Datasheet
Gate Driver Providing Galvanic Isolation Series
Isolation Voltage 2500 Vrms
1ch Gate Driver Providing Galvanic Isolation
BM60060FV-C
Key Specifications
General Description
The BM60060FV-C is a gate driver with an isolation
voltage of 2500 Vrms. It has an I/O delay time of 210
ns, minimum input pulse width of 90 ns, and
incorporates the fault signal output function, under
voltage lockout (UVLO) function, short circuit protection
(SCP, built-in temperature compensation of detection
voltage) function, fast turn off function for short circuit
protection, active miller clamping (MC) function,
temperature monitoring function, switching controller
function, gate resistance switching function and output
state feedback function.
Isolation Voltage:
Maximum Gate Drive Voltage:
I/O Delay Time:
Minimum Input Pulse Width:
Package
2500 Vrms
24 V
210 ns (Max)
90 ns
W (Typ) x D (Typ) x H (Max)
9.2 mm x 10.4 mm x 2.4 mm
SSOP-B28W
Features
AEC-Q100 Qualified (Note 1)
Fault Signal Output Function
Under Voltage Lockout Function
Short Circuit Protection Function
Temperature Compensation of Short Circuit
Detection Voltage
Fast Turn Off Function for Short Circuit Protection
Soft Turn Off Function for Short Circuit Protection
(Adjustable Turn Off Time)
Active Miller Clamping
Temperature Monitor
Switching Controller
Gate Resistance Switching Function
Output State Feedback Function
(Note 1) Grade1
Applications
Automotive Inverter
Automotive DC-DC Converter
Industrial Inverter System
UPS System
Typical Application Circuit
GND1
ECU
GND2
FLT
OUT2
GRSEL
OUT1F
INA
SCPTH
OSFB
TC
SENSOR
TO
INB
VCC2
FB
VREG2
RTC
VCC2
V_BATT
COMP
SCPIN
V_BATT
TCOMP
VREG1
PROOUT1
FET_G
PROOUT2
RTCOMP
snubber
GND1
VCC2
CVCC2
GND2
SENSE
OUT1
GND1
GND2
CVREG2
GND2
CVBATT CVREG1
〇Product structure : Silicon integrated circuit
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〇This product has no designed protection against radioactive rays.
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BM60060FV-C
Contents
General Description ................................................................................................................................................................ 1
Features ................................................................................................................................................................................. 1
Applications ............................................................................................................................................................................ 1
Key Specifications ................................................................................................................................................................... 1
Package ................................................................................................................................................................................. 1
Typical Application Circuit ........................................................................................................................................................ 1
Contents ................................................................................................................................................................................. 2
Recommended Range of External Constants ........................................................................................................................... 3
Pin Configuration .................................................................................................................................................................... 3
Pin Descriptions ...................................................................................................................................................................... 3
Block Diagram ........................................................................................................................................................................ 4
Absolute Maximum Ratings ..................................................................................................................................................... 4
Thermal Resistance ................................................................................................................................................................ 5
Recommended Operating Conditions ...................................................................................................................................... 5
Insulation Related Characteristics............................................................................................................................................ 5
Electrical Characteristics ......................................................................................................................................................... 6
Typical Performance Curves .................................................................................................................................................... 9
Description of Pins and Cautions on Layout of Board ............................................................................................................. 30
Description of Functions and Examples of Constant Setting ................................................................................................... 31
1. Fault Status Output ........................................................................................................................................................ 31
2. Under Voltage Lockout (UVLO) Function ........................................................................................................................ 32
3. Short Circuit Protection (SCP) Function .......................................................................................................................... 34
4. Miller Clamp (MC) Function............................................................................................................................................ 37
5. Gate Resistance Switching Function............................................................................................................................... 38
6. Output State Feedback Function .................................................................................................................................... 38
7. Switching Controller ....................................................................................................................................................... 39
8. Temperature Monitor Function ........................................................................................................................................ 41
Selection of Components Externally Connected ..................................................................................................................... 42
I/O Equivalent Circuits ........................................................................................................................................................... 43
Operational Notes ................................................................................................................................................................. 47
Ordering Information ............................................................................................................................................................. 49
Marking Diagrams ................................................................................................................................................................. 49
Physical Dimension and Packing Information ......................................................................................................................... 50
Revision History .................................................................................................................................................................... 51
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Recommended Range of External Constants
Pin Configuration
(TOP VIEW)
Pin Name
Recommended Value
Min
Typ
Max
Unit
GND2
1
28
GND1
OUT1
2
27
SENSE
1.25
kΩ
PROOUT2
3
26
FET_G
PROOUT1
4
25
VREG1
TCOMP
5
24
V_BATT
COMP
Symbol
TC
RTC
(As Temperature
monitor)
TC
-
100
(No Temperature
monitor)
RTC
0.1
1
10
MΩ
TCOMP
RTCOMP
9
-
100
kΩ
SCPIN
6
23
-
μF
VREG2
7
22
FB
VCC2
8
21
INB
TO
9
20
SENSOR
V_BATT
CVBATT
3
-
VCC2
CVCC2
0.4
-
-
μF
VREG1
CVREG1
0.3
1
10
μF
VREG2
CVREG2
0.3
1
10
μF
TC
10
19
OSFB
SCPTH
11
18
INA
OUT1F
12
17
GRSEL
OUT2
13
16
FLT
GND2
14
15
GND1
Pin Descriptions
Pin No.
Pin Name
Function
1
GND2
Output-side ground pin
2
OUT1
Output pin
3
PROOUT2
Fast turn off pin for short circuit protection
4
PROOUT1
Soft turn off pin for short circuit protection / Gate voltage input pin
5
TCOMP
Temperature compensation pin of short circuit detection voltage
6
SCPIN
Short circuit detection pin
7
VREG2
Output-side internal power supply pin
8
VCC2
Output-side power supply pin
9
TO
Constant current output pin / Sensor voltage input pin
10
TC
Resistor connection pin for setting constant current
11
SCPTH
Short circuit detection threshold setting pin
12
OUT1F
Output pin
13
OUT2
Miller clamp pin
14
GND2
Output-side ground pin
15
GND1
Input-side ground pin
16
FLT
17
GRSEL
18
INA
19
OSFB
20
SENSOR
21
INB
Control input pin
22
FB
Error amplifier inverting input pin for switching controller
23
COMP
24
V_BATT
Main power supply pin
25
VREG1
Input-side internal power supply pin
26
FET_G
MOS FET for transformer drive control pin for switching controller
27
SENSE
Current feedback resistor connection pin for switching controller
28
GND1
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Fault output pin
Gate resistance switching pin
Control input pin
Output state feedback output pin
Temperature information output pin
Error amplifier output pin for switching controller
Input-side ground pin
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BM60060FV-C
Block Diagram
Isolation
GND1
GND2
FLT
MC
OUT2
PWM1
GRSEL
OUT1F
PWM2
INA
SCPTH
OSFB
TC
TEMPERATURE
OSFB/FLT
MONITOR
SENSOR
TO
TEMPERATURE
INB
LOGIC
MONITOR
LOGIC
UVLO
VCC2
VREG
FB
VREG2
COMP
SCPIN
SCP
V_BATT
VREG
TCOMP
UVLO
VREG1
FET_G
OSFB
PROOUT1
PROOUT2
SWITCHING
CONTROLLER
SENSE
OUT1
GND1
GND2
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Main Power Supply Voltage
VBATTMAX
-0.3 to +40.0 (Note 2)
V
Output-Side Supply Voltage
VCC2MAX
-0.3 to +30.0 (Note 3)
V
VINMAX
-0.3 to +7.0 (Note 2)
V
(Note 2)
V
INA, INB, GRSEL Pin Input Voltage
FLT, OSFB Pin Input Voltage
FLT, OSFB Pin Output Current
SENSOR Pin Output Current
FB Pin Input Voltage
FET_G Pin Output Current (Peak 5 µs)
SCPIN Pin Input Voltage
SCPTH Pin Input Voltage
VFLTMAX
-0.3 to +7.0
IFLT
10
ISENSOR
10
VFBMAX
-0.3 to +7.0
IFET_GPEAK
VSCPINMAX
VSCPTHMAX
TO Pin Input Voltage
VTOMAX
TO Pin Output Current
ITOMAX
mA
mA
(Note 2)
V
1
A
-0.3 to VCC2 + 0.3 or +30.0
-0.3 to +7.0
(Note 3)
(Note 3)
V
V
-0.3 to VCC2 + 0.3 or +30.0 (Note 3)
V
8
mA
OUT1, OUT1F Pin Output Current (Peak 5 µs)
IOUT1PEAK
10
OUT2 Pin Output Current (Peak 5 µs)
IOUT2PEAK
10 (Note 4)
A
(Note 4)
A
(Note 4)
A
PROOUT1 Pin Output Current (Peak 10 µs)
IPROOUT1PEAK
2.5
PROOUT2 Pin Output Current (Peak 5 µs)
IPROOUT2PEAK
5.0 (Note 4)
A
Tstg
-55 to +150
°C
Tjmax
+150
°C
Storage Temperature Range
Maximum Junction Temperature
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 2) Relative to GND1
(Note 3) Relative to GND2
(Note 4) Should not exceed Tj = 150 C
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Thermal Resistance (Note 5)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s (Note 7)
2s2p (Note 8)
θJA
112.9
64.4
°C/W
ΨJT
34
23
°C/W
SSOP-B28W
Junction to Ambient
Junction to Top Characterization Parameter
(Note 6)
(Note 5) Based on JESD51-2A (Still-Air).
(Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 7) Using a PCB board based on JESD51-3.
(Note 8) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
Recommended Operating Conditions
Parameter
Symbol
Min
Max
Unit
Main Power Supply Voltage
VBATT (Note 9)
8
24
V
Output-side Supply Voltage
(Note10)
13.5
24.0
V
VCC2
VREG1 pin Output Current
IVREG1
-
0.5
mA
VREG2 Pin Output Current
IVREG2
-
0.5
mA
VTO (Note 10)
1.35
3.84
V
0.5
2.0
V
Topr
-40
+125
°C
Symbol
Characteristic
Unit
Insulation Resistance (VIO = 500 V)
RS
> 109
Ω
Insulation Withstand Voltage / 1 min
VISO
2500
Vrms
Insulation Test Voltage / 1 s
VISO
3000
Vrms
TO pin Input Voltage
SCPTH Pin Input Voltage
Operating Temperature
VSCPTH
(Note10)
(Note 9) Relative to GND1
(Note 10) Relative to GND2
Insulation Related Characteristics
Parameter
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Electrical Characteristics
(Unless otherwise specified Ta = -40 °C to +125 °C, VBATT = 8 V to 24 V, VCC2 = 13.5 V to 24 V)
Parameter
Symbol
Min
Typ
Max
Unit
General
Main Power Supply
IBATT1
0.4
1.2
2.0
mA
Circuit Current 1
Main Power Supply
IBATT2
0.3
1.1
1.9
mA
Circuit Current 2
Conditions
FET_G switching operation
INA, INB not switching
FET_G Not switching
INA, INB not switching
FET_G switching operation
Main Power Supply
Circuit Current 3
IBATT3
0.5
1.3
2.1
mA
Main Power Supply
Circuit Current 4
IBATT4
0.5
1.4
2.3
mA
ICC2
VREG1
VREG2
1.4
4.5
4.8
3.0
5.0
5.0
4.6
5.5
5.2
mA
V
V
VFETGH
VFETGL
4.5
0
5.0
-
5.5
0.3
V
V
IFET_G = 0 A (open)
IFET_G = 0 A (open)
RONGH
3
6
12
Ω
IFET_G = 10 mA
RONGL
0.3
0.6
1.3
Ω
IFET_G = 10 mA
fOSC_SW
tSS
VFB
IFB
ICOMPSINK
ICOMPSOURCE
80
1.47
-0.8
-160
40
100
1.50
0
-80
80
120
50
1.53
+0.8
-40
160
kHz
ms
V
μA
μA
μA
gm err
0.5
1.1
2.2
mA/V
VUVLOBATTH
VUVLOBATTL
DONMAX
6.5
5.5
50
7.0
6.0
55
7.5
6.5
60
V
V
%
VOVTH
1.88
1.95
2.02
V
VUVTH
1.03
1.10
1.17
V
VOCTH
0.17
0.20
0.23
V
tDCDCRLS
20
40
60
ms
VINH
VINL
RIND
tINFIL
0.7 x VREG1
0
25
5
50
45
5.5
0.3 x VREG1
100
90
V
V
kΩ
ns
Output Side Circuit Current
VREG1 Output Voltage
VREG2 Output Voltage
Switching Controller
FET_G Output Voltage H
FET_G Output Voltage L
FET_G On Resistance
(Source-side)
FET_G On Resistance
(Sink-side)
Oscillation Frequency
Soft-start Time
FB Threshold Voltage
FB Input Current
COMP Pin Sink Current
COMP Pin Source Current
Error Amplifier
Transconductance
V_BATT UVLO Off Voltage
V_BATT UVLO On Voltage
Maximum On Duty
Over Voltage Detection
Threshold
Under Voltage Detection
Threshold
Over-current Detection
Threshold
Switching Controller Protection
Holding Time
Logic Input
Logic High Level Input Voltage
Logic Low Level Input Voltage
Logic Pull-down Resistance
Logic Input Filtering Time
INA = 10 kHz, Duty = 50 %
INB = L
FET_G switching operation
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INA = 20 kHz, Duty = 50 %
INB = L
RTC = 10 kΩ
Guaranteed by design
INA, INB, GRSEL
INA, INB, GRSEL
INA, INB, GRSEL
INA, INB
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13.Mar.2019 Rev.001
BM60060FV-C
Electrical Characteristics - continued
(Unless otherwise specified Ta = -40 °C to +125 °C, VBATT = 8 V to 24 V, VCC2 = 13.5 V to 24 V)
Parameter
Symbol
Min
Typ
Max
Unit
Output
OUT1 On Resistance (Source-side)
RONH1
0.09
0.22
0.42
Ω
OUT1 On Resistance (Sink-side)
RONL1
0.07
0.20
0.40
Ω
OUT1 Maximum Current (Source-side)
IOUTMAX1H
6
-
-
A
OUT1 Maximum Current (Sink-side)
IOUTMAX1L
4
-
-
A
OUT1 Turn ON Time
OUT1 Turn OFF Time
OUT1 Propagation Distortion
OUT1 Rise Time
OUT1 Fall Time
tPON1
tPOFF1
tPDIST1
tRISE1
tFALL1
90
80
-60
25
25
150
140
-10
50
50
210
200
+40
120
100
ns
ns
ns
ns
ns
OUT1F On Resistance (Source-side)
RONH1F
0.11
0.25
0.50
Ω
OUT1F On Resistance (Sink-side)
RONL1F
0.07
0.18
0.36
Ω
OUT1F Maximum Current (Source-side)
IOUTMAX1FH
3
-
-
A
OUT1F Maximum Current (Sink-side)
IOUTMAX1FL
5
-
-
A
OUT1F Turn ON Time
OUT1F Turn OFF Time
OUT1F Propagation Distortion
OUT1F Rise Time
OUT1F Fall Time
tPON1F
tPOFF1F
tPDIST1F
tRISE1F
tFALL1F
90
80
-60
25
25
150
140
-10
50
50
210
200
+40
130
100
ns
ns
ns
ns
ns
PROOUT1 On Resistance
RONPRO1
0.4
1.2
2.7
Ω
PROOUT2 On Resistance
RONPRO2
0.1
0.3
0.8
Ω
PROOUT1 Maximum Current
IOUTMAXPRO1
1
-
-
A
PROOUT2 Maximum Current
IOUTMAXPRO2
5
-
-
A
RON2
0.10
0.25
0.60
Ω
VOUT2ON
tOUT2ON
CM
1.8
100
2.0
60
-
2.2
90
-
V
ns
kV/μs
VTC
ITO
0.975
0.97
8
88.0
47.6
6.4
-
1.000
1.00
10
90.0
50.0
10.0
60
60
1.025
1.03
14
92.0
52.4
13.6
160
160
V
mA
kHz
%
%
%
Ω
Ω
OUT2 On Resistance
OUT2 On Threshold Voltage
OUT2 Output Delay Time
Common Mode Transient Immunity
Temperature Monitor
TC Voltage
TO Output Current
SENSOR Output Frequency
SENSOR Output Duty1
SENSOR Output Duty2
SENSOR Output Duty3
SENSOR On Resistance (Source-side)
SENSOR On Resistance (Sink-side)
fOSC_TO
DSENSOR1
DSENSOR2
DSENSOR3
RSENSORH
RSENSORL
50 %
INA
Conditions
IOUT1 = 40 mA,
Guaranteed by design
IOUT1 = 40 mA,
Guaranteed by design
VCC2 = 15 V,
Guaranteed by design
VCC2 = 15 V,
Guaranteed by design
tPOFF1 - tPON1
Load = 4.7 Ω + 1 nF
Load = 4.7 Ω + 1 nF
IOUT1F = 40 mA,
Guaranteed by design
IOUT1F = 40 mA,
Guaranteed by design
VCC2 = 15 V,
Guaranteed by design
VCC2 = 15 V,
Guaranteed by design
tPOFF1F - tPON1F
Load = 4.7 Ω + 1 nF
Load = 4.7 Ω + 1 nF
IPROOUT1 = 40 mA,
Guaranteed by design
IPROOUT2 = 40 mA,
Guaranteed by design
VCC2 = 15V,
Guaranteed by design
VCC2 = 15V,
Guaranteed by design
IOUT2 = 40 mA
Guaranteed by design
Guaranteed by design
Guaranteed by design
RTC = 10 kΩ
VTO = 1.35 V
VTO = 2.59 V
VTO = 3.84 V
ISENSOR = 5 mA
ISENSOR = 5 mA
50 %
tPOFF1
tPON1
90 %
OUT1
10 %
tPOFF1F
tPON1F
90 %
OUT1F
10 %
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TSZ02201-0818ACH00150-1-2
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BM60060FV-C
Electrical Characteristics - continued
(Unless otherwise specified Ta = -40 °C to +125 °C, VBATT = 8 V to 24 V, VCC2 = 13.5 V to 24 V)
Parameter
Symbol
Min
Typ
Max
Unit
Protection Function
VREG1 UVLO Off Voltage
VUVLOREG1H
4.05
4.25
4.45
V
VREG1 UVLO On Voltage
VUVLOREG1L
3.95
4.15
4.35
V
VREG1 UVLO Delay Time
tDUVLOREG1OUT
2
10
30
μs
(OUT1)
VREG1 UVLO Delay Time
tDUVLOREG1FLT
2
10
30
μs
(FLT)
Output-side UVLO Off Voltage
VUVLO2H
11.5
12.5
13.5
V
Output-side UVLO On Voltage
VUVLO2L
10.5
11.5
12.5
V
Output-side UVLO Delay Time
tDUVLO2OUT
2
10
30
μs
(OUT1)
Output-side UVLO Delay Time
3
65
tDUVLO2FLT
μs
(FLT)
VREG2 UVLO Off Voltage
VUVLOREG2H
4.05
4.25
4.45
V
VREG2 UVLO On Voltage
VUVLOREG2L
3.95
4.15
4.35
V
VREG2 UVLO Delay Time
tDUVLOREG2OUT
2
10
30
μs
(OUT1)
VREG2 UVLO Delay Time
3
65
tDUVLOREG2FLT
μs
(FLT)
SCPIN Leading Edge
400
450
500
tSCPLEB
ns
Blanking Time
Short Circuit Detection Offset
VSCDET
-25
0
+25
mV
TCOMP Pin Output Voltage1
VTCOMP1
3.72
3.84
3.96
V
TCOMP Pin Output Voltage 2
VTCOMP2
1.30
1.35
1.40
V
SCPIN Pin Output Current 1
ISCPIN1
409
427
445
μA
SCPIN Pin Output Current 2
ISCPIN2
11.4
13.5
15.6
μA
tDSCPPRO
140
230
320
ns
tDSCPFLT
1
-
35
μs
tPRO2ON
VSCPINL
RFLTL
tFLTRLS
100
160
220
20
0.02
30
40
0.10
80
60
ns
V
Ω
ms
VOSFBH
12.9
13.8
14.7
V
VOSFBL
12.5
13.4
14.3
V
ROSFBL
-
30
80
Ω
Short Circuit Protection Delay
Time (PROOUT1, PROOUT2)
Short Circuit Protection
Delay Time (FLT)
PROOUT2 On Time
SCPIN Pin Low Voltage
FLT Output On Resistance
Fault Output Holding Time
Gate State H Detection
Threshold Voltage
Gate State L Detection
Threshold Voltage
OSFB Output On Resistance
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Conditions
Guaranteed by design
VSCPTH = 0.5 V
VTO = 3.84 V
VTO = 1.35 V
VTO = 3.84 V,
RTCOMP = 9 kΩ
VTO = 1.35 V,
RTCOMP = 100 kΩ
Guaranteed by design
ISCPIN = 1 mA
IFLT = 5 mA
