BM2P0362-Z

Datasheet AC/DC Converter PWM Type DC/DC Converter IC with Integrated Switching MOSFET BM2P0362-Z General Description Key Specifications The PWM type DC/DC converter for AC/DC provides an optimal system for all products that require an electrical outlet. This IC supports both isolated and non-isolated devices and enables simpler designs of various types of a low power consumption electrical converters. The built-in 730 V startup circuit contributes to low power consumption. Power supplies can be designed flexibly by connecting a current detection resistor for the switching externally. Current is restricted in each cycle and excellent performances are demonstrated in a bandwidth and transient response since a current mode control is utilized. The switching frequency is 65 kHz by a fixed method. At light load, the frequency is reduced and high efficiency is achieved. A built-in frequency hopping function also contributes to low EMI. A built-in 730 V switching MOSFET makes designs easy. ◼ Operating Power Supply Voltage Range VCC Pin: 8.9 V to 26.0 V DRAIN Pin: 730 V (Max) ◼ Current at Switching Operation: 0.65 mA (Typ) ◼ Current at Burst Operation: 0.30 mA (Typ) ◼ Switching Frequency: 65 kHz (Typ) ◼ Operating Temperature Range: -40 °C to +105 °C ◼ MOSFET ON Resistance: 3.0 Ω (Typ) Package DIP7K W (Typ) x D (Typ) x H (Max) 9.27 mm x 6.35 mm x 8.63 mm Features PWM Current Mode Method Frequency Hopping Function Burst Operation at Light Load Frequency Reduction Function Built-in 730 V Startup Circuit Built-in 730 V Switching MOSFET VCC UVLO (Under Voltage Lockout) VCC OVP (Over Voltage Protection) Soft Start Function FB OLP (Over Load Protection) Over Current Detection Function per Cycle Over Current Detection AC Voltage Compensation Function ◼ SOURCE Pin Open Protection Function ◼ SOURCE Pin Short Protection Function ◼ SOURCE Pin Leading Edge Blanking Function ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ Applications AC Adapters, Household Appliances (Such as Vacuum Cleaners, Humidifiers, Air Cleaners, Air Conditioners, IH Cooking Heaters and Rice Cookers) Typical Application Circuit Fuse AC Input Filter Diode Bridge DRAIN SOURCE 〇Product structure : Silicon integrated circuit www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 DRAIN Error AMP VCC GND FB 〇This product has no designed protection against radioactive rays. 1/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Pin Configuration (TOP VIEW) Pin Descriptions Pin No. Pin Name I/O Function 1 2 3 4 5 6 7 SOURCE N.C. GND FB VCC DRAIN DRAIN I/O I/O I I I/O I/O MOSFET SOURCE pin Non connection GND pin Feedback signal input pin Power supply input pin MOSFET DRAIN pin MOSFET DRAIN pin www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/26 ESD Diode VCC GND ○ ○ ○ ○ ○ ○ - TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Block Diagram Fuse AC Input Diode Bridge Filter 5 VCC 6, 7 DRAIN VCC UVLO + - 100 μs Filter + - Startup Circuit 4.0 V Line Reg VCC OVP Clamp Circuit Internal Block S R Internal Reg. Q DRIVER PWM Control Internal Reg. OLP FB 4 + OLP Timer Burst Comparator Current Limiter Leading Edge Blanking + - 1 SOURCE + Rs AC Input Compensation Soft Start PWM Comparator - Maximum Duty + 3 + OSC GND Frequency Hopping Slope Compensation FeedBack With Isolation www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Description of Blocks 1 Startup Circuit This IC has a built-in startup circuit. It enables low standby electricity and high speed startup. The current consumption after startup is only OFF current ISTART3. Reference values of startup time are shown in Figure 3. When CVCC = 10 µF, it can start in 0.1 s or less. Fuse AC Input Diode Bridge Filter DRAIN Startup Circuit SW1 VCC CVCC + VCC UVLO Figure 1. Block Diagram of Startup Circuit Startup Current Startup Time [s] ISTART2 ISTART1 ISTART3 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 0 VSC 10 V VUVLO1 10 15 20 25 30 35 40 45 50 CVCC [µF] VCC Pin Voltage Figure 2. Startup Current vs VCC Pin Voltage www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5 Figure 3. Startup Time vs CVCC 4/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Description of Blocks – continued 2 Startup Sequences Startup sequences are shown in Figure 4. See the sections below for detailed descriptions. Input Voltage VH VCC Pin Voltage VUVL O1 VCH G2 VCH G1 VUVL O2 tFOLP2 tFOLP1 FB Pin Voltage tFOLP1 VFOL P1 VFOL P2 VBST2 VBST1 tFOLP1 Output Voltage Normal Load Overload Output Current ON Light Load tFOLP1 Burst mode ON Overload tFOLP2 tFOLP1 ON Switching tFOLP2 A B C D E F G H I J K Figure 4. Startup Sequences Timing Chart A: B: The input voltage VH is applied and the VCC pin voltage rises. If the VCC pin voltage becomes more than VUVLO1, the IC starts to operate. And if the IC judges the other protection functions as normal condition, it starts the switching operation. The soft start function limits the over current detection voltage to prevent any excessive voltage or current rising. When the switching operation starts, the output voltage rises. C: Until the output voltage becomes a constant value or more from startup, the VCC pin voltage drops by the VCC pin current consumption. D: After the switching operation starts, it is necessary that the output voltage is set to become the rated voltage within tFOLP1. E: At light load, the burst operation starts to reduce the power consumption if the FB pin voltage becomes less than VBST1. F: When the FB pin voltage becomes more than VFOLP1, the IC starts the overload operation. G: When the condition that the FB pin voltage > VFOLP1 continues for tFOLP1, the switching stops for tFOLP2 period by FB OLP. (If the FB pin voltage becomes less than VFOLP2, FB OLP detection timer tFOLP1 is reset.) H: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates. I: When the VCC pin voltage becomes more than VCHG2, the VCC recharge function stops operating. J: After tFOLP2 period from G, the switching operation starts. K: Same as G. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Description of Blocks – continued 3 VCC Pin Protection Function This IC has the internal protection functions at the VCC pin as shown below. 3.1 VCC UVLO/VCC OVP VCC UVLO and VCC OVP are the auto recovery type comparator having voltage hysteresis. 3.2 VCC Recharge Function If the VCC pin voltage drops to less than VCHG1 after once the VCC pin becomes more than VUVLO1 and the IC starts to operate, the VCC recharge function operates. At this time, the VCC pin is recharged from the DRAIN pin through the startup circuit. When the VCC pin voltage becomes more than VCHG2, this recharge is stopped. Input Voltage VH VOVP1 VOVP2 VCC Pin Voltage VUVLO1 tCOMP VCHG2 VCHG1 VUVLO2 Output Voltage ON ON VCC UVLO ON VCC OVP ON VCC Recharge Function ON ON Switching A B C DE F G HI J K Figure 5. VCC UVLO/VCC OVP/VCC Recharge Function Timing Chart A: B: The input voltage VH is applied and the VCC pin voltage rises. When the VCC pin voltage becomes more than VUVLO1, the IC starts operating. And if the IC judges the other protection functions as normal condition, it starts switching operation. The soft start function limits the over current detection voltage value to prevent any excessive voltage or current