BM2PDA1Y-Z

Datasheet AC/DC Converter IC Non-isolated Type PWM DC/DC Converter IC Built-in Switching MOSFET BM2Pxx1Y-Z Series General Description Key Specifications The PWM type DC/DC converter for AC/DC provides an optimum system for all products that include an electrical outlet. It enables simpler design of a high effective converter specializing in non-isolation. By a built-in startup circuit that tolerates 650 V, this IC contributes to low power consumption. A current detection resistor as internal device realizes the small power supply designs. Since a current mode control is utilized, the current can be restricted in each cycle and an excellent performance is demonstrated in the bandwidth and transient response. The switching frequency is fixed to 25 kHz / 65 kHz. A frequency hopping function is also on chip, and it contributes to low EMI. In addition, a built-in super junction MOSFET with 650 V withstand voltage makes the design easy. ◼ ◼ ◼ ◼ ◼ ◼ Power Supply Voltage Range VCC Pin: 11.10 V to 26.00 V DRAIN Pin: 730 V (Max) Current at Switching Operation: 650 μA (Typ) Current at Burst Operation: 350 μA (Typ) Switching Frequency: 25 kHz / 65 kHz (Typ) Operation Temperature Range: -40 °C to +105 °C MOSFET ON Resistor: 1.2 Ω (Typ) Package W (Typ) x D (Typ) x H (Max) 9.27 mm x 6.35 mm x 8.63 mm pitch 2.54 mm DIP7K Features ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ PWM Current Mode Method Frequency Hopping Function Burst Operation at Light Load Built-in 650 V Startup Circuit Built-in 650 V Super Junction MOSFET VCC UVLO (Under Voltage Lockout) VCC OVP (Over Voltage Protection) Over Current Detection Function per Cycle Soft Start Function Sleep Mode Lineup Applications ◼ Product Name Switching Frequency Frequency Reduction BM2PAA1Y-Z 65 kHz Yes BM2PAB1Y-Z 25 kHz No BM2PDA1Y-Z 65 kHz Yes BM2PDB1Y-Z 25 kHz No Over Current Detection Current 1.76 A 0.93 A Household Appliances such as Washing Machines, Air-conditioners, and Cleaners Typical Application Circuit VCC SLEEP Signal FB GND_IC L VOUT DRAIN AC Input Filter DRAIN GND 〇Product structure : Silicon integrated circuit www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays. 1/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Pin Configuration 7 1 6 2 3 5 4 Pin Descriptions Pin No. Pin Name I/O 1 2 3 4 5 6 7 N.C. SLEEP GND_IC FB VCC DRAIN DRAIN I I/O I I I/O I/O ESD Diode VCC GND_IC ✔ ✔ ✔ ✔ ✔ ✔ Function Non connection Sleep/Normal mode exchange control GND pin Output voltage feedback pin Power supply input pin MOSFET DRAIN pin MOSFET DRAIN pin Block Diagram VCC DRAIN 5 Starter VCC UVLO ・・・ ・・・ Reference Voltage Reference Voltage Sleep Comparator + - 4 Clamper ｔCOMP Filte r Inte rnal Regula tor Gate Clamper VCC OVP Internal Block ｔFOL P1 /ｔFOL P2 Timer OLP Reference Voltage + - Reference Voltage + - + - Reference Voltage FB + - Reference Voltage + Burst Comparator PWM Comparator R PWM Control - Current Limitter ｔSLEE P1 Timer Q DRIVER Dynamic Current Limitter Log ic and Timer Sleep/Normal 2 Sup er Jun ction MOSFET S + - Reference Voltage + SLEEP 6,7 + - Reference Voltage Lea ding-Edg e Blan kin g Time Curren t Sen sin g Soft Start + Reference Voltage Maximu m Duty Thermal Pro tection www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 OSC 2/32 3 GND_IC Freque ncy Hoppin g TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Description of Blocks 1 Buck Converter This IC is for exclusive use of non-isolated type buck converter. Basic operations of buck converter are as shown below. 1.1 When the Switching MOSFET is ON Current IL flows to coil L and energy is stored when the MOSFET turns ON. At this moment, the GND_IC pin voltage becomes near the DRAIN pin voltage, and the diode D1 is OFF. In discontinuous mode, the formula of IL when MOSFET turns ON is as shown below. 𝐼𝐿 = (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇 ) × 𝑡𝑂𝑁 𝐿 [A] Where: 𝐼𝐿 is the current flowing to the coil. 𝑉𝐼𝑁 is the voltage applied to the DRAIN pin. 𝑉𝑂𝑈𝑇 is the output voltage. 𝐿 is the inductance value of coil. 𝑡𝑂𝑁 is the time after MOSFET turns on. VCC Signal FB SLEEP L GND_IC VOUT ON IL DRAIN AC Input Filter DRAIN Current D1 GND Figure 1. Buck Converter Operation (MOSFET = ON) www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series 1 Buck Converter – continued 1.2 When the Switching MOSFET is OFF The energy stored in coil L is output via diode D1 when the MOSFET turns OFF. In discontinuous mode, the formula of IL when MOSFET turns OFF is as shown below. 