Datasheet
Gate Driver Providing Galvanic Isolation Series
Isolation Voltage 3750 Vrms
1ch Gate Driver Providing Galvanic Isolation
BM6112FV-C
General Description
Key Specifications
BM6112FV-C is a gate driver with isolation voltage of
3750 Vrms, I/O delay time of 150 ns, and incorporates
fault signal output function, ready signal output function,
under voltage lockout (UVLO) function, short circuit
protection (SCP) function, active miller clamping function,
output state feedback function and temperature monitor
function.
Isolation Voltage
Maximum Gate Drive Voltage:
I/O Delay Time:
Minimum Input Pulse Width:
Package
SSOP-B28W
3750 Vrms
20 V
150 ns (Max)
90 ns
W (Typ) x D (Typ) x H (Max)
9.2 mm x 10.4 mm x 2.4 mm
Features
AEC-Q100 Qualified (Note 1)
Fault Signal Output Function
Ready Signal Output Function
Under Voltage Lockout Function
Short Circuit Protection Function
Active Miller Clamping Function
Output State Feedback Function
Temperature Monitor Function
UL1577 (pending)
(Note 1) Grade1
Applications
Automotive Inverter
Automotive DC-DC Converter
Industrial Inverter System
UPS System
Typical Application Circuit
1pin
〇Product structure : Silicon integrated circuit
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Contents
General Description .............................................................................................................................................................. 1
Features ................................................................................................................................................................................ 1
Applications .......................................................................................................................................................................... 1
Key Specifications ................................................................................................................................................................ 1
Package................................................................................................................................................................................. 1
Typical Application Circuit .................................................................................................................................................... 1
Contents................................................................................................................................................................................ 2
Recommended Range of External Constants ...................................................................................................................... 3
Pin Configuration .................................................................................................................................................................. 3
Pin Description ..................................................................................................................................................................... 3
Block Diagram....................................................................................................................................................................... 4
Absolute Maximum Ratings.................................................................................................................................................. 4
Thermal Resistance .............................................................................................................................................................. 5
Recommended Operating Conditions .................................................................................................................................. 5
Insulation Related Characteristics........................................................................................................................................ 5
Electrical Characteristics...................................................................................................................................................... 6
Typical Performance Curves................................................................................................................................................. 8
Application Information ...................................................................................................................................................... 22
I/O Equivalence Circuit ....................................................................................................................................................... 28
Operational Notes ............................................................................................................................................................... 31
Ordering Information .......................................................................................................................................................... 33
Marking Diagram ................................................................................................................................................................. 33
Physical Dimension and Packing Information.................................................................................................................... 34
Revision History.................................................................................................................................................................. 35
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Recommended Range of External Constants
Pin Name
Symbol
TC
RTC
Recommended Value
Min
Typ
Max
1.25
-
50
Pin Configuration
(TOP VIEW)
Unit
VEE2
1
28
GND1
kΩ
PROOUT2
2
27
NC
3
26
NC
VCC1
CVCC1
0.1
0.22
-
µF
PROOUT1
VCC2
CVCC2
0.2
-
-
µF
OUT2
4
25
VCC1
VREG
CVREG
0.01
0.1
0.47
µF
VREG
5
24
NC
TC
6
23
NC
TO
7
22
NC
GND2
8
21
SENSOR
SCPIN2
9
20
RDY
SCPIN1
10
19
INB
VCC2
11
18
INA
OUT1H
12
17
ENA
OUT1L
13
16
FLT
14
15
GND1
VEE2
Pin Description
Pin No.
Pin Name
1
VEE2
Function
2
PROOUT2
Soft turn-off pin 2
3
PROOUT1
Soft turn-off pin 1 / Gate voltage input pin
4
OUT2
Gate control pin for active miller clamping
5
VREG
Power supply pin for driving MOSFET for active miller clamping
6
TC
Resistor connection pin for setting constant current source output
7
TO
Constant current output pin / Sensor voltage input pin
Output-side negative power supply pin
8
GND2
9
SCPIN2
Output-side ground pin
Short circuit current detection pin 2
10
SCPIN1
Short circuit current detection pin 1
11
VCC2
12
OUT1H
Source-side output pin
13
OUT1L
Sink-side output pin
14
VEE2
Output-side negative power supply pin
15
GND1
Input-side ground pin
Output-side positive power supply pin
16
FLT
Fault output pin
17
ENA
Input pin for enabling control input signal
18
INA
Control input pin
19
INB
Control input pin
20
RDY
Ready output pin
21
SENSOR
22
NC
Non connection
23
NC
Non connection
24
NC
Non connection
25
VCC1
26
NC
Non connection
27
NC
Non connection
28
GND1
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Temperature information output pin
Input-side power supply pin
Input-side ground pin
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Block Diagram
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
(Note 2)
Input-side Supply Voltage
VCC1MAX
-0.3 to +7.0
V
Output-side Positive Supply Voltage
VCC2MAX
-0.3 to +24.0(Note 3)
V
Output-side Negative Supply Voltage
VEE2MAX
-15.0 to +0.3(Note 3)
V
Maximum Difference between Output-side Positive and
Negative Supply Voltages
VMAX2
30.0
V
INA, INB, ENA Pin Input Voltage
VINMAX
-0.3 to VCC1+0.3 or +7.0(Note 2)
FLT, RDY Pin Input Voltage
VFLTMAX,VRDYMAX
(Note 2)
-0.3 to +7.0
FLT, RDY Pin Output Current
IFLT,IRDY
10
SENSOR Pin Output Current
ISENSOR
10
SCPIN1, SCPIN2 Pin Input Voltage
VSCPINMAX
V
V
mA
mA
-0.3 to VCC2+0.3 or +24.0
(Note 3)
V
-0.3 to VCC2+0.3 or +24.0
(Note 3)
V
TO Pin Input Voltage
VTOMAX
TO Pin Output Current
ITOMAX
1
mA
Tstg
-55 to +150
°C
Tjmax
+150
°C
Storage Temperature Range
Maximum Junction Temperature
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 2) Relative to GND1
(Note 3) Relative to GND2
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Thermal Resistance (Note 4)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 6)
2s2p(Note 7)
θJA
112.9
64.4
°C/W
ΨJT
34
23
°C/W
SSOP-B28W
Junction to Ambient
Junction to Top Characterization Parameter
(Note 5)
(Note 4) Based on JESD51-2A(Still-Air)
(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 6) Using a PCB board based on JESD51-3.
