Datasheet
AC/DC Converter
PWM Type DC/DC Converter IC
with Integrated Switching MOSFET
BM2P0361K-Z
General Description
Key Specifications
The PWM type DC/DC converter for AC/DC provides an
optimal system for all products that require an electrical
outlet. This IC supports both isolated and non-isolated
devices and enables simpler designs of various types of
low power consumption electrical converters.
The built-in 800 V startup circuit contributes to low power
consumption.
Power supplies can be designed flexibly by connecting a
current detection resistor for the switching externally.
Current is restricted in each cycle and excellent
performances are demonstrated in a bandwidth and
transient response since a current mode control is
utilized. The switching frequency is 65 kHz by a fixed
method. At light load, the frequency is reduced, and high
efficiency is achieved. A built-in frequency hopping
function also contributes to low EMI. A built-in 800 V
switching MOSFET makes designs easy.
◼ Operating Power Supply Voltage Range
VCC Pin:
8.9 V to 26.0 V
DRAIN Pin:
800 V (Max)
◼ Current at Switching Operation:
0.70 mA (Typ)
◼ Current at Burst Operation:
0.30 mA (Typ)
◼ Switching Frequency:
65 kHz (Typ)
◼ Operating Temperature Range:
-40 °C to +105 °C
◼ MOSFET ON Resistance:
3.5 Ω (Typ)
Package
DIP7K
W (Typ) x D (Typ) x H (Max)
9.27 mm x 6.35 mm x 8.63 mm
Pitch: 2.54 mm
Features
PWM Current Mode Method
Frequency Hopping Function
Burst Operation at Light Load
Frequency Reduction Function
Built-in 800 V Startup Circuit
Built-in 800 V Switching MOSFET
VCC UVLO (Under Voltage Lockout)
VCC OVP (Over Voltage Protection)
Soft Start Function
FB OLP (Overload Protection)
Over Current Detection Function per Cycle
Over Current Detection AC Voltage Compensation
Function
◼ SOURCE Pin Open Protection Function
◼ SOURCE Pin Short Protection Function
◼ SOURCE Pin Leading Edge Blanking Function
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
Applications
AC Adapters, Various Household Appliances (Such as
Vacuum Cleaners, Humidifiers, Air Cleaners, Air
Conditioners, IH Cooking Heaters and Rice Cookers)
Typical Application Circuit
Fuse
AC
Input
Filter
Diode
Bridge
DRAIN
SOURCE FADJ
〇Product structure : Silicon integrated circuit
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TSZ22111 • 14 • 001
Error
AMP
VCC
DRAIN
GND
FB
〇This product has no designed protection against radioactive rays.
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Pin Configuration
(TOP VIEW)
SOURCE
1
7
DRAIN
FADJ
2
6
DRAIN
GND
3
FB
4
5
VCC
Pin Descriptions
Pin No.
Pin Name
I/O
1
2
3
4
5
6
7
SOURCE
FADJ
GND
FB
VCC
DRAIN
DRAIN
I/O
I
I/O
I
I
I/O
I/O
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Function
MOSFET SOURCE pin
Burst frequency setting pin
GND pin
Feedback signal input pin
Power supply input pin
MOSFET DRAIN pin
MOSFET DRAIN pin
2/26
ESD Diode
VCC
GND
○
○
○
○
○
○
○
○
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Block Diagram
Fuse
AC
Input
Diode
Bridge
Filter
5
VCC
6, 7
DRAIN
VCC UVLO
+
-
100 μs
Filter
+
-
Startup
Circuit
4.0 V
Line Reg
Clamp
Circuit
VCC OVP
Internal Block
FADJ
2
Burst
Frequency
Control
S
R
Q
Driver
CFADJ
PWM Control
+
Burst Control
Internal Reg.
Internal Reg.
OLP
FB
4
+
OLP
Timer
Burst
Comparator
Current
Detection
+
-
Leading Edge
Blanking
1
+
Rs
Soft Start
PWM
Comparator
+
AC Input
Compensation
Maximum
Duty
3
+
SOURCE
OSC
GND
Frequency
Hopping
Slope
Compensation
FeedBack
With
Isolation
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Description of Blocks
1
Startup Circuit
This IC has a built-in startup circuit. It enables low standby electricity and high-speed startup.