IOSFB = 5 mA
TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves
Main Power Supply Circuit Current 1 : IBATT1 [mA]
Main Power Suuply Circuit Current 1 : IBATT1 [mA]
(Reference data)
2.0
1.8
1.6
Ta = +125 °C
Ta = +25 °C
1.4
1.2
1.0
0.8
Ta = -40 °C
0.6
0.4
8
12
16
20
2.0
1.8
1.6
VBATT = 14 V
1.4
VBATT = 24 V
1.2
1.0
VBATT = 8 V
0.8
0.6
0.4
-40
24
0
1.9
1.7
1.5
Ta = +25 °C
1.1
0.9
0.7
Ta = -40 °C
0.5
0.3
8
12
16
20
24
Main Power Supply Voltage : VBATT [V]
Figure 3. Main Power Supply Circuit Current 2
vs Main Power Supply Voltage
(FET_G not switching, INA not switching)
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TSZ22111 • 15 • 001
120
Figure 2. Main Power Supply Circuit Current 1
vs Temperature
(FET_G switching operation, INA not switching)
Main Power Supply Circuit Current 2 : IBATT2 [mA]
Main Power Supply Circuit Current 2 : IBATT2 [mA]
Figure 1. Main Power Supply Circuit Current 1
vs Main Power Supply Voltage
(FET_G switching operation, INA not switching)
Ta = +125 °C
80
Temperature : Ta [°C]
Main Power Supply Voltage : VBATT [V]
1.3
40
9/51
1.9
1.7
1.5
VBATT = 14 V
1.3
VBATT = 24 V
1.1
0.9
VBATT = 8 V
0.7
0.5
0.3
-40
0
40
80
120
Temperature : Ta [°C]
Figure 4. Main Power Supply Circuit Current 2
vs Temperature
(FET_G not switching, INA not switching)
TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
Main Power Supply Circuit Current 3 : IBATT3 [mA]
Main Power Supply Circuit Current 3 : IBATT3 [mA]
(Reference data)
2.1
1.9
1.7
Ta = +125 °C
Ta = +25 °C
1.5
1.3
1.1
0.9
Ta = -40 °C
0.7
0.5
8
12
16
20
2.1
1.9
1.7
VBATT = 14 V
1.5
VBATT = 24 V
1.3
1.1
VBATT = 8 V
0.9
0.7
0.5
24
-40
0
Main Power Supply Voltage : VBATT [V]
2.1
1.9
Ta = +25 °C
1.5
1.3
1.1
0.9
Ta = -40 °C
0.7
0.5
8
12
16
20
24
Main Power Supply Voltage : VBATT [V]
Figure 7. Main Power Supply Circuit Current 4 vs Main
Power Supply Voltage
(FET_G switching operation, INA = 20 kHz, Duty = 50 %)
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TSZ22111 • 15 • 001
120
Figure 6. Main Power Supply Circuit Current 3 vs
Temperature
(FET_G switching operation, INA = 10 kHz, Duty = 50 %)
Main Power Supply Circuit Current 4 : IBATT4 [mA]
Main Power Supply Circuit Current 4 : IBATT4 [mA]
2.3
Ta = +125 °C
80
Temperature : Ta [°C]
Figure 5. Main Power Supply Circuit Current 3 vs Main
Power Supply Voltage
(FET_G switching operation, INA = 10 kHz, Duty = 50 %)
1.7
40
10/51
2.3
2.1
1.9
VBATT = 14 V
1.7
VBATT = 24 V
1.5
1.3
1.1
VBATT = 8 V
0.9
0.7
0.5
-40
0
40
80
120
Temperature : Ta [°C]
Figure 8. Main Power Supply Circuit Current 4 vs
Temperature
(FET_G switching operation, INA = 20 kHz, Duty = 50 %)
TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
(Reference data)
4.6
Output-side Circuit Current : I CC2 [mA]
Output-side Circuit Current : I CC2 [mA]
4.6
3.8
Ta = +25 °C
Ta = +125 °C
3.0
Ta = -40 °C
2.2
1.4
3.8
3.0
VCC2 = 13.5 V
VCC2 = 15 V
VCC2 = 24 V
2.2
1.4
13.5
15 16.5 18 19.5 21 22.5
Output-side Supply Voltage : VCC2 [V]
24
-40
120
Figure 10. Output-side Circuit Current vs
Temperature
Figure 9. Output-side Circuit Current vs
Output-side Supply Voltage
5.50
5.50
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
5.25
VREG1 Output Voltage : VREG1 [V]
VREG1 Output Voltage : VREG1 [V]
0
40
80
Temperature : Ta [°C]
5.00
4.75
4.50
5.25
5.00
VBATT = 8 V
VBATT = 14 V
VBATT = 24 V
4.75
4.50
8
12
16
20
24
0
40
80
120
Temperature : Ta [°C]
Main Power Supply Voltage : VBATT [V]
Figure 11. VREG1 Output Voltage vs
Main Power Supply Voltage
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TSZ22111 • 15 • 001
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Figure 12. VREG1 Output Voltage vs
Temperature
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TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
(Reference data)
5.2
VREG2 Output Voltage : VREG2 [V]
VREG2 Output Voltage : VREG2 [V]
5.2
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
5.1
5.0
4.9
4.8
VCC2 = 13.5 V
VCC2 = 15 V
VCC2 = 24 V
5.1
5.0
4.9
4.8
13.5
15
16.5
18
19.5
21
22.5
24
-40
Output-side Supply Voltage : VCC2 [V]
40
80
120
Temperature : Ta [°C]
Figure 13. VREG2 Output Voltage vs
Output-side Supply Voltage
Figure 14. VREG2 Output Voltage vs
Temperature
0.30
FET_G Output Voltage L : VFETGL [V]
5.50
FET_G Output Voltage H : VFETGH [V]
0
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
5.25
5.00
4.75
4.50
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
0.20
0.10
0.00
-0.10
-0.20
-0.30
8
12
16
20
24
Main Power Supply Voltage : VBATT [V]
12
16
20
24
Main Power Supply Voltage : VBATT [V]
Figure 15. FET_G Output Voltage H vs
Main Power Supply Voltage
(IFET_G = 0 A)
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TSZ22111 • 15 • 001
8
Figure 16. FET_G Output Voltage L vs
Main Power Supply Voltage
(IFET_G = 0 A)
12/51
TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
(Reference data)
1.3
FET_G On Resistance : R ONGL [Ω]
FET_G On Resistance : R ONGH [Ω]
12.0
10.5
9.0
Ta = +25 °C
Ta = +125 °C
7.5
6.0
4.5
1.1
0.9
0.7
0.5
Ta = -40 °C
Ta = -40 °C
3.0
0.3
8
12
16
20
24
8
12
16
20
Main Power Supply Voltage : VBATT [V]
Main Power Supply Voltage : VBATT [V]
Figure 17. FET_G On Resistance vs
Main Power Supply Voltage
(Source-side)
Figure 18. FET_G On Resistance vs
Main Power Supply Voltage
(Sink-side)
24
50.0
120
115
42.5
110
Ta = +25 °C
Ta = +125 °C
Soft-start Time : tss [ms]
Oscillation Frequency : fosc_sw[kHz]
Ta = +25 °C
Ta = +125 °C
105
100
95
90
Ta = -40 °C
35.0
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
27.5
20.0
12.5
85
5.0
80
8
12
16
20
24
8
12
16
20
Main Power Supply Voltage : VBATT [V]
Main Power Supply Voltage : VBATT [V]
Figure 19. Oscillation Frequency vs
Main Power Supply Voltage
Figure 20. Soft-start Time vs Main Power
Supply Voltage
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24
TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
(Reference data)
0.8
Ta = -40 °C
1.51
Ta = +25 °C
1.50
1.49
Ta = +125 °C
1.48
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
1.47
8
12
16
20
8
24
12
16
20
Main Power Supply Voltage : VBATT [V]
Power Supply Voltage : VBATT [V]
Figure 21. FB Threshold Voltage vs Main
Power Supply Voltage
Figure 22. FB Input Current vs Main
Power Supply Voltage
(FB = 5 V)
24
160
Ta = +25 °C
Ta = -40 °C
-60
COMP Source Current : ICOMPSOURCE [μA]
-40
COMP Sink Current : ICOMPSINK [μA]
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
0.6
1.52
FB Input Current : IFB [μA]
FB Threshold Voltage : VFB [V]
1.53
-80
-100
-120
Ta = +125 °C
-140
-160
140
Ta = +125 °C
Ta = +25 °C
120
100
80
60
Ta = -40 °C
40
8
12
16
20
24
Power Supply Voltage : VBATT [V]
12
16
20
24
Power Supply Voltage : VBATT [V]
Figure 23. COMP Sink Current vs Main
Power Supply Voltage
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Figure 24. COMP Source Current vs Main
Power Supply Voltage
TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
(Reference data)
60
5
Maximum On Duty : DONMAX [%]
FLT Output Voltage : VFLT [V]
6
Ta = +125 °C
4
Ta = +25 °C
3
Ta = -40 °C
2
1
0
58
Ta = +125 °C
56
54
Ta = -40 °C
52
50
5.5
6
6.5
7
7.5
8
12
V_BATT UVLO On/Off Voltage : VUVLOBATTH/L [V]
Under Voltage Detection Threshold : VUVTH [V]
2.00
Ta = -40 °C
Ta = +25 °C
1.96
1.94
1.92
Ta = +125 °C
1.90
1.88
8
12
16
20
20
24
1.17
1.15
Ta = -40 °C
1.13
Ta = +25 °C
1.11
1.09
Ta = +125 °C
1.07
1.05
1.03
8
12
16
20
Main Power Supply Voltage : VBATT [V]
Main Power Supply Voltage : VBATT [V]
Figure 27. Over Voltage Detection Threshold
vs Main Power Supply Voltage
Figure 28. Under Voltage Detection Threshold
vs Main Power Supply Voltage
