Datasheet
AC/DC Converter
PWM Type DC/DC Converter IC
Built-in a Switching MOSFET
BM2P0161-Z BM2P0361-Z
General Description
Key Specification
The PWM type DC/DC converter for AC/DC provides an
optimal system for all products that require an electrical
outlet.
BM2P0161-Z and BM2P0361-Z support both isolated and
non-isolated devices, enabling simpler design of various
types of low power consumption electrical converters.
The built-in 730 V starter circuit contributes to low-power
consumption.
Power supply can be designed flexibly by connecting
current sensing resistor for the switching externally.
Current is restricted in each cycle and excellent
performance is demonstrated in bandwidth and transient
response since current mode control is utilized. The
switching frequency is 65 kHz. At light load, the switching
frequency is reduced and high efficiency is achieved. A
frequency hopping function that contributes to low EMI is
also included on chip.
Design can be easily implemented because includes a
730 V switching MOSFET.
◼ Operating Power Supply Voltage Range:
VCC:
8.9 V to 26.0 V
DRAIN:
730 V(Max)
◼ Circuit Current (ON)1:
BM2P0161-Z: 0.90 mA(Typ)
BM2P0361-Z: 0.65 mA(Typ)
◼ Circuit Current (ON)2:
0.30 mA(Typ)
◼ Oscillation Frequency1:
65 kHz(Typ)
◼ Operating Ambient Temperature: -40 °C to +105 °C
◼ MOSFET ON Resistance:
BM2P0161-Z: 1.0 Ω(Typ)
BM2P0361-Z: 3.0 Ω(Typ)
Package
W (Typ) x D (Typ) x H (Max)
9.27 mm x 6.35 mm x 8.63 mm
pitch 2.54 mm
DIP7K
Feature
PWM Frequency: 65 kHz
PWM Current Mode Control
Built-in Frequency Hopping Function
Burst Operation When Load is Light
Frequency Reduction Function
Built-in 730 V Starter Circuit
Built-in 730 V Switching MOSFET
VCC Pin Under-Voltage Protection
VCC Pin Over-Voltage Protection
SOURCE Pin Open Protection
SOURCE Pin Short Protection
SOURCE Pin Leading Edge Blanking Function
Per-Cycle Over-Current Protection Circuit
Over Current Protection AC Voltage Compensation
Circuit
◼ Soft Start
◼ Secondary Over-Current Protection Circuit
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
Application
For AC Adapters, TV and Household Appliances (Vacuum
Cleaners, Humidifiers, Air Cleaners, Air Conditioners, IH
Cooking Heaters, Rice Cookers, etc.)
Typical Application Circuit
+
AC85V
to
AC265V
FUSE
Filter
Diode
Bridge
-
〇Product structure : Silicon monolithic integrated circuit
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
DRAIN
DRAIN
SOURCE
FADJ
VCC
GND
FB
ERROR
AMP
〇This product has no designed protection against radioactive rays.
1/21
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Pin Configuration
TOP VIEW
6
5
FB
7
GND
4
VCC
FADJ
3
DRAIN
SOURCE
2
DRAIN
1
Pin Description
Pin No.
Pin Name
I/O
1
2
3
4
5
6
7
SOURCE
FADJ
GND
FB
VCC
DRAIN
DRAIN
I/O
I
I/O
I
I
I/O
I/O
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Function
MOSFET SOURCE pin
Burst frequency setting pin
GND pin
Feedback signal input pin
Power supply input pin
MOSFET DRAIN pin
MOSFET DRAIN pin
2/21
ESD Diode
VCC
GND
○
○
○
○
○
○
○
○
-
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Block Diagram
VH
VOUT
FUSE
AC
Diode
Bridge
Filter
VCC
DRAIN
5
6.7
VCC UVLO
+
-
13.5V
/ 8.2V
VCC OVP
Starter
4.0V
Line Reg
100µs
Filter
+
-
12V Clamp
Circuit
27.5V
10µA
Internal Block
FADJ
2
Burst
Frequency
Control
S
PWM Control
+
Burst Control
DR IVER
R Q
4.0V
4.0V
30k
FB
4
OLP
+
128ms/
512ms
Timer
1M
Current
Limiter
Burst
Comparator
Leading Edge
Blanking
(Typ=250ns)
+
-
1
SOURCE
+
Rs
Soft Start
PWM
Comparator
-
AC Voltage
compensation
MAX
DUTY
+
+
OSC
(65kHz)
3
Frequency
Hopping
GND
Slo pe
Co mpen sation
Feedback
With
Isolation
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
3/21
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Description of Blocks
1. Start Circuit (DRAIN: Pin 6,7)
These ICs have a built-in start circuit. It enables low standby mode electricity and high speed start.
