BM1P105FJ-E2

Datasheet AC/DC Drivers PWM Control IC BM1P105FJ ● General The PWM control IC for AC/DC “BM1P105FJ” provides an optimum system for all products that include an electrical outlet. A built-in start circuit that withstands 650 V helps to keep power consumption low. Both isolated and non-isolated versions are supported, making for simpler design of various types of low-power converters. Switching MOSFET and current detection resistors are external devices, thus achieving a higher degree of freedom in power supply design. The switching frequency is set as fixed. Since current mode control is used, a current limit is imposed in each cycle, and excellent performance is demonstrated in bandwidth and transient response. With a light load, frequency is reduced and higher efficiency is realized. A frequency hopping function is also built in, contributing to low EMI. Also on chip are soft start and burst functions, a per-cycle overcurrent limiter, VCC overvoltage protection, overload protection, and other protection functions. ● Features  PWM frequency: 100 kHz  PWM current mode method  Frequency hopping function  Burst operation during light load / Frequency reduction function  650 V start circuit  VCC pin undervoltage protection  VCC pin overvoltage protection  CS pin open protection  CS pin Leading-Edge-Blanking function  Per-cycle overcurrent limiter function  Overcurrent limiter with AC voltage compensation function  Soft start function  Secondary overcurrent protection circuit ● Package SOP-J8 4.90 mm × 6.00 mm × 1.65 mm (Typ.) (Typ.) (Typ.) pitch 1.27 mm (Typ.) ● Basic Specifications  Operating power supply voltage range:  Operating current:  Oscillation frequency: VCC 8.9 V to 26.0 V VH: to 600 V Normal: 0.60 mA (Typ.) Burst mode: 0.35 mA (Typ.) BM1P105FJ: 100 kHz (Typ.)  Operating temperature range: ● Applications AC adapters, TVs, and household appliances (vacuum cleaners, humidifiers, air cleaners, air conditioners, IH cooking heaters, rice cookers, etc.) -40°C to +85°C ● Application circuit ● Line-up BM1P061FJ BM1P062FJ BM1P063FJ BM1P064FJ BM1P065FJ BM1P066FJ BM1P067FJ BM1P068FJ BM1P101FJ BM1P102FJ BM1P103FJ BM1P104FJ BM1P105FJ BM1P106FJ BM1P107FJ BM1P108FJ Frequency VCCOVP VCC recharge 65kHz 65kHz 65kHz 65kHz 65kHz 65kHz 65kHz 65kHz 100kHz 100kHz 100kHz 100kHz 100kHz 100kHz 100kHz 100kHz Auto-restart Latch Auto-restart Latch Auto-restart Latch Auto-restart Latch Auto-restart Latch Auto-restart Latch Auto-restart Latch Auto-restart Latch 〇 〇 〇 〇 × × × × 〇 〇 〇 〇 × × × × X-cap discharge 〇 〇 × × × × × × 〇 〇 × × × × × × Brown-out 〇 〇 × × 〇 〇 × × 〇 〇 × × 〇 〇 × × Figure 1．Application Circuit ○ Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed for protection against radioactive rays 1/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ ● Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Rating Unit Maximum voltage 1 Vmax1 -0.3 ~ 30.0 V Maximum voltage 2 Vmax2 -0.3 ~ 6.5 V Maximum voltage 3 Vmax3 -0.3 ~ 15.0 V Maximum voltage 4 Vmax4 -0.3 ~ 650 V OUT pin peak current IOUT ±1.0 A Allowable dissipation Pd 674.9 (Note1) mW o Operating temperature range Topr -40 ~ +85 C o Storage temperature range Tstr -55 ~ +150 C (Note1) SOP-J8: When mounted, 70 × 70 × 1.6 mm (glass epoxy on single-layer used at Ta = 25°C or above. Conditions VCC CS, FB, ACMONI OUT VH When mounted substrate). Reduce to 5.40 mW/°C when ● Recommended Operating Conditions (Ta = 25°C) Parameter Supply voltage range 1 Supply voltage range 2 Symbol VCC VH Rating 8.9 ~ 26.0 80 ~ 600 Unit V V ● Electrical Characteristics (Unless otherwise noted, Ta = 25°C, VCC = 15 V) Rating Parameter Symbol Min. Typ. Max. Conditions VCC pin voltage VH pin voltage Unit Conditions ［Circuit current］ FB = 2.0 V (during pulse operation) FB = 0.0 V (during burst operation) Circuit current (ON) 1 ION1 - 600 1000 μA Circuit current (ON) 2 ION2 - 350 450 μA 12.50 7.50 26.00 - 13.50 8.20 5.30 27.50 23.50 4.00 14.50 8.90 29.00 - V V V V V V VCC rise VCC drop VUVLO3 = VUVLO1- VUVLO2 VCC rise VCC drop VOUTH