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TSZ22111 • 15 • 001
24
Figure 26. Maximum On Duty vs Main
Power Supply Voltage
2.02
1.98
16
Main Power Supply Voltage : VBATT [V]
Figure 25. FLT Output Voltage vs V_BATT
UVLO On/Off Voltage
Over Voltage Detection Threshold : VOVTH [V]
Ta = +25 °C
15/51
24
TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
0.23
Switching Controller Protection Holding Time :
tDCDCRLS [ms]
Over-current Detection Threshold : VOCTH [V]
(Reference data)
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
0.22
0.21
0.20
0.19
0.18
0.17
8
12
16
20
60
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
50
40
30
20
8
24
16
20
24
Main Power Supply Voltage : VBATT [V]
Main Power Supply Voltage : VBATT [V]
Figure 30. Switching Controller Protection
Holding Time vs Main Power Supply Voltage
Figure 29. Over-current Detection Threshold
vs Main Power Supply Voltage
5.5
100
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
5.0
4.5
Logic Pull-down Resistance : R IND [kΩ]
Logic High/Low Level Input Voltage : VINH/INL [V]
12
4.0
H Level
3.5
3.0
2.5
2.0
L Level
1.5
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
1.0
0.5
0.0
85
Ta = +25 °C
Ta = -40 °C
70
55
40
Ta = +125 °C
25
8
12
16
20
24
Main Power Supply Voltage : VBATT [V]
12
16
20
24
Main Power Supply Voltage : VBATT [V]
Figure 31. Logic High/Low Level Input
Voltage vs Main Power Supply Voltage
(INA, INB, GRSEL)
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Figure 32. Logic Pull-down Resistance vs
Main Power Supply Voltage
(INA, INB, GRSEL)
TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
OUT1 On Resistance (Source-side) : R ONH1 [Ω]
(Reference data)
Logic Input Filtering Time : t INFIL [ns]
90
73
56
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
39
22
5
4.7
4.9
5.1
5.3
0.39
0.36
Ta = +125 °C
0.33
0.30
0.27
Ta = +25 °C
0.24
0.21
0.18
0.15
Ta = -40 °C
0.12
0.09
5.5
13.5
15
16.5
18
19.5
21
22.5
24
VREG1 Output Voltage : VREG1 [V]
Output-side Supply Voltage : VCC2 [V]
Figure 33. Logic Input Filtering Time vs
VREG1 Output Voltage
(INA, INB)
Figure 34. OUT1 On Resistance (Source-side)
vs Output-side Supply Voltage
(IOUT1 = 40 mA)
0.40
210
0.37
Ta = +125 °C
0.34
OUT1 Turn ON Time : t PON1 [ns]
OUT1 On Resistance (Sink-side) : R ONL1 [Ω]
4.5
0.42
0.31
0.28
Ta = +25 °C
0.25
0.22
0.19
0.16
0.13
Ta = -40 °C
0.10
0.07
190
Ta = +125 °C
170
Ta = -40 °C
150
Ta = +25 °C
130
110
90
13.5
15
16.5
18
19.5
21
22.5
24
15
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
Output-side Supply Voltage : VCC2 [V]
Figure 35. OUT1 On Resistance (Sink-side) vs
Output-side Supply Voltage
(IOUT1 = 40 mA)
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Figure 36. OUT1 Turn ON Time vs
Output-side Supply Voltage
TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
(Reference data)
125.0
112.5
180
Ta = +125 °C
160
OUT1 Rise Time : t RISE1 [ns]
OUT1 Turn OFF Time : t POFF1 [ns]
200
Ta = +25 °C
140
120
Ta = -40 °C
100
100.0
87.5
Ta = +25 °C
75.0
62.5
50.0
37.5
Ta = -40 °C
25.0
80
13.5
15
16.5
18
19.5
21
22.5
13.5
24
15
16.5
18
19.5
21
22.5
Output-side Supply Voltage : VCC2 [V]
Output-side Supply Voltage : VCC2 [V]
Figure 37. OUT1 Turn OFF Time vs
Output-side Supply Voltage
Figure 38. OUT1 Rise Time vs
Output-side Supply Voltage
(Load = 4.7 Ω + 1 nF)
100.0
24
OUT1F On Resistance (Source-side) :
RONH1F [Ω]
0.50
87.5
OUT1 Fall Time : t FALL1 [ns]
Ta = +125 °C
75.0
Ta = +125 °C
Ta = +25 °C
62.5
50.0
Ta = -40 °C
37.5
25.0
0.47
0.44
0.41
Ta = +125 °C
0.38
0.35
0.32
0.29
Ta = +25 °C
0.26
0.23
0.20
0.17
Ta = -40 °C
0.14
0.11
13.5
15
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
15
16.5
18 19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
Figure 39. OUT1 Fall Time vs Output-side
Supply Voltage
(Load = 4.7 Ω + 1 nF)
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Figure 40. OUT1F On Resistance (Source-side)
vs Output-side Supply Voltage
(IOUT1F = 40 mA)
TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
0.36
210
0.33
OUT1F Turn ON Time : t PON1F [ns]
OUT1F On Resistance (Sink-side) : R ONL1F[Ω]
(Reference data)
Ta = +125 °C
0.30
0.27
0.24
Ta = +25 °C
0.22
0.19
0.16
0.13
Ta = -40 °C
0.10
0.07
190
Ta = +125 °C
170
150
Ta = +25 °C
130
110
90
13.5
15
16.5
18
19.5
21
22.5
24
13.5
Output-side Supply Voltage : VCC2 [V]
15
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
Figure 42. OUT1F Turn ON Time vs
Output-side Supply Voltage
Figure 41. OUT1F On Resistance (Sink-side)
vs Output-side Supply Voltage
(IOUT1F = 40 mA)
130.0
200
115.0
180
160
OUT1F Rise Time : t RISE1F [ns]
OUT1F Turn OFF Time : t POFF1F [ns]
Ta = -40 °C
Ta = +125 °C
140
Ta = -40 °C
120
Ta = +25 °C
100
100.0
Ta = +125 °C
85.0
70.0
55.0
Ta = +25 °C
40.0
Ta = -40 °C
80
13.5
25.0
15
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
15
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
Figure 44. OUT1F Rise Time vs
Output-side Supply Voltage
(Load = 4.7 Ω + 1 nF)
Figure 43. OUT1F Turn OFF Time vs
Output-side Supply Voltage
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TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
(Reference data)
2.6
PROOUT1 On Resistance : R ONPRO1 [Ω]
OUT1F Fall Time : t FALL1F [ns]
100.0
87.5
75.0
Ta = +125 °C
62.5
50.0
Ta = +25 °C
37.5
Ta = -40 °C
25.0
2.4
2.2
2
1.8
Ta = +125 °C
1.6
1.4
1.2
1
0.8
0.6
0.4
13.5
15
16.5
18
19.5
21
22.5
24
13.5
15
Figure 45. OUT1F Fall Time vs
Output-side Supply Voltage
(Load = 4.7 Ω + 1 nF)
18
19.5
21
22.5
24
Figure 46. PROOUT1 On Resistance vs
Output-side Supply Voltage
(IPROOUT1 = 40 mA)
0.8
0.6
OUT2 On Resistance : R ON2 [Ω]
0.7
0.6
Ta = +125 °C
0.5
0.4
Ta = +25 °C
Ta = -40 °C
0.3
0.2
0.1
13.5
16.5
Output-side Supply Voltage : VCC2 [V]
Output-side Supply Voltage : VCC2 [V]
PROOUT2 On Resistance : R ONPRO2 [Ω]
Ta = -40 °C
Ta = +25 °C
0.5
Ta = +125 °C
0.4
Ta = +25 °C
Ta = -40 °C
0.3
0.2
0.1
15
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
15
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
Figure 47. PROOUT2 On Resistance vs
Output-side Supply Voltage
(IPROOUT2 = 40 mA)
www.rohm.com
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TSZ22111 • 15 • 001
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Figure 48. OUT2 On Resistance vs
Output-side Supply Voltage
(IOUT2 = 40 mA)
TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
(Reference data)
90
OUT2 Output Delay Time : tOUT2ON [ns]
OUT2 On Threshold Voltage : VOUT2ON [V]
2.2
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
2.1
2
1.9
1.8
Ta = +125 °C
80
70
60
50
Ta = +25 °C
Ta = -40 °C
40
30
20
13.5
15
16.5
18
19.5
21
22.5
24
13.5
15
18
19.5
21
22.5
Output-side Supply Voltage : VCC2 [V]
Output-side Supply Voltage : VCC2 [V]
Figure 49. OUT2 On Threshold Voltage vs
Output-side Supply Voltage
Figure 50. OUT2 Output Delay Time vs
Output-side Supply Voltage
24
1.03
1.025
Ta = +125 °C
1.013
Ta = +125 °C
TO Output Current : ITO [mA]
1.02
TC Voltage : VTC [V]
16.5
Ta = +25 °C
1.000
Ta = -40 °C
0.988
Ta = +25 °C
1.01
1.00
Ta = -40 °C
0.99
0.98
0.97
0.975
13.5
15
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
15
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
Figure 52. TO Output Current vs Output-side
Supply Voltage
(RTC = 10 kΩ)
Figure 51. TC Voltage vs Output-side
Supply Voltage
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Typical Performance Curves - continued
(Reference data)
14
SENSOR Output Frequency : fOSC_TO [kHz]
TO Output Current : ITO [mA]
10
1
13
Ta = +25 °C
12
11
10
Ta = -40 °C
9
8
0.1
1
10
13.5
100
TC Resistance : R TC [kΩ]
16.5
18