After start up, consumption power is determined by idling current I START3 only.
Reference values of starting time are shown in Figure 3. When CVCC=10 µF it can start in less than 0.1 s.
FUSE
Diode
Bridge
AC
DRAIN
Starter
SW1
VCC
Cvcc
VCCUVLO
Figure 1. Block Diagram of Start Circuit
1.0
0.9
IST ART2
Start Up Current [mA]
0.8
Start Time [s]
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
IST ART1
IST ART3
0 VSC
0
10V
5
10
15
20
25
30
35
40
45
50
CVCC[µF]
VUVLO1
VCC Voltage [V]
Figure 2. Start Up Current vs VCC Voltage
Figure 3. Start Time vs CVCC
* Start current flows from the DRAIN pin.
e.g.) Consumption power of start circuit only when Vac=100 V
𝑷𝑽𝑯 = 𝟏𝟎𝟎𝑽 × √𝟐 × 𝟏𝟎𝝁𝑨 = 𝟏. 𝟒𝟏𝒎𝑾
e.g.) Consumption power of start circuit only when Vac=240 V
𝑷𝑽𝑯 = 𝟐𝟒𝟎𝑽 × √𝟐 × 𝟏𝟎𝝁𝑨 = 𝟑. 𝟑𝟗𝒎𝑾
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
4/21
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Description of Blocks - continued
2. Start Sequences
Start sequences are shown in Figure 4. See the sections below for detailed descriptions.
VH
(Input Voltage)
VUVLO1
VCHG2
VUVLO2
VCC
VFOLP1A
Internal REF
Pull Up
Within
128ms
Within
128ms
Within
128ms
FB
Output Voltage
Over
Load
Normal
Load
Light
Load
Output Current
Burst mode
Switching
stop
Switching
A
BC
D
E
F
GH
I
J
Figure 4. Start Sequences Timing Chart
A:
B:
Input voltage VH is applied.
This IC starts operating when VCC>VUVLO1. Switching function starts when other protection functions are judged as
normal. Until the secondary output voltage becomes constant value or more from startup, the VCC pin consumption
current causes the VCC voltage to drop. As a result, IC should be set to VCC>VUVLO2 until switching starts.
C: With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current.
D: When the switching operation starts, VOUT rises.
After a switching operating start, set the rated voltage within the tFOLP1 period.
E: When there is a light load, it makes FB voltageVFOLP1A, it overloads.
G: When the FB pin voltage>VFOLP1A keeps above tFOLP1, overcurrent protection is caused between tFOLP2 period, and
switching stops. If the FB pin voltageVOVP1, tLATCH(100 μs Typ) continues, switching is stopped by the VCC OVP function.
VCCVUVLO1, VCC UVLO function releases, VCC charge function stops, DC/DC operation starts.
Because output voltage is low, the VCC voltage drops at the start time.
VCCVCHG2, VCC recharge function stops.
VCCVCHG2, VCC recharge function stops.
After the output voltage is finished rising, VCC is charged by the auxiliary winding, and the VCC pin stabilizes.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
7/21
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Description of Blocks – continued
4. DC/DC Driver
These ICs have a current mode PWM control.
An internal oscillator sets a fixed switching frequency (65 kHz Typ).
It has a switching frequency hopping function, which causes the switching frequency to fluctuate as shown in Figure 7
below.
The fluctuation cycle is 125 Hz.(Typ)
SwitchingFrequency
[kHz]
500μs
69
68
67
66
65
64
63
62
61
125 Hz(8ms)
Time
Figure 7. Frequency Hopping Function
Maximum duty cycle is fixed at 75 % and minimum ON time is fixed at 400 ns.
