BM2SCQ121T-LBZ

Datasheet Quasi-resonant AC/DC Converter Built-in 1700 V SiC-MOSFET BM2SCQ12xT-LBZ Series General Description Key Specifications This is the product guarantees long time support in industrial market. BM2SCQ12xT-LBZ series is a quasi-resonant AC/DC converter that provides an optimum system for all products which has an electrical outlet. Quasi-resonant operation enables soft switching and helps to keep the EMI low. This IC can be designed easily because it includes the 1700 V/4 A SiC (Silicon-Carbide) MOSFET. Design with a high degree of flexibility is achieved with current detection resistors as external devices. The burst operation reduces an input power at light load. BM2SCQ12xT-LBZ series includes various protection functions, such as soft start function, burst operation, over current limiter per cycle, over-voltage protection function, overload protection function. ◼ Operating Power Supply Voltage Range: VCC: 15.0 V to 27.5 V DRAIN: 1700 V (Max) ◼ Normal Operating Current: 2000 µA (Typ) ◼ Burst Operating Current: 500 µA (Typ) ◼ Maximum Operating Frequency: 120 kHz (Typ) ◼ Operating Temperature: -40 °C to +105 °C Package TO220-6M W (Typ) x D (Typ) x H (Max) 10.0 mm x 4.5 mm x 25.6 mm Features ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ Long Time Support Product for Industrial Applications 6 Pins: TO220-6M Package Built-in 1700 V/4 A/1.12 Ω SiC-MOSFET Quasi-resonant Type (Low EMI) Frequency Reduction Function Low Current Consumption (19 µA) during Standby Burst Operation at Light Load SOURCE Pin Leading Edge Blanking VCC UVLO (Under Voltage Lockout protection) VCC OVP (Over Voltage Protection) Over Current Protection Circuit per Cycle Soft Start Function ZT Pin Trigger Mask Function ZT OVP (Over Voltage Protection) Applications Power Supply for Industrial Equipment, AC Adaptor, Household Appliances Lineup Product name BM2SCQ121T-LBZ BM2SCQ122T-LBZ BM2SCQ123T-LBZ BM2SCQ124T-LBZ FB OLP Auto Restart Latch Auto Restart Latch VCC OVP Latch Latch Auto Restart Auto Restart Typical Application Circuit FUSE Filter Diode Bridge DRAIN SOURCE FB GND ZT VCC ERROR AMP 〇Product structure :Silicon and silicon carbide integrated circuit .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Pin Configuration (TOP VIEW) DRAIN 1 SOURCE FB 2 3 GND ZT VCC 4 5 6 Pin Description Pin No. Pin Name I/O 1 2 3 4 5 6 DRAIN SOURCE FB GND ZT VCC I/O I I I/O I I www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Function MOSFET DRAIN pin MOSFET SOURCE pin Feedback signal input pin GND pin Zero current detection pin Power supply input pin 2/30 ESD Diode VCC GND ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ - TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Block Diagram VOUT VH FUSE RSTART Diode Bridge Filter Va CVCC 6 VCC DRAIN + 1 VCC UVLO - NOUT 4.0 V Regulator Internal 18.5 V/14.0 V 18.0 V Clamper Supply + - ZT ACSNS Comp. + - + - RZT1 ZT CZT 5 + ZT OVP Comp. (LATCH) ZT Comp. AND ZT Blanking OUT(H->L) 0.60 µs 200 mV - VREF(4 V) FB Time Out ( 45 µs ) 1700 V SiC-MOSFET OSC ERROR AMP OR S Q AND NOUT FBOLP_OH OR Maximum Blanking Frequency (120 kHz) + + 20 kΩ OSC 1 shot - 7V RZT2 VCC OVP 28.0 V AND PRE Driver POUT OUT NOUT R 1.00 V 3 + Burst Comp. - 0.50 V CFB OLP + - Timer (128 ms) FBOLP_OH Soft Start 200 kΩ 200 kΩ FB/2 1.00 V - DCDC Comp. + CURRENT SENSE (V-V Change) Normal: ｘ 1.0 Leading Edge Blanking 2 SOURCE RS 4 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 GND 3/30 PC TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Description of Blocks 1 Startup Sequences (FB OLP: Auto Recovery Mode) The BM2SCQ12xT-LBZ’s startup sequence is shown in Figure 1. See the sections below for the detailed descriptions. Input Voltage VH 19.5 V VCC Pin Voltage 14.0 V Internal REF Pull Up VFLOP1 VFLOP2 128 ms 128 ms 128 ms FB Pin Voltage VOUT Normal Load Over Load Light Load IOUT Burst Mode Switching Soft Start Time A BC D E F GH IJ K Figure 1. Startup Sequence Timing Chart A: B: The input voltage VH is applied. The VCC pin voltage rises due to start resistor RSTART, and this IC starts operating when the VCC pin voltage becomes higher than VUVLO1 (Typ = 19.5 V). When the protection functions are judged as normal status, the switching operation starts. At that time, since the VCC pin voltage value always drops due to the pin's consumption current, it is necessary to set the VCC pin voltage to higher than VUVLO2 (Typ = 14.0 V). C: The IC has a soft start function which regulates the voltage level at the