19.5
21
22.5
24
Figure 54. SENSOR Output Frequency vs
Output-side Supply Voltage
100
92
SENSOR Output Duty1 : DSENSOR1 [%]
90
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
80
70
60
50
40
30
20
10
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
91
90
89
88
0
1.35
15
Output-side Supply Voltage : VCC2 [V]
Figure 53. TO Output Current vs TC
Resistance
SENSOR Output Duty : DSENSOR [%]
Ta = +125 °C
1.77
2.18
2.60
3.01
3.43
3.84
13.5
15
16.5
18
19.5
21
22.5
24
TO Voltage [V]
Output-side Supply Voltage : VCC2 [V]
Figure 55. SENSOR Output Duty vs TO Voltage
Figure 56. SENSOR Output Duty1 vs Output-side
Supply Voltage
(VTO = 1.35 V)
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Typical Performance Curves - continued
(Reference data)
13.6
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
51.8
SENSOR Output Duty3 : DSENSOR3 [%]
SENSOR Output Duty2 : DSENSOR2 [%]
52.4
51.2
50.6
50
49.4
48.8
48.2
47.6
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
12.4
11.2
10
8.8
7.6
6.4
13.5
15
16.5
18
19.5
21
22.5
13.5
24
Output-side Supply Voltage : VCC2 [V]
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
Figure 57. SENSOR Output Duty2 vs
Output-side Supply Voltage
(VTO = 2.59 V)
Figure 58. SENSOR Output Duty3 vs
Output-side Supply Voltage
(VTO = 3.84 V)
160
SENSOR On Resistance (Sink-side) :
RSENSORL [Ω]
160
SENSOR On Resistance (Source-side) :
RSENSORH [Ω]
15
130
100
Ta = +125 °C
70
40
Ta = +25 °C
Ta = -40 °C
130
100
Ta = +125 °C
70
40
Ta = +25 °C
Ta = -40 °C
10
10
8
12
16
20
24
12
16
20
24
Main Power Supply Voltage : VBATT [V]
Main Power Supply Voltage : VBATT [V]
Figure 59. SENSOR On Resistance (Source-side)
vs Main Power Supply Voltage
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Figure 60. SENSOR On Resistance (Sink-side)
vs Main Power Supply Voltage
TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
(Reference data)
6
VREG1 UVLO Delay Time (OUT1) :
tDUVLOREG1OUT [μs]
30
FLT Voltage : VFLT [V]
5
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
4
3
2
1
26
22
18
14
10
6
2
0
3.95
4.05
4.15
4.25
4.35
VREG1 Output Voltage : VREG1 [V]
-40
4.45
40
80
120
Temperature : Ta [°C]
Figure 61. FLT Voltage vs VREG1 Output Voltage
(VREG1 UVLO On/Off Voltage)
Figure 62. VREG1 UVLO Delay Time (OUT1)
vs Temperature
30
6
26
5
22
FLT Voltage : VFLT [V]
VREG1 UVLO Delay Time (FLT) :
tDUVLOREG1FLT [μs]
0
18
14
10
4
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
3
2
1
6
2
0
-40
0
40
80
120
Temperature : Ta [°C]
11
11.5
12
12.5
13
Output-side Supply Voltage : VCC2 [V]
13.5
Figure 64. FLT Voltage vs Output-side Supply Voltage
(Output-side UVLO On/Off Voltage)
Figure 63. VREG1 UVLO Delay Time (FLT)
vs Temperature
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Typical Performance Curves - continued
(Reference data)
63
Output-side UVLO Delay Time (FLT) :
tDUVLO2FLT [μs]
Output-side UVLO Delay Time (OUT1) :
tDUVLO2OUT [μs]
30
26
22
18
14
10
6
53
43
33
23
13
3
2
-40
0
40
80
-40
120
80
120
Figure 66. Output-side UVLO Delay Time (FLT)
vs Temperature
Figure 65. Output-side UVLO Delay Time (OUT1)
vs Temperature
6
VREG2 UVLO Delay Time (OUT1) :
tDUVLOREG2OUT [μs]
30
5
FLT Voltage : VFLT [V]
40
Temperature : Ta [°C]
Temperature : Ta [°C]
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
4
3
2
1
26
22
18
14
10
6
2
0
3.95
0
4.05
4.15
4.25
4.35
VREG2 Output Voltage : VREG2 [V]
4.45
0
40
80
120
Temperature : Ta [°C]
Figure 67. FLT Voltage vs VREG2 Output Voltage
(VREG2 UVLO On/Off Voltage)
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Figure 68. VREG2 UVLO Delay Time (OUT1)
vs Temperature
TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
(Reference data)
500
SCPIN Leading Edge Blanking Time :
tSCPLEB [ns]
VREG2 UVLO Delay Time (FLT) :
tDUVLOREG2FLT [μs]
63
53
43
33
23
13
490
480
470
460
450
440
430
Ta = +25 °C
Ta = +125 °C
420
410
400
3
-40
0
40
80
13.5
120
Temperature : Ta [°C]
15
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
Figure 69. VREG2 UVLO Delay Time (FLT)
vs Temperature
Figure 70. SCPIN Leading Edge Blanking Time
vs Output-side Supply Voltage
3.96
20
TCOMP Pin Output Voltage1 : VTCOMP1 [V]
25
Short Circuit Detection Offset : VSCDET [mV]
Ta = -40 °C
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
15
10
5
0
-5
-10
-15
-20
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
3.92
3.88
3.84
3.8
3.76
3.72
-25
13.5
15
16.5
18
19.5
21
22.5
24
15
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
Output-side Supply Voltage : VCC2 [V]
Figure 71. Short Circuit Detection Offset vs
Output-side Supply Voltage
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Figure 72. TCOMP Pin Output Voltage1 vs
Output-side Supply Voltage
(VTO = 3.84 V)
TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
(Reference data)
445
SCPIN Pin Output Current 1 : ISCPIN1 [μA]
TCOMP Pin Output Voltage2 : VTCOMP2 [V]
1.40
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
1.38
1.36
1.34
1.32
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
439
433
427
421
415
409
1.30
13.5
15
16.5
18
19.5
21
22.5
13.5
24
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
Output-side Supply Voltage : VCC2 [V]
Figure 74. SCPIN Pin Output Current 1 vs
Output Side Supply Voltage
(VTO = 3.84 V, RTCOMP = 9 kΩ)
Figure 73. TCOMP Pin Output Voltage2 vs
Output-side Supply Voltage
(VTO = 1.35 V)
320
15.6
15
300
Short Circuit Protection Delay Time
(PROOUT1, PROOUT2) : tDSCPPRO [ns]
SCPIN Pin Output Current 2 : ISCPIN2 [μA]
15
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
14.4
280
Ta = -40 °C
260
13.8
240
220
13.2
12.6
Ta = +125 °C
Ta = +25 °C
200
180
12
160
11.4
140
13.5
15
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
Figure 75. SCPIN Pin Output Current 2 vs
Output-side Supply Voltage
(VTO = 1.35 V, RTCOMP = 100 kΩ)
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13.5
15
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
Figure 76. Short Circuit Protection Delay Time
(PROOUT1, PROOUT2) vs Output-side
Supply Voltage
TSZ02201-0818ACH00150-1-2
13.Mar.2019 Rev.001
BM60060FV-C
Typical Performance Curves - continued
(Reference data)
220
PROOUT2 On Time : t PRO2ON [ns]
Short Circuit Protection Delay Time (FLT)
: tDSCPFLT [μs]
33
29
25
21
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
17
13
9
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
180
160
140
120
5
1
100
13.5
15
16.5
18
19.5
21
22.5
24
13.5
15
16.5
18
19.5
21
22.5
24
Output_side Supply Voltage : VCC2 [V]
Output-side Supply Voltage : VCC2 [V]
Figure 77. Short Circuit Protection Delay Time
(FLT) vs Output-side Supply Voltage
Figure 78. PROOUT2 On Time vs Output-side
Supply Voltage
80
FLT Output On Resistance : R FLTL [Ω]
0.1
SCPIN Pin Low Voltage : VSCPINL [V]
200
0.08
0.06
Ta = +25 °C
Ta = +125 °C
0.04
0.02
70
60
50
Ta = +125 °C
40
30
Ta = -40 °C
20
Ta = +25 °C
Ta = -40 °C
0
13.5
10
15
16.5
18
19.5
21
22.5
24
8
12
16
20
Output-side Supply Voltage : VCC2 [V]
Main Power Supply Voltage : VBATT [V]
Figure 79. SCPIN Pin Low Voltage vs
Output-side Supply Voltage
(ISCPIN = 1 mA)
Figure 80. FLT Output On Resistance vs
Main Power Supply Voltage
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BM60060FV-C
Typical Performance Curves - continued
(Reference data)
14.7
Gate State H/L Detection Threshold Voltage :
VOSFBH/OSFBL [V]
Fault Output Holding Time : t FLTRLS [ms]
60
14.5
Ta = +25 °C
14.3
50
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
14.1
Ta = -40 °C
13.9
Ta = +125 °C
H State
13.7
40
13.5
13.3
13.1
30
Ta = -40 °C
Ta = +125 °C
L State
12.9
Ta = +25 °C
12.7
20
12.5
8
12
16
20
24
