BM60212FV-CE2

Datasheet 1200V High Voltage High and Low Side Driver BM60212FV-C General Description Key Specifications     The BM60212FV-C is high and low side drive IC which operates up to 1200V with bootstrap operation, which can drive N-channel power MOSFET and IGBT. Under-voltage Lockout (UVLO) function and Miller Clamp function are built-in. High-Side Floating Supply Voltage: Maximum Gate Drive Voltage: Turn ON/OFF Time: Logic Input Minimum Pulse Width: 1200V 24V 75ns (Max) 60ns Features      AEC-Q100 Qualified(Note 1) High-Side Floating Supply Voltage 1200V Active Miller Clamping Under Voltage Lockout Function 3.3V and 5.0V Input Logic Compatible Package W(Typ) x D(Typ) x H(Max) 6.50mm x 8.10mm x 2.01mm SSOP-B20W (Note 1) Grade 1 Applications  MOSFET Gate Driver  IGBT Gate Driver Typical Application Circuit SSOP-B20W VCCB GND1 UVLO S ENA ENA INA INA INB INB VREG Pulse Generator Up to 1200V NC UVLO GND2 Q NC R VCCA Regulator OUTAH Predriver VCCB OUTAL CVREG OUTBH MCA Predriver OUTBL NC + CVCCB - MCB GND1 GND2 CVCCA NC Pin 1 + 2V 2V - TO LOAD Figure 1. Typical Application Circuit 〇Product structure : Semiconductor integrated circuit www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/23 TSZ02201-0818ABH00270-1-2 18.Jan.2018 Rev.001 BM60212FV-C Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Key Specifications........................................................................................................................................................................... 1 Package...................................... .................................................................................................................................................... 1 Typical Application Circuit ............................................................................................................................................................... 1 Recommended Range of External Constants ................................................................................................................................. 3 Pin Configuration ............................................................................................................................................................................ 3 Pin Descriptions .............................................................................................................................................................................. 3 Description of Functions and Examples of Constant Setting .......................................................................................................... 5 Absolute Maximum Ratings (Ta=25°C) ........................................................................................................................................... 8 Thermal Resistance ........................................................................................................................................................................ 9 Recommended Operating Conditions ............................................................................................................................................. 9 Electrical Characteristics............................................................................................................................................................... 10 Typical Performance Curves ......................................................................................................................................................... 11 Figure 10. VCCB Circuit Current 1 vs Low-side Supply Voltage (OUTB=L) .............................................................................. 11 Figure 11. VCCB Circuit Current 2 vs Low-side Supply Voltage (OUTB=H) .............................................................................. 11 Figure 12. VCCB Circuit Current 3 vs Low-side Supply Voltage (INA=10kHz, Duty=50%) ...................................................... 11 Figure 13. VCCB Circuit Current 4 vs Low-side Supply Voltage (INA=20kHz, Duty=50%) ....................................................... 11 Figure 14. VCCA Circuit Current 1 vs High-side Floating Supply Voltage (OUTA=L) ................................................................ 12 Figure 15. VCCA Circuit Current 2 vs High-side Floating Supply Voltage (OUTA=H) ................................................................ 12 Figure 16. Logic H/L Level Input Voltage vs High-side Floating Supply Voltage........................................................................ 12 Figure 17. OUTA (OUTB)Output Voltage vs Logic Input Voltage (VCCB=15V, VCCA=15V, Ta=+25°C)......................................... 