Datasheet
AC/DC Drivers
PWM type DC/DC converter IC
Included 650V MOSFET
BM2Pxx4 Series
General Description
Features
The PWM type DC/DC converter (BM2Pxx4 Series)
for AC/DC provide an optimum system for all products
that include an electrical outlet.
This IC supports both isolated and non-isolated
devices, enabling simpler design of various types of
low-power electrical converters.
This IC built in a HV starter circuit that tolerates
650V, it contributes to low-power consumption.
With current detection resistors as external devices, a
higher degree of design freedom is achieved. Since
current mode control is utilized, current is restricted in
each cycle and excellent performance is demonstrated
in bandwidth and transient response.
The switching frequency is 65 kHz. At light load, the
switching frequency is reduced and high efficiency is
achieved.
A frequency hopping function is also on chip, which
contributes to low EMI.
We can design easily, because this IC includes the
switching MOSFET.
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Package
DIP7K
DIP7F
Basic specifications
DIP7WF
◼ Operating Power Supply Voltage Range:
VCC 8.9V to 26.0V DRAIN: to 650V
◼ Operating Current: Normal Mode
BM2P014: 0.950mA (Typ.)
BM2P034: 0.775mA (Typ.)
BM2P054: 0.600mA (Typ.)
BM2P094: 0.500mA (Typ.)
Burst Mode: 0.400mA (Typ.)
◼ Oscillation Frequency:
65kHz (Typ.)
◼ Operating Temperature:
- 40 C to +105 C
◼ MOSFET ON Resistance:
BM2P014: 1.4Ω (Typ.)
BM2P034: 2.4Ω (Typ.)
BM2P054: 4.0Ω (Typ.)
BM2P094: 8.5Ω (Typ.)
+
Line Up
Product
BM2P014
BM2P034
BM2P054
BM2P094
Diode
Bridge
-
7
6
1
2
MOSFET ON resistor
1.4Ω
2.4Ω
4.0Ω
8.5Ω
5
DRAIN DRAIN
SOURCE N.C.
9.27mm x 6.35mm x 8.63mm
Pitch 2.54mm(Typ.)
9.20mm x 6.35mm x 7.60mm
Pitch 2.54mm(Typ.)
9.35mm x 6.35mm x 8.10mm
Pitch 2.54mm(Typ.)
AC adapters and household appliances (vacuum
cleaners, humidifiers, air cleaners, air conditioners, IH
cooking heaters, rice cookers, etc.)
FUSE
Filter
W(Typ.) x D(Typ.) x H(Max.)
Applications
Application circuit
AC
85-265Vac
PWM frequency : 65kHz
PWM current mode method
Burst operation when load is light
Frequency reduction function
Built-in 650V start circuit
Built-in 650V switching MOSFET
VCC pin under voltage protection
VCC pin overvoltage protection
SOURCE pin Open protection
SOURCE pin Short protection
SOURCE pin Leading-Edge-Blanking function
Per-cycle over current protection circuit
Soft start
Secondary Over current protection circuit
VCC
GND
FB
3
4
ERROR
AMP
Figure 1. Application circuit
○Product structure: Silicon monolithic integrated circuit
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
○This product is not designed protection against radioactive rays
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BM2Pxx4 Series
Absolute Maximum Ratings (Ta=25C )
Parameter
Vmax1
Vmax2
V max3
-0.3 to 30
-0.3 to 6.5
650
Rating
Unit
Drain current pulse
IDP
10.40
A
Drain current pulse
IDP
5.20
A
Drain current pulse
IDP
2.60
A
Drain current pulse
IDP
1.30
A
Maximum applied voltage 1
Maximum applied voltage 2
Maximum applied voltage 3
Symbol
V
V
V
Allowable dissipation
Pd
2000
mW
oC
Operating temperature range
Topr
-40 to +105
oC
MAX junction temperature
TJMAX
150
oC
Storage temperature range
Tstr
-55 to +150
(Note1): When mounted (on 74.2 mm × 74.2 mm x 1.6 mm thick, glass epoxy on double-layer substrate).
