Datasheet
Automotive IPD 2ch Low Side Switch
BM2LC120FJ-C
Features
Key Specifications
■
■
■
■
■
■
■
AEC-Q100 Qualified(Note 1)
Built-in Over Current Protection Function(OCP)
Built-in Thermal Shutdown Function (TSD)
Built-in Active Clamp Function
Built-in Diagnostic Function
Direct Control Enabled from CMOS Logic IC, etc.
On Resistance RDS(ON) = 120 mΩ(Typ)
(when VIN = 5 V, IOUT = 0.8 A, Tj = 25 C)
■ Monolithic Power Management IC with the Control
Block (CMOS) and Power MOS FET Mounted on a
Single Chip
120 mΩ
On-state Resistance (Tj = 25 °C, Typ)
Over Current Detection Current
(Tj = 25 °C, Typ)
Output Clamp Voltage (Min)
Active Clamp Energy (Tj(START) = 25 °C)
Package
6A
42 V
140 mJ
W (Typ) x D (Typ) x H (Max)
4.90mm x 6.00mm x 1.65mm
SOP-J8
(Note 1) Grade1
General Description
The BM2LC120FJ-C is an automotive 2ch low side
switch IC, which has built-in OCP, TSD, active clamp
function.
Also, diagnostic function can diagnose OCP, TSD, open
load detection function (OLD).
Application
■ Driving Resistive, Inductive and Capacitive Load
Block Diagram(Note 1)
IN
OUT
Acti ve Clamp
Circuit
ST
TSD
OCP
OLD
GND
Figure 1. Block Diagram
(Note 1) There are two blocks in this product.
Product structure: Silicon monolithic integrated circuit
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Contents
Features.......................................................................................................................................................................................... 1
General Description ........................................................................................................................................................................ 1
Application ...................................................................................................................................................................................... 1
Key Specifications........................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Block Diagram ................................................................................................................................................................................ 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 3
Pin Description................................................................................................................................................................................ 3
Term ................................................................................................................................................................................................ 3
Absolute Maximum Ratings ............................................................................................................................................................ 4
Recommended Operating Conditions ............................................................................................................................................. 4
Thermal Resistance ........................................................................................................................................................................ 5
Electrical Characteristics................................................................................................................................................................. 9
Typical Performance Curves ......................................................................................................................................................... 11
Measurement Circuit for Typical Performance Curves .................................................................................................................. 18
I/O Pin Truth Table ........................................................................................................................................................................ 20
Timing Chart ................................................................................................................................................................................. 20
Function Description ..................................................................................................................................................................... 22
Operational Notes ......................................................................................................................................................................... 24
Ordering Information ..................................................................................................................................................................... 25
Marking Diagram .......................................................................................................................................................................... 25
Physical Dimension and Packing Information ............................................................................................................................... 26
Revision History ............................................................................................................................................................................ 27
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Pin Configuration
SOP-J8
(TOP VIEW)
IN1
1
8
OUT1
ST1
2
7
GND1
IN2
3
6
OUT2
ST2
4
5
GND2
Figure 2. Pin Configuration
Pin Description
.
Pin No.
Pin Name(Note 1)
1
IN1
Input pin 1, with internal pull-down resistor.
2
ST1
Self-diagnostic output pin 1.
3
IN2
Input pin 2, with internal pull-down resistor.
4
ST2
Self-diagnostic output pin 2.
5
GND2
GND pin 2.
6
OUT2
Output pin 2, when output pin shorted to battery and output current exceeding
the over current detection value, output current will be limited to protect IC.
7
GND1
GND pin 1.
8
OUT1
Output pin 1. When output pin shorted to battery and output current exceeding
the over current detection value, output current will be limited to protect IC.
Function
(Note 1) The number in Pin Name is the channel number.
