BM2P26CK-Z

Datasheet AC/DC Convertor IC PWM Type DC/DC Converter IC with Integrated Switching MOSFET BM2P26CK-Z Key Specifications General Description  The PWM Type DC/DC converter for AC/DC provides an optimal system for all products that include an electrical outlet. The built-in 650 V startup circuit contributes to low power consumption. Small-sized power supplies can be designed with a built-in current detection resistor for switching. Current is restricted in each cycle and excellent performance is demonstrated in bandwidth and transient response since current mode control is utilized. The switching frequency is 100 kHz by a fixed method. At light load, the switching frequency is reduced and high efficiency is achieved. A built-in frequency hopping function also contributes to low EMI. A built-in 800 V super junction MOSFET makes designs easy.     Operating Power Supply Voltage Range VCC Pin Voltage: 11.9 V to 25.5 V DRAIN Pin Voltage: 800 V (Max) VH Pin Voltage: 650 V (Max) Current at Switching Operation: 0.6 mA (Typ) Current at Burst Operation: 0.35 mA (Typ) Switching Frequency: 100 kHz (Typ) Operating Temperature Range: -40 °C to +105 °C Package DIP7K W (Typ) x D (Typ) x H (Max) 9.27 mm x 6.35 mm x 8.63 mm pitch 2.54 mm Features              PWM Current Mode Method Frequency Hopping Function Burst Operation at Light Load Frequency Reduction Function Built-in 650 V Startup Circuit Built-in 800 V Super Junction MOSFET VCC UVLO (Under Voltage Lockout) VCC OVP (Over Voltage Protection) Over Current Detection Function per Cycle Over Current Detection AC Voltage Compensation Function Soft Start Function External Latch Function X Capacitor Discharge Function Applications AC Adapters and Household Appliances Typical Application Circuit AC Input Fuse Filter Diode Bridge DRA IN DRA IN VCC 〇Product structure : Silicon integrated circuit .www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 FB Error AMP VH GND LATCH 〇This product has no designed protection against radioactive rays 1/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Pin Configuration (TOP VIEW) 1 VCC DRAIN 7 2 FB DRAIN 6 3 GND 4 LATCH VH 5 Pin Descriptions Pin No. Pin Name I/O 1 VCC I Power supply input pin Feedback signal input pin 2 FB I 3 GND I/O 4 LATCH I Function ESD Diode VCC GND ✔ - ✔ ✔ - External latch pin - ✔ GND pin 5 VH I AC voltage startup pin - ✔ 6 DRAIN I/O MOSFET DRAIN pin - ✔ 7 DRAIN I/O MOSFET DRAIN pin - ✔ www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Block Diagram Fuse AC Input Diode Bridge Filter CVCC VH Error AMP 5 1 DRAIN VCC 6, 7 Startup Circuit VCC UVLO Inte rnal Regula tor + Clamp Circuit VCC O VP + Filte r + Inte rnal Block LATCH S 4 Filte r + R Q RA Driver Super Junction MOSFET PWM Con trol Inte rnal Regula tor FB Curren t Detection FB OLP + 2 + - Filte r + Lea ding Edge Leading Edge Blanking Blan kin g Bur st Comparator 1/4 Soft Start ++ PWM Comparator AC Inp ut Compensation Maximu m Duty ++ OSC GND 3 Freque ncy Hoppin g Slop e Compensation www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Description of Blocks 1 Startup Circuit The VH pin controls the following operations. VH UVLO (When the AC input voltage becomes less than VHUVLO, it stops the switching operation.) X Capacitor Discharge Function (When the AC input voltage is not supplied, it discharges X capacitor.) It is necessary for the VH pin to be connected from both of the AC lines (L and N) through diodes. Fuse AC Input Diode Brid ge Filte r CVCC 5 VH 1 Startup Circuit VCC IVH Charge IVCC VCC UVLO Internal Block + VUVLO1 VUVLO2 Recharge + Logic VCHG1 VCHG2 Monitor + Logic tDISON2 Logic Discharge VHUVLO DRAIN 6, 7 Logic ILATCH SW1 tDISON1 LATCH Logic 4 SW2 RA Figure 1. Startup Circuit