Conditions
VCC
SOURCE, FB
DRAIN
PW=10us, Duty cycle=1%
(BM2P014)
PW=10us, Duty cycle=1%
(BM2P034)
PW=10us, Duty cycle=1%
(BM2P054)
PW=10us, Duty cycle=1%
(BM2P094)
Reduce to 16 mW/C when Ta = 25C or above.
Operating Conditions (Ta=25C )
Parameter
Symbol
Power supply voltage range 1
Power supply voltage range 2
Rating
VCC
VDRAIN
Unit
8.9 to 26.0
to 650
V
V
Conditions
VCC pin voltage
DRAIN pin voltage
Electrical Characteristics of MOSFET part (Unless otherwise noted, Ta = 25C, VCC = 15 V)
Min
Specifications
Typ
Max
V(BR)DDS
650
-
-
V
ID=1mA / VGS=0V
IDSS
-
-
100
uA
On resistance
RDS(ON)
-
1.4
2.0
Ω
On resistance
RDS(ON)
-
2.4
3.6
Ω
On resistance
RDS(ON)
-
4.0
5.5
Ω
On resistance
RDS(ON)
-
8.5
12.0
Ω
VDS=650V / VGS=0V
ID=0.25A / VGS=10V
(BM2P014)
ID=0.25A / VGS=10V
(BM2P034)
ID=0.25A / VGS=10V
(BM2P054)
ID=0.25A / VGS=10V
(BM2P094)
Parameter
Symbol
Unit
Conditions
[MOSFET Block]
Between drain and
source voltage
Drain leak current
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BM2Pxx4 Series
Electrical Characteristics of Control IC part (Unless otherwise noted, Ta = 25C, VCC = 15 V)
Parameter
Symbol
[Circuit current]
Min
Specifications
Typ
Max
Unit
Conditions
BM2P014 FB=2.0V
( at pulse operation)
BM2P034 FB=2.0V
(at pulse operation)
BM2P054 FB=2.0V
(at pulse operation)
BM2P094 FB=2.0V
(at pulse operation)
Circuit current (ON) 1
ION1
700
950
1200
μA
Circuit current (ON) 1
ION1
550
775
1050
μA
Circuit current (ON) 1
ION1
410
600
790
μA
Circuit current (ON) 1
ION1
350
500
650
μA
Circuit current (ON) 2
ION2
-
400
500
μA
FB=0.0V(at burst operation)
VUVLO1
VUVLO2
VUVLO3
VOVP1
VOVP2
VLATCH
VCHG1
VCHG2
TLATCH
TSD
12.50
7.50
26.0
14.50
8.90
29.0
7.70
12.00
50
118
13.50
8.20
5.30
27.5
23.5
VUVLO2-0.5
8.70
13.00
100
145
9.70
14.00
150
-
V
V
V
V
V
V
V
V
us
C
VCC rises
VCC falls
VUVLO3= VUVLO1- VUVLO2
VCC rises
VCC falls
FSW1
FSW2
FDEL1
FCH
TSS1
TSS2
TSS3
TSS4
Dmax
RFB
Gain
VBST
60
20
75
0.30
0.60
1.20
4.80
68.0
23
0.300
65
25
4.0
125
0.50
1.00
2.00
8.00
75.0
30
4.00
0.400
70
30
175
0.70
1.40
2.80
11.20
82.0
37
0.500
KHz
KHz
KHz
Hz
ms
ms
ms
ms
%
kΩ
V/V
V
VDLT
1.100
1.250
1.400
V
VFOLP1A
VFOLP1B
TFOLP1
TFOLP1b
TFOLP2
2.60
40
26
358
2.80
2.60
64
32
512
3.00
88
38
666
V
V
ms
ms
ms
VCS
0.380
0.400
0.420
V
Overcurrent detection voltage SS1
VCS_SS1
-
0.100
-
V
0[ms] ~ TSS1[ms]
Overcurrent detection voltage SS2
VCS_SS2
-
0.150
-
V
TSS1 [ms] ~ TSS2 [ms]
Overcurrent detection voltage SS3
VCS_SS3
-
0.200
-
V
TSS2 [ms] ~ TSS3[ms]
Overcurrent detection voltage SS4
VCS_SS4
-
0.300
-
V
TSS3 [ms] ~ TSS4 [ms]
Leading Edge Blanking Time
Over current detection AC Voltage
compensation factor
SOURCE pin
short protection voltage
[Start circuit block]
Start current 1
Start current 2
TLEB
-
250
-
ns
KCS
12
20
28
mV/us
VCSSHT
0.020
0.050
0.080