𝐼𝐿 = 𝑉𝑂𝑈𝑇 × 𝑡𝑂𝐹𝐹 𝐿 [A] Where: 𝐼𝐿 is the current flowing to the coil. 𝑉𝑂𝑈𝑇 is the output voltage. 𝐿 is the inductance value of coil. 𝑡𝑂𝐹𝐹 is the time from the MOSFET turns off to IL becomes 0. VCC Signal FB L GND_IC SLEEP VOUT OFF IL DRAIN AC Input Filter DRAIN D1 Current GND Figure 2. Buck Converter Operation (MOSFET = OFF) www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Description of Blocks – continued 2 Startup Sequences Startup sequences are as shown in Figure 3. See the sections below for detailed descriptions. Voltage between DRAIN pin and GND (Note 1) VCNT (Note 2) VUVL O1 VCH G2 VCH G1 VUVL O2 Voltage between VCC pin and GND_IC pin tFOLP1 Voltage between VOUT and GND (Note 1) Normal Load FB OLP status which i s se t Overload Light Load IOUT Overload tFOLP2 tFOLP1 tFOLP1 Burst mode Switching A B C D E F G H I J K (Note 1) This GND does n ot mean th e G ND _IC pin of the IC. (Note 2) VCN T is the set output voltage of normal mo de. It is calculated by the fo rmu la b elow. [V] Figure 3. Startup Sequences Timing Chart A: B: C: D: E: F: G: H: I: J: K: The input voltage is applied to the DRAIN pin and the VCC pin voltage rises. If the VCC pin voltage exceeds VUVLO1, the IC starts to operate. In addition, if the IC judges the other protection functions as normal, it starts the switching operation. The soft start function limits the over current detection voltage and the switching frequency to prevent any excessive voltage or current rising. When the switching operation starts, the output voltage rises. Until the output voltage becomes a constant value or more from startup, the VCC pin voltage drops by the VCC pin current consumption. After the switching operation starts, it is necessary to make sure that the output voltage reaches the set voltage within tFOLP1 by setting the external components. At light load, the IC starts the burst operation to reduce the power consumption. When the load exceeds a certain electric power, the IC starts the overload operation. If the set overload state lasts for tFOLP1, the switching operation is turned off. When the VCC pin voltage drops to less than VCHG1, the VCC recharge function operates. When the VCC pin voltage rises to more than VCHG2, the recharge function stops operating. After tFOLP2 period from G, the switching operation starts. Same as G. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Description of Blocks – continued 3 Stop Sequences Stop sequences are as shown in Figure 4. Input Voltage 0V Voltage between DRAIN pin and GND (Note 1) Voltage between VOUT and GND (Note 1) VCNT (Note 2) VUVL O1 VCH G2 VCH G1 VUVL O2 Voltage between VCC pin and GND_IC pin Overload Normal Load IOUT Switching A C B DE FG (Note 1) This GND does n ot mean th e G ND _IC pin of the IC. (Note 2) VCN T is the set output voltage of normal mo de. It is calculated by the fo rmu la b elow. [V] Figure 4. Stop Sequences Timing Chart A: B: C: D: E: F: G: Normal operation When the input voltage is stopped, the DRAIN pin voltage starts to drop. If the DRAIN pin voltage drops under a certain level, the ON duty of the switching becomes maximum and FB OLP operates. The VCC pin voltage starts to drop because of the drop of output voltage. When the VCC pin voltage drops to less than VCHG1, the VCC recharge function operates. When the VCC pin voltage rises to more than VCHG2, the VCC recharge function stops operating. When the VCC pin voltage drops to less than VCHG1, the VCC recharge function operates. However, the current supply to the VCC pin decreases and the VCC pin voltage continues dropping, because the DRAIN pin voltage is low. When the VCC pin voltage drops to less than VUVLO2, the switching operation stops. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Description of Blocks – continued 4 Startup Circuit Owing to a built-in startup circuit, this IC achieves low standby electric power and high-speed startup. The current consumption after startup is only OFF current ISTART3. The startup current flows from the DRAIN pin. Startup Current VCC VCC - UVLO FB + Filter VOUT GND_IC Starter AC Input L DRAIN Signal SLEEP D1 GND Figure 5. Startup Circuit Startup Current [A] ISTART2 ISTART1 ISTART3 VSC VUVLO1 VCC Pin Voltage [V] Figure 6. Startup Current vs VCC Pin Voltage www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Description of Blocks – continued 5 The VCC Pin Protection Function This IC has the internal protection functions at the VCC pin as shown below. 