(Note 7) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
Recommended Operating Conditions
Parameter
Symbol
Min
Max
Unit
VCC1(Note 8)
4.5
5.5
V
Output-side Positive Supply Voltage
VCC2
(Note 9)
14
20
V
Output-side Negative Supply Voltage
VEE2(Note 9)
-12
0
V
Maximum Difference between Output-side Positive and Negative
Supply Voltages
VMAX2
-
28
V
Operating Temperature
Topr
-40
+125
°C
Input-side Supply Voltage
(Note 8) Relative to GND1
(Note 9) Relative to GND2
Insulation Related Characteristics
Parameter
Symbol
Characteristic
Unit
Insulation Resistance (VIO = 500 V)
RS
>109
Ω
Insulation Withstand Voltage / 1 min
VISO
3750
Vrms
Insulation Test Voltage / 1 s
VISO
4500
Vrms
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Electrical Characteristics
(Unless otherwise specified, Ta = -40 °C to +125 °C, VCC1 = 4.5 V to 5.5 V, VCC2 = 14 V to 20 V, VEE2 = -12 V to 0 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Input-side Circuit Current 1
ICC11
1.9
3.9
7.8
mA
OUT1L = L
Input-side Circuit Current 2
ICC12
1.9
3.9
7.8
mA
OUT1H = H
Input-side Circuit Current 3
ICC13
2.1
4.3
8.6
mA
INA = 10 kHz, Duty = 50 %
Input-side Circuit Current 4
ICC14
2.3
4.6
9.2
mA
INA = 20 kHz, Duty = 50 %
Output-side Circuit Current
ICC2
1.26
2.80
4.60
mA
RTC = 4.7 kΩ
Logic High Level Input Voltage
VINH
2.0
-
VCC1
V
INA, INB, ENA
Logic Low Level Input Voltage
VINL
0
-
0.8
V
INA, INB, ENA
Logic Pull-down Resistance
RIND
25
50
100
kΩ
INA, ENA
Logic Pull-up Resistance
RINU
25
50
100
kΩ
INB
Logic Input Filtering Time
tINFIL
-
-
90
ns
INA, INB
ENA Input Filtering Time
tENAFIL
4
10
20
µs
OUT1H ON Resistance
ROUT1H
-
0.20
0.45
Ω
IOUT1H = -40 mA
OUT1L ON Resistance
ROUT1L
-
0.20
0.45
Ω
IOUT1L = 40 mA
OUT1H, OUT1L Maximum Current
IOUT1MAX
20
-
-
A
VCC2 = 15 V
Guaranteed by design
RPRO1
-
0.5
1.1
Ω
IPROOUT1 = 40 mA
IPRO1MAX
3
-
-
A
VCC2 = 15 V
Guaranteed by design
RPRO2
-
0.20
0.45
Ω
IPROOUT2 = 40 mA
Guaranteed by design
IPRO2MAX
5
-
-
A
VCC2 = 15 V
Guaranteed by design
Turn ON Time
tON
40
90
150
ns
Turn OFF Time
tOFF
40
90
150
ns
Propagation Distortion
tPDIST
-30
0
+30
ns
tOFF - tON
Rise Time
tRISE
-
30
50
ns
Load = 1 nF
Guaranteed by design
Fall Time
tFALL
-
30
50
ns
Load = 1 nF
Guaranteed by design
OUT2 ON Resistance (Source)
ROUT2H
-
2.0
4.5
Ω
IOUT2 = -10 mA
OUT2 ON Resistance (Sink)
ROUT2L
-
2.0
4.5
Ω
IOUT2 = 10mA
OUT2 Maximum Current
IOUT2MAX
0.4
-
-
A
Guaranteed by design
OUT2 ON Threshold Voltage
VOUT2ON
1.8
2.0
2.2
V
Relative to VEE2
OUT2 Output Delay Time
tDOUT2
-
135
195
ns
VREG Output Voltage
VREG
4.5
5.0
5.5
V
CM
100
-
-
kV/µs
General
Logic Block
Output
PROOUT1 ON Resistance
PROOUT1 Maximum Current
PROOUT2 ON Resistance
PROOUT2 Maximum Current
Common Mode Transient Immunity
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Relative to VEE2
Guaranteed by design
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BM6112FV-C
Electrical Characteristics - continued
(Unless otherwise specified, Ta = -40 °C to 125 °C, VCC1 = 4.5 V to 5.5 V, VCC2 = 14 V to 20 V, VEE2 = -12 V to 0 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
TC Pin Voltage
VTC
-
0.94
-
V
TO Pin Output Current
ITO
196
200
204
μA
RTC = 4.7 kΩ
Maximum Duty
DMAX
88.0
90.0
92.0
%
VTO = 3.84 V
Minimum Duty
DMIN
9.0
10.0
11.0
%
VTO = 1.35 V
SENSOR Output Frequency
fSENSOR
0.7
1.0
1.4
kHz
Duty Accuracy 1 (Actual - Typ)
DACC1
-2.0
0
+2.0
%
3.0 V ≤ VTO ≤ 3.84 V
Duty Accuracy 2 (Actual - Typ)
DACC2
-1.3
0
+1.3
%
2.5 V ≤ VTO < 3.0 V
Duty Accuracy 3 (Actual - Typ)
DACC3
-1.1
0
+1.1
%
2.0 V ≤ VTO < 2.5 V
Duty Accuracy 4 (Actual - Typ)
DACC4
-1.0
0
+1.0
%
1.35 ≤ VTO < 2.0 V
SENSOR ON Resistance
(Source-side)
RSENSORH
-
60
160
Ω
ISENSOR = -5 mA
SENSOR ON Resistance
(Sink-side)
RSENSORL
-
60
160
