BM2P063MF-ZE2

Datasheet AC/DC Converter IC PWM Type DC/DC Converter IC With Integrated Switching MOSFET BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z General Description Key Specifications The PWM Type DC/DC Converter for AC/DC provides an optimal system for all products that include an electrical outlet. This IC supports isolated power supply and enables simpler designs of various low power consumption electrical converters. It realizes the high flexibility in power supply design by incorporating a switching MOSFET and with external current detection resistor. This IC can make high efficiency power supply because it has AC low voltage protection function and X capacitor discharge function and operates frequency reduction, minimum ON width adjustment and burst operation at light load. This IC has following various protection functions. ◼ Operating Power Supply Voltage Range VCC Pin Voltage: 11 V to 60 V VH Pin Voltage: 650 V (Max) DRAIN Pin Voltage: 730 V (Max) ◼ Current at Switching Operation: BM2P060MF-Z: 1400 μA (Typ) BM2P061MF-Z: 1100 μA (Typ) BM2P063MF-Z: 850 μA (Typ) ◼ Current at Burst Operation: 400 μA (Typ) ◼ Switching Frequency: 65 kHz (Typ) ◼ Operating Temperature Range: -40 °C to +105 °C MOSFET ON Resistor: BM2P060MF-Z: 0.70 Ω (Typ) BM2P061MF-Z: 1.00 Ω (Typ) BM2P063MF-Z: 3.00 Ω (Typ) Features Package AC Low Voltage Protection Function (AC UVLO) X Capacitor Discharge Function VCC Pin Low Voltage Protection (VCC UVLO) PWM Type Current Mode Control Frequency Reduction Function Burst Operation at Light Load Burst Voltage Setting Function Minimum ON Width Adjustment at Light Load Soft Start Function FB Pin Overload Protection Function (FB OLP) Over Current Protection Function by cycle Over Current Detection Compensation Function by AC Voltage Detection ◼ External Stop Function ◼ Dynamic Over Current Protection ◼ Leading Edge Blanking Function SOP20A ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ W (Typ) x D (Typ) x H (Max) 12.8 mm x 10.3 mm x 2.65 mm Lineup Product Name BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z MOSFET ON Resistor 0.70 Ω 1.00 Ω 3.00 Ω Applications AC Adapters, Each Household Applications and Power Supplies for Motor Typical Application Circuit FUS E FIL TER SN UBB ER DIO DE BR IDG E ER RO R AM P 〇Product structure : Silicon integrated circuit www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays. 1/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Pin Configuration (TOP VIEW) 20 19 18 17 16 15 14 13 12 11 VH N.C. GND N.C. SOURCE N.C. DRAIN DRAIN DRAIN DRAIN STOP FB BURST OFF VCC N.C. DRAIN DRAIN 1 2 3 4 5 6 7 8 DRAIN 9 DRAIN 10 Pin Descriptions ESD Diode VCC GND No Pin name I/O Function 1 STOP I External stop pin - ○ 2 FB I/O Feedback pin - ○ 3 BURST I Burst setting pin - ○ 4 OFF I MIN on setting pin - ○ 5 VCC I/O Power supply input pin - ○ - - 6 N.C. 7 DRAIN 8 DRAIN 9 DRAIN 10 DRAIN 11 DRAIN 12 DRAIN 13 DRAIN 14 DRAIN 15 16 - No connection (Note 1) I/O MOSFET Drain pin - ○ N.C. - No connection (Note 1) - - SOURCE I/O MOSFET source pin - ○ (Note 1) - - ○ - - - - ○ 17 N.C. - 18 GND I/O 19 N.C. - 20 VH I No connection GND pin No connection (Note 1) AC voltage start-up pin (Note 1) The N.C. pin must be open on the board. It means not to connect GND etc. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Block Diagram FUSE AC Input Diode Bridge Filter VH VCC DRAIN Starter X-Cap Discharge Internal Reg H voltage clamp + AC voltage Detection Reg VCC CHG Reg Internal Block ROFF Min ON Setting OFF S Q Reg DRIVER R FB FBOLP RFB PWM Control FBOLP Timer + 1/AVG Dynamic Over current Protection + - Pulse counter Min ON Width Reg Current Limiter Burst Comparator Leading Edge + - + RBURST Blanking SOURCE Burst PWM Comparator Setting BURST Soft Start - AC detection Compensation + Slope Compensation STOP MAX DUTY OSC Frequency Reduction Reg RSTOP + Frequency Hopping GND STOP comparator + - www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Timer STOP 3/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Description of Blocks 1 Start-up Circuit This IC has a built-in start-up circuit. When the AC input voltage is applied, the VH pin is also applied the voltage. Then the VCC pin voltage is charged by applied current to the VCC pin through the start-up circuit. This charge is stopped after the VCC pin voltage rises and VCC UVLO is released. 