Datasheet
Magnetic Sensor Series
Current Sensor IC
BM14270AMUV-LB
General Description
Key Specifications
This is the product guarantees long time support in
industrial market.
BM14270AMUV-LB is coreless non-contact type current
sensor of the magnetic detection using MI sensor. It’s
possible to measure the current line in non-contact, and
therefore it’s possible to measure current without loss.
Input Voltage Range:
2.7 V to 5.5 V
Operating Current (20 SPS):
70 μA(Typ)
Magnetic Measurable Range:
±280 μT(Typ)
Magnetic Sensitivity:
0.045 μT/LSB(Typ)
Operating Temperature Range: -40 °C to +125 °C
Package
Features
VQFN20QV3535
W(Typ) x D(Typ) x H(Max)
3.50 mm x 3.50 mm x 1.00 mm
Long Time Support Product for Industrial Applications
Current Sensor using MI Element
I2C Interface
14bit Digital Output
Applications
Industrial Equipment
Meter for the Power Measurement
UPS
Power Conditioner
VQFN20QV3535
Typical Application Circuit and Block Diagram
VDD
Regulator
(Internal)
VREG
GND
ALERT
MI Sensor
AMP
ADC
Sginal
Processing
SDA
I2C
Interface
Host
SCL
ADDR
TEST
Clock
〇Product structure : Silicon integrated circuit
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〇This product has no designed protection against radioactive rays
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Contents
General Description ................................................................................................................................................................ 1
Features ................................................................................................................................................................................. 1
Applications ............................................................................................................................................................................ 1
Key Specifications................................................................................................................................................................... 1
Package ................................................................................................................................................................................. 1
Typical Application Circuit and Block Diagram .......................................................................................................................... 1
Pin Configuration .................................................................................................................................................................... 3
Pin Description........................................................................................................................................................................ 3
Absolute Maximum Ratings ..................................................................................................................................................... 4
Thermal Resistance ................................................................................................................................................................ 4
Recommended Operating Conditions ...................................................................................................................................... 5
Magnetic, Electrical Characteristics ......................................................................................................................................... 5
Example of the Current Measurement Configuration ................................................................................................................ 6
Typical Performance Curves .................................................................................................................................................... 7
I2C Bus Timing Characteristics ................................................................................................................................................ 8
I2C Bus Communication .......................................................................................................................................................... 8
I2C Bus Slave Address ............................................................................................................................................................ 9
Register Map .......................................................................................................................................................................... 9
Control Sequence ................................................................................................................................................................. 11
Application Example.............................................................................................................................................................. 14
I/O Equivalence Circuits ........................................................................................................................................................ 15
Operational Notes ................................................................................................................................................................. 16
Ordering Information ............................................................................................................................................................. 18
Marking Diagram................................................................................................................................................................... 18
Physical Dimension and Packing Information ......................................................................................................................... 19
Revision History .................................................................................................................................................................... 20
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Pin Configuration
Top View
NC
NC
NC
NC
NC
15
14
13
12
11
Top View
Current
direction
ALERT
16
10
TEST
SCL
17
9
VREG
SDA
18
8
GND
ADDR
19
7
VDD
6
NC
Magnetic field
Sensing direction
EXP-PAD
5
Current
direction
NC
4
NC
3
NC
NC
NC
2
20
1
NC
Above arrows indicate + output
Pin Description
Pin No.
Pin Name
Function
1
NC
No connection (Set to open)
2
NC
No connection (Set to open)
3
NC
No connection (Set to open)
4
NC
No connection (Set to open)
5
NC
No connection (Set to open)
6
NC
No connection (Set to open)
7
VDD
Power supply(Note 1)
8
GND
Ground
9
VREG
Internal regulator output(Note 2)
10
TEST
Test pin(Note 3)
11
NC
No connection (Set to open)
12
NC
No connection (Set to open)
13
NC
No connection (Set to open)
14
NC
No connection (Set to open)
15
NC
No connection (Set to open)
16
ALERT
17
SCL
I2C signal clock input
18
SDA
I2C signal data I/O
19
ADDR
20
NC
-
EXP-PAD
ALERT output pin
I2C programmable address bit(Note 4)
No connection (Set to open)
The EXP-PAD connect to GND or floating
(Note 1) Dispose a bypass capacitor between VDD and GND as close as possible to the IC.
