BM2P201W-Z

Datasheet AC/DC Convertor IC Non-isolated Type PWM DC/DC Converter IC Built-in Switching MOSFET BM2Pxx1W-Z Series General Description Key Specifications ◼ Power Supply Voltage Range DRAIN Pin: 650 V (Max) ◼ Current at Switching Operation: 850 µA (Typ) ◼ Current at Burst Operation: 450 µA (Typ) ◼ Switching Frequency: 65 kHz (Typ) ◼ Operation Temperature Range: -40 °C to +105 °C ◼ MOSFET ON Resistor: 1.5 Ω (Typ) The PWM type DC/DC converter for AC/DC provides an optimum system for all products that include an electrical outlet. It enables simpler design of a high effective converter specializing in non-isolation. By a built-in startup circuit that tolerates 650 V, this IC contributes to low power consumption. A current detection resistor as internal device realizes the small power supply designs. Since a current mode control is utilized, the current can be restricted in each cycle and an excellent performance is demonstrated in the bandwidth and transient response. The switching frequency is fixed to 65 kHz. A frequency hopping function is also on chip, and it contributes to low EMI. In addition, a built-in super junction MOSFET which tolerates 650 V makes the design easy. Package W (Typ) x D (Typ) x H (Max) DIP7K 9.27 mm x 6.35 mm x 8.63 mm pitch 2.54 mm Features ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ PWM Current Mode Method Frequency Hopping Function Burst Operation at Light Load Built-in 650 V Startup Circuit Built-in 650 V Super Junction MOSFET VCC UVLO (Under Voltage Lockout) VCC OVP (Over Voltage Protection) Over Current Detection Function per Cycle Soft Start Function Applications Household Appliances such Air-conditioners and Cleaners as LED Lights, Lineup Product Name BM2P101W-Z BM2P121W-Z BM2P131W-Z BM2P141W-Z BM2P151W-Z BM2P181W-Z BM2P201W-Z BM2P241W-Z VCC Control Voltage 10.00 V 12.00 V 13.00 V 14.00 V 15.00 V 18.00 V 20.00 V 24.80 V Typical Application Circuit VCC GND_IC VOUT DRAIN AC Input Filter DRAIN GND 〇Product structure : Silicon integrated circuit www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Pin Configuration (TOP VIEW) N.C. DRAIN N.C. DRAIN GND_IC N.C. VCC Pin Descriptions Pin No. Pin Name I/O 1 2 3 4 5 6 7 N.C. N.C. GND_IC N.C. VCC DRAIN DRAIN I/O I I/O I/O ESD Diode VCC GND_IC ✔ ✔ ✔ ✔ Function Non connection Non connection GND pin Non connection Power supply input pin MOSFET DRAIN pin MOSFET DRAIN pin Block Diagram VCC DRAIN 5 6, 7 Starter + - Thermal Pro tection + - VCC OVP VCC UVLO 100 μs Filte r Inte rnal Regula tor Internal Block Sup er Jun ction MOSFET 64 ms /512 ms Timer OLP + - S Q R + - Burst Comparator + Reference Voltage PWM Comparator PWM Control - DRIVER Dynamic Current Limitter + Log ic and Timer - Reference Voltage + + - Current Limitter Reference Voltage Lea ding-Edg e Blan kin g Time Curren t Sen sin g Soft Start Maximu m Duty Freque ncy Hoppin g OSC www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/29 GND_IC 3 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Description of Blocks 1 Back Converter This is the IC for exclusive use of non-isolated type back converter. Basic operation of back converter is shown below. 1.1 When the Switching MOSFET is ON Current IL flows to coil L and energy is stored when the MOSFET turns ON. At this moment, the GND_IC pin voltage becomes near the DRAIN pin voltage, and the diode D1 is OFF. 𝐼𝐿 = (𝑉𝐼𝑁 −𝑉𝑂𝑈𝑇 ) 𝐿 [A] × 𝑡𝑂𝑁 Where: 𝐼𝐿 is the current flowing to the coil. 𝑉𝐼𝑁 is the voltage applied to the DRAIN pin. 𝑉𝑂𝑈𝑇 is the output voltage. 𝐿 is the value of coil. 