Datasheet
Gate Driver Providing Galvanic Isolation Series
Isolation Voltage 2500 Vrms
1ch Gate Driver Providing Galvanic Isolation
BM61M22BFJ-C
General Description
Key Specifications
The BM61M22BFJ-C is a gate driver providing galvanic
isolation with an isolation voltage of 2500 Vrms,
maximum I/O delay time of 60 ns, and minimum input
pulse width of 60 ns. It incorporates the Under-voltage
Lockout (UVLO) function.
Isolation Voltage:
Maximum Gate Drive Voltage:
Maximum I/O Delay Time:
Minimum Input Pulse Width:
Package
Features
SOP-JW8
(Note 1)
2500 Vrms
24 V
60 ns
60 ns
W (Typ) x D (Typ) x H (Max)
4.9 mm x 6.0 mm x 1.65 mm
AEC-Q100 Qualified
Providing Galvanic Isolation
Under-voltage Lockout Function
UL1577 (pending)
(Note 1) Grade1
Applications
IGBT Gate Driver
MOSFET Gate Driver
Typical Application Circuits
Figure 1. Typical Application Circuits (in case of 2ch)
〇Product structure : Silicon integrated circuit
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〇This product has no designed protection against radioactive rays.
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package……… ............................................................................................................................................................................... 1
Typical Application Circuits ............................................................................................................................................................. 1
Contents ......................................................................................................................................................................................... 2
Recommended Range of External Constants ................................................................................................................................. 3
Pin Configurations .......................................................................................................................................................................... 3
Block Diagram ................................................................................................................................................................................ 4
Absolute Maximum Ratings ............................................................................................................................................................ 4
Thermal Resistance ........................................................................................................................................................................ 5
Recommended Operating Conditions ............................................................................................................................................. 5
Insulation Related Characteristics .................................................................................................................................................. 5
Electrical Characteristics................................................................................................................................................................. 6
Typical Performance Curves........................................................................................................................................................... 7
Pin Descriptions ............................................................................................................................................................................ 13
Description of Functions and Examples of Constant Setting ........................................................................................................ 14
Selection of Components Externally Connected ........................................................................................................................... 16
I/O Equivalence Circuits................................................................................................................................................................ 17
Operational Notes ......................................................................................................................................................................... 18
Ordering Information ..................................................................................................................................................................... 20
Marking Diagram .......................................................................................................................................................................... 20
Physical Dimension and Packing Information ............................................................................................................................... 21
Revision History ............................................................................................................................................................................ 22
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Recommended Range of External Constants
Recommended Value
Pin Name
Symbol
Unit
Min
Typ
Max
VCC1
CVCC1
0.1
1.0
-
µF
VCC2
CVCC2
0.33
-
-
µF
CVCC2: For supplying gate charge current of MOS FET/IGBT.
Pin Configurations
SOP-JW8
(TOP VIEW)
1 VCC1
8 GND2
2 INA
7 OUTL
3 INB
6 OUTH
4 GND1
5 VCC2
Pin No.
Pin Name
1
VCC1
2
INA
Control input pin A
3
INB
Control input pin B
4
GND1
Input side ground pin
5
VCC2
Output side power supply pin
6
OUTH
Source side output pin for gate driving
7
OUTL
Sink side output pin for gate driving
8
GND2
Output side ground pin
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Function
Input side power supply pin
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Block Diagram
Absolute Maximum Ratings
Parameter
Symbol
Limits
Unit
(Note 2)
Input Side Supply Voltage
VCC1
-0.3 to +7.0
Output Side Supply Voltage
VCC2
-0.3 to +30.0
INA Pin Input Voltage
VINA
-0.3 to +VCC1+0.3 or +7.0
INB Pin Input Voltage
VINB
-0.3 to +VCC1+0.3 or +7.0
Gate Drive Output Current (10 µs)
Storage Temperature Range
Maximum Junction Temperature
V
(Note 3)
V
(Note 2)
V
(Note 2)
V
IOUTPEAK
self limited
A
Tstg
-55 to +150
°C
Tjmax
150
°C
(Note 2) Relative to GND1.
(Note 3) Relative to GND2.