(Note 2) Dispose a bypass capacitor between VREG and GND as close as possible to the IC.
Set a bypass capacitor of 0.22 μF between VREG and GND.
(Note 3) Connect to GND.
(Note 4) Connect to VDD or GND.
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Absolute Maximum Ratings (Ta=25 °C)
Parameter
Symbol
Rating
Unit
VDD
7.0
V
Input Voltage
VIN
-0.3 to VDD+0.3
V
Storage Temperature Range
Tstg
-40 to +150
°C
Tjmax
150
°C
Mef
-1000 to +1000
mT
Supply Voltage
Maximum Junction Temperature
Maximum Exposed Field
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 5)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 7)
2s2p(Note 8)
Unit
VQFN20QV3535
Junction to Ambient
θJA
181.9
50.5
°C/W
Junction to Top Characterization Parameter (Note 6)
ΨJT
19
7
°C/W
(Note 5) Based on JESD51-2A(Still-Air).
(Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 7) Using a PCB board based on JESD51-3.
(Note 8) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Thermal Via(Note 9)
Pitch
Diameter
1.20 mm
Φ0.30 mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 9) This thermal via connects with the copper pattern of all layers.
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Recommended Operating Conditions
Parameter
Supply Voltage
2
Symbol
Min
Typ
Max
Unit
VDD
2.7
5.0
5.5
V
I C Clock Frequency
fSCL
-
-
400
kHz
Operating Temperature
Topr
-40
+25
+125
°C
Magnetic, Electrical Characteristics (Unless otherwise specified VDD=5.0 V Ta=25 °C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Operating Average Current
IDD
-
70
140
µA
Output Data Rate = 20 SPS
Power Down Mode Current
ISS
-
5
10
µA
ALL Power Down
Low-level Input Voltage
VIL
GND
-
0.3 x
VDD
V
High-level Input Voltage
VIH
-
VDD
V
Current Consumption
Logic
Low-level Input Current
IIL
0.7 x
VDD
-10
-
0
µA
VIL = GND
High-level Input Current
IIH
0
-
µA
VIH = VDD
Low-level Output Voltage
VOL
GND
-
10
0.2 x
VDD
V
ILOAD = -0.3 mA
High-level Output Voltage
VOH
0.8 x
VDD
-
VDD
V
ILOAD = 0.3 mA
Low-level Input Current
IIL2
-10
-
0
µA
VIL = GND
High-level Input Current
IIH2
0
-
µA
At HiZ, VIH = VDD
Low-level Output Voltage
VOL2
GND
-
10
0.2 x
VDD
V
ILOAD = -3 mA
Measurable Range
RM
-
±280
-
µT
Linearity(Note 10)
LIN
-
0.5
2
%FS
VOFS
-
0
-
Magnetic Sensitivity
DELTAV
-
0.045
-
Measurement Time
tMS
-
0.35
-
LSB
µT/
LSB
ms
Serial Communication
Magnetic Sensor
Output Offset
(Note 10) Linearity = Output Error / R M = (output – ideal output) / RM
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Example of the Current Measurement Configuration
This product has two different sensors of the magnetic field detection direction.
It is configuration to output difference of the magnetic field which two sensors detected. (Out = A - B)
Top View
Side View
Sensing
direction
A
Sensing
direction
B
Sensing
direction
A
Sensor
Sensing
direction
B
Sensor
Sensor
Sensor
Figure 1. Sensor Configuration
This product locates on the board pattern such as follows, then the magnetic field of the different direction is applied to two
sensors and can detect magnetic field depending on current. In addition, the disturbance magnetic field is applied to the
same direction for two sensors, and can cancel disturbance magnetic field in the operating range.