Term
VBAT
VBAT
RL, ZL
IOUT
VMCU
IST
RST
OUT
ST
VOUT
VST
IIN
IN
CST
GND
VIN
VIN
GND
Figure 3. Term
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Absolute Maximum Ratings(Tj = 25°C)
Parameter
Output Voltage
Input Voltage
Output Current
Symbol
Ratings
Unit
VOUT
-0.3 to +42
V
VIN
-0.3 to +7
V
3.0 (inside limited)(Note 1)
IOUT(OCP)
A
Diagnostic Output Voltage
VST
-0.3 to +7
V
Diagnostic Output Current
IST
10
mA
EAS(25 °C)
140
Active Clamp Energy (Single Pulse)
Tj(START) = 25 °C(Note 2)
mJ
Active Clamp Energy (Single Pulse)
Tj(START) = 150 °C(Note 2) (Note 3)
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
EAS(150 °C)
50
Tj
-40 to +150
°C
Tstg
-55 to +150
°C
Tjmax
150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case
the IC is operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of
the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into
consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Internally limited by over current protection function.
(Note 2) Active clamp energy (Single Pulse), at the condition IOUT(START) = 1.9 A, VBAT = 16 V.
EAS =
1
2
LIOUT(START)2 × ( 1 -
VBAT
)
VBAT - VOUT(CL)
(Note 3) Not 100 % tested.
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Input Voltage
VIN
3.0
5.0
5.5
V
Operating Temperature
Tj
-40
+25
+150
°C
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Thermal Resistance(Note 1)
Parameter
Symbol
Typ
Unit
Condition
167.9
°C/W
1s
(Note 2)
105.8
°C/W
2s
(Note 3)
85.6
°C/W
2s2p
(Note 4)
Typ
Unit
Condition
141.5
°C/W
1s
(Note 2)
84.1
°C/W
2s
(Note 3)
67.1
°C/W
2s2p
(Note 4)
SOP-J8 (1ch ON)
Between Junction and Surroundings Temperature
Thermal Resistance
θJA
Parameter
Symbol
SOP-J8 (All ch ON)
Between Junction and Surroundings Temperature
Thermal Resistance
θJA
(Note 1) The thermal impedance is based on JESD51-2A (Still-Air) standard. It is used the chip of BM2LC120FJ-C
(Note 2) JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s)
(Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.)
(Note 3) JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layers (2s)
(Top copper foil: ROHM recommended Footprint + wiring to measure/
Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side) 2 oz.)
(Note 4) JESD51-5/-7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p)
(Top copper foil: ROHM recommended Footprint + wiring to measure/
2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side/inner layers) 2 oz./1 oz.)
■ PCB Layout 1 layer (1s)
Footprint
Figure 4. PCB Layout 1 layer (1s)
Dimension
Value
Board Finish Thickness
1.57 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
Board Material
FR4
Copper Thickness (Top Layer)
0.070 mm (Cu:2 oz)
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Thermal Resistance – continued
■
PCB Layout 2 layers (2s)
Top Layer
Bottom Layer
Top Layer
Bottom Layer
Cross Section
Figure 5. PCB Layout 2 layers (2s)
Dimension
Value
Board Finish Thickness
1.60 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
Board Material
FR4
Copper Thickness (Top/Bottom Layers)
0.070 mm (Cu + Plating)
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Thermal Resistance – continued
■ PCB Layout 4 layers (2s2p)
Top Layer
2nd/3rd/Bottom Layers
Top Layer
2nd Layer
3rd Layer
Bottom Layer
Cross Section
Figure 6. PCB Layout 4 layers (2s2p)
Dimension
Value
Board Finish Thickness
1.60 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