www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z 1 Startup Circuit – continued The timing chart of the X capacitor discharge operation is shown below. tDISON1 AC input voltage VH pin voltage tDISON1 LATCH pin voltage ILATC H x R A VCC pin voltage VUVL O1 VCH G2 VCH G1 VUVL O2 VCC pin current tDISON2 ON Switching ON X capacitor discharge function ON ON ON ON VCC recharge function A C B D E F G H I J K Figure 2. Timing Chart of X Capacitor Discharge Function A: The AC input voltage is turned OFF. B: After tDISON1 from A, the LATCH pin voltage falls. C: After tDISON2 from A, the switching operation stops and the X capacitor discharge function operates because of the VCC pin voltage > VCHG1. D: When the VCC pin voltage becomes less than VCHG1, the VCC recharge operation starts. E: When the VCC pin voltage becomes more than VCHG2, the VCC recharge operation stops. F: Same as D. G: Same as E. H: Same as D. I: Same as E. J: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates. However, the current supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low VH pin voltage. K: When the VCC pin voltage becomes less than VUVLO2, VCC UVLO operates. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Description of Blocks – continued 2 Startup Sequence The startup sequence is shown in Figure 3. See the sections below for detailed descriptions. VH pin voltage VCC pin voltage VUVL O1 VCH G2 VCH G1 VUVL O2 tFOLP2 tFOLP1 FB pin voltage tFOLP1 VFOL P1 VFOL P2 VBST2 VBST1 tFOLP1 Output voltage Normal Load Overload Output current ON Light Load tFOLP1 Burst mode ON Overload tFOLP2 tFOLP1 ON Switching tFOLP2 A B C D E F G H I J K Figure 3. Timing Chart of Startup Sequences A: B: C: D: E: F: G: H: I: J: K: The VH pin voltage is applied and the VCC pin voltage rises. If the VCC pin voltage becomes more than VUVLO1, the IC starts to operate. And if the IC judges the other protection functions as normal condition, it starts the switching operation. The soft start function limits the over current detection current to prevent any excessive voltage or current rising. When the switching operation starts, the output voltage rises. Until the output voltage becomes a constant value or more from startup, the VCC pin voltage drops by the VCC pin current consumption. After the switching operation starts, it is necessary that the output voltage is set to become the rated voltage within tFOLP1. At light load, the burst operation starts to reduce the power consumption if the FB pin voltage becomes less than VBST1. When the FB pin voltage becomes more than VFOLP1, the IC starts the overload operation. When the condition that the FB pin voltage > VFOLP1 continues for tFOLP1, the switching stops for tFOLP2 period by FB OLP. (If the FB pin voltage becomes less than VFOLP2, FB OLP ON detection timer tFOLP1 is reset.) When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates. When the VCC pin voltage becomes more than VCHG2, the VCC recharge function stops operating. After tFOLP2 period from G, the switching operation starts. Same as G. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Description of Blocks – continued 3 4 VCC Pin Protection Function This IC has the internal protection functions at the VCC pin as shown below. 3.1 VCC UVLO This is an auto recovery comparator with a voltage hysteresis. 3.2 VCC OVP This is a latch type comparator. VCC OVP has a built-in mask time and it detects when the condition the VCC pin voltage > VOVP continues for tLATCH. Surges occurring at the pin is masks by this function. 3.3 VCC Recharge Function If the VCC pin voltage drops to less than VCHG1 after once the VCC pin becomes more than VUVLO1 and the IC starts to operate, the VCC recharge function operates. At this time, the VCC pin is recharged from the VH pin through the startup circuit. When the VCC pin voltage becomes more than VCHG2, this recharge is stopped. 