VOUTL RPDOUT 10.5 75 12.5 100 14.5 1.00 125 V V kΩ IO = -20 mA IO = +20 mA VACMONI1 VACMONI2 VACMONI3 TACMONI1 0.92 0.63 0.20 180 1.00 0.70 0.30 256 1.08 0.77 0.40 330 V V V ms ACMONI rises ACMONI falls Start current 1 Start current 2 ISTART1 ISTART2 0.400 1.000 0.700 3.000 1.000 5.000 mA mA OFF current ISTART3 - 10 20 uA VSC 0.400 0.800 1.400 V ［VCC pin (5 pin) protection function ］ VCC UVLO voltage 1 VUVLO1 VCC UVLO voltage 2 VUVLO2 VCC UVLO hysteresis VUVLO3 VCC OVP voltage 1 VOVP1 VCC OVP voltage 2 VOVP2 VCC OVP hysteresis VOVP3 [Output driver block] OUT pin H voltage OUT pin L voltage OUT pin pull-down resistance [ACMONI detection circuit] ACMONI detection voltage1 ACMONI detection voltage2 ACMONI Hysteresis ACMONI Timer [Start circuit block] Start current switching voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/27 VCC = 0 V VCC = 10 V Inflow current from VH pin after release of UVLO TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ ● Electrical characteristics of control IC block (Unless otherwise noted, Ta = 25°C, VCC = 15 V) Rating Parameter Symbol Unit Min. Typ. Max. Conditions [PWM type DC/DC driver block] FB = 2.00 V average frequency FB = 0.40 V average frequency FB = 2.00 V average frequency Oscillation frequency 1a FSW1a 90 100 110 kHz Oscillation frequency 2 FSW2 - 25 - kHz Frequency hopping range FDEL1 - 6.0 - kHz Hopping fluctuation frequency Minimum pulse width Soft start time 1 Soft start time 2 Soft start time 3 Soft start time 4 Maximum duty FB pin pull-up resistance FB / CS gain FB burst voltage 1 FB burst voltage 2 FCH Tmin TSS1 TSS2 TSS3 TSS4 Dmax RFB Gain VBST1 VBST2 75 0.30 0.60 1.20 2.40 68.0 22 0.300 0.350 125 400 0.50 1.00 2.00 4.00 75.0 30 4.00 0.400 0.450 175 0.70 1.40 2.80 5.60 82.0 38 0.500 0.550 Hz ns ms ms ms ms % kΩ V/V V V FBOLP voltage 1a VFOLP1A 2.60 2.80 3.00 V FBOLP voltage 1b VFOLP1B - VFOLP2A-0.2 - V TFOLP 44 64 84 ms VCS 0.380 0.400 0.420 V VCS_SS1 - 0.100 - V VCS_SS2 - 0.150 - V TSS1 [ms] ~ TSS2 [ms] VCS_SS3 - 0.200 - V TSS2 [ms] ~ TSS3[ms] VCS_SS4 - 0.300 - V TSS3 [ms] ~ TSS4 [ms] TLEB - 250 - ns KCS 12 20 28 mV/us FBOLP detection timer FB drop FB rise When overload is detected (FB rise) When overload is detected (FB drop) [Overcurrent detection block] Overcurrent detection voltage Overcurrent detection voltage SS1 Overcurrent detection voltage SS2 Overcurrent detection voltage SS3 Overcurrent detection voltage SS4 Leading edge blanking time Overcurrent detection AC compensation factor www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/27 Ton = 0 us 0 [ms] ~ Tss1 [ms] TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ ● Pin Descriptions Table1. I/O Pin Functions No. Pin Name I/O Function 1 2 3 4 5 6 7 8 ACMONI FB CS GND OUT VCC N.C. VH I I I I/O O I/O I Comparator input pin Feedback signal input pin Primary current sense pin GND pin External MOS drive pin Power supply input pin Non Connection Start circuit pin ESD Diode VCC ○ ○ ○ ○ - GND ○ ○ ○ ○ ○ ○ ● I/O Equivalent Circuit Diagram Figure 2. I/O Equivalent Circuit Diagram www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ ● Block Diagram Figure 3. Block Diagram www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ ● Description of application operations in blocks (1) Start circuit (VH pin: 8 pin) This IC has a built-in start circuit (withstands 650 V). This enables both low standby mode power and high-speed startup. This start circuit operates only at startup. The current flow when operating is shown in Figure 5. After startup, the power consumed is only for the idling current ISTART3 (typ = 10 uA). ex) When Vac = 100 V, power consumption is from start circuit only PVH = 100 V*√2*10 uA = 1.41 mW ex) When Vac = 240 V, power consumption is from start circuit only PVH = 240 V*√2*10 uA = 3.38 mW Startup time is determined based on the inflow current for the VH pin and the capacitance for the VCC pin. Startup time reference values are shown in Figure 6. For example, when Cvcc = 10 uF, startup takes about 0.07 seconds. When