Datasheet
AC/DC Converter IC
Non-isolated Type PWM DC/DC Converter IC
Built-in Switching MOSFET
BM2Pxx1Y-Z Series
General Description
Key Specifications
The PWM type DC/DC converter for AC/DC provides an
optimum system for all products that include an
electrical outlet. It enables simpler design of a high
effective converter specializing in non-isolation.
By a built-in startup circuit that tolerates 650 V, this IC
contributes to low power consumption. A current
detection resistor as internal device realizes the small
power supply designs. Since a current mode control is
utilized, the current can be restricted in each cycle and
an excellent performance is demonstrated in the
bandwidth and transient response. The switching
frequency is fixed to 25 kHz / 65 kHz. A frequency
hopping function is also on chip, and it contributes to
low EMI. In addition, a built-in super junction MOSFET
with 650 V withstand voltage makes the design easy.
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Power Supply Voltage Range
VCC Pin:
11.10 V to 26.00 V
DRAIN Pin:
730 V (Max)
Current at Switching Operation:
650 μA (Typ)
Current at Burst Operation:
350 μA (Typ)
Switching Frequency:
25 kHz / 65 kHz (Typ)
Operation Temperature Range: -40 °C to +105 °C
MOSFET ON Resistor:
1.2 Ω (Typ)
Package
W (Typ) x D (Typ) x H (Max)
9.27 mm x 6.35 mm x 8.63 mm
pitch 2.54 mm
DIP7K
Features
◼
◼
◼
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◼
◼
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◼
◼
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PWM Current Mode Method
Frequency Hopping Function
Burst Operation at Light Load
Built-in 650 V Startup Circuit
Built-in 650 V Super Junction MOSFET
VCC UVLO (Under Voltage Lockout)
VCC OVP (Over Voltage Protection)
Over Current Detection Function per Cycle
Soft Start Function
Sleep Mode
Lineup
Applications
◼
Product
Name
Switching
Frequency
Frequency
Reduction
BM2PAA1Y-Z
65 kHz
Yes
BM2PAB1Y-Z
25 kHz
No
BM2PDA1Y-Z
65 kHz
Yes
BM2PDB1Y-Z
25 kHz
No
Over
Current
Detection
Current
1.76 A
0.93 A
Household Appliances such as Washing Machines,
Air-conditioners, and Cleaners
Typical Application Circuit
VCC
SLEEP
Signal
FB
GND_IC
L
VOUT
DRAIN
AC
Input
Filter
DRAIN
GND
〇Product structure : Silicon integrated circuit
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〇This product has no designed protection against radioactive rays.
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Pin Configuration
7
1
6
2
3
5
4
Pin Descriptions
Pin No.
Pin Name
I/O
1
2
3
4
5
6
7
N.C.
SLEEP
GND_IC
FB
VCC
DRAIN
DRAIN
I
I/O
I
I
I/O
I/O
ESD Diode
VCC
GND_IC
✔
✔
✔
✔
✔
✔
Function
Non connection
Sleep/Normal mode exchange control
GND pin
Output voltage feedback pin
Power supply input pin
MOSFET DRAIN pin
MOSFET DRAIN pin
Block Diagram
VCC
DRAIN
5
Starter
VCC UVLO
・・・
・・・
Reference
Voltage
Reference
Voltage
Sleep
Comparator
+
-
4
Clamper
ｔCOMP
Filte r
Inte rnal
Regula tor
Gate
Clamper
VCC OVP
Internal Block
ｔFOL P1
/ｔFOL P2
Timer
OLP
Reference
Voltage
+
-
Reference
Voltage
+
-
+
-
Reference
Voltage
FB
+
-
Reference
Voltage
+
Burst
Comparator
PWM
Comparator
R
PWM
Control
-
Current
Limitter
ｔSLEE P1
Timer
Q
DRIVER
Dynamic Current
Limitter
Log ic
and
Timer
Sleep/Normal
2
Sup er Jun ction
MOSFET
S
+
-
Reference
Voltage
+
SLEEP
6,7
+
-
Reference
Voltage
Lea ding-Edg e
Blan kin g Time
Curren t
Sen sin g
Soft Start
+
Reference
Voltage
Maximu m
Duty
Thermal
Pro tection
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GND_IC
Freque ncy
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BM2Pxx1Y-Z Series
Description of Blocks
1
Buck Converter
This IC is for exclusive use of non-isolated type buck converter.
Basic operations of buck converter are as shown below.
1.1
When the Switching MOSFET is ON
Current IL flows to coil L and energy is stored when the MOSFET turns ON. At this moment, the GND_IC pin
voltage becomes near the DRAIN pin voltage, and the diode D1 is OFF.
In discontinuous mode, the formula of IL when MOSFET turns ON is as shown below.
𝐼𝐿 =
(𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇 )
× 𝑡𝑂𝑁
𝐿
[A]
Where:
𝐼𝐿 is the current flowing to the coil.
𝑉𝐼𝑁 is the voltage applied to the DRAIN pin.
𝑉𝑂𝑈𝑇 is the output voltage.
𝐿 is the inductance value of coil.
𝑡𝑂𝑁 is the time after MOSFET turns on.
VCC
Signal
FB
SLEEP
L
GND_IC
VOUT
ON
IL
DRAIN
AC
Input
Filter
DRAIN
Current
D1
GND
Figure 1. Buck Converter Operation (MOSFET = ON)
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1
Buck Converter – continued
1.2
When the Switching MOSFET is OFF
The energy stored in coil L is output via diode D1 when the MOSFET turns OFF.