Main Power Supply Voltage : VBATT [V]
13.5
15
16.5
18
19.5
21
22.5
24
Output-side Supply Voltage : VCC2 [V]
Figure 81. Fault Output Holding Time vs
Main Power Supply Voltage
Figure 82. Gate State H/L Detection Threshold
Voltage vs Output-side Supply Voltage
OSFB Output On Resistance : R OSFBL [Ω]
80
70
60
50
Ta = +125 °C
40
30
20
Ta = -40 °C
Ta = +25 °C
10
8
12
16
20
24
Main Power Supply Voltage : VBATT [V]
Figure 83. OSFB Output On Resistance vs
Main Power Supply Voltage
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Description of Pins and Cautions on Layout of Board
1.
V_BATT (Main power supply pin)
This is the main power supply pin. Connect a bypass capacitor between the V_BATT pin and the GND1 pin in order to
suppress voltage variations.
2.
VREG1 (Input-side internal power supply pin)
This is the internal power supply pin on the input-side. Be sure to connect a bypass capacitor between the VREG1 pin
and the GND1 pin in order to prevent oscillation and suppress voltage variation due to the driving current of the internal
transformer.
3.
GND1 (Input-side ground pin)
This pin is the ground pin on the input-side.
4.
VCC2 (Output-side power supply pin)
This is the power supply pin on the output-side. To reduce voltage fluctuations due to the output current, connect a
bypass capacitor between the VCC2 pin and the GND2 pin.
5.
VREG2 (Output-side internal power supply pin)
This is the internal power supply pin on the output-side. Be sure to connect a bypass capacitor between the VREG2 pin
and the GND2 pin in order to prevent oscillation and suppress voltage variation due to the driving current of the internal
transformer.
6.
GND2 (Output-side ground pin)
This is the ground pin on the output-side.
7.
INA, INB (Control input pin), GRSEL (Gate resistance switching pin)
These are pins for determining the output logic. The OUT1F pin holds the previous state after GRSEL is switched and
until the next the OUT1 pin is switched.
GRSEL
INB
INA
OUT1
OUT1F
L
8.
9.
Connect the GND2 pin to the emitter/source of output device.
L
L
L
Hi-Z
L
L
H
H
Hi-Z
L
H
L
L
Hi-Z
L
H
H
L
Hi-Z
H
L
L
L
L
H
L
H
H
H
H
H
L
L
L
H
H
H
L
L
FLT (Fault output pin)
The FLT pin is an open drain pin that sends a fault signal when a fault occurs (i.e., when the under voltage lockout
function (UVLO) or short circuit protection function (SCP) is activated).
State
FLT
While in normal operation
Hi-Z
When a Fault occurs (UVLO/SCP)
L
OSFB (Output pin for monitoring gate condition)
The OSFB pin is an open drain pin that outputs L when the gate theory of output element being monitored by the
PROOUT1 pin is H. However, the OSFB pin becomes Hi-Z when a fault occurs (i.e., when the under voltage lockout
function (UVLO) or short circuit protection function (SCP) is activated).
Status
PROOUT1 (input)
OSFB
While in normal operation
When a Fault occurs (UVLO / SCP)
H
L
L
Hi-Z
X
Hi-Z
X: Don't care
10. SENSOR (Temperature information output pin)
This is a pin outputs the voltage of the TO pin converted to Duty cycle.
11. FB (Error amplifier inverting input pin for switching controller)
This is a voltage feedback pin of the switching controller. This pin combine with voltage monitoring at overvoltage
protection function and under voltage protection function for switching controller. When overvoltage or under voltage
protection is activated, switching controller will be at OFF state (the FET_G pin outputs L). When the switching
controller protection holding time tDCDCRLS is completed, the protection function will be released. Under voltage function
is not activated during soft-start. Connect it to the VREG1 pin when the switching controller is not used.
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Description of Pins and Cautions on Layout of Board – continued
12. COMP (Error amplifier output pin for switching controller)
This is the gain control pin of the switching controller. Connect a phase compensation capacitor and resistor. When
the switching controller is not used, connect it to the GND1 pin.
13. FET_G (MOS FET for transformer drive control pin for switching controller)
This is a MOS FET for transformer drive control pin for switching controller. Leave it open when the switching controller
is not used.
14. SENSE (Current feedback resistor connection pin for switching controller)
This is a pin connected to the resistor of the switching controller current feedback. This pin combines with current
detection at overcurrent restriction function for switching controller. When overcurrent restriction is activated, switching
controller will be at OFF state (the FET_G pin outputs Low), and the overcurrent restriction function will be released in
the next switching period. When the switching controller is not used, connect it to the VREG1 pin.
15. OUT1, OUT1F (Output pin)
The OUT1 pin and the OUT1F pin are gate driving pins.
16. OUT2 (Miller clamp pin)
This is the miller clamp pin for preventing a rise of gate voltage due to miller current of output element. It also functions
as a pin for monitoring gate voltage for miller clamp and the OUT2 pin voltage become not more than VOUT2ON (Typ 2.0 V),
miller clamp function operates. The OUT2 pin should be connect to the GND2 pin when miller clamp function is not
used.
17. PROOUT1 (Soft turn off pin for short circuit protection / Gate voltage input pin), PROOUT2 (Fast turn off pin for short
circuit protection)
They are pins for soft turn off of output element when short-circuit protection is activated. Both the PROOUT1 pin and
the PROOUT2 pin turn on for tPRO2ON from short circuit detection. After tPRO2ON, only the PROOUT1 pin turns on.
Leave the PROOUT2 pin open when the fast turn off function is not used. It also functions as the PROOUT1 pin for
monitoring gate voltage for output state feedback function.
18. SCPIN (Short circuit detection pin), SCPTH (Short circuit detection threshold setting pin)
The SCPIN pin and the SCPTH pin are current detection pins for short circuit protection. When the SCPIN pin voltage
becomes the SCPTH pin voltage, or more, the short circuit protection function is activated. Built-in MOSFET between
the SCPIN pin and the GND2 pin for discharging electric charge of external filter when the OUT1 pin is L state. In the
open state, the IC may possibly malfunction. To avoid this risk, apply voltage to SCPTH pin even when not using the
short circuit protection function and connect the SCPIN pin to the GND2 pin.
19. TCOMP (Temperature compensation pin of short circuit detection voltage)
The TCOMP pin connects a resistor that sets the SCPIN pin output current according to TO pin voltage.
20. TC (Resistor connection pin for setting constant current)
The TC pin is a resistor connection for setting the constant current output. If an arbitrary resistance value is connected
between the TC pin and the GND2 pin, it is possible to set the constant current value output from the TO1 pin.
21. TO (Constant current output / sensor voltage input pin)
The TO pin is constant current output / voltage input pins. It can be used as a sensor input by connecting an element
with arbitrary impedance between the TO pin and the GND2 pin.
Description of Functions and Examples of Constant Setting
1. Fault Status Output
This function is used to set a fault signal from the FLT pin when a fault occurs (i.e., when the under voltage lockout
function (UVLO) or short circuit protection function (SCP) is activated) and hold the fault signal until fault output holding
time (tFLTRLS) is completed.
