Datasheet
1200V High Voltage
High and Low Side Driver
BM60212FV-C
General Description
Key Specifications
The BM60212FV-C is high and low side drive IC which
operates up to 1200V with bootstrap operation, which
can drive N-channel power MOSFET and IGBT.
Under-voltage Lockout (UVLO) function and Miller
Clamp function are built-in.
High-Side Floating Supply Voltage:
Maximum Gate Drive Voltage:
Turn ON/OFF Time:
Logic Input Minimum Pulse Width:
1200V
24V
75ns (Max)
60ns
Features
AEC-Q100 Qualified(Note 1)
High-Side Floating Supply Voltage 1200V
Active Miller Clamping
Under Voltage Lockout Function
3.3V and 5.0V Input Logic Compatible
Package
W(Typ) x D(Typ) x H(Max)
6.50mm x 8.10mm x 2.01mm
SSOP-B20W
(Note 1) Grade 1
Applications
MOSFET Gate Driver
IGBT Gate Driver
Typical Application Circuit
SSOP-B20W
VCCB
GND1
UVLO
S
ENA
ENA
INA
INA
INB
INB
VREG
Pulse
Generator
Up to 1200V
NC
UVLO
GND2
Q
NC
R
VCCA
Regulator
OUTAH
Predriver
VCCB
OUTAL
CVREG
OUTBH
MCA
Predriver
OUTBL
NC
+
CVCCB
-
MCB
GND1
GND2
CVCCA
NC
Pin 1
+
2V
2V
-
TO
LOAD
Figure 1. Typical Application Circuit
〇Product structure : Semiconductor integrated circuit
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications........................................................................................................................................................................... 1
Package...................................... .................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Recommended Range of External Constants ................................................................................................................................. 3
Pin Configuration ............................................................................................................................................................................ 3
Pin Descriptions .............................................................................................................................................................................. 3
Description of Functions and Examples of Constant Setting .......................................................................................................... 5
Absolute Maximum Ratings (Ta=25°C) ........................................................................................................................................... 8
Thermal Resistance ........................................................................................................................................................................ 9
Recommended Operating Conditions ............................................................................................................................................. 9
Electrical Characteristics............................................................................................................................................................... 10
Typical Performance Curves ......................................................................................................................................................... 11
Figure 10. VCCB Circuit Current 1 vs Low-side Supply Voltage (OUTB=L) .............................................................................. 11
Figure 11. VCCB Circuit Current 2 vs Low-side Supply Voltage (OUTB=H) .............................................................................. 11
Figure 12. VCCB Circuit Current 3 vs Low-side Supply Voltage (INA=10kHz, Duty=50%) ...................................................... 11
Figure 13. VCCB Circuit Current 4 vs Low-side Supply Voltage (INA=20kHz, Duty=50%) ....................................................... 11
Figure 14. VCCA Circuit Current 1 vs High-side Floating Supply Voltage (OUTA=L) ................................................................ 12
Figure 15. VCCA Circuit Current 2 vs High-side Floating Supply Voltage (OUTA=H) ................................................................ 12
Figure 16. Logic H/L Level Input Voltage vs High-side Floating Supply Voltage........................................................................ 12
Figure 17. OUTA (OUTB)Output Voltage vs Logic Input Voltage (VCCB=15V, VCCA=15V, Ta=+25°C)......................................... 12
Figure 18. Logic Pull-down Resistance vs Temperature ............................................................................................................ 13
Figure 19. Logic Pull-down Current vs Temperature ................................................................................................................. 13
Figure 20. Logic Input Minimum Pulse Width vs Temperature .................................................................................................. 13
Figure 21. ENA Input Mask Time vs Temperature ..................................................................................................................... 13
Figure 22. OUTA ON Resistance (Source) vs Temperature ...................................................................................................... 14
Figure 23. OUTA ON Resistance (Sink) vs Temperature ........................................................................................................... 14
Figure 24. OUTB ON Resistance (Source) vs Temperature ...................................................................................................... 14
Figure 25. OUTB ON Resistance (Sink) vs Temperature .......................................................................................................... 14
Figure 26. OUTA Turn ON Time vs Temperature (INA=PWM, INB=L)....................................................................................... 15