Top View
Side View
PCB
BM14270AMUV-LB
A
B
Current
PCB
Board pattern
(Current line)
Board pattern
(Current line)
BM14270AMUV-LB
Figure 2. Example of the Board Pattern
Top View
1.6 mm
1.6 mm
Side View
2.5 mm
0.5 mm
Figure 3. Position of the Sensor (Reference)
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Typical Performance Curves
(Unless otherwise specified, VDD = 5.0 V, GND = 0.0 V, Ta 25 C)
500
Operating Average Current:IDD [µA]
Power Down Mode Current:ISS [µA]
10
8
6
4
2
400
300
200
100
0
0
2
3
4
5
Supply Voltage:VDD [V]
2
6
Figure 4. Power Down Mode Current vs Supply Voltage
3
4
5
Supply Voltage:VDD [V]
6
Figure 5. Operating Average Current vs Supply Voltage
(20 SPS)
Operating Average Current:IDD [µA]
500
400
300
200
100
0
0
200
400
600
ODR [Hz]
800
1000
Figure 6. Operating Average Current vs ODR
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I2C Bus Timing Characteristics (Unless otherwise specified VDD = 5.0 V, Ta = 25 °C)
S: Restart
S: Start
VIH
SDA
VIH
VIL
VIL
VIL
S: Start
P: Stop
VIH
VIH
VIL
tBUF
tHD;STA
tSU;DAT
VIH
SCL
VIL
tLOW
tHD;STA
VIH
VIH
VIL
VIH
VIH
VIH
VIL
tHIGH
tHD;DAT
tSU;STA
tSU;STO
Figure 7. I2C Timing Chart
Parameter
Symbol
Min
Typ
Max
Unit
fSCL
0
-
400
kHz
‘L’ Period of the SCL Clock
tLOW
1.3
-
-
µs
‘H’ Period of the SCL Clock
tHIGH
0.6
-
-
µs
Setup Time for Repeated START Condition
tSU;STA
0.6
-
-
µs
Hold Time (Repeated) START Condition
tHD;STA
0.6
-
-
µs
Data Setup Time
tSU;DAT
100
-
-
ns
Data Hold Time
tHD;DAT
0
-
-
µs
Setup Time for STOP Condition
Bus Free Time between a STOP and START
Condition
tSU;STO
0.6
-
-
µs
tBUF
1.3
-
-
µs
SCL Clock Frequency
Conditions
I2C Bus Communication
1. Main write format
(1) Indicate register address
S
W
0
Slave Address
ACK
Indicate register address
ACK
Indicate register address
ACK
P
(2) Write to data register after indicating register address
S
W
0
Slave Address
Data specified at register
address field
ACK
ACK
ˑˑˑ
ACK
Data specified at register
address field + N
ACK
P
NACK
P
NACK
P
2. Main read format
(1) Read data after indicate register address
S
Slave Address
W
0
ACK
S
Slave Address
R
1
ACK
Data specified at register
address field + 1
ACK
ˑˑˑ
Indicate register address
ACK
Data specified at register
address field
ACK
ACK
Data specified at register
address field + N
(2) Read data from the specified register
S
R
1
Slave Address
Data specified at register
address field + 1
ACK
ACK
ˑˑˑ
Data specified at register
address field
ACK
from master to slave
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ACK
Data specified at register
address field + N
from slave to master
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I2C Bus Slave Address
Selectable 2 I2C Slave Addresses by setting ADRR pin
(ADDR=L: 0001110, ADDR=H: 0001111)
Register Map(Note 11)
Address
0x0F
Register Name
STA1
0x10
R/W
R
D7
RD_
DRDY
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
FS1
0
R
DATA [7:0]
DATA
0x11
R
DATA [15:8]
0x1B
CNTL1
RW
PC1
0
RST_
LV
0x1C
CNTL2
RW
0
0
0
0
ALERT
_EN
0
0
0
0x1D
CNTL3
RW
0
FORCE
0
0
0
0
0
0
0x5C
ODR [1:0]
W
RSTB_LV [7:0]
W
RSTB_LV [15:8]
CNTL4
0x5D
(Note 11) Do not write any commands to other addresses except above. Do not write ‘1’ to the fields in which value is ‘0’ in above table.
