Datasheet
LED Drivers for LCD Backlights
1ch Buck Type (Quasi-Resonant Control)
White LED Driver for Large LCD
Included 250V MOSFET
BM531Q11
1.1 General Description
Key Specifications
BM531Q11 is a high efficiency driver for white LEDs and
designed for large LCDs. BM531Q11 is built-in a
quasi-resonant control method DCDC converter that
employ an array of LEDs as the light source. BM531Q11
is built-in 250V MOSFET and owing to the external
current setting resistance, a power supply design with a
high degree of freedom can be achieved.
Operating power supply voltage range:
VCC: 9.0V to 35.0V
DRAIN:
to 250V
Operating current:
700μA(typ.)
Maximum frequency:
400kHz(typ.)
Operating temperature range:
- 40°C to +105°C
Features
1.2 Package
Quasi-resonant switching mode
Built-in 250V MOSFET
Maximum frequency 400kHz
VCC pin: under voltage protection
SOURCE pin: Leading-Edge-Blanking function
PWM and ADIM dimming operating
FAIL signal output (ADIM pin)
DIP7AK
W(Typ) x D(Typ) x H(Max)
9.20mm×6.35mm×4.30mm
Applications
TV, Computer Display
Other LCD backlighting
Figure 1. DIP7AK
Typical Application Circuit
Figure 2. Typical Application Circuit
〇Product structure : Silicon monolithic integrated circuit
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1.3 Pin Configuration
1
SOURCE
2
ADIM
3
GND
VCC 6
4
ZT
PWM 5
DRAIN 7
Figure 3. Pin Configuration
1.4 Pin Descriptions
Pin No.
Pin Name
1
SOURCE
Function
2
ADIM
Analog dimming signal input and error detection output pin
3
GND
-
4
ZT
5
PWM
PWM signal input pin
6
VCC
Power supply pin
7
DRAIN
Inductor current sensing pin
Zero current detection pin
MOSFET DRAIN pin
1. 5 Block Diagram
VIN
LED+
CIN
COUT
LED-
L
VCC
VCC UVLO
Comp.
+
SYSTEM ON
-
7.5V/6.75V
DRAIN
1 shot
ZT
10kΩ
Reset prior
ZT
Comp.
+
S
OR
TimeOut
45usec
-
AND
OUT
DRIVER
OUT
R
400kHz
Clamper
100mV
/200mV
Q
AND
VCC
ADIM
Current Limit
Comp.
3kΩ
x0.7
DC
MAX ON Time
60us
10kΩ
AND
+
OR
Leading Edge
Blanking
OUT(L->H)0.25us
SOURCE
Rs
PWM
+
-
300kΩ
1.5V/0.8V
AND
SOURCE Low DET.
Auto Restart
LOGIC
CS OVP
Comp.
50kΩ
+
-
4.0V/3.8V
GND
VCC
FAILB
Figure 4. Block Diagram
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1.6 Absolute Maximum Ratings (Ta=25°C)
Symbol
VCC
Rating
Unit
-0.3 to +36
V
ADIM, PWM
-0.3 to +36
V
Parameter
Power Supply Voltage
ADIM, PWM Pin Voltage
SOURCE Pin Voltage
SOURCE
-0.3 to +6.5
V
ZT
-1.0 to +10.5
V
DRAIN
250
V
ZT Pin Voltage
DRAIN Pin Voltage
ZT Pin Current
IZT
±4
mA
Pulsed Drain Current
IDP
16 (Note 1)
A
Power Dissipation
Pd
1.00 (Note 2)
W
Topr
-40 to +105
°C
Tjmax
150
°C
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Tstg
-55 to +150
(Note 1) Pulse width=10μs, Duty cycle=1%
(Note 2) In the case of mounting 1 layer glass epoxy base-plate of 74.2mm×74.2mm×1.6mm,
derate by 8mW/°C when operating above Ta=25°C.
°C
1.7 Recommended Operating Ranges
Parameter
Power Supply Voltage
Symbol
VCC
Range
9.0 to 35.0
Unit
V
DRAIN Pin Voltage
VDRAIN
~ 250
V
2.0(Note3)
ADIM Input Voltage
VADIM
0.45 ~
V
(Note 3) To use the whole range of the ADIM voltage range, it is recommended not to exceed
maximum frequency and maximum ON time.