𝑡𝑂𝑁 is the term that the MOSFET is on. 4 5 VCC GND_IC 3 ON AC Input Filter VOUT Current 6 DRAIN 2 7 1 IL DRAIN GND Figure 1. Back Converter Operation (MOSFET = ON) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series 1 Back Converter – continued 1.2 When the Switching MOSFET is OFF The energy stored in the coil is output via the diode when the MOSFET turns OFF. 𝐼𝐿 = 𝑉𝑂𝑈𝑇 × 𝑡𝑂𝐹𝐹 𝐿 [A] Where: 𝐼𝐿 is the current flowing to the coil. 𝑉𝑂𝑈𝑇 is the output voltage. 𝐿 is the value of coil. 𝑡𝑂𝐹𝐹 is the term that the MOSFET is off. 4 5 VCC GND_IC 3 VOUT OFF AC Input Filter 6 DRAIN 2 7 1 IL DRAIN Current GND Figure 2. Back Converter Operation (MOSFET = OFF) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Description of Blocks – continued 2 Startup Sequences Startup sequences are shown in Figure 3. See the sections below for detailed descriptions. Voltage between DRAIN pin and GND (Note 1) VCN T VUVL O1 VCH G2 VCH G1 VUVL O2 Voltage between VCC pin and GND_IC pin tFOLP1 Voltage between VOUT and GND (Note 1) Normal Load FB OLP status which i s se t Overload Light Load IOUT Overload tFOLP2 tFOLP1 tFOLP1 Burst mode Switching A (Note 1) B C D E F G H I J K This GND does n ot mean th e G ND_IC pin of the IC. Figure 3. Startup Sequences Timing Chart A: B: The input voltage is applied to the DRAIN pin and the VCC pin voltage rises. If the VCC pin voltage exceeds VUVLO1, the IC starts to operate. And if the IC judges the other protection functions as normal condition, it starts the switching operation. The soft start function limits the over current detection voltage to prevent any excessive voltage or current rising. When the switching operation starts, the output voltage rises. C: Until the output voltage becomes a constant value or more from startup, the VCC pin voltage drops by the VCC pin current consumption. D: After the switching operation starts, it is necessary that the output voltage is set to become the rated voltage within tFOLP1. E: At light load, the IC starts the burst operation to restrict the power consumption. F: When the load exceeds a certain electric power, the IC starts the overload operation. G: If the overload status which is set lasts for tFOLP1, the switching operation is turned off. H: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates. I: When the VCC pin voltage becomes more than VCHG2, the recharge function stops operating. J: After tFOLP2 period from G, the switching operation starts. K: Same as G. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Description of Blocks – continued 3 Stop Sequences Stop sequences are shown in Figure 4. Input Voltage 0V Voltage between DRAIN pin and GND (Note 1) Voltage between VOUT and GND (Note 1) VCN T VUVL O1 VCH G2 VCH G1 VUVL O2 Voltage between VCC pin and GND_IC pin Overload Normal Load IOUT Switching A C B DE FG (Note 1) This GND does n ot mean th e G ND _IC pin of the IC. Figure 4. Stop Sequences Timing Chart A: B: C: Normal operation When the input voltage is stopped, the DRAIN pin voltage starts to drop. If the DRAIN pin voltage drops, the ON duty of the switching becomes maximum and FB OLP operates. And the VCC pin voltage starts to drop if the output voltage drops. D: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates. E: When the VCC pin voltage becomes more than VCHG2, the VCC recharge function stops operating. F: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates. However, the supply to the VCC pin decreases and the VCC pin voltage continues to drop because the DRAIN pin voltage is low. G: When the VCC pin voltage becomes less than VUVLO2, the switching operation is stopped. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Description of Blocks – continued 4 Startup Circuit This IC enables low standby electric power and high-speed startup because it has a built-in startup circuit. The current consumption after startup is only OFF current ISTART3. The startup current flows from the DRAIN pin. Startup Current 4 VCC 5 VCC UVLO + - Starter GND_IC 6 AC Input 7 Filter 3 VOUT 2 1 DRAIN GND Figure 5. Startup Circuit Startup Current [A] ISTART2 ISTART1 ISTART3 VSC VUVLO1 VCC Pin Voltage [V] Figure 6. Startup Current vs VCC Pin Voltage www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Description of Blocks – continued 5 The VCC Pin Protection Function This IC has the internal protection function at the VCC pin as shown below. 5.1 VCC UVLO/VCC OVP VCC UVLO and VCC OVP are auto recovery type comparators that have voltage hysteresis. VCC OVP has an internal mask time and its detection is performed if the condition that the VCC pin voltage is VOVP1 or more lasts for tCOMP. The recovery requirement is the VCC pin voltage becomes less than VOVP2. 5.2 VCC Recharge Function If the VCC pin voltage drops to less than VCHG1 after once the VCC pin becomes more than VUVLO1 and the IC starts to operate, the VCC recharge function operates. At this time, the VCC pin is recharged from the DRAIN pin through the startup circuit. When the VCC pin voltage becomes more than VCHG2, this recharge is stopped. Voltage between DRAIN pin and GND (Note 1) VOVP1 VOVP2 VCNT tCOMP VUVLO1 VCHG2 VCHG1 VUVLO2 Voltage between VCC pin and GND_IC pin Voltage between VOUT and GND (Note 1) ON ON VCC UVLO ON VCC OVP ON VCC recharge function ON ON Switching A (Note 1) B CD E F GH I J This GND does n ot mean th e G ND_IC pin of the IC. Figure 7. VCC UVLO/VCC OVP/VCC Recharge Function Timing Chart A: B: The input voltage is applied to the DRAIN pin and the VCC pin voltage rises. When the VCC pin voltage becomes higher than VUVLO1, the IC starts operating. And if the IC judges the other protection functions as normal condition, it starts switching operation. The soft start function limits the over current detection current value to prevent any excessive voltage or current rising. When the switching operation starts, the output voltage rises. C: When the VCC pin voltage becomes more than VOVP1, VCC OVP timer operates. D: When the condition that the VCC pin voltage is more than VOVP1 lasts for tCOMP, the IC detects VCC OVP function and stops switching operation. E: When the VCC pin voltage becomes less than VOVP2, VCC OVP is released and the switching operation restarts. F: When the input power supply is turned OFF, the DRAIN pin voltage drops. G: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function is started. H: When the VCC pin voltage becomes more than VCHG2, the VCC recharge function is stopped. I: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function is started. However, the supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low DRAIN pin voltage. J: When the VCC pin voltage becomes less than VUVLO2, VCC UVLO starts operating. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Description of Blocks – continued 6 DC/DC Driver This IC performs current mode PWM control. An internal oscillator fixes the switching frequency fSW. This IC has a built-in switching frequency hopping function. The maximum duty is DMAX. To achieve the low power consumption at light load, it also has an internal burst mode circuit. 6.1 Setting of the Output Voltage VOUT Because of adopting the non-isolated type without photo coupler, the VCC pin voltage should be set to the rated value. This VCC pin voltage means the voltage between the VCC pin and the GND_IC pin. The output voltage VOUT is defined by the formula below. The voltage when the MOSFET is off is shown in Figure 8. 𝑉𝑂𝑈𝑇 = 𝑉𝐶𝑁𝑇 − 𝑉𝐹𝐷1 + 𝑉𝐹𝐷2 [V] Where: 𝑉𝐹𝐷1 is the forward voltage of diode D1. 