Ω
ISENSOR = 5 mA
Input-side UVLO OFF Voltage
VUVLO1H
4.05
4.25
4.45
V
Input-side UVLO ON Voltage
VUVLO1L
3.95
4.15
4.35
V
Input-side UVLO Filtering Time
tUVLO1FIL
2
10
30
µs
Output-side UVLO OFF Voltage
VUVLO2H
11.5
12.5
13.5
V
Output-side UVLO ON Voltage
VUVLO2L
10.5
11.5
12.5
V
Output-side UVLO Filtering
Time
tUVLO2FIL
2
10
30
µs
Output-side UVLO Delay Time
(OUT1H, OUT1L)
tDUVLO2OUT
2
10
30
µs
Output-side UVLO Delay Time
(RDY)
tDUVLO2RDY
3
-
65
µs
SCPIN Input Voltage
VSCPIN
-
0.10
0.22
V
ISCPIN1, ISCPIN2 = 1mA
SCPIN Leading Edge
Blanking Time
tSCPINLEB
0.10
0.20
0.30
µs
SCPIN1, SCPIN2
Guaranteed by Design
Short Circuit Detection Voltage
VSCDET
0.67
0.70
0.73
V
SCPIN1, SCPIN2
Short Circuit Detection
Filtering Time
tSCPFIL
0.15
0.30
0.45
µs
SCPIN1, SCPIN2
tDFLT
0.2
0.5
0.9
µs
PROOUT2 ON Time
tPRO2ON
100
160
220
ns
PROOUT1 H Detection Voltage
VOSFBH
-
5.0
-
V
PROOUT1 L Detection Voltage
VOSFBL
-
4.5
-
V
OSFB Output Filtering Time
tOSFBFIL
5.0
7.4
9.8
μs
RDY Output ON Resistance
RRDYL
-
30
80
Ω
IRDY = 5 mA
FLT Output ON Resistance
RFLTL
-
30
80
Ω
IFLT = 5 mA
Temperature Monitor
Protection Functions
FLT Delay Time
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Typical Performance Curves
8.0
8.0
7.5
7.5
7.0
7.0
Input-side Circuit Current 1: ICC11 [mA]
Input-side Circuit Current 1: ICC11 [mA]
(Reference data)
6.5
6.0
Ta = +125 °C
Ta = +25 °C
Ta = -40 °C
5.5
5.0
4.5
4.0
3.5
3.0
2.5
6.5
6.0
5.5
VCC1 = 5.5 V
5.0
VCC1 = 5.0 V
4.5
4.0
3.5
3.0
VCC1 = 4.5 V
2.5
2.0
2.0
1.5
1.5
4.50
4.75
5.00
5.25
Input-side Supply Voltage: VCC1 [V]
-50
5.50
Figure 1.
Input-side Circuit Current 1
vs Input-side Supply Voltage
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 2.
Input-side Circuit Current 1 vs Temperature
6.0
5.5
Input-side Circuit Current 2: ICC12 [mA]
6.0
Input-side Circuit Current 2: ICC12 [mA]
-25
Ta = +125 °C
Ta = +25 °C
Ta = -40 °C
5.0
4.5
4.0
3.5
3.0
2.5
5.5
5.0
4.5
VCC1 = 5.5 V
VCC1 = 5.0 V
4.0
3.5
VCC1 = 4.5 V
3.0
2.5
2.0
2.0
1.5
1.5
4.50
4.75
5.00
5.25
Input-side Supply Voltage: VCC1 [V]
5.50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 4.
Input-side Circuit Current 2 vs Temperature
Figure 3.
Input-side Circuit Current 2
vs Input-side Supply Voltage
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Typical Performance Curves - continued
(Reference data)
9.0
Input-side Circuit Current 3: ICC13 [mA]
Input-side Circuit Current 3: ICC13 [mA]
9.0
8.0
7.0
Ta = +125 °C
Ta = +25 °C
Ta = -40 °C
6.0
5.0
4.0
3.0
8.0
7.0
6.0
VCC1 = 5.5 V
VCC1 = 5.0 V
5.0
4.0
3.0
VCC1 = 4.5 V
2.0
2.0
4.50
4.75
5.00
5.25
Input-side Supply Voltage: VCC1 [V]
-50
5.50
Figure 5.
Input-side Circuit Current 3
vs Input-side Supply Voltage
9.0
9.0
Input-side Circuit Current 4: ICC14 [mA]
10.0
Input-side Circuit Current 4: ICC14 [mA]
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 6.
Input-side Circuit Current 3 vs Temperature
10.0
8.0
Ta = +125 °C
Ta = +25 °C
Ta = -40 °C
7.0
-25
6.0
5.0
4.0
3.0
2.0
8.0
7.0
VCC1 = 5.5 V
6.0
VCC1 = 5.0 V
5.0
4.0
VCC1 = 4.5 V
3.0
2.0
4.50
4.75
5.00
5.25
Input-side Supply Voltage: VCC1 [V]
5.50
Figure 7.
Input-side Circuit Current 4
vs Input-side Supply Voltage
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-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 8.
Input-side Circuit Current 4 vs Temperature
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Typical Performance Curves - continued
5.0
5.0
4.5
4.5
Output-side Circuit Current: ICC2 [mA]
Output-side Circuit Current: ICC2 [mA]
(Reference data)
4.0
Ta = +125 °C
Ta = +25 °C
3.5
3.0
2.5
2.0
Ta = -40 °C
1.5
4.0
VCC2 = 20 V
3.5
VCC2 = 15 V
3.0
2.5
VCC2 = 14 V
2.0
1.5
1.0
1.0
14
15
16
17
18
19
20
Output-side Positive Supply Voltage: VCC2 [V]
-50
Figure 9.