V
ISTART1
ISTART2
0.100
1.000
0.500
3.000
1.000
6.000
mA
mA
OFF current
ISTART3
-
10
20
uA
VSC
0.800
1.500
2.100
V
[VCC protection function]
VCC UVLO voltage 1
VCC UVLO voltage 2
VCC UVLO hysteresis
VCC OVP voltage 1
VCC OVP voltage 2
Latch released VCC voltage
VCC Recharge start voltage
VCC Recharge stop voltage
Latch mask time
Thermal shut down temperature
[PWM type DCDC driver block]
Oscillation frequency 1
Oscillation frequency 2
Frequency hopping width 1
Hopping fluctuation frequency
Soft start time 1
Soft start time 2
Soft start time 3
Soft start time 4
Maximum duty
FB pin pull-up resistance
ΔFB / ΔCS gain
FB burst voltage
FB voltage of
starting
Frequency
reduction
mode
FB OLP voltage 1a
FB OLP voltage 1b
FB OLP ON timer
FB OLP Start up timer
FB OLP OFF timer
[Over current detection block]
Overcurrent detection voltage
Start current switching voltage
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TSZ22111 • 15 • 001
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Control IC
FB=2.00V
FB=0.40V
FB=2.0V
FB falls
Overload is detected (FB rise)
Overload is detected (FB drop)
Ton=0us
VCC= 0V
VCC=10V
Inflow current from Drain pin
after UVLO released UVLO.
When MOSFET is OFF
TSZ02201-0F2F0A200070-1-2
26.Oct.2021 Rev.011
BM2Pxx4 Series
PIN DESCRIPTIONS
Table 1
Pin Description
NO.
Pin Name
I/O
Function
1
2
3
4
5
6
7
SOURCE
N.C.
GND
FB
VCC
DRAIN
DRAIN
I/O
I/O
I
I
I/O
I/O
MOSFET SOURCE pin
GND pin
Feedback signal input pin
Power supply input pin
MOSFET DRAIN pin
MOSFET DRAIN pin
ESD Diode
VCC
GND
○
○
○
○
○
-
I/O Equivalent Circuit Diagram
DRAIN
7
DRAIN
6
DRAIN
Internal
Circuit
DRAIN
VCC
Internal
Circuit
Internal MOSFET
Internal MOSFET
SOURCE
1
VCC
5
SOURCE
SOURCE
2
3
N.C.
4
GND
FB
VREF
VREF
GND
SOURCE
FB
R FB
Figure 2 I/O Equivalent Circuit Diagram
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BM2Pxx4 Series
Block Diagram
+
VH
VO
FUSE
AC
Diode
Bridge
Filter
CM
Vs
-
Cvcc
VCC
DRAIN
VCC
DRAIN
DRAIN
DRAIN
5
6
7
VCC UVLO
VCC OVP
+
-
13.5V
/ 8.2V
Starter
4.0V
Line Reg
+
-
12V Clamp
Circuit
27.5V/
23.5V
10uA
Internal Block
S
R
DRIVER
Q
PWM Control
4.0V
4.0V
30k
FB
4
OLP
+
1M
32ms
64ms
Timer
Current
Limiter
Burst
Comparator
Leading Edge
Blanking
(typ=250ns)
+
-
SOURCE
1
+
Rs
Soft Start
PWM
Comparator
-
AC Input
Compensation
MAX
DUTY
GND
+
+
OSC
(65kHz)
3
Frequency
Hopping
Slope
Compensation
FeedBack
With
Isolation
Figure 3.
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Block Diagram
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BM2Pxx4 Series
Description of Blocks
(1) Start circuit (DRIAN: 6,7pin)
This IC built in Start circuit (tolerates 650V). It enables to be low standby mode electricity and high speed starting.
After starting, consumption power is idling current ISTART3 (typ=10uA ) only.