SOURCE pin to prevent an excessive rise in voltage and current. D: When the switching operation starts, VOUT rises. At startup, the output voltage should be set to the regulated voltage within tFOLP period (Typ = 128 ms). E: At a light load, the IC starts burst operation in order to keep power consumption down. F: Overload operation. G: When the FB pin voltage keeps being more than VFOLP1 (Typ = 2.8 V) for tFOLP (Typ = 128 ms) or more, the switching operation is stopped by the overload protection circuit. If the FB pin voltage status becomes less than VFOLP2(Typ = 2.6 V) even once, tFOLP (Typ = 128 ms) timer is reset H: When the VCC pin voltage becomes VUVLO2 (Typ = 14.0 V) or less, restart is executed. I: The IC’s circuit current is reduced and the VCC pin voltage rises. (Same as B) J: Same as F. K: Same as G. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series 1 Startup Sequences (FB OLP: Auto Recovery Mode) – continued Start resistance RSTART is the resistance required to start the IC. If the start resistance RSTART value is set to low, the standby power becomes large and the startup time becomes short. Conversely, if the start resistance RSTART value is set to large, standby power becomes low and the startup time becomes long. The standby current IOFF of BM2SCQ12xT-LBZ is 30 µA (Max). However, this is the minimum current required to start the IC. It is necessary to set the appropriate current value for the set target. e.g. Start Resistance RSTART Setting 𝑅𝑆𝑇𝐴𝑅𝑇 < (𝑉𝑀𝐼𝑁 − 𝑉𝑈𝑉𝐿𝑂 (𝑀𝑎𝑥)) ÷ 𝐼𝑂𝐹𝐹 [Ω] Where: 𝑅𝑆𝑇𝐴𝑅𝑇 is the start resistance. 𝑉𝑀𝐼𝑁 is the minimum AC voltage. 𝑉𝑈𝑉𝐿𝑂 is the VCC UVLO voltage. 𝐼𝑂𝐹𝐹 is the standby current. When the AC input voltage is AC 80 V, VMIN = 113 V. And it can be calculated as (113 - 20)/30 μA = 3.1 MΩ because VUVLO1 (Max) = 20.0 V at this time. Considering the optimal value for the resistor which is 3.1 MΩ or less and set RSTART to 3.0 MΩ. The power dissipation at this time is calculated by the formula below. 𝑃𝑑(𝑅𝑆𝑇𝐴𝑅𝑇 ) = (𝑉𝐻 − 𝑉𝐶𝐶 )2 ÷ 𝑅𝑆𝑇𝐴𝑅𝑇 = (141𝑉 − 14V)2 ÷ 3.0𝑀𝛺 = 5.4 [mW] Where: 𝑃𝑑 is the power dissipation. 𝑅𝑆𝑇𝐴𝑅𝑇 is the start resistance. 𝑉𝐻 is the input voltage. 𝑉𝐶𝐶 is the IC power supply voltage. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Description of Blocks – continued 2 VCC Pin Protection Function BM2SCQ12xT-LBZ includes the VCC low voltage protection function VCC UVLO and the VCC over voltage protection function VCC OVP. These functions prevent the abnormal voltage-related break in MOSFETs used for switching. The VCC UVLO function is an auto recovery type comparator with voltage hysteresis and the VCC OVP function is the comparator uses latch mode or auto recovery mode. After latch function is detected by VCC OVP, latching is released (reset) when the condition the VCC pin voltage < VLATCH (Typ = VUVLO2 - 3.5 V) is met. This operation is shown in Figure 2. And VCC OVP has a built-in mask time tLATCH (Typ = 150 µs). This function masks such as the surges occur at the pin. Input Voltage VH VOVP1 VUVLO1 VCC Pin Voltage VUVLO2 VLATCH 0V ON ON VCC UVLO OFF OFF ON VCC OVP OFF ON Switching OFF ON OFF OFF OFF L : Normal H : Latch Internal Latch Signal A B C DE F G H I J K L M N A B Time Figure 2. VCC UVLO/OVP (Latch Mode) A: B: C: D: E: F: G: H: I: VH is applied, the VCC voltage rises. When the VCC pin voltage is higher than VUVLO1 (Typ = 19.5 V), the switching operation starts. When the VCC pin voltage is lower than VUVLO2 (Typ = 14.0 V), the switching operation stops. When the VCC pin voltage is higher than VUVLO1 (Typ = 19.5 V), the switching operation starts. The VCC pin voltage drops until the output voltage is stabilized. The VCC pin voltage rises. When the VCC pin voltage is higher than VOVP1 (Typ = 29.5 V), the switching is stopped by an internal latch signal. When the switching operation stops, power supply from the auxiliary coil stops and the VCC pin voltage drops. When the VCC pin voltage is lower than VUVLO2 (Typ = 14.0 V), the VCC pin voltage rises because the IC current consumption current drops. J: When the VCC pin voltage is higher than VUVLO1 (Typ = 19.5 V), there are no switching operations because the IC is during latch operation. The VCC pin voltage drops because the IC current consumption current is lowered. K: Same as H. L: Same as I. M: VH is OPEN (unplugged). The VCC pin voltage drops. N: When the VCC pin voltage < VLATCH (Typ = VUVLO2 -3.5 V), it is latch-released. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Description of Blocks – continued 3 DC/DC Converter Function BM2SCQ12xT-LBZ uses PFM (Pulse Frequency Modulation) mode control. The FB pin, the ZT pin, and the SOURCE pin are monitored to provide a system optimized as DC/DC. The switching MOSFET ON width (turn OFF) is controlled by the FB pin and the SOURCE pin, and the OFF width (turn ON) is controlled by the ZT pin. By setting maximum frequency, PFM mode will control it to meet noise regulation. A detailed description is below. (Refer to Figure 3) VH RSTART Va CVCC 6 VCC DRAIN 1 18.0 V Clamper NOUT + - ZT ACSNS Comp. 1700 V SiC-MOSFET + - RZT1 ZT CZT 5 + ZT OVP Comp. (LATCH) ZT Comp. 7V RZT2 1 shot AND - ZT Blanking OUT(H L) 0.60 µs 200 mV - OR AND NOUT S Q FBOLP_OH AND OR Maximum Blanking Frequency (120 kHz) + + VREF(4 V) Time Out ( 45 µs ) PRE Driver POUT OUT NOUT R 1.00 V FB 20 kΩ 3 + Burst Comp. - 0.50V CFB OLP + - Timer (128 ms) FBOLP_OH Soft Start 200 kΩ 200 kΩ FB/2 1.00 V - DCDC Comp. + CURRENT SENSE (V-V Change) Normal: x 1.0 Leading Edge Blanking 2 SOURCE RS 4 GND Figure 3. Block Diagram of DC/DC Operations www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series 3 DC/DC Converter Function – continued 3.1 Determination of ON Width (Turn OFF) ON width is controlled by the FB pin and SOURCE pin. The ON width is determined by comparing the FB pin voltage at 1/AV (Typ = 1/2) with the SOURCE pin voltage. In addition, the comparator level is changed by comparing with the IC's internally generated VLIM1A (Typ = 1.0 V), as is shown in Figure 4. The SOURCE pin is also used for the over current limiter circuit per pulse. Changes at the FB pin changes in the maximum blanking frequency and over current limiter level. mode 1: Burst operation mode 2: Frequency reduction operation (reduces maximum frequency) mode 3: Maximum frequency operation (operates at maximum frequency) mode 4: Overload operation (pulse operation is stopped when overload is detected) Maximum Operating Frequency [kHz] mode 1 mode 2 mode 3 mode 4 fSW1 fSW2 0.0 CS　 Limiter [V] 0.5 mode 1 2.0 1.25 mode 3 mode 2 FB Pin Voltage [V] 2.8 mode 4 VLIM1 VLIM2 0.0 0.5 1.25 2.0 2.8 FB Pin Voltage [V] Figure 4. Relationship of FB Pin Voltage to Over Current Limiter and Maximum Frequency The switch of over current protection in the soft start function and input voltage is performed by adjusting the over current limiter lever. In this case, the VLIM1 and VLIM2 values are as listed below. Soft Start Table 1. Over Current Protection Voltage IZT ≥ -1.0 mA VLIM1A IZT < -1.0 mA VLIM2A VLIM1B VLIM2B from startup to less than 1 ms 0.250 V (25.0 %) 0.063 V (6.3 %) 0.175 V (17.5 %) 0.047 V (4.7 %) from 1 ms to less than 4 ms 0.500 V (50.0 %) 0.125 V (12.5 %) 0.350 V (35.0 %) 0.094 V (9.4 %) 4 ms or more 1.000 V (100.0 %) 0.250 V (25.0 %) 0.700 V (70.0 %) 0.188 V (18.8 %) (Note) Values those compared to VLIM1A (Typ = 1.0 V) during IZT ≥ -1.0 mA are shown in (). 3.2 L.E.B. (Leading Edge Blanking) Function When the switching MOSFET is turned ON, surge current occur at each capacitor component and drive current. Therefore, when the SOURCE pin voltage rises temporarily, detection errors may occur in the over current limiter circuit. To prevent detection errors, BM2SCQ12xT-LBZ has the blanking function. This function masks the SOURCE pin voltage for tLEB (Typ = 250 ns) after the DRAIN pin changes from high to low. This blanking function reduces the SOURCE pin noise filter. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series 3 DC/DC Converter Function – continued 3.3 SOURCE Over Current Protection Switching Function When the input voltage (VH) becomes high, the ON time is shortened and the operating frequency increases. As a result, the maximum rated power is increased for a certain over current limiter. As a countermeasure, the IC will use its internal over current protection function to switch. In case of high voltage, the over current comparator value which determines the ON time is multiplied by 0.7 of normal operation. Detection and switch are performed by monitoring the ZT inflow current. When the MOSFET is turned ON, Va becomes a negative voltage dependent on the input voltage (VH). The ZT pin is clamped to nearly 0 V in the IC. The formula used to calculate this is shown below. A block diagram is shown in Figure 5. Also, graphs are shown in Figure 6, Figure 7 and Figure 8. [A] 𝐼𝑍𝑇 = (𝑉𝑎 − 𝑉𝑍𝑇 ) ÷ 𝑅𝑍𝑇1 = 𝑉𝑎 ÷ 𝑅𝑍𝑇1 = 𝑉𝐻 × 𝑁𝑎 ÷ 𝑁𝑝 ÷ 𝑅𝑍𝑇1 𝑅𝑍𝑇1 = 𝑉𝑎 ÷ 𝐼𝑍𝑇 [Ω] Where: 𝐼𝑍𝑇 is the ZT inflow current. 𝑉𝑎 is the auxiliary winding voltage. 