the VCC pin has been shorted to GND, the ISTART1 current in Figure 5 flows. When the VH pin has been shorted to GND, a large current flows to GND from the VH line. To prevent this, insert resistor RVH (5 kΩ ~ 60 kΩ) to limit the current between the VH line and the VH pin of the IC. 2 When the VH pin is shorted, the power of VH /RVH is applied to the resistor. Therefore, select a resistor size that is able to tolerate this amount of power. If one resistor is not enough for the allowable power, connect two or more resistors in series. Figure 4. Block Diagram of Start Circuit 1.0  0.9  起動時間[sec] Startup Time [us] 0.8  0.7  0.6  0.5  0.4  0.3  0.2  0.1  0.0  0 5 10 15 20 25 30 35 40 45 50 Cvcc  [uF] Figure 5. Start Current vs VCC Voltage (* Start current flows from the VH pin.) The operating waveform at startup is as follows. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 6. Startup Time (Reference Value) (CVCC is capacitance for the VCC pin.) 6/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ The operating waveform at startup is shown in Figure 7. VH Voltage ISTART2 VH input current ISTART1 ISTART3 VUVLO1 VCC(5pin) VSC Switing Set voltage Secondary output A B C D Figure 7. Operating Waveform at Startup A: VH voltage is applied when plugged into the outlet. At that time, charging starts from the VH pin via the start circuit to the VCC pin. At that time, VCC < VSC (typ = 0.8 V), so the VH input current is limited to ISTART1 by the VCC pin short protection function. B: Since VCC voltage > VSC (typ = 0.8 V), VCC short protection is cancelled and current flow is from the VH input current. C: Since VCC voltage > VUVLO1 (typ = 13.5 V), the start circuit is stopped and the VH input current flow is only ISTART3 (typ = 10 uA). When switching starts, secondary output begins to increase, but since secondary output is low, the VCC pin voltage is reduced. The drop rate of VCC is determined by the consumption current between the VCC pin capacitor and the IC and by the load current connected to the VCC pin. (V/t = Cvcc/Icc) D: Since secondary output has risen to a constant voltage, voltage is applied from the auxiliary winding to the VCC pin, and VCC voltage is stabilized. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ (2) Startup sequences (soft start operation, light load operation, auto recovery operation during overload protection) Startup sequences are shown in Figure 8. See the sections below for detailed descriptions. Figure 8. Startup Sequence Time Chart A: Voltage is applied to the input voltage (VH) pin (pin 8). B: The VCC pin (pin 6) voltage rises, and when VCC ＞ VUVLO1 (13.5 V typ) this IC starts to operate. When protection functions (ACMONI, VCC, CS, FB pin, temperature) are judged as normal, switching operation begins. At this time, the VCC pin (pin 6) consumption current necessarily causes the VCC pin voltage to drop. When VCC < VUVLO2 (8.2 V typ), switching operation stops by VCC UVLO function. For that, set VCC capacitor to finish start-up before VCC VUVLO1 (13.5 V typ), the start circuit stops charging VCC. J: Same as F K: Same as G Startup waveforms are shown as reference examples in Figure 9 and Figure 10. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ VH voltage VH voltage Secondary output Secondary output VCC voltage VCC voltage Within 64ms Within 64ms Figure 9. Waveform of No-load Startup Figure 10. Waveform of High-load Startup (3) VCC pin protection function This IC includes a VCC pin under voltage protection function VCC UVLO (Under Voltage Protection) and overvoltage protection function VCC OVP (Over Voltage Protection). The VCC UVLO function and VCC OVP function prevent damage to the switching MOSFET that can occur when the VCC voltage drops or becomes excessive. (3-1) VCC UVLO and VCC OVP functions VCC UVLO is an auto recovery type comparator with voltage hysteresis. For VCC OVP, the BM1P105FJ has an auto recovery type comparator. After VCCOVP operation detects, switching operation re-start when VCC VUVLO1, the VCC