1.8 Electrical Characteristics MOSFET (Unless otherwise specified VCC=12V Ta=25°C)
Parameter
Drain – Source Voltage
Zero Gate Voltage Drain Current
On-Resistance
Symbol
V(BR)DDS
Min
250
IDSS
-
RDS(ON)
-
Typ
-
Max
-
Unit
V
Conditions
ID=1mA / VGS=0V
-
100
μA
VDS=250V / VGS=0V
0.93
1.30
Ω
ID=0.25A / VGS=10V
1.9 Electrical Characteristics 1/2 (Unless otherwise specified VCC=12V Ta=25°C)
Parameter
[Circuit Current]
Symbol
Min
Typ
Max
Unit
ION
350
700
1000
μA
PWM=L
VCC UVLO Release Voltage
VUVLO_VCC
6.5
7.5
8.5
V
VCC=sweep up
VCC UVLO Hysteresis
VUHYS_VCC
500
750
1000
mV
VCC=sweep down
VZT1
60
100
140
mV
ZT=sweep down
ZT Comparator Voltage 2
VZT2
120
200
280
mV
ZT=sweep up
ZT Comparator Hysteresis
VZTHYS
-
100
-
mV
VZTHYS= VZT2- VZT1
ZT Trigger Time-out Time
TZTOUT
30
45
60
μs
VSOURCE=0V
Current Detection Voltage 1
VSOURCE1
1.034
1.050
1.066
V
ADIM=1.5V
Current Detection Voltage 2
VSOURCE2
1.383
1.400
1.417
V
ADIM=2.0V
Current Detection Clamp Voltage
VCLP
1.393
1.415
1.436
V
ADIM=2.2V
Maximum Frequency
FMAX
360
400
440
kHz
Leading Edge Blank Time
TLEB
-
0.25
-
μs
Turn-off Time
TOFF
-
0.2
-
μs
Maximum ON Time
Tmax
45
60
75
μs
Circuit Current (ON)
Conditions
[VCC Pin Protection]
[DC/DC Converter (Turn On)]
ZT Comparator Voltage 1
[DC/DC Converter (turn-off)]
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1.9 Electrical Characteristics 2/2 (Unless otherwise specified VCC=12V Ta=25°C)
Parameter
[DC/DC Protection]
Symbol
Min
Typ
Max
Unit
Conditions
SOURCE OVP Voltage
VSUROVP
3.8
4.0
4.2
V
SOURCE OVP Hysteresis
VSURHYS
100
200
400
mV
SOURCE OVP Mask Time
TSURMSK
5
10
20
μs
PWM pin HIGH Voltage
VPWM_H
1.5
-
35
V
PWM=sweep up
PWM pin LOW Voltage
SOURCE=sweep up
SOURCE=sweep down
[Dimming Control Block]
VPWM_L
-0.3
-
0.8
V
PWM= sweep down
PWM pin Pull-Down Resistance
RPWM
180
300
420
kΩ
PWM=3.0V
ADIM pin Leak Current
ADIM pin Pull-Up Resistance at
Latch off state
IADIM
-2
0
2
μA
ADIM=2.0V
RLO
-
3.0
6.0
kΩ
SOURCE=5.0V
2.1 Pin Descriptions
○Pin 1: SOURCE
The source of built-in MOSFET.
This pin controls ON width (turn-off) of the switching MOSFET. The detect voltage is set by the DC voltage of the ADIM
pin. Please refer to the ADIM pin description.
In the driving timing of turn ON of the MOSFET, switching noise is generated. Because the SOURCE voltage rises by the
switching noise, the OFF detection may be activated illegally. For prevention of this false detection, it has a blanking
function to mask detection (0.25us typ.) after MOSFET is turned ON from OFF state built-in (Leading Edge Blanking
function). Please refer to the time chart in the section 3.3.1.
This pin has three kinds of protection functions as following.
(i) SOURCE OVP
When the SOURCE pin is more than 4.0V(typ.), because of larger current for detection resistor than normal dimming
operation, the state is judged as an abnormal after 10us(typ.) and outputs FAIL signal (ADIM is pulled up to VCC level).
And after 390us(typ.) has passed, the operation is restarted. Please refer to the time chart in the section 3.3.6.
(ii) SOURCE LOW
When SOURCE=L, PWM=H continues 180us(typ.) without normal voltage being input into SOURCE pin, the state is
judged as an abnormal condition and outputs FAIL signal (ADIM is pulled up to VCC level). And after 390us(typ.) has
passed, the operation is restarted. Please refer to the time chart in the section 3.3.7.
(iii) LEB DET
When the state that MOSFET turns on only in the term of LEB continues 180us(typ.), the state is judged as an abnormal
condition and outputs FAIL signal (ADIM is pulled up to VCC level). And after 390us(typ.) has passed, the operation is
restarted. Please refer to the time chart in the section 3.3.8.