In discontinuous mode, the formula of IL when MOSFET turns OFF is as shown below.
𝐼𝐿 =
𝑉𝑂𝑈𝑇
× 𝑡𝑂𝐹𝐹
𝐿
[A]
Where:
𝐼𝐿 is the current flowing to the coil.
𝑉𝑂𝑈𝑇 is the output voltage.
𝐿 is the inductance value of coil.
𝑡𝑂𝐹𝐹 is the time from the MOSFET turns off to IL becomes 0.
VCC
Signal
FB
L
GND_IC
SLEEP
VOUT
OFF
IL
DRAIN
AC Input
Filter
DRAIN
D1
Current
GND
Figure 2. Buck Converter Operation (MOSFET = OFF)
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Description of Blocks – continued
2
Startup Sequences
Startup sequences are as shown in Figure 3.
See the sections below for detailed descriptions.
Voltage between
DRAIN pin and GND
(Note 1)
VCNT
(Note 2)
VUVL O1
VCH G2
VCH G1
VUVL O2
Voltage between
VCC pin and GND_IC pin
tFOLP1
Voltage between
VOUT and GND
(Note 1)
Normal
Load
FB OLP status
which i s se t
Overload
Light
Load
IOUT
Overload
tFOLP2
tFOLP1
tFOLP1
Burst
mode
Switching
A
B
C
D
E
F
G
H I
J
K
(Note 1) This GND does n ot mean th e G ND _IC pin of the IC.
(Note 2) VCN T is the set output voltage of normal mo de. It is calculated by the fo rmu la b elow.
[V]
Figure 3. Startup Sequences Timing Chart
A:
B:
C:
D:
E:
F:
G:
H:
I:
J:
K:
The input voltage is applied to the DRAIN pin and the VCC pin voltage rises.
If the VCC pin voltage exceeds VUVLO1, the IC starts to operate. In addition, if the IC judges the other protection
functions as normal, it starts the switching operation. The soft start function limits the over current detection
voltage and the switching frequency to prevent any excessive voltage or current rising. When the switching
operation starts, the output voltage rises.
Until the output voltage becomes a constant value or more from startup, the VCC pin voltage drops by the VCC
pin current consumption.
After the switching operation starts, it is necessary to make sure that the output voltage reaches the set voltage
within tFOLP1 by setting the external components.
At light load, the IC starts the burst operation to reduce the power consumption.
When the load exceeds a certain electric power, the IC starts the overload operation.
If the set overload state lasts for tFOLP1, the switching operation is turned off.
When the VCC pin voltage drops to less than VCHG1, the VCC recharge function operates.
When the VCC pin voltage rises to more than VCHG2, the recharge function stops operating.
After tFOLP2 period from G, the switching operation starts.
Same as G.
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Description of Blocks – continued
3
Stop Sequences
Stop sequences are as shown in Figure 4.
Input Voltage
0V
Voltage between
DRAIN pin and GND
(Note 1)
Voltage between
VOUT and GND
(Note 1)
VCNT
(Note 2)
VUVL O1
VCH G2
VCH G1
VUVL O2
Voltage between
VCC pin and GND_IC pin
Overload
Normal Load
IOUT
Switching
A
C
B
DE
FG
(Note 1) This GND does n ot mean th e G ND _IC pin of the IC.
(Note 2) VCN T is the set output voltage of normal mo de. It is calculated by the fo rmu la b elow.
[V]
Figure 4. Stop Sequences Timing Chart
A:
B:
C:
D:
E:
F:
G:
Normal operation
When the input voltage is stopped, the DRAIN pin voltage starts to drop.
If the DRAIN pin voltage drops under a certain level, the ON duty of the switching becomes maximum and FB
OLP operates. The VCC pin voltage starts to drop because of the drop of output voltage.
When the VCC pin voltage drops to less than VCHG1, the VCC recharge function operates.
When the VCC pin voltage rises to more than VCHG2, the VCC recharge function stops operating.
When the VCC pin voltage drops to less than VCHG1, the VCC recharge function operates. However, the
current supply to the VCC pin decreases and the VCC pin voltage continues dropping, because the DRAIN pin
voltage is low.
When the VCC pin voltage drops to less than VUVLO2, the switching operation stops.
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Description of Blocks – continued
4
Startup Circuit
Owing to a built-in startup circuit, this IC achieves low standby electric power and high-speed startup. The current
consumption after startup is only OFF current ISTART3. The startup current flows from the DRAIN pin.
Startup Current
VCC
VCC
- UVLO
FB
+
Filter
VOUT
GND_IC
Starter
AC Input
L
DRAIN
Signal
SLEEP
D1
GND
Figure 5. Startup Circuit
Startup Current [A]
ISTART2
ISTART1
ISTART3
VSC
VUVLO1
VCC Pin Voltage [V]
Figure 6. Startup Current vs VCC Pin Voltage
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Description of Blocks – continued
5
The VCC Pin Protection Function
This IC has the internal protection functions at the VCC pin as shown below.
5.1
VCC UVLO / VCC OVP
VCC UVLO and VCC OVP are auto-recovery typed comparators that have voltage hysteresis. VCC OVP has
an internal mask time, and it is detected when the state which VCC pin voltage exceeds VOVP1 lasts for tCOMP.
The recovery condition is that the VCC pin voltage drops under VOVP2.