Board Material
FR4
Copper Thickness (Top/Bottom Layers)
0.070 mm (Cu + Plating)
Copper Thickness (Inner Layers)
0.035 mm
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Thermal Resistance – continued
■ Transient Thermal Resistance (Single Pulse) 1ch ON
1000
Zth [ C/W]
100
10
footprint
1
2s
2s2p
0
0.0001
0.001
0.01
0.1
1
Pulse time[s]
10
100
1000
Figure 7. Transient Thermal Resistance
■ Transient Thermal Resistance (Single Pulse) All ch ON
1000
Zth [ C/W]
100
10
footprint
1
2s
2s2p
0
0.0001
0.001
0.01
0.1
1
Pulse time[s]
10
100
1000
Figure 8. Transient Thermal Resistance
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Electrical Characteristics (Unless otherwise specified, 40 C ≤ Tj ≤ 150 C)
Parameter
Symbol
Output Clamp Voltage
Limit
Unit
Conditions
Min
Typ
Max
VOUT(CL)
42
48
54
V
RDS(ON)
-
120
160
mΩ
VIN = 5 V,IOUT = 0.8 A,Tj = 25 °C
RDS(ON)
-
230
300
mΩ
VIN = 5 V,IOUT = 0.8 A,Tj = 150 °C
RDS(ON)
-
160
230
mΩ
VIN = 3 V,IOUT = 0.8 A,Tj = 25 °C
RDS(ON)
-
290
420
mΩ
VIN = 3 V,IOUT = 0.8 A,Tj = 150 °C
Leak Current (Tj = 25 °C)
IOUT(L)
40
60
80
μA
VIN = 0 V,VOUT = 18 V,Tj = 25 °C
Leak Current (Tj = 150 °C)
IOUT(L)
50
85
200
μA
VIN = 0 V,VOUT = 18 V,Tj = 150 °C
Turn-ON TIME
tON
-
-
60
μs
Turn-OFF TIME
tOFF
-
-
60
μs
Slew Rate On
SRON
-
1.3
2.5
V/μs
Slew Rate Off
SROFF
-
1.5
2.7
V/μs
Input Threshold Voltage
VIN(TH)
1.5
-
2.7
V
RL = 15 Ω, VBAT = 12 V
IIN(H1)
-
125
250
μA
VIN = 5 V
IIN(H2)
-
-
500
μA
VIN = 5 V
IIN(L)
-10
0
+10
μA
VIN = 0 V
IOUT(OCP)
3
6
9
A
VIN = 5 V, VBAT = 12 V, Tj = 25 °C
Tjo
150
175
-
°C
VIN = 5 V
Tjr
135
-
-
°C
VIN = 5 V
TjΔHYS
-
15
-
°C
VIN = 5 V
On-state Resistance
(VIN = 5 V, Tj = 25 °C)
On-state Resistance
(VIN = 5 V, Tj = 150 °C)
On-state Resistance
(VIN = 3 V, Tj = 25 °C)
On-state Resistance
(VIN = 3 V, Tj = 150 °C)
High-level Input Current1
(in Normal Operation)
High-level Input Current2
(in Abnormal Operation)(Note 1)
Low-level Input Current
Over Current Detection Current
Thermal Shutdown Operated
Temperature(Note 2)
Thermal Shutdown Released
Temperature(Note 2)
Thermal Shutdown Hysteresis
(Note 2)
VIN = 0 V,IOUT = 1 mA
VIN = 0 V to 5 V, RL = 15 Ω,
VBAT = 12 V, Tj = 25 °C
VIN = 5 V to 0 V, RL = 15 Ω,
VBAT = 12 V, Tj = 25 °C
VIN = 0 V to 5 V, RL = 15 Ω,
VBAT = 12 V, Tj = 25 °C
VIN = 5 V to 0 V, RL = 15 Ω,
VBAT = 12 V, Tj = 25 °C
(Note 1) When thermal shutdown function or over current protection function is ON.
(Note 2) Not 100 % tested.
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Electrical Characteristics (Unless otherwise specified, 40 C ≤ Tj ≤ 150 C) – continued
Parameter
Symbol
Limit
Unit
Conditions
Min
Typ
Max
VOPEN
1.5
-
4.5
V
VIN = 0 V
ST Output On Voltage1
VST(ON1)
-
0.2
0.5
V
VIN = 5 V, IST = 1 mA
ST Output On Voltage2
VST(ON2)
-
0.2
0.5
V
VIN = 0 V, VOUT = 4.5 V,
IST = 0.5 mA
ST Output Leak Current1
IST(L1)
-
-
20
μA
VIN = 5 V, VST = 5 V
ST Output Leak Current2
IST(L2)
-
-
20
μA
ST Output Delay Time Detect
tSTDET
-
1
30
μs
ST Output Delay Time Release
tSTREL
-
1
30
μs
VIN = 0 V, VOUT = 1.5 V,
VST = 5 V
VIN = 0 V, VOUT = 5 V to 1 V,
VMCU = 5 V, RST = 10 kΩ, CST = 10 pF
VIN = 0 V, VOUT = 1 V to 5 V,
VMCU = 5 V, RST = 10 kΩ, CST = 10 pF
Open Load Detection Voltage
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Typical Performance Curves(Unless otherwise specified, Tj = 25 °C, VIN = 5.0 V)
54
240
On-state Resistance: RDS(ON) [mΩ]