In current mode control, sub-harmonic oscillation may occur when the duty cycle exceeds 50 %.
As a countermeasure, this IC has built-in slope compensation circuits.
These ICs have built-in burst mode and frequency reduction circuits to achieve lower power consumption when the load is
light.
The FB pin is pulled up to an internal power supply by RFB.
The FB pin voltage is changed by secondary output voltage (secondary load power).
Monitor the FB pin voltage and change a switching operation state.
Figure 8 shows the FB voltage, and the DC/DC switching frequency operation.
mode1: Burst operation.
mode2: Frequency reduction operation. (max frequency is reduced)
mode3: Fixed frequency operation. (operates at max frequency)
mode4: Overload operation. (stops the pulse operation, sampling operation)
Switching
Frequency
[kHz]
Y
mode2
mode1
mode3
mode4
65kHz
25kHz
Pulse OFF
X
0.30V
1.25V
2.00V
2.80V
FB [V]
Figure 8. Switching Operation State Changes by FB Pin Voltage
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
8/21
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
4. DC/DC Driver – continued
(1) Burst Frequency Setting
The frequency can be fixed by adding capacitance to the FADJ pin. This can reduce the burst sounds.
The characteristics of the capacitor CFADJ connected to the FADJ pin and frequency fBST is shown in the Figure 10.
Frequency
[kHz]
Burst
Mode
Frequency
[kHz]
Frequency
Fixed Frequency
Reduction Mode
Mode
65kHz
Burst
Mode
Frequency
Fixed Frequency
Reduction Mode
Mode
65kHz
Switching
frequency
Switching
frequency
25kHz
25kHz
[Area of sound]
[Area of sound]
FADJ
Burst frequency
Burst frequency
Output Power[W]
Output Power[W]
Figure 9-2. setting
fBST [kHz]
Figure 9-1. No setting
CFADJ [pF]
Figure 10. fBST vs CFADJ
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
9/21
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Description of Blocks – continued
5. Over Current Limiter
These ICs have a built-in over current limiter per switching cycle.
If the SOURCE pin exceeds a certain voltage, switching stops. It also has a built-in AC voltage compensation function.
This function is a compensation function to increase the over current limiter level by AC voltage compensation function
time.
Shown in Figure11,12,13.
65kHz(15.3µs)
65kHz(15.3µs)
ON
ON
[DC/DC]
@AC100V
[DC/DC]
@AC100V
OFF
OFF
OFF
ON
ON
[DC/DC]
@AC240V
OFF
OFF
[DC/DC]
@AC100V
OFF
OFF
OFF
Ipeak(AC)@Vin=240V
Ipeak(AC)@Vin=240V
Ipeak(AC)@Vin=100V
Ipeak(AC)@Vin=100V
Ipeak(DC)= included conpensation
tDELAY
tDELAY
Ipeak(DC)＝Constant
tDELAY
Primary Peak Current
Primary Peak Current
Figure 11. No AC Voltage Compensation Function
tDELAY
Figure 12. Built-in AC Compensation Voltage
Primary peak current is calculated using the formula below.
𝑰𝒑𝒆𝒂𝒌 =
𝑽𝑺𝑶𝑼𝑹𝑪𝑬 𝑽𝒅𝒄
+
× 𝒕𝒅𝒆𝒍𝒂𝒚
𝑹𝒔
𝑳𝒑
Where:
𝑽𝑺𝑶𝑼𝑹𝑪𝑬 is the over current limiter voltage (internal).
𝑹𝒔 is the current detection resistance.
𝑽𝒅𝒄 is the input DC voltage.
𝑳𝒑 is the primary inductance.
𝒕𝒅𝒆𝒍𝒂𝒚 is the delay time after detection of over current limiter.