rising. When the switching operation starts, the output voltage rises. C: The output voltage finishes startup. The VCC pin voltage is stabilized by being recharged from the auxiliary winding. D: When the VCC pin voltage becomes more than VOVP1, VCC OVP timer operates. E: When the condition that the VCC pin voltage is more than VOVP1 lasts for tCOMP, the IC detects VCC OVP and stops switching operation. F: When the VCC pin voltage becomes less than VOVP2, VCC OVP is released and the switching operation restarts. G: When the input voltage VH becomes OPEN, the VCC pin voltage drops. H: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates. I: When the VCC pin voltage becomes more than VCHG2, the VCC recharge function stops its operation. J: When the VCC pin voltage becomes less than V CHG1, the VCC recharge function operates. However, the current supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low input voltage VH. K: When the VCC pin voltage becomes less than VUVLO2, VCC UVLO operates. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z 3 VCC Pin Protection Function – continued 3.3 4 TSD (Thermal Shutdown) TSD stops the switching operation if the junction temperature becomes more than TSD1. DC/DC Driver Block This IC performs a current mode PWM control and it has the following characteristics. ◼ The switching frequency is fixed at fSW1 by an internal oscillator. It has a built-in frequency hopping function and it makes the switching frequency fluctuate as shown in Figure 6. The hopping fluctuation cycle is fCH. ◼ Maximum duty is fixed at DMAX and minimum ON width is fixed at tMIN. ◼ In the current mode control, a sub-harmonic oscillation may occur when the duty cycle exceeds 50 %. As a countermeasure, this IC has a built-in slope compensation circuit. ◼ It has a built-in burst mode and frequency reduction circuits to achieve lower power consumption at light load. ◼ The FB pin is pulled up to the internal power supply by RFB. ◼ The FB pin voltage is changed by the secondary output voltage. This IC monitors the FB pin voltage and changes a switching operation status. Switching Frequency [kHz] 500 μs(Note 1) 69 68 67 66 65 64 63 62 61 fCH Time (Note 1) This is the value calculated as fCH is typical valu e. Figure 6. Frequency Hopping Function www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z 4 DC/DC Driver Block – continued 4.1 Soft Start Function At startup, this function controls the over current detection voltage in order to prevent any excessive voltage or current rising. This IC enables this soft start operation by changing the over current detection voltage with time. Over Current Detection Voltage SS1 SS2 SS3 SS4 VSOURCE VSOURCE4 VSOURCE3 VSOURCE2 VSOURCE1 tSS1 tSS2 tSS3 tSS4 Time Figure 7. Soft Start Function 4.2. FB OLP (Overload Protection) FB OLP is the function that monitors the secondary output load status at the FB pin voltage and stops the switching operation at the overload status. At the overload status, the FB pin voltage rises because current dose not flows to the photocoupler because of a drop of the output voltage. When the condition that the FB pin voltage > VFOLP1 continues for longer than tFOLP1, it is judged as the overload status and the switching operation stops. If the FB pin voltage falls to less than VFOLP2 within tFOLP1 from the status that the FB pin voltage > VFOLP1, FB OLP ON detection timer is reset. At startup, the FB pin is pulled up to the IC’s internal voltage, so the operation starts from the voltage more than VFOLP1. Therefore, it is necessary to set the startup time within tFOLP1 so that the FB pin voltage becomes less than VFOLP2. Recovery from the detection of overload status is after tFOLP2. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Description of Blocks – continued 5 Over Current Detection Block 5.1 Over Current Detection Function This IC has a built-in over current detection function per switching cycle. If the SOURCE pin voltage becomes VSOURCE (VSOURCE1 to VSOURCE4 in the case of SS1 to SS4) or more, the switching operation stops. It also has a built-in AC voltage compensation function. This function makes IPEAK (DC) increase with time. fSW1 fSW1 ON Switching (AC100 V) ON Switching (AC100 V) OFF OFF ON Switching (AC240 V) OFF OFF ON Switching (AC240 V) OFF OFF OFF OFF IPEAK (AC) VDC = 240 V IPEAK (AC) VDC = 240 V VDC = 100 V VDC = 100 V IPEAK(DC) compensated constant IPEAK (DC) Primary Peak Current Primary Peak Current tDELAY tDELAY tDELAY Figure 8. Without the AC Voltage Compensation Function tDELAY Figure 9. With the AC Voltage Compensation Function Primary peak current entering overload mode is calculated by the following formula. 𝑰𝑷𝑬𝑨𝑲 = 𝑽𝑺𝑶𝑼𝑹𝑪𝑬 𝑽𝑫𝑪 + × 𝒕𝑫𝑬𝑳𝑨𝒀 𝑹𝒔 𝑳𝒑 [A] where: 𝐼𝑃𝐸𝐴𝐾 is the primary peak current. 𝑉𝑆𝑂𝑈𝑅𝐶𝐸 is the internal over current detection voltage. 𝑅𝑠 is the current detection resistor. 𝑉𝐷𝐶 is the input DC voltage. 𝐿𝑝 is the primary transformer L value. 𝑡𝐷𝐸𝐿𝐴𝑌 is the delay time after the over current detection. Over Current Detection Voltage + KSOURCE VSOURCE Time 0 Figure 10. Over Current Detection Voltage www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z 5 6 Over Current Detection Block – continued 5.2 SOURCE Pin Leading Edge Blanking Function Normally, when the MOSFET for driver is turned ON, surge current is generated at each capacitor component, drive current and so on. At this time, detection errors may occur in the over current detection circuit because the SOURCE pin voltage rises. To prevent this errors, Leading Edge Blanking function is built in this IC. This function masks the SOURCE pin voltage for tLEB from the time the DRAIN pin voltage switches H to L. 5.3 SOURCE Pin Short Protection Function When the SOURCE pin is shorted, excessive heat may destroy the IC. To prevent this, this IC has a built-in short protection function (auto recovery protection). 5.4 SOURCE Pin Open Protection Function When the SOURCE pin is opened, excessive heat by such as noise may destroy the IC. To prevent this, this IC has a built-in open protection function (auto recovery protection). Operation Mode of Protection Functions The operation modes of each protection function are shown in Table 1. Table 1. Operation Modes of Protection Functions VCC UVLO VCC OVP TSD FB OLP Detection Conditions VCC pin voltage < VUVLO2 (at voltage dropping) VCC pin voltage > VOVP1 (at voltage rising) Junction temperature > TSD1 (at temperature rising) FB pin voltage > VFOLP1 (at voltage rising) Release Conditions VCC pin voltage > VUVLO1 (at voltage rising) VCC pin voltage < VOVP2 (at voltage dropping) Junction temperature < TSD2 (at temperature dropping) or VCC UVLO detection FB pin voltage < VFOLP2 (at voltage falling) or VCC UVLO detection tCOMP tCOMP tFOLP1 VCC pin voltage < VOVP2 Junction temperature < TSD2 FB pin voltage < VFOLP2 (at voltage falling) – – – Auto recovery Auto recovery Auto recovery Detection Timer Reset Condition – Release Timer Reset Condition Auto Recovery or Latch tFOLP2 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/26 VCC UVLO detection Auto recovery TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit Conditions Maximum Applied Voltage 1 VMAX1 -0.3 to +32 V VCC pin voltage Maximum Applied Voltage 2 VMAX2 -0.3 to +6.5 