12 Figure 18. Logic Pull-down Resistance vs Temperature ............................................................................................................ 13 Figure 19. Logic Pull-down Current vs Temperature ................................................................................................................. 13 Figure 20. Logic Input Minimum Pulse Width vs Temperature .................................................................................................. 13 Figure 21. ENA Input Mask Time vs Temperature ..................................................................................................................... 13 Figure 22. OUTA ON Resistance (Source) vs Temperature ...................................................................................................... 14 Figure 23. OUTA ON Resistance (Sink) vs Temperature ........................................................................................................... 14 Figure 24. OUTB ON Resistance (Source) vs Temperature ...................................................................................................... 14 Figure 25. OUTB ON Resistance (Sink) vs Temperature .......................................................................................................... 14 Figure 26. OUTA Turn ON Time vs Temperature (INA=PWM, INB=L)....................................................................................... 15 Figure 27. OUTA Turn OFF Time vs Temperature (INA=PWM, INB=L) ..................................................................................... 15 Figure 28. OUTB Turn ON Time vs Temperature (INA=L, INB=PWM) ...................................................................................... 15 Figure 29. OUTB Turn OFF Time vs Temperature (INA=L, INB=PWM) .................................................................................... 15 Figure 30. MCA ON Resistance vs Temperature ....................................................................................................................... 16 Figure 31. MCB ON Resistance vs Temperature....................................................................................................................... 16 Figure 32. MCA ON Threshold Voltage vs Temperature ............................................................................................................ 16 Figure 33. MCB ON Threshold Voltage vs Temperature ........................................................................................................... 16 Figure 34. VCCB UVLO ON/OFF Voltage vs Temperature ....................................................................................................... 17 Figure 35. VCCB UVLO Mask Time vs Temperature................................................................................................................. 17 Figure 36. VCCA UVLO ON/OFF Voltage vs Temperature ........................................................................................................ 17 Figure 37. VCCA UVLO Mask Time vs Temperature ................................................................................................................. 17 I/O Equivalence Circuits................................................................................................................................................................ 18 Operational Notes ......................................................................................................................................................................... 19 Ordering Information ..................................................................................................................................................................... 21 Marking Diagram .......................................................................................................................................................................... 21 Physical Dimension, Tape and Reel Information .......................................................................................................................... 22 Revision History ............................................................................................................................................................................ 