2 AC UVLO (Under Voltage Lockout), X Capacitor Discharge Function AC UVLO: At start-up, the voltage occurs at the VH pin when the AC input voltage is applied. The VCC pin waits the detection of AC input voltage remaining applied voltage and IC switching is stopped until the VH pin peak voltage becomes more than VINLVP while this IC charges the VCC pin through the start-up circuit. IC does not work switching operate in AC UVLO operation. When the VH pin peak voltage is more than VINLVP, AC UVLO function is released and IC works switching operation. After stopping AC input voltage supply, the VH pin peak voltage is VINLVP or less for tINLVP, IC stops switching operation. X Capacitor Discharge Function: When the status of the VH pin peak voltage is VINLVP or less continues for tINLVP and the switching operation is stopped by AC UVLO function, X capacitor discharge function starts to operate. Since the VH pin detects the voltage change, even if the VH pin peak voltage is more than VINLVP, If the VH pin does not detect voltage rising or falling for tINLVP, IC does not work switching operation. FUSE VH VCC IVCC ISTART Start-up Circuit UVLO + - LOGIC Recharge + - Internal BLOCK MONITOR + - Timer tINLV P LOGIC X-capacitor Discharge Figure 1. Block Diagram of VH Pin and VCC Pin www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z 2 AC UVLO (Under Voltage Lockout), X Capacitor Discharge Function – continued tINLVP AC input voltage VH pin voltage VCC pin voltage VUVLO1 VCHG2 VCHG1 VUVLO2 VCC pin current ON VCC UVLO ON Switching ON X capacitor discharge function ON ON ON ON VCC recharge function B A C D E F G H I J Figure 2. Timing Chart of X Capacitor Discharge Function A: B: C: D: E: F: G: H: I: J: The AC input voltage is turned OFF. After tINLVP from A, the switching operation stops. VCC capacitor is discharged because of the VCC pin voltage more than VCHG1. When the VCC pin voltage becomes less than VCHG1, the VCC recharge operation starts. When the VCC pin voltage becomes more than VCHG2, the VCC recharge operation stops. The Same as C. The Same as D. The Same as C. The Same as D. When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates. However, the current supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low VH pin voltage. When the VCC pin voltage becomes less than VUVLO2, VCC UVLO operates. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Description of Blocks – continued VCC Pin Protection Function This IC has VCC UVLO and VCC recharge function at the VCC pin. 3 3.1 VCC UVLO (Under Voltage Lockout) This is an auto recovery comparator with a voltage hysteresis. When the VCC pin voltage becomes less than VUVLO2, the IC stops the operation. And, when the VCC pin voltage becomes more than VUVLO1, the operation is restarted. 3.2 VCC Recharge Function If the VCC pin voltage drops to less than VCHG1 after once the VCC pin becomes more than VUVLO1 and the IC starts to operate, the VCC recharge function operates. At this time, the VCC pin is recharged from the VH pin through the start-up circuit. When the VCC pin voltage becomes more than VCHG2, this recharge is stopped. VINLVP VH pin voltage AC UVLO VUVLO1 VCHG2 VCC pin voltage VCHG1 VUVLO2 VCC UVLO VCC charge VCC recharge function Switching AB C D E F G HI J Figure 3. Timing Chart of VCC UVLO and VCC Recharge Function A: B: C: D: The VH pin is applied voltage and the VCC pin voltage rises. When the VH pin voltage becomes more than VINLVP, AC UVLO is released. When the VCC pin voltage becomes more than VUVLO1, the switching operation starts. When the VCC pin voltage becomes less than VCHG1, the VCC pin is recharged from the VH pin by VCC recharge function. E: When the VCC pin voltage becomes more than VCHG2, the VCC recharge function is stopped. F: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates. G: When the VCC pin voltage becomes more than VCHG2, the VCC recharge function stops. By the operation of F and G, the VCC pin voltage is maintained constantly. H: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates. However, the current supply to the VCC pin decreases and the VCC pin voltage continues to drop because the VH pin voltage dropped. I: When the VCC pin voltage becomes less than VUVLO2, VCC UVLO operates. J: The VH pin is applied voltage and the IC operation restarts. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Description of Blocks – continued 4 DC/DC Driver Block This IC performs a current mode PWM control and it has the following characteristics. ◼ ◼ ◼ ◼ ◼ ◼ ◼ The switching frequency operates in the range of fSW2 to fSW1 by an internal oscillator. It has a built-in frequency hopping function and the fluctuation cycle is at random. It makes the EMI low by swaying the switching frequency within ±6 %. This IC controls the ON width by detecting the peak current using the SOURCE pin voltage correspond to the FB pin voltage. The SOURCE pin voltage is restricted to 1/AVG of the FB pin voltage. Maximum duty is fixed at DMAX. In the current mode control, a sub-harmonic oscillation may occur when the duty cycle exceeds 50 %. As a countermeasure, this IC has a built-in slope compensation circuit. It has a built-in burst mode and frequency reduction circuit to achieve lower power consumption at light load. The FB pin is pulled up to the internal power supply by R FB. The FB pin voltage is changed by the secondary output power. This IC monitors this and changes a switching operation status. 4.1 Transition of Switching Frequency by FB Pin Voltage IC works burst operation which moves between mode a and mode b by repetition. IC enables to set burst stop voltage at the BURST pin. VBST* means VBST1 to VBST8 and it is able to select by the BURST pin. Refer to the description of 4.6.3 about setting by AC voltage. IC does not work switching operation when the FB pin voltage is less than burst stop voltage at light load. After burst stop status, as the FB pin voltage is more than burst release voltage, IC rework switching operation. IC switching frequency increases from fsw2 to fsw1 in proportion to the FB voltage at mode c. mode a: mode b: mode c: mode d: Burst operation (Operate intermittently) Fix frequency operation (Operate for fSW2) Frequency modulated operation (Change switching frequency) Fix frequency operation (Operate for fSW1) Switching Frequency mode a mode b mode c mode d fSW1 fSW2 Switching OFF VBST* VFBSW1 VFBSW2 FB pin voltage Figure 4. State Transition of Switching Frequency www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z 4 DC/DC Driver Block - continued 4.2 Transition of SOURCE Pin Voltage by FB Pin Voltage This IC operates as shown below. Over current detection protection voltage (VOCP) means from VOCP1 to VOCP8, the value is set by AC voltage. The setting by AC voltage refers to 4.5.1. VBST* means from VBST1 to VBST8, the value is set by the BURST pin voltage. The setting by AC voltage refers to 4.6.3. mode A: mode B: mode C: Burst operation Normal load operation Overload operation (The SOURCE pin voltage is changed by the FB pin voltage.) (The SOURCE pin peak voltage is limited by VOCP. When the status continues for tFBOLP1, IC is stopped by FB OLP.) SOURCE Pin Voltage mode A mode B mode C VOCP Switching OFF FB pin voltage VBST1/ VBST2 Figure 5. State Transition of SOURCE Pin Voltage by FB Pin Voltage 4.3 Soft Start Function This function controls the over current protection voltage in order to prevent any excessive voltage or current rising at start-up. This IC enables the soft start operation by changing the over current protection voltage with time. SOURCE pin voltage SS1 SS2 VOCP x 1.00 VOCP x 0.60 VOCP x 0.30 tSS2 tSS1 Time [ms] Figure 6. Soft Start Function www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z 4 DC/DC Driver Block - continued 4.4 FB Pin Overload Protection Function (FB OLP) This IC is switched off when status that the FB pin