UVLO function is canceled and the DC/DC operation starts. Then VCC start-up circuit stops charging. C: When VCC pin (pin 6) voltage < VUVLO2, the VCC UVLO function is operated and the DC/DC operation stops. Then VCC start-up circuit starts charging. D: When VCC pin (pin 6) voltage > VUVLO1, the VCC UVLO function is canceled and the DC/DC operation starts. Then VCC start-up circuit stops charging. E: After finishing start-up, VCC pin voltage is stable as secondary output voltage is stable. F: VCC pin voltage rises G: When VCC pin (pin 6) voltage > VOCP status continues for TLATCH (typ = 100us), switching operation is stopped by the VCC OVP function. H: When VCC pin voltage < VOVP2, VCCOVP function is released, and the switching operation re-starts. I: When VCC pin voltage < VUVLO2, VCCUVLO function operates, and switching operation stops. J: When VCC pin (pin 6) voltage > VUVLO1, the VCC UVLO function is canceled and the DC/DC operation starts. K: The same as I. L: The same as J. M: The same as K. N: High voltage line VH is reduced. Then VCC pin voltage drops because IC cannot charge the power to VCC pin. O: When VCC < VUVLO2, the VCC UVLO function operates. P: When VCC ＞ VUVLO, start-up circuit stops, and the switching operation re-starts. ・Capacitance value of VCC pin To ensure stable operation of the IC, set the VCC pin capacitance value to 10 uF or above. If the capacitor for the VCC pin is too large, it will delay the response of the VCC pin to secondary output. In cases where the transformer has a low degree of coupling, a large surge can be generated at the VCC pin, which may damage the IC. In such cases, insert a resistance of 10 Ω to 100 Ω on a bus between the diode and capacitor after the auxiliary winding. As for constants, perform a waveform evaluation of the VCC pin and enter settings that will prevent any surge at the VCC pin from exceeding the absolute maximum rating for the VCC pin. ・VCC OVP voltage protection settings for increased secondary output The VCC pin voltage is determined by the secondary output and the transformer ratio (Np:Ns). Accordingly, when secondary output has become large, it can be protected by VCC OVP. The VCC OVP protection settings are as follows. Vout Np Ns Nb Figure 12 VCC OVP Settings This is determined by VCC voltage = Vout x Nb/Ns. (Vout: Secondary output, Nb: auxiliary winding turns, Ns: secondary winding turns). When secondary output voltage rises 30% high, and protection is desired, set the number of winding turns so that 1.3 x Vout x (Nb/Ns) ＞ VOVP1. For VCC OVP protection, since there is the TLATCH (typ = 100 us) blanking time, VCC OVP protection cannot be detected for instantaneous surges at the VCC pin. However, VCC OVP is detected when the VCC pin voltage has become higher than VOVP1 for at least the TLATCH period, such as due to the impact of a low degree of transformer couplings, so an application evaluation should be done to check this before setting VCC OVP. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ (4) ACMONI pin protection function ACMONI(1pin) pin is for brown-out protection. When AC voltage falls, the brown-out function stops switching operation. The usage is shown in Figure 13. The voltage divide AC voltage by resistors is applied to ACMONI pin. When ACMONI pin voltage exceeds VACOMONI (1.0Vtyp), IC detects normal state, and IC starts switching operation. The release condition of this function is different by DC detection and AC detection. (Fig-13 shows AC detection method) In DC detection, ACMONI pin voltage is lower than VACMONI2（0.7V typ） after switching operation, the internal timer of ＩＣ starts to operate. When the status which ACMONI pin voltage is lower than VACMONI2 （ 0.7V typ ） continues for TACMONI1(typ=256ms), the switching operation stops. In AC detection, when the status which ACMONI pin voltage is lower than VACMONI1（1.0V typ） continues for TACMONI1(typ=256ms), the switching operation stops. For that, even if AC voltage temporary disappearance occurs, the switching