Figure 27. OUTA Turn OFF Time vs Temperature (INA=PWM, INB=L) ..................................................................................... 15
Figure 28. OUTB Turn ON Time vs Temperature (INA=L, INB=PWM) ...................................................................................... 15
Figure 29. OUTB Turn OFF Time vs Temperature (INA=L, INB=PWM) .................................................................................... 15
Figure 30. MCA ON Resistance vs Temperature ....................................................................................................................... 16
Figure 31. MCB ON Resistance vs Temperature....................................................................................................................... 16
Figure 32. MCA ON Threshold Voltage vs Temperature ............................................................................................................ 16
Figure 33. MCB ON Threshold Voltage vs Temperature ........................................................................................................... 16
Figure 34. VCCB UVLO ON/OFF Voltage vs Temperature ....................................................................................................... 17
Figure 35. VCCB UVLO Mask Time vs Temperature................................................................................................................. 17
Figure 36. VCCA UVLO ON/OFF Voltage vs Temperature ........................................................................................................ 17
Figure 37. VCCA UVLO Mask Time vs Temperature ................................................................................................................. 17
I/O Equivalence Circuits................................................................................................................................................................ 18
Operational Notes ......................................................................................................................................................................... 19
Ordering Information ..................................................................................................................................................................... 21
Marking Diagram .......................................................................................................................................................................... 21
Physical Dimension, Tape and Reel Information .......................................................................................................................... 22
Revision History ............................................................................................................................................................................ 23
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Recommended Range of External Constants
Recommended Value
Pin Name
Symbol
Unit
Min
Typ
Max
VCCA
CVCCA
0.1
1.0
-
µF
VCCB
CVCCB
0.1
1.0
-
µF
VREG
CVREG
0.1
3.3
10.0
µF
Pin Configuration
(TOP VIEW)
NC
1
GND2
2
NC
3
MCA
4
OUTAL
5
OUTAH
6
VCCA
7
NC
8
GND2
9
20
8
19
8
18
8
17
8
16
8
15
8
14
8
13
8
12
8
11
NC 10
GND1
MCB
OUTBL
OUTBH
VCCB
VREG
INB
INA
ENA
GND1
Figure 2. Pin Configuration
Pin Descriptions
Pin No.
Pin Name
1
NC
2
GND2
Function
Non-connection
High-side ground pin
3
NC
4
MCA
5
OUTAL
High-side output pin (Sink)
6
OUTAH
High-side output pin (Source)
7
VCCA
8
NC
9
GND2
10
NC
Non-connection
High-side pin for Miller Clamp
High-side power supply pin
Non-connection
High-side ground pin
Non-connection
11
GND1
12
ENA
Low-side and input-side ground pin
Input enabling signal input pin
13
INA
Control input pin for high-side
14
INB
Control input pin for low-side
15
VREG
Power supply pin for input circuit
16
VCCB
Low-side and input-side power supply pin
17
OUTBH
Low-side output pin (Source)
18
OUTBL
Low-side output pin (Sink)
19
MCB
Low-side pin for Miller Clamp
20
GND1
Low-side and input-side ground pin
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Pin Descriptions - continued
1.
VCCA (High-side power supply pin)
The VCCA pin is a power supply pin on the high-side output. To reduce voltage fluctuations due to the OUTA pin output
current, connect a bypass capacitor between the VCCA and GND2 pins.
2.
GND2 (High-side ground pin)
The GND2 pin is a ground pin on the high-side. Connect the GND2 pin to the emitter/source of a high-side power
device.
3.
VCCB (Low-side and input-side power supply pin)
The VCCB pin is a power supply pin on the low-side output. To reduce voltage fluctuations due to the OUTB pin output
current, connect a bypass capacitor between the VCCB and GND2 pins.
4.
GND1 (Low-side and input-side ground pin)
The GND1 pin is a ground pin on the low-side and the input side.
5.
VREG (Power supply pin for input circuit)
The VREG pin is a power supply pin for the input circuit. To suppress voltage fluctuations due to the current to drive
internal transformers, connect a bypass capacitor between the VREG and GND1 pins.
6.
INA, INB, ENA (Control input pin)
The INA, INB and ENA pins are used to determine output logic.
ENA
INA
INB
OUTA
OUTB
L
X
X
L
L
H
L
L
L
L
H
L
H
L
H
H
H
L
H
L
H
H
H
L
L
X: Don't care
The High output of OUTA (OUTB) becomes effective in ENA=H and L to H edge input of INA (INB).
7.
OUTAH, OUTAL, OUTBH, OUTBL (Output pin)
The OUTAH pin and the OUTBH pin are source side pins used to drive the gate of a power device, and the OUTAL pin
and the OUTBL pin are sink side pins used to drive the gate of a power device.