○Pin 2: ADIM
This is the input pin for the analog dimming signal. Please input a certain bias into this pin, because the internal
resistance is not connected to a certain bias. This is why the input level is not affected by the input current or the output
current.
The SOURCE pin detection voltage is defined as 0.7 times level of this ADIM pin level. If more than 2.0V is input, the
SOURCE detect voltage is clamped to the constant level, in case LED large current flow. In this condition, the input current
of ADIM pin is caused.
As for the relations of ADIM pin voltage and current detection voltage VSOURCE(SOURCE pin voltage), the equation is the
following.
1.415
0.7
SOURCE
detect level[V]
2.0
2.0
The ADIM pin serves as FAIL signal output.
Please refer to the table 1 in the section 2.2,
and the time chart in the section 3.3.6, 3.3.7, 3.3.8.
1.415V
1.40V
1.05V
0.315V
ADIM[V]
0
0.45V
1.5V
2.0V
Figure 5. Analog dimming character
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○Pin 3: GND
It is the GND in the IC.
○Pin 4: ZT
The ZT pin controls OFF width (turn on). There are two factors to assert MOSFET=ON.
(i) At the timing that the coil current decrease to zero, the drain potential of the MOSFET drops. The divided potential by
resistor is input to ZT pin. Only when ZT potential cross VZT1(typ.=100mV), the asserting signal which the MOSFET
can turn on is generated. (ONE SHOT operation)
(ii) The ZT time-out function make the switching MOSFET ON compulsively, in the case that the assertion MOSFET ON
does not take place for the constant interval, that is, TZTOUT(45us typ.) which is counted from the timing the MOSFET
OFF. Please refer to the time chart in the section 3.3.5.
Both factors (i) (ii) are restricted for ON timing when oscillatory frequency is too fast, by maximum frequency
FMAX=400kHz(typ.).
In addition, the MOSFET is not turned on, in the input condition that should be off such as SOURCE> 3.0V.
○Pin 5: PWM
This is the input pin of the PWM dimming signal. The dimming is realized by adjusting the input DUTY of the PWM pin.
The input range of the L, H level of the PWM pin is the following. In addition, The pull-down resister is 300kΩ(typ.) inside
IC.
State
PWM pin voltage
PWM=H
PWM = 1.5V to 35.0V
PWM=L
PWM = - 0.3V to 0.8V
○Pin 6: VCC
This is the power supply pin of the IC. The input range is 9.0 to 35.0V.
When VCC is more than 7.5V(typ.), the operation starts, and shut down in less than VCC=6.75V(typ.).
The switching as the driver causes the VCC voltage amplitude. Please input in the condition VCC>9.0V continuously.
If the lower VCC voltage is input continuously, the IC temperature may be increased.
○Pin 7: DRAIN
The drain of the built-in MOSFET. The rating of this pin is 250V.
2.2 The list of the protection function detection condition and operation
The operation of each protection is shown in table 1.
Table 1. The operation mode of the protection
Protection
name
Detection
pin
Detection
condition
Release
condition
Detection
timer
Protection
type
VCC UVLO
VCC
VCC7.5V
Immediately
Immediately
Auto-Restart
SOURCE OVP
SOURCE
SOURCE LOW
SOURCE
LEB DET
SOURCE
SOURCE > 4.0V
SOURCE < 3.8V
SOURCE=L and
PWM=H
MOSFET=ON time
is around 0.25us
and PWM=H
SOURCE=H or
PWM=L
MOSFET=ON time
> 0.25us
or PWM=L
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Operation at detection
MOS
OFF
10us
Auto-Restart
OFF
180us
Auto-Restart
OFF
180us
Auto-Restart
OFF
ADIM(FAIL)
Auto-Restart
Timer
Normal
Immediately
Pull up to
VCC
Pull up to
VCC
Pull up to
VCC
390us
390us
390us
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BM531Q11
3.1 Parts Setting Example
VIN
The circuit point the symbol annotating is shown in the right diagram.
Cin
Cout
[1]…During M1=ON, as the coil voltage of its both side can approximate VIN - VLED,
the slope of IL; SlopeIL_ON is
D
_
VLED
VOUT
[2]…During M1=OFF, as the coil voltage of its both side can approximate VLED,
the slope of IL; SlopeIL_OFF is
L
VCC
SW
DRAIN
PWM
M1
_
GATE
(internal)
The equation can be expressed above.
+
-
It is necessary for VIN, VLED, L to meet the following condition.
(a) Maximum ON time of the OUT pin (maximum ON width: TMAX) is 60us(typ.).
