BM14270AMUV-LBE2

Datasheet Magnetic Sensor Series Current Sensor IC BM14270AMUV-LB General Description Key Specifications      This is the product guarantees long time support in industrial market. BM14270AMUV-LB is coreless non-contact type current sensor of the magnetic detection using MI sensor. It’s possible to measure the current line in non-contact, and therefore it’s possible to measure current without loss. Input Voltage Range: 2.7 V to 5.5 V Operating Current (20 SPS): 70 μA(Typ) Magnetic Measurable Range: ±280 μT(Typ) Magnetic Sensitivity: 0.045 μT/LSB(Typ) Operating Temperature Range: -40 °C to +125 °C Package Features     VQFN20QV3535 W(Typ) x D(Typ) x H(Max) 3.50 mm x 3.50 mm x 1.00 mm Long Time Support Product for Industrial Applications Current Sensor using MI Element I2C Interface 14bit Digital Output Applications     Industrial Equipment Meter for the Power Measurement UPS Power Conditioner VQFN20QV3535 Typical Application Circuit and Block Diagram VDD Regulator (Internal) VREG GND ALERT MI Sensor AMP ADC Sginal Processing SDA I2C Interface Host SCL ADDR TEST Clock 〇Product structure : Silicon integrated circuit .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Contents General Description ................................................................................................................................................................ 1 Features ................................................................................................................................................................................. 1 Applications ............................................................................................................................................................................ 1 Key Specifications................................................................................................................................................................... 1 Package ................................................................................................................................................................................. 1 Typical Application Circuit and Block Diagram .......................................................................................................................... 1 Pin Configuration .................................................................................................................................................................... 3 Pin Description........................................................................................................................................................................ 3 Absolute Maximum Ratings ..................................................................................................................................................... 4 Thermal Resistance ................................................................................................................................................................ 4 Recommended Operating Conditions ...................................................................................................................................... 5 Magnetic, Electrical Characteristics ......................................................................................................................................... 5 Example of the Current Measurement Configuration ................................................................................................................ 6 Typical Performance Curves .................................................................................................................................................... 7 I2C Bus Timing Characteristics ................................................................................................................................................ 8 I2C Bus Communication .......................................................................................................................................................... 8 I2C Bus Slave Address ............................................................................................................................................................ 9 Register Map .......................................................................................................................................................................... 9 Control Sequence ................................................................................................................................................................. 11 Application Example.............................................................................................................................................................. 