It is the following conditions to be able to access each register.
Condition
Accessible Register
Supply Power
CNTL1
CNTL4
Supply Power
(CNTL1) PC1=1
(CNTL1) RST_LV=0
(CNTL4) RSTB_LV=1
STA1
CNTL2
CNTL3
Supply Power
(CNTL1) PC1=1
(CNTL1) RST_LV=0
(CNTL4) RSTB_LV=1
(CNTL3) FORCE=1 after first access
DATA
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Register Map - continued
(0x0F) Status Register
Fields
Function
This bit informs the preparation status of the measured data
0: Waiting for end of measurement
1: Ready OK
RD_DRDY
default value 0x00
(0x10/0x11) Output Data Register
Fields
Function
DATA [7:0]
Output value LSB
DATA [15:8]
Output value MSB
default value 0xXXXX
signed 16 bit -8192d(0xE000) to +8191d(0x1FFF)
(0x1B) Control setting1 Register
Fields
Function
PC1
Power Control
0: Power Down 1: Active
RST_LV
Logic reset control
0: Reset release 1: Reset
Reset release at RST_LV(CNTL1)=0 & RSTB_LV(CNTL4)=1
ODR [1:0]
Measurement output data rates
00: 20 Hz Mode 01: 100 Hz Mode 10: 200 Hz Mode 11: 1 kHz Mode
FS1
Measurement mode setting
0: Continuous mode 1: Single mode
default value 0x22
(0x1C) Control setting2 Register
Fields
ALERT_EN
Function
Select output signal of ALERT pin
0: No output
1: DRDY signal(Output RD_DRDY from pin)
default value 0x00
(0x1D) Control setting3 Register
Fields
Function
AD start measurement trigger at continuous mode (FS1=0)
and single mode (FS1=1)
1: Start measurement
FORCE
Register is automatic clear “0” after write data “1”
Write data “0” is invalid
If write data “1” on measurement way, stop and restart measurement
default value 0x00
(0x5C/0x5D) Control setting4 Register
Fields
Function
RSTB_LV [7:0]
Reserved (ignore write data)
RSTB_LV [15:8]
RSTB_LV=1 by write access (ignore write data)
Reset release at RST_LV(CNTL1)=0 & RSTB_LV(CNTL4)=1
RSTB_LV=0 by write PC1(CNTL1)=0
default value 0x00
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Control Sequence
1.
Control Sequence
1.1 Power supply start-up sequence
Do the command control by I2C after all powers are supplied.
2.7 V
VDD
> 0.1 ms
I2 C
command
Address: 0x5C,
0x5D
Data: 0x00
command
Address: 0x1B
Data[7] = 1
command
> 1 ms
Figure 8. Timing Chart at Power ON
1.2 Power supply end sequence
2.7 V
VDD
0.4 V
> 0 ms
> 1 ms
command
Address: 0x1B
I2C
Data[7] = 0
Data[5] = 1
Figure 9. Timing Chart at Power OFF
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Control Sequence - continued
2.
Measurement sequence
There are the following two kinds of measurement modes
Continuous Mode
BM14270AMUV-LB is measured at specified cycle (ODR=20 Hz, 100 Hz, 200 Hz, 1 kHz) .
Single Mode
BM14270AMUV-LB is measured by the measurement request from the host.