Reference values of Starting time are shown in Figure-7. When Cvcc=10uF it can start less than 0.1 sec.
+
FUSE
AC
85- 265 Vac
Diode
Bridge
-
DRAIN
Starter
SW1
VCC
Cvcc
+
VCCUVLO
Figure 4.
Block diagram of start circuit
Start Time [s]
Start Up Current [mA]
ISTART2
ISTART1
ISTART3
0 Vsc
10V
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
5
10 15 20 25 30 35 40 45 50
CVCC [μF]
V UVLO1
VCC Voltage[V]
Figure 5.
Start current vs VCC voltage
Figure 6.
Start time (reference value)
* Start current flows from the DRAIN pin
ex) Consumption power of start circuit only when the Vac=100V
PVH=100V*√2*10uA=1.41mW
ex) Consumption power of start circuit only when the Vac=240V
PVH=240V*√2*10uA=3.38mW
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BM2Pxx4 Series
(2) Start sequences
(Soft start operation, light load operation, and auto recovery operation during overload protection)
Start sequences are shown in Figure 7. See the sections below for detailed descriptions.
VH
VCC=13.5V
VCC(1pin)
VCC=8.2V
Internal REF
Pull Up
Within
32ms
FB OLP ON
64ms
FB(8pin)
Vout
Over Load
Normal Load
Light LOAD
Iout
Burst mode
Switching
stop
Switching
Switing
Soft
Start
A
BC
Figure 7.
E
D
F
GH
I
Start sequences Timing Chart
A: Input voltage VH is applied
B: This IC starts operation when VCC pin voltage rises and VCC > V UVLO1 (13.5 V typ).Switching function starts when
other protection functions are judged as normal. Until the secondary output voltage becomes constant level, VCC
voltage drops because of the VCC consumption current. VCC recharge function start if VCC voltage < VCHG1 (8.7V
typ )
C: With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current.
D: When the switching operation starts, VOUT rises.The output voltage become to stable state, VCC voltage also
become to stable state through auxiliary winding.Please set the rated voltage within the TFOLP1b period (32ms typ)
from VCC voltage > VUVLO1.
E: During a light load, if it reaches FB voltage < VBST (= 0.4Vtyp), the IC starts burst operation to keep power
consumption low.During burst operation, it becomes low-power consumption mode.
F: When the FB Voltage＞VFOLP1A (=2.8V typ ), it becomes a overload operation.
G: When FB pin voltage keeps VFOLP1A (= 2.8V typ) at or above TFOLP1 (64ms typ), the overload protection function is
triggered and switching stops 64ms later. if the FB pin voltage becomes FB Vovp1 (typ=27.5V), and Switching is
restart when VCC pin voltage < Vovp2 (typ=23.5V)
VH
VVovp1=27.5Vtyp
OVP1 V OVP1
VVovp2=23.5Vtyp
OVP2 V OVP2
VCC
VUVLO1 V UVLO1
VCCuvlo1=13.5Vtyp
VVchg2=13.0Vtyp
CHG2
V
CHG2
VVchg1=
CHG1 8.7Vtyp
V
CHG1
VUVLO2 =V
VCCuvlo2
8.2Vtyp
UVLO2
Time
ON
ON
OFF
VCC UVLO
ON
VCC OVP
OFF
OFF
ON
ON
VCC Charge
Function
OFF
ON
OUT
Switching
OFF
OFF
Time
A
B C
D
E F
Figure 8.
A:
B:
C:
D:
E:
F:
G:
H:
I:
J:
G
H
I
J
A
VCC UVLO / OVP Timing Chart
DRAIN voltage input, VCC pin voltage starts rising.
VCC>VUVLO1, DC/DC operation starts
VCC< VCHG1, VCC charge function operates and the VCC voltage rises.
VCC > VCHG2, VCC charge function is stopped.
VCC > VOVP1, continues TLATCH (typ =100us), switching is stopped by the VCCOVP function.
VCC < VOVP2, Switching operation restarts
VH is OPEN.VCC Voltage is fall.
Same as C.
Same as D.
VCCV UVLO1 and the DC/DC operation starts then the VCC
pin voltage drops to VCHG2, charge is stopped. The operations are shown in figure 9.