𝑉𝑍𝑇 is the ZT pin voltage. 𝑅𝑍𝑇1 is the ZT pin resistance 1. 𝑉𝐻 is the input voltage. 𝑁𝑎 is the primary side winding. 𝑁𝑝 is the auxiliary winding. From the above, the VH voltage is set with a resistance value (RZT1). The ZT bottom detection voltage is determined at that time, therefore, set the timing with CZT. VH RSTART Va CVCC IZT =(VH x Na)/(Np x RZT1) 6 VCC DRAIN 1 18.0 V Clamper NOUT + - ZT ACSNS Comp. + - RZT1 CZT ZT RZT2 5 + ZT OVP Comp. (LATCH) ZT Comp. 1 shot AND - 7V ZT Blanking OUT(H L) 0.60 µs 200 mV - OR AND NOUT S Q FBOLP_OH AND OR Maximum Blanking Frequency (120 kHz) + + VREF(4 V) Time Out ( 45 µs ) PRE Driver POUT OUT NOUT R 1.00 V FB 20 kΩ 3 + Burst Comp. - 0.50V CFB OLP + - Timer (128 ms) FBOLP_OH Soft Start 200 kΩ 200 kΩ FB/2 1.00 V - DCDC Comp. + CURRENT SENSE (V-V Change) Normal: x 1.0 Leading Edge Blanking 2 SOURCE RS 4 GND Figure 5. Block Diagram of SOURCE Switching Current www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series 3.3 SOURCE Over Current Protection Switching Function – continued SOURCE Y 　Limiter [V] mode 1 mode 2 mode 3 mode 4 VLIM1A VLIM1B IZT ≥ -1.0 mA IZT < -1.0 mA VLIM2A VLIM2B 0.0 0.5 1.0 1.5 X 2.8 FB pin voltage [V] 2.0 Figure 6. SOURCE Switching: SOURCE Limiter vs FB Pin Voltage Y SOURCE 　Limiter [V] VLIM1 VLIM1 x 0.7 1.0 ZT Pin Current [mA] X Figure 7. SOURCE Switching: SOURCE Limiter vs ZT Pin Current e.g. Setup method (for switching between 100 V AC and 220 V AC.) 100 V AC: 141 V ±42 V (±30 % margin) 220 V AC: 308 V ±62 V (±20 % margin) In the above cases, the SOURCE current is switched in the range from 182 V to 246 V. → This is done when VH = 214 V. Given: Np = 100, Na = 15. 𝑉𝑎 = 𝑉𝐼𝑁 × 𝑁𝑎 ÷ 𝑁𝑝 = 214𝑉 × 15 ÷ 100 × (−1) = −32.1 𝑅𝑍𝑇 = 𝑉𝑎 ÷ 𝐼𝑍𝑇 = −32.1𝑉 ÷ −1𝑚𝐴 = 32.1 [kΩ] [V] Where: 𝑉𝑎 is the auxiliary winding voltage. 𝑉𝐼𝑁 is the input voltage. 𝑁𝑎 is the primary side winding. 𝑁𝑝 is the auxiliary side winding. 𝑅𝑍𝑇 is the ZT pin resistance. 𝐼𝑍𝑇 is the ZT pin inflow current. According to the above, RZT = 32 kΩ is set. SOURCE 　Limiter [V] Y VLIM1 VLIM1 x 0.7 214 VH Pin Voltage [V] X Figure 8. Example of SOURCE Switching: SOURCE Limiter vs VH Pin Voltage www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series 3 DC/DC Converter Function – continued 3.4 Determination of OFF Width (Turn ON) The OFF width is controlled at the ZT pin. While switching is OFF, the power stored in the coil is supplied to the secondary side output capacitor. When this power supply ends, there is no more current flowing to the secondary side, so the DRAIN pin of switching MOS voltage drops. Consequently, the voltage on the auxiliary coil side also drops. A voltage that was resistance-divided by RZT1 and RZT2 is applied to the ZT pin. When this voltage level drops to VZT1 (Typ = 100 mV) or below, switching is turned ON by the ZT comparator. To detect zero current status at the ZT pin, time constants are generated using CZT, RZT1, and RZT2. Additionally, the ZT trigger mask and the ZT timeout function are built-in. 3.5 ZT Pin Trigger Mask Function When the switching is set OFF from ON, superposition of noise may occur at the ZT pin. At this time, the ZT comparator is masked for the tZTMASK (Typ = 0.60 µs) to prevent the ZT comparator operate errors. (Refer to Figure 9) ON Switching OFF ON OFF ON OUT ZT Pin Voltage tZMASK ZT Trigger Mask Pin A B C tZMASK D E F G Time Figure 9. ZT Pin Trigger Mask Function A: B: C: D: E: F: G: Switching is OFF→ON Switching is ON→OFF Because noise occurs at the ZT pin, the ZT comparator is not operated during tZTMASK (Typ = 0.60 µs). Same as A. Same as B. Same as C. Same as A. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series 3 DC/DC Converter Function – continued 3.6 ZT Timeout Function ZT Timeout Function 1 When the ZT pin voltage is not higher than VZT2 (Typ = 200 mV) during tZTOUT1 (Typ = 45 µs) because of the decrease of output voltage or the shorted ZT pin such as at startup, this function turns on the switching by force. ZT Timeout Function 2 After the ZT comparator detects the bottom, the IC turns on MOSFET by force when the IC does not operate next detection within tZTOUT2 (Typ = 5.0 µs). After the ZT comparator detected signal once, this function operates. For that, it does not operate at startup or at low output voltage. When the IC is not able to detect bottom by decreasing auxiliary winding voltage, the function operates. ZT pin GND short ZT Pin VZT2 voltage VZT1 Bottom Detection 5 µs 5 µs Timeout 5 µs 45 µs 45 µs Timeout 45 µs