Fault occurs (UVLO or SCP)
Status
Status
FLT pin
Normal
Hi-Z
Hi-Z
Fault occurs
L
FLT
L
H
OUT1
L
Fault output holding time (tFLTRLS)
（tFLTRLS
） Timing Chart
Figure 84. Fault Status
Output
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Description of Functions and Examples of Constant Setting - continued
2. Under Voltage Lockout (UVLO) Function
The BM60060FV-C incorporates the under voltage lockout (UVLO) function on V_BATT, VCC2, VREG1 and VREG2.
When the power supply voltage drops to the UVLO ON voltage, the OUT1 pin and the FLT pin will both output the “L”
signal and the OUT1F pin becomes the "Hi-Z" state. However, if V_BATT or VREG1 voltage drops to the UVLO ON
voltage when the OUT1F pin is "L", the OUT1F pin holds "L" state. When the power supply voltage rises to the UVLO
OFF voltage, UVLO will be reset after the fault output holding time tFLTRLS is completed. However, if the INA pin is "L" or
the INB pin is "H", when UVLO reset timing, the OUT1F pin holds the previous state until the next the OUT1 pin is
switched even if the GRSEL pin is H. In addition, to prevent malfunction due to noise, filtering time are set on both
V_BATT, VCC2, VREG1 and VREG2.
H
L
H
L
VUVLOBATTH
VUVLOBATTL
GRSEL
INA
V_BATT
Hi-Z
L
H
OUT1
L
H
OUT1F
L Hi-Z
H Hi-Z
FET_G
L
Figure 85. V_BATT UVLO Function Operation Timing Chart (When GRSEL = L)
H
GRSEL
L
H
INA
L
VUVLOREG1H
VREG1
VUVLOREG1L
FLT
Hi-Z
L
H
OUT1
L
H Hi-Z
OUT1F
L
H Hi-Z
FET_G
L
Figure 86. VREG1 UVLO Function Operation Timing Chart (When GRSEL = L)
H
GRSEL
L
H
INA
L
VUVLO2H
VCC2
VUVLO2L
FLT
FLT
OUT1
OUT1F
FET_G
Figure 87. VCC2 UVLO Function Operation Timing Chart (When GRSEL = L)
Hi-Z
L
H Hi-Z
L
H Hi-Z
L
H
L
H
L
H
L
GRSEL
INA
VUVLOREG2H
VUVLOREG2L
VREG2
Hi-Z
L
HHi-Z
L
HHi-Z
L
H
L
FLT
OUT1
OUT1F
FET_G
Figure 88. VREG2 UVLO Function Operation Timing Chart (When GRSEL = L)
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2. Under Voltage Lockout (UVLO) Function – continued
H
L
H
L
VUVLOBATTH
VUVLOBATTL
GRSEL
INA
V_BATT
Hi-Z
L
H
L
H
L Hi-Z
H Hi-Z
L
FLT
OUT1
OUT1F
FET_G
Figure 89. V_BATT UVLO Function Operation Timing Chart (When GRSEL = H)
H
L
H
L
VUVLOREG1H
VUVLOREG1L
GRSEL
INA
VREG1
FLT
OUT1
OUT1F
FET_G
Figure 90. VREG1 UVLO Function Operation Timing Chart (When GRSEL = H)
Hi-Z
L
H
L
H Hi-Z
L
H Hi-Z
L
H
L
H
L
VUVLO2H
VUVLO2L
GRSEL
INA
VCC2
FLT
OUT1
OUT1F
FET_G
Figure 91. VCC2 UVLO Function Operation Timing Chart (When GRSEL = H)
Hi-Z
L
H Hi-Z
L
H Hi-Z
L
H
L
H
L
H
L
GRSEL
INA
VUVLOREG2H
VUVLOREG2L
VREG2
Hi-Z
L
H
L Hi-Z
H
L Hi-Z
H
L
FLT
OUT1
OUT1F
FET_G
Figure 92. VREG2 UVLO Function Operation Timing Chart (When GRSEL = H)
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Description of Functions and Examples of Constant Setting - continued
3. Short Circuit Protection (SCP) Function
Continuing the state where the SCPIN pin voltage ≥ the SCPTH pin voltage for tDSCPPRO or more, the short circuit
protection function is activated. Once the function is activated, the OUT1 pin and the OUT1F pin become "Hi-Z" state
and both the PROOUT1 pin and the PROOUT2 pin turn on (Fast Turn Off). After tPRO2ON since the short circuit
detection, the PROOUT2 pin turns off (Soft Turn Off). Furthermore, when the SCPIN pin voltage < the SCPTH pin
voltage and the OUT2 pin voltage < VOUT2ON, the OUT1 pin and the OUT2 pin become L. In additional, the FLT pin
becomes L after tDSCPFLT since the short circuit protection function is activated. Finally, when the fault output holding
time tFLTRLS is completed, the SCP function will be released and the FLT pin becomes "Hi-Z". The PROOUT1 pin hold L
state until the OUT1 pin becomes H.
This IC has a built-in temperature characteristics correction function for short circuit detection voltage. Since the SCPIN
pin outputs current ISCPIN according to the TO pin voltage, the IC is capable of correcting the temperature characteristics
for short circuit detection voltage using voltage drop of resistor RSCPCOMP connected to the SCPIN pin in series. The
SCPIN pin output current ISCPIN can be formulated as:
ISCPIN [mA] = VTO [V] /RTCOMP [kΩ]
Therefore, short circuit detection voltage VSC can be formulated as:
VSC [V] = VSCPTH [V] - VTO [V] × RSCPCOMP [kΩ] / RTCOMP [kΩ]
Still more, built-in MOSFET between the SCPIN pin and the GND2 pin for discharging electric charge of external filter
when OUT1 is L state. This MOSFET turns off after tSCPLEB since the OUT1 pin becomes H. And this MOSFET
immediately turns on after the OUT1 pin becomes L. Also, this MOSFET immediately turns on after short circuit
detection.
VCC2
OUT2
+
-
OUT1
OUT1F
LOGIC
PROOUT1
PROOUT2
FLT
FLT
SCPIN
RSCPCOMP
+
GND1
VREG2
-
SCPTH
TCOMP
TO
RTCOMP
TEMP
COMPENSATION
GND2
Figure 93. SCP Function Block Diagram
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3. Short Circuit Protection (SCP) Function – continued
H
L
INA
VSCDET
SCPIN
tDSCPPRO
tDSCPPRO
H
Hi-Z
L
H
Hi-Z
L
Hi-Z
L
Hi-Z
L
Hi-Z
L
Hi-Z
L
OUT1
OUT1F
OUT2
PROOUT1
PROOUT2
FLT
tDSCPFLT
tDSCPFLT
Gate Voltage
VOUT2ON
tPRO2ON
VOUT2ON
tPRO2ON
tFLTRLS
tFLTRLS
Figure 94. SCP Function Operation Timing Chart (When GRSEL = L)
START
Yes
VSCPIN ≥ VSCPTH
VOUT2 < VOUT2ON
No
No
Yes
Yes
Exceed tDSCPPRO
No
OUT1 = L, OUT2 = L
Yes
OUT1 = Hi-Z, OUT1F = Hi-Z
PROOUT1 = L, PROOUT2 = L
FLT = L (Note 11)
Exceed tFLTRLS
No
Yes
Exceed tPRO2ON
No
FLT = Hi-Z
Yes
PROOUT2 = Hi-Z
INA = H
No
Yes
VSCPIN < VSCPTH
OUT1 = H
OUT2 = Hi-Z, PROOUT1 = Hi-Z
No
Yes
(Note 11) The FLT pin becomes "L" after tDSCPFLT
Figure 95. SCP Function Operation Status Transition Diagram (When GRSEL = L)
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3. Short Circuit Protection (SCP) Function – continued
H
L
INA
VSCDET
SCPIN
tDSCPPRO
tDSCPPRO
H
Hi-Z
L
H
Hi-Z
L
Hi-Z
L
Hi-Z
L
Hi-Z
L
Hi-Z
L
OUT1
OUT1F
OUT2
PROOUT1
PROOUT2
FLT
tDSCPFLT
tDSCPFLT
Gate Voltage
VOUT2ON
tPRO2ON
VOUT2ON
tPRO2ON
tFLTRLS
tFLTRLS
Figure 96. SCP Function Operation Timing Chart (When GRSEL = H)
START
Yes
VSCPIN ≥ VSCPTH
VOUT2 < VOUT2ON
No
No
Yes
Yes
Exceed tDSCPPRO
No
OUT1 = L, OUT2 = L
Yes
OUT1 = Hi-Z, OUT1F = Hi-Z
PROOUT1 = L, PROOUT2 = L
FLT = L (Note 12)
Exceed tFLTRLS
No
Yes
Exceed tPRO2ON
No
FLT = Hi-Z
Yes
PROOUT2 = Hi-Z
INA = H
No
Yes
VSCPIN < VSCPTH
OUT1 = H, OUT1F = H
OUT2 = Hi-Z, PROOUT1 = Hi-Z
No
Yes
(Note 12) The FLT pin becomes "L" after tDSCPFLT
Figure 97. SCP Function Operation Status Transition Diagram (When GRSEL = H)
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Description of Functions and Examples of Constant Setting - continued
4. Miller Clamp (MC) Function
When the OUT1 pin = L and the OUT2 pin voltage < VOUT2ON, internal MOS of the OUT2 pin is turned ON and miller
clamp function operates. After miller clamp function operates, the OUT2 pin keeps L state until the OUT1 pin goes H
again. While the short circuit protection function is activated, miller clamp function operates when the OUT2 pin voltage
< VOUT2ON.