5.2
VCC Recharge Function
Once the VCC pin voltage exceeds VUVLO1, and the IC starts up, then if it drops under VCHG1, the VCC recharge
function operates. At this time, the VCC pin is recharged from the DRAIN pin through the startup circuit. When
the VCC pin voltage rises to more than VCHG2, the recharge stops.
Voltage between
DRAIN pin and GND
(Note 1)
VOVP1
VOVP2
VCNT
(Note 2)
tCOMP
VUVLO1
VCHG2
VCHG1
VUVLO2
Voltage between
VCC pin and GND_IC pin
Voltage between
VOUT and GND
(Note 1)
ON
ON
VCC UVLO
ON
VCC OVP
ON
VCC recharge
function
ON
ON
Switching
A
B
CD E
F
G
HI
JK
(Note 1) This GND dose n ot mean th e G ND _IC pin of the IC.
(Note 2) VCN T is the set output voltage of normal mo de. It is calculated by the fo rmu la b elow.
[V]
Figure 7. VCC UVLO/VCC OVP/VCC Recharge Function Timing Chart
A:
B:
C:
D:
E:
F:
G:
H:
I:
J:
K:
The input voltage is applied to the DRAIN pin and the VCC pin voltage rises.
When the VCC pin voltage exceeds VUVLO1, the IC starts operating. If the IC judges the other protection
functions as normal, it starts switching operation. The soft start function limits the over current detection
current and the switching frequency to prevent excessive voltage or current rising. When the switching
operation starts, the output voltage rises.
When the VCC pin voltage exceeds VOVP1 by some anomaly, VCC OVP timer starts to operate.
When the condition that the VCC pin voltage exceeds VOVP1 lasts for tCOMP, the IC detects VCC OVP and
stops switching operation.
When the VCC pin voltage drops to less than VOVP2, VCC OVP is released and the switching operation
restarts.
When the input power supply is turned OFF, the DRAIN pin voltage drops.
If the DRAIN pin voltage drops under a certain level, the output voltage drops. The VCC pin voltage
starts to drop because of the drop of the output voltage.
When the VCC pin voltage drops to less than VCHG1, the VCC recharge function is started.
When the VCC pin voltage rises to more than VCHG2, the VCC recharge function is stopped.
When the VCC pin voltage drops to less than VCHG1, the VCC recharge function is started. However, the
current supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low
DRAIN pin voltage.
When the VCC pin voltage drops to less than VUVLO2, VCC UVLO starts operating.
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Description of Blocks – continued
6
DC/DC Driver
This IC performs current mode PWM control. An internal oscillator fixes the switching frequency fSW. This IC has a
built-in switching frequency hopping function. The maximum duty is DMAX. To achieve the low power consumption
at light load, it also has an internal burst mode circuit.
6.1
Setting of the Output Voltage VOUT
Because of adopting the non-isolated type without optocoupler, it operates to keep the FB pin voltage at the
regulated value. This FB pin voltage means the voltage between the FB pin and the GND_IC pin.
The output voltage VOUT is defined using RFB1 and RFB2 by the formula below.
The voltage when the MOSFET is off is as shown in Figure 8.
𝑉𝑂𝑈𝑇 = 𝑉𝐹𝐵 ×
𝑅𝐹𝐵1 + 𝑅𝐹𝐵2
+ 𝑉𝐹𝐷2 − 𝑉𝐹𝐷1
𝑅𝐹𝐵2
[V]
Where:
𝑉𝐹𝐷1 is the forward voltage of diode D1.
𝑉𝐹𝐷2 is the forward voltage of diode D2.
𝑉𝐹𝐵 is the FB pin control voltage.
𝑅𝐹𝐵1 is the upside divider resistor for VOUT setting.
𝑅𝐹𝐵2 is the downside divider resistor for VOUT setting.
- VFD1 + VFB × （RFB1+RFB2) / RFB2
-VFD1+VFB
VCC
Signal
FB
GND_IC
SLEEP
-VFD1
RFB1
RFB2
D2
-VFD1+ VFD2+ VFB × （RFB1 + RFB2) / RFB2
L
VOUT
DRAIN
AC
Input
Filter
DRAIN
D1
0V
GND
Figure 8. Output Voltage Setting
The output voltage may rise at light load because it is different from the VCC pin voltage. In this case, the output
voltage should be dropped by adjusting the value of the resistor ROUT that is connected to the VOUT. The
position of the resistor ROUT is as shown in Figure 9.
VCC
Signal
FB
GND_IC
SLEEP
DRAIN
AC
Input Filter
L
VOUT
ROUT
DRAIN
GND
Figure 9. Location of Resistor ROUT
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6
DC/DC Driver – continued
6.2
Frequency Circuit
6.2.1 With the Frequency Reduction Operation (BM2PAA1Y-Z, BM2PDA1Y-Z)
mode 1: Burst Mode
mode 2: Frequency Reduction Mode
mode 3: Fixed Frequency Mode
mode 4: Overload Mode
Switching
Frequency
[kHz]
mode1
(The intermittent operation starts.)
(It reduces the frequency.)
(It operates at the maximum frequency.)
(The intermittent operation starts.)
mode2
mode3
mode4
fSW_A
fSW_B
Burst
Mode
Output Power [W]
Figure 10. State Transition of Switching Frequency (BM2PAA1Y-Z, BM2PDA1Y-Z)
6.2.2 Without the Frequency Reduction Operation (BM2PAB1Y-Z, BM2PDB1Y-Z)
mode 1: Burst Mode
mode 2: Fixed Frequency Mode
mode 3: Overload Mode
(The intermittent operation starts.)
(It operates in the maximum frequency.)