The current consumption after startup is only OFF current ISTART3.
Reference values of startup time are shown in Figure 3. When CVCC = 10 µF, it can start in 0.1 s or less.
Fuse
AC
Input
Diode
Bridge
Filter
DRAIN
Startup
Circuit
SW1
VCC
CVCC
+
VCC UVLO
Figure 1. Block Diagram of Startup Circuit
Startup Current
0.6
Startup Time [s]
ISTART2
0.5
0.4
0.3
0.2
0.1
0.0
0
ISTART1
ISTART3
5
10
15
20
25
30
35
40
45
50
CVCC [µF]
0 VSC
10 V
VUVLO1
VCC Pin
Voltage
Figure 2. Startup Current vs VCC Pin Voltage
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Figure 3. Startup Time vs CVCC
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Description of Blocks - continued
2
Startup Sequences
Startup sequences are shown in Figure 4. See the sections below for detailed descriptions.
Input Voltage
VH
VCC Pin
Voltage
VUVL O1
VCH G2
VCH G1
VUVL O2
tFOLP2
tFOLP1
FB Pin
Voltage
tFOLP1
VFOL P1
VFOL P2
VBST2
VBST1
tFOLP1
Output Voltage
Normal
Load
Overload
Output Current
ON
Light
Load
tFOLP1
Burst
mode
ON
Overload
tFOLP2
tFOLP1
ON
Switching
tFOLP2
A
B
C
D
E
F
G
H
I
J
Figure 4. Startup Sequences Timing Chart
A:
B:
The input voltage VH is applied and the VCC pin voltage rises.
If the VCC pin voltage becomes more than VUVLO1, the IC starts to operate. And if the IC judges the other
protection functions as normal condition, it starts the switching operation. The soft start function limits the over
current detection voltage to prevent any excessive voltage or current rising. When the switching operation starts,
the output voltage rises. Until the output voltage becomes a constant value or more from startup, the VCC pin
voltage drops by the VCC pin current consumption. Also, after the switching operation starts, it is necessary that
the output voltage is set to become the rated voltage within tFOLP1.
C: The output voltage becomes constant.
D: At light load, the burst operation starts to reduce the power consumption if the FB pin voltage becomes less
than VBST1.
E: When the FB pin voltage becomes more than VFOLP1, the IC starts the overload operation.
F: When the condition that the FB pin voltage more than VFOLP1 continues for tFOLP1, the switching stops for
tFOLP2 period by FB OLP. (If the FB pin voltage becomes less than VFOLP2, FB OLP detection timer tFOLP1 is
reset.)
G: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates.
H: When the VCC pin voltage becomes more than VCHG2, the VCC recharge function stops operating.
I: After tFOLP2 period from F, the switching operation starts.
J: Same as F.
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Description of Blocks – continued
3
VCC Pin Protection Function
This IC has the internal protection functions at the VCC pin as shown below.
3.1
VCC UVLO/VCC OVP
VCC UVLO and VCC OVP are the auto recovery type comparator having voltage hysteresis.
3.2
VCC Recharge Function
If the VCC pin voltage drops to less than VCHG1 after once the VCC pin becomes more than VUVLO1 and the IC
starts to operate, the VCC recharge function operates. At this time, the VCC pin is recharged from the DRAIN pin
through the startup circuit. When the VCC pin voltage becomes more than VCHG2, this recharge is stopped.
Input Voltage
VH
VOVP1
VOVP2
VCC Pin
Voltage VUVLO1
tCOMP
VCHG2
VCHG1
VUVLO2
Output Voltage
ON
ON
VCC UVLO
ON
VCC OVP
ON
VCC Recharge
Function
ON
ON
Switching
A
B
C
DE F
G
HI
J K
Figure 5. VCC UVLO/VCC OVP/VCC Recharge Function Timing Chart
A:
B:
The input voltage VH is applied and the VCC pin voltage rises.