SOURCE Pin Voltage DRAIN Pin Voltage A BC D E F G H I Time Figure 10. ZT Timeout Function A: B: C: D: E: F: G: H: I: At startup, the IC starts to operate by ZT timeout function1 because of the ZT pin voltage is 0 V. MOSFET turns ON. MOSFET turns OFF. The ZT pin voltage drops to lower than VZT2 (Typ = 200 mV) by the oscillation decreasing. MOSFET turns ON after tZTOUT2 (Typ = 5.0 µs) from D point by ZT timeout function 2. The ZT pin voltage drops to lower than VZT2 (Typ = 200 mV) by the oscillation decreasing. MOSFET turns ON after tZTOUT2 (Typ = 5.0 µs) from F point by ZT timeout function 2. The ZT pin is shorted to GND. MOSFET turns ON after tZTOUT1 (Typ = 45.0 µs) by ZT timeout function 1. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Description of Blocks – continued 4 Soft Start Function Normally, a large current flows to the AC/DC power supply when the AC power supply is turned ON. BM2SCQ12xT-LBZ includes a soft start function to prevent large changes in the output voltage current during startup. This function is performed when the VCC pin voltage drops to VUVLO2 (Typ = 14.0 V) or less. Soft start function performs the following operation after startup. (Refer to turn OFF described above in section 3.1). ･ from startup to less than 1 ms → Set the SOURCE limiter value to 25 % of normal ･ from 1 ms to less than 4 ms → Set the SOURCE limiter value to 50 % of normal ･ 4 ms or more → Normal operation 5 Over Load Protection Function The overload protection function monitors the overload status of the secondary output current at the FB pin and fixes the OUT pin at low level when the overload status is detected. During overload status, current no longer flows to the photo-coupler, so the FB pin voltage rises. When this status continues for the tFOLP (Typ = 128 ms), it judges the status as an overload and the OUT pin is fixed at low level. If the FB pin voltage drops to lower than VFOLP2 (Typ = 2.6 V) within tFOLP (Typ = 128 ms) after once it exceeds VFOLP1 (Typ = 2.8 V), the overload protection timer is reset. At startup, the FB pin voltage is pulled up to the internal voltage by a pull-up resistor, so operation starts from VFOLP1 (Typ = 2.8 V) or above. Therefore, it is necessary for the design to set the FB pin voltage at VFOLP2 (Typ = 2.6 V) or below within tFOLP (Typ = 128 ms). In other words, the startup time of the secondary output voltage must be set to within tFOLP (Typ = 128 ms) after the IC starts. To release latching at selecting latch mode is operated when the VCC pin voltage becomes lower than VLATCH (Typ = VUVLO2 - 3.5 V) by unplugging power supply. 6 ZT OVP (Over Voltage Protection) ZT OVP (Over Voltage Protection) function is built-in the ZT pin. When the ZT pin voltage reaches VZTL (Typ = 3.5 V), this function operates detection. The ZT pin OVP function is performed in latch mode. ZT OVP function has a built-in mask time defined as tLATCH (Typ = 150 µs). This operates detection when ZT OVP status continues for tLATCH (Typ = 150 µs). This function masks such as surges those occur at the pin. Refer to Figure 11. (A similar tLATCH (Typ = 150 µs) is built-in VCC OVP.) ΔT1 < tLATCH (Typ = 150 µs) ΔT2 = tLATCH (Typ = 150 µs) ΔT1 ΔT2 VZTL PULSE ZT　Pin Voltage PULSE ON Switching OFF A B C D E Figure 11. ZT OVP and Latch Mask Function A: B: C: D: E: Switching turns ON and the ZT pin starts pulse operation. The ZT pin voltage > VZTL (Typ = 3.5 V). The status of the ZT pin voltage > VZTL (Typ = 3.5 V) is within tLATCH (Typ = 150 µs), so the switching is reset to the normal operations. The ZT pin voltage > VZTL (Typ = 3.5 V). The status of ZT pin voltage > VZTL (Typ = 3.5 V) continues for tLATCH (Typ = 150 µs), so latching occurs and the switching turned OFF. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Description of Blocks – continued 7 Thermal Shutdown Function Thermal Shutdown function is auto restart type. When VCC UVLO is released, the IC starts from state 2 because of preventing from thermal destruction of external parts. At startup, it does not start until the temperature becomes T1 or below. (Refer to Figure 12.) Switching State 2 OFF State 1 ON T1 = 135 °C (Typ) T2 = 185 °C (Typ) Temperature [°C] Figure 12. Thermal Shutdown Function Operation Modes of Protection Circuit Table 2 below lists the operation modes of the various protection functions. Table 2. Operation Modes of Protection Circuit Item Operation Mode VCC Under Voltage Locked Out Auto recovery VCC Over Voltage Protection