Output-side Circuit Current vs
Output-side Positive Supply Voltage
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 10.
Output-side Circuit Current vs Temperature
6.0
100.0
Logic Pull-down Resistance: RIND [kΩ]
RDY Voltage: VRDY [V]
Pull-up to 5 V
Ta = +125 °C
5.0
Ta = +25 °C
4.0
Ta = -40 °C
40+25 °C
3.0
2.0
1.0
87.5
Ta = +25 °C
75.0
Ta = -40 °C
VCC1 = 4.5 V
VCC1 = 5.0 V
VCC1 = 5.5 V
62.5
50.0
Ta = 125 °C
37.5
25.0
0.0
0.8
1.0
1.2
1.4
1.6
1.8
Logic Input Voltage: VIN [V]
2.0
Figure 11.
RDY Voltage vs Logic Input Voltage
(Logic High/Low Level Input Voltage)
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-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 12.
Logic Pull-down Resistance vs Temperature
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Typical Performance Curves - continued
(Reference data)
87.5
80
75.0
Logic Input Filtering Time: tINFIL [ns]
90
Logic Pull-up Resistance: RINU [kΩ]
100.0
VCC1 = 4.5 V
VCC1 = 5.0 V
VCC1 = 5.5 V
62.5
50.0
37.5
VCC1 = 4.5 V
VCC1 = 5.0 V
VCC1 = 5.5 V
70
60
50
40
30
25.0
20
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
-50
20
0.45
18
0.40
16
14
VCC1 = 5.5 V
VCC1 = 5.0 V
12
10
8
VCC1 = 4.5 V
6
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 14.
Logic Input Filtering Time vs Temperature
OUT1H ON Resistance: ROUT1H [Ω]
ENA Input Filtering Time: tENAFIL [μs]
Figure 13.
Logic Pull-up Resistance vs Temperature
-25
0.35
0.30
0.25
0.20
0.15
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
0.10
0.05
0.00
4
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 15.
ENA Input Filtering Time vs Temperature
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TSZ22111 • 15 • 001
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 16.
OUT1H ON Resistance vs Temperature
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Typical Performance Curves - continued
(Reference data)
1.1
0.45
1.0
PROOUT1 ON Resistance: RPRO1 [Ω]
OUT1L ON Resistance: ROUT1L [Ω]
0.40
0.35
0.30
0.25
0.20
0.15
0.10
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
0.05
0.9
0.8
0.7
0.6
0.5
0.4
0.3
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
0.2
0.1
0.00
0.0
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
-50
0.45
150
0.40
140
25
50
75
Temperature: Ta [°C]
100
125
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
130
0.35
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
0.30
0
Figure 18.
PROOUT1 ON Resistance vs Temperature
Turn ON Time: tON [ns]
PROOUT2 ON Resistance: RPRO2 [Ω]
Figure 17.
OUT1L ON Resistance vs Temperature
-25
0.25
0.20
0.15
0.10
120
110
100
90
80
70
60
0.05
50
40
0.00
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 19.
PROOUT2 ON Resistance vs Temperature
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TSZ22111 • 15 • 001
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 20.
Turn ON Time vs Temperature
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Typical Performance Curves - continued
(Reference data)
150
50
140
40
120
Rise Time: tRISE [ns]
Turn OFF Time: tOFF [ns]
130
110
100
90
80
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
70
60
VCC2 = 20 V
VCC2 = 15 V
VCC2 = 14 V
30
20
10
50
40
0
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
-50
-25
Figure 21. Turn OFF Time vs Temperature
100
125
Figure 22. Rise Time vs Temperature
4.5
OUT2 ON Resistance (Source): ROUT2H [Ω]
50
40
Fall Time: tFALL [ns]
0
25
50
75
Temperature: Ta [°C]
30
VCC2 = 20 V
VCC2 = 15 V
20
10
VCC2 = 14 V
4.0
3.5
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 23. Fall Time vs Temperature
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TSZ22111 • 15 • 001
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 24.
OUT2 ON Resistance (Source) vs Temperature
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Typical Performance Curves - continued
(Reference data)
2.20
4.0
OUT2 ON Threshold Voltage: VOUT2ON [V]
OUT2 ON Reisistance (Sink): ROUT2L [Ω]
4.5
3.5
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
3.0
2.5
2.0
1.5
1.0
0.5
2.15
2.10
2.05
2.00
1.95
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
1.90
1.85
1.80
0.0
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
-50
125
Figure 25.
OUT2 ON Resistance (Sink) vs Temperature
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 26.
OUT2 ON Threshold Voltage vs Temperature
5.1
200
5.0
160
VREG Output Voltage: VREG [V]
OUT2 Output Delay Time: tDOUT2 [ns]
180
140
120
100
VCC2 = 20 V
VCC2 = 15 V
VCC2 = 14 V
80
60
40
4.9
Ta = +125 °C
Ta = +25 °C
Ta = -40 °C
4.8
4.7
4.6
20
0
4.5
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 27.
OUT2 Output Delay Time vs Temperature
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TSZ22111 • 15 • 001
14
15
16
17
18
19
20
Output-side Positive Supply Voltage: VCC2 [V]
Figure 28.
VREG Output Voltage vs
Output-side Positive Supply Voltage
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Typical Performance Curves - continued
(Reference data)
1.00
204
203
VCC2 = 20 V
VCC2 = 15 V
VCC2 = 14 V
0.96
TO Pin Output Current: ITO [μA]
TC Pin Voltage: VTC [V]
0.98
0.94
0.92
VCC2 = 20 V
VCC2 = 14 V
VCC2 = 15 V
202
201
200
199
198
0.90
197
196
0.88
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
-50
125
Figure 29.