3.4 TSD (Thermal Shutdown) TSD stops the switching operation if the junction temperature becomes more than T SD1. DC/DC Driver Block This IC performs a current mode PWM control and it has the following characteristics.  The switching frequency is fixed at fSW1 by an internal oscillator. It has a built-in frequency hopping function and the fluctuation cycle is at random. It makes the EMI low by changing the switching frequency at random. The fluctuation width of frequency is within ±6 % for the fundamental frequency.  Maximum duty is fixed at DMAX.  In the current mode control, a sub-harmonic oscillation may occur when the duty cycle exceeds 50 %. As a countermeasure, this IC has a built-in slope compensation circuit.  It has a built-in burst mode and frequency reduction circuits to achieve lower power consumption at light load.  The FB pin is pulled up to the internal power supply by RFB.  The FB pin voltage is changed by the secondary output voltage. This IC monitors the FB pin voltage and changes a switching operation status. mode 1: Burst Operation mode 2: Fixed Frequency Operation mode 3: Frequency Modulation Operation mode 4: Fixed Frequency Operation mode 5: Overload Operation (The intermittent operation starts.) (It operates in fSW2.) (It modulates the frequency.) (It operates in fSW1.) (The intermittent operation starts.) Switching Frequency mode 1 mode 2 mode 3 mode 4 mode 5 fSW1 fSW2 Switching OFF VBST1 VBST2 VDLT2 VDLT1 VFOLP1 VFOLP2 FB pin voltage Figure 4. State Transition of Switching Frequency www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z 4 DC/DC Driver Block – continued 4.1 Soft Start Function At startup, this function controls the over current detection current in order to prevent any excessive voltage or current rising. This IC enables soft start operation by changing the over current detection current with time. Coil Current I L SS1 SS2 IPEAK1 IPEAK1 x 0.75 IPEAK1 x 0.50 Time 2.0 4.0 [ms] Figure 5. Soft Start Function 4.2 FB OLP (Overload Protection) FB OLP is the function that monitors the secondary output load status at the FB pin voltage and stops the switching operation at the overload status. At the overload status, the FB pin voltage rises because current does not flow to the photocoupler because of a drop of the output voltage. When the condition that the FB pin voltage > VFOLP1 continues for longer than tFOLP1, it is judged as the overload status and the switching operation stops. If the FB pin voltage falls to less than V FOLP2 within tFOLP1 from the status that the FB pin voltage > VFOLP1, FB OLP ON detection timer is reset. At startup, the FB pin is pulled up to the IC’s internal voltage, so the operation starts from the voltage more than VFOLP1. Therefore, it is necessary to set the startup time within t FOLP1 so that the FB pin voltage becomes less than VFOLP2. Recovery from the detection of overload status is after tFOLP2. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Description of Blocks – continued 5 Over Current Detection Block 5.1 Over Current Detection Function This IC has a built-in over current detection function per switching cycle. This function stops the switching operation if the coil current IL becomes IPEAK or more. It also has a built-in AC voltage compensation function. This function makes IPEAK (DC) increase with time. fSW1 fSW1 ON Switching (AC100 V) ON Switching (AC100 V) OFF OFF ON Switching (AC240 V) OFF OFF ON Switching (AC240 V) OFF OFF OFF OFF IPEAK (AC) VIN = 240 V IPEAK (AC) VIN = 240 V VIN = 100 V VIN = 100 V IPEAK (DC) compensated constant IPEAK (DC) Primary Peak Current Primary Peak Current tDELAY tDELAY tDELAY Figure 6. Without the AC Voltage Compensation Function tDELAY Figure 7. With the AC Voltage Compensation Function The peak current entering overload mode is calculated using the formula below. 