Output Clamp Voltage: VOUT(CL) [V]
220
52
50
48
46
44
200
180
160
140
120
100
42
80
-40
0
40
80
120
150
3
4
Junction Temperature: Tj[℃]
Figure 9. Output Clamp Voltage
vs Junction Temperature
7
Figure 10. On-state Resistance vs Input Voltage
200
450
VIN = 3 V
400
180
VIN = 5 V
350
Leak Current: IOUT(L) [μA]
On-state Resistance: RDS(ON) [mΩ]
5
6
Input Voltage: VIN [V]
300
250
200
150
160
140
120
100
100
80
60
50
40
0
-40
0
40
80
120
150
0
40
80
120
150
Junction Temperature: Tj[℃]
Junction Temperature: Tj[℃]
Figure 11. On-state Resistance
vs Junction Temperature
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Figure 12. Leak Current vs Junction Temperature
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Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, VIN = 5.0 V) – continued
60
Turn-OFF TIME: tOFF [μs]
50
40
30
20
10
0
3
5
6
Input Voltage: VIN [V]
7
Figure 14. Turn-OFF TIME vs Input Voltage
60
60
50
50
Turn-OFF TIME: tOFF [μs]
Turn-ON TIME: tON [μs]
Figure 13. Turn-ON TIME vs Input Voltage
4
40
40
30
30
20
20
10
10
0
0
-40
0
40
80
120
150
Junction Temperature: Tj[℃]
0
40
80
120
150
Junction Temperature: Tj[℃]
Figure 15. Turn-ON TIME vs Junction Temperature
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Figure 16. Turn-OFF TIME vs Junction Temperature
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3.0
3.0
2.5
2.5
Slew Rate Off: SROFF [V/μs]
Slew Rate On: SRON [V/μs]
Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, VIN = 5.0 V) – continued
2.0
1.5
1.0
2.0
1.5
1.0
0.5
0.5
0.0
0.0
3
4
5
6
Input Voltage: VIN [V]
3
7
5
6
Input Voltage: VIN [V]
7
Figure 18. Slew Rate Off vs Input Voltage
Figure 17. Slew Rate On vs Input Voltage
3.0
3.0
2.5
2.5
Slew Rate Off: SROFF [V/μs]
Slew Rate On: SRON [V/μs]
4
2.0
1.5
1.0
0.5
2.0
1.5
1.0
0.5
0.0
0.0
-40
0
40
80
120
150
Junction Temperature: Tj[℃]
0
40
80
120
150
Junction Temperature: Tj[℃]
Figure 20. Slew Rate off vs Junction Temperature
Figure 19. Slew Rate On vs Junction Temperature
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Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, VIN = 5.0 V) – continued
250
2.7
VIN(TH) High
High-level Input Current1: IIN(H1) [μA]
Input Threshold Voltage: VIN(TH) [V]
VIN(TH) Low
2.3
1.9
1.5
200
150
100
50
0
1.1
-40
0
40
80
120
3
150
4
Junction Temperature: Tj[℃]
7
Figure 22. High-level Input Current1 (In Normal
Operation) vs Input Voltage
Figure 21. Input Threshold Voltage
vs Junction Temperature
9
Over Current Detection Current: IOUT(OCP) [A]
250
High-level Input Current1: IIN(H1) [μA]
5
6
Input Voltage: VIN [V]
200
150
100
50
0
8
7
6
5
4
VIN = 3 V
3
VIN = 4 V
VIN = 5 V
2
VIN = 6 V
1
VIN = 7 V
0
-40
0
40
80
120
150
Junction Temperature: Tj[℃]
2
4
6
8
Output Voltage: VOUT [V]
10
12
Figure 24. Over Current Detection Current
vs Output Voltage
Figure 23. High-level Input Current1 (in Normal
Operation) vs Junction Temperature
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Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, VIN = 5.0 V) – continued
5
Open Load Detection Voltage: VOPEN [V]
Over Current Detection Current: IOUT(OCP) [A]
9
8
7
6
5
4
4
3
2
1
0
3
-40
0
40
80
120
-40
150
0
Junction Temperature: Tj[℃]
Figure 25. Over Current Detection Current
vs Junction Temperature
80
120
150
Figure 26. Open Load Detection Voltage
vs Junction Temperature
0.5
ST Output On Voltage2: VST(ON2) [V]