VH
VUVLO1
VCHG2
VCC VCHG1
VUVLO2
Switching
VH charge
charge
charge charge charge
OUTPUT
voltage
A
Figure 9.
A:
B:
C:
D:
E:
F:
G:
H:
B C D E
F G H
Charge operation VCC pin charge operation
DRAIN pin voltage rises, charge starts to VCC pin by the VCC charge function.
VCC > VUVLO1, VCC UVLO function releases, VCC charge function stops, DC/DC operation starts.
When DC/DC operation starts, the VCC voltage drops.
VCC < VCHG1, VCC recharge function operates and VCC pin voltage rises.
VCC > VCHG2, VCC recharge function stops.
VCC < VCHG1, VCC recharge function operates and VCC pin voltage rises.
VCC > VCHG2, VCC recharge function stops.
After start of output voltage finished, VCC is charged by the auxiliary winding VCC pin stabilizes.
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BM2Pxx4 Series
(4) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)
This IC is current mode PWM control.
An internal oscillator sets a fixed switching frequency (65kHz typ).
This IC is integrated switching frequency hopping function which changes the switching frequency to fluctuate as
shown in Figure 10 below.
The fluctuation cycle is 125 Hz typ.
Switching Frequency
[kHz]
500us
69
68
67
66
65
64
63
62
61
125 Hz(8ms)
Time
Figure 10. Frequency hopping function
Max duty cycle is fixed as 75% (typ) and MIN pulse width is fixed as 400 ns (typ).
With current mode control, when the duty cycle exceeds 50% sub harmonic oscillation may occur.
As a countermeasure to this, this IC is built in slope compensation circuits.
This IC is built in burst mode circuit and frequency reduction circuit to achieve lower power consumption, when the
load is light.
FB pin is pull up by RFB (30 kΩ typ).
FB pin voltage is changed by secondary output voltage (secondary load power).
FB pin is monitored, burst mode operation and frequency detection start.
Figure 11 shows the FB voltage, and switching frequency, DCDC operation
• mode1 : Burst operation
• mode2 : Frequency reduction operation.
• mode3 : Fixed frequency operation.(operate at the max frequency)
• mode4 : Over load operation.(detect the over load state and stop the pulse operation)
Y
mode1
mode2
mode3
mode4
65kHz
25kHz
0.40V
Figure 11.
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TSZ22111 • 15 • 001
1.25V
2.00V
2.80V FB [V]
X
Switching operation state changes by FB pin voltage
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BM2Pxx4 Series
(5) Over Current limiter
This IC is built in Over Current limiter per cycle. If the SOURCE pin exceeds a certain voltage, switching is stopped.
It is also built in AC voltage compensation function. This is the function which compensates the maximum power as
the AC voltage’s change by increasing over current limiter with time.
Shown in figure-12, 13, and 14.
65kHz(15.3us)
65kHz(15.3us)
ON
[DC/DC]
@AC100V
ON
[DC/DC]
@AC100V
OFF
OFF
[DC/DC]
@AC240V
OFF
OFF
ON
ON
OFF
[DC/DC]
@AC100V
OFF
OFF
OFF
Iepak(AC)@Vin=240V
Iepak(AC)@Vin=240V
Iepak(AC)@Vin=100V
Iepak(AC)@Vin=100V
Iepak(DC)= included conpensation
Iepak(DC)＝Constant
Tdelay
Tdelay
Tdelay
Primary Peak Current
Tdelay
Primary Peak Current
Figure 12. No AC voltage compensation function
Figure13. built-in AC compensation voltage
Primary peak current is decided as the formula below.
Primary peak current: Ipeak = Vs./Rs + Vdc/Lp*Tdelay
Vcs: Over current limiter voltage internal IC, Rs: Current detection resistance, Vdc input DC voltage, Lp: Primary
inductance,
Tdelay: delay time after detection of over current limiter
Y
CS Limitter[V]
0.704V
+20mV/us
0.552V
0.400V
0.0
X
7.6us
15.3us
Time [us]
Figure 14. Over current limiter voltage
(6) L.E.B period
When the driver MOSFET is turned ON, surge current occurs at each capacitor component and drive current.