5.1 VCC UVLO / VCC OVP VCC UVLO and VCC OVP are auto-recovery typed comparators that have voltage hysteresis. VCC OVP has an internal mask time, and it is detected when the state which VCC pin voltage exceeds VOVP1 lasts for tCOMP. The recovery condition is that the VCC pin voltage drops under VOVP2. 5.2 VCC Recharge Function Once the VCC pin voltage exceeds VUVLO1, and the IC starts up, then if it drops under VCHG1, the VCC recharge function operates. At this time, the VCC pin is recharged from the DRAIN pin through the startup circuit. When the VCC pin voltage rises to more than VCHG2, the recharge stops. Voltage between DRAIN pin and GND (Note 1) VOVP1 VOVP2 VCNT (Note 2) tCOMP VUVLO1 VCHG2 VCHG1 VUVLO2 Voltage between VCC pin and GND_IC pin Voltage between VOUT and GND (Note 1) ON ON VCC UVLO ON VCC OVP ON VCC recharge function ON ON Switching A B CD E F G HI JK (Note 1) This GND dose n ot mean th e G ND _IC pin of the IC. (Note 2) VCN T is the set output voltage of normal mo de. It is calculated by the fo rmu la b elow. [V] Figure 7. VCC UVLO/VCC OVP/VCC Recharge Function Timing Chart A: B: C: D: E: F: G: H: I: J: K: The input voltage is applied to the DRAIN pin and the VCC pin voltage rises. When the VCC pin voltage exceeds VUVLO1, the IC starts operating. If the IC judges the other protection functions as normal, it starts switching operation. The soft start function limits the over current detection current and the switching frequency to prevent excessive voltage or current rising. When the switching operation starts, the output voltage rises. When the VCC pin voltage exceeds VOVP1 by some anomaly, VCC OVP timer starts to operate. When the condition that the VCC pin voltage exceeds VOVP1 lasts for tCOMP, the IC detects VCC OVP and stops switching operation. When the VCC pin voltage drops to less than VOVP2, VCC OVP is released and the switching operation restarts. When the input power supply is turned OFF, the DRAIN pin voltage drops. If the DRAIN pin voltage drops under a certain level, the output voltage drops. The VCC pin voltage starts to drop because of the drop of the output voltage. When the VCC pin voltage drops to less than VCHG1, the VCC recharge function is started. When the VCC pin voltage rises to more than VCHG2, the VCC recharge function is stopped. When the VCC pin voltage drops to less than VCHG1, the VCC recharge function is started. However, the current supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low DRAIN pin voltage. When the VCC pin voltage drops to less than VUVLO2, VCC UVLO starts operating. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Description of Blocks – continued 6 DC/DC Driver This IC performs current mode PWM control. An internal oscillator fixes the switching frequency fSW. This IC has a built-in switching frequency hopping function. The maximum duty is DMAX. To achieve the low power consumption at light load, it also has an internal burst mode circuit. 6.1 Setting of the Output Voltage VOUT Because of adopting the non-isolated type without optocoupler, it operates to keep the FB pin voltage at the regulated value. This FB pin voltage means the voltage between the FB pin and the GND_IC pin. The output voltage VOUT is defined using RFB1 and RFB2 by the formula below. The voltage when the MOSFET is off is as shown in Figure 8. 𝑉𝑂𝑈𝑇 = 𝑉𝐹𝐵 × 𝑅𝐹𝐵1 + 𝑅𝐹𝐵2 + 𝑉𝐹𝐷2 − 𝑉𝐹𝐷1 𝑅𝐹𝐵2 [V] Where: 𝑉𝐹𝐷1 is the forward voltage of diode D1. 𝑉𝐹𝐷2 is the forward voltage of diode D2. 𝑉𝐹𝐵 is the FB pin control voltage. 𝑅𝐹𝐵1 is the upside divider resistor for VOUT setting. 𝑅𝐹𝐵2 is the downside divider resistor for VOUT setting. - VFD1 + VFB × （RFB1+RFB2) / RFB2 -VFD1+VFB VCC Signal FB GND_IC SLEEP -VFD1 RFB1 RFB2 D2 -VFD1+ VFD2+ VFB × （RFB1 + RFB2) / RFB2 L VOUT DRAIN AC Input Filter DRAIN D1 0V GND Figure 8. Output Voltage Setting The output voltage may rise at light load because it is different from the VCC pin voltage. In this case, the output voltage should be dropped by adjusting the value of the resistor ROUT that is connected to the VOUT. The position of the resistor ROUT is as shown in Figure 9. VCC Signal FB GND_IC SLEEP DRAIN AC Input Filter L VOUT ROUT DRAIN GND Figure 9. Location of Resistor ROUT www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series 6 DC/DC Driver – continued 6.2 Frequency Circuit 6.2.1 With the Frequency Reduction Operation (BM2PAA1Y-Z, BM2PDA1Y-Z) mode 1: Burst Mode mode 2: Frequency Reduction Mode mode 3: Fixed Frequency Mode