23 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/23 TSZ02201-0818ABH00270-1-2 18.Jan.2018 Rev.001 BM60212FV-C Recommended Range of External Constants Recommended Value Pin Name Symbol Unit Min Typ Max VCCA CVCCA 0.1 1.0 - µF VCCB CVCCB 0.1 1.0 - µF VREG CVREG 0.1 3.3 10.0 µF Pin Configuration (TOP VIEW) NC 1 GND2 2 NC 3 MCA 4 OUTAL 5 OUTAH 6 VCCA 7 NC 8 GND2 9 20 8 19 8 18 8 17 8 16 8 15 8 14 8 13 8 12 8 11 NC 10 GND1 MCB OUTBL OUTBH VCCB VREG INB INA ENA GND1 Figure 2. Pin Configuration Pin Descriptions Pin No. Pin Name 1 NC 2 GND2 Function Non-connection High-side ground pin 3 NC 4 MCA 5 OUTAL High-side output pin (Sink) 6 OUTAH High-side output pin (Source) 7 VCCA 8 NC 9 GND2 10 NC Non-connection High-side pin for Miller Clamp High-side power supply pin Non-connection High-side ground pin Non-connection 11 GND1 12 ENA Low-side and input-side ground pin Input enabling signal input pin 13 INA Control input pin for high-side 14 INB Control input pin for low-side 15 VREG Power supply pin for input circuit 16 VCCB Low-side and input-side power supply pin 17 OUTBH Low-side output pin (Source) 18 OUTBL Low-side output pin (Sink) 19 MCB Low-side pin for Miller Clamp 20 GND1 Low-side and input-side ground pin www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/23 TSZ02201-0818ABH00270-1-2 18.Jan.2018 Rev.001 BM60212FV-C Pin Descriptions - continued 1. VCCA (High-side power supply pin) The VCCA pin is a power supply pin on the high-side output. To reduce voltage fluctuations due to the OUTA pin output current, connect a bypass capacitor between the VCCA and GND2 pins. 2. GND2 (High-side ground pin) The GND2 pin is a ground pin on the high-side. Connect the GND2 pin to the emitter/source of a high-side power device. 3. VCCB (Low-side and input-side power supply pin) The VCCB pin is a power supply pin on the low-side output. To reduce voltage fluctuations due to the OUTB pin output current, connect a bypass capacitor between the VCCB and GND2 pins. 4. GND1 (Low-side and input-side ground pin) The GND1 pin is a ground pin on the low-side and the input side. 5. VREG (Power supply pin for input circuit) The VREG pin is a power supply pin for the input circuit. To suppress voltage fluctuations due to the current to drive internal transformers, connect a bypass capacitor between the VREG and GND1 pins. 6. INA, INB, ENA (Control input pin) The INA, INB and ENA pins are used to determine output logic. ENA INA INB OUTA OUTB L X X L L H L L L L H L H L H H H L H L H H H L L X: Don't care The High output of OUTA (OUTB) becomes effective in ENA=H and L to H edge input of INA (INB). 7. OUTAH, OUTAL, OUTBH, OUTBL (Output pin) The OUTAH pin and the OUTBH pin are source side pins used to drive the gate of a power device, and the OUTAL pin and the OUTBL pin are sink side pins used to drive the gate of a power device. 8. MCA, MCB (Pin for Miller Clamp) The MCA pin and MCB pin are for preventing the increase in gate voltage due to the Miller current of the power device connected to the OUT pin. If the Miller Clamp function is not used, short-circuit the MCA pin to the GND2 pin and the MCB pin to the GND1 pin. H ENA L H INA(INB) L H OUTA(OUTB) L Figure 3. Input and Output Logic Timing Chart www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/23 TSZ02201-0818ABH00270-1-2 18.Jan.2018 Rev.001 BM60212FV-C Description of Functions and Examples of Constant Setting 1. Miller Clamp function When INA (INB)=Low and MCA (MCB) pin voltage < VMCON (Typ 2.0V), the internal MOSFET of the MCA (MCB) pin is turned ON. It is maintained until the input signal is switched to High. INA (INB) MCA (MCB) Internal MOSFET of the MCA (MCB) pin L Less than VMCON ON H X OFF X: Don't care VCCA (VCCB) LOGIC PREDRIVER OUTAH (OUTBH) PREDRIVER OUTAL (OUTBL) GATE MCA (MCB) PREDRIVER + - VMCON GND2 (GND1) Figure 4. Block Diagram of Miller Clamp Function tPOFF tPON H INA(INB) L H OUTA(OUTB) L H GATE VMCON L Hi-Z MCA(MCB) L Figure 5. Timing Chart of Miller Clamp Function www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/23 TSZ02201-0818ABH00270-1-2 18.Jan.2018 Rev.001 BM60212FV-C Description of Functions and Examples of Constant Setting - continued 2. Under-voltage Lockout (UVLO) function The BM60212FV-C incorporates the Under-voltage Lockout (UVLO) function both the high and low voltage sides. When the power supply voltage drops to VUVLOL (Typ 8.5V), the OUT pin will output the “L” signal. When the power supply voltage rises to VUVLOH (Typ 9.5V), the OUT pin will return to a normal state. In addition, to prevent malfunctions due to noises, a mask time of tUVLOMSK (Typ 2.5µs) is set on both the high and the low voltage sides. H INA L VCCA VUVLOH VUVLOL OUTA H Hi-Z L Figure 6. High-side UVLO Function Operation Timing Chart H INA (INB) L VUVLOH VUVLOL VCCB H Hi-Z L OUTA (OUTB) Figure 7. Low-side UVLO Function Operation Timing Chart 3. I/O condition table Input No Output Status VCCB VCCA ENA INB INA OUTB MCB OUTA MCA UVLO X X X X L L L L ○ UVLO L X X L L L L ○ UVLO H L X L L L L 4 ○ UVLO H H L H Hi-Z L L 5 ○ UVLO H H H L L L L ○ ○ L X X L L L L ○ ○ H L L L L L L ○ ○ H L H L L H Hi-Z ○ ○ H H L H Hi-Z L L ○ ○ H H H L L L L 1 VCCB UVLO 2 3 VCCA UVLO 6 Disable 7 8 9 Normal Operation 10 ○ : VCCA or VCCB > UVLO, X : Don't care www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/23 