𝑃𝑒𝑎𝑘 𝑐𝑢𝑟𝑟𝑒𝑛𝑡 = 𝐼𝑃𝐸𝐴𝐾 + Where: 𝐼𝑃𝐸𝐴𝐾 𝑉𝐷𝐶 𝐿 𝑡𝐷𝐸𝐿𝐴𝑌 𝑉𝐷𝐶 × 𝑡𝐷𝐸𝐿𝐴𝑌 𝐿 [A] is the over current detection current. is the DC voltage between both ends of coil. is coil value. is the delay time after the over current detection. Coil Current IPEAK2 IPEAK1 0.0 10.0 Time [μs] Figure 8. Over Current Detection Voltage www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z 5 Over Current Detection Block – continued 5.2 Dynamic Current Detection Function This IC has a built-in dynamic over current detection function. In the case that the coil current I L exceeds IDPEAK two times consecutively, it stops the switching operation for tDPEAK. 2 counts IDPEAK 1 2 tDPEAK Coil Current IL ON ON OFF Switching Figure 9. Dynamic Current Detection Function 5.3 Leading Edge Blanking Function Normally, when the MOSFET for driver is turned ON, surge current is generated at each capacitor component and drive current and so on. At this time, detection errors may occur in the over current detection function because the coil current IL rises. To prevent these errors, Leading Edge Blanking function is built in this IC. This function masks the coil current IL for tLEB from the time the DRAIN pin voltage switches H to L. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Description of Blocks – continued 6 LATCH Pin Operation The LATCH pin has the external latch function and operates as a power supply source for LED. 6.1 Transition of Status by AC Input Voltage The AC input voltage is monitored by the VH pin. The transition of the IC’s status depends on whether VH UVLO is detected or not. Table 1. Transition of Status VH UVLO LATCH Pin Status SW1 SW2 Not detected Current pull-up (ILATCH) OFF ON Detected Resistor pull-down (RLATCH) ON OFF 6.1.1 When a LED is Connected to the LATCH Pin Internal Regulator Internal Regulator ILATCH ILATCH SW2 ON SW2 OFF Current + - LATCH ｔLATCH VLATCH LED ON + - LATCH ｔLATCH VLATCH LED OFF SW1 OFF Figure 10. VH UVLO is not Detected SW1 ON Figure 11. VH UVLO is Detected 6.1.2 When Use the External Latch Function with a Photocoupler Internal Regulator Internal Regulator VCC VCC ILATCH ILATCH SW2 ON (No te 1) PC OFF LATCH + - ｔLAT CH LATCH + - VLAT CH VLAT CH SW1 OFF SW1 OFF (Note 1) Photocoupler ｔLAT CH (Note 1) Photocoupler Figure 12. LATCH Pin is not Connected to VCC Pin www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SW2 ON (No te 1) PC ON 11/28 Figure 13. LATCH Pin is Connected to VCC Pin TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z 6 LATCH Pin Operation – continued 6.2 External Latch Function If the condition of the LATCH pin voltage > VLATCH continues for more than tLATCH, the IC is latched off. VLATCH continues for more than tLATCH. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Description of Blocks – continued 7 Operation Mode of Protection Functions The operation modes of each protection function are shown in Table 2. Table 2. Operation Modes of Protection Functions VCC UVLO VCC OVP TSD Detection Conditions VCC pin voltage < VUVLO2 (at voltage falling) VCC pin voltage > VOVP (at voltage rising) Junction Temperature > TSD1 (at temperature rising) Release Conditions VCC pin voltage > VUVLO1 (at voltage rising) VCC pin voltage < VRESET (at voltage falling) Junction Temperature < TSD2 (at temperature falling) or VCC UVLO detection tLATCH tLATCH (VCC pin voltage < VRESET) (Junction Temperature < TSD2) – – – Auto Recovery Latch Auto Recovery FB OLP VH UVLO External LATCH Detection Conditions FB pin voltage > VFOLP1 (at voltage