(The intermittent operation starts.)
Switching
Frequency
[kHz]
mode1
fSW_B
mode2
mode3
Burst
Mode
Output Power [W]
Figure 11. State Transition of Switching Frequency (BM2PAB1Y-Z, BM2PDB1Y-Z)
6.3
Frequency Hopping Function
Frequency hopping function achieves low EMI by changing the frequency randomly.
The upper limit of the frequency’s hopping is ±6 % (Typ) to the basic frequency.
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6
DC/DC Driver – continued
6.4
Over Current Detection Function
This IC has a built-in cycle-by-cycle over current detection function. This function stops the switching operation
if the coil current IL rises to IPEAK_A or IPEAK_D or more. Additionally, an internal current detection resistor
contributes to the reduction of parts count and improvement on efficiency. The peak current while the IC is in
overload mode is determined by the formula below.
𝑃𝑒𝑎𝑘 𝑐𝑢𝑟𝑟𝑒𝑛𝑡 = 𝐼𝑃𝐸𝐴𝐾 +
(𝑉𝐷𝑅𝐴𝐼𝑁 − 𝑉𝑂𝑈𝑇 )
× 𝑡𝑑𝑒𝑙𝑎𝑦
𝐿
[A]
Where:
𝐼𝑃𝐸𝐴𝐾 is the over current detection current. (IPEAK_A, IPEAK_D)
𝑉𝐷𝑅𝐴𝐼𝑁 is the DRAIN pin voltage.
𝑉𝑂𝑈𝑇 is the output voltage.
𝐿 is the inductance value of coil.
𝑡𝑑𝑒𝑙𝑎𝑦 is the delay time after the over current detection.
6.5
Dynamic Over Current Detection Function
This IC has a built-in dynamic over current detection function.
In the case that the coil current IL exceeds IDPEAK_A or IDPEAK_D two times consecutively, it stops the switching
operation for tDPEAK.
2 counts
IDPEAK
1
2
tDPEAK
IL
ON
ON
OFF
Switching
Figure 12. Dynamic Over Current Detection
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6
DC/DC Driver – continued
6.6
Soft Start Function
This function restricts the over current detection value and the switching frequency to prevent excessive voltage
or current rising at startup. The details are as shown in Figure 13, 14. The IC achieves the soft start operation
by changing the over current detection value and switching frequency with time.
Over Current
Detection Current
[A]
SS1
Switching
Frequency
[kHz]
SS1
SS2
SS2
IDPEAK_A
IDPEAK_D
fSW_A
IDPEAK_A2
IDPEAK_D2
IDPEAK_A1
IDPEAK_D1
fSS_A2
IPEAK_A
IPEAK_D
fSS_A1
IPEAK_A2
IPEAK_D2
IPEAK_A1
IPEAK_D1
fSW_B
fSS_B2
fSS_B1
tSS1
tSS2
Time [ms]
Figure 13. Over Current Detection Current vs Time
tSS1
tSS2
Time [ms]
Figure 14. Switching Frequency vs Time
7
FB OLP (Overload Protection)
FB OLP is a function that monitors load state and stops the switching operation at the overload state. In the overload
condition, the output voltage drops. Therefore, this function judges the state as overload and the switching operation
is stopped when the state of the setting electricity power or more lasts for tFOLP1. The switching operation recovers
tFOLP2 later after the detection of FB OLP.
8
TSD (Thermal Shutdown)
TSD is a function that stops the switching operation if the temperature of IC becomes TSD1 or more.
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Description of Blocks – continued
9
Sleep Mode
This IC goes into sleep mode by controlling the SLEEP pin voltage with the optocoupler.
The low standby power consumption is achieved by the sleep mode.
VCC
SLEEP
GND_IC
DRAIN
AC
Input
Optocoupler
FB
DC/DC
Optocoupler
Filter
DRAIN
μ-Com
Figure 15. Application Circuit (Sleep Mode)
9.1
Settings of Switching the Modes
The SLEEP pin is controlled by an inverter input. The operation states are determined by the settings shown
below. Short the SLEEP pin to the GND_IC if it is not used.
Table 1. Control of Sleep Operation
9.2
SLEEP pin voltage
Mode
Open
< VINL
Sleep
Normal
Timing Chart
Voltage between
SLEEP pin
and GND_IC pin
Operation Mode
NORMAL MODE
SLEEP MODE
NORMAL MODE
Voltage between
VCC pin
and GND_IC pin
VSLEEP2
VSLEEP1
tSLEEP2
tSLEEP1
tSLEEP2
tSLEEP2
Switching
A
A:
B:
C:
D:
E:
F:
G:
H:
I:
J:
B
CDE
FGH
I J
Figure 16. Mode Transition Sequences Timing Chart
The SLEEP pin voltage changes from Low to High.
When tSLEEP1 passes from A, switching operation stops and is contained in a sleep mode. The IC reduces
the current consumption in sleep mode and the over current detection value and the switching frequency
shifts to IPEAK_D and fSW_B. (Note)
When the VCC pin voltage drops to less than VSLEEP1, the switching recovery delay timer starts to operate.
The switching operation starts after tSLEEP2 from C.
When the VCC pin voltage exceeds VSLEEP2, the switching operation is stopped.
Same as C.
Same as D.
Same as E.
The SLEEP pin voltage changes from High to Low.
The IC returns to normal mode after tSLEEP2 with the soft start operation.
(Note) This IPEAK_D and fSW_B are not only for BM2PDB1Y-Z but also for all of this series.