operation continues within TACMONI1(typ=256ms) period. + FUSE AC 85-265Vac - Discharge AC monitor ERROR AMP RH RL Figure 13. Application circuit The detection value of brown-out sets by external resistors of AMMONI pin. The setting method is below: ○The setting : When AC line voltage is higher than the voltage “VHstart”, IC starts to operate VHstart value is calculated by below equation. *VACMONI1=1.0V VHstart=(RH+RL)/RL×VACMONI1 Please set RH and RL by the equation. Then brown-out protection voltage “VHend” is calculated by below equation. *VACMONI1=0.7V VHend=(RH+RL)/RL×VACMONI2 When brown-out function does not use, ACMONI pin voltage needs to be set the voltage from 1.3V to 5.0V As the applied method, apply from outside or apply the voltage divided resistors from VCC. Vout Np Ns Nb Figure 14. The setting of ACMONI pin in the case not to use brown-out function www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ (5) DC/DC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst) (5-1) PWM basic operations Figure 15 shows a PWM basic block diagram and Figure 16 illustrates PWM basic operations. Ip Figure 15. Block Diagram of IC Internal PWM Operations Figure 16. PWM Basic Operations A: A SET signal is output from the oscillator in the IC, and the MOSFET is turned ON. At that time, the capacitance between the MOSFET drain and source becomes discharged, and noise is generated at the CS pin. This noise is called the leading edge. This IC has a built-in filter for this noise. (See (6).) As a result of this filter and delay time, the minimum pulse width of the IC is 400 ns (typ). Afterward, current flow to the MOSFET and the Vcs = Rs * Ip voltage is applied to the CS pin. B: When CS pin voltage rises greater than the FB pin voltage/Gain (typ = 4) or the overcurrent detection voltage Vcs, the RESET signal is output and OUT is turned off. C: There is a delay time Tondelay between time point B and actual turn-off. This time results from differences in maximum power that occur based on the AC voltage. This IC includes a function that suppresses these differences. (See (5-4).) D: The energy that accumulates in the transformer during Ton status is discharged to the secondary side, and the drain voltage starts to oscillate freely based on the transformer Lp value and the MOSFET Cds (drain-source capacitance). www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ E: Since the switching frequency within the IC is predetermined, SET signal output from the internal oscillator occurs for a set period starting from point A, and the MOSFET is turned on. (5-2) Frequency operations Figure 17. PWM Operations in IC The PWM frequency is generated by the OSC block (internal oscillator) in Figure 17. This oscillator has a switching frequency hopping function and the switching frequency fluctuates such as is shown in Figure 18. The fluctuation cycle is 125 Hz. Due to this frequency hopping function, the frequency spectrum is dispersed and the frequency spectrum peak is lowered. This increases the margin for EMI testing. Switching Frequency [kHz] 500us 106 100 94 125 Hz(8ms) Time Figure 18. Frequency Hopping Function In Figure 18, the duty is calculated as Ton * Switching frequency * 100. The maximum duty value is Dmax (typ = 75%). Since the PWM current mode method is being used, if the duty exceeds 50% sub harmonic oscillation may occur. 22 mV/us slope compensation is built in as a countermeasure to this. To reduce power consumption when there is a light load, a burst mode circuit and frequency reduction circuit are built in. These operations are illustrated in Figure19. As shown in this figure, frequency fluctuates according to the FB voltage. If the FB voltage is in the range shown for mode2, switching loss is reduced by reducing internal oscillations based on the FB voltage. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ Figure 19. Operation with FB pin voltage ・mode1: ・mode2: ・mode3: ・mode4: Burst operation Frequency reduction operation (reduces maximum frequency.) Fixed frequency operation (operates at maximum frequency.) Overload operation (overload status is detected and pulse operation is stopped.) (5-3) Overcurrent detection operation RFB (30 kΩ.typ) is used as pull-up resistance for the FB pin with regard to the internal power supply (4.0 V). When the load of the secondary output voltage (secondary load power) changes, the photo-coupler current changes, and so the FB pin voltage also changes. FB voltage VFB is determined by the equation FB voltage = 4 V - IFB. (IFB: photo coupler current) For example, when the load becomes heavier, the FB current is reduced, so the FB voltage rises. When the load becomes lighter, the FB current is increased, so the FB voltage drops. In this way, secondary voltage is monitored by the FB pin. As the FB pin voltage is monitored, if the load becomes lighter (if FB voltage drops), a burst mode operation or frequency reduction operation is executed. Figure 20 shows the CS detection voltage with regard to FB voltage. ⊿CS/⊿FB Gain : 1/4 Figure 20 FB Voltage vs CS Voltage Characteristics When FB voltage is less than 2.0 V or when the CS voltage exceeds the FB voltage / Gain (typ = 4), the MOSFET is turned off. (See time point C in Figure 16.) When the FB voltage exceeds 2.0 V, the CS voltage = Vcs + Kcs * Ton. Kcs * Ton depends on AC voltage compensation. (See 5-4.) Therefore, peak current Ip is determined as Ip = Vcs1 / Rs. The current value for the MOSFET should be set with a margin with regard to the Ip value obtained from this formula. 2 Maximum power is determined as Pmax = 1/2 x Lp x Ip x Fsw. (Lp: primary inductance value, Ip: primary peak current, Fsw: switching frequency) Vcs1 is determined as Vcs1 = Vcs (typ = 0.4 V) + Kcs (typ = 20) * Ton + Vdelay. Vdelay is the amount of CS voltage increase during the delay time Rondelay between B and C in Figure 16. This is calculated as Vdelay = Vin / Lp * Tondelay * Rs. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ (5-4) AC voltage dependent compensation of overcurrent limiter This IC has an AC voltage compensation function on chip. This function performs compensation for AC voltage by increasing the level of the overcurrent limiter over time. In the equation below, (A) and (B) are assigned values similar to those for AC 100 V and AC 200 V to perform compensation. Vcs1 = Vcs (typ = 0.4 V) + Kcs (typ = 20) *Ton + Vdelay (A) (B) These operations are shown in Figures 21, 22, and 23. When there is no AC voltage compensation, the peak current becomes offset during the response time. Figure 21. Without AC Voltage Compensation Function Figure 22. With AC Voltage Compensation Function Primary peak current that flows during overload mode is defined as follows. Primary peak current Ipeak = Vcs/Rs + Kcs * Ton/Rs + Vin/Lp * Tondelay Vcs: Overcurrent limiter voltage in IC Current detection resistor Rs: Vin: Input DC voltage Primary peak current Lp: Tondelay: Delay time after overcurrent limiter detection Figure 23. Overcurrent Limiter Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ (6) L.E.B period When the driver MOSFET is turned on, a surge current is generated at time point A in Figure 16. At that time, the CS voltage (pin 4) rises, which may cause detection errors in the overcurrent limiter circuit. To prevent these detection errors, the OUT pin in this IC is switched from low to high and the CS voltage (pin 4) is masked for 250 ns by the built-in L.E.B. function (Leading Edge Blanking function). This blanking function can reduce the CS pin noise filter for the noise that is generated when switching the OUT pin from low to high. However, if the CS pin noise does not stay within this 250 ns period, an RC filter should be applied to this pin, such as is shown in Figure 24. At this time, a delay time occurs due to the RC filter when the CS pin is detected. Even if there is no filter, attachment of RCS as a surge countermeasure is recommended. The recommended resistance for Rcs is 1 kΩ. When a filter ring is desired, use Ccs to