14 I/O Equivalence Circuits ........................................................................................................................................................ 15 Operational Notes ................................................................................................................................................................. 16 Ordering Information ............................................................................................................................................................. 18 Marking Diagram................................................................................................................................................................... 18 Physical Dimension and Packing Information ......................................................................................................................... 19 Revision History .................................................................................................................................................................... 20 .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Pin Configuration Top View NC NC NC NC NC 15 14 13 12 11 Top View Current direction ALERT 16 10 TEST SCL 17 9 VREG SDA 18 8 GND ADDR 19 7 VDD 6 NC Magnetic field Sensing direction EXP-PAD 5 Current direction NC 4 NC 3 NC NC NC 2 20 1 NC Above arrows indicate + output Pin Description Pin No. Pin Name Function 1 NC No connection (Set to open) 2 NC No connection (Set to open) 3 NC No connection (Set to open) 4 NC No connection (Set to open) 5 NC No connection (Set to open) 6 NC No connection (Set to open) 7 VDD Power supply(Note 1) 8 GND Ground 9 VREG Internal regulator output(Note 2) 10 TEST Test pin(Note 3) 11 NC No connection (Set to open) 12 NC No connection (Set to open) 13 NC No connection (Set to open) 14 NC No connection (Set to open) 15 NC No connection (Set to open) 16 ALERT 17 SCL I2C signal clock input 18 SDA I2C signal data I/O 19 ADDR 20 NC - EXP-PAD ALERT output pin I2C programmable address bit(Note 4) No connection (Set to open) The EXP-PAD connect to GND or floating (Note 1) Dispose a bypass capacitor between VDD and GND as close as possible to the IC. (Note 2) Dispose a bypass capacitor between VREG and GND as close as possible to the IC. Set a bypass capacitor of 0.22 μF between VREG and GND. (Note 3) Connect to GND. (Note 4) Connect to VDD or GND. .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Absolute Maximum Ratings (Ta=25 °C) Parameter Symbol Rating Unit VDD 7.0 V Input Voltage VIN -0.3 to VDD+0.3 V Storage Temperature Range Tstg -40 to +150 °C Tjmax 150 °C Mef -1000 to +1000 mT Supply Voltage Maximum Junction Temperature Maximum Exposed Field Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance(Note 5) Parameter Symbol Thermal Resistance (Typ) 1s(Note 7) 2s2p(Note 8) Unit VQFN20QV3535 Junction to Ambient θJA 181.9 50.5 °C/W Junction to Top Characterization Parameter (Note 6) ΨJT 19 7 °C/W (Note 5) Based on JESD51-2A(Still-Air). (Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 7) Using a PCB board based on JESD51-3. (Note 8) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Thermal Via(Note 9) Pitch Diameter 1.20 mm Φ0.30 mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 9) This thermal via connects with the copper pattern of all layers. .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Recommended Operating Conditions Parameter Supply Voltage 2 Symbol Min Typ Max Unit VDD 2.7 5.0 5.5 V I C Clock Frequency fSCL - - 400 kHz Operating Temperature Topr -40 +25 +125 °C Magnetic, Electrical Characteristics (Unless otherwise specified VDD=5.0 V Ta=25 °C) Parameter Symbol Min Typ Max Unit Conditions Operating Average Current IDD - 70 140 µA Output Data Rate = 20 SPS Power Down Mode Current ISS - 5 10 µA ALL Power Down Low-level Input Voltage VIL GND - 0.3 x VDD V High-level Input Voltage VIH - VDD V Current Consumption Logic Low-level Input Current IIL 0.7 x VDD -10 - 0 µA VIL = GND High-level Input Current IIH 0 - µA VIH = VDD Low-level Output Voltage VOL GND - 10 0.2 x VDD V ILOAD = -0.3 mA High-level Output Voltage VOH 0.8 x VDD - VDD V ILOAD = 0.3 mA Low-level Input Current IIL2 -10 - 0 µA VIL = GND High-level Input Current IIH2 0 - µA At HiZ, VIH = VDD Low-level Output Voltage VOL2 GND - 10 0.2 x VDD V ILOAD = -3 mA Measurable Range RM - ±280 - µT Linearity(Note 10) LIN - 0.5 2 %FS VOFS - 0 - Magnetic Sensitivity DELTAV - 0.045 - Measurement Time tMS - 0.35 - LSB µT/ LSB ms Serial Communication Magnetic Sensor Output Offset (Note 10) Linearity = Output Error / R M = (output – ideal output) / RM .