(Power Off)
·Supply VDD Voltage
Power Down
·Send "Logic OFF" Command
·Send "Logic ON" Command
Ready
·Finish Measurement @ Signal Mode
·Send "Select Signal Mode" Command
@ Continuous Mode
·Send Setting Command
·Send "Measurement Start" Command
Measurement
Figure 10. State Transition of Each Mode
2.1 Continuous Mode
Register Name
CNTL1
Step1
Step2
Step3
Step4
CNTL4
CNTL2
CNTL3
STA1
DATA
BM14270AMUV-LB
Host
(Send command example)
Address
0x1B
0x5C
0x5D
0x1C
0x1D
0x0F
0x10
0x11
Start
Data
0x80
0x00
0x00
0x08
0x40
Start
Supply Power
POR
Power Down
Step1
Read
Write CNTL1 : PC1=1, RST_LV=0
Write CNTL1 : ODR=00
Write CNTL1 : FS1=0
Write CNTL4 : RSTB_LV=1
Active
Timer=20SPS
Continuous Mode
Step2
Write CNTL2 : ALERT_EN=1
Step3
Write CNTL3 : FORCE=1
ALERT_EN=1
Measurement
No
Does ALERT output
the rising edge?
ALERT High
Yes
Step4
Read DATA
ALERT Low
Timer (wait)
Figure 11. Sequence of Continuous Mode
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Control Sequence - continued
2.2 Single Mode
(Send command example)
Register Name
CNTL1
Step1
Step2
Step3
Step4
CNTL4
CNTL2
CNTL3
STA1
DATA
BM14270AMUV-LB
Host
Address
0x1B
0x5C
0x5D
0x1C
0x1D
0x0F
0x10
0x11
Start
Data
0x82
0x00
0x00
0x08
0x40
Start
Supply Power
POR
Power Down
Step1
Read
Write CNTL1 : PC1=1, RST_LV=0
Write CNTL1 : FS1=1
Write CNTL4 : RSTB_LV=1
Active
Step2
Write CNTL2 : ALERT_EN=1
ALERT_EN=1
Step3
Write CNTL3 : FORCE=1
Measurement
Does ALERT output
No the rising edge?
ALERT High
Yes
Step4
Read DATA
ALERT Low
Figure 12. Sequence of Single Mode
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Application Example
VDD
Regulator
(Internal)
VREG
0.22 μF
0.22 μF
GND
ALERT
MI Sensor
AMP
ADC
Sginal
Processing
SDA
I2C
Interface
Host
SCL
ADDR
TEST
Clock
Figure 13. Example of Application Circuit
(Note) Sensor property may change due to around magnetic parts. We recommend calibrating
the sensitivity and origin point of magnetic sensors after mounting.
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I/O Equivalence Circuits
Pin Name
Equivalent Circuit Diagram
SCL
ALERT
VDD
VDD
Pin Name
SDA
ADDR
VDD
Equivalent Circuit Diagram
VDD
VDD
VDD
VDD
TEST
VDD
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VDD
VREG
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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BM14270AMUV-LB
Operational Notes – continued
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Figure 14. Example of IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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TSZ22111 • 15 • 001
17/20
TSZ02201-0M2M0F919020-1-2
10.Oct.2019 Rev.001
BM14270AMUV-LB
Ordering Information
B
M
1
4
2
7
0
A
M
U
V
-
Package
MUV:VQFN20QV3535
LBE2
Product Class
LB for Industrial Applications
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
VQFN20QV3535 (TOP VIEW)
Part Number Marking
M1427
LOT Number
0AMUV
Pin 1 Mark
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© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
18/20
TSZ02201-0M2M0F919020-1-2
10.Oct.2019 Rev.001
BM14270AMUV-LB
Physical Dimension and Packing Information
Package Name
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© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
VQFN20QV3535
19/20
TSZ02201-0M2M0F919020-1-2
10.Oct.2019 Rev.001
BM14270AMUV-LB
Revision History
Date
Revision
10.Oct.2019
001
Changes
New Release
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TSZ22111 • 15 • 001
20/20
TSZ02201-0M2M0F919020-1-2
10.Oct.2019 Rev.001
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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