When the VCC pin voltage becomes more than VUVLO1, the IC starts operating. And if the IC judges the other
protection functions as normal condition, it starts switching operation. The soft start function limits the over
current detection voltage value to prevent any excessive voltage or current rising. When the switching
operation starts, the output voltage rises.
C: The output voltage finishes startup. The VCC pin voltage is stabilized by being recharged from the auxiliary
winding.
D: When the VCC pin voltage becomes more than VOVP1, VCC OVP timer operates.
E: When the condition that the VCC pin voltage is more than V OVP1 lasts for tCOMP, VCC OVP operates and
stops switching operation.
F: When the VCC pin voltage becomes less than VOVP2, VCC OVP is released and the switching operation
restarts.
G: When the input voltage VH becomes OPEN, the VCC pin voltage drops.
H: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates.
I: When the VCC pin voltage becomes more than VCHG2, the VCC recharge function stops its operation.
J: When the VCC pin voltage becomes less than V CHG1, the VCC recharge function operates. However, the
current supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low
input voltage VH.
K: When the VCC pin voltage becomes less than VUVLO2, VCC UVLO operates.
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3
VCC Pin Protection Function – continued
3.3
4
TSD (Thermal Shutdown)
TSD stops the switching operation if the junction temperature becomes more than TSD1. When the junction
temperature becomes less than TSD2, the IC restarts the switching operation.
DC/DC Driver Block
This IC performs a current mode PWM control and it has the following characteristics.
◼
The switching frequency is fixed at fSW1 by an internal oscillator. It has a built-in frequency hopping function and it
makes the switching frequency fluctuate as shown in Figure 6. The hopping fluctuation cycle is fCH.
◼
Maximum duty is fixed at DMAX and minimum ON time is fixed at tMIN.
◼
In the current mode control, a sub-harmonic oscillation may occur when the duty cycle exceeds 50 %. As a
countermeasure, this IC has a built-in slope compensation circuit.
◼
It has a built-in burst mode and frequency reduction circuits to achieve lower power consumption at light load.
◼
The FB pin is pulled up to the internal power supply by RFB.
◼
The FB pin voltage is changed by the secondary output voltage. This IC monitors this and changes a switching
operation status.
Switching Frequency
[kHz]
500 μs(Note 1)
69
68
67
66
65
64
63
62
61
fCH
Time
(Note 1) This is the value calculated as fCH is typical valu e.
Figure 6. Frequency Hopping Function
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4
DC/DC Driver Block – continued
4.1
Frequency Circuit and Setting Burst Frequency
This IC fixes the burst frequency by connecting a capacitor to the FADJ pin and it reduces the sound noise at the
burst operation. The correlation between the capacitor connected to the FADJ pin and the FADJ pin maximum
burst frequency is shown in the Figure 9.
mode 1: Burst Operation
mode 2: Frequency Modulation Operation
mode 3: Fixed Frequency Operation
mode 4: Overload Operation
(The intermittent operation starts.)
(It modulates the frequency.)
(It operates in the maximum frequency.)
(The intermittent operation starts.)
Switching
Frequency
Switching
Frequency
Output Power [W]
mode 1
mode 3
mode 2
Output Power [W]
mode 1
mode 4
fSW1
mode 3
mode 2
mode 4
fSW1
Switching Frequency
Switching Frequency
Pulse off
Pulse off
fSW2
fSW2
Audible Region
Audible Region
Burst Frequency
VBST1
VBST2
VDLT
Burst Frequency
VFOLP1
VFOLP2
VBST1
VBST2
FB Pin
Voltage
Figure 7. Without Connecting the Capacitor to the FADJ Pin
VDLT
VFOLP1
VFOLP2
FB Pin
Voltage
Figure 8. Connect the Capacitor to the FADJ Pin
FADJ Pin Maximum Burst Frequency:
fBST [Hz]
100000
10000
1000
100
10
50
500
5000
Capacitor Connected to the FADJ Pin: CFADJ [pF]
Figure 9. FADJ Pin Maximum Burst Frequency vs Capacitor Connected to the FADF Pin
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4
DC/DC Driver Block – continued
4.2
Soft Start Function
At startup, this function controls the over current detection voltage in order to prevent any excessive voltage or
current rising. This IC enables the soft start operation by changing the over current detection voltage with time.
