BM2P0161-Z

Datasheet AC/DC Converter PWM Type DC/DC Converter IC Built-in a Switching MOSFET BM2P0161-Z BM2P0361-Z General Description Key Specification The PWM type DC/DC converter for AC/DC provides an optimal system for all products that require an electrical outlet. BM2P0161-Z and BM2P0361-Z support both isolated and non-isolated devices, enabling simpler design of various types of low power consumption electrical converters. The built-in 730 V starter circuit contributes to low-power consumption. Power supply can be designed flexibly by connecting current sensing resistor for the switching externally. Current is restricted in each cycle and excellent performance is demonstrated in bandwidth and transient response since current mode control is utilized. The switching frequency is 65 kHz. At light load, the switching frequency is reduced and high efficiency is achieved. A frequency hopping function that contributes to low EMI is also included on chip. Design can be easily implemented because includes a 730 V switching MOSFET. ◼ Operating Power Supply Voltage Range: VCC: 8.9 V to 26.0 V DRAIN: 730 V(Max) ◼ Circuit Current (ON)1: BM2P0161-Z: 0.90 mA(Typ) BM2P0361-Z: 0.65 mA(Typ) ◼ Circuit Current (ON)2: 0.30 mA(Typ) ◼ Oscillation Frequency1: 65 kHz(Typ) ◼ Operating Ambient Temperature: -40 °C to +105 °C ◼ MOSFET ON Resistance: BM2P0161-Z: 1.0 Ω(Typ) BM2P0361-Z: 3.0 Ω(Typ) Package W (Typ) x D (Typ) x H (Max) 9.27 mm x 6.35 mm x 8.63 mm pitch 2.54 mm DIP7K Feature PWM Frequency: 65 kHz PWM Current Mode Control Built-in Frequency Hopping Function Burst Operation When Load is Light Frequency Reduction Function Built-in 730 V Starter Circuit Built-in 730 V Switching MOSFET VCC Pin Under-Voltage Protection VCC Pin Over-Voltage Protection SOURCE Pin Open Protection SOURCE Pin Short Protection SOURCE Pin Leading Edge Blanking Function Per-Cycle Over-Current Protection Circuit Over Current Protection AC Voltage Compensation Circuit ◼ Soft Start ◼ Secondary Over-Current Protection Circuit ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ Application For AC Adapters, TV and Household Appliances (Vacuum Cleaners, Humidifiers, Air Cleaners, Air Conditioners, IH Cooking Heaters, Rice Cookers, etc.) Typical Application Circuit + AC85V to AC265V FUSE Filter Diode Bridge - 〇Product structure : Silicon monolithic integrated circuit www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 DRAIN DRAIN SOURCE FADJ VCC GND FB ERROR AMP 〇This product has no designed protection against radioactive rays. 1/21 TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Pin Configuration TOP VIEW 6 5 FB 7 GND 4 VCC FADJ 3 DRAIN SOURCE 2 DRAIN 1 Pin Description Pin No. Pin Name I/O 1 2 3 4 5 6 7 SOURCE FADJ GND FB VCC DRAIN DRAIN I/O I I/O I I I/O I/O www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Function MOSFET SOURCE pin Burst frequency setting pin GND pin Feedback signal input pin Power supply input pin MOSFET DRAIN pin MOSFET DRAIN pin 2/21 ESD Diode VCC GND ○ ○ ○ ○ ○ ○ ○ ○ - TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Block Diagram VH VOUT FUSE AC Diode Bridge Filter VCC DRAIN 5 6.7 VCC UVLO + - 13.5V / 8.2V VCC OVP Starter 4.0V Line Reg 100µs Filter + - 12V Clamp Circuit 27.5V 10µA Internal Block FADJ 2 Burst Frequency Control S PWM Control + Burst Control DR IVER R Q 4.0V 4.0V 30k FB 4 OLP + 128ms/ 512ms Timer 1M Current Limiter Burst Comparator Leading Edge Blanking (Typ=250ns) + - 1 SOURCE + Rs Soft Start PWM Comparator - AC Voltage compensation MAX DUTY + + OSC (65kHz) 3 Frequency Hopping GND Slo pe Co mpen sation Feedback With Isolation www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/21 TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Description of Blocks 1. Start Circuit (DRAIN: Pin 6,7) These ICs have a built-in start circuit. It enables low standby mode electricity and high speed start. After start up, consumption power is determined by idling current I START3 only. Reference values of starting time are shown in Figure 3. When CVCC=10 µF it can start in less than 0.1 s. FUSE Diode Bridge AC DRAIN Starter SW1 VCC Cvcc VCCUVLO Figure 1. Block Diagram of Start Circuit 1.0 0.9 IST ART2 Start Up Current [mA] 0.8 Start Time [s] 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 IST ART1 IST ART3 0 VSC 0 10V 5 10 15 20 25 30 35 40 45 50 CVCC[µF] VUVLO1 VCC Voltage [V] Figure 2. Start Up Current vs VCC Voltage Figure 3. Start Time vs CVCC * Start current flows from the DRAIN pin. e.g.) Consumption power of start circuit only when Vac=100 V 𝑷𝑽𝑯 = 𝟏𝟎𝟎𝑽 × √𝟐 × 𝟏𝟎𝝁𝑨 = 𝟏. 