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
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Thermal Resistance(Note 4)
Parameter
Thermal Resistance (Typ)
Symbol
1s
(Note 6)
Unit
(Note 7)
2s2p
SOP-JW8
Input Side Junction to Ambient
Output Side Junction to Ambient
Input Side Junction to Top Characterization Parameter
(Note 5)
Output Side Junction to Top Characterization Parameter
(Note 5)
θJA1
202.0
111.6
°C/W
θJA2
202.5
111.6
°C/W
ΨJT1
68
48
°C/W
ΨJT2
72
42
°C/W
(Note 4) Based on JESD51-2A (Still-Air).
(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 6) Using a PCB board based on JESD51-3.
(Note 7) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
Recommended Operating Conditions
Parameter
Symbol
Min
Max
Unit
Input Side Supply Voltage
VCC1
(Note 8)
4.5
5.5
V
Output Side Supply Voltage
VCC2
(Note 9)
9
24
V
-40
+125
°C
Operating Temperature
Topr
(Note 8) Relative to GND1.
(Note 9) Relative to GND2.
Insulation Related Characteristics
Parameter
Symbol
Characteristic
Insulation Resistance (VIO = 500 V)
RS
>10
Insulation Withstand Voltage (1 min)
VISO
2500
Vrms
Insulation Test Voltage (1 s)
VISO
3000
Vrms
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9
Unit
Ω
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Electrical Characteristics
(Unless otherwise specified Ta = -40 °C to +125 °C, VCC1 = 4.5 V to 5.5 V, VCC2 = 9 V to 24 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Input Side Circuit Current 1
ICC11
0.25
0.50
1.00
mA
INA = L, INB = H
Input Side Circuit Current 2
ICC12
1.50
3.00
6.00
mA
INA = H, INB = L
Output Side Circuit Current 1
ICC21
0.30
0.60
1.20
mA
OUT (OUTL and OUTH are
shorted) = L
Output Side Circuit Current 2
ICC22
0.22
0.45
0.90
mA
OUT = H
VINH
2.0
-
VCC1
V
INA, INB
General
Logic Block
Logic High Level Input Voltage
Logic Low Level Input Voltage
VINL
0
-
0.8
V
INA, INB
Logic Pull Down Resistance
RIND
25
50
100
kΩ
INA
Logic Pull Up Resistance
RINU
25
50
100
kΩ
INB
Minimum Input Pulse Width
tINMIN
60
-
-
ns
INA, INB
OUT ON Resistance (Source)
RONH
0.60
1.35
3.00
Ω
IOUT = -40 mA
OUT ON Resistance (Sink)
RONL
0.25
0.80
1.70
Ω
OUT Maximum Current (Source)
IOUTMAXH
2.0
3.0
-
A
OUT Maximum Current (Sink)
IOUTMAXL
2.0
3.0
-
A
tPONA
40
50
60
ns
IOUT = +40 mA
VCC2 = 15 V,
Guaranteed by design
VCC2 = 15 V,
Guaranteed by design
INA = PWM, INB = L
Output
Turn ON Time
Turn OFF Time
tPONB
40
50
60
ns
INA = H, INB = PWM
tPOFFA
40
50
60
ns
INA = PWM, INB = L
tPOFFB
40
50
60
ns
INA = H, INB = PWM
tPDISTA
-10
0
+10
ns
tPOFFA - tPONA
tPDISTB
-10
0
+10
ns
tPOFFB - tPONB
Part-to-part Skew
tSK-PP
-
-
12
ns
Same temperature
Guaranteed by design
Rise Time
tRISE
-
15
-
ns
OUT - GND2 = 2 nF
Fall Time
tFALL
-
15
-
ns
OUT - GND2 = 2 nF
Common Mode Transient Immunity
CM
100
-
-
kV/µs
VCC1 UVLO OFF Voltage
VUVLO1H
3.35
3.50
3.65
V
VCC1 UVLO ON Voltage
VUVLO1L
3.25
3.40
3.55
V
VCC1 UVLO Mask Time
tUVLO1MSK
0.6
1.7
3.4
µs
VCC2 UVLO OFF Voltage
VUVLO2H
7.2
7.8
8.4
V
VCC2 UVLO ON Voltage
VUVLO2L
6.8
7.4
8.0
V
VCC2 UVLO Mask Time
tUVLO2MSK
1.0
2.9
5.0
µs
Propagation Distortion