ADIM
IL
+
SOURCE Rs
C1
R1
ZT
R2
GND
_
(b) The resonance frequency is lower than maximum frequency (FMAX) 400kHz (typ.)
1
_
Figure 6. Each pin waveform
_
Please refer the time chart in the section 3.3.3, 3.3.4.
[3]…When the MOSFET M1 is turned off, ZT increases by the SW bounce. It is necessary to set R2 / (R1+R2) so that the voltage
peak of ZT does not exceed around 5V.
[4]…After that, the ZT pin gradually decreases, the decline is decided by C1, (R1+R2).
[5]…At the timing of IL = 0mA, SW suddenly decreases, therefore ZT decreases suddenly. The ZT slope is decided by C1,
(R1+R2). The delay exists from the timing IL = 0mA to reach the detection level 100mV of ZT.
Cout smoothes an LED current. Ripple current of the LED becomes larger with Cout smaller constant. And when larger Cout is
used, the response of an LED current is slow. Rg can set the switching speed.
[2]
[1]
IL
Detect level
SOURCE
[3]
[4]
ZT
GATE
(internal)
[5]
TOUT_ON
TOUT_OFF
Figure 7. Dimming Waveform
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3.2 LED current setting
tdly1
IL
ILED
IL’
0A
tdly2
TOUT_ON
TOUT_OFF
Figure 8. Coil current and LED current
The LED current (ILED) is expressed as follows.
〇LED current (ILED) setting equation
_
1
_
2
_
2
1
_
1
_
′
2
Where
TOUT_ON is the ON-time of the MOSFET(M1)
TOUT_OFF is the OFF-time of the MOSFET(M1)
tdly1 is the turn-off delay time of the MOSFET(M1)
tdly2 is the turn-on delay time of the MOSFET(M1)
IL’ is the coil current considering tdly1
_
Ω
1000
′
_
1
1
Ω
2.0
2.0
0.7
1.415
1000
_
【setting example】
If VIN=100V, VLED=60V, VSOURCE=1.4V, RS=1.4Ω, L=0.22mH, tdly1=0.2us, tdly2=0.4us, ILED is calculated as follows.
_
1.4
0.22
100 60
1.4 Ω
1.4
1.4 Ω
1
0.22
1000
0.2
5.7
1000
1036
_
5.7
1035
3.8
60
Thus,
5.7
2
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3.8
5.7
0.2
3.8
0.4
3.8
1
0.2
0.4
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BM531Q11
【The LED current’s shift by the fluctuation of tdly1 and tdly2】
The LED current is shifted by the fluctuation of tdly1 and tdly2. In particular, tdly2, which is decided by the inductance (L), the
capacitance of the MOSFET(M1), the Diode(D) and the ZT(C1), affects the LED current.
If the LED current (ILED’) is defined when the fluctuation of the tdly2 is +10% from the setting example (in other words,
tdly2=0.44us), ILED’ is calculated as follows.
0.44
5.7 3.8 0.2
1
3.8
1035
489
′
2
5.7 3.8 0.2 0.44
Thus, the ratio of difference is
∆
100
489 492
492
100
0.6 %
3.3 Timing Chart
3.3.1 Starting Up (1)
VIN
7.5V
VCC
PWM
IL
TOFF
Detect level
SOURCE
TLEB
ZT
GATE
(internal)
TOUT_ON
TOUT_OFF
VOUT
(*5)
(*1) (*2)
(*3)
(*4)
(*6)
(*7)
Figure 9. Starting up waveform (1)
(*1)…As for the sequence, it is recommended that VIN turns on firstly and turns off lastly.
(*2)…The IC starts when VCC is more than 7.5V(typ.).
(*3)…PWM=H enables the MOSFET turn on. In the figure, then PWM = 100% is input.
(*4)…When SOURCE pin reached the detection level, the MOSFET turns off after the time TOFF.
(*5)…When the coil current decreases to zero (IL = 0mA), ZT suddenly decreases. When ZT reaches the detection level, the
MOSFET turns on.
(*6)…The SOURCE switching noise is masked during Leading Edge Blank time TLEB (0.25μs typ.), which counts from the
MOSFET=ON. During this terminal, the MOSFET is not turned off, even if higher than detection level are input.
(*7)…After VOUT decreases, Cout is charged enough, LED current flows.
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3.3.2 Starting Up (2)
VIN
7.5V
VCC
PWM
IL
Detect level
SOURCE
ZT
GATE
(internal)
VOUT
(*1)
(*2)
(*3)
(*4)
(*5)
Figure 10. Starting up waveform (2)
(*1)…As for the sequence, it is recommended that VIN turns on firstly and turns off lastly.
(*2)…The IC starts when VCC is more than 7.5V(typ.).