𝑉𝐹𝐷2 is the forward voltage of diode D2. 𝑉𝐶𝑁𝑇 is the VCC control voltage. VCNT - VFD1 D2 VCC GND_IC VOUT -VFD1 VCNT　-　VFD1 + VFD2 DRAIN AC Input Filter DRAIN D1 0V GND Figure 8. Back Converter Circuit (MOSFET = OFF) The output voltage may rise at light road because the VCC pin voltage is difference from it. In this case, the output voltage should be dropped by adjusting the value of the resistor ROUT which is connected to the VOUT. The location of the resistor ROUT is shown in Figure 9. VCC GND_IC VOUT DRAIN AC Input Filter ROUT DRAIN GND Figure 9. Location of Resistor ROUT www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series 6.1 Setting of the Output Voltage VOUT – continued This IC enables simpler constitution with a few external parts by fixing the VCC pin voltage. When adjust the output voltage, adding zener diodes makes it variable. However, it is necessary to consider the dispersion of the zener diodes. The variable output voltage is defined by the formula below. The voltage when the MOSFET is off is shown in Figure 10. 𝑉𝑂𝑈𝑇 = 𝑉𝐶𝑁𝑇 − 𝑉𝐹𝐷1 + 𝑉𝐹𝐷2 + 𝑉𝑍𝐷1 [V] Where: 𝑉𝐹𝐷1 is the forward voltage of diode D1. 𝑉𝐹𝐷2 is the forward voltage of diode D2. 𝑉𝑍𝐷1 is the zener diode ZD1 voltage. 𝑉𝐶𝑁𝑇 is the VCC control voltage. VCNT - VFD1 + VZD1 VCNT - VFD1 ZD1 D2 VCC GND_IC VOUT -VFD1 VCNT - VFD1 + VFD2 + VZD1 DRAIN AC Input Filter DRAIN D1 0V GND Figure 10. Back Converter Output Dispersion Circuit (MOSFET = OFF) 6.2 Frequency Circuit mode 1: Burst Mode mode 2: Frequency Modulation Mode mode 3: Fixed Frequency Mode mode 4: Overload Mode Switching Frequency [kHz] mode 1 (The intermittent operation starts.) (It reduces the frequency.) (It operates in the maximum frequency.) (The intermittent operation starts.) mode 2 mode 3 mode 4 65 25 Switching OFF Output Power [W] Figure 11. State Transition of Switching Frequency 6.3 Frequency Hopping Function Frequency hopping function achieves low EMI by change the frequency at random. The upper limit of the frequency’s wave width is ±6 % (Typ) for basic frequency. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series 6 DC/DC Driver – continued 6.4 Over Current Detection Function This IC has a built-in over current detection function per switching cycle. This function stops the switching operation if the coil current IL becomes IPEAK or more. Additionally, an internal current detection resistor contributes to the reduction of parts and improvement of efficiency. The peak current which the IC switches to the overload mode is determined by the formula below. 𝑃𝑒𝑎𝑘 𝑐𝑢𝑟𝑟𝑒𝑛𝑡 = 𝐼𝑃𝐸𝐴𝐾 + (𝑉𝐷𝑅𝐴𝐼𝑁 − 𝑉𝑂𝑈𝑇 ) × 𝑡𝑑𝑒𝑙𝑎𝑦 𝐿 [A] Where: 𝐼𝑃𝐸𝐴𝐾 is the over current detection current. 𝑉𝐷𝑅𝐴𝐼𝑁 is the DRAIN pin voltage. 𝑉𝑂𝑈𝑇 is the output voltage. 𝐿 is the coil value. 𝑡𝑑𝑒𝑙𝑎𝑦 is the delay time after a detection of over current. 6.5 Dynamic Over Current Detection Function This IC has a built-in dynamic over current detection function. In the case that the coil current IL exceeds IDPEAK two times consecutively, it stops the switching operation for tDPEAK. 2 counts IDPEAK 1 2 tDPEAK IL ON ON OFF Switching Figure 12. Dynamic Over Current Limiter www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series 6 DC/DC Driver – continued 6.6 Soft Start Function At startup, this function controls the over current detection current in order to prevent any excessive voltage or current rising. The details are shown in Figure 13. The IC enables the soft start operation by changing the over current detection current with time. Coil Current [A] SS1 SS2 SS3 IDPEAK IDPEAK3 IDPEAK2 IPEAK IPEAK3 IDPEAK1 IPEAK2 IPEAK1 tSS1 tSS2 tSS3 Time [ms] Figure 13. Soft Start Function 7 FB OLP (Overload Protection) FB OLP monitors load status and stops the switching operation at an overload status. In the overload condition, the output voltage drops. Therefore, the function judges the status as an overload and the switching operation stops, when the status that the electric power remains at the value set in the internal IC or more lasts for tFOLP1. The recovery after the detection of FB OLP is tFOLP2 later. 