TC Pin Voltage vs Temperature
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 30.
TO Pin Output Current vs Temperature
92.0
11.0
10.8
91.5
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
91.0
10.6
Minimum Duty: DMIN [%]
Maximum Duty: DMAX [%]
-25
90.5
90.0
89.5
10.4
10.2
10.0
9.8
9.6
VCC2 = 20 V
VCC2 = 15 V
VCC2 = 14 V
89.0
9.4
88.5
9.2
88.0
9.0
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 31.
Maximum Duty vs Temperature
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TSZ22111 • 15 • 001
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 32.
Minimum Duty vs Temperature
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Typical Performance Curves - continued
(Reference data)
2.0
Duty Accuracy 1 (Actual - Typ): DACC1 [%]
SENSOR Output Frequency: fSENSOR [kHz]
1.4
1.3
1.2
1.1
1.0
0.9
VCC2 = 20 V
VCC2 = 15 V
VCC2 = 14 V
0.8
0.7
1.5
1.0
0.5
0.0
VCC2 = 20 V
VCC2 = 15 V
VCC2 = 14 V
-0.5
-1.0
-1.5
-2.0
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
-50
1.2
1.2
1.0
Duty Accuracy 3 (Actual - Typ): DACC3 [%]
Duty Accuracy 2 (Actual - Typ): DACC2 [%]
1.4
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
VCC2 = 20 V
VCC2 = 15 V
VCC2 = 14 V
-0.6
-0.8
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 34.
Duty Accuracy 1 (Actual - Typ) vs Temperature
Figure 33.
SENSOR Output Frequency vs Temperature
-0.4
-25
-1.0
-1.2
-1.4
0.8
0.6
0.4
0.2
0.0
-0.2
VCC2 = 20 V
VCC2 = 15 V
VCC2 = 14 V
-0.4
-0.6
-0.8
-1.0
-1.2
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 35.
Duty Accuracy 2 (Actual - Typ) vs Temperature
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-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 36.
Duty Accuracy 3 (Actual - Typ) vs Temperature
TSZ02201-0818ACH00110-1-2
18.Nov.2019 Rev.001
BM6112FV-C
Typical Performance Curves - continued
(Reference data)
160
SENSOR ON Resistance (Source): RSENSORH [Ω]
Duty Accuracy 4 (Actual - Typ): DACC4 [%]
1.0
0.8
0.6
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
140
100
80
60
40
20
0
-1.0
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
-50
125
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 38.
SENSOR ON Resistance (Source) vs Temperature
Figure 37.
Duty Accuracy 4 (Actual - Typ) vs Temperature
6.0
160
Pull-up to 5 V
140
RDY Voltage: VRDY [V]
SENSOR ON Resistance (Sink): RSENSORL [Ω]
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
120
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
120
100
80
5.0
4.0
3.0
Ta = +125 °C
Ta = +25 °C
Ta = -40 °C
60
2.0
40
1.0
20
0
0.0
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 39.
SENSOR ON Resistance (Sink) vs Temperature
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4.00 4.05 4.10 4.15 4.20 4.25 4.30 4.35 4.40
Input-side Supply Voltage: VCC1[V]
Figure 40.
RDY Voltage vs Input-side Supply Voltage
(Input-side UVLO ON/OFF Voltage)
TSZ02201-0818ACH00110-1-2
18.Nov.2019 Rev.001
BM6112FV-C
Typical Performance Curves - continued
(Reference data)
6.0
Pull-up to 5 V
RDY Voltage: VRDY [V]
Input-side UVLO Filtering Time: tUVLO1FIL [μs]
30
25
VCC2 = 20 V
VCC2 = 15 V
VCC2 = 14 V
20
15
5.0
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
4.0
3.0
10
2.0
5
1.0
0.0
0
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0
Output-side Positive Supply Voltage: VCC2 [V]
125
Figure 41.
Input-side UVLO Filtering Time vs Temperature
Figure 42.
RDY Voltage vs Output-side Positive Supply Voltage
(Output-side UVLO ON/OFF Voltage)
28
25
Output-side UVLO Delay Time
(OUT1H,OUT1L): tDUVLO2OUT [μs]
Output-side UVLO Filtering Time: tUVLO2FIL [μs]
30
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
20
15
10
5
24
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
20
16
12
8
4
0
0
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 43.
Output-side UVLO Filtering Time vs Temperature
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-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 44.
Output-side UVLO Delay Time (OUT1H, OUT1L)
vs Temperature
TSZ02201-0818ACH00110-1-2
18.Nov.2019 Rev.001
BM6112FV-C
Typical Performance Curves - continued
(Reference data)
70
0.22
SCPIN Input Voltage: VSCPIN [V]
Output-side UVLO Delay Time (RDY):
tDUVLO2RDY [μs]
0.20
60
50
40
30
20
VCC2 = 20 V
VCC2 = 15 V
VCC2 = 14 V
10
0.18
0.16
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
0.00
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
-50
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 46.
SCPIN Input Voltage vs Temperature
0.30
0.73
0.28
0.26
Short Circuit Detection Voltage: VSCDET [V]
SCPIN Leading Edge Blanking Time: tSCPINLEB [μs]
Figure 45.
Output-side UVLO Delay Time (RDY)
vs Temperature
-25
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.72
VCC2 = 20 V
VCC2 = 15 V
VCC2 = 14 V
0.71
0.70
0.69
0.68
0.67
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 47.
SCPIN Leading Edge Blanking Time vs Temperature
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-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 48.
Short Circuit Detection Voltage vs Temperature
TSZ02201-0818ACH00110-1-2
18.Nov.2019 Rev.001
BM6112FV-C
Typical Performance Curves - continued
0.9
0.45
0.8
0.40
FLT Delay Time: tDFLT [μs]
Short Circuit Detection Filtering Time: tSCPFIL [μs]
(Reference data)
0.35
0.30
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
0.25
0.20
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
0.7
0.6
0.5
0.4
0.3
0.15
0.2
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
-50
-25
Figure 49.