8.
MCA, MCB (Pin for Miller Clamp)
The MCA pin and MCB pin are for preventing the increase in gate voltage due to the Miller current of the power device
connected to the OUT pin. If the Miller Clamp function is not used, short-circuit the MCA pin to the GND2 pin and the
MCB pin to the GND1 pin.
H
ENA
L
H
INA(INB)
L
H
OUTA(OUTB)
L
Figure 3. Input and Output Logic Timing Chart
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Description of Functions and Examples of Constant Setting
1.
Miller Clamp function
When INA (INB)=Low and MCA (MCB) pin voltage < VMCON (Typ 2.0V), the internal MOSFET of the MCA (MCB) pin is
turned ON. It is maintained until the input signal is switched to High.
INA (INB)
MCA (MCB)
Internal MOSFET of the MCA (MCB) pin
L
Less than VMCON
ON
H
X
OFF
X: Don't care
VCCA (VCCB)
LOGIC
PREDRIVER
OUTAH (OUTBH)
PREDRIVER
OUTAL (OUTBL)
GATE
MCA (MCB)
PREDRIVER
+
-
VMCON
GND2 (GND1)
Figure 4. Block Diagram of Miller Clamp Function
tPOFF
tPON
H
INA(INB)
L
H
OUTA(OUTB)
L
H
GATE
VMCON
L
Hi-Z
MCA(MCB)
L
Figure 5. Timing Chart of Miller Clamp Function
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Description of Functions and Examples of Constant Setting - continued
2.
Under-voltage Lockout (UVLO) function
The BM60212FV-C incorporates the Under-voltage Lockout (UVLO) function both the high and low voltage sides.
When the power supply voltage drops to VUVLOL (Typ 8.5V), the OUT pin will output the “L” signal. When the power
supply voltage rises to VUVLOH (Typ 9.5V), the OUT pin will return to a normal state. In addition, to prevent malfunctions
due to noises, a mask time of tUVLOMSK (Typ 2.5µs) is set on both the high and the low voltage sides.
H
INA
L
VCCA
VUVLOH
VUVLOL
OUTA
H
Hi-Z
L
Figure 6. High-side UVLO Function Operation Timing Chart
H
INA (INB)
L
VUVLOH
VUVLOL
VCCB
H
Hi-Z
L
OUTA (OUTB)
Figure 7. Low-side UVLO Function Operation Timing Chart
3.
I/O condition table
Input
No
Output
Status
VCCB
VCCA
ENA
INB
INA
OUTB
MCB
OUTA
MCA
UVLO
X
X
X
X
L
L
L
L
○
UVLO
L
X
X
L
L
L
L
○
UVLO
H
L
X
L
L
L
L
4
○
UVLO
H
H
L
H
Hi-Z
L
L
5
○
UVLO
H
H
H
L
L
L
L
○
○
L
X
X
L
L
L
L
○
○
H
L
L
L
L
L
L
○
○
H
L
H
L
L
H
Hi-Z
○
○
H
H
L
H
Hi-Z
L
L
○
○
H
H
H
L
L
L
L
1
VCCB UVLO
2
3
VCCA UVLO
6
Disable
7
8
9
Normal
Operation
10
○ : VCCA or VCCB > UVLO, X : Don't care
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Description of Functions and Examples of Constant Setting - continued
4.
Power supply startup/shutdown sequence
H
INA
L
H
INB
L
VCCA
VCCB
VUVLOL
VUVLOH
VUVLOH
VUVLOL
VUVLOH
VUVLOL
VUVLOH
VUVLOL
H
Hi-Z
L
OUTA
MCA
Hi-Z
L
H
Hi-Z
L
OUTB
MCB
Hi-Z
L
H
INA
L
H
INB
L
VCCA
VCCB
VUVLOL
VUVLOH
VUVLOH
VUVLOL
VUVLOH
VUVLOL
VUVLOH
VUVLOL
H
Hi-Z
L
OUTA
MCA
Hi-Z
L
H
Hi-Z
L
OUTB
MCB
Hi-Z
L
: Since the VCCA to GND2 pin voltage is low and the output MOS does not turn ON,
the output pins become Hi-Z.
: Since the VCCB to GND1 pin voltage is low and the output MOS does not turn ON,
the output pins become Hi-Z.