mode 4: Overload Mode Switching Frequency [kHz] mode1 (The intermittent operation starts.) (It reduces the frequency.) (It operates at the maximum frequency.) (The intermittent operation starts.) mode2 mode3 mode4 fSW_A fSW_B Burst Mode Output Power [W] Figure 10. State Transition of Switching Frequency (BM2PAA1Y-Z, BM2PDA1Y-Z) 6.2.2 Without the Frequency Reduction Operation (BM2PAB1Y-Z, BM2PDB1Y-Z) mode 1: Burst Mode mode 2: Fixed Frequency Mode mode 3: Overload Mode (The intermittent operation starts.) (It operates in the maximum frequency.) (The intermittent operation starts.) Switching Frequency [kHz] mode1 fSW_B mode2 mode3 Burst Mode Output Power [W] Figure 11. State Transition of Switching Frequency (BM2PAB1Y-Z, BM2PDB1Y-Z) 6.3 Frequency Hopping Function Frequency hopping function achieves low EMI by changing the frequency randomly. The upper limit of the frequency’s hopping is ±6 % (Typ) to the basic frequency. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series 6 DC/DC Driver – continued 6.4 Over Current Detection Function This IC has a built-in cycle-by-cycle over current detection function. This function stops the switching operation if the coil current IL rises to IPEAK_A or IPEAK_D or more. Additionally, an internal current detection resistor contributes to the reduction of parts count and improvement on efficiency. The peak current while the IC is in overload mode is determined by the formula below. 𝑃𝑒𝑎𝑘 𝑐𝑢𝑟𝑟𝑒𝑛𝑡 = 𝐼𝑃𝐸𝐴𝐾 + (𝑉𝐷𝑅𝐴𝐼𝑁 − 𝑉𝑂𝑈𝑇 ) × 𝑡𝑑𝑒𝑙𝑎𝑦 𝐿 [A] Where: 𝐼𝑃𝐸𝐴𝐾 is the over current detection current. (IPEAK_A, IPEAK_D) 𝑉𝐷𝑅𝐴𝐼𝑁 is the DRAIN pin voltage. 𝑉𝑂𝑈𝑇 is the output voltage. 𝐿 is the inductance value of coil. 𝑡𝑑𝑒𝑙𝑎𝑦 is the delay time after the over current detection. 6.5 Dynamic Over Current Detection Function This IC has a built-in dynamic over current detection function. In the case that the coil current IL exceeds IDPEAK_A or IDPEAK_D two times consecutively, it stops the switching operation for tDPEAK. 2 counts IDPEAK 1 2 tDPEAK IL ON ON OFF Switching Figure 12. Dynamic Over Current Detection www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series 6 DC/DC Driver – continued 6.6 Soft Start Function This function restricts the over current detection value and the switching frequency to prevent excessive voltage or current rising at startup. The details are as shown in Figure 13, 14. The IC achieves the soft start operation by changing the over current detection value and switching frequency with time. Over Current Detection Current [A] SS1 Switching Frequency [kHz] SS1 SS2 SS2 IDPEAK_A IDPEAK_D fSW_A IDPEAK_A2 IDPEAK_D2 IDPEAK_A1 IDPEAK_D1 fSS_A2 IPEAK_A IPEAK_D fSS_A1 IPEAK_A2 IPEAK_D2 IPEAK_A1 IPEAK_D1 fSW_B fSS_B2 fSS_B1 tSS1 tSS2 Time [ms] Figure 13. Over Current Detection Current vs Time tSS1 tSS2 Time [ms] Figure 14. Switching Frequency vs Time 7 FB OLP (Overload Protection) FB OLP is a function that monitors load state and stops the switching operation at the overload state. In the overload condition, the output voltage drops. Therefore, this function judges the state as overload and the switching operation is stopped when the state of the setting electricity power or more lasts for tFOLP1. The switching operation recovers tFOLP2 later after the detection of FB OLP. 8 TSD (Thermal Shutdown) TSD is a function that stops the switching operation if the temperature of IC becomes TSD1 or more. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Description of Blocks – continued 9 Sleep Mode This IC goes into sleep mode by controlling the SLEEP pin voltage with the optocoupler. The low standby power consumption is achieved by the sleep mode. VCC SLEEP GND_IC DRAIN AC Input Optocoupler FB DC/DC Optocoupler Filter DRAIN μ-Com Figure 15. Application Circuit (Sleep Mode) 9.1 Settings of Switching the Modes The SLEEP pin is controlled by an inverter input. The operation states are determined by the settings shown below. Short the SLEEP pin to the GND_IC if it is not used. Table 1. Control of Sleep Operation 9.2 SLEEP pin voltage Mode Open < VINL Sleep Normal Timing Chart Voltage between SLEEP pin and GND_IC pin Operation Mode NORMAL MODE SLEEP MODE NORMAL MODE Voltage between VCC pin and GND_IC pin VSLEEP2 VSLEEP1 tSLEEP2 tSLEEP1 tSLEEP2 tSLEEP2 Switching A A: B: C: D: E: F: G: H: I: J: B CDE FGH I J Figure 16. Mode Transition Sequences Timing Chart The SLEEP pin voltage changes from Low to High. When tSLEEP1 passes from A, switching operation stops and is contained in a sleep mode. The IC reduces the current consumption in sleep mode and the over current detection value and the switching frequency shifts to IPEAK_D and fSW_B. (Note) When the VCC pin voltage drops to less than VSLEEP1, the switching recovery delay timer starts to operate. The switching operation starts after tSLEEP2 from C. When the VCC pin voltage exceeds VSLEEP2, the switching operation is stopped. Same as C. Same as D. Same as E. The SLEEP pin voltage changes from High to Low. The IC returns to normal mode after tSLEEP2 with the soft start operation. (Note) This IPEAK_D and fSW_B are not only for BM2PDB1Y-Z but also for all of this series. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Description of Blocks – continued 10 Operation Modes of Protection Functions The operation modes of each protection function are as shown in Table 2. Table 2. The Operation Modes of Protection Functions VCC UVLO VCC OVP TSD FB OLP Detection Condition VCC pin voltage < VUVLO2 (while the voltage is dropping) VCC pin voltage > VOVP1 (while the voltage is rising) Junction temperature > TSD1 (while the temperature is rising) Coil current IL ≥ IPEAK_A or IPEAK_D Release Condition VCC pin voltage > VUVLO1 (while the voltage is rising) VCC pin voltage < VOVP2 (while the voltage is dropping) Junction temperature < TSD2 (while the temperature is dropping) or VCC UVLO detection Coil current IL < IPEAK_A or IPEAK_D or VCC UVLO detection tCOMP tCOMP tFOLP1 VCC pin voltage < VOVP2 Junction temperature < TSD2 Coil current IL < IPEAK_A or IPEAK_D Detection Timer Reset Condition – Release Timer Reset Condition Auto Recovery or Latch tFOLP2 – – – Auto recovery Auto recovery Auto recovery www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/32 Coil current IL ≥ IPEAK_A or IPEAK_D Auto recovery TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Description of Blocks – continued 11 External Components Use the parts that match the input and load conditions. Figure 17 shows the application circuit. CFB1 RFB1 CVCC VCC FB GND_IC RFB2 CSLEEP L DRAIN AC Input PC SLEEP DC/DC PC Filter COUT DRAIN CIN μ-Com CD-S Figure 17. Application Circuit 11.1 Output Capacitor COUT The output capacitor COUT should be set to satisfy the specification of the ripple voltage, and guarantee that the output voltage rises to the set value within tFOLP1 after startup. It is recommended to set COUT to 100 μF or more. 11.2 Inductance Value of Coil L The inductance value of coil L should be set depending on the input voltage and output voltage. If the inductance value is too large, the switching operation becomes continuous mode that deteriorates the heat. In the other hand, if the inductance value is too small, the control of IC is impossible during ON time < tMINON, so there is a possibility that the over current detection operates even under a normal load condition. 11.3 VCC Pin Capacitor CVCC The VCC pin capacitor CVCC adjusts the startup time of the IC and the response of Error AMP. It is recommended to be set to 1/100 of COUT or less. 11.4 Output Voltage Feedback Resistor RFB1, RFB2 For reducing the electronic power consumption, RFB1 is recommended to be set to 1 MΩ to 3 MΩ as a reference. For restricting the tolerance of output voltage, use high precision resistors for RFB1 and RFB2. 11.5 Phase Compensation Capacitor CFB1 According to the input and output conditions, the phase compensation capacitor CFB1 may be used. It is recommended to be set to 1 nF to 10 nF. Evaluate with sufficient consideration of the tolerances and temperature characteristics of the components. 11.6 Noise Filter Capacitor CSLEEP In case of using an optocoupler to control the SLEEP pin, for preventing the malfunction on mode transition, it is recommended to use the noise filter capacitor CSLEEP. It is recommended to be set to 10 nF to 100 nF. Notice that the time of mode transitions may become longer by using CSLEEP. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit 650 V 730 V Conditions Maximum Applied Voltage 1 VMAX1 Maximum Applied Voltage 2 VMAX2 -0.3 to +32 V DRAIN pin voltage DRAIN pin voltage (tpulse < 10 μs) (Note 1) VCC pin voltage DRAIN Pin Current (Pulse) IDD 12.00 A Consecutive operation Power Dissipation Pd 1.00 W (Note 2) Tjmax 150 °C Tstg -55 to +150 °C Maximum Junction Temperature Storage Temperature Range Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) Duty is less than 1 %. (Note 2) In case of being mounted on a glass epoxy single layer PCB (70 mm x 70 mm x 1.6 mm). Derate by 8 mW/°C if the IC is used at the ambient temperature 25 °C or above. Thermal Dissipation Make the thermal design by making the IC operates in the following conditions. (Because the following temperature is guaranteed value, it is necessary to consider a margin.) 