Short Circuit Detection Filtering Time vs Temperature
100
125
Figure 50.
FLT Delay Time vs Temperature
10.0
OSFB Ouput Filtering Time: tOSFBFIL [μs]
220
PROOUT2 ON Time: tPRO2ON [ns]
0
25
50
75
Temperature: Ta [°C]
200
VCC2 = 14 V
VCC2 = 15 V
VCC2 = 20 V
180
160
140
120
9.5
9.0
8.5
VCC1 = 4.5 V
VCC1 = 5.0 V
VCC1 = 5.5 V
8.0
7.5
7.0
6.5
6.0
5.5
5.0
100
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 51.
PROOUT2 ON Time vs Temperature
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TSZ22111 • 15 • 001
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 52.
OSFB Output Filtering Time vs Temperature
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Typical Performance Curves - continued
80
80
70
70
FLT Output ON Resistance: RFLTL [Ω]
RDY Output ON Resistance: RRDYL [Ω]
(Reference data)
VCC1 = 4.5 V
VCC1 = 5.0 V
VCC1 = 5.5 V
60
50
40
30
20
10
0
60
VCC1 = 4.5 V
VCC1 = 5.0 V
VCC1 = 5.5 V
50
40
30
20
10
0
-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 53.
RDY Output ON Resistance vs Temperature
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-50
-25
0
25
50
75
Temperature: Ta [°C]
100
125
Figure 54.
FLT Output ON Resistance vs Temperature
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Application Information
1. Description of Pins and Cautions on Layout of Board
(1) VCC1 (Input-side power supply pin)
The VCC1 pin is a power supply pin on the input side. To suppress voltage fluctuations due to the driving current of the
internal transformer, connect a bypass capacitor between the VCC1 and GND1 pins.
(2) GND1 (Input-side ground pin)
The GND1 pin is a ground pin on the input side.
(3) VCC2 (Output-side positive power supply pin)
The VCC2 pin is a positive power supply pin on the output side. To suppress voltage fluctuations due to the OUT1H pin
or the OUT1L pin output current and due to the driving current of the internal transformer and output current, connect a
bypass capacitor between the VCC2 and GND2 pins.
(4) VEE2 (Output-side negative power supply pin)
The VEE2 pin is a negative power supply pin on the output side. To suppress voltage fluctuations due to the OUT1H pin
or the OUT1L pin output current and due to the driving current of the internal transformer and output current, connect a
bypass capacitor between the VEE2 and GND2 pins. Connect the VEE2 pin to the GND2 pin when no negative power
supply is used.
(5) GND2 (Output-side ground pin)
The GND2 pin is a ground pin on the output side. Connect the GND2 pin to the emitter or source of output device.
(6) INA, INB, ENA (Control input pin)
The INA, INB, and ENA pins are pins used to determine output logic.
ENA
INB
INA
L
Don’t care
Don’t care
H
H
Don’t care
H
L
L
H
L
H
OUT1H
Hi-Z
Hi-Z
Hi-Z
H
OUT1L
L
L
L
Hi-Z
(7) FLT (Fault output pin)
The FLT pin is an open drain pin used to output a fault signal when short circuit protection (SCP) function is activated,
and will be released at the rising edge of the ENA.
State
FLT
While in normal operation
Hi-Z
When a Fault occurs (SCP)
L
(8) RDY (Ready output pin)
The RDY pin shows the status of three internal protection features which are VCC1 UVLO, VCC2 UVLO and output
state feedback (OSFB). The term "output state feedback" shows whether the PROOUT1 pin voltage (High or Low)
corresponds to input logic or not.
Status
RDY
While in normal operation
Hi-Z
VCC1 UVLO or VCC2 UVLO or Output state feedback
L
(9) SENSOR (Temperature information output pin)
This is a pin which outputs the voltage of the TO pin converted to Duty cycle.
(10) OUT1H, OUT1L (Source-side, Sink-side output pin)
The OUT1H pin is a source side pin used to drive the gate of a power device. The OUT1L pin is a sink side pin used to
drive the gate of a power device. The OUT1H pin is also used to monitor gate voltage for active miller clamping function.
(11) OUT2 (Gate control pin for active miller clamping)
The OUT2 pin is a pin used for controlling the external MOSFET to prevent an increase in gate voltage due to the miller
current of the power device connected to the OUT1H pin or the OUT1L pin.
(12) VREG (Power supply pin for driving MOSFET for active miller clamping)
The VREG pin is a power supply pin for active miller clamping (Typ 5 V). Be sure to connect a capacitor between the
VREG pin and the VEE2 pin to prevent oscillation and to suppress voltage fluctuations due to the OUT2 pin output
current.
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BM6112FV-C
Description of Pins and Cautions on Layout of Board – continued
(13) PROOUT1, PROOUT2 (Soft turn-off pin / Gate voltage input pin)
These are pins for soft turn off of the gate of the power device when short circuit protection is activated. Both the
PROOUT1 pin and the PROOUT2 pin turn on for tPRO2ON (Typ 160 ns) from short circuit detection. After t PRO2ON (Typ
160ns), only the PROOUT1 pin continues to turn on. The PROOUT1 pin is also used to monitor gate voltage for output
state feedback function.
(14) SCPIN1, SCPIN2 (Short circuit current detection pin)
The SCPIN1 pin and the SCPIN2 pin are pins used to detect current for short-current protection. When the SCPIN1 pin
or the SCPIN2 pin voltage exceeds VSCDET (Typ 0.7 V), SCP function will be activated. This may cause the IC to
malfunction in an open state. To avoid such trouble, connect the SCPIN1 pin or the SCPIN2 pin to the GND2 pin
respectively if either of which is not used. In order to prevent the wrong detection due to noise, the noise mask time
tSCPFIL (Typ 0.3 µs) is set.