rising) VH pin voltage < VHUVLO LATCH pin voltage > VLATCH Release Conditions FB pin voltage < VFOLP2 (at voltage falling) or VCC UVLO detection VH pin voltage ≥ VHUVLO or VCC UVLO detection LATCH pin voltage ≤ VLATCH Detection Timer tFOLP1 tDISON2 tLATCH (Reset Conditions) (FB pin voltage < VFOLP2) (VH pin voltage ≥ VHUVLO) (VCC pin voltage < VRESET) Release Timer tFOLP2 – – (Reset Conditions) (FB pin voltage > VFOLP1) Auto Recovery or Latch Auto Recovery Auto Recovery Latch Detection Timer – (Reset Conditions) Release Timer (Reset Conditions) Auto Recovery or Latch www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit Maximum Applied Voltage 1 VMAX1 -0.3 to +650 V VH pin voltage Maximum Applied Voltage 2 VMAX2 -0.3 to +800 V DRAIN pin voltage Maximum Applied Voltage 3 VMAX3 -0.3 to +6.5 V FB pin voltage Maximum Applied Voltage 4 VMAX4 -0.3 to +32 V VCC pin voltage Maximum Applied Voltage 5 VMAX5 -0.3 to +32 V LATCH pin voltage Drain Current (Pulse) IDD 3.0 A PW = 10 μs, Duty cycle = 1 % Power Dissipation Pd 1.00 W (Note 1) Tjmax +150 °C Tstg -55 to +150 °C Maximum Junction Temperature Storage Temperature Range Caution 1: Caution 2: (Note 1) Conditions Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. At mounted on a glass epoxy single layer PCB (74.2 mm x 74.2 mm, 1.6 mm). Derate by 8 mW/°C if the IC is used in the ambient temperature Ta 25 °C or above. Thermal Dissipation Make the thermal design so that the IC operates in the following conditions. (Because the following temperature is guarantee value, it is necessary to consider margin.) 1. The ambient temperature Ta must be 105 °C or less. 2. The IC’s loss must be the power dissipation Pd or less. The thermal abatement characteristic is as follows. (At mounting on a glass epoxy single layer PCB which size is 74.2 mm x 74.2 mm x 1.6 mm) 1.5 Pd [W] 1.0 0.5 0.0 0 25 50 75 100 125 150 Ta [ºC] Figure 15. DIP7K Thermal Dissipation Characteristic www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Recommended Operating Condition Parameter Symbol Min Typ Max Unit Conditions Operating Power Supply Voltage Range 1 VH - - 650 V VH pin voltage Operating Power Supply Voltage Range 2 VDRAIN - - 800 V DRAIN pin voltage Operating Power Supply Voltage Range 3 Operating Temperature VCC 11.9 - 25.5 V VCC pin voltage Topr -40 - +105 °C Symbol Min Typ Max Unit V(BR)DS IDSS RDS(ON) 800 - 6.0 100 8.4 V μA Ω Symbol Min Typ Max Unit Startup Current ISTART1 1.50 5.50 10.20 mA VH Pin OFF Current ISTART2 5 10 20 μA VH UVLO Voltage VHUVLO 65 80 95 V Discharge ON Delay Time 1 tDISON1 102 130 158 ms Discharge ON Delay Time 2 tDISON2 204 260 316 ms Symbol Min Typ Max Unit Current at Switching Operation ION1 - 0.60 1.20 mA Current at Burst Operation ION2 0.20 0.35 0.50 mA OFF Current IOFF 10 20 30 μA Electrical Characteristics in MOSFET Part (Unless otherwise noted, Ta = 25 °C, VCC = 15 V) Parameter DRAIN Pin Voltage DRAIN Pin Leak Current ON Resistance Conditions ID = 1 mA, VGS = 0 V VDS = 800 V, VGS = 0 V ID = 0.25 A, VGS = 10 V Electrical Characteristics in Startup Circuit Part (Unless otherwise noted, Ta = 25 °C, VCC = 15 V) Parameter Conditions VH pin voltage = 100 V VCC pin voltage = 10 V VH pin voltage = 100 V Electrical Characteristics in Control IC Part (Unless otherwise noted, Ta = 25 °C, VCC = 15 V) Parameter Conditions Circuit Current www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/28 FB pin voltage = 2.0 V DRAIN pin: open FB pin voltage = 0.0 V At startup and VCC pin voltage = 14.5 V TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Electrical Characteristics in Control IC Part – continued (Unless otherwise noted, Ta = 25 °C, VCC = 15 V) Parameter Symbol Min Typ Max Unit Conditions VCC UVLO Voltage 1 VUVLO1 14.50 15.50 