(*3)…PWM=H enables the MOSFET turn on.
(*4)…PWM=L stops the switching operation.
(*5)…After VOUT decreases, Cout is charged enough, LED current flows.
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3.3.3 Maximum Frequency Operation
As for the resonance frequency, the IC works lower than maximum frequency (FMAX) 400kHz (typ.). It prevents increase
temperature because of the fast frequency switching.
In this operation, the LED current is lower than the setting value, because the interval of IL = 0mA is longer than expected.
IL
Detect level
SOURCE
ZT
GATE
(internal)
TOUT_ON
TOUT_OFF
(*1) (*2) (*3)
Figure 11. Maximum frequency operation waveform
(*1)…SOURCE reached the detection level, the MOSFET turns off.
(*2)…ZT reached the detection level, but cannot become next the MOSFET=ON when the operational frequency is too fast.
(*3)…After the certain interval, the MOSFET turns on. In this case,
1
_
_
Here, FMAX=400kHz(typ).
3.3.4 Maximun On Time Operarion
As for the ON time, the IC works lower than maximum ON time (TMAX) 60us(typ.). This is why MOS current and others are limited.
In this operation, the LED current is lower than the setting value, because IL does not increase to the expected value.
IL
Detect level
SOURCE
ZT
GATE
(internal)
TOUT_ON=TMAX
TOUT_OFF
(*1)
(*2)
Figure 12. Maximum On time operation waveform
(*1)…SOURCE does not reach the detection level, but the MOSFET turns off because of TOUT_ON=TMAX.
(*2)…ZT reached the detection level, OUT=H is asserted.
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3.3.5 ZT Trigger Time-out Operation
When the operation is out of its resonance, for example, ZT always keeps L because of the abnormality of the external parts, this
function turns on MOS with the constant interval TZTOUT(45us typ.).
IL
Detect level
SOURCE
ZT
GATE
(internal)
TOUT_OFF
TOUT_ON
TZTOUT
(*1)
(*2)
TZTOUT
TZTOUT
(*3)
Figure 13. ZT trigger time-out operation waveform
(*1)…SOURCE reached the detection level, the MOSFET turns off.
(*2)…Because ZT is always L, it cannot be output next the MOSFET=ON.
(*3)…The switching MOSFET ON compulsively, in the case that the MOSFET=ON does not take place for the constant interval,
that is, TZTOUT(45us typ.) which is counted from the timing the MOSFET=OFF. The time measurement of TZTOUT is no
relation to the PWM logic.
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3.3.6 SOURCE OVP
This is the protection function which stops once and restarts after 390us(typ.), when the high voltage was input into SOURCE pin
because of the abnormality of the external parts around IC.
IL
3.8V
4.0V
10us
Detect level
SOURCE
short
open
ZT
GATE
(internal)
ADIM
(FAIL)
Input level
390us
IC STATE
normal
390us
normal
abnormal
(*1)
(*2)
judge
judge
(*3)
(*4)
Figure 14. SOURCE OVP sequence waveform
(*1)…It is the example which the short circuit of the around IC parts so that the high voltage is input into on SOURCE pin. If
SOURCE exceeds a detect level, the MOSFET turns off.
(*2)…If SOURCE>4.0V(typ.) continues more than 10us(typ.) nevertheless the MOSFET=OFF, the state is judged as abnormal
and the operation is stopped for 390us(typ.).
(*3)…After 390us(typ.), the abnormality is judged again. In the figure, considering SOURCE>4.0V, the abnormality is still keeps
and stop the operation.
(*4)…As a result of judgment again, an abnormal state is released in this figure and becomes SOURCE Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 17. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls
below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
17/20
TSZ02201-0F4F0C100170-1-2
22.Jul.2016 Rev.001
Datasheet
BM531Q11
Ordering Information
B
M
5
3
1
Part Number
Q
1
1
-
Package
None:DIP7AK
Packaging and forming specification
None: Container tube
Marking Diagrams
DIP7AK(TOP VIEW)
Part Number Marking
M531Q11
LOT Number
1PIN MARK
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
18/20
TSZ02201-0F4F0C100170-1-2
22.Jul.2016 Rev.001
Datasheet
BM531Q11
●Physical Dimension, Tape and Reel Information
Package Name
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
DIP7AK
19/20
TSZ02201-0F4F0C100170-1-2
22.Jul.2016 Rev.001
Datasheet
BM531Q11
Revision History
Date
Revision
22.Jul.2016
001
Changes
New Release
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
20/20
TSZ02201-0F4F0C100170-1-2
22.Jul.2016 Rev.001
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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