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Description of Blocks – continued
10 Operation Modes of Protection Functions
The operation modes of each protection function are as shown in Table 2.
Table 2. The Operation Modes of Protection Functions
VCC UVLO
VCC OVP
TSD
FB OLP
Detection
Condition
VCC pin voltage
< VUVLO2
(while the voltage
is dropping)
VCC pin voltage
> VOVP1
(while the voltage
is rising)
Junction temperature > TSD1
(while the temperature
is rising)
Coil current IL
≥ IPEAK_A or IPEAK_D
Release
Condition
VCC pin voltage
> VUVLO1
(while the voltage
is rising)
VCC pin voltage
< VOVP2
(while the voltage
is dropping)
Junction temperature < TSD2
(while the temperature
is dropping)
or VCC UVLO detection
Coil current IL
< IPEAK_A or IPEAK_D
or VCC UVLO detection
tCOMP
tCOMP
tFOLP1
VCC pin voltage
< VOVP2
Junction temperature
< TSD2
Coil current IL
< IPEAK_A or IPEAK_D
Detection
Timer
Reset
Condition
–
Release
Timer
Reset
Condition
Auto
Recovery
or
Latch
tFOLP2
–
–
–
Auto recovery
Auto recovery
Auto recovery
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Coil current IL
≥ IPEAK_A or IPEAK_D
Auto recovery
TSZ02201-0F1F0A200620-1-2
17.Jun.2021 Rev.001
BM2Pxx1Y-Z Series
Description of Blocks – continued
11 External Components
Use the parts that match the input and load conditions.
Figure 17 shows the application circuit.
CFB1
RFB1
CVCC
VCC
FB
GND_IC
RFB2
CSLEEP
L
DRAIN
AC
Input
PC
SLEEP
DC/DC
PC
Filter
COUT
DRAIN
CIN
μ-Com
CD-S
Figure 17. Application Circuit
11.1
Output Capacitor COUT
The output capacitor COUT should be set to satisfy the specification of the ripple voltage, and guarantee that the
output voltage rises to the set value within tFOLP1 after startup. It is recommended to set COUT to 100 μF or more.
11.2
Inductance Value of Coil L
The inductance value of coil L should be set depending on the input voltage and output voltage. If the inductance
value is too large, the switching operation becomes continuous mode that deteriorates the heat. In the other
hand, if the inductance value is too small, the control of IC is impossible during ON time < tMINON, so there is a
possibility that the over current detection operates even under a normal load condition.
11.3
VCC Pin Capacitor CVCC
The VCC pin capacitor CVCC adjusts the startup time of the IC and the response of Error AMP.
It is recommended to be set to 1/100 of COUT or less.
11.4
Output Voltage Feedback Resistor RFB1, RFB2
For reducing the electronic power consumption, RFB1 is recommended to be set to 1 MΩ to 3 MΩ as a reference.
For restricting the tolerance of output voltage, use high precision resistors for RFB1 and RFB2.
11.5
Phase Compensation Capacitor CFB1
According to the input and output conditions, the phase compensation capacitor CFB1 may be used.
It is recommended to be set to 1 nF to 10 nF.
Evaluate with sufficient consideration of the tolerances and temperature characteristics of the components.
11.6
Noise Filter Capacitor CSLEEP
In case of using an optocoupler to control the SLEEP pin, for preventing the malfunction on mode transition, it is
recommended to use the noise filter capacitor CSLEEP.
It is recommended to be set to 10 nF to 100 nF.
Notice that the time of mode transitions may become longer by using CSLEEP.
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BM2Pxx1Y-Z Series
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
650
V
730
V
Conditions
Maximum Applied Voltage 1
VMAX1
Maximum Applied Voltage 2
VMAX2
-0.3 to +32
V
DRAIN pin voltage
DRAIN pin voltage
(tpulse < 10 μs) (Note 1)
VCC pin voltage
DRAIN Pin Current (Pulse)
IDD
12.00
A
Consecutive operation
Power Dissipation
Pd
1.00
W
(Note 2)
Tjmax
150
°C
Tstg
-55 to +150
°C
Maximum Junction Temperature
Storage Temperature Range
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Duty is less than 1 %.
(Note 2) In case of being mounted on a glass epoxy single layer PCB (70 mm x 70 mm x 1.6 mm). Derate by 8 mW/°C if the IC is used at the ambient
temperature 25 °C or above.
Thermal Dissipation
Make the thermal design by making the IC operates in the following conditions.
(Because the following temperature is guaranteed value, it is necessary to consider a margin.)
1. The ambient temperature must be 105 °C or less.
2. The IC’s loss must be the power dissipation Pd or less.
The thermal abatement characteristic is as follows.
(In case of being mounted on a glass epoxy single layer PCB with size of 70 mm x 70 mm x 1.6 mm)
1.50
Pd [W]
1.00
0.50
0.00
0
25
50
75
100
125
150
Ta [ºC]
Figure 18. Thermal Abatement Characteristic
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
-
-
650
V
-
-
730
V
Conditions
Power Supply Voltage Range 2
VCC
11.10
-
26.00
V
DRAIN pin voltage
DRAIN pin voltage
(tpulse < 10 μs) (Note 1)
VCC pin voltage
Operating Temperature
Topr
-40
-
+105
°C
Surrounding temperature
Power Supply Voltage Range 1
VDRAIN
(Note 1) Duty is less than 1 %.