voltage more than V FBOLP1 during tFBOLP1. When the FB pin voltage is less than VFBOLP2 during tFBOLP1, the detection timer tFBOLP1 is released. It restarts with soft start after fFBOLP2 when switching off. Output Voltage FB pin voltage VFBOLP1 VFBOLP2 tFBOLP1 tFBOLP1 tFBOLP2 FB overload detectecd Switching Figure 7. FB Overload Protection Function www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z DC/DC Driver Block – continued 4 4.5 SOURCE Pin Protection Function This IC has a built-in OCP for cycle and Dynamic OCP in the SOURCE pin. Function Table 1. Operation Status of SOURCE Pin Protection Functions Load Status at Operation to Protect Detection Voltage Operation to Protect OCP Over the peak load (Lowing the output voltage) SOURCE pin peak voltage > VOCP (VOCP: It is set from VOCP1 to VOCP8) Turned off by pulse Dynamic OCP SOURCE pin voltage is increased for CCM operation SOURCE pin peak voltage > VDOC Operate at the time of the detection in two continuations. (VDOC: set by from VDOC1 to VDOC8) Switching stop for tDOC 4.5.1 Over Current Protection function (OCP) This IC is built-in OCP function by switching cycle. As the SOURCE pin peak voltage is more than VOCP1 to VOCP8, MOSFET is turned to OFF. OCP is built-in AC voltage compensation function. IC detects the VH pin peak voltage, OCP voltage is switched from VOCP1 to VOCP8 according to Table 2. This function compensates the AC voltage dependency of overload protection power. At this time, the maximum power has the characteristics shown in Figure 9. Table 2. OCP voltage by AC voltage detection VH peak Voltage[V] OCP Symbol OCP[V] (Typ) to 85 VOCP1 0.680 85 to 127 VOCP2 0.670 127 to 170 VOCP3 0.640 170 to 212 VOCP4 0.615 212 to 255 VOCP5 0.600 255 to 297 VOCP6 0.590 297 to 339 VOCP7 0.580 339 to VOCP8 0.570 0.680 150.0 145.0 Maximum Power [W] 0.660 OCP Voltage [V] 0.640 0.620 0.600 0.580 0.560 140.0 135.0 130.0 125.0 120.0 115.0 110.0 105.0 100.0 0 100 200 300 400 500 0 VH peak Voltage [V] 100 200 300 400 500 VH peak Voltage [V] Figure 8. OCP Voltage vs VH peak Voltage Figure 9.(Note 2) Example of Maximum Power (Lp = 450 μH, Rs = 0.22 Ω) (Note 2) Figure 9 is reference graph. It changes to depend on external condition. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z 4.5 SOURCE pin protection function – continued 4.5.2 Dynamic over current protection function This IC is built-in dynamic over current protection. When the SOURCE pin voltage detects over VDOC voltage in continuous two pulses, IC stops switching operation for tDOC. 2 counts VDOC 1 2 SOURCE tDOC ON ON Switching OFF Figure 10. Dynamic OCP Timing Chart 4.5.3 Leading Edge Blanking Normally, when the MOSFET for switching is turned to ON, surge current is generated at each capacitor component and drive current and so on. At this time, detection errors may occur in the over current protection function because the SOURCE pin voltage rises temporary. To prevent these errors, Leading Edge Blanking function is built-in this IC. This function masks the SOURCE pin voltage for tLEB from the switch of the Drain pin H to L. 4.6 Minimum ON width function This IC is built-in minimum ON width function. 4.6.1 Minimum ON width switching function by FB pin pulse count of burst period Normally, the minimum ON width of this IC is tMIN1. When the operation is burst operation at light load, IC counts the number of switching from the start of switching after the burst stop is released to the burst stop again. When switching number is 3 pulses or less IC operates low stand-by mode, and IC switches minimum ON width. The switching of minimum ON width is decided from tMIN2 to tMIN4 to correspond to the OFF pin resistor value. As minimum ON width is switched, the number of switching is low. When it is low standby power mode, if the load is increased, the number of switching increases. When the number of switching after the burst operation is stopped is 2 pulses or more, the low standby power mode is switched to the normal mode. Then minimum ON width function is released, minimum ON width is to tMIN1. VCC FB VBST2 VBST1 