8 TSD (Thermal Shutdown) TSD stops the switching operation if the IC’s temperature becomes TSD1 or more. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Description of Blocks – continued 9 Operation Mode of Protection Function The operation modes of each protection function are shown in Table 1. Table 1. The Operation Modes of Protection Functions VCC UVLO VCC OVP TSD FB OLP Detection Requirements VCC pin voltage < VUVLO2 (at voltage dropping) VCC pin voltage ≥ VOVP1 (at voltage rising) Junction temperature ≥ TSD1 (at temperature rising) Coil current IL ≥ IPEAK Release Requirements VCC pin voltage ≥ VUVLO1 (at voltage rising) VCC pin voltage < VOVP2 (at voltage dropping) Junction temperature < TSD2 (at temperature dropping) or VCC UVLO detection Coil current IL < IPEAK or VCC UVLO detection tCOMP tCOMP tFOLP1 VCC pin voltage < VOVP2 Junction temperature < TSD2 Coil current IL < IPEAK – – – Auto recovery Auto recovery Auto recovery Detection Timer – Reset Condition Release Timer tFOLP2 Reset Condition Auto Recovery or Latch www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/29 Coil current IL ≥ IPEAK Auto recovery TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Description of Blocks – continued 10 External Components Each part should be adopted considering the input voltage and output load condition. Figure 14 shows the application circuit. D2 5 GND_IC 6 AC Input Filter CVCC 4 VCC L 3 VOUT 2 DRAIN 7 1 DRAIN CD-S D1 COUT ROUT CIN GND Figure 14. Application Circuit 10.1 Output Capacitor COUT The output capacitor COUT should be set to meet the specification of the ripple voltage and start within tFOLP1. It is recommended for COUT to be set to 100 μF or more. 10.2 Inductor L The value of inductor should be set considering the input voltage and output voltage. If the inductor value is too large, the switching operation becomes continuous mode and increases heat. And if the inductor value is too small, it is impossible that the IC controls in the ON width ≤ tMINON, so there is possibility of the over current detection in spite of the normal operation load. It is recommended for L to be set to about 270 μH to 680 μH. 10.3 VCC Pin Capacitor CVCC The VCC pin capacitor CVCC adjusts startup time of the IC and response of Error AMP. It is recommended to be set to less than about 1/100 value of COUT. 10.4 Capacitor between the DRAIN Pin and the GND_IC Pin CD-S It is recommended to be set to 22 pF or less if the capacitor is connected between the DRAIN pin and the GND_IC pin. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit Maximum Applied Voltage 1 VMAX1 -0.3 to +650 V DRAIN pin voltage Maximum Applied Voltage 2 VMAX2 -0.3 to +32 V VCC pin voltage DRAIN Pin Current (Pulse) IDD 12.00 A Consecutive operation Power Dissipation Pd 1.00 W (Note 1) Tjmax 150 °C Tstg -55 to +150 °C Maximum Junction Temperature Storage Temperature Range Conditions Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) At mounted on a glass epoxy single layer PCB (70 mm x 70 mm x 1.6 mm). Derate by 8 mW/°C if the IC is used in the ambient temperature 25 °C or above. Thermal Dissipation Make the thermal design so that the IC operates in the following conditions. (Because the following temperature is guarantee value, it is necessary to consider such as a margin.) 