V SOURCE and FB pins voltage Maximum Applied Voltage 3 VMAX3 650 V DRAIN pin voltage 730 V 1.00 W Tjmax 150 °C Tstg -55 to +150 °C Power Dissipation Pd Maximum Junction Temperature Storage Temperature Range Caution 1: Caution 2: (Note 1) (Note 2) DRAIN(tpulse < 10 μs) (Note 1) (Note 2) Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Duty is less than 1 %. At mounted on a glass epoxy single layer PCB (74.2 mm x 74.2 mm, 1.6 mm). Derate by 8 mW/°C if the IC is used in the ambient temperature Ta 25 °C or above. Thermal Dissipation Make the thermal design so that the IC operates in the following conditions. (Because the following temperature is guarantee value, it is necessary to consider margin.) 1. The ambient temperature Ta must be 105 °C or less. 2. The IC’s loss must be the power dissipation Pd or less. The thermal abatement characteristic is as follows. (At mounting on a glass epoxy single layer PCB which size is 74.2 mm x 74.2 mm x 1.6 mm) 1.5 Pd [W] 1.0 0.5 0.0 0 25 50 75 100 125 150 Ta [ºC] Figure 11. DIP7K Thermal Dissipation Characteristic www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Operating Power Supply Voltage Range 1 VCC 8.9 - 26.0 V VCC pin voltage Operating Power Supply Voltage Range 2 VDRAIN - - 650 V DRAIN pin voltage Operating Temperature Conditions DRAIN(tpulse < 10 μs) (Note 3) 730 Topr -40 - +105 °C Parameter Symbol Min Typ Max Unit 650 - - V ID = 1 mA, VGS = 0 V Voltage between DRAIN and SOURCE Pins V(BR)DDS (Note 3) Duty is less than 1 % Electrical Characteristics in MOSFET Part (Unless otherwise noted, Ta = 25 °C, VCC = 15 V) Conditions IDSS - - 100 μA ID = 1 mA, VGS = 0 V tpulse < 10 μs VDS = 650 V, VGS = 0 V RDS(ON) - 3.0 3.6 Ω ID = 0.25 A, VGS = 10 V Symbol Min Typ Max Unit Startup Current 1 ISTART1 0.100 0.500 1.000 mA VCC pin voltage = 0 V Startup Current 2 ISTART2 1.00 3.00 6.00 mA OFF Current ISTART3 - 10 20 μA VCC pin voltage = 10 V Inflow current from the DRAIN pin after UVLO is released (at MOSFET OFF) VSC 0.800 1.500 2.100 V Symbol Min Typ Max Unit Conditions Current at Switching Operation ION1 0.30 0.65 1.05 mA VFB = 2.0 V (pulse operation) Current at Burst Operation ION2 0.20 0.30 0.45 mA VFB = 0.0 V VCC UVLO Voltage 1 VUVLO1 12.50 13.50 14.50 V At VCC pin voltage rising VCC UVLO Voltage 2 VUVLO2 7.50 8.20 8.90 V At VCC pin voltage falling VCC UVLO Voltage Hysteresis VUVLO3 - 5.30 - V VUVLO3 = VUVLO1 - VUVLO2 VCC OVP Voltage 1 VOVP1 26.0 27.5 29.0 V At VCC pin voltage rising VCC OVP Voltage 2 VOVP2 22.0 23.5 25.0 V At VCC pin voltage falling VOVP3 = VOVP1 - VOVP2 DRAIN Pin Leak Current On Resistance 730 Electrical Characteristics in Startup Circuit Part (Unless otherwise noted, Ta = 25 °C, VCC = 15 V) Parameter Startup Current Switching Voltage Conditions Electrical Characteristics in Control IC Part (Unless otherwise noted, Ta = 25 °C, VCC = 15 V) Parameter Circuit Current VCC Pin Protection Function VCC OVP Voltage Hysteresis VOVP3 - 4.0 - V VCC Recharge Start Voltage VCHG1 7.70 8.70 9.70 V VCC Recharge Stop Voltage VCHG2 12.00 13.00 14.00 V TSD Temperature 1 TSD1 150 175 200 °C At temperature rising(Note 1) TSD Temperature 2 TSD2 110 135 160 °C At temperature falling(Note 1) VCC OVP/TSD Timer tCOMP 50 100 150 μs (Note 1) Not 100 % tested. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Electrical Characteristics in Control IC Part – continued (Unless otherwise noted, Ta = 25 °C, VCC = 15 V) Parameter Symbol Min Typ Max Unit Conditions Switching Frequency 1 fSW1 60 65 70 kHz VFB = 2.00 V Switching Frequency 2 fSW2 20 25 30 kHz VFB = 0.30 V Frequency Hopping Width fDEL - 4.0 - kHz VFB = 2.0 V Hopping Fluctuation Cycle fCH 75 125 175 Hz Soft Start Time 1 tSS1 0.30 0.50 0.70 ms Soft Start Time 2 tSS2 0.60 1.00 1.40 ms Soft Start Time 3 tSS3 1.20 2.00 2.80 ms DC/DC Driver Block Soft Start Time 4 tSS4 3.20 4.00 4.80 ms DMAX 68.0 75.0 82.0 % Minimum ON Time tMIN 150 400 650 ns FB Pin Pull-up Resistance RFB 23 30 37 kΩ ΔFB Pin/ΔSOURCE Pin Voltage Gain Gain 3.00 4.00 7.00 V/V FB Pin Burst Voltage 1 VBST1 0.220 0.280 0.340 V At FB pin voltage falling FB Pin Burst Voltage 2 VBST2 0.260 0.320 0.380 V At FB pin voltage rising FB Pin Burst Hysteresis FB Pin Voltage at Starting Frequency Reduction VBST3 - 0.040 - V VBST3 = VBST2 - VBST1 VDLT 1.100 1.250 1.400 V FB OLP Voltage 1 VFOLP1 2.60 2.80 3.00 V FB OLP Voltage 2 VFOLP2 2.40 2.60 2.80 V FB OLP ON Detection Timer tFOLP1 80 128 176 ms FB OLP OFF Timer tFOLP2 332 512 692 ms Over Current Detection Voltage Over Current Detection Voltage 1 VSOURCE VSOURCE1 0.375 0.050 0.400 0.100 0.425 0.150 V V tON = 0 μs Over Current Detection Voltage 2 VSOURCE2 0.080 0.150 0.220 V (Note 1) (Note 2) Over Current Detection Voltage 3 VSOURCE3 0.130 0.200 0.270 V (Note 1) (Note 2) Over Current Detection Voltage 4 Over Current Detection AC Voltage Compensation Factor Leading Edge Blanking Time SOURCE Pin Short Protection Voltage SOURCE Pin Short Protection Time VSOURCE4 0.230 0.300 0.370 V (Note 1) (Note 2) KSOURCE 12 20 28 mV/μs tLEB 120 250 380 ns VSOURCESHT 0.020 0.050 0.080 V tSOURCESHT 1.80 3.00 4.20 μs Maximum Duty At overload detection (at FB pin voltage rising) At overload detection (at FB pin voltage falling) Over Current Detection Block (Note 1) (Note 2) (Note 1) (Note 1) Not 100 % tested. (Note 2) Refer to Figure 7. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Typical Performance Curves (Reference Data) 0.40 Current at Burst Operation: ION2 [mA] Current at Switching Operation: ION1 [mA] 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.35 0.30 0.25 0.20 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 12. Current at Switching Operation vs Temperature Figure 13. Current at Burst Operation vs Temperature 15.0 10.0 VCC UVLO Voltage 2: VUVLO2 [V] VCC UVLO Voltage 1: VUVLO1 [V] 0 14.0 13.0 12.0 11.0 10.0 9.0 8.0 7.0 6.0 5.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 14. VCC UVLO Voltage 1 vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 15. VCC UVLO Voltage 2 vs Temperature 14/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Typical Performance Curves – continued (Reference Data) 30.0 5.9 VCC OVP Voltage 1: VOVP1 [V] VCC UVLO Voltage Hysteresis: VUVLO3 [V] 6.0 5.8 5.7 5.6 5.5 5.4 5.3 5.2 5.1 5.0 29.0 28.0 27.0 26.0 25.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 16. VCC UVLO Voltage Hysteresis vs Temperature Figure 17. VCC OVP Voltage 1 vs Temperature 25.0 5.0 VCC OVP Voltage Hysteresis: VOVP3 [V] VCC OVP Voltage 2: VOVP2 [V] 0 24.0 23.0 22.0 4.0 3.0 2.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 18. VCC OVP Voltage 2 vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 19. VCC OVP Voltage Hysteresis vs Temperature 15/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Typical Performance Curves – continued (Reference Data) 15.0 VCC Recharge Stop Voltage: VCHG2 [V] VCC Recharge Start Voltage: VCHG1 [V] 10.0 9.0 8.0 7.0 6.0 14.0 13.0 12.0 11.0 10.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] Figure 20. VCC Recharge Start Voltage vs Temperature 20 40 60 80 100 120 Temperature [°C] Figure 21. VCC Recharge Stop Voltage vs Temperature 70.0 30.0 Switching Frequency 2: fSW2 [kHz] Switching Frequency 1: fSW1 [kHz] 0 69.0 68.0 67.0 66.0 65.0 64.0 63.0 62.0 61.0 60.0 29.0 28.0 27.0 26.0 25.0 24.0 23.0 22.0 21.0 20.