DRAIN State NORMAL A B NORMAL Low Power C D E F G H Figure 11. MIN ON Width Function A: B: C: D: E: F: G: H: VCC voltage rises, and IC works switching operation. When the FB pin voltage is less than VBST1, IC does not work switching operation by burst function. When the FB pin voltage is more than VBST2, IC works switching operation. Because the number of switching is 3 times for one burst period, IC changes low standby mode. And pulse width is increased after the next burst release. Burst stop function is released, the minimum ON width increases. Because the power of one switching increases, pulse number is reduced. Because IC detects burst stop in the state of one switching number, IC maintains low standby mode. The burst stop is released, IC works switching operation. Because IC detects second pulse in one burst period, IC changes from low standby mode to normal mode. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z 4.6 4.6.2 Minimum ON width function - continued Minimum ON width switching function by OFF pin Minimum ON width in burst operation is able to switch external resistor at the OFF pin. IC detects the OFF pin resistor value at the timing of tSTSET2 from VCC UVLO released. Then IC sets minimum ON width below. When the OFF pin is connected to GND, MIN ON width is set to tMIN4, the number of switching pulse increases by +1. The function is reset when VCC UVLO is detected. Table 3. MIN ON Setting Width R1 (kΩ) MIN ON width OPEN 180 47 GND tMIN2 tMIN3 tMIN4 tMIN4 Number of Low Standby Mode Switching Pulse 3 3 3 4 Number of Normal Mode Switching Pulse 1 1 1 2 Reg ROFF MIN ON width Setting R1 OFF Figure 12. OFF Setting Circuit 4.6.3 BURST voltage switching function by BURST pin Burst operation voltage is able to switch external resistor at the BURST pin. IC sets the BURST voltage as follows by BURST pin voltage at the timing of tSTSET1 from VCC UVLO released. The function is reset when VCC UVLO is detected. Table 4. BURST Voltage Setting R2 (kΩ) OPEN 180 47 GND Burst Detection Voltage Symbol VBST1 VBST3 VBST5 VBST7 Burst Release Voltage Symbol VBST2 VBST4 VBST6 VBST8 Reg RBURST Burst voltage Setting R2 BURST Figure 13. BURST Setting Circuit www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Description of Blocks – continued 5 External stop function by the STOP pin This IC is switched off when status that the STOP pin voltage less than V STOP for tSTOP. This IC incorporates a mask timer of tSTOP to prevent the false detection by the noise. When the STOP pin voltage more than VSTOP, the switching is reopened. The STOP pin is pulled up in the IC inside by RSTOP. Example for use to the STOP pin The STOP pin can perform outside stop. Show a case stopping from the microcomputer of the secondary as an example in figure 14. This is stopped by transmitting a signal from the microcomputer on the secondary side to the primary side with a photocoupler. RST OP STOP + - µ-CON Figure 14. External Stop Circuit www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Operation Mode of Protection Functions The operation modes of each protection function are shown in Table 5. Table 5. Operation Modes of Protection Functions AC UVLO VCC UVLO Dynamic OCP Detection Conditions VH pin peak voltage ≤ VINLVP VCC pin voltage < VUVLO2 (voltage drop) SOURCE pin voltage > VDOC Release Conditions VH pin peak voltage > VINLVP VCC pin voltage > VUVLO1 (voltage rise) Release after past for tDOC tINLVP (VH pin peak voltage > VINLVP) – Detect continuous two pulses Auto restart Auto restart STOP FB OLP TSD (Thermal Protection) Detection Conditions STOP pin voltage < VSTOP (Voltage drop) FB pin voltage > VFBOLP1 (Voltage rise) Tj > TTSD1 (Temperature rise) Release Conditions STOP pin voltage > VSTOP (Voltage rise) Elapsed period by tFBOLP2 Tj < TTSD2 (Temperature drop) tSTOP (STOP pin voltage > VSTOP) tFBOLP1 (FB pin voltage < VFBOLP2) tTSD (Tj < TTSD2) Auto restart Auto restart Auto restart Detection Timer (Reset Conditions) Auto restart or Latch Detection Timer (Reset Conditions) Auto restart or Latch www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/28 