BM2SCQ121T-LBZ/BM2SCQ122T-LBZ = Latch BM2SCQ123T-LBZ/BM2SCQ124T-LBZ = Auto recovery FB Over Limited Protection BM2SCQ121T-LBZ/BM2SCQ123T-LBZ = Auto recovery BM2SCQ122T-LBZ/BM2SCQ124T-LBZ = Latch ZT Over Voltage Protection Latch Thermal Shutdown www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Auto recovery 14/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit Conditions Maximum Applied Voltage 1 VMAX1 -0.3 to +32 V The VCC pin Maximum Applied Voltage 2 VMAX2 -0.3 to +6.5 V The SOURCE, FB, ZT pin Maximum Applied Voltage 3 The DRAIN pin VMAX3 -0.3 to +1700 V ZT Pin Maximum Current ISZT ±3.0 mA Power Dissipation Pd 1.50 W Tjmax 150 °C Tstg -55 to +150 °C Maximum Junction Temperature Storage Temperature Range (Note 1) Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) When mounted (on 70 mm x 70 mm x 1.6 mm thick, glass epoxy on single-layer substrate) De-rated by 12 mW/°C when operating above Ta = 25 °C Thermal Loss The thermal design should be set operation for the following conditions. 1. The ambient temperature Ta must be 105 °C or less. 2. The IC’s loss must be within the allowable dissipation Pd. The thermal dissipation characteristics are as follows. (PCB: 70 mm x 70 mm x 1.6 mm, mounted on glass epoxy substrate) 2.0 Pd[W] 1.5 1.0 0.5 0.0 0 25 50 75 100 125 150 Ta[℃] Figure 13. Thermal Abatement Characteristics Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Operating Power Supply Voltage Range 1 VCC 15.0 24.0 27.5 V VCC pin voltage Operating Power Supply Voltage Range 2 VDRAIN -0.3 - +1700 V DRAIN pin voltage Topr -40 25 +105 °C Operating Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/30 Conditions TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Electrical Characteristics (Unless otherwise noted, VCC = 24 V, Ta = 25 °C) Parameter Symbol Min Typ Max Unit Conditions Voltage between DRAIN and SOURCE Pin V(BR)DDS 1700 - - V ID = 1 mA/VGS = 0 V IDSS - - 100 µA VDS = 1700 V/VGS = 0 V RDS(ON) - 1.12 - Ω ID = 0.25 A/VGS = 18 V Standby Operating Current IOFF 10 19 30 µA VCC = 18.0 V (VCC UVLO = Disable) Normal Operating Current ION1 1000 2000 4000 µA FB Pin Voltage= 1.0 V (At Pulse Operation) Burst Operating Current ION2 150 500 1000 µA FB Pin Voltage = 0.0 V (At Burst Operation) IPROTECT 800 1600 2200 µA FB OLP, VCC OVP, ZT OVP VCC UVLO Voltage 1 VUVLO1 19.00 19.50 20.00 V VCC pin voltage rising VCC UVLO Voltage 2 VUVLO2 13.00 14.00 15.00 V VCC pin voltage falling VCC UVLO Hysteresis Voltage VUVLO3 - 5.50 - V VUVLO3 = VUVLO1 - VUVLO2 VCC OVP Voltage 1 VOVP1 27.50 29.50 31.50 V VCC pin voltage rising VCC OVP Voltage 2 VOVP2 21.00 23.00 25.00 V VCC pin voltage falling VCC OVP Hysteresis Voltage VOVP3 - 6.50 - V VOVP3 = VOVP1 - VOVP2 Latch Released Voltage VLATCH - VUVLO2-3.5 - V VCC pin Voltage Latch Mask Time tLATCH 50 150 250 µs RFB 15 20 25 kΩ SOURCE Pin Over Current Detection Voltage 1A VLIM1A 0.950 1.000 1.050 V FB pin voltage = 2.2 V (IZT ≥ -1.0 mA) SOURCE Pin Over Current Detection Voltage 1B VLIM1B 0.620 0.700 0.780 V FB pin voltage = 2.2 V (IZT < -1.0 mA) SOURCE Pin Over Current Detection Voltage 2A VLIM2A 0.200 0.300 0.400 V FB pin voltage = 0.6 V (IZT ≥ -1.0 mA) SOURCE Pin Over Current Detection Voltage 2B VLIM2B 0.140 0.210 0.280 V FB pin voltage = 0.6 V (IZT < -1.0 mA) SOURCE Pin Switching ZT Pin Current IZT 0.900 1.000 1.100 mA SOURCE Pin Leading Edge Blanking Time tLEB - 250 - ns Minimum ON Width tMIN - 0.500 - µs [MOSFET] DRAIN Leak Current On Resistance [Operating Current] Protection Circuit Operating Current [VCC Pin Protection Function] [DC/DC Converter Block (Turn OFF)] FB Pin Pull-up Resistance www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Electrical Characteristics – continued (Unless otherwise noted, VCC = 24 V, Ta = 25 °C) Parameter Symbol Min Maximum Operating Frequency 1 fSW1 106 Maximum Operating Frequency 2 fSW2 20 FB Pin Frequency Reduction Start Voltage VFBSW1 FB Pin Frequency Reduction End Voltage 1 FB Pin Frequency Reduction End Voltage 2 Typ Max Unit Conditions 120 134 kHz FB pin voltage = 2.0 V 30 40 kHz FB pin voltage = 0.5 V 1.100 1.250 1.400 V VFBSW2 0.400 0.500 0.600 V VFBSW3 - 0.550 - V Voltage Gain AV 1.700 2.000 2.300 V/V ΔVFB/ΔVSOURCE ZT Pin Comparator Voltage 1 VZT1 60 100 140 mV ZT pin voltage falling ZT Pin Comparator Voltage 2 VZT2 120 200 280 mV ZT pin voltage rising ZT Pin Trigger Mask Time tZTMASK 0.25 0.60 0.95 µs For noise prevention after OUT pin voltage H→L ZT Pin Trigger Timeout Period 1 tZTOUT1 30.0 45.0 90.0 µs Count from final