𝟒𝟏𝒎𝑾 e.g.) Consumption power of start circuit only when Vac=240 V 𝑷𝑽𝑯 = 𝟐𝟒𝟎𝑽 × √𝟐 × 𝟏𝟎𝝁𝑨 = 𝟑. 𝟑𝟗𝒎𝑾 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/21 TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Description of Blocks - continued 2. Start Sequences Start sequences are shown in Figure 4. See the sections below for detailed descriptions. VH (Input Voltage) VUVLO1 VCHG2 VUVLO2 VCC VFOLP1A Internal REF Pull Up Within 128ms Within 128ms Within 128ms FB Output Voltage Over Load Normal Load Light Load Output Current Burst mode Switching stop Switching A BC D E F GH I J Figure 4. Start Sequences Timing Chart A: B: Input voltage VH is applied. This IC starts operating when VCC>VUVLO1. Switching function starts when other protection functions are judged as normal. Until the secondary output voltage becomes constant value or more from startup, the VCC pin consumption current causes the VCC voltage to drop. As a result, IC should be set to VCC>VUVLO2 until switching starts. C: With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current. D: When the switching operation starts, VOUT rises. After a switching operating start, set the rated voltage within the tFOLP1 period. E: When there is a light load, it makes FB voltageVFOLP1A, it overloads. G: When the FB pin voltage>VFOLP1A keeps above tFOLP1, overcurrent protection is caused between tFOLP2 period, and switching stops. If the FB pin voltageVOVP1, tLATCH(100 μs Typ) continues, switching is stopped by the VCC OVP function. VCCVUVLO1, VCC UVLO function releases, VCC charge function stops, DC/DC operation starts. Because output voltage is low, the VCC voltage drops at the start time. VCCVCHG2, VCC recharge function stops. VCCVCHG2, VCC recharge function stops. After the output voltage is finished rising, VCC is charged by the auxiliary winding, and the VCC pin stabilizes. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/21 TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Description of Blocks – continued 4. DC/DC Driver These ICs have a current mode PWM control. An internal oscillator sets a fixed switching frequency (65 kHz Typ). It has a switching frequency hopping function, which causes the switching frequency to fluctuate as shown in Figure 7 below. The fluctuation cycle is 125 Hz.(Typ) SwitchingFrequency [kHz] 500μs 69 68 67 66 65 64 63 62 61 125 Hz(8ms) Time Figure 7. Frequency Hopping Function Maximum duty cycle is fixed at 75 % and minimum ON time is fixed at 400 ns. In current mode control, sub-harmonic oscillation may occur when the duty cycle exceeds 50 %. As a countermeasure, this IC has built-in slope compensation circuits. These ICs have built-in burst mode and frequency reduction circuits to achieve lower power consumption when the load is light. The FB pin is pulled up to an internal power supply by RFB. The FB pin voltage is changed by secondary output voltage (secondary load power). Monitor the FB pin voltage and change a switching operation state. Figure 8 shows the FB voltage, and the DC/DC switching frequency operation. mode1: Burst operation. mode2: Frequency reduction operation. (max frequency is reduced) mode3: Fixed frequency operation. (operates at max frequency) mode4: Overload operation. (stops the pulse operation, sampling operation) Switching Frequency [kHz] Y mode2 mode1 mode3 mode4 65kHz 25kHz Pulse OFF X 0.30V 1.25V 2.00V 2.80V FB [V] Figure 8. Switching Operation State Changes by FB Pin Voltage www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/21 TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z 4. DC/DC Driver – continued (1) Burst Frequency Setting The frequency can be fixed by adding capacitance to the FADJ pin. This can reduce the burst sounds. The characteristics of the capacitor CFADJ connected to the FADJ pin and frequency fBST is shown in the Figure 10. Frequency [kHz] Burst Mode Frequency [kHz] Frequency Fixed Frequency Reduction Mode Mode 65kHz Burst Mode Frequency Fixed Frequency Reduction Mode Mode 65kHz Switching frequency Switching frequency 25kHz 25kHz [Area of sound] [Area of sound] FADJ Burst frequency Burst frequency Output Power[W] Output Power[W] Figure 9-2. setting fBST [kHz] Figure 9-1. No setting CFADJ [pF] Figure 10. fBST vs CFADJ www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/21 TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Description of Blocks – continued 5. Over Current Limiter These ICs have a built-in over current limiter per switching cycle. If the SOURCE pin exceeds a certain voltage, switching stops. It also has a built-in AC voltage compensation function. This function is a compensation function to increase the over current limiter level by AC voltage compensation function time. Shown in Figure11,12,13. 65kHz(15.3µs) 65kHz(15.3µs) ON ON [DC/DC] @AC100V [DC/DC] @AC100V OFF OFF OFF ON ON [DC/DC] @AC240V OFF OFF [DC/DC] @AC100V OFF OFF OFF Ipeak(AC)@Vin=240V Ipeak(AC)@Vin=240V Ipeak(AC)@Vin=100V Ipeak(AC)@Vin=100V Ipeak(DC)= included conpensation tDELAY tDELAY Ipeak(DC)＝Constant tDELAY Primary Peak Current Primary Peak Current Figure 11. No AC Voltage Compensation Function tDELAY Figure 12. Built-in AC Compensation Voltage Primary peak current is calculated using the formula below. 𝑰𝒑𝒆𝒂𝒌 = 𝑽𝑺𝑶𝑼𝑹𝑪𝑬 𝑽𝒅𝒄 + × 𝒕𝒅𝒆𝒍𝒂𝒚 𝑹𝒔 𝑳𝒑 Where: 𝑽𝑺𝑶𝑼𝑹𝑪𝑬 is the over current limiter voltage (internal). 𝑹𝒔 is the current detection resistance. 𝑽𝒅𝒄 is the input DC voltage. 𝑳𝒑 is the primary inductance. 𝒕𝒅𝒆𝒍𝒂𝒚 is the delay time after detection of over current limiter. Y CS Limitter[V] 0.704V +20mV/µs 0.552V 0.400V X 0.0 7.6µs 15.3µs Time [µs] Figure 13. Over Current Limiter Voltage www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/21 TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Description of Blocks – continued 6. L. E. B. Blanking Period When the MOSFET driver is turned ON, surge current flows through each capacitor component and drive current is generated. Therefore, when the SOURCE pin voltage rises temporarily, detection errors may occur in the over current limiter circuit. To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for 250 ns by the on-chip LEB (Leading Edge Blanking) function. 7. SOURCE Pin Short Protection Function When the SOURCE pin is shorted, excessive heat may destroy the IC. To prevent it from being damaged, these ICs have a built-in short protection function. 8. SOURCE Pin Open Protection When the SOURCE pin becomes OPEN, excessive heat by noise may destroy the IC. To prevent it from being damaged, these ICs have a built-in OPEN protection circuit (auto recovery protection). 9. Output Over Load Protection Function (FB OLP Comparator) The output overload protection function monitors the secondary output load status at the FB pin and stops switching whenever overload occurs. When there is an overload, the output voltage is reduced and current no longer flows to the photo coupler, so the FB pin voltage rises. When the FB pin voltage >VFOLP1A continuously for the period tFOLP1, it is judged as an overload and switching stops. When the FB pin > VFOLP1A, the voltage goes lower than VFOLP1B during the period tFOLP1, the overload protection timer is reset. The switching operation is performed during this period tFOLP1. At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of VFOLP1A or above. Therefore, at startup please set startup time within tFOLP1 so that the FB voltage becomes VFOLP1B or less. Recovery is after the period tFOLP2, from the detection of FBOLP. Absolute Maximum Ratings (Ta=25 °C) Parameter Symbol Rating Unit Maximum Applied Voltage 1 VMAX1 -0.3 to +32.0 