Therefore, because SOURCE pin voltage rises temporarily, the detection errors may occur in the over current limiter
circuit.
To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for 250 ns by the
on-chip LEB (Leading Edge Blanking) function.
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BM2Pxx4 Series
(7) SOURCE pin (1pin) short protection function
When the SOURCE pin (1pin) is shorted, this IC is over heat.
This IC built in short protection function to prevent destroying.
(8) SOURCE pin (1pin) open protection
If the SOURCE pin becomes OPEN this IC may be damaged.
To prevent to be damaged, this IC built in OPEN protection circuit (auto recovery protection ).
(9) Output over load protection function (FB OLP Comparator )
The output overload protection function monitors the secondary output load status at the FB pin, and stops switching
when an overload occurs. In case of an overload, the output voltage is reduced and current no longer flows to the
photo coupler, so the FB pin voltage rises. When the FB pin voltage > VFOLP1A (2.8 V typ) continuously for the period
TFOLP1 (64ms typ), it is judged as an overload and stops switching.
When the FB pin > VFOLP1A (2.8 V typ), if the voltage goes lower than VFOLP1B (2.6V typ) during the period TFOLP1 (64ms
typ), the overload protection timer is reset. The switching operation is performed during this period TFOLP1 (64ms typ).
At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of V FOLP1A (2.8 V typ)
or above. Therefore, at startup the FB voltage must be set to go to V FOLP1B (2.6 V typ) or below during the period TFOLP1
(64ms typ), and the secondary output voltage’s start time must be set within the period TFOLP1 (64ms typ) following
startup of the IC.
Recovery from the once detection of FBOLP, after the period TFOLP2 (512 ms typ)
VFOLP 1A
FB
VH
charge
charge
64ms
charge
64ms
Switching
512ms
VUVLO 1
VCHG 2
VCC
512ms
VCHG1
VUVLO 2
A
Figure 15.
B
C D
E
F
G H
Over load protection (Auto recovery)
A: The FBOLP comparator detects over load for FB>VFOLP1A
B: If the State of A continues for the period TFOLP1 (64ms typ), it is judged as an overload and stops switching after 64ms.
C: While switching stops for the over load protection function, the VCC pin voltage drops and VCC pin voltage reaches <
VCHG1, the VCC charge function operates so the VCC pin voltage rises.
D: VCC charge function stops when VCC pin voltage > VCHG2
E: If TFOLP2 (typ =512ms ) go on from B point, Switching function starts on soft start.
F: If TFOLP1 (typ=64ms ) go on from E point to continues a overload condition (FB>VFOLP1A), Switching function stops at F
point.
G: While switching stops VCC pin voltage drops to < VCHG1, VCC charge function operates and VCC pin voltage rises.
H: If VCC pin (5pin) voltage becomes over VCHG2 by the VCC charge function, VCC charge function operation stops.
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TSZ02201-0F2F0A200070-1-2
26.Oct.2021 Rev.011
BM2Pxx4 Series
Operation mode of protection circuit
Operation mode of protection functions are shown in table2.
Table2
Operation mode of protection circuit
Function
Operation mode
VCC Under Voltage Locked Out
Auto recovery
VCC Over Voltage Protection
Auto recovery
TSD
Latch (with 100us timer )
FB Over Limited Protection
SOURCE Open Protection
Auto recovery (with 64ms timer )
Auto recovery
Sequence
The sequence diagram is show in Fig 16.
All condition transits OFF Mode VCC0 .5ms
Soft Start 2
Time>1.0ms
Soft Start 3
Time >2 .0ms
VCC27 .5V
Temp>145℃
Normal MODE
LATCH OFF MODE
( Pulse Stop )
FB>2.80V
PULSE OFF
FB>2 .80 V
(64 ms)
FB0.40 V
Burst MODE
( Pulse OFF )
Figure 16. The sequence diagram
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TSZ02201-0F2F0A200070-1-2
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BM2Pxx4 Series
Thermal loss
The thermal design should set operation for the following conditions.
(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)
1. The ambient temperature Ta must be 105°C or less.
2. The IC’s loss must be within the allowable dissipation Pd.
The thermal abatement characteristics are as follows.