Y
CS Limitter[V]
0.704V
+20mV/µs
0.552V
0.400V
X
0.0
7.6µs
15.3µs
Time [µs]
Figure 13. Over Current Limiter Voltage
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
10/21
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Description of Blocks – continued
6. L. E. B. Blanking Period
When the MOSFET driver is turned ON, surge current flows through each capacitor component and drive current is
generated. Therefore, when the SOURCE pin voltage rises temporarily, detection errors may occur in the over current
limiter circuit. To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for 250
ns by the on-chip LEB (Leading Edge Blanking) function.
7. SOURCE Pin Short Protection Function
When the SOURCE pin is shorted, excessive heat may destroy the IC.
To prevent it from being damaged, these ICs have a built-in short protection function.
8. SOURCE Pin Open Protection
When the SOURCE pin becomes OPEN, excessive heat by noise may destroy the IC.
To prevent it from being damaged, these ICs have a built-in OPEN protection circuit (auto recovery protection).
9. Output Over Load Protection Function (FB OLP Comparator)
The output overload protection function monitors the secondary output load status at the FB pin and stops switching
whenever overload occurs. When there is an overload, the output voltage is reduced and current no longer flows to the
photo coupler, so the FB pin voltage rises.
When the FB pin voltage >VFOLP1A continuously for the period tFOLP1, it is judged as an overload and switching stops.
When the FB pin > VFOLP1A, the voltage goes lower than VFOLP1B during the period tFOLP1, the overload protection timer is
reset. The switching operation is performed during this period tFOLP1.
At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of VFOLP1A or above.
Therefore, at startup please set startup time within tFOLP1 so that the FB voltage becomes VFOLP1B or less.
Recovery is after the period tFOLP2, from the detection of FBOLP.
Absolute Maximum Ratings (Ta=25 °C)
Parameter
Symbol
Rating
Unit
Maximum Applied Voltage 1
VMAX1
-0.3 to +32.0
V
VCC
Maximum Applied Voltage 2
VMAX2
-0.3 to +6.5
V
SOURCE, FB, FADJ
Maximum Applied Voltage 3
VMAX3
650
V
DRAIN
730
V
DRAIN(tpulse < 10 μs) (Note 1)
PW=10 μs, Duty cycle=1 %
(BM2P0161-Z)
PW=10 μs, Duty cycle=1 %
(BM2P0361-Z)
Drain Current Pulse
IDP
12
A
Drain Current Pulse
IDP
4
A
Power Dissipation
Pd
1.00
W
Tjmax
150
°C
Tstg
-55 to +150
°C
Maximum Junction Temperature
Storage Temperature Range
Conditions
(Note 2)
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with power dissipation taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Duty is less than 1 %.
(Note 2) When mounted (on 74.2 mm x 74.2 mm, 1.6 mm thick, glass epoxy on single-layer substrate). Reduce to 8 mW/°C when Ta=25 °C or above.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
11/21
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Thermal Loss
The thermal design should set operation for the following conditions.
1. The ambient temperature Ta must be 105 °C or less.
2. The IC’s loss must be within the power dissipation Pd.
The thermal abatement characteristics are as follows.
(PCB: 74.2 mm x 74.2mm x 1.6 mm, mounted on glass epoxy on single-layer substrate)
1.4
1.2
1.0
Pd[W ]
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
125
150
Ta[℃]
Figure 14. DIP7K Thermal Abatement Characteristics
Recommended Operating Conditions
Parameter
Symbol
Power Supply Voltage Range 1
VCC
Power Supply Voltage Range 2
VDRAIN
Operating Temperature
Topr
Rating
Unit
Conditions