V VCC Maximum Applied Voltage 2 VMAX2 -0.3 to +6.5 V SOURCE, FB, FADJ Maximum Applied Voltage 3 VMAX3 650 V DRAIN 730 V DRAIN(tpulse < 10 μs) (Note 1) PW=10 μs, Duty cycle=1 % (BM2P0161-Z) PW=10 μs, Duty cycle=1 % (BM2P0361-Z) Drain Current Pulse IDP 12 A Drain Current Pulse IDP 4 A Power Dissipation Pd 1.00 W Tjmax 150 °C Tstg -55 to +150 °C Maximum Junction Temperature Storage Temperature Range Conditions (Note 2) Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) Duty is less than 1 %. (Note 2) When mounted (on 74.2 mm x 74.2 mm, 1.6 mm thick, glass epoxy on single-layer substrate). Reduce to 8 mW/°C when Ta=25 °C or above. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/21 TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Thermal Loss The thermal design should set operation for the following conditions. 1. The ambient temperature Ta must be 105 °C or less. 2. The IC’s loss must be within the power dissipation Pd. The thermal abatement characteristics are as follows. (PCB: 74.2 mm x 74.2mm x 1.6 mm, mounted on glass epoxy on single-layer substrate) 1.4 1.2 1.0 Pd[W ] 0.8 0.6 0.4 0.2 0.0 0 25 50 75 100 125 150 Ta[℃] Figure 14. DIP7K Thermal Abatement Characteristics Recommended Operating Conditions Parameter Symbol Power Supply Voltage Range 1 VCC Power Supply Voltage Range 2 VDRAIN Operating Temperature Topr Rating Unit Conditions Min Typ Max 8.9 - 26.0 V VCC pin voltage - - 650 V DRAIN pin voltage - - 730 V DRAIN(tpulse < 10 μs) (Note 1) -40 - +105 °C (Note 1) Duty is less than 1 % Electrical Characteristics (unless otherwise noted, Ta=25 °C, VCC=15 V) Parameter Symbol Rating Unit Min Typ Max 650 - - V 730 - - V IDSS - - 100 μA On Resistance RDS(ON) - 1.0 1.4 Ω On Resistance RDS(ON) - 3.0 3.6 Ω Conditions [MOSFET Block] Between Drain and Source Voltage Drain Leak Current www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 V(BR)DDS 12/21 ID=1 mA / VGS=0 V ID = 1 mA, VGS = 0 V tpulse < 10 μs VDS=650 V / VGS=0 V ID=0.25 A / VGS=10 V (BM2P0161-Z) ID=0.25 A / VGS=10 V (BM2P0361-Z) TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Electrical Characteristics – continued Parameter Symbol Min Specifications Typ Max Unit Conditions [Circuit Current] Circuit Current (ON) 1 ION1 - 900 1450 μA Circuit Current (ON) 1 ION1 - 650 1050 μA Circuit Current (ON) 2 ION2 150 300 450 μA VFB=2.0 V (at pulse operation) (BM2P0161-Z) VFB=2.0 V (at pulse operation) (BM2P0361-Z) VFB=0.3 V VCC UVLO Voltage 1 VUVLO1 12.50 13.50 14.50 V VCC rise VCC UVLO Voltage 2 VUVLO2 7.50 8.20 8.90 V VCC fall VCC UVLO Hysteresis VUVLO3 - 5.30 - V VUVLO3=VUVLO1-VUVLO2 VCC OVP Voltage 1 VOVP1 26.0 27.5 29.0 V VCC rise VCC OVP Voltage 2 VOVP2 22.0 23.5 25.0 V VCC fall VCC OVP Hysteresis VOVP3 - 4.0 - V VOVP3=VOVP1-VOVP2 VCC Recharge Start Voltage VCHG1 7.70 8.70 9.70 V VCC Recharge Stop Voltage VCHG2 12.00 13.00 14.00 V Latch Mask Time tLATCH 50 100 150 μs Thermal Shutdown Temperature 1 TSD1 120 145 170 °C Control IC, temperature rise Thermal Shutdown Temperature 2 TSD2 90 115 140 °C Control IC, temperature fall Oscillation Frequency 1 fSW1 60 65 70 kHz VFB=2.00 V Oscillation Frequency 2 fSW2 20 25 30 kHz VFB=0.30 V Frequency Hopping Width 1 fDEL1 - 4.0 - kHz VFB=2.0 V fCH 75 125 175 Hz FADJ Source Current IBST 0.80 1.00 1.20 μA FADJ Comparator Voltage VBST 1.13 1.20 1.27 V FADJ Max Burst Frequency fBST - 0.833 - kHz Soft Start Time 1 tSS1 0.30 0.50 0.70 ms Soft Start Time 2 tSS2 0.60 1.00 1.40 ms Soft Start Time 3 tSS3 1.20 2.00 2.80 ms Soft Start Time 4 tSS4 4.80 8.00 11.20 ms DMAX 68.0 75.0 82.0 % Minimum ON Time tMIN 150 400 650 ns FB Pin Pull-Up Resistance RFB 23 30 37 kΩ ΔFB / ΔSOURCE Gain Gain 3.00 4.00 7.00 V/V FB Burst Voltage 1 VBST1 0.220 0.280 0.340 V FB fall FB Burst Voltage 2 VBST2 0.260 0.320 0.380 V FB rise FB Burst Hysteresis FB Voltage of Starting Frequency Reduction VBST3 - 0.040 - V VBST3=VBST2-VBST1 VDLT 1.100 1.250 1.400 V FB OLP Voltage 1a VFOLP1A 2.60 2.80 3.00 V FB OLP Voltage 1b VFOLP1B 2.40 2.60 2.80 V FB OLP ON Detect Timer tFOLP1 80 128 176 ms FB OLP OFF Timer tFOLP2 