16.50 V At VCC pin voltage rising VCC UVLO Voltage 2 VUVLO2 9.50 10.20 10.90 V At VCC pin voltage falling VCC UVLO Hysteresis VUVLO3 - 5.30 - V VUVLO3 = VUVLO1 - VUVLO2 VOVP 26.0 27.5 29.0 V At VCC pin voltage rising VCC Pin Protection Function VCC OVP Voltage Latch Released VCC Pin Voltage VRESET - VUVLO2-0.5 - V VCC Recharge Start Voltage VCHG1 10.20 11.20 12.20 V VCC Recharge Stop Voltage VCHG2 14.00 15.00 16.00 V Latch Mask Time tLATCH 50 100 150 μs TSD Temperature 1 TSD1 120 145 170 °C At temperature rising (Note 1) TSD Temperature 2 TSD2 90 115 140 °C At temperature falling Switching Frequency 1 fSW1 94 100 106 kHz Switching Frequency 2 fSW2 30 45 60 kHz Frequency Hopping Width fDEL - 6.0 - kHz Maximum Duty Frequency Reduction Start FB Pin Voltage Frequency Reduction End FB Pin Voltage FB Pin Burst Voltage 1 DMAX 65 75 85 % VDLT1 1.14 1.24 1.34 V VDLT2 0.88 0.98 1.08 V VBST1 0.70 0.80 0.90 V At FB pin voltage falling FB Pin Burst Voltage 2 VBST2 0.76 0.86 0.96 V At FB pin voltage rising FB Pin Pull-up Voltage VFB 3.92 4.00 4.08 V FB Pin Pull-up Resistance RFB 23 30 37 kΩ FB OLP Voltage 1 VFOLP1 2.50 2.80 3.10 V At FB pin voltage rising FB OLP Voltage 2 VFOLP2 2.30 2.60 2.90 V At FB pin voltage falling FB OLP ON Detection Timer tFOLP1 40 64 88 ms FB OLP OFF Timer tFOLP2 332 512 692 ms Over Current Detection Current 1 IPEAK1 0.110 0.130 0.150 A tON = 0 μs Over Current Detection Current 2 IPEAK2 0.192 0.240 0.288 A tON = 10 μs Over Current Detection Delay Time Dynamic Over Current Detection Current Dynamic Over Current Detection Time tPEAK - 300 - ns IDPEAK - IPEAK1 x 2 - A tDPEAK 70 128 160 μs tLEB - 300 - ns VLATCH 7.80 8.50 9.20 V LATCH Pin Pull-up Current ILATCH 250 320 390 μA LATCH Pin Pull-down Resistance RLATCH 120 215 300 Ω (Note 1) DC/DC Driver Block Over Current Detection Block Leading Edge Blanking Time (Note 1) (Note 1) External Latch Function Block External Latch Detection Voltage (Note 1) Not 100 % tested. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Typical Performance Curves (Reference Data) Current at Burst Operation: ION2 [mA] Current at Switching Operation: ION1 [mA] 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 -40 -20 0 0.5 0.4 0.3 0.2 0.1 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 16. Current at Switching Operation vs Temperature Figure 17. Current at Burst Operation vs Temperature 16.5 11.0 VCC UVLO Voltage 2: VUVLO2 [V] VCC UVLO Voltage 1: VUVLO1 [V] 0 16.0 15.5 15.0 14.5 10.5 10.0 9.5 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 18. VCC UVLO Voltage 1 vs Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 19. VCC UVLO Voltage 2 vs Temperature 17/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Typical Performance Curves – continued (Reference Data) Latch Released VCC Pin Voltage: VRESET [V] VCC OVP Voltage: VOVP [V] 30.0 29.0 28.0 27.0 26.0 25.0 11.0 10.5 10.0 9.5 9.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] Figure 20. VCC OVP Voltage vs Temperature 20 40 60 80 100 120 Temperature [°C] Figure 21. Latch Released VCC Pin Voltage vs Temperature 110.0 60.0 Switching Frequency 2: fSW2 [kHz] Switching Frequency 1: fSW1 [kHz] 0 105.0 100.0 95.0 90.0 55.0 50.0 45.0 40.0 35.0 30.