(PCB: 74.2 mm × 74.2mm × 1.6 mm, mounted on glass epoxy on double-layer substrate)
3000
2500
Pd[mW ]
2000
1500
1000
500
0
0
25
50
75
100
125
150
Ta[℃]
Figure 17. Thermal Abatement Characteristics
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BM2Pxx4 Series
Ordering Information
B
M
2
P
x
x
4
-
x
MOSFET ON Resistor
01: 1.4 Ω
03: 2.4 Ω
05: 4.0 Ω
09: 8.5 Ω
Outsourced Package
Z: DIP7K
ZA: DIP7WF
Blank: DIP7F
Making Diagram
DIP7K (TOP VIEW)
DIP7F (TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
DIP7WF (TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
Product Name
MOSFET ON resistor
BM2P014
BM2P034
BM2P054
BM2P094
BM2P014
BM2P034
BM2P054
BM2P094
1.4 Ω
2.4 Ω
4.0 Ω
8.5 Ω
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BM2Pxx4 Series
Physical Dimension and Packing Information
Package Name
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DIP7K
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BM2Pxx4 Series
Physical Dimension and Packing Information
Package Name
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TSZ22111 • 15 • 001
DIP7F
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26.Oct.2021 Rev.011
BM2Pxx4 Series
Physical Dimension and Packing Information
Package Name
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DIP7WF
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BM2Pxx4 Series
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the GND and supply lines of the
digital and analog blocks to prevent noise in the GND and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to GND at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
GND Voltage
Ensure that no pins are at a voltage below that of the GND pin at any time, even during transient condition.
4.
GND Wiring Pattern
When using both small-signal and large-current GND traces, the two GND traces should be routed separately but
connected to a single GND at the reference point of the application board to avoid fluctuations in the small-signal
GND caused by large currents. Also ensure that the GND traces of external components do not cause variations on
the GND voltage. The GND lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
8.
9.
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of GND wiring, and routing of connections.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, GND the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to GND, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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TSZ02201-0F2F0A200070-1-2
26.Oct.2021 Rev.011
BM2Pxx4 Series
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or GND line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin A
N
P+
N
P
N
P+
N
Parasitic
Elements
N
P+
GND
E
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
Parasitic
Elements
GND
GND
Figure 18. Example of monolithic IC structure
N Region
close-by
GND
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation
should always be within the IC’s power dissipation rating. If however the rating is exceeded for a
continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn
OFF all output pins. The IC should be powered down and turned ON again to resume normal
operation because the TSD circuit keeps the outputs at the OFF state even if the TJ falls below the
TSD threshold.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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TSZ22111 • 15 • 001
20/21
TSZ02201-0F2F0A200070-1-2
26.Oct.2021 Rev.011
BM2Pxx4 Series
Revision History
date
Rev. No.
2012.07.19
001
2013.11.18
006
2015.05.15
007
2015.09.24
008
Revision Point
New Release
P7 An explanation for Figure7
P8 An explanation for VCC_UVLO/VCC_OVP function
An explanation for Figure8
P11 An explanation for Over Current limiter
P12 An explanation for Output over load protection function
An explanation for Figure15
P13 Figure16
P13 Operation mode of protection circuit
P13 Sequence
P5 Figure3
P7 An explanation of Start sequence
P8 An explanation of VCC pin protection function
P8 An explanation of VCC UVLO / VCC OVP function
P9 An explanation of VCC Charge function
P11 An explanation of Over Current Limiter
P12 An explanation of Output over load protection function
2017.03.07
009
P1 An explanation of package height
P2 Format for Electrical Characteristics of MOSFET
P3 Format for Electrical Characteristics of Control IC
P3 An explanation of Thermal shut down temperature
P7 An explanation of Start sequences
P8 An explanation of Figure8
P9 An explanation of VCC pin protection function
P12 An explanation of OUTPUT over load protection function
2019.04.22
010
P1 Add the division of product name
P1 Add the package variation and modify the size
P16, P17 Modify the physical dimension and packing information
2021.10.26
011
P1 Add the package variation
P15 Add the package variation
P18 Add the physical dimension
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TSZ02201-0F2F0A200070-1-2
26.Oct.2021 Rev.011
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
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Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
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