Over Current
Detection Voltage
SS1
SS2
SS3
SS4
VSOURCE
VSOURCE4
VSOURCE3
VSOURCE2
VSOURCE1
tSS1
tSS2
tSS3
tSS4
Time
Figure 10. Soft Start Function
4.3.
FB OLP (Overload Protection)
FB OLP is the function that monitors the secondary output load status at the FB pin voltage and stops the
switching operation at the overload status.
At the overload status, the FB pin voltage rises because current does not flow to the photocoupler because of a
drop of the output voltage. When the condition that the FB pin voltage > VFOLP1 continues for longer than tFOLP1, it
is judged as the overload status and the switching operation stops. If the FB pin voltage falls to less than VFOLP2
within tFOLP1 from the status that the FB pin voltage > VFOLP1, FB OLP ON detection timer is reset.
At startup, the FB pin is pulled up to the IC’s internal voltage, so the operation starts from the voltage more than
VFOLP1. Therefore, it is necessary to set the startup time so that the FB pin voltage becomes less than VFOLP2
within tFOLP1.
Recovery from the detection of overload status is after tFOLP2.
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Description of Blocks – continued
5
Over Current Detection Block
5.1
Over Current Detection Function
This IC has a built-in over current detection function per switching cycle. If the SOURCE pin voltage becomes
VSOURCE (VSOURCE1 to VSOURCE4 in the case of SS1 to SS4) or more, the switching operation stops.
It also has a built-in over current detection AC voltage compensation function. This function makes IPEAK (DC)
increase with time.
fSW1
fSW1
ON
Switching
(AC100 V)
ON
Switching
(AC100 V)
OFF
OFF
ON
Switching
(AC240 V)
OFF
OFF
ON
Switching
(AC240 V)
OFF
OFF
OFF
OFF
IPEAK (AC)
VDC = 240 V
IPEAK (AC)
VDC = 240 V
VDC = 100 V
VDC = 100 V
IPEAK(DC)
compensated
constant
IPEAK (DC)
Primary
Peak Current
Primary
Peak Current
tDELAY
tDELAY
tDELAY
Figure 11. Without the AC Voltage Compensation Function
tDELAY
Figure 12. With the AC Voltage Compensation Function
Primary peak current entering overload mode is calculated by the following formula.
𝑰𝑷𝑬𝑨𝑲 =
𝑽𝑺𝑶𝑼𝑹𝑪𝑬 𝑽𝑫𝑪
+
× 𝒕𝑫𝑬𝑳𝑨𝒀
𝑹𝒔
𝑳𝒑
[A]
where:
𝐼𝑃𝐸𝐴𝐾 is the primary peak current.
𝑉𝑆𝑂𝑈𝑅𝐶𝐸 is the over current detection voltage inside the IC.
𝑅𝑠 is the current detection resistor.
𝑉𝐷𝐶 is the input DC voltage.
𝐿𝑝 is the primary transformer L value.
𝑡𝐷𝐸𝐿𝐴𝑌 is the delay time after the over current detection.
Over Current Detection
Voltage
+ KSOURCE
VSOURCE
Time
0
Figure 13. Over Current Detection Voltage
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5
6
Over Current Detection Block – continued
5.2
SOURCE Pin Leading Edge Blanking Function
Normally, when the MOSFET for driver is turned ON, surge current is generated at each capacitor component,
drive current and so on. At this time, detection errors may occur in the over current detection circuit because the
SOURCE pin voltage rises. To prevent these errors, Leading Edge Blanking function is built in this IC. This
function masks the SOURCE pin voltage for tLEB from the time the DRAIN pin voltage switches H to L.
5.3
SOURCE Pin Short Protection Function
When the SOURCE pin is shorted, excessive heat may destroy the IC.
To prevent this, this IC has a built-in short protection function (auto recovery).
5.4
SOURCE Pin Open Protection Function
When the SOURCE pin is opened, excessive heat by such as noise may destroy the IC.
To prevent this, this IC has a built-in open protection function (auto recovery).