Auto restart TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit -0.3 to +650 V DRAIN 730 V -0.3 to +6.5 V DRAIN (tpulse < 10 μs) (Note 3) SOURCE, FB, OFF, BURST, STOP VCC Maximum Applied Voltage 1 VMAX1 Maximum Applied Voltage 2 VMAX2 Maximum Applied Voltage 3 VMAX3 -0.3 to +62.0 V Maximum Applied Voltage 4 VMAX4 -0.3 to +650.0 V Drain Current 1 (Pulse) IDP1 21 A Drain Current 2 (Pulse) IDP2 12 A Drain Current 3 (Pulse) IDP3 4 A Power Dissipation Pd 2.30 W Tjmax 150 °C Tstg -55 to +150 °C Maximum Junction Temperature Storage Temperature Range Condition VH Pw = 10 µs, Duty cycle = 1 % (BM2P060MF-Z) Pw = 10 µs, Duty cycle = 1 % (BM2P061MF-Z) Pw = 10 µs, Duty cycle = 1 % (BM2P063MF-Z) (Note 4) Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 3) Duty is less than 1 % (Note 4) When IC mounted singly. Derate by 18.3 mW / °C if the IC is used in the ambient temperature 25 °C or more. Thermal Dissipation Make the thermal design so that the IC operates in the following conditions. (Because the following temperature is guarantee value, it is necessary to consider margin.) 1. The ambient temperature Ta must be 105 °C or less. 2. The IC’s loss must be the power dissipation Pd or less. The thermal abatement characteristic is as follows. (At mounting singly) 2.50 Pd [W] 2.00 1.50 1.00 0.50 0.00 0 25 50 75 100 125 150 Ta [℃ ] Figure 15. SOP20A Thermal Dissipation Characteristic www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Operating VCC Pin Voltage Range VCC 11 - V VH Pin Range at AC Voltage VH - - 60 300 VCC Pin Capacitor CVCC 4.7 - - µF VH Pin Resistor RVH - - 4.7 kΩ Operating Temperature Topr -40 - +105 °C (Note 5) V (Note 5) The recommendation maximum operating voltage shows AC 300 V which is the input AC voltage in the application. Apply the input AC voltage which is full-wave-rectified to the VH pin. Electrical Characteristics in MOSFET Part (Unless otherwise specified Tj = 25 °C, VCC = 15 V) Parameter Symbol Min Typ Max Unit 650 - - V 730 - - V Conditions Drain Voltage VDS DRAIN Pin Leak Current IDSS - - 100 μA ID = 1 mA, VGS = 0 V ID = 1 mA, VGS = 0 V tpulse < 10 μs(Note 6) VDS = 650 V, VGS = 0 V ON Resistor 1 RDS(ON)1 - 0.70 0.86 Ω BM2P060MF-Z ON Resistor 2 RDS(ON)2 - 1.00 1.35 Ω BM2P061MF-Z ON Resistor 3 RDS(ON)3 - 3.00 4.00 Ω BM2P063MF-Z (Note 6) Duty is less than 1 %. Electrical Characteristics in Start Up VH Part (Unless otherwise specified Tj = 25 °C, VCC = 15 V) Parameter Symbol Min Typ Max Unit Conditions Start-up Current ISTART1 8 15 25 mA VH = 100 V, VCC = 10 V VH Pin OFF Current ISTART2 5 12 20 μA VH = 100 V, VCC = 15 V AC UVLO Detection Voltage VINLVP 75 85 95 V Discharge ON Delay Timer tINLVP 105 150 195 ms Electrical Characteristics in Control IC Part (Unless otherwise specified Tj = -40 °C to +105 °C, VCC = 15 V) Parameter Symbol Min Typ Max Unit Current at Switching Operation 1A ION1A 900 1400 2000 μA Current at Switching Operation 1B ION1B 500 1100 1700 μA Current at Switching Operation 1C ION1C 300 850 1450 μA Current at Burst Operation ION2 250 400 550 μA BM2P060MF-Z, FB = 3.0 V (Note 7) BM2P061MF-Z, FB = 3.0 V (Note 7) BM2P063MF-Z, FB = 3.0 V (Note 7) FB = 0.2 V (Note 7) Current at STOP ISTOP 70 150 230 μA Stop by the STOP pin (Note 7) VCC UVLO Release Voltage VUVLO1 13.0 14.0 15.0 V VCC rising (Note 7) VCC UVLO Detection Voltage VUVLO2 8.2 9.0 9.8 V VCC UVLO Hysteresis VUVLO3 - 5.0 - V VCC falling (Note 7) VUVLO3 = VUVLO1 - VUVLO2 VCC Recharge Start Voltage VCHG1 9 10 11 V (Note 7) VCC Recharge Stop Voltage VCHG2 11 12 13 V (Note 7) TSD Temperature 1 TTSD1 150 - - °C TSD Temperature 2 TTSD2 - TTSD1 -25 - °C tTSD - 100 - μs TSD Timer Conditions (Note 7) (Note 7) Tj = 25 °C guaranteed. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Electrical Characteristics – continued (Unless otherwise specified, Tj = -40 °C to +105 °C, VCC = 15 V) Parameter Symbol Min Typ Max Unit Conditions Switching Frequency 1 fSW1 60 65 70 kHz Switching Frequency 2 fSW2 20 25 30 kHz Frequency Hopping Width fDEL - 4 - kHz Voltage Gain (FB/SOURCE) AVG - 5 - V/V Maximum Duty DMAX 67 75 83 % (Note 7) FB Pin Burst Voltage 1 VBST1 0.20 0.25 0.30 V FB Falling FB Pin Burst Voltage 2 VBST2 - 0.28 - V FB Rising FB Pin Burst Voltage 3 VBST3 0.25 0.30 0.35 V FB Falling FB Pin Burst Voltage 4 VBST4 - 0.33 - V FB Rising FB Pin Burst Voltage 5 VBST5 0.30 0.35 0.40 V FB Falling FB Pin Burst Voltage 6 VBST6 - 0.40 - V FB Rising FB Pin Burst Voltage 7 VBST7 0.40 0.45 0.50 V FB Falling FB Pin Burst Voltage 8 Frequency Reduction Start FB Pin Voltage Frequency Reduction End FB Pin Voltage Leading Edge Blanking Time VBST8 - 0.50 - V FB Rising VFBSW1 0.75 0.90 1.05 V (Note 7) VFBSW2 1.15 1.30 1.45 V (Note 7) tLEB - 0.25 - µs RSOCE 1.4 2.0 2.6 MΩ FB Pin Pull up Resistor RFB 24 30 36 kΩ (Note 7) Minimum ON Width 1 tMIN1 - 0.50 - µs Normal Minimum ON Width 2 tMIN2 1.30 1.50 1.70 µs OFF: OPEN (Note 7) Minimum ON Width 3 tMIN3 1.55 1.70 1.85 µs OFF: 180 kΩ (Note 7) Minimum ON Width 4 tMIN4 1.70 1.90 2.10 µs OFF: or less 47 kΩ (Note 7) DC/DC Driver Block SOURCE Pin Pull up Resistor (Note 7) FB = 3.0 V During normal operation (Note 7) DC/DC Driver Block (SOURCE Pin Over Current Protection Function) SOURCE Pin OCP Voltage 1 VOCP1 0.645 0.680 0.715 V VH peak < 85 V SOURCE Pin OCP Voltage 2 VOCP2 0.635 0.670 0.705 V 85 V < VH peak < 127 V SOURCE Pin OCP Voltage 3 VOCP3 0.605 0.640 0.675 V 127 V < VH peak < 170 V SOURCE Pin OCP Voltage 4 VOCP4 0.580 0.615 0.640 V 170 V < VH peak < 212 V SOURCE Pin OCP Voltage 5 VOCP5 0.565 0.600 0.635 V 212 V < VH peak < 255 V SOURCE Pin OCP Voltage 6 VOCP6 0.555 0.590 0.625 V 255 V < VH peak < 297 V SOURCE Pin OCP Voltage 7 VOCP7 0.545 0.580 0.615 V 297 V < VH peak < 339 V SOURCE Pin OCP Voltage 8 VOCP8 0.535 0.570 0.605 V VH peak > 339 V SOURCE Pin Dynamic OCP Voltage 1 VDOC1 0.934 1.005 1.076 V VH peak < 85 V SOURCE Pin Dynamic OCP Voltage 2 VDOC2 0.920 0.990 1.060 V 85 V < VH peak < 127 V SOURCE Pin Dynamic OCP Voltage 3 VDOC3 0.886 0.953 1.020 V 127 V < VH peak < 170 V SOURCE Pin Dynamic OCP Voltage 4 VDOC4 0.858 0.923 0.988 V 170 V < VH peak < 212 V SOURCE Pin Dynamic OCP Voltage 5 VDOC5 0.837 0.900 0.963 V 212 V < VH peak < 255 V SOURCE Pin Dynamic OCP Voltage 6 VDOC6 0.823 0.885 0.947 V 255 V < VH peak < 297 V SOURCE Pin Dynamic OCP Voltage 7 VDOC7 0.809 0.870 0.931 V 297 V < VH peak < 339 V SOURCE Pin Dynamic OCP Voltage 8 VDOC8 0.795 0.855 0.915 V VH peak > 339 V tDOC 100 160 220 µs SOURCE Pin Dynamic OCP Stop Timer (Note 7) (Note 7) Tj = 25 °C guaranteed. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Electrical Characteristics – continued (Unless otherwise specified Tj = -40 °C to +105 °C, VCC = 15 V) Parameter Symbol Min Typ Max Unit Conditions DC/DC Driver Block (Soft Start Function) Soft Start Timer 1 tSS1 1.79 2.56 3.33 ms Soft Start Timer 2 tSS2 7.17 10.24 13.31 ms DC/DC Driver Block (FB Pin Overload Protection Function) FB OLP Detection Voltage VFBOLP1 3.9 4.2 4.5 V FB OLP Release Voltage VFBOLP2 - 4.0 - V FB OLP Detection Timer tFBOLP1 60 82 104 ms (Note 7) FB OLP STOP Timer tFBOLP2 484 656 828 ms (Note 7) External Stop Function by the STOP Pin STOP Pin by Stop Voltage VSTOP 0.4 0.5 0.6 V STOP Pin Pull up Resistor RSTOP 19.4 25.9 32.3 kΩ (Note 7) STOP Detection Timer tSTOP 75 150 250 µs (Note 7) RBURST 150 200 250 kΩ (Note 7) tSTSET1 160 320 480 µs (Note 7) ROFF 150 200 250 kΩ (Note 7) tSTSET2 160 320 480 µs (Note 7) BURST Pin Setting Block BURST Pin Pull up Resistor BURST Pin External Resistor Detection Timer in Start-up OFF Pin Setting Block OFF Pin Pull up Resistor OFF Pin External Resistor Detection Timer in Start-up (Note 7) Tj = 25 °C guaranteed. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Application Examples Show a flyback circuitry example in Figure 16. Be careful that when the DRAIN voltage turn off it is occur high voltage with ringing. With this IC, it become able to operate to 730 V. FUS E FIL TER SN UBB ER DIO DE BR IDG E ER RO R AM P Figure 16. Flyback Application Diagram 730 V 650 V DRAIN 0V tpulse < 10 μs (Duty < 1 %) Figure 17. DRAIN pin Ringing Waveform www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z 2000 Current at Burst operation: ION2 [μA] Current at Switching Operation 1A: ION1A [μA] Typical Performance Curves 1800 1600 1400 1200 1000 550 475 400 325 250 800 -40 -20 0 20 40 60 80 -40 -20 100 0 20 40 60 80 100 Temperature[℃] Temperature[℃] Figure 18. Current at Switching Operation 1A vs Temperature Figure 19. Current at Burst Operation vs Temperature 72 Switching Frequency 1: fSW1 [kHz] Current at STOP: ISTOP [μA] 230 190 150 110 70 68 66 64 62 60 58 70 -40 -20 0 20 40 60 Temperature[℃] 80 100 0 20 40 60 80 100 Temperature[℃] Figure 20. Current at STOP vs Temperature www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -40 -20 Figure 21. Switching Frequency 1 vs Temperature 20/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z 15.0 VCC UVLO Detection Voltage: VUVLO2 [V] 9.8 14.5 VUVLO1 [V] VCC UVLO Release Voltage: Typical Performance Curves – continued 14.0 13.5 13.0 -40 -20 0 20 40 60 80 9.4 9.0 8.6 8.2 100 -40 -20 0 Temperature[℃] 11.0 10.5 10.0 9.5 9.0 0 20 40 60 80 100 60 80 100 13.0 12.5 12.0 11.5 11.0 -40 -20 0 20 40 60 80 100 Temperature[℃] Temperature[℃] Figure 24. VCC Recharge Start Voltage vs Temperature www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 40 Figure 23. VCC UVLO Detection Voltage vs Temperature VCC Recharge Stop Voltage: VCHG2 [V] VCC Recharge Start Voltage: VCHG1 [V] Figure 22. VCC UVLO Release Voltage vs Temperature -40 -20 20 Temperature[℃] 21/28 Figure 25. VCC Recharge Stop Voltage vs Temperature TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z 0.64 36 FB Pin Pull up Resistor: RFB [kΩ] SOURCE Pin OCP Voltage 5: VOCP5 [V] Typical Performance Curves – continued 0.62 0.60 0.58 0.56 30 27 24 -40 -20 0 20 40 60 Temperature[℃] 80 100 -40 -20 0 20 40 60 Temperature[℃] 80 100 Figure 27. FB Pin Pull up Resistor vs Temperature Figure 26. SOURCE Pin OCP Voltage 5 vs Temperature 0.40 104 FB OLP Detection Timer: tFBOLP1 [ms] FB Pin Burst Voltage 5: VBST5 [V] 33 0.38 0.36 0.34 0.32 0.30 93 82 71 60 -40 -20 0 20 40 60 80 100 0 20 40 60 80 100 Temperature[℃] Temperature[℃] Figure 28. FB Pin Burst Voltage 5 vs Temperature www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -40 -20 Figure 29. FB OLP Detection Timer vs Temperature 22/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z I/O Equivalence Circuit STOP 1 2 FB Internal Reg Internal Reg STOP FB GND GND VCC 5 6 N.C . BURST 3 Internal Reg Internal Reg BURST OFF GND GND DRAIN 7 OFF 4 8 DRAIN DRAIN DRAIN VCC GND 9 DRAIN 10 DRAIN DRAIN 13 SOURCE SOURCE GND GND DRAIN 11 DRAIN 12 DRAIN DRAIN DRAIN SOURCE SOURCE SOURCE SOURCE GND GND GND GND DRAIN 14 DRAIN N.C . 15 16 DRAIN DRAIN SOURCE Internal Reg MOSFET DRAIN SOURCE SOURCE GND GND N.C . 17 GND 18 SOURCE GND N.C . 19 20 VH VH GND - - Internal Circuit GND (Note) The N.C pin must be open on the board. It means not to connect GND etc. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 24/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Operational Notes – continued 10. Regarding the Input Pin of the IC This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Figure 30. Example of IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 25/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Ordering Information B M 2 P 0 6 x M MOSFET Ron 0: 0.70 Ω 1: 1.00 Ω 3: 3.00 Ω F Package SOP20A - ZE2 Packaging and forming specification E2: Embossed tape and reel Lineup Part Number Marking BM2P060MF BM2P061MF BM2P063MF MOSFET Ron 0.70 Ω 1.00 Ω 3.00 Ω Package SOP20A Orderable Part Number BM2P060MF-ZE2 BM2P061MF-ZE2 BM2P063MF-ZE2 Marking Diagram SOP20A (TOP VIEW) Part Number Marking LOT Number Pin 1 Mark www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 26/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Physical Dimension and Packing Information Package Name www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SOP20A 27/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z Revision History Date Revision 21.Apr.2021 001 Changes New Release www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 28/28 TSZ02201-0F1F0A200840-1-2 21.Apr.2021 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001