1. The ambient temperature must be 105 °C or less. 2. The IC’s loss must be the power dissipation Pd or less. The thermal abatement characteristic is as follows. (At mounting on a glass epoxy single layer PCB which size is 70 mm x 70 mm x 1.6 mm) 1.5 Pd [W] 1.0 0.5 0.0 0 25 50 75 100 125 150 Ta [ºC] Figure 15. Thermal Abatement Characteristic www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Power Supply Voltage Range 1 VDRAIN - 650 V Power Supply Voltage Range 2 VCC 9.50 - 10.80 V Power Supply Voltage Range 2 VCC 9.50 12.96 V Power Supply Voltage Range 2 VCC 12.00 14.04 V Power Supply Voltage Range 2 VCC 12.00 15.12 V Power Supply Voltage Range 2 VCC 12.00 16.20 V Power Supply Voltage Range 2 VCC 12.00 19.44 V Power Supply Voltage Range 2 VCC 12.00 21.60 V Power Supply Voltage Range 2 VCC 12.00 26.78 V Operating Temperature Topr -40 - +105 °C Symbol Min Typ Max Unit Voltage between DRAIN and GND_IC Pin V(BR)DDS 650 - - V ID = 1 mA, VGS = 0 V DRAIN Pin Leak Current IDSS - 0 100 μA VDS = 650 V, VGS = 0 V RDS(ON) - 1.5 2.0 Ω ID = 0.25 A, VGS = 10 V - Conditions DRAIN pin voltage VCC pin voltage (BM2P101W-Z) VCC pin voltage (BM2P121W-Z) VCC pin voltage (BM2P131W-Z) VCC pin voltage (BM2P141W-Z) VCC pin voltage (BM2P151W-Z) VCC pin voltage (BM2P181W-Z) VCC pin voltage (BM2P201W-Z) VCC pin voltage (BM2P241W-Z) Surrounding temperature Electrical Characteristics in MOSFET Part (Unless otherwise noted, Ta = 25 °C) Parameter ON Resistor Conditions Electrical Characteristics in Startup Circuit Part (Unless otherwise noted, Ta = 25 °C) Parameter Symbol Min Typ Max Unit Startup Current 1 ISTART1 0.150 0.300 0.600 mA VCC pin voltage = 0 V Startup Current 2 ISTART2 1.200 3.000 6.000 mA VCC pin voltage = 7 V OFF Current ISTART3 - 10 20 μA After UVLO is released VSC 0.500 0.800 1.200 V Startup Current Switching Voltage www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/29 Conditions TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Electrical Characteristics in Control IC Part (Unless otherwise noted, Ta = 25 °C) Parameter Symbol Min Typ Max Unit Conditions Current at Switching Operation ION1 - 850 1700 μA Current at Switching Operation ION1 - 1050 1900 μA Current at Burst Operation ION2 300 450 550 μA VCC Control Voltage VCNT 9.90 10.00 10.10 V BM2P101W-Z VCC Control Voltage VCNT 11.88 12.00 12.12 V BM2P121W-Z VCC Control Voltage VCNT 12.87 13.00 13.13 V BM2P131W-Z VCC Control Voltage VCNT 13.86 14.00 14.14 V BM2P141W-Z VCC Control Voltage VCNT 14.85 15.00 15.15 V BM2P151W-Z VCC Control Voltage VCNT 17.82 18.00 18.18 V BM2P181W-Z VCC Control Voltage VCNT 19.80 20.00 20.20 V BM2P201W-Z VCC Control Voltage VCNT 24.55 24.80 25.05 V BM2P241W-Z Circuit Current DRAIN pin = open BM2P101W-Z, BM2P121W-Z BM2P131W-Z DRAIN pin = open BM2P141W-Z, BM2P151W-Z, BM2P181W-Z, BM2P201W-Z, BM2P241W-Z Protection Function (BM2P101W-Z, BM2P121W-Z) VCC UVLO Voltage 1 VUVLO1 8.10 8.80 9.50 V At VCC pin voltage rising VCC UVLO Voltage 2 VUVLO2 6.60 7.30 8.00 V At VCC pin voltage dropping VCC UVLO Hysteresis VUVLO3 - 1.50 - V VCC Recharge Start Voltage VCHG1 7.00 7.70 8.40 V At VCC pin voltage dropping VCC Recharge Stop Voltage VCHG2 7.40 8.10 8.80 V At VCC pin voltage rising VCC Recharge Hysteresis VCHG3 0.20 0.40 0.70 V Protection Function (BM2P131W-Z, BM2P141W-Z, BM2P151W-Z, BM2P181W-Z, BM2P201W-Z, BM2P241W-Z) VCC UVLO Voltage 1 VUVLO1 10.20 11.10 12.00 V At VCC pin voltage rising VCC UVLO Voltage 2 VUVLO2 8.80 9.70 10.60 V At VCC pin voltage dropping VCC UVLO Hysteresis VUVLO3 - 1.40 - V VCC Recharge Start Voltage VCHG1 9.50 10.20 10.90 V At VCC pin voltage dropping VCC Recharge Stop Voltage VCHG2 9.90 10.60 11.30 V At VCC pin voltage rising VCC Recharge Hysteresis VCHG3 0.20 0.40 0.70 V Protection Function (Common throughout BM2Pxx1W-Z Series) VCC OVP Voltage 1 VOVP1 VCNT x 1.08 VCNT x 1.15 VCNT x 1.22 V At VCC pin voltage rising VCC OVP Voltage 2 VOVP2 - VCNT x 1.10 - V At VCC pin voltage dropping VCC OVP Hysteresis VOVP3 VCNT x 0.02 - VCNT x 0.07 V TSD Temperature 1 TSD1 120 150 180 °C At temperature rising(Note 1) TSD Temperature 2 TSD2 - 85 - °C At temperature dropping(Note 1) TSD Hysteresis TSD3 - 65 - °C (Note 1) Timer of VCC OVP and TSD tCOMP 50 100 150 μs (Note 1) Not 100 % tested. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Electrical Characteristics in Control IC Part – continued (Unless otherwise noted, Ta = 25 °C) Parameter Symbol Min Typ Max Unit Switching Frequency fSW 60 65 70 kHz Frequency Hopping Width fDEL - 4.0 - kHz Maximum Duty DMAX 35 40 45 % FB OLP ON Detection Timer tFOLP1 40 64 88 ms FB OLP OFF Timer Conditions PWM Type DC/DC Driver Block tFOLP2 332 512 692 ms Soft Start Time 1 tSS1 2.8 4.0 5.2 ms Soft Start Time 2 tSS2 5.6 8.0 10.4 ms Soft Start Time 3 tSS3 11.2 16.0 20.8 ms Over Current Detection Current IPEAK 1.310 1.460 1.610 A Over Current Detection Current 1 IPEAK1 - 1.095 - A (Note 1) (Note 2) Over Current Detection Current 2 IPEAK2 - 0.730 - A (Note 1) (Note 2) Over Current Detection Current 3 IPEAK3 - 0.365 - A (Note 1) (Note 2) Dynamic Over Current Detection Current IDPEAK 2.295 2.550 Dynamic Over Current Detection Current 1 IDPEAK1 - 0.637 - A (Note 1) (Note 2) Dynamic Over Current Detection Current 2 IDPEAK2 - 1.275 - A (Note 1) (Note 2) Dynamic Over Current Detection Current 3 IDPEAK3 - 1.912 - A (Note 1) (Note 2) Dynamic Over Current Enforced OFF Time tDPEAK 64 128 170 μs tLEB - 150 - ns (Note 1) tMINON - 300 550 ns (Note 1) Over Current Detection Block Leading Edge Blanking Time Minimum ON Width 2.805 A (Note 1) Not 100 % tested. (Note 2) Refer to Figure 13. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Typical Performance Curves (Reference Data) 600 Current at Burst Operation: ION2 [µA] Current at Switching Operation: ION1 [µA] 1200 1100 1000 900 800 700 600 500 -40 -20 0 20 40 60 80 100 120 550 500 450 400 350 300 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 16. Current at Switching Operation vs Temperature Figure 17. Current at Burst Operation vs Temperature 9.6 12.0 VCC UVLO Voltage 1: VUVLO1 [V] VCC UVLO Voltage 1: VUVLO1 [V] 0 9.4 9.2 9.0 8.8 8.6 8.4 8.2 8.0 11.5 11.0 10.5 10.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 18. VCC UVLO Voltage 1 vs Temperature (BM2P101W-Z, BM2P121W-Z) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 19. VCC UVLO Voltage 1 vs Temperature (BM2P131W-Z, BM2P141W-Z, BM2P151W-Z, BM2P181W-Z, BM2P201W-Z, BM2P241W-Z) 19/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Typical Performance Curves – continued (Reference Data) 10.5 VCC UVLO Voltage 2: VUVLO2 [V] VCC UVLO Voltage 2: VUVLO2 [V] 8.0 7.8 7.6 7.4 7.2 7.0 6.8 10.0 6.6 9.5 9.0 8.5 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 20. VCC UVLO Voltage 2 vs Temperature (BM2P101W-Z, BM2P121W-Z) Figure 21. VCC UVLO Voltage 2 vs Temperature (BM2P131W-Z, BM2P141W-Z, BM2P151W-Z, BM2P181W-Z, BM2P201W-Z, BM2P241W-Z) 3.0 3.0 VCC UVLO Hysteresis: VUVLO3 [V] VCC UVLO Hysteresis: VUVLO3 [V] 0 2.5 2.0 1.5 1.0 0.5 0.