ZT pin trigger ZT Pin Trigger Timeout Period 2 tZTOUT2 2.0 5.0 8.0 µs Count from final ZT pin trigger (2 stages) tZTON 27.0 45.0 62.0 µs Soft Start Time 1 tSS1 0.600 1.000 1.400 ms Soft Start Time 2 tSS2 2.400 4.000 5.600 ms FB OLP Voltage 1 VFOLP1 2.500 2.800 3.100 V FB pin voltage rising FB OLP Voltage 2 FB pin voltage falling [DC/DC Converter Block (Turn ON)] Maximum ON Time [DC/DC Protection Functions] VFOLP2 2.300 2.600 2.900 V FB OLP Timer tFOLP 90 128 166 ms ZT OVP Voltage VZTL 3.250 3.500 3.750 V www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Typical Performance Curves 30.00 Normal Operating Current: ION1 [uA] Standby Operating Current: IOFF [uA] (Reference Data) 25.00 20.00 15.00 10.00 -40 -20 0 20 40 60 80 100 120 2500 2300 2100 1900 1700 1500 Temperature [℃] Figure 14. Standby Operating Current vs Temperature 20 40 60 80 100 120 Temperature [℃] 2000 Protection Circuit Operating Current: IPROTECT [uA] Burst Operating Current: ION2 [uA] 0 Figure 15. Normal Operating Current vs Temperature 900 750 600 450 300 150 -40 -20 -40 -20 0 Temperature [℃] www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 1600 1400 1200 1000 20 40 60 80 100 120 Figure 16. Burst Operating Current vs Temperature 1800 -40 -20 0 20 40 60 80 100 120 Temperature [℃] Figure 17. Protection Circuit Operating Current vs Temperature 18/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Typical Performance Curves – continued (Reference Data) 15.0 VCC UVLO Voltage 2: VUVLO2 [V] VCC UVLO Voltage 1: VUVLO1 [V] 20.0 19.8 19.6 19.4 19.2 19.0 -40 -20 0 14.5 14.0 13.5 13.0 20 40 60 80 100 120 -40 -20 Figure 18. VCC UVLO Voltage 1 vs Temperature 31.5 VCC OVP Voltage 1: VOVP1 [V] VCC UVLO Hysteresis Voltage: VUVLO3 [V] 20 40 60 80 100 120 Figure 19. VCC UVLO Voltage 2 vs Temperature 6.5 6.0 5.5 5.0 4.5 0 Temperature [℃] Temperature [℃] -40 -20 0 29.5 28.5 27.5 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120 Temperature [℃] Temperature [℃] Figure 20. VCC UVLO Hysteresis Voltage vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 30.5 19/30 Figure 21. VCC OVP Voltage 1 vs Temperature TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Typical Performance Curves – continued 1.05 25.0 SOURCE Pin Over Current Detection Voltage 1A: VLIM1A [V] FB Pin Pull-up Resistance: RFB [kΩ] (Reference Data) 23.0 21.0 19.0 17.0 15.0 -40 -20 0 1.03 1.01 0.99 0.97 0.95 20 40 60 80 100 120 -40 -20 Figure 22. FB Pin Pull-up Resistance vs Temperature 0.40 SOURCE Pin Over Current Detection Voltage 2A: VLIM2A [V] SOURCE Pin Over Current Detection Voltage 1B: VLIM1B [V] 20 40 60 80 100 120 Figure 23. SOURCE Pin Over Current Detection Voltage 1A vs Temperature 0.80 0.75 0.70 0.65 0.60 0 Temperature [℃] Temperature [℃] -40 -20 0 0.30 0.25 0.20 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120 Temperature [℃] Temperature [℃] Figure 24. SOURCE Pin Over Current Detection Voltage 1B vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0.35 Figure 25. SOURCE Pin Over Current Detection Voltage 2A vs Temperature 20/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Typical Performance Curves – continued (Reference Data) 1.10 SOURCE Pin Switching ZT Pin Current: IZT [mA] SOURCE Pin Over Current Detection Voltage 2B: VLIM2B [V] 0.30 0.25 0.20 0.15 -40 -20 0 1.05 1.00 0.95 0.90 20 40 60 80 100 120 Temperature [℃] 20 40 60 80 100 120 Figure 27. SOURCE Pin Switching ZT Pin Current vs Temperature 130.0 Maximum Operating Frequency 1: fSW1 [kHz] 0.90 Minimum ON Width: tMIN [μs] 0 Temperature [℃] Figure 26 SOURCE Pin Over Current Detection Voltage 2B vs Temperature 0.80 125.0 0.70 0.60 120.0 0.50 0.40 115.0 0.30 0.20 0.10 -40 -20 -40 -20 0 110.0 20 40 60 80 100 120 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 20 40 60 80 100 120 Temperature [℃] Temperature [℃] Figure 28. Minimum ON Width vs Temperature -40 -20 Figure 29. Maximum Operating Frequency 1 vs Temperature 21/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Typical Performance Curves – continued 40.0 1.40 FB Pin Frequency Reduction Start Voltage: VFBSW1 [V] Maximum Operating Frequency 2: fSW2 [kHz] (Reference Data) 35.0 30.0 25.0 20.0 -40 -20 0 1.35 1.30 1.25 1.20 1.15 1.10 20 40 60 80 100 120 Temperature [℃] 20 40 60 80 100 120 Figure 31. FB Pin Frequency Reduction Start Voltage vs Temperature 0.65 FB Pin Frequency Reduction End Voltage 2: VFBSW3 [V] 0.60 FB Pin Frequency Reduction End Voltage 1: VFBSW2 [V] 0 Temperature [℃] Figure 30. Maximum Operating Frequency 2 vs Temperature 