Short Circuit
Not detected
OUT1
OUT2 (Input)
OUT2 (Output)
H
X
Hi-Z
L
Not less than VOUT2ON
Hi-Z
L
less than VOUT2ON
L
Hi-Z
Not less than VOUT2ON
Hi-Z
Hi-Z
less than VOUT2ON
L
Detected
VCC2
OUT1
LOGIC
OUT2
+
-
VOUT2ON
GND2
Figure 98. Miller Clamp Function Block Diagram
H
OUT1
L
tOUT2ON
OUT2 (Input)
VOUT2ON
0V
Hi-Z
OUT2 (Output)
L
Figure 99. Miller Clamp Function Operation Timing Chart
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Description of Functions and Examples of Constant Setting - continued
5. Gate Resistance Switching Function
When the GRSEL pin is L, the OUT1 pin alone outputs the theory according to the input of the INA pin and INB pin, and
the OUT1F pin becomes Hi-Z. When the GRSEL pin is H, the OUT1 pin and the OUT1F pin output the theory
according to the input of the INA pin and INB pin. The OUT1F pin holds the previous state until next switching of the
OUT1 pin after the GRSEL pin is switched.
GRSEL
INB
INA
OUT1
OUT1F
L
L
L
L
Hi-Z
L
L
H
H
Hi-Z
L
H
L
L
Hi-Z
L
H
H
L
Hi-Z
H
L
L
L
L
H
L
H
H
H
H
H
L
L
L
H
H
H
L
L
H
GRSEL
L
H
INA
L
H
OUT1
L
H
Hi-Z
L
OUT1F
Figure 100. Gate Resistance Switching Function Operation Timing Chart
6. Output State Feedback Function
When the output element gate state being monitored at the PROOUT1 pin is H, the OSFB pin becomes L. However,
when a fault occurs (i.e., when the under voltage lockout function (UVLO) or short circuit protection function (SCP) is
activated), the OSFB pin becomes Hi-Z.
State
PROOUT1 Input
OSFB
Normal operation
Fault occurs
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H
L
L
Hi-Z
X
Hi-Z
X: Don't care
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Description of Functions and Examples of Constant Setting - continued
7. Switching Controller
(1) Basic action
This IC has a built-in switching controller which repeats ON/OFF synchronizing with internal clock. When V_BATT
voltage is supplied (VBATT > VUVLOBATTH and VREG1 > VUVLOREG1), the FET_G pin starts switching by soft-start. Output
voltage is determined by the following equation by external resistance and winding ratio “n” of flyback transformer (n =
VOUT2 side winding number/VOUT1 side winding number)
VOUT = VFB×{(R1+R2)/R2} ×n [V]
(2) MAX DUTY
When, for example, output load is large, and voltage level of the SENSE pin does not reach current detection level,
output is forcibly turned OFF by Maximum On Duty (DONMAX).
(3) Over voltage protection function, under voltage protection function
The switching controller has protection function as overvoltage protection (OVP) and under voltage protection (UVP).
OVP and UVP monitor the voltage of the FB pin. When the protection function is activated, switching controller will
be OFF state (the FET_G pin outputs Low). The switching controller protection holding time (tDCDCRLS) is completed,
the protection function will be released. Under voltage function is not activated during soft-start.
VOVTH
FB
0V
tDCDCRLS
FET_G
Figure 101. Over Voltage Protection Function Operation Timing Chart
V_BATT
0V
tss
VUVTH
FB
0V
tDCDCRLS
FET_G
Figure 102. Under Voltage Protection Function Operation Timing Chart
(4) Overcurrent restriction function
The switching controller has overcurrent restriction function that monitors the SENSE pin voltage. When overcurrent
restriction is activated, switching controller will be at OFF state (FET_G = L), and the overcurrent restriction function
will be released in the next switching period.
Internal Clock
VOCTH
SENSE
0V
FET_G
Figure 103. Overcurrent Restriction Function Operation Timing Chart
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7. Switching Controller – continued
(5) Pin conditions when switching controller is not used
Implement pin setting as shown below when switching power supply is not used.
Pin Number
Pin Name
Treatment Method
22
FB
Connect to VREG1
23
COMP
24
V_BATT
Connect to GND1
Connect power supply
25
VREG1
Connect capacitor
26
FET_G
No connection
27
SENSE
Connect to VREG1
Soft start
R1
-
FB
VFB
R2
UVLO_BATT
+
OVP
COMP
UVP
Max duty
VOUT
V_BATT
VREG
VREG1
R
Q
FET_G
S
SENSE
+
COMP
OSC
Slope
OC
GND1
Figure 104. Block Diagram of switching controller
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Description of Functions and Examples of Constant Setting - continued
8. Temperature Monitor Function
This IC has a built-in constant current circuit and constant current is supplied from the TO pin. This current value ITO
can be adjusted in accordance with the resistance value connected between the TC pin and the GND2 pin.
Furthermore, the TO pin has voltage input function, and outputs signal of the TO pin voltage converted to Duty from the
SENSOR pin.
Constant Current Value
ITO [mA]=10 × VTC [V] / RTC [kΩ]
VCC2
OSC
x10
TO
SENSOR
Z
TC
RTC
GND2
Figure 105. Block Diagram of Temperature Monitor Function
4.1 V
Internal triangle wave
TO pin voltage
1.1 V
SENSOR pin output
Figure 106. Temperature Monitor Function Timing Chart
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Selection of Components Externally Connected
The following components are recommended for external components.
ROHM
MCR03EZP
ROHM
MCR100JZH
LTR100JZP
LTR50UZP
LTR18EZP
GND1
sumida
CEER117
ECU
GND2
FLT
OUT2
GRSEL
OUT1F
INA
SCPTH
OSFB
TC
SENSOR
TO
INB
VCC2
FB
VREG2
COMP
SCPIN
ROHM
MCR03EZP
VCC2
V_BATT
V_BATT
TCOMP
VREG1
PROOUT1
FET_G
PROOUT2
ROHM
LTR50UZP
LTR18EZP
スナバ回路
GND1
VCC2
GND2
SENSE
OUT1
GND1
GND2
GND2
ROHM
RB168VYM150FH
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TSZ22111 • 15 • 001
ROHM
LTR18EZP
ROHM
RTR020N05FRA
RSR025N05FRA
RTR025N05FRA
RTR030N05FRA
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MCR100JZH
ROHM
MCR100JZH
LTR100JZP
LTR50UZP
LTR18EZP
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I/O Equivalent Circuits
Pin No.
Pin Name
Input Output Equivalent Circuit Diagram
Pin Function
OUT1
VCC2
2
Output pin
OUT1
OUT1F
OUT1F
12
GND2
Output pin
VCC2
OUT2
VREG2
13
OUT2
Miller clamp pin
GND2
VCC2
PROOUT1
VREG2
4
PROOUT1
Soft turn off pin for short circuit
protection / Gate voltage input pin
GND2
VCC2
PROOUT2
PROOUT2
3
Fast turn off pin for short circuit
protection
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I/O Equivalence Circuits - Continued
Pin No.
Pin Name
Input Output Equivalent Circuit Diagram
Pin Function
VCC2
TCOMP
5
Temperature compensation pin of short
circuit detection voltage
VREG2
SCPIN
SCPIN
TCOMP
6
Short circuit detection pin
GND2
VCC2
SCPTH
VREG2
11
SCPTH
Short circuit detection threshold
setting pin
GND2
VCC2
VREG2
TO
9
TO
Constant current output pin / Sensor
voltage input pin
TC
TC
10
Constant current setting resistor
connection pin
GND2
VCC2
Internal
Power Supply
VREG2
VREG2
7
Output-side internal power supply pin
GND2
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I/O Equivalence Circuits - Continued
Pin No.
Pin Name
Input Output Equivalent Circuit Diagram
Pin Function
FLT
FLT
OSFB
16
Fault output pin
OSFB
19
GND1
Output state feedback output pin
VREG1
GRSEL
GRSEL
17
Gate resistance switching pin
GND1
VREG1
T
INA
18
Control input pin
INA
INB
INB
i
21
GND1
Control input pin
VREG1
SENSOR
SENSOR
20
Temperature information output pin
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I/O Equivalence Circuits - Continued
Pin No.
Pin Name
Input Output Equivalent Circuit Diagram
Pin Function
VREG1
FB
22
FB
Error amplifier inverting input pin for
switching controller
GND1
VREG1
COMP
COMP
23
Error amplifier output pin for switching
controller
GND1
VREG1
V_BATT
Internal
Power Supply
25
Input-side internal power supply pin
VREG1
FET_G
FET_G
26
GND1
MOS FET for transformer drive control
pin for switching controller
VREG1
SENSE
27
SENSE
Current feedback resistor connection
pin for switching controller
GND1
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground
at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using
electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause
variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the
electrical characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power
supply should always be turned off completely before connecting or removing it from the test setup during the
inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar
precautions during transport and storage.
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Operational Notes – continued
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result
in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output
pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid
environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The
small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor
and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected
to the power supply or ground line.
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Figure 107. Example of IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Ordering Information
B
M
6
0
0
Part Number
6
0
F
V
Package
FV: SSOP-B28W
-
CE2
Product class
C: for Automotive applications
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
SSOP-B28W (TOP VIEW)
Part Number Marking
BM60060
LOT Number
Pin1 Mark
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Physical Dimension and Packing Information
Package Name
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SSOP-B28W
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Revision History
Date
Revision
13.Mar.2019
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