1. The ambient temperature must be 105 °C or less. 2. The IC’s loss must be the power dissipation Pd or less. The thermal abatement characteristic is as follows. (In case of being mounted on a glass epoxy single layer PCB with size of 70 mm x 70 mm x 1.6 mm) 1.50 Pd [W] 1.00 0.50 0.00 0 25 50 75 100 125 150 Ta [ºC] Figure 18. Thermal Abatement Characteristic Recommended Operating Conditions Parameter Symbol Min Typ Max Unit - - 650 V - - 730 V Conditions Power Supply Voltage Range 2 VCC 11.10 - 26.00 V DRAIN pin voltage DRAIN pin voltage (tpulse < 10 μs) (Note 1) VCC pin voltage Operating Temperature Topr -40 - +105 °C Surrounding temperature Power Supply Voltage Range 1 VDRAIN (Note 1) Duty is less than 1 %. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Electrical Characteristics in MOSFET Section (Unless noted otherwise, Ta = 25 °C) Parameter Voltage between DRAIN and SOURCE DRAIN Pin Leak Current ON Resistor Symbol Min Typ Max Unit 650 - - V 730 - - V IDSS - 0 100 μA ID = 1 mA, VGS = 0 V tpulse < 10 μs VDS = 650 V, VGS = 0 V RDS(ON) - 1.2 2.2 Ω ID = 0.25 A, VGS = 10 V V(BR)DDS Conditions ID = 1 mA, VGS = 0 V Electrical Characteristics in Startup Circuit Section (Unless noted otherwise, Ta = 25 °C) Parameter Symbol Min Typ Max Unit Startup Current 1 ISTART1 0.150 0.300 0.600 mA VCC = 0 V Startup Current 2 ISTART2 1.000 3.000 6.000 mA VCC = 7 V OFF Current ISTART3 - 10 20 μA After UVLO is released VSC 0.4 0.8 1.2 V Startup Current Transition Voltage Conditions Electrical Characteristics in Control IC Section (Unless noted otherwise, Ta = 25 °C) Parameter Symbol Min Typ Max Unit Conditions ION1 - 650 950 μA ION2 - 350 550 μA ISLEEP - 65 95 μA SLEEP pin = open Circuit Current (Common throughout the series) Current at Switching Operation Current at Burst Operation Current at Sleep Mode DRAIN pin = open VCC Pin (Common throughout the series) VCC UVLO Release Voltage VUVLO1 9.70 10.40 11.10 V At VCC pin voltages rising VCC UVLO Detection Voltage VUVLO2 8.20 8.90 9.60 V At VCC pin voltage dropping VCC UVLO Hysteresis VUVLO3 - 1.50 - V VUVLO3 = VUVLO1 - VUVLO2 VCC Recharge Start Voltage VCHG1 8.60 9.30 10.00 V At VCC pin voltage dropping VCC Recharge Stop Voltage VCHG2 9.00 9.70 10.40 V At VCC pin voltage rising VCC Recharge Hysteresis VCHG3 - 0.40 - V VCHG3 = VCHG2 - VCHG1 VCC Sleep Voltage 1 VSLEEP1 11.10 11.50 11.90 V At VCC pin voltage rising VCC Sleep Voltage 2 VSLEEP2 10.20 10.50 10.80 V At VCC pin voltage dropping VCC Sleep Hysteresis VSLEEP3 - 1.00 - V VSLEEP3 = VSLEEP1 - VSLEEP2 VCC OVP Detection Voltage VOVP1 27.00 28.00 29.00 V At VCC pin voltage rising VCC OVP Release Voltage VOVP2 26.00 27.00 28.00 V At VCC pin voltage dropping VCC OVP Hysteresis VOVP3 - 1.00 - V VOVP3 = VOVP1 - VOVP2 VCC OVP / TSD Timer tCOMP 50 100 150 μs Thermal Shutdown (Common throughout the series) TSD Temperature 1 TSD1 150 175 200 °C At temperature rising (Note 1) TSD Temperature 2 TSD2 - 100 - °C At temperature dropping (Note 1) TSD Hysteresis TSD3 - 65 - °C (Note 1) (Note 1) Not 100 % tested. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Electrical Characteristics in Control IC Section – continued (Unless noted otherwise, Ta = 25 °C) Parameter Symbol Min Typ Max Unit Conditions Switching Frequency A fSW_A 60.0 65.0 70.0 kHz After soft start Frequency Hopping Width A fDEL_A - 4.0 - kHz After soft start Switching Frequency A1 fSS_A1 - 15.0 - kHz (Note 1, 2) Switching Frequency A2 fSS_A2 - 30.0 - kHz (Note 1, 2) Switching Frequency B fSW_B 22.5 25.0 27.5 kHz After soft start Frequency Hopping Width B fDEL_B - 1.5 - kHz After soft start Switching Frequency B1 fSS_B1 - 6.0 - kHz (Note 1, 2) Switching Frequency B2 fSS_B2 - 12.0 - kHz (Note 1, 2) DC/DC Driver Section (BM2PxA1Y-Z) DC/DC Driver Section (BM2PxB1Y-Z) DC/DC Driver Section (Common throughout the series) Maximum Duty DMAX 35 40 45 % FB OLP Detection Timer tFOLP1 52 64 76 ms FB OLP OFF Timer tFOLP2 416 512 608 ms Soft Start Time 1 tSS1 6.8 8.0 9.2 ms Soft Start Time 2 tSS2 13.6 16.0 18.4 ms FB Pin Control Voltage VFB 1.98 2.00 2.02 V Over Current Detection Current A IPEAK_A 1.57 1.76 1.94 A Over Current Detection Current A1 IPEAK_A1 - 0.88 - A (Note 1, 3) Over Current