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 22. Switching Frequency 1 vs Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 23. Switching Frequency 2 vs Temperature 18/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Typical Performance Curves – continued (Reference Data) 1.00 FB Pin Burst Voltage 2: VBST2 [V] FB Pin Burst Voltage 1: VBST1 [V] 1.00 0.95 0.90 0.85 0.80 0.75 0.70 0.95 0.90 0.85 0.80 0.75 0.70 -40 -20 0 20 40 60 80 100 120 -40 -20 20 40 60 80 100 120 Temperature [°C] Temperature [°C] Figure 24. FB Pin Burst Voltage 1 vs Temperature Figure 25. FB Pin Burst Voltage 2 vs Temperature 3.00 3.00 FB OLP Voltage 2: VFOLP2 [V] FB OLP Voltage 1: VFOLP1 [V] 0 2.90 2.80 2.70 2.60 2.50 2.90 2.80 2.70 2.60 2.50 2.40 2.30 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 26. FB OLP Voltage 1 vs Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 27. FB OLP Voltage 2 vs Temperature 19/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Typical Performance Curves – continued (Reference Data) 600 FB OLP OFF Timer: tFOLP2 [ms] FB OLP ON Detection Timer: tFOLP1 [ms] 80 70 60 50 40 550 500 450 400 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 28. FB OLP ON Detection Timer vs Temperature Figure 29. FB OLP OFF Timer vs Temperature 0.20 Over Current Detection Current 2: IPEAK2 [A] Over Current Detection Current 1: IPEAK1 [A] 0 0.15 0.10 0.05 0.30 0.28 0.26 0.24 0.22 0.20 0.18 0.16 0.14 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 30. Over Current Detection Current 1 vs Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 31. Over Current Detection Current 2 vs Temperature 20/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Typical Performance Curves – continued 100.0 VH Pin Current (at 300 V): IVH2 [μA] VH Pin Current (at 100 V): IVH1 [μA] (Reference Data) 80.0 60.0 40.0 20.0 0.0 -40 -20 0 100.0 80.0 60.0 40.0 20.0 0.0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 32. VH Pin Current (at 100 V) vs Temperature Figure 33. VH Pin Current (at 300V) vs Temperature 160 320 Discharge ON Delay Time 2: tDISON2 [ms] Discharge ON Delay Time 1: tDISON1 [ms] 0 150 140 130 120 110 100 300 280 260 240 220 200 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 34. Discharge ON Delay Time 1 vs Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 35. Discharge ON Delay Time 2 vs Temperature 21/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Typical Performance Curves – continued (Reference Data) 500 LATCH Pin Pull-up Current: ILATCH [μA] Extarnal Latch Detection Voltage: VLATCH [V] 10.0 9.5 9.0 8.5 8.0 7.5 7.0 400 300 200 100 0 -40 -20 0 20 40 60 80 100 120 -40 -20 0 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 36. External Latch Detection Voltage vs Temperature Figure 37. LATCH Pin Pull-up Current vs Temperature LATCH Pin Pull-down Resistance: RLATCH [Ω] 900 800 700 600 500 400 300 200 100 0 -40 -20 0 20 40 60 80 100 120 Temperature [°C] Figure 38. LATCH Pin Pull-down Resistance vs Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z I/O Equivalence Circuit 7 DRAIN 6 - DRAIN DRAIN - VH DRAIN Internal MOSFET Internal Circuit Internal MOSFET GND 1 VH 5 GND GND 2 VCC 3 FB 4 LATCH VCC VCC VCC GND VCC LAT CH FB GND GND GND www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 GND 23/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 24/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Operational Notes – continued 10. Regarding the Input Pin of the IC This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Figure 39. Example of IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 25/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Ordering Information B M 2 P 2 6 C K - Z Marking Diagram DIP7K (TOP VIEW) Part Number Marking B M2 P 2 6 C K www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 LOT Number 26/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Physical Dimension and Packing Information Package Name www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 DIP7K 27/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 BM2P26CK-Z Revision History Date Rev. 11.Jul.2019 001 Changes New Release www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 28/28 TSZ02201-0F1F0A200430-1-2 11.Jul.2019 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001