0.55 0.50 0.45 0.40 -40 -20 -40 -20 0 Temperature [℃] www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0.55 0.50 0.45 20 40 60 80 100 120 Figure 32. FB Pin Frequency Reduction End Voltage 1 vs Temperature 0.60 -40 -20 0 20 40 60 80 100 120 Temperature [℃] Figure 33 FB Pin Frequency Reduction End Voltage 2 vs Temperature 22/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Typical Performance Curves – continued (Reference Data) 140 ZT Pin Comparator Voltage 1: VZT1 [mV] Voltage Gain: AV [V/V] 2.30 2.20 2.10 2.00 1.90 1.80 1.70 -40 -20 0 120 100 80 60 20 40 60 80 100 120 -40 -20 Figure 34. Voltage Gain vs Temperature 1.4 55.00 Soft Start Time 1: tSS1 [ms] Maximum ON Time: tZTON [μs] 20 40 60 80 100 120 Figure 35. ZT Pin Comparator Voltage 1 vs Temperature 60.00 50.00 45.00 40.00 35.00 30.00 0 Temperature [℃] Temperature [℃] -40 -20 0 1.0 0.8 0.6 20 40 60 80 100 120 Temperature [℃] -40 -20 0 20 40 60 80 100 120 Temperature [℃] Figure 36. Maximum ON Time vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 1.2 Figure 37. Soft Start Time 1 vs Temperature 23/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Typical Performance Curves – continued (Reference Data) 3.1 FB OLP Voltage 1: VFOLP1 [V] Soft Start Time 2: tSS2 [ms] 5.5 5.0 4.5 4.0 3.5 3.0 2.5 -40 -20 0 3.0 2.9 2.8 2.7 2.6 2.5 20 40 60 80 100 120 -40 -20 Figure 38. Soft Start Time 2 vs Temperature 150.0 2.8 FB OLP Timer: tFOLP [ms] FB OLP Voltage 2: VFOLP2 [V] 20 40 60 80 100 120 Figure 39. FB OLP Voltage 1 vs Temperature 2.9 2.7 2.6 2.5 2.4 2.3 0 Temperature [℃] Temperature [℃] -40 -20 0 130.0 120.0 110.0 100.0 20 40 60 80 100 120 Temperature [℃] -40 -20 0 20 40 60 80 100 120 Temperature [℃] Figure 40. FB OLP Voltage 2 vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 140.0 Figure 41. FB OLP Timer vs Temperature 24/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Typical Performance Curves – continued (Reference Data) ZT OVP Voltage: VZTL [V] 3.8 3.7 3.6 3.5 3.4 3.3 3.2 -40 -20 0 20 40 60 80 100 120 Temperature [℃] Figure 42. ZT OVP Voltage vs Temperature I/O Equivalence Circuit 1 DRAIN DRAIN 2 SOURCE VCC 3 4 FB VCC GND 5 ZT 6 VCC Internal Reg GND ZT Internal MOSFET SOURCE www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 25/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 26/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Operational Notes – continued 10. Regarding the Input Pin of the IC This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C Pin A N P+ N P N P+ N Parasitic Elements N P+ GND E N P N P+ B N C E Parasitic Elements P Substrate P Substrate Parasitic Elements Pin B B Parasitic Elements GND GND N Region close-by GND Figure 43. Example of IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. The IC should be powered down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the OFF state even if the Tj falls below the TSD threshold. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 27/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Ordering Information B M 2 S C Q (FB OLP) 1: Auto Restart 2: Latch 3: Auto Restart 4: Latch 1 2 x T (VCC OVP) Latch Latch Auto Restart Auto Restart - Package T: TO220-6M L B Z Product Rank LB: Industrial applications Lineup Product name BM2SCQ121T-LBZ BM2SCQ122T-LBZ BM2SCQ123T-LBZ BM2SCQ124T-LBZ FB OLP Auto Restart Latch Auto Restart Latch VCC OVP Latch Latch Auto Restart Auto Restart Marking Diagram TO220-6M (TOP VIEW) Part Number Marking LOT Number Product name BM2SCQ121T-LBZ BM2SCQ122T-LBZ BM2SCQ123T-LBZ BM2SCQ124T-LBZ Part Number Marking M2SCQ121 M2SCQ122 M2SCQ123 M2SCQ124 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 28/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Physical Dimension and Packing Information Package Name www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 TO220-6M 29/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 BM2SCQ12xT-LBZ Series Revision History Date Revision Changes 09.Jan.2019 001 New Release 03.Apr.2019 002 Add the division of product name 03.Dec.2019 003 P1 Features: Modify the internal MOSFET’s on resistance. P1 Features: Modify the notation of VCC UVLO. P3 Modify the Block Diagram. P7 Modify the Block Diagram. P9 Modify the Block Diagram. P12 Modify the points D and F of Figure 10. 11.Jan.2022 004 P14 Modify Operation Modes of Protection Circuit www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 30/30 TSZ02201-0F1F0A200470-1-2 11.Jan.2022 Rev.004 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001