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Example of the Current Measurement Configuration This product has two different sensors of the magnetic field detection direction. It is configuration to output difference of the magnetic field which two sensors detected. (Out = A - B) Top View Side View Sensing direction A Sensing direction B Sensing direction A Sensor Sensing direction B Sensor Sensor Sensor Figure 1. Sensor Configuration This product locates on the board pattern such as follows, then the magnetic field of the different direction is applied to two sensors and can detect magnetic field depending on current. In addition, the disturbance magnetic field is applied to the same direction for two sensors, and can cancel disturbance magnetic field in the operating range. Top View Side View PCB BM14270AMUV-LB A B Current PCB Board pattern (Current line) Board pattern (Current line) BM14270AMUV-LB Figure 2. Example of the Board Pattern Top View 1.6 mm 1.6 mm Side View 2.5 mm 0.5 mm Figure 3. Position of the Sensor (Reference) .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Typical Performance Curves (Unless otherwise specified, VDD = 5.0 V, GND = 0.0 V, Ta  25 C) 500 Operating Average Current:IDD [µA] Power Down Mode Current:ISS [µA] 10 8 6 4 2 400 300 200 100 0 0 2 3 4 5 Supply Voltage:VDD [V] 2 6 Figure 4. Power Down Mode Current vs Supply Voltage 3 4 5 Supply Voltage:VDD [V] 6 Figure 5. Operating Average Current vs Supply Voltage (20 SPS) Operating Average Current:IDD [µA] 500 400 300 200 100 0 0 200 400 600 ODR [Hz] 800 1000 Figure 6. Operating Average Current vs ODR .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB I2C Bus Timing Characteristics (Unless otherwise specified VDD = 5.0 V, Ta = 25 °C) S: Restart S: Start VIH SDA VIH VIL VIL VIL S: Start P: Stop VIH VIH VIL tBUF tHD;STA tSU;DAT VIH SCL VIL tLOW tHD;STA VIH VIH VIL VIH VIH VIH VIL tHIGH tHD;DAT tSU;STA tSU;STO Figure 7. I2C Timing Chart Parameter Symbol Min Typ Max Unit fSCL 0 - 400 kHz ‘L’ Period of the SCL Clock tLOW 1.3 - - µs ‘H’ Period of the SCL Clock tHIGH 0.6 - - µs Setup Time for Repeated START Condition tSU;STA 0.6 - - µs Hold Time (Repeated) START Condition tHD;STA 0.6 - - µs Data Setup Time tSU;DAT 100 - - ns Data Hold Time tHD;DAT 0 - - µs Setup Time for STOP Condition Bus Free Time between a STOP and START Condition tSU;STO 0.6 - - µs tBUF 1.3 - - µs SCL Clock Frequency Conditions I2C Bus Communication 1. Main write format (1) Indicate register address S W 0 Slave Address ACK Indicate register address ACK Indicate register address ACK P (2) Write to data register after indicating register address S W 0 Slave Address Data specified at register address field ACK ACK ˑˑˑ ACK Data specified at register address field + N ACK P NACK P NACK P 2. Main read format (1) Read data after indicate register address S Slave Address W 0 ACK S Slave Address R 1 ACK Data specified at register address field + 1 ACK ˑˑˑ Indicate register address ACK Data specified at register address field ACK ACK Data specified at register address field + N (2) Read data from the specified register S R 1 Slave Address Data specified at register address field + 1 ACK ACK ˑˑˑ Data specified at register address field ACK from master to slave .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 ACK Data specified at register address field + N from slave to master 8/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB I2C Bus Slave Address Selectable 2 I2C Slave Addresses by setting ADRR pin (ADDR=L: 0001110, ADDR=H: 0001111) Register Map(Note 11) Address 0x0F Register Name STA1 0x10 R/W R D7 RD_ DRDY D6 D5 D4 D3 D2 D1 D0 0 0 0 0 0 0 0 0 FS1 0 R DATA [7:0] DATA 0x11 R DATA [15:8] 0x1B CNTL1 RW PC1 0 RST_ LV 0x1C CNTL2 RW 0 0 0 0 ALERT _EN 0 0 0 0x1D CNTL3 RW 0 FORCE 0 0 0 0 0 0 0x5C ODR [1:0] W RSTB_LV [7:0] W RSTB_LV [15:8] CNTL4 0x5D (Note 11) Do not write any commands to other addresses except above. Do not write ‘1’ to the fields in which value is ‘0’ in above table. It is the following conditions to be able to access each register. Condition Accessible Register Supply Power CNTL1 CNTL4 Supply Power (CNTL1) PC1=1 (CNTL1) RST_LV=0 (CNTL4) RSTB_LV=1 STA1 CNTL2 CNTL3 Supply Power (CNTL1) PC1=1 (CNTL1) RST_LV=0 (CNTL4) RSTB_LV=1 (CNTL3) FORCE=1 after first access DATA .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Register Map - continued (0x0F) Status Register Fields Function This bit informs the preparation status of the measured data 0: Waiting for end of measurement 1: Ready OK RD_DRDY default value 0x00 (0x10/0x11) Output Data Register Fields Function DATA [7:0] Output value LSB DATA [15:8] Output value MSB default value 0xXXXX signed 16 bit -8192d(0xE000) to +8191d(0x1FFF) (0x1B) Control setting1 Register Fields Function PC1 Power Control 0: Power Down 1: Active RST_LV Logic reset control 0: Reset release 1: Reset Reset release at RST_LV(CNTL1)=0 & RSTB_LV(CNTL4)=1 ODR [1:0] Measurement output data rates 00: 20 Hz Mode 01: 100 Hz Mode 10: 200 Hz Mode 11: 1 kHz Mode FS1 Measurement mode setting 0: Continuous mode 1: Single mode default value 0x22 (0x1C) Control setting2 Register Fields ALERT_EN Function Select output signal of ALERT pin 0: No output 1: DRDY signal(Output RD_DRDY from pin) default value 0x00 (0x1D) Control setting3 Register Fields Function AD start measurement trigger at continuous mode (FS1=0) and single mode (FS1=1) 1: Start measurement FORCE Register is automatic clear “0” after write data “1” Write data “0” is invalid If write data “1” on measurement way, stop and restart measurement default value 0x00 (0x5C/0x5D) Control setting4 Register Fields Function RSTB_LV [7:0] Reserved (ignore write data) RSTB_LV [15:8] RSTB_LV=1 by write access (ignore write data) Reset release at RST_LV(CNTL1)=0 & RSTB_LV(CNTL4)=1 RSTB_LV=0 by write PC1(CNTL1)=0 default value 0x00 .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Control Sequence 1. Control Sequence 1.1 Power supply start-up sequence Do the command control by I2C after all powers are supplied. 2.7 V VDD > 0.1 ms I2 C command Address: 0x5C, 0x5D Data: 0x00 command Address: 0x1B Data[7] = 1 command > 1 ms Figure 8. Timing Chart at Power ON 1.2 Power supply end sequence 2.7 V VDD 0.4 V > 0 ms > 1 ms command Address: 0x1B I2C Data[7] = 0 Data[5] = 1 Figure 9. Timing Chart at Power OFF .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Control Sequence - continued 2. Measurement sequence There are the following two kinds of measurement modes Continuous Mode BM14270AMUV-LB is measured at specified cycle (ODR=20 Hz, 100 Hz, 200 Hz, 1 kHz) . Single Mode BM14270AMUV-LB is measured by the measurement request from the host. (Power Off) ·Supply VDD Voltage Power Down ·Send "Logic OFF" Command ·Send "Logic ON" Command Ready ·Finish Measurement @ Signal Mode ·Send "Select Signal Mode" Command @ Continuous Mode ·Send Setting Command ·Send "Measurement Start" Command Measurement Figure 10. State Transition of Each Mode 2.1 Continuous Mode Register Name CNTL1 Step1 Step2 Step3 Step4 CNTL4 CNTL2 CNTL3 STA1 DATA BM14270AMUV-LB Host (Send command example) Address 0x1B 0x5C 0x5D 0x1C 0x1D 0x0F 0x10 0x11 Start Data 0x80 0x00 0x00 0x08 0x40 Start Supply Power POR Power Down Step1 Read Write CNTL1 : PC1=1, RST_LV=0 Write CNTL1 : ODR=00 Write CNTL1 : FS1=0 Write CNTL4 : RSTB_LV=1 Active Timer=20SPS Continuous Mode Step2 Write CNTL2 : ALERT_EN=1 Step3 Write CNTL3 : FORCE=1 ALERT_EN=1 Measurement No Does ALERT output the rising edge? ALERT High Yes Step4 Read DATA ALERT Low Timer (wait) Figure 11. Sequence of Continuous Mode .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Control Sequence - continued 2.2 Single Mode (Send command example) Register Name CNTL1 Step1 Step2 Step3 Step4 CNTL4 CNTL2 CNTL3 STA1 DATA BM14270AMUV-LB Host Address 0x1B 0x5C 0x5D 0x1C 0x1D 0x0F 0x10 0x11 Start Data 0x82 0x00 0x00 0x08 0x40 Start Supply Power POR Power Down Step1 Read Write CNTL1 : PC1=1, RST_LV=0 Write CNTL1 : FS1=1 Write CNTL4 : RSTB_LV=1 Active Step2 Write CNTL2 : ALERT_EN=1 ALERT_EN=1 Step3 Write CNTL3 : FORCE=1 Measurement Does ALERT output No the rising edge? ALERT High Yes Step4 Read DATA ALERT Low Figure 12. Sequence of Single Mode .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Application Example VDD Regulator (Internal) VREG 0.22 μF 0.22 μF GND ALERT MI Sensor AMP ADC Sginal Processing SDA I2C Interface Host SCL ADDR TEST Clock Figure 13. Example of Application Circuit (Note) Sensor property may change due to around magnetic parts. We recommend calibrating the sensitivity and origin point of magnetic sensors after mounting. .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB I/O Equivalence Circuits Pin Name Equivalent Circuit Diagram SCL ALERT VDD VDD Pin Name SDA ADDR VDD Equivalent Circuit Diagram VDD VDD VDD VDD TEST VDD .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VDD VREG 15/20 VDD VDD TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Operational Notes – continued 10. Regarding the Input Pin of the IC This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Figure 14. Example of IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Ordering Information B M 1 4 2 7 0 A M U V - Package MUV:VQFN20QV3535 LBE2 Product Class LB for Industrial Applications Packaging and forming specification E2: Embossed tape and reel Marking Diagram VQFN20QV3535 (TOP VIEW) Part Number Marking M1427 LOT Number 0AMUV Pin 1 Mark .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Physical Dimension and Packing Information Package Name .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VQFN20QV3535 19/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 BM14270AMUV-LB Revision History Date Revision 10.Oct.2019 001 Changes New Release .www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/20 TSZ02201-0M2M0F919020-1-2 10.Oct.2019 Rev.001 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001