0.5
ST Output On Voltage1: VST(ON1) [V]
40
Junction Temperature: Tj[℃]
0.4
0.3
0.2
0.1
0.0
-40
0
40
80
120
150
Junction Temperature: Tj[℃]
0.3
0.2
0.1
0.0
-40
0
40
80
120
150
Junction Temperature: Tj[℃]
Figure 27. ST Output On Voltage1
vs Junction Temperature
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Figure 28. ST Output On Voltage2
vs Junction Temperature
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0.30
3.0
0.25
2.5
ST Output Leak Current2: IST(L2) [μA]
ST Output Leak Current1: IST(L1) [μA]
Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, VIN = 5.0 V) – continued
0.20
0.15
0.10
0.05
2.0
1.5
1.0
0.5
0.0
0.00
-40
0
40
80
120
150
-40
0
80
120
150
Junction Temperature: Tj[℃]
Junction Temperature: Tj[℃]
Figure 30. ST Output Leak Current2
vs Junction Temperature
Figure 29. ST Output Leak Current1
vs Junction Temperature
5
ST Output Delay Time Release: tSTREL [μs]
5
ST Output Delay Time Detect: tSTDET [μs]
40
4
3
2
1
4
3
2
1
0
0
-40
0
40
80
120
150
0
40
80
120
150
Junction Temperature: Tj[℃]
Junction Temperature: Tj[℃]
Figure 31. ST Output Delay Time Detect
vs Junction Temperature
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Figure 32. ST Output Delay Time Release
vs Junction Temperature
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Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, VIN = 5.0 V) – continued
Active Clamp Energy (Single Pulse): EAS[mJ]
1000
Tj(START) = 25 °C
Tj(START) = 150 °C
100
10
1.0
1.5
2.0
Output Current (Start): IOUT(START)[A]
2.5
Figure 33. Active Clamp Energy (Single Pulse)
vs Output Current (Start)
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Measurement Circuit for Typical Performance Curves
RDS(ON)
= VOUT/IOUT
IOUT = 0.8 A
IOUT = 1 mA
OUT
OUT
ST
ST
V
V
IN
IN
GND
GND
VIN
Measurement Circuit for
Figure 9
Measurement Circuit for
Figure 10, 11
A
RL = 15Ω
VOUT = 18 V
OUT
VBAT = 12 V
OUT
ST
ST
Monitor
IN
IN
GND
GND
0 V to 5 V
or
5 V to 0 V
Monitor
Measurement Circuit for
Figure 13, 14, 15, 16, 17, 18, 19, 20
Measurement Circuit for
Figure 12
RL = 15 Ω
VBAT = 12 V
VBAT = 12 V
RL = 15 Ω
OUT
OUT
ST
ST
V
IN
A
IN
GND
VIN
GND
V
VIN
Measurement Circuit for
Figure 21
Measurement Circuit for
Figure 22, 23
A
VOUT
VOUT
OUT
OUT
10 kΩ
ST
ST
5V
IN
V
V
IN
GND
GND
VIN
Measurement Circuit for
Figure 24, 25
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Measurement Circuit for
Figure 26
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Measurement Circuit for Typical Performance Curves – continued
VOUT = 4.5 V
OUT
OUT
ST
IST = 1 mA
ST
IST = 0.5 ｍA
V
V
IN
IN
GND
GND
VIN
Measurement Circuit for
Figure 27
Measurement Circuit for
Figure 28
VOUT = 1.5 V
OUT
OUT
ST
A
A
ST
VST = 5 V
VST = 5 V
IN
IN
GND
GND
VIN
Measurement Circuit for
Figure 29
Measurement Circuit for
Figure 30
1 V to 5 V
or
5 V to 1 V
OUT
10 kΩ
ST
5V
10pF
Monitor
Monitor
IN
GND
Measurement Circuit for
Figure 31, 32
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BM2LC120FJ-C
I/O Pin Truth Table
■ Output Function
Input Signal
Operating Status
Output Status
L
Standby
OFF
H
Normal
ON
H
Over Current
Current Limiting
H
Over Temperature
OFF
■ Diagnostic Function of Abnormal Status
Diagnoses the presence or absence of an abnormal condition. By combining High and Low of the input signal and the ST
pin, it is possible to grasp overcurrent, heating state, load open state.