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 22. Switching Frequency 1 vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 23. Switching Frequency 2 vs Temperature 16/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Typical Performance Curves – continued (Reference Data) 0.40 FB Pin Burst Voltage 1: VBST1 [V] Maximum Duty: D MAX [%] 90.0 85.0 80.0 75.0 70.0 65.0 0.35 0.30 0.25 0.20 -40 -20 0 20 40 60 80 100 120 -40 -20 0 Temperature [°C] Figure 24. Maximum Duty vs Temperature Figure 25. FB Pin Burst Voltage 1 vs Temperature 3.00 FB OLP Voltage 1: VFOLP1 [V] 0.40 FB Pin Burst Voltage 2: VBST2 [V] 20 40 60 80 100 120 Temperature [°C] 0.35 0.30 0.25 2.90 2.80 2.70 2.60 2.50 0.20 -40 -20 0 -40 -20 20 40 60 80 100 120 20 40 60 80 100 120 Temperature [°C] Temperature [°C] Figure 26. FB Pin Burst Voltage 2 vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 27. FB OLP Voltage 1 vs Temperature 17/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Typical Performance Curves – continued (Reference Data) 700 FB OLP OFF Timer: tFOLP2 [ms] FB OLP ON Detection Timer: tFOLP1 [ms] 180 160 140 120 100 600 500 400 80 300 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 28. FB OLP ON Detection Timer vs Temperature Figure 29. FB OLP OFF Timer vs Temperature 0.45 1.0 Start Current 1:ISTART1 [mA] Over Current Detection Voltage: VSOURCE [V] 0 0.43 0.41 0.39 0.37 0.35 0.8 0.6 0.4 0.2 0.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 30. Over Current Detection Voltage vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 31. Start Current 1 vs Temperature 18/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Typical Performance Curves – continued (Reference Data) Start Current 2: ISTART2 [mA] 8.0 6.0 4.0 2.0 0.0 -40 -20 0 20 40 60 80 100 120 Temperature [°C] Figure 32. Start Current 2 vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Application Examples Show a flyback circuitry example in Figure 33. Be careful with the DRAIN voltage because high voltage is produced by ringing in turn OFF. With this IC, It become able to work to 730V. Fuse AC Input Filter Diode Bridge DRAIN SOURCE DRAIN VCC GND Error AMP FB Figure 33. Flyback Application Ciucit 730V 650V DRAIN 0V tpulse < 10 μs(Duty < 1%) Figure 34. Drain Pin Ringing Waveform www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z I/O Equivalence Circuit SOURCE 1 2 N.C. 3 4 GND FB VCC VCC GND SOURCE R FB FB Non Connection 5 VCC - DRAIN 6 7 DRAIN DRAIN VCC Internal Circuit Internal Circuit Interna l MOSFET Interna l MOSFET SOURC E www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/26 DRAIN SOURC E TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Operational Notes – continued 10. Regarding the Input Pin of the IC This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Figure 33. Example of IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Ordering Information B M 2 P 0 3 6 2 - Z Marking Diagram DIP7K (TOP VIEW) Part Number Marking BM2P0362 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 LOT Number 24/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Physical Dimension and Packing Information Package Name www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 DIP7K 25/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 BM2P0362-Z Revision Historys Date Revision 12.Feb.2019 001 07.Dec.2020 002 Changes New Release P11 Change the Absolute Maximum Ratings P20 Addition of the Application Circuit www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 26/26 TSZ02201-0F1F0A200420-1-2 07.Dec.2020 Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001