Min
Typ
Max
8.9
-
26.0
V
VCC pin voltage
-
-
650
V
DRAIN pin voltage
-
-
730
V
DRAIN(tpulse < 10 μs) (Note 1)
-40
-
+105
°C
(Note 1) Duty is less than 1 %
Electrical Characteristics (unless otherwise noted, Ta=25 °C, VCC=15 V)
Parameter
Symbol
Rating
Unit
Min
Typ
Max
650
-
-
V
730
-
-
V
IDSS
-
-
100
μA
On Resistance
RDS(ON)
-
1.0
1.4
Ω
On Resistance
RDS(ON)
-
3.0
3.6
Ω
Conditions
[MOSFET Block]
Between Drain and Source Voltage
Drain Leak Current
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
V(BR)DDS
12/21
ID=1 mA / VGS=0 V
ID = 1 mA, VGS = 0 V
tpulse < 10 μs
VDS=650 V / VGS=0 V
ID=0.25 A / VGS=10 V
(BM2P0161-Z)
ID=0.25 A / VGS=10 V
(BM2P0361-Z)
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Electrical Characteristics – continued
Parameter
Symbol
Min
Specifications
Typ
Max
Unit
Conditions
[Circuit Current]
Circuit Current (ON) 1
ION1
-
900
1450
μA
Circuit Current (ON) 1
ION1
-
650
1050
μA
Circuit Current (ON) 2
ION2
150
300
450
μA
VFB=2.0 V
(at pulse operation)
(BM2P0161-Z)
VFB=2.0 V
(at pulse operation)
(BM2P0361-Z)
VFB=0.3 V
VCC UVLO Voltage 1
VUVLO1
12.50
13.50
14.50
V
VCC rise
VCC UVLO Voltage 2
VUVLO2
7.50
8.20
8.90
V
VCC fall
VCC UVLO Hysteresis
VUVLO3
-
5.30
-
V
VUVLO3=VUVLO1-VUVLO2
VCC OVP Voltage 1
VOVP1
26.0
27.5
29.0
V
VCC rise
VCC OVP Voltage 2
VOVP2
22.0
23.5
25.0
V
VCC fall
VCC OVP Hysteresis
VOVP3
-
4.0
-
V
VOVP3=VOVP1-VOVP2
VCC Recharge Start Voltage
VCHG1
7.70
8.70
9.70
V
VCC Recharge Stop Voltage
VCHG2
12.00
13.00
14.00
V
Latch Mask Time
tLATCH
50
100
150
μs
Thermal Shutdown Temperature 1
TSD1
120
145
170
°C
Control IC, temperature rise
Thermal Shutdown Temperature 2
TSD2
90
115
140
°C
Control IC, temperature fall
Oscillation Frequency 1
fSW1
60
65
70
kHz
VFB=2.00 V
Oscillation Frequency 2
fSW2
20
25
30
kHz
VFB=0.30 V
Frequency Hopping Width 1
fDEL1
-
4.0
-
kHz
VFB=2.0 V
fCH
75
125
175
Hz
FADJ Source Current
IBST
0.80
1.00
1.20
μA
FADJ Comparator Voltage
VBST
1.13
1.20
1.27
V
FADJ Max Burst Frequency
fBST
-
0.833
-
kHz
Soft Start Time 1
tSS1
0.30
0.50
0.70
ms
Soft Start Time 2
tSS2
0.60
1.00
1.40
ms
Soft Start Time 3
tSS3
1.20
2.00
2.80
ms
Soft Start Time 4
tSS4
4.80
8.00
11.20
ms
DMAX
68.0
75.0
82.0
%
Minimum ON Time
tMIN
150
400
650
ns
FB Pin Pull-Up Resistance
RFB
23
30
37
kΩ
ΔFB / ΔSOURCE Gain
Gain
3.00
4.00
7.00
V/V
FB Burst Voltage 1
VBST1
0.220
0.280
0.340
V
FB fall
FB Burst Voltage 2
VBST2
0.260
0.320
0.380
V
FB rise
FB Burst Hysteresis
FB Voltage of Starting Frequency
Reduction
VBST3
-
0.040
-
V
VBST3=VBST2-VBST1
VDLT
1.100
1.250
1.400
V
FB OLP Voltage 1a
VFOLP1A
2.60
2.80
3.00
V
FB OLP Voltage 1b
VFOLP1B
2.40
2.60
2.80
V
FB OLP ON Detect Timer
tFOLP1
80
128
176
ms
FB OLP OFF Timer
tFOLP2
332
512
692
ms
[VCC Protection Function]
[PWM Type DC/DC Driver Block]
Hopping Fluctuation Frequency
Maximum Duty
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
13/21
FADJ=0.0 V
CFADJ=1000 pF
Overload is detected (FB
rise)
Overload is detected (FB
fall)
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Electrical Characteristics – continued
Parameter
[Over Current Detection Block]
Over-Current Detection Voltage
Over-Current Detection Voltage SS1
Over-Current Detection Voltage SS2
Symbol
VSOURCE
Min
Specifications
Typ
Max
Unit
Conditions
VSOURCE_SS1
0.375
0.050
0.400
0.100
0.425
0.150
V
V
tON=0 μs
0 ms to tSS1 ms
VSOURCE_SS2
0.080
0.150
0.220
V
tSS1 ms to tSS2 ms
Over-Current Detection Voltage SS3
VSOURCE_SS3
0.130
0.200
0.270
V
tSS2 ms to tSS3 ms
Over-Current Detection Voltage SS4
VSOURCE_SS4
0.230
0.300
0.370
V
tSS3 ms to tSS4 ms