adjust for this resistance. Figure24. Circuits Peripheral to the CS Pin (7) CS pin open protection When the CS pin (pin 4) has become an open pin, transient heat (due to noise, etc.) occurs in the IC, which may become damaged. An open protection circuit has been built in to prevent such damage. (Auto recovery protection) VCCOVP Timeout Bottom det OR POUT AND S Q FBOLP_OH AND 5 OUT PRE Driver NOUT R VREF(4V) 1MΩ CURRENT SENSE Leading Edge Blanking (V-V Change) Normal : ×1.0 3 CS RS Figure 25. CS Pin Peripheral Circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ (8) Output overload protection function (FB OLP comparator) As is shown in mode4 of Figure 20, when the FB pin voltage rises to above a certain value, it is called an overload condition. The output overload protection function stops switching operations when mode4 has an overload condition. During an overload condition, the output voltage drops and so current no longer flows to the photo coupler while the FB voltage (pin 2) rises. When the FB voltage (pin 2) exceeds VFOLP1A (2.8 V typ) continuously for TFOLP2 (64 ms typ), it is judged as an overload condition and switching is stopped. While the FB pin (pin 2) exceeds VFOLP1A (2.8 V typ), if the FB pin (pin 2) voltage drops below VFOLP1B (2.6 V typ) during the TFOLP (64 ms typ) period, the overload protection timer is reset. Switching operation are performed during the TFOLP (64 ms typ) period. At startup, the FB pin (pin 2) voltage is pulled up by a resistance to the IC internal voltage, and operations start when the voltage reaches VFOLP1A (2.8 V typ) or above. Therefore, at startup the start time of secondary output voltage must be set so that the FB voltage (pin 2) drops to VFOLP1B (2.6 V typ) or below within the TFOLP (64 ms typ) period. Once FBOLP is detected, the switching operation stops, and VCC voltage falls down because secondary output voltage falls down. When VCC voltage is lower than Vuvlo2(8.2V.typ), IC is reset, and IC starts by starter circuit shown in (1). The switching stop time is calculated by VCC pin voltage and VCC capacitor and Icc current Stop time : Tstop Tstop=Cvcc*(VCC – Vuvlo2) / Icc Figure 26. Overload Protection (Auto Recovery) A: Since FB > VFOLP1A, the FBOLP comparator detects an overload. B: When FB VFOLP1A, the FBOLP comparator detects an overload. D: When the condition at C continues for TFOLP (typ = 64 ms), switching is stopped by the overload protection function. As switching operation stops, VCC pin voltage falls down because output voltage falls down. E: When VCC pin voltage < VUVLO2, IC is reset by VCC UVLO function, and start-up circuit operates. F: When VCC pin voltage > VUVLO1, VCC UVLO is released, and switching operation starts. G: Because secondary output voltage is stable, VCC pin voltage is also stable. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ (9-1) OUT pin clamp function To protect the external MOSFET, the high voltage level of the OUT pin (pin 5) is clamped to VOUTH (typ = 12.5 V). The VCC pin (pin 6) voltage is raised to prevent MOSFET gate damage. (Shown in Figure27.) Figure 27. OUT Pin (Pin 5) Schematic (9-2) OUT pin driver circuit Figure 28. OUT Pin (Pin 5) Driver Circuit Switching noise that occurs when OUT is turned on or off may cause EMI-related problems. In such cases, the MOSFET turn-on time and turn-off time must be delayed. However, when the turn off time is delayed, switching loss increases. Figure 28 shows a delay circuit for the OUT pin. In Figure 28, ① is valid during both turn-on and turn-off operations. ② shows a delay in the turn-on only, while turn-off is accelerated. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ (10) Caution points for board layout pattern Figure 29. Board Layout Pattern ・Caution points ① The red lines shown in Figure 29 are large current pathways. In the layout, these should be as short as possible since they can cause ringing, dissipation, etc. Also, any loops that occur in the red line should be made as small as possible in this layout. ② The orange lines in the secondary side of Figure 29 should also be made short and thick like the red lines and should be made with small loops in this layout. ③ Be sure to implement grounding for the red lines, brown lines, blue lines, and green lines. ④ The green lines are pathways for surges on the secondary side to escape to the primary side, and since a large current may flow instantaneously, they should be laid out independently of the red lines and blue lines. ⑤ The blue lines are GND lines for IC control. They do not have any large current flow, but they are susceptible to noise effects, so they should be laid out independently of the red lines, green lines, and brown lines. ⑥ The brown lines are current pathways for the VCC pin. A current flows on these lines during switching, so they should also be laid out independently. ⑦ Do not route any IC control lines directly under the transformer, since they may be affected by magnetic flux. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ (Application circuit example) ACIN_L F1 3.15A AC250V LP01 C21 2200pF/Y1 C2 0.22uF/X2 DA1 800V 10A AC90V -264V ACIN_N T1 10,11,12 1 R6 47k 2W C3 450V 100uF C1 0.22uF/X2 24V 2A D3 FRD 800V 0.5A D4 SBD 60V 1A D1 800V 0.1A R7 10 R8 150 Vout C4 2200pF 500V 7,8,9 3 Q1 800V 5A D2 800V 0.1A D6 FRD 300V 5A C11 35V 470uF C12 35V 470uF GND R9 100k R10 0.18 1W R11 1k 4 R1 10k R2 10k C6 50V 10uF R3 3.9M R12 10 D5 200V 0.5A IC1 BM1P061FJ R15 2k R16 1k 5 R4 short R5 39k R17 120k R18 9.1k C20 2200pF/Y1 C8 47pF PC1 PC81 7 C7 1000pF 4 1 3 2 C10 0.1uF U2 TL431 R20 12k R19 15k Figure 30. Application Circuit Example www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ ● Operation modes of protection circuit Table 3 lists the operation mode of each protection function. Table 3. Operation Modes of Protection Circuit Function Operation mode VCC Undervoltage Locked Out Auto recovery VCC Overvoltage Protection Auto recovery (with 100-us timer) FB Over Limited Protection Auto recovery (with 64-us timer) CS OPEN Protection Auto recovery (with 100-us timer) ● Sequence The sequence for this IC is shown in Figure 31. A transition to OFF mode occurs under all conditions when VCC exceeds 8.2 V. OFF MODE Soft Start1 Soft Start2 Soft Start3 VCC OVP ( Pulse Stop) Soft Start4 CS OPEN MODE ( Pulse Stop) Normal MODE OLP MODE ( Pulse Stop) Burst & Low Power MODE Figure 31. Sequence Diagram www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ ● Thermal loss In the thermal design, set operations for the following conditions. (The temperature shown below is the guaranteed temperature, so be sure that a margin is taken into account.) 1. Ambient temperature Ta must be 85°C or less. 2. IC loss must be within the allowable dissipation Pd. The thermal abatement characteristics are follows. (PCB: 70 mm x 70 mm x 1.6 mm, when mounted on glass epoxy substrate) 1000 900 800 700 Pd[mW] 600 500 400 300 200 100 0 0 25 図-19 50 75 SOP8 熱軽減特性 Ta[℃] 100 125 150 Figure 32. Thermal Abatement Characteristics www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 31. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ ● Part Number selection B M 1 P 1 0 5 F J Package FJ: SOP-J8 Part name ● Marking diagram - E2 Packaging and forming specifications E2: Reel type embossed tape ● Line-up 1PIN MARK 1P105 LOT No. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/27 Model name (BM1PXXXFJ) BM1P061FJ BM1P062FJ BM1P063FJ BM1P064FJ BM1P065FJ BM1P066FJ BM1P067FJ BM1P068FJ BM1P101FJ BM1P102FJ BM1P103FJ BM1P104FJ BM1P105FJ BM1P106FJ BM1P107FJ BM1P108FJ TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ Physical Dimension, Tape and Reel Information Package Name SOP-J8 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 26/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet BM1P105FJ Revision History Date Revision 20.Jan.2014 001 Changes New Release www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 27/27 TSZ02201-0F2F0A200170-1-2 2.Oct.2013.Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001