(15) TC (Resistor connection pin for setting constant current source output)
The TC pin is a resistor connection pin for setting the constant current output. If an arbitrary resistance value is
connected between the TC pin and the VEE2 pin, it is possible to set the constant current value output from the TO pin.
(16) TO (Constant current output pin / Sensor voltage input pin)
The TO pin is constant current output or voltage input pin. It can be used as a sensor input by connecting an element
with arbitrary impedance between the TO pin and the GND2 pin.
2. Description of Functions and Examples of Constant Setting
(1) Active Miller Clamping Function
When OUT1H Hi-Z and the OUT1H pin voltage < VOUT2ON (Typ 2 V), the OUT2 pin outputs High signal and the external
MOSFET is turned ON. Once OUT2 is turned High, OUT2 remains High even if OUT1H exceeds VOUT2ON (Typ 2 V).
When OUT1H = High, the OUT2 pin outputs Low signal and the external MOSFET is turned OFF.
OUT1H
OUT2
Hi-Z (Not less than VOUT2ON)
L
Hi-Z (less than VOUT2ON)
H
H
L
OUT1H, OUT1L
OUT1H
(Monitor gate voltage)
VOUT2ON
tDOUT2
(Typ 135 ns)
OUT2
Figure 55. Timing chart of active Miller clamping
(2) Fault Status Output Function
This function is used to output a fault signal from the FLT pin when short-circuit protection is activated and hold the Fault
signal until rising edge of the ENA is put in.
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BM6112FV-C
Description of Functions and Examples of Constant Setting – continued
(3) Under Voltage Lockout (UVLO) Function
BM6112FV-C incorporates under voltage lockout (UVLO) function both on the input and the output sides. When the
power supply voltage drops to UVLO ON voltage, the OUT1L pin and the RDY pin will output a “L” signal. When the
power supply voltage rises to UVLO OFF voltage, these pins will be reset. To prevent malfunctions due to noise, Filtering
time tUVLO1FIL and tUVLO2FIL are set on both input and output sides.
H
L
INA
VUVLO1H
VUVLO1L
VCC1
Hi-Z
L
H
L
RDY
OUT1H, OUT1L
Figure 56. Input-side UVLO Function Operation Timing Chart
H
L
INA
VUVLO2H
VUVLO2L
VCC2
Hi-Z
L
H
Hi-Z
L
RDY
OUT1H, OUT1L
Figure 57. Output-side UVLO Operation Timing Chart
(4) Short Circuit Protection (SCP) Function
When the SCPIN1 pin voltage or the SCPIN2 pin voltage exceeds a voltage set with VSCDET (Typ 0.7 V) parameter, SCP
function will be activated. When SCP function is activated, the OUT1H pin and the OUT1L pin voltage will be set to “HiZ” level, and both the PROOUT1 pin and the PROOUT2 pin turn on for tPRO2ON (Typ 160 ns). After tPRO2ON (Typ 160 ns),
only the PROOUT1 pin continues to turn on. First, the PROOUT1 pin voltage and the PROOUT2 pin voltage will go to
the “L” level (soft turn-off). Next, when the OUT1H pin voltage < VOUT2ON (Typ 2 V), the OUT1H pin and the OUT1L pin
become L and the PROOUT1 pin become Hi-Z. Finally, SCP function will be released at the rising edge of the ENA.
INA
ENA
tSCPINLEB
tENAFIL
VSCDET
SCPINx
tSCPFIL
H
Hi-Z
L
OUT1H, OUT1L
Hi-Z
L
Hi-Z
L
Hi-Z
L
PROOUT1
PROOUT2
FLT
H
L
H
L
tPRO2ON
tDFLT
tDOUT2ON
Gate Voltage
VOUT2ON
Figure 58. SCP Operation Timing Chart
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Short Circuit Protection (SCP) Function – continued
Collector or drain voltage (VDESAT) at which desaturation protection function operates and the blanking time (tBLANK)
determined by external component can be calculated by the formula below.
𝑉𝐷𝐸𝑆𝐴𝑇 = 𝑉𝑆𝐶𝐷𝐸𝑇 ×
𝑅3 +𝑅2
𝑉𝐶𝐶2𝑀𝐼𝑁 > 𝑉𝑆𝐶𝐷𝐸𝑇 ×
– 𝑉𝐹𝐷1 [V]
𝑅3
𝑅3+𝑅2+𝑅1
𝑅3
[V]
𝑅2+𝑅1
𝑡𝐵𝐿𝐴𝑁𝐾 = − 𝑅3+𝑅2+𝑅1 × 𝑅3 × (𝐶𝐵𝐿𝐴𝑁𝐾 + 6.5 × 10−12 ) × ln(1 −
𝑅3+𝑅2+𝑅1
𝑅3
×
𝑉𝑆𝐶𝐷𝐸𝑇
𝑉𝐶𝐶2
) [s]
where:
𝑉𝐷𝐸𝑆𝐴𝑇 is the collector or drain voltage at which desaturation protection function operates.
𝑉𝐹𝐷1 is the forward voltage of the diode.
𝑉𝑆𝐶𝐷𝐸𝑇 is the Short Circuit Detection Voltage.
𝑉𝐶𝐶2𝑀𝐼𝑁 is the minimum Output-side Positive Supply Voltage.
𝑡𝐵𝐿𝐴𝑁𝐾 is the blanking time.
𝑅1 is the resistance 1 to determine the 𝑉𝐷𝐸𝑆𝐴𝑇 , 𝑉𝐶𝐶2𝑀𝐼𝑁 and 𝑡𝐵𝐿𝐴𝑁𝐾 .
𝑅2 is the resistance 2 to determine the 𝑉𝐷𝐸𝑆𝐴𝑇 , 𝑉𝐶𝐶2𝑀𝐼𝑁 and 𝑡𝐵𝐿𝐴𝑁𝐾 .