TSZ02201-0818ABH00270-1-2 18.Jan.2018 Rev.001 BM60212FV-C Description of Functions and Examples of Constant Setting - continued 4. Power supply startup/shutdown sequence H INA L H INB L VCCA VCCB VUVLOL VUVLOH VUVLOH VUVLOL VUVLOH VUVLOL VUVLOH VUVLOL H Hi-Z L OUTA MCA Hi-Z L H Hi-Z L OUTB MCB Hi-Z L H INA L H INB L VCCA VCCB VUVLOL VUVLOH VUVLOH VUVLOL VUVLOH VUVLOL VUVLOH VUVLOL H Hi-Z L OUTA MCA Hi-Z L H Hi-Z L OUTB MCB Hi-Z L : Since the VCCA to GND2 pin voltage is low and the output MOS does not turn ON, the output pins become Hi-Z. : Since the VCCB to GND1 pin voltage is low and the output MOS does not turn ON, the output pins become Hi-Z. Figure 8. Power Supply Startup/Shutdown Sequence www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/23 TSZ02201-0818ABH00270-1-2 18.Jan.2018 Rev.001 BM60212FV-C Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit VCCA -0.3 to +1230(Note 2) V High-side Floating Supply Offset Voltage GND2 VCCA-30 to VCCA+0.3 V High-side Floating Output Voltage OUTA VOUTA GND2-0.3 to VCCA+0.3 V High-side Miller Clamp Pin Voltage MCA VMCA GND2-0.3 to VCCA+0.3 V Low-side Supply Voltage VCCB -0.3 to +30.0(Note 2) V Low-side Output Voltage OUTB VOUTB -0.3 to +VCCB+0.3 or +30.0(Note 2) V Low-side Miller Clamp Pin Voltage MCB VMCB -0.3 to +VCCB+0.3 or +30.0(Note 2) V Logic Input Voltage (INA, INB, ENA) VIN -0.3 to +VCCB+0.3 or +30.0(Note 2) V OUTA Pin Output Current (Peak 1µs) IOUTAPEAK 5.0(Note 3) A OUTB Pin Output Current (Peak 1µs) IOUTBPEAK 5.0(Note 3) A MCA Pin Output Current (Peak 1µs) IMCAPEAK 5.0(Note 3) A MCB Pin Output Current (Peak 1µs) IMCBPEAK 5.0(Note 3) A Tstg -55 to +150 °C Tjmax 150 °C High-side Floating Supply Voltage Storage Temperature Range Maximum Junction Temperature Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 2) Relative to GND1. (Note 3) Should not exceed Tj=150°C. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/23 TSZ02201-0818ABH00270-1-2 18.Jan.2018 Rev.001 BM60212FV-C Thermal Resistance(Note 4) Parameter Thermal Resistance (Typ) Symbol Unit 1s(Note 6) 2s2p(Note 7) θJA 151.5 80.6 °C/W ΨJT 47 40 °C/W SSOP-B20W Junction to Ambient Junction to Top Characterization Parameter (Note5) (Note 4) Based on JESD51-2A(Still-Air) (Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 6) Using a PCB board based on JESD51-3. (Note 7) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70µm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70µm 74.2mm x 74.2mm 35µm 74.2mm x 74.2mm 70µm Recommended Operating Conditions Parameter Symbol Min Typ Max Units VCCA GND2+10 GND2+15 GND2+24 V High-side Floating Supply Offset Voltage GND2 - 1200 V High-side Floating Output Voltage OUTA VOUTA GND2 - VCCA V VOUTB GND1 - VCCB V VIN GND1 - VCCB V Low-side Supply Voltage VCCB 10 15 24 V Operating Temperature Range Topr -40 +25 +125 °C High-side Floating Supply Voltage Low-side Output Voltage OUTB Logic Input Voltage (INA, INB, ENA) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/23 TSZ02201-0818ABH00270-1-2 18.Jan.2018 Rev.001 BM60212FV-C Electrical Characteristics (Unless otherwise specified Ta=-40°C to +125°C, VCCA-GND2=10V to 24V, VCCB=10V to 24V) Limit Parameter Symbol Unit Min Typ Max Conditions General VCCB Circuit Current 1 ICC11 0.54 0.85 1.35 mA OUTB=L VCCB Circuit Current 2 ICC12 0.49 0.80 1.30 mA OUTB=H VCCB Circuit Current 3 ICC12 1.28 1.89 3.30 mA INA=10kHz, Duty=50% VCCB Circuit Current 4 ICC13 1.29 1.92 3.40 mA INA=20kHz, Duty=50% VCCA Circuit Current 1 ICC21 0.49 0.73 1.15 mA OUTA=L VCCA Circuit Current 2 Logic Block ICC22 0.38 0.57 0.95 mA OUTA=H Logic High Level Input Voltage VINH 2.0 - VCCB V INA, INB, ENA Logic Low Level Input Voltage VINL 0 - 0.8 V INA, INB, ENA Logic Pull-down Resistance RIND 25 50 100 kΩ INA Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Figure 38. Example of IC structure 12. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. Operation (ASO). 13. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/23 TSZ02201-0818ABH00270-1-2 18.Jan.2018 Rev.001 BM60212FV-C Ordering Information B M 6 0 2 1 2 F V - Package FV: SSOP-B20W Part Number CE 2 Rank C:for Automotive applications Packaging and forming specification E2: Embossed tape and reel Marking Diagram SSOP-B20W(TOP VIEW) Part Number Marking BM60212 LOT Number Pin 1 Mark www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/23 TSZ02201-0818ABH00270-1-2 18.Jan.2018 Rev.001 BM60212FV-C Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SSOP-B20W 22/23 TSZ02201-0818ABH00270-1-2 18.Jan.2018 Rev.001 BM60212FV-C Revision History Date Revision 18.Jan.2018 001 Changes New Release www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/23 TSZ02201-0818ABH00270-1-2 18.Jan.2018 Rev.001 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001