Leading Edge Blanking Time
Over Current Detection AC Voltage
Compensation Factor
SOURCE Pin Short Protection
Voltage
SOURCE Pin Short Protection Time
tLEB
120
250
380
ns
(Note 2)
KSOURCE
12
20
28
mV/μs
VSOURCESHT
0.020
0.050
0.080
V
tSOURCESHT
1.80
3.00
4.20
μs
Start Current 1
ISTART1
0.100
0.500
1.000
mA
VCC=0 V
Start Current 2
ISTART2
1.000
3.000
6.000
mA
OFF Current
ISTART3
-
10
20
μA
VCC=10 V
Inflow current from the
DRAIN pin after UVLO is
released and when
MOSFET is OFF
VSC
0.800
1.500
2.100
V
[Circuit Current]
Start Current Switching Voltage
(Note 2) Not 100 % tested.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
14/21
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Application Examples
Show a flyback circuitry example in Figure 15.
Be careful with the DRAIN voltage because high voltage is produced by ringing in turn OFF.
With this IC, It become able to work to 730V.
+
AC85V
to
AC265V
FUSE
Filter
Diode
Bridge
-
DRAIN
DRAIN
SOURCE
FADJ
VCC
GND
FB
ERROR
AMP
Figure 15. Flyback Application Ciucit
730V
650V
DRAIN
0V
tpulse < 10 μs(Duty < 1%)
Figure 16. Drain Pin Ringing Waveform
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
15/21
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
I/O Equivalence Circuit
SOURCE
1
3
FB
4
GND
FADJ
SOURCE
VCC
Internal Reg
VCC
VREF
VREF
5
FADJ
2
-
-
6
R FB
FB
GND
DRAIN
7
DRAIN
DRAIN
DRAIN
VCC
-
Internal
Circuit
Internal
Circuit
Internal MOSFET
Internal MOSFET
SOURCE
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
16/21
SOURCE
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital
and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.
Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on
the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions.
The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always
be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Interpin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
17/21
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Figure 16. Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature
and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
14. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection
circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used
in applications characterized by continuous operation or transitioning of the protection circuit.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
18/21
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Ordering Information
B
M
2
P
0
x
6
1
-
Z
MOSFET ON Resistor
1: 1.0 Ω (Typ)
3: 3.0 Ω (Typ)
Lineup
Orderable Part Number
MOSFET ON
Resistor
MOSFET
Withstand
Voltage (V)
Package
Part Number Marking
BM2P0161-Z
BM2P0361-Z
1.0 Ω (Typ)
3.0 Ω (Typ)
730
DIP7AK
BM2P0161
BM2P0361
Making Diagram
DIP7K (TOP VIEW)
Part Number Marking
LOT Number
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
19/21
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Physical Dimension and Packing Information
Package Name
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
DIP7K
20/21
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
BM2P0161-Z BM2P0361-Z
Revision History
Date
Revision
Changes
15.May.2018
001
New Release
20.Mar.2019
002
P1 Modify the size of package
13.Dec.2019
003
Revise Japanese datasheet
05.Jun.2020
004
07.Dec.2020
005
Modify P14 Figure15
P11 Change the Absolute Maximum Ratings
P15 Addition of the Application Circuit
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
21/21
TSZ02201-0F1F0A200310-1-2
07.Dec.2020 Rev.005
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
工商网监
湘ICP备2023018690号