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BM2Pxx1Y-Z Series
Electrical Characteristics in MOSFET Section
(Unless noted otherwise, Ta = 25 °C)
Parameter
Voltage between
DRAIN and SOURCE
DRAIN Pin Leak Current
ON Resistor
Symbol
Min
Typ
Max
Unit
650
-
-
V
730
-
-
V
IDSS
-
0
100
μA
ID = 1 mA, VGS = 0 V
tpulse < 10 μs
VDS = 650 V, VGS = 0 V
RDS(ON)
-
1.2
2.2
Ω
ID = 0.25 A, VGS = 10 V
V(BR)DDS
Conditions
ID = 1 mA, VGS = 0 V
Electrical Characteristics in Startup Circuit Section
(Unless noted otherwise, Ta = 25 °C)
Parameter
Symbol
Min
Typ
Max
Unit
Startup Current 1
ISTART1
0.150
0.300
0.600
mA
VCC = 0 V
Startup Current 2
ISTART2
1.000
3.000
6.000
mA
VCC = 7 V
OFF Current
ISTART3
-
10
20
μA
After UVLO is released
VSC
0.4
0.8
1.2
V
Startup Current Transition Voltage
Conditions
Electrical Characteristics in Control IC Section
(Unless noted otherwise, Ta = 25 °C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
ION1
-
650
950
μA
ION2
-
350
550
μA
ISLEEP
-
65
95
μA
SLEEP pin = open
Circuit Current (Common throughout the series)
Current at Switching Operation
Current at Burst Operation
Current at Sleep Mode
DRAIN pin = open
VCC Pin (Common throughout the series)
VCC UVLO Release Voltage
VUVLO1
9.70
10.40
11.10
V
At VCC pin voltages rising
VCC UVLO Detection Voltage
VUVLO2
8.20
8.90
9.60
V
At VCC pin voltage dropping
VCC UVLO Hysteresis
VUVLO3
-
1.50
-
V
VUVLO3 = VUVLO1 - VUVLO2
VCC Recharge Start Voltage
VCHG1
8.60
9.30
10.00
V
At VCC pin voltage dropping
VCC Recharge Stop Voltage
VCHG2
9.00
9.70
10.40
V
At VCC pin voltage rising
VCC Recharge Hysteresis
VCHG3
-
0.40
-
V
VCHG3 = VCHG2 - VCHG1
VCC Sleep Voltage 1
VSLEEP1
11.10
11.50
11.90
V
At VCC pin voltage rising
VCC Sleep Voltage 2
VSLEEP2
10.20
10.50
10.80
V
At VCC pin voltage dropping
VCC Sleep Hysteresis
VSLEEP3
-
1.00
-
V
VSLEEP3 = VSLEEP1 - VSLEEP2
VCC OVP Detection Voltage
VOVP1
27.00
28.00
29.00
V
At VCC pin voltage rising
VCC OVP Release Voltage
VOVP2
26.00
27.00
28.00
V
At VCC pin voltage dropping
VCC OVP Hysteresis
VOVP3
-
1.00
-
V
VOVP3 = VOVP1 - VOVP2
VCC OVP / TSD Timer
tCOMP
50
100
150
μs
Thermal Shutdown (Common throughout the series)
TSD Temperature 1
TSD1
150
175
200
°C
At temperature rising (Note 1)
TSD Temperature 2
TSD2
-
100
-
°C
At temperature dropping (Note 1)
TSD Hysteresis
TSD3
-
65
-
°C
(Note 1)
(Note 1) Not 100 % tested.
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BM2Pxx1Y-Z Series
Electrical Characteristics in Control IC Section – continued
(Unless noted otherwise, Ta = 25 °C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Switching Frequency A
fSW_A
60.0
65.0
70.0
kHz
After soft start
Frequency Hopping Width A
fDEL_A
-
4.0
-
kHz
After soft start
Switching Frequency A1
fSS_A1
-
15.0
-
kHz
(Note 1, 2)
Switching Frequency A2
fSS_A2
-
30.0
-
kHz
(Note 1, 2)
Switching Frequency B
fSW_B
22.5
25.0
27.5
kHz
After soft start
Frequency Hopping Width B
fDEL_B
-
1.5
-
kHz
After soft start
Switching Frequency B1
fSS_B1
-
6.0
-
kHz
(Note 1, 2)
Switching Frequency B2
fSS_B2
-
12.0
-
kHz
(Note 1, 2)
DC/DC Driver Section (BM2PxA1Y-Z)
DC/DC Driver Section (BM2PxB1Y-Z)
DC/DC Driver Section (Common throughout the series)
Maximum Duty
DMAX
35
40
45
%
FB OLP Detection Timer
tFOLP1
52
64
76
ms
FB OLP OFF Timer
tFOLP2
416
512
608
ms
Soft Start Time 1
tSS1
6.8
8.0
9.2
ms
Soft Start Time 2
tSS2
13.6
16.0
18.4
ms
FB Pin Control Voltage
VFB
1.98
2.00
2.02
V
Over Current Detection Current A
IPEAK_A
1.57
1.76
1.94
A
Over Current Detection Current A1
IPEAK_A1
-
0.88
-
A
(Note 1, 3)
Over Current Detection Current A2
IPEAK_A2
-
1.32
-
A
(Note 1, 3)
Dynamic Over Current Detection Current A
IDPEAK_A
2.73
3.08
3.43
A
Dynamic Over Current Detection Current A1
IDPEAK_A1
-
1.54
-
A
(Note 1, 3)
Dynamic Over Current Detection Current A2
IDPEAK_A2
-
2.31
-
A
(Note 1, 3)
Over Current Detection Current D
IPEAK_D
0.83
0.93
1.04
A
Over Current Detection Current D1
IPEAK_D1
-
0.46
-
A
(Note 1, 3)
Over Current Detection Current D2
IPEAK_D2
-
0.69
-
A
(Note 1, 3)
Dynamic Over Current Detection Current D
IDPEAK_D
1.43
1.62
1.81
A
Dynamic Over Current Detection Current D1
IDPEAK_D1
-
0.81
-
A
(Note 1, 3)
Dynamic Over Current Detection Current D2
IDPEAK_D2
-
1.21
-
A
(Note 1, 3)
I2F_AA
149
191
233
A2kHz
I2F_AB
51
73
96
A2kHz
I2F_DA
33
48
62
A2kHz
I2F_DB
11
18
26
A2kHz
Over Current Detection Section (BM2PAx1Y-Z)
Over Current Detection Section (BM2PDx1Y-Z)
Over Current Detection Section（BM2PAA1Y-Z）
Power Coefficient AA
Over Current Detection Section（BM2PAB1Y-Z）
Power Coefficient AB
Over Current Detection Section（BM2PDA1Y-Z）
Power Coefficient DA
Over Current Detection Section（BM2PDB1Y-Z）
Power Coefficient DB
(Note 1) Not 100 % tested.