Operation Mode of Protection Functions
The operation modes of each protection function are shown in Table 1.
Table 1. Operation Modes of Protection Functions
VCC UVLO
VCC OVP
TSD
FB OLP
Detection
Conditions
VCC pin voltage
< VUVLO2
(at voltage dropping)
VCC pin voltage
> VOVP1
(at voltage rising)
Junction temperature > TSD1
(at temperature rising)
FB pin voltage > VFOLP1
(at voltage rising)
Release
Conditions
VCC pin voltage
> VUVLO1
(at voltage rising)
VCC pin voltage
< VOVP2
(at voltage dropping)
Junction temperature < TSD2
(at temperature dropping)
or VCC UVLO detection
FB pin voltage < VFOLP2
(at voltage falling)
or
VCC UVLO detection
Detection
Timer
–
tCOMP
tCOMP
tFOLP1
Release
Timer
–
–
–
tFOLP2
Auto
Recovery
or
Latch
Auto recovery
Auto recovery
Auto recovery
Auto recovery
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Conditions
Maximum Applied Voltage 1
VMAX1
-0.3 to +32
V
VCC pin voltage
Maximum Applied Voltage 2
VMAX2
-0.3 to +6.5
V
SOURCE and FB and FADJ pins voltage
Maximum Applied Voltage 3
VMAX3
-0.3 to +800
V
DRAIN pin voltage
DRAIN Pin Current (Pulse)
IDP
4.8
A
PW = 10 μs, Duty cycle = 1 %
Power Dissipation
Pd
1.00
W
(Note 1)
Tjmax
150
°C
Tstg
-55 to +150
°C
Maximum Junction Temperature
Storage Temperature Range
Caution 1:
Caution 2:
(Note 1)
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
At mounted on a glass epoxy single layer PCB (74.2 mm x 74.2 mm, 1.6 mm). Derate by 8 mW/°C if the IC is used in the ambient temperature Ta
25 °C or above.
Thermal Dissipation
Make the thermal design so that the IC operates in the following conditions.
(Because the following temperature is guarantee value, it is necessary to consider margin.)
1. The ambient temperature Ta must be 105 °C or less.
2. The IC’s loss must be the power dissipation Pd or less.
The thermal abatement characteristic is as follows.
(At mounting on a glass epoxy single layer PCB which size is 74.2 mm x 74.2 mm x 1.6 mm)
1.5
Pd [W]
1.0
0.5
0.0
0
25
50
75
100
125
150
Ta [ºC]
Figure 14. DIP7K Thermal Dissipation Characteristic
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Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Operating Power Supply Voltage Range 1
VCC
8.9
-
26.0
V
VCC pin voltage
Operating Power Supply Voltage Range 2
VDRAIN
-
-
800
V
DRAIN pin voltage
Topr
-40
-
+105
°C
Parameter
Symbol
Min
Typ
Max
Unit
Voltage between DRAIN and SOURCE Pins
V(BR)DDS
800
-
-
V
ID = 1 mA, VGS = 0 V
IDSS
-
-
100
μA
VDS = 800 V, VGS = 0 V
RDS(ON)
-
3.5
4.2
Ω
ID = 1.5 A, VGS = 10 V
Symbol
Min
Typ
Max
Unit
Startup Current 1
ISTART1
0.100
0.500
1.000
mA
VCC pin voltage = 0 V
Startup Current 2
ISTART2
1.00
3.00
6.00
mA
OFF Current
ISTART3
-
10
20
μA
VCC pin voltage = 10 V
Inflow current from the
DRAIN pin after UVLO is
released (at MOSFET OFF)
VSC
0.800
1.500
2.100
V
Symbol
Min
Typ
Max
Unit
Current at Switching Operation
ION1
0.35
0.70
1.05
mA
Current at Burst Operation
ION2
0.20
0.30
0.45
mA
VCC UVLO Voltage 1
VUVLO1
12.50
13.50
14.50
V
At VCC pin voltage rising
VCC UVLO Voltage 2
VUVLO2
7.50
8.20
8.90
V
At VCC pin voltage falling
VCC UVLO Voltage Hysteresis
VUVLO3
-
5.30
-
V
VUVLO3 = VUVLO1 - VUVLO2
VCC OVP Voltage 1
VOVP1
26.0
27.5
29.0
V
At VCC pin voltage rising
VCC OVP Voltage 2
VOVP2