Timing Chart
Input Signal
ST Signal
Diagnosis Result
L
L
No Abnormality
L
H
Load Open
H
L
Over Current
or
Over Temperature
H
H
No Abnormality
VIN[V]
VIN
VIN(TH)
t
0
VOUT[V]
VOUT(CL)
VOUT
VBAT
IOUT x RDS(ON)
0
t
IOUT[A]
VBAT
ZL + RDS(ON)
IOUT
t
0
Figure 34. Inductive Load Operation
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Timing Chart – continued
VIN[V]
tr ≤ 0.1[μs]
tf ≤ 0.1[μs]
5V
90 %
VIN
10 %
0
ｔ
VOUT[V]
tON[μs]
tOFF[μs]
≈ 12 V
VOUT
0
80 %
70 %
30 %
20 %
ｔ
SROFF[V/μs]
SRON[V/μs]
≈0V
Figure 35. Switching Time
VIN[V]
VIN[V]
VIN
VIN
VIN = 0 V
VIN = 0 V
VOUT[V]
VOUT[V]
5V
VOUT
VOUT
1.5 V
5V
4.5 V
1V
1V
0
VST[V]
0
t
VST[V]
tSTDET
≈5V
VST
2.5 V
0
≈0V
t
tSTREL
≈5V
VST
t
0
t
0
2.5 V
0
t
≈0V
t
Figure 36. ST Output Delay Time
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Function Description
■ Over Current Protection Function
This IC has OCP function. Following is shown that the timing chart of OCP function.
Occurrence of Over Current
Dissolution of Over Current
①
②
VIN
VOUT
IOUT(OCP)
I OUT
Normal Current
VST
Figure 37. Timing Chart of OCP Function
①
②
IOUT is limited at Over Current Limitation Level (IOUT(OCP)) = 6 A (Typ) and the VOUT rises when over current is occurred.
VST turns Low.
Current limitation is released when over current is occured. VST turns High.
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Function Description – continued
■ TSD Function
This IC has a built-in TSD function. Following is shown that the timing chart of TSD function.
VIN
①
②
①
②
①
②
VOUT
Tjo
Tjr
Tj
VST
Figure 38. Timing Chart of TSD Function
① The output is turned off when the temperature of the IC reaches Thermal Shutdown Detected Temperature (Tjo) =
175 °C (Typ) or more. VST turns Low.
② The output returns to its normal state when the temperature of the IC becomes Thermal Shutdown Released
Temperature (Tjr) = 135 °C (Min) or less. VST turns High.
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Operational Notes
1.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
2.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately
but connected to a single ground at the reference point of the application board to avoid fluctuations in the
small-signal ground caused by large currents. Also ensure that the ground traces of external components do not
cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line
impedance.
3.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
4.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
5.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
6.
Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
7.
Thermal Shutdown Function (TSD)
This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should
always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued
period, the junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins.
When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under
no circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC
from heat damage.
8.
Over Current Protection Function (OCP)
This IC incorporates an integrated over current protection function that is activated when the load is shorted. This
protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC
should not be used in applications characterized by continuous operation or transitioning of the protection function.
9.
Active Clamp Operation
The IC integrates the active clamp function to internally absorb the reverse energy which is generated when the
inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Please do
not exceed active clamp endurance when inductive load is used.
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BM2LC120FJ-C
Ordering Information
B
M 2
L
C
M2: 2ch
L: Low Side SW
1
2
0
F
J
On-state Resistance Package
120: 120 mΩ
FJ: SOP-J8
(Tj = 25 °C, Typ)
C
E
2
Product Grade
C: For Automotive
Packaging and Forming Specification
E2: Embossed Tape and Reel
Marking Diagram
SOP-J8(TOP VIEW)
Part Number Marking
2 L C 1 2
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
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SOP-J8
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BM2LC120FJ-C
Revision History
Date
Revision
Changes
26.Feb.2018
001
New Release
09.Apr.2018
002
P4 Absolute Maximum Ratings Diagnostic output voltage and Diagnostic output current
were added.
25.Jul.2018
003
P9 Electrical Characteristics Slew Rate On and S Slew Rate Off limits were corrected.
P13 Figjre 17, 18, 19 and 20 were corrected.
25.May.2020
004
P22, P23 Function Description Descriptions of Over Current Protection Function and
TSD
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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