(Note 2) Refer to Figure 14.
(Note 3) Refer to Figure 13.
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BM2Pxx1Y-Z Series
Electrical Characteristics in Control IC Section – continued
(Unless noted otherwise, Ta = 25 °C)
Over Current Detection Section (Common throughout the series)
Dynamic Over Current Enforced OFF Time
tDPEAK
-
128
-
μs
(Note 1)
Minimum ON Width
tMINON
-
200
-
ns
(Note 1)
Sleep Pin Low Voltage
VINL
-
-
1.0
V
Sleep Pin High Voltage
VINH
3.5
-
-
V
Sleep Pin Pull Up Resistor
RSLEEP
1.2
2.0
2.8
MΩ
Sleep Operation Start Mask Time
tSLEEP1
1.0
2.0
3.0
ms
Switching Recovery Delay Time
tSLEEP2
50
200
350
μs
Sleep Pin (Common throughout the series)
SLEEP pin = open
(Note 1) Not 100 % tested.
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BM2Pxx1Y-Z Series
Typical Performance Curves
(Reference Data)
500
Current at Burst Operation: ION2 [μA]
Current at Switching Operation:
ION1 [μA]
900
800
700
600
500
400
-40 -20
0
20 40 60 80 100 120
450
400
350
300
250
200
-40 -20
0
Temperature [°C]
Figure 19. Current at Switching Operation vs Temperature
Figure 20. Current at Burst Operation vs Temperature
10.50
VCC UVLO Release Voltage:
VUVLO1 [V]
90
Current at Sleep Mode: ISLEEP [μA]
20 40 60 80 100 120
Temperature [°C]
80
10.45
70
10.40
60
10.35
50
40
-40 -20
0
10.30
-40 -20
20 40 60 80 100 120
Temperature [°C]
20 40 60 80 100 120
Temperature [°C]
Figure 21. Current at Sleep Mode vs Temperature
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0
Figure 22. VCC UVLO Release Voltage vs Temperature
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BM2Pxx1Y-Z Series
Typical Performance Curves – continued
(Reference Data)
9.5
VCC Recharge Start Voltage:
VCHG1 [V]
VCC UVLO Detection Voltage:
VUVLO2 [V]
9.00
8.95
8.90
8.85
8.80
-40 -20
0
9.4
9.3
9.2
9.1
-40 -20
20 40 60 80 100 120
0
Temperature [°C]
Figure 23. VCC UVLO Detection Voltage vs Temperature
Figure 24. VCC Recharge Start Voltage vs Temperature
11.7
VCC Sleep Voltage 1: VSLEEP1 [V]
VCC Recharge Stop Voltage:
VCHG2 [V]
9.9
9.8
9.7
9.6
9.5
-40 -20
20 40 60 80 100 120
Temperature [°C]
0
20 40 60 80 100 120
Temperature [°C]
11.5
11.4
11.3
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Figure 25. VCC Recharge Stop Voltage vs Temperature
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Figure 26. VCC Sleep Voltage 1 vs Temperature
TSZ02201-0F1F0A200620-1-2
17.Jun.2021 Rev.001
BM2Pxx1Y-Z Series
Typical Performance Curves – continued
(Reference Data)
1.02
VCC Sleep Hysteresis: VSLEEP3 [V]
VCC Sleep Votlage 2: VSLEEP2 [V]
10.7
10.6
10.5
10.4
10.3
-40 -20
0
20 40 60 80 100 120
1.01
1.00
0.99
0.98
-40 -20
0
Temperature [°C]
Figure 27. VCC Sleep Voltage 2 vs Temperature
Figure 28. VCC Sleep Hysteresis vs Temperature
27.2
VCC OVP Release Voltage:
VOVP2 [V]
28.2
VCC OVP Detection Voltage:
VOVP1 [V]
20 40 60 80 100 120
Temperature [°C]
28.1
28.0
27.9
27.8
-40 -20 0
27.0
26.9
26.8
-40 -20
20 40 60 80 100 120
Temperature [°C]
0
20 40 60 80 100 120
Temperature [°C]
Figure 29. VCC OVP Detection Voltage vs Temperature
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Figure 30. VCC OVP Release Voltage vs Temperature
TSZ02201-0F1F0A200620-1-2
17.Jun.2021 Rev.001
BM2Pxx1Y-Z Series
Typical Performance Curves – continued
(Reference Data)
26.0
Switching Frequency B: fSW_B [kHz]
Switching Frequency A: fSW_A [kHz]
66.0
65.5
65.0
64.5
64.0
-40 -20
0
20 40 60 80 100 120
25.5
25.0
24.5
24.0
-40 -20
0
Temperature [°C]
Figure 31. Switching Frequency A vs Temperature
Figure 32. Switching Frequency B vs Temperature
FB OLP Detection Timer: tFOLP1 [ms]
Maximum Duty: D MAX [%]
40.2
40.1
40.0
39.9
39.8
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
66
65
64
63
62
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Figure 33. Maximum Duty vs Temperature
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20 40 60 80 100 120
Temperature [°C]
Figure 34. FB OLP Detection Timer vs Temperature