22.0
23.5
25.0
V
At VCC pin voltage falling
VOVP3 = VOVP1 - VOVP2
Operating Temperature
Conditions
Electrical Characteristics in MOSFET Part
(Unless otherwise noted, Ta = 25 °C, VCC = 15 V)
DRAIN Pin Leak Current
On Resistance
Conditions
Electrical Characteristics in Startup Circuit Part
(Unless otherwise noted, Ta = 25 °C, VCC = 15 V)
Parameter
Startup Current Switching Voltage
Conditions
Electrical Characteristics in Control IC Part
(Unless otherwise noted, Ta = 25 °C, VCC = 15 V)
Parameter
Conditions
Circuit Current
FB pin voltage = 2.0 V
(pulse operation)
FB pin voltage = 0.0 V
VCC Pin Protection Function
VCC OVP Voltage Hysteresis
VOVP3
-
4.0
-
V
VCC Recharge Start Voltage
VCHG1
7.70
8.70
9.70
V
VCC Recharge Stop Voltage
VCHG2
12.00
13.00
14.00
V
TSD Temperature 1
TSD1
120
145
170
°C
At temperature rising(Note 1)
TSD Temperature 2
TSD2
90
115
140
°C
At temperature falling(Note 1)
VCC OVP/TSD Timer
tCOMP
50
100
150
μs
(Note 1) Not 100 % tested.
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Electrical Characteristics in Control IC Part – continued
(Unless otherwise noted, Ta = 25 °C, VCC = 15 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Switching Frequency 1
fSW1
60
65
70
kHz
FB pin voltage = 2.00 V
Switching Frequency 2
fSW2
20
25
30
kHz
FB pin voltage = 0.30 V
Frequency Hopping Width
fDEL
-
4.0
-
kHz
FB pin voltage = 2.0 V
Hopping Fluctuation Cycle
fCH
75
125
175
Hz
FADJ Pin Current
IFADJ
0.80
1.00
1.20
μA
FADJ Pin Comparator Voltage
VFADJ
1.13
1.20
1.27
V
FADJ Pin Maximum Burst Frequency
fBST
-
0.833
-
kHz
Soft Start Time 1
tSS1
0.30
0.50
0.70
ms
Soft Start Time 2
tSS2
0.60
1.00
1.40
ms
Soft Start Time 3
tSS3
1.20
2.00
2.80
ms
Soft Start Time 4
tSS4
3.20
4.00
4.80
ms
DMAX
68.0
75.0
82.0
%
Minimum ON Time
tMIN
150
400
650
ns
FB Pin Pull-up Resistance
RFB
23
30
37
kΩ
DC/DC Driver Block
Maximum Duty
FADJ pin voltage = 0.0 V
CFADJ = 1000 pF
(Note 1)
ΔFB Pin/ΔSOURCE Pin Voltage Gain
Gain
3.00
4.00
7.00
V/V
FB Pin Burst Voltage 1
VBST1
0.220
0.280
0.340
V
At FB pin voltage falling
FB Pin Burst Voltage 2
VBST2
0.260
0.320
0.380
V
At FB pin voltage rising
FB Pin Burst Voltage Hysteresis
FB Pin Voltage
at Starting Frequency Reduction
VBST3
-
0.040
-
V
VBST3 = VBST2 - VBST1
VDLT
1.100
1.250
1.400
V
FB OLP Voltage 1
VFOLP1
2.60
2.80
3.00
V
FB OLP Voltage 2
VFOLP2
2.40
2.60
2.80
V
FB OLP ON Detection Timer
tFOLP1
80
128
176
ms
FB OLP OFF Timer
tFOLP2
332
512
692
ms
Over Current Detection Voltage
Over Current Detection Voltage 1
VSOURCE
VSOURCE1
0.375
0.050
0.400
0.100
0.425
0.150
V
V
tON = 0 μs
Over Current Detection Voltage 2
VSOURCE2
0.080
0.150
0.220
V
(Note 1) (Note 2)
Over Current Detection Voltage 3
VSOURCE3
0.130
0.200
0.270
V
(Note 1) (Note 2)
Over Current Detection Voltage 4
Over Current Detection
AC Voltage Compensation Factor
Leading Edge Blanking Time
SOURCE Pin
Short Protection Voltage
SOURCE Pin
Short Protection Time
VSOURCE4
0.230
0.300
0.370
V
(Note 1) (Note 2)
KSOURCE
12
20
28
mV/μs
tLEB
120
250
380
ns
VSOURCESHT
0.020
0.050
0.080
V
tSOURCESHT
1.80
3.00
4.20
μs
At overload detection
(at FB pin voltage rising)
At overload detection
(at FB pin voltage falling)
Over Current Detection Block
(Note 1) (Note 2)
(Note 1)
(Note 1) Not 100 % tested.