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 22. VCC UVLO Hysteresis vs Temperature (BM2P101W-Z, BM2P121W-Z) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 23. VCC UVLO Hysteresis vs Temperature (BM2P131W-Z, BM2P141W-Z, BM2P151W-Z, BM2P181W-Z, BM2P201W-Z, BM2P241W-Z) 20/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Typical Performance Curves – continued 8.4 VCC Recharge Start Voltage: V CHG1 [V] VCC Recharge Start Voltage: V CHG1 [V] (Reference Data) 8.2 8.0 7.8 7.6 7.4 7.2 7.0 -40 -20 0 10.5 10.3 10.1 9.9 9.7 9.5 20 40 60 80 100 120 -40 -20 Temperature [°C] Figure 25. VCC Recharge Start Voltage vs Temperature (BM2P131W-Z, BM2P141W-Z, BM2P151W-Z, BM2P181W-Z, BM2P201W-Z, BM2P241W-Z) 8.8 8.6 8.4 8.2 8.0 7.8 7.6 7.4 -40 -20 0 20 40 60 80 100 120 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12.0 11.5 11.0 10.5 10.0 9.5 -40 -20 Temperature [°C] Figure 26. VCC Recharge Stop Voltage vs Temperature (BM2P101W-Z, BM2P121W-Z) 20 40 60 80 100 120 Temperature [°C] VCC Recharge Stop Voltage: V CHG2 [V] VCC Recharge Stop Voltage: V CHG2 [V] Figure 24. VCC Recharge Start Voltage vs Temperature (BM2P101W-Z, BM2P121W-Z) 0 0 20 40 60 80 100 120 Temperature [°C] Figure 27. VCC Recharge Stop Voltage vs Temperature (BM2P131W-Z, BM2P141W-Z, BM2P151W-Z, BM2P181W-Z, BM2P201W-Z, BM2P241W-Z) 21/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Typical Performance Curves – continued (Reference Data) 45.0 Maximum Duty: D MAX [%] Switching Frequency: fSW [kHz] 70.0 68.0 66.0 64.0 62.0 60.0 43.0 41.0 39.0 37.0 35.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 28. Switching Frequency vs Temperature Figure 29. Maximum Duty vs Temperature 90 700 FB OLP OFF Timer: tFOLP2 [ms] FB OLP ON Detection Timer: tFOLP1 [ms] 0 80 70 60 50 40 -40 -20 0 20 40 60 80 100 120 500 400 300 -40 -20 Temperature [°C] 0 20 40 60 80 100 120 Temperature [°C] Figure 30. FB OLP ON Detection Timer vs Temperature www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 600 Figure 31. FB OLP OFF Timer vs Temperature 22/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Typical Performance Curves – continued (Reference Data) Figure 32. Over Current Detection Current vs Temperature Figure 33. Startup Current 1 vs Temperature Figure 34. Startup Current 2 vs Temperature www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series I/O Equivalence Circuit 7 DRAIN 6 DRAIN - DRAIN - 5 VCC DRAIN VCC Internal MOSFET GND_IC 1 N.C. - Internal MOSFET GND_IC 2 N.C. 3 GND_IC 4 N.C. GND_IC Non Connection www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Non Connection Non Connection 24/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 25/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Operational Notes – continued 10. Regarding the Input Pin of the IC This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage less than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Figure 35. Example of IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 26/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Ordering Information B M 2 P x x 1 W - Z VCC Control Voltage 10: 10.00 V 12: 12.00 V 13: 13.00 V 14: 14.00 V 15: 15.00 V 18: 18.00 V 20: 20.00 V 24: 24.80 V Lineup Part Number Marking BM2P101W BM2P121W BM2P131W BM2P141W BM2P151W BM2P181W BM2P201W BM2P241W Orderable Part Number VCC Control Voltage BM2P101W-Z BM2P121W-Z BM2P131W-Z BM2P141W-Z BM2P151W-Z BM2P181W-Z BM2P201W-Z BM2P241W-Z 10.00 12.00 13.00 14.00 15.00 18.00 20.00 24.80 Making Diagram DIP7K (TOP VIEW) Part Number Marking LOT Number www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 27/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Physical Dimension and Packing Information Package Name www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 DIP7K 28/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 BM2Pxx1W-Z Series Revision History Date Revision 17.Sep.2020 20.May.2022 001 002 Changes New release Deleted the word "under development" www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 29/29 TSZ02201-0F1F0A200780-1-2 20.May.2022 Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001