332 512 692 ms [VCC Protection Function] [PWM Type DC/DC Driver Block] Hopping Fluctuation Frequency Maximum Duty www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/21 FADJ=0.0 V CFADJ=1000 pF Overload is detected (FB rise) Overload is detected (FB fall) TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Electrical Characteristics – continued Parameter [Over Current Detection Block] Over-Current Detection Voltage Over-Current Detection Voltage SS1 Over-Current Detection Voltage SS2 Symbol VSOURCE Min Specifications Typ Max Unit Conditions VSOURCE_SS1 0.375 0.050 0.400 0.100 0.425 0.150 V V tON=0 μs 0 ms to tSS1 ms VSOURCE_SS2 0.080 0.150 0.220 V tSS1 ms to tSS2 ms Over-Current Detection Voltage SS3 VSOURCE_SS3 0.130 0.200 0.270 V tSS2 ms to tSS3 ms Over-Current Detection Voltage SS4 VSOURCE_SS4 0.230 0.300 0.370 V tSS3 ms to tSS4 ms Leading Edge Blanking Time Over Current Detection AC Voltage Compensation Factor SOURCE Pin Short Protection Voltage SOURCE Pin Short Protection Time tLEB 120 250 380 ns (Note 2) KSOURCE 12 20 28 mV/μs VSOURCESHT 0.020 0.050 0.080 V tSOURCESHT 1.80 3.00 4.20 μs Start Current 1 ISTART1 0.100 0.500 1.000 mA VCC=0 V Start Current 2 ISTART2 1.000 3.000 6.000 mA OFF Current ISTART3 - 10 20 μA VCC=10 V Inflow current from the DRAIN pin after UVLO is released and when MOSFET is OFF VSC 0.800 1.500 2.100 V [Circuit Current] Start Current Switching Voltage (Note 2) Not 100 % tested. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/21 TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Application Examples Show a flyback circuitry example in Figure 15. Be careful with the DRAIN voltage because high voltage is produced by ringing in turn OFF. With this IC, It become able to work to 730V. + AC85V to AC265V FUSE Filter Diode Bridge - DRAIN DRAIN SOURCE FADJ VCC GND FB ERROR AMP Figure 15. Flyback Application Ciucit 730V 650V DRAIN 0V tpulse < 10 μs(Duty < 1%) Figure 16. Drain Pin Ringing Waveform www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/21 TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z I/O Equivalence Circuit SOURCE 1 3 FB 4 GND FADJ SOURCE VCC Internal Reg VCC VREF VREF 5 FADJ 2 - - 6 R FB FB GND DRAIN 7 DRAIN DRAIN DRAIN VCC - Internal Circuit Internal Circuit Internal MOSFET Internal MOSFET SOURCE www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/21 SOURCE TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Interpin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/21 TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Operational Notes – continued 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Figure 16. Example of monolithic IC structure 12. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 13. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). 14. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 15. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/21 TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Ordering Information B M 2 P 0 x 6 1 - Z MOSFET ON Resistor 1: 1.0 Ω (Typ) 3: 3.0 Ω (Typ) Lineup Orderable Part Number MOSFET ON Resistor MOSFET Withstand Voltage (V) Package Part Number Marking BM2P0161-Z BM2P0361-Z 1.0 Ω (Typ) 3.0 Ω (Typ) 730 DIP7AK BM2P0161 BM2P0361 Making Diagram DIP7K (TOP VIEW) Part Number Marking LOT Number www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/21 TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Physical Dimension and Packing Information Package Name www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 DIP7K 20/21 TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 BM2P0161-Z BM2P0361-Z Revision History Date Revision Changes 15.May.2018 001 New Release 20.Mar.2019 002 P1 Modify the size of package 13.Dec.2019 003 Revise Japanese datasheet 05.Jun.2020 004 07.Dec.2020 005 Modify P14 Figure15 P11 Change the Absolute Maximum Ratings P15 Addition of the Application Circuit www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/21 TSZ02201-0F1F0A200310-1-2 07.Dec.2020 Rev.005 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001