(Note 2) Refer to Figure 10.
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Typical Performance Curves
(Reference Data)
0.45
0.95
Current at Burst Operation: ION2 [mA]
Current at Switching Operation: ION1 [mA]
1.05
0.85
0.75
0.65
0.55
0.45
0.35
0.40
0.35
0.30
0.25
0.20
-40
-20
0
20 40 60 80
Temperature [°C]
100 120
-40
Figure 15. Current at Switching Operation vs Temperature
-20
0
20 40 60 80
Temperature [°C]
100 120
Figure 16. Current at Burst Operation vs Temperature
14.5
8.9
14.3
VCC UVLO Voltage 2: VUVLO2 [V]
VCC UVLO Voltage 1: VUVLO1 [V]
8.7
14.1
13.9
13.7
13.5
13.3
13.1
12.9
8.5
8.3
8.1
7.9
7.7
12.7
12.5
7.5
-40
-20
0
20 40 60 80
Temperature [°C]
100 120
-40
Figure 17. VCC UVLO Voltage 1 vs Temperature
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-20
0
20
40
60
80
Temperature [°C]
100 120
Figure 18. VCC UVLO Voltage 2 vs Temperature
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Typical Performance Curves – continued
(Reference Data)
29.0
5.7
28.5
5.6
VCC OVP Voltage 1: VOVP1 [V]
VCC UVLO Voltage Hysteresis: VUVLO3 [V]
5.8
5.5
5.4
5.3
5.2
5.1
5.0
27.5
27.0
26.5
4.9
4.8
26.0
-40
-20
0
20
40
60
80
Temperature [°C]
100 120
-40
Figure 19. VCC UVLO Voltage Hysteresis vs Temperature
-20
0
20 40 60 80
Temperature [°C]
100 120
Figure 20. VCC OVP Voltage 1 vs Temperature
4.5
VCC OVP Voltage Hysteresis: VOVP3 [V]
25.0
24.5
VCC OVP Voltage 2: VOVP2 [V]
28.0
24.0
23.5
23.0
22.5
22.0
4.4
4.3
4.2
4.1
4.0
3.9
3.8
3.7
3.6
3.5
-40
-20
0
20 40 60 80
Temperature [°C]
100 120
-40
Figure 21. VCC OVP Voltage 2 vs Temperature
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-20
0
20
40
60
80
Temperature [°C]
100 120
Figure 22. VCC OVP Voltage Hysteresis vs Temperature
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Typical Performance Curves – continued
9.7
14.0
9.5
13.8
VCC Recharge Stop Voltage: VCHG2 [V]
VCC Recharge Start Voltage: VCHG1 [V]
(Reference Data)
9.3
9.1
8.9
8.7
8.5
8.3
8.1
7.9
13.4
13.2
13.0
12.8
12.6
12.4
12.2
12.0
7.7
-40
-20
0
80
60
40
20
Temperature [°C]
-40
100 120
Figure 23. VCC Recharge Start Voltage vs Temperature
0
-20
20 40 60 80
Temperature [°C]
100 120
Figure 24. VCC Recharge Stop Voltage vs Temperature
70
30
69
29
Switching Frequency 2: fSW2 [kHz]
Switching Frequency 1: fSW1 [kHz]
13.6
68
67
66
65
64
63
62
28
27
26
25
24
23
22
21
61
20
60
-40
-20
0
80
60
40
20
Temperature [°C]
100
-40
120
Figure 25. Switching Frequency 1 vs Temperature
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-20
0
80
60
40
20
Temperature [°C]
100
120
Figure 26. Switching Frequency 2 vs Temperature
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Typical Performance Curves – continued
(Reference Data)
1.27
FADJ Pin Comparator Voltage: VFADJ [V]
1.20
FADJ Pin Current: IFADJ [μA]
1.15
1.10
1.05
1.00
0.95
0.90
0.85
0.80
1.23
1.21
1.19
1.17
1.15
1.13
-40
-20
0
20 40 60 80
Temperature [°C]
100 120
-40
Figure 27. FADJ Pin Current vs Temperature
-20
0