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BM2Pxx1Y-Z Series
Typical Performance Curves – continued
(Reference Data)
8.2
Soft Start Time 1: tSS1 [ms]
FB OLP OFF Timer: tFOLP2 [ms]
530
525
520
515
510
505
500
-40 -20
0
8.1
8.0
7.9
7.8
7.7
-40 -20
20 40 60 80 100 120
0
Temperature [°C]
Figure 35. FB OLP OFF Timer vs Temperature
Figure 36. Soft Start Time 1 vs Temperature
2.02
FB Pin Control Voltage: VFB [V]
Soft Start Time 2: tSS2 [ms]
16.4
16.2
16.0
15.8
15.6
15.4
-40 -20
20 40 60 80 100 120
Temperature [°C]
0
2.00
1.99
1.98
-40 -20
20 40 60 80 100 120
Temperature [°C]
0
20 40 60 80 100 120
Temperature [°C]
Figure 37. Soft Start Time 2 vs Temperature
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2.01
Figure 38. FB Pin Control Voltage vs Temperature
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BM2Pxx1Y-Z Series
Typical Performance Curves – continued
(Reference Data)
1.05
Over Current Detection Current D:
IPEAK_D [A]
Over Current Detection Current A:
IPEAK_A [A]
1.90
1.80
0.95
1.70
1.60
-40 -20
0.85
0
0.75
-40 -20
20 40 60 80 100 120
0
20 40 60 80 100 120
Temperature [°C]
Temperature [°C]
Figure 39. Over Current Detection Current A
vs Temperature
Figure 40. Over Current Detection Current D
vs Temperature
2.00
Dynamic Over Current Detection
Current D: IDPEAK_D [A]
Dynamic Over Current Detection
Current A: IDPEAK_A [A]
3.60
3.40
3.20
3.00
2.80
2.60
-40 -20
0
Temperature [°C]
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1.70
1.55
1.40
-40 -20
20 40 60 80 100 120
Figure 41. Dynamic Over Current Detection Current A
vs Temperature
1.85
0
20 40 60 80 100 120
Temperature [°C]
Figure 42. Dynamic Over Current Detection Current D
vs Temperature
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BM2Pxx1Y-Z Series
Application Examples
Show a flyback circuitry example in Figure 43.
High voltage is produced by such as ringing in turn OFF at the DRAIN pin.
up to 730 V.
The voltage during this ringing can be tolerated
Fuse
AC
Input
Filter
Diode
Bridge
DRAI N DRAI N
SLEEP GND_IC
VCC
Error
AMP
FB
Signal
Figure 43. Flyback Application Circuit Diagram
730 V
650 V
DRAIN pin
voltage
0V
tpulse < 10 μs (Duty < 1 %)
Figure 44. Drain Pin Ringing Waveform
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BM2Pxx1Y-Z Series
I/O Equivalence Circuit
7
DRAIN
6
DRAIN
-
-
5
VCC
DRAIN
DRAIN
VCC
Internal
MOSFET
Internal
MOSFET
GND_IC
1
N. C.
GND_IC
GND_IC
2
SLEEP
3
GND_IC
4
FB
Internal Reg.
GND_IC
FB
SLEEP
-
GND_IC
GND_IC
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BM2Pxx1Y-Z Series
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BM2Pxx1Y-Z Series
Operational Notes – continued
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Figure 45. Example of IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BM2Pxx1Y-Z Series
Ordering Information
B
M
2
P
x
x
Over Current
Detection Current
A: 1.76 A
D: 0.93 A
1
Y
-
Z
Switching Frequency and Frequency Reduction
A: 65 kHz with frequency reduction
B: 25 kHz without frequency reduction
Z: Outsourced package
Marking Diagram
DIP7K (TOP VIEW)
Part Number Marking
LOT Number
Lineup
Part Number Marking
Orderable Part Number
BM2PAA1Y
BM2PAB1Y
BM2PDA1Y
BM2PDB1Y
BM2PAA1Y-Z
BM2PAB1Y-Z
BM2PDA1Y-Z
BM2PDB1Y-Z
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© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Oscillatory
Frequency
65 kHz
25 kHz
65 kHz
25 kHz
30/32
Frequency
Reduction
Yes
No
Yes
No
Over Current
Detection Current
1.76 A
0.93 A
TSZ02201-0F1F0A200620-1-2
17.Jun.2021 Rev.001
BM2Pxx1Y-Z Series
Physical Dimension and Packing Information
Package Name
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DIP7K
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17.Jun.2021 Rev.001
BM2Pxx1Y-Z Series
Revision History
Date
Revision
17.Jun.2021
001
Changes
New release
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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