Figure 8. Power Supply Startup/Shutdown Sequence
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Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Limits
Unit
VCCA
-0.3 to +1230(Note 2)
V
High-side Floating Supply Offset Voltage
GND2
VCCA-30 to VCCA+0.3
V
High-side Floating Output Voltage OUTA
VOUTA
GND2-0.3 to VCCA+0.3
V
High-side Miller Clamp Pin Voltage MCA
VMCA
GND2-0.3 to VCCA+0.3
V
Low-side Supply Voltage
VCCB
-0.3 to +30.0(Note 2)
V
Low-side Output Voltage OUTB
VOUTB
-0.3 to +VCCB+0.3 or +30.0(Note 2)
V
Low-side Miller Clamp Pin Voltage MCB
VMCB
-0.3 to +VCCB+0.3 or +30.0(Note 2)
V
Logic Input Voltage (INA, INB, ENA)
VIN
-0.3 to +VCCB+0.3 or +30.0(Note 2)
V
OUTA Pin Output Current (Peak 1µs)
IOUTAPEAK
5.0(Note 3)
A
OUTB Pin Output Current (Peak 1µs)
IOUTBPEAK
5.0(Note 3)
A
MCA Pin Output Current (Peak 1µs)
IMCAPEAK
5.0(Note 3)
A
MCB Pin Output Current (Peak 1µs)
IMCBPEAK
5.0(Note 3)
A
Tstg
-55 to +150
°C
Tjmax
150
°C
High-side Floating Supply Voltage
Storage Temperature Range
Maximum Junction Temperature
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 2) Relative to GND1.
(Note 3) Should not exceed Tj=150°C.
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BM60212FV-C
Thermal Resistance(Note 4)
Parameter
Thermal Resistance (Typ)
Symbol
Unit
1s(Note 6)
2s2p(Note 7)
θJA
151.5
80.6
°C/W
ΨJT
47
40
°C/W
SSOP-B20W
Junction to Ambient
Junction to Top Characterization Parameter
(Note5)
(Note 4) Based on JESD51-2A(Still-Air)
(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 6) Using a PCB board based on JESD51-3.
(Note 7) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70µm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70µm
74.2mm x 74.2mm
35µm
74.2mm x 74.2mm
70µm
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Units
VCCA
GND2+10
GND2+15
GND2+24
V
High-side Floating Supply Offset Voltage
GND2
-
1200
V
High-side Floating Output Voltage OUTA
VOUTA
GND2
-
VCCA
V
VOUTB
GND1
-
VCCB
V
VIN
GND1
-
VCCB
V
Low-side Supply Voltage
VCCB
10
15
24
V
Operating Temperature Range
Topr
-40
+25
+125
°C
High-side Floating Supply Voltage
Low-side Output Voltage OUTB
Logic Input Voltage (INA, INB, ENA)
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Electrical Characteristics
(Unless otherwise specified Ta=-40°C to +125°C, VCCA-GND2=10V to 24V, VCCB=10V to 24V)
Limit
Parameter
Symbol
Unit
Min
Typ
Max
Conditions
General
VCCB Circuit Current 1
ICC11
0.54
0.85
1.35
mA
OUTB=L
VCCB Circuit Current 2
ICC12
0.49
0.80
1.30
mA
OUTB=H
VCCB Circuit Current 3
ICC12
1.28
1.89
3.30
mA
INA=10kHz, Duty=50%
VCCB Circuit Current 4
ICC13
1.29
1.92
3.40
mA
INA=20kHz, Duty=50%
VCCA Circuit Current 1
ICC21
0.49
0.73
1.15
mA
OUTA=L
VCCA Circuit Current 2
Logic Block
ICC22
0.38
0.57
0.95
mA
OUTA=H
Logic High Level Input Voltage
VINH
2.0
-
VCCB
V
INA, INB, ENA
Logic Low Level Input Voltage
VINL
0
-
0.8
V
INA, INB, ENA
Logic Pull-down Resistance
RIND
25
50
100
kΩ
INA Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Figure 38. Example of IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others. Operation (ASO).
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
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BM60212FV-C
Ordering Information
B
M
6
0
2
1
2
F
V
-
Package
FV: SSOP-B20W
Part Number
CE 2
Rank
C:for Automotive applications
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SSOP-B20W(TOP VIEW)
Part Number Marking
BM60212
LOT Number
Pin 1 Mark
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Physical Dimension, Tape and Reel Information
Package Name
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BM60212FV-C
Revision History
Date
Revision
18.Jan.2018
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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