20 40 60 80
Temperature [°C]
100 120
Figure 28. FADJ Pin Comparator Voltage vs Temperature
82
0.34
FB Pin Burst Voltage 1: VBST1 [V]
80
Maximum Duty: DMAX [%]
1.25
78
76
74
72
70
68
0.32
0.30
0.28
0.26
0.24
0.22
-40
-20
0
20
40
60
80
Temperature [°C]
100
120
-40
Figure 29. Maximum Duty vs Temperature
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-20
0
20 40 60 80
Temperature [°C]
100 120
Figure 30. FB Pin Burst Voltage 1 vs Temperature
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Typical Performance Curves – continued
(Reference Data)
0.38
3.00
FB OLP Voltage 1: VFOLP1 [V]
FB Pin Burst Voltage 2: VBST2 [V]
2.95
0.36
0.34
0.32
0.30
2.90
2.85
2.80
2.75
2.70
0.28
2.65
0.26
2.60
-40
-20
0
20 40 60 80
Temperature [°C]
100 120
-40
Figure 31. FB Pin Burst Voltage 2 vs Temperature
0
20 40 60 80
Temperature [°C]
100 120
Figure 32. FB OLP Voltage 1 vs Temperature
180
700
170
650
160
FB OLP OFF Timer: tFOLP2 [ms]
FB OLP ON Detection Timer: tFOLP1 [ms]
-20
150
140
130
120
110
100
600
550
500
450
400
350
90
80
300
-40
-20
0
20 40 60 80
Temperature [°C]
100 120
-40
Figure 33. FB OLP ON Detection Timer vs Temperature
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-20
0
20 40 60 80
Temperature [°C]
100 120
Figure 34. FB OLP OFF Timer vs Temperature
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Typical Performance Curves – continued
0.425
1.0
0.420
0.9
0.415
Startup Current 1: ISTART1 [mA]
Over Current Detection Voltage: VSOURCE [V]
(Reference Data)
0.410
0.405
0.400
0.395
0.390
0.385
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.380
0.375
0.1
-40
-20
0
20 40 60 80
Temperature [°C]
100 120
-40
Figure 35. Over Current Detection Voltage vs Temperature
-20
0
20
40
60
80
Temperature [°C]
100 120
Figure 36. Startup Current 1 vs Temperature
6.0
Startup Current 2: ISTART2 [mA]
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
-40
-20
0
20
40
60
80
Temperature [°C]
100 120
Figure 37. Startup Current 2 vs Temperature
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BM2P0361K-Z
I/O Equivalence Circuit
SOURCE
1
2
VREF
3
4
GND
GND
FADJ
VCC
FB
VREF
VREF
SOURCE
5
FADJ
R FB
FB
-
-
6
DRAIN
7
DRAIN
DRAIN
Internal
Circuit
VCC
DRAIN
Internal
Circuit
Internal MOSFET
Internal MOSFET
SOURCE
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all
power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Figure 38. Example of IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not
be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BM2P0361K-Z
Ordering Information
B
M
2
P
0
3
6
1
K
-
Z
Marking Diagram
DIP7K (TOP VIEW)
Part Number Marking
BM2P0361K
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LOT Number
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Physical Dimension and Packing Information
Package Name
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Revision History
Date
Revision
18.May.2021
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