Detection Current A2 IPEAK_A2 - 1.32 - A (Note 1, 3) Dynamic Over Current Detection Current A IDPEAK_A 2.73 3.08 3.43 A Dynamic Over Current Detection Current A1 IDPEAK_A1 - 1.54 - A (Note 1, 3) Dynamic Over Current Detection Current A2 IDPEAK_A2 - 2.31 - A (Note 1, 3) Over Current Detection Current D IPEAK_D 0.83 0.93 1.04 A Over Current Detection Current D1 IPEAK_D1 - 0.46 - A (Note 1, 3) Over Current Detection Current D2 IPEAK_D2 - 0.69 - A (Note 1, 3) Dynamic Over Current Detection Current D IDPEAK_D 1.43 1.62 1.81 A Dynamic Over Current Detection Current D1 IDPEAK_D1 - 0.81 - A (Note 1, 3) Dynamic Over Current Detection Current D2 IDPEAK_D2 - 1.21 - A (Note 1, 3) I2F_AA 149 191 233 A2kHz I2F_AB 51 73 96 A2kHz I2F_DA 33 48 62 A2kHz I2F_DB 11 18 26 A2kHz Over Current Detection Section (BM2PAx1Y-Z) Over Current Detection Section (BM2PDx1Y-Z) Over Current Detection Section（BM2PAA1Y-Z） Power Coefficient AA Over Current Detection Section（BM2PAB1Y-Z） Power Coefficient AB Over Current Detection Section（BM2PDA1Y-Z） Power Coefficient DA Over Current Detection Section（BM2PDB1Y-Z） Power Coefficient DB (Note 1) Not 100 % tested. (Note 2) Refer to Figure 14. (Note 3) Refer to Figure 13. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Electrical Characteristics in Control IC Section – continued (Unless noted otherwise, Ta = 25 °C) Over Current Detection Section (Common throughout the series) Dynamic Over Current Enforced OFF Time tDPEAK - 128 - μs (Note 1) Minimum ON Width tMINON - 200 - ns (Note 1) Sleep Pin Low Voltage VINL - - 1.0 V Sleep Pin High Voltage VINH 3.5 - - V Sleep Pin Pull Up Resistor RSLEEP 1.2 2.0 2.8 MΩ Sleep Operation Start Mask Time tSLEEP1 1.0 2.0 3.0 ms Switching Recovery Delay Time tSLEEP2 50 200 350 μs Sleep Pin (Common throughout the series) SLEEP pin = open (Note 1) Not 100 % tested. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Typical Performance Curves (Reference Data) 500 Current at Burst Operation: ION2 [μA] Current at Switching Operation: ION1 [μA] 900 800 700 600 500 400 -40 -20 0 20 40 60 80 100 120 450 400 350 300 250 200 -40 -20 0 Temperature [°C] Figure 19. Current at Switching Operation vs Temperature Figure 20. Current at Burst Operation vs Temperature 10.50 VCC UVLO Release Voltage: VUVLO1 [V] 90 Current at Sleep Mode: ISLEEP [μA] 20 40 60 80 100 120 Temperature [°C] 80 10.45 70 10.40 60 10.35 50 40 -40 -20 0 10.30 -40 -20 20 40 60 80 100 120 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 21. Current at Sleep Mode vs Temperature www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 22. VCC UVLO Release Voltage vs Temperature 20/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Typical Performance Curves – continued (Reference Data) 9.5 VCC Recharge Start Voltage: VCHG1 [V] VCC UVLO Detection Voltage: VUVLO2 [V] 9.00 8.95 8.90 8.85 8.80 -40 -20 0 9.4 9.3 9.2 9.1 -40 -20 20 40 60 80 100 120 0 Temperature [°C] Figure 23. VCC UVLO Detection Voltage vs Temperature Figure 24. VCC Recharge Start Voltage vs Temperature 11.7 VCC Sleep Voltage 1: VSLEEP1 [V] VCC Recharge Stop Voltage: VCHG2 [V] 9.9 9.8 9.7 9.6 9.5 -40 -20 20 40 60 80 100 120 Temperature [°C] 0 20 40 60 80 100 120 Temperature [°C] 11.5 11.4 11.3 -40 -20 0 20 40 60 80 100 120 Temperature [°C] Figure 25. VCC Recharge Stop Voltage vs Temperature www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11.6 21/32 Figure 26. VCC Sleep Voltage 1 vs Temperature TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Typical Performance Curves – continued (Reference Data) 1.02 VCC Sleep Hysteresis: VSLEEP3 [V] VCC Sleep Votlage 2: VSLEEP2 [V] 10.7 10.6 10.5 10.4 10.3 -40 -20 0 20 40 60 80 100 120 1.01 1.00 0.99 0.98 -40 -20 0 Temperature [°C] Figure 27. VCC Sleep Voltage 2 vs Temperature Figure 28. VCC Sleep Hysteresis vs Temperature 27.2 VCC OVP Release Voltage: VOVP2 [V] 28.2 VCC OVP Detection Voltage: VOVP1 [V] 20 40 60 80 100 120 Temperature [°C] 28.1 28.0 27.9 27.8 -40 -20 0 27.0 26.9 26.8 -40 -20 20 40 60 80 100 120 Temperature [°C] 0 20 40 60 80 100 120 Temperature [°C] Figure 29. VCC OVP Detection Voltage vs Temperature www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 27.1 22/32 Figure 30. VCC OVP Release Voltage vs Temperature TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Typical Performance Curves – continued (Reference Data) 26.0 Switching Frequency B: fSW_B [kHz] Switching Frequency A: fSW_A [kHz] 66.0 65.5 65.0 64.5 64.0 -40 -20 0 20 40 60 80 100 120 25.5 25.0 24.5 24.0 -40 -20 0 Temperature [°C] Figure 31. Switching Frequency A vs Temperature Figure 32. Switching Frequency B vs Temperature FB OLP Detection Timer: tFOLP1 [ms] Maximum Duty: D MAX [%] 40.2 40.1 40.0 39.9 39.8 -40 -20 0 20 40 60 80 100 120 Temperature [°C] 66 65 64 63 62 -40 -20 0 20 40 60 80 100 120 Temperature [°C] Figure 33. Maximum Duty vs Temperature www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20 40 60 80 100 120 Temperature [°C] Figure 34. FB OLP Detection Timer vs Temperature 23/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Typical Performance Curves – continued (Reference Data) 8.2 Soft Start Time 1: tSS1 [ms] FB OLP OFF Timer: tFOLP2 [ms] 530 525 520 515 510 505 500 -40 -20 0 8.1 8.0 7.9 7.8 7.7 -40 -20 20 40 60 80 100 120 0 Temperature [°C] Figure 35. FB OLP OFF Timer vs Temperature Figure 36. Soft Start Time 1 vs Temperature 2.02 FB Pin Control Voltage: VFB [V] Soft Start Time 2: tSS2 [ms] 16.4 16.2 16.0 15.8 15.6 15.4 -40 -20 20 40 60 80 100 120 Temperature [°C] 0 2.00 1.99 1.98 -40 -20 20 40 60 80 100 120 Temperature [°C] 0 20 40 60 80 100 120 Temperature [°C] Figure 37. Soft Start Time 2 vs Temperature www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2.01 Figure 38. FB Pin Control Voltage vs Temperature 24/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Typical Performance Curves – continued (Reference Data) 1.05 Over Current Detection Current D: IPEAK_D [A] Over Current Detection Current A: IPEAK_A [A] 1.90 1.80 0.95 1.70 1.60 -40 -20 0.85 0 0.75 -40 -20 20 40 60 80 100 120 0 20 40 60 80 100 120 Temperature [°C] Temperature [°C] Figure 39. Over Current Detection Current A vs Temperature Figure 40. Over Current Detection Current D vs Temperature 2.00 Dynamic Over Current Detection Current D: IDPEAK_D [A] Dynamic Over Current Detection Current A: IDPEAK_A [A] 3.60 3.40 3.20 3.00 2.80 2.60 -40 -20 0 Temperature [°C] www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 1.70 1.55 1.40 -40 -20 20 40 60 80 100 120 Figure 41. Dynamic Over Current Detection Current A vs Temperature 1.85 0 20 40 60 80 100 120 Temperature [°C] Figure 42. Dynamic Over Current Detection Current D vs Temperature 25/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Application Examples Show a flyback circuitry example in Figure 43. High voltage is produced by such as ringing in turn OFF at the DRAIN pin. up to 730 V. The voltage during this ringing can be tolerated Fuse AC Input Filter Diode Bridge DRAI N DRAI N SLEEP GND_IC VCC Error AMP FB Signal Figure 43. Flyback Application Circuit Diagram 730 V 650 V DRAIN pin voltage 0V tpulse < 10 μs　(Duty < 1 %) Figure 44. Drain Pin Ringing Waveform www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 26/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series I/O Equivalence Circuit 7 DRAIN 6 DRAIN - - 5 VCC DRAIN DRAIN VCC Internal MOSFET Internal MOSFET GND_IC 1 N. C. GND_IC GND_IC 2 SLEEP 3 GND_IC 4 FB Internal Reg. GND_IC FB SLEEP - GND_IC GND_IC www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 27/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 28/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Operational Notes – continued 10. Regarding the Input Pin of the IC This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Figure 45. Example of IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 29/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Ordering Information B M 2 P x x Over Current Detection Current A: 1.76 A D: 0.93 A 1 Y - Z Switching Frequency and Frequency Reduction A: 65 kHz with frequency reduction B: 25 kHz without frequency reduction Z: Outsourced package Marking Diagram DIP7K (TOP VIEW) Part Number Marking LOT Number Lineup Part Number Marking Orderable Part Number BM2PAA1Y BM2PAB1Y BM2PDA1Y BM2PDB1Y BM2PAA1Y-Z BM2PAB1Y-Z BM2PDA1Y-Z BM2PDB1Y-Z www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Oscillatory Frequency 65 kHz 25 kHz 65 kHz 25 kHz 30/32 Frequency Reduction Yes No Yes No Over Current Detection Current 1.76 A 0.93 A TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Physical Dimension and Packing Information Package Name www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 DIP7K 31/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 BM2Pxx1Y-Z Series Revision History Date Revision 17.Jun.2021 001 Changes New release www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 32/32 TSZ02201-0F1F0A200620-1-2 17.Jun.2021 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001