𝑅3 is the resistance 3 to determine the 𝑉𝐷𝐸𝑆𝐴𝑇 , 𝑉𝐶𝐶2𝑀𝐼𝑁 and 𝑡𝐵𝐿𝐴𝑁𝐾 .
𝐶𝐵𝐿𝐴𝑁𝐾 is the capacitance to determine the 𝑡𝐵𝐿𝐴𝑁𝐾 .
Reference Value
VDESAT
R1
R2
R3
4.0 V
15 kΩ
39 kΩ
6.8 kΩ
4.5 V
15 kΩ
43 kΩ
6.8 kΩ
5.0 V
15 kΩ
36 kΩ
5.1 kΩ
5.5 V
15 kΩ
39 kΩ
5.1 kΩ
6.0 V
15 kΩ
43 kΩ
5.1 kΩ
6.5 V
15 kΩ
62 kΩ
6.8 kΩ
7.0 V
15 kΩ
68 kΩ
6.8 kΩ
7.5 V
15 kΩ
82 kΩ
7.5 kΩ
8.0 V
15 kΩ
91 kΩ
8.2 kΩ
8.5 V
15 kΩ
82 kΩ
6.8 kΩ
9.0 V
15 kΩ
130 kΩ
10 kΩ
9.5 V
15 kΩ
91 kΩ
6.8 kΩ
10.0 V
15 kΩ
130 kΩ
9.1 kΩ
Figure 59. Block Diagram for DESAT
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Description of Functions and Examples of Constant Setting – continued
(5) Temperature monitor function
The TO Pin Output Current (ITO) is supplied from the TO pin from the built-in constant current circuit. This current value
can be adjusted in accordance with the resistance value between the TC pin and the VEE2 pin. Furthermore, the TO pin
voltage is converted to Duty and outputs the signal to the SENSOR pin.
𝐼𝑇𝑂 =
𝑉𝑇𝐶
𝑅𝑇𝐶
[A]
where:
𝐼𝑇𝑂 is the TO pin Output Current.
𝑉𝑇𝐶 is the TC pin Voltage.
𝑅𝑇𝐶 is the resistance to determine the desired 𝐼𝑇𝑂 .
Figure 60. Block Diagram of Temperature Monitor Function
The SENSOR Duty is calculated according to the following calculating formula.
(VTO < 1.35 V):
𝑆𝐸𝑁𝑆𝑂𝑅 𝐷𝑢𝑡𝑦 = 10 [%]
(1.35 V ≤ VTO < 2.5 V):
𝑆𝐸𝑁𝑆𝑂𝑅 𝐷𝑢𝑡𝑦 = 32 × 𝑉𝑇𝑂 − 33.2
[%]
(2.5 V ≤ VTO ≤ 3.84 V):
𝑆𝐸𝑁𝑆𝑂𝑅 𝐷𝑢𝑡𝑦 = 32 × 𝑉𝑇𝑂 − 32.9
[%]
(3.84 V < VTO):
𝑆𝐸𝑁𝑆𝑂𝑅 𝐷𝑢𝑡𝑦 = 90 [%]
where:
𝑆𝐸𝑁𝑆𝑂𝑅 𝐷𝑢𝑡𝑦 is the duty cycle obtained by converting the TO pin voltage.
𝑉𝑇𝑂 is the TO pin voltage.
SENSOR Duty[%]
100
90
80
70
60
50
40
30
20
10
0
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3.84 4
3
VTO[V]
Figure 61. SENSOR Duty vs TO Voltage
1
2
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Description of Functions and Examples of Constant Setting – continued
(6) Gate State Monitoring Function
When gate logic and input logic of output device monitored with the PROOUT1 pin are compared, a logic L is output
from the RDY pin when they differ. In order to prevent the detection error due to delay of input and output, OSFB output
filtering time tOSFBFIL is provided.
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I/O Equivalence Circuit
Pin No.
Pin Name
Input Output Equivalence Circuit Diagram
Pin Function
PROOUT2
VCC2
2
Soft turn-off pin 2
PROOUT2, OUT1L
OUT1L
VEE2
13
Sink-side Output pin
VCC2
PROOUT1
PROOUT1
3
Soft turn-off pin 1 /
Gate voltage input pin
GND2
VEE2
VCC2
OUT2
4
Gate control pin for active miller
clamping
Internal Power
Supply
VREG
VREG
OUT2
5
Power supply pin for driving MOSFET
for active miller clamping
TC
VEE2
VCC2
Internal Power
Supply
6
Resister connection pin for setting
constant current source output
TO
TC
TO
7
GND2
Constant current output pin /
Sensor voltage input pin
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I/O Equivalence Circuit - continued
Pin Name
Pin No.
Input Output Equivalence Circuit Diagram
Pin Function
VCC2
SCPIN2
9
Short circuit current detection pin 2
SCPIN1, SCPIN2
SCPIN1
10
GND2
Short circuit current detection pin 1
VCC2
OUT1H
12
OUT1H
Source-side output pin
VEE2
FLT
16
FLT, RDY
Fault output pin
GND1
RDY
20
Ready output pin
ENA
VCC1
17
Input enabling signal input pin
ENA, INA
INA
18
Control input pin
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I/O Equivalence Circuit - continued
Pin Name
Pin No.
Input Output Equivalence Circuit Diagram
Pin Function
VCC1
INB
INB
19
Control input pin
GND1
VCC1
SENSOR
21
SENSOR
Temperature information output pin
GND1
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Figure 62. Example of IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Ordering Information
B
M
6
1
1
Part Number
2
F
V
-
Package
FV : SSOP-B28W
CE2
Product class
C: for Automotive applications
Packaging and forming specification
E2: Embossed tape and reel
(SSOP-B28W)
Marking Diagram
SSOP-B28W (TOP VIEW)
B M6 11 2
Part Number Marking
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
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Revision History
Date
Revision
18.Nov.2019
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