Guaranteed by design
Protection Functions
INA
VINL
VINH
VINH
INB
tPONA
VINL
tPONB
tPOFFB
90 %
90 %
OUT
10 %
tRISE
tFALL
tPOFFA
90 %
90 %
tRISE
tFALL
10 %
10 % 10 %
Figure 2. IN-OUT Timing Chart
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1.10
1.10
1.00
1.00
Input Side Circuit Current 1: ICC11 [mA]
Input Side Circuit Current 1: ICC11 [mA]
Typical Performance Curves
0.90
0.80
0.70
0.60
Ta = +125 °C
0.50
0.40
0.30
Ta = +25 °C
0.90
0.80
0.70
VCC1 = 5.5 V
0.60
VCC1 = 5.0 V
0.50
0.40
0.30
VCC1 = 4.5 V
Ta = -40 °C
0.20
0.20
4.50
4.75
5.00
5.25
Input Side Supply Voltage: VCC1 [V]
5.50
-40
6.00
6.00
5.50
5.50
5.00
4.50
Ta = +125 °C
4.00
3.50
Ta = +25 °C
3.00
2.50
Ta = -40 °C
2.00
0
20
40
60
80
Temperature: Ta [˚C]
100 120
Figure 4. Input Side Circuit Current 1 vs Temperature
Input Side Circuit Current 2 : ICC12 [mA]
Input Side Circuit Current 2 : ICC12 [mA]
Figure 3. Input Side Circuit Current 1
vs Input Side Supply Voltage
-20
1.50
5.00
4.50
VCC1 = 5.5 V
4.00
VCC1 = 5.0 V
3.50
3.00
2.50
VCC1 = 4.5 V
2.00
1.50
4.50
4.75
5.00
5.25
5.50
-40
Input Side Supply Voltage: VCC1 [V]
0
20
40
60
80
Temperature: Ta [˚C]
100 120
Figure 6. Input Side Circuit Current 2 vs Temperature
Figure 5. Input Side Circuit Current 2
vs Input Side Supply Voltage
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1.20
1.20
1.10
1.10
Output Side Circuit Current 1: ICC21 [mA]
Output Side Circuit Current 1: ICC21 [mA]
Typical Performance Curves - continued
1.00
1.00
0.90
0.90
0.80
Ta = +125 °C
0.70
0.70
0.60
0.60
0.50
0.50
0.40
Ta = +25 °C
Ta = -40 °C
9
12
15
18
21
Output Side Supply Voltage: VCC2 [V]
VCC2 = 15 V
0.40
0.30
VCC2 = 9 V
0.30
24
-40
Figure 7. Output Side Circuit Current 1
vs Output Side Supply Voltage (OUT = L)
-20
0
20
40
60
80
Temperature: Ta [˚C]
100
120
Figure 8. Output Side Circuit Current 1
vs Temperature (OUT = L)
0.90
Output Side Circuit Current 2 : ICC22 [mA]
0.90
Output Side Circuit Current 2 : ICC22 [mA]
VCC2 = 24 V
0.80
0.80
0.70
Ta = +125 °C
0.60
0.50
0.40
Ta = +25 °C
0.80
0.70
VCC2 = 24 V
0.60
0.50
0.40
VCC2 = 9 V
Ta = -40 °C
0.30
VCC2 = 15 V
0.30
9
12
15
18
21
Output Side Supply Voltage: VCC2 [V]
24
-40
Figure 9. Output Side Circuit Current 2
vs Output Side Supply Voltage (OUT = H)
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-20
0
20 40 60 80
Temperature: Ta [˚C]
100 120
Figure 10. Output Side Circuit Current 2
vs Temperature (OUT = H)
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Typical Performance Curves - continued
24
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
2.5
20
2.0
Output Voltage [V]
Logic H/L Level Input Voltage: VINH, VINL [V]
3.0
H level
1.5
L level
1.0
12
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
0.5
8
4
0.0
0
4.50
4.75
5.00
5.25
Input Side Supply Voltage: VCC1 [V]
5.50
0
1
2
3
4
5
Logic H/L Level Input Voltage: VINH ,VINL [V]
Figure 12. Output Voltage vs Logic H/L Level Input Voltage
(VCC1 = 5 V, VCC2 = 15 V, Ta = 25 °C)
Figure 11. Logic H/L Level Input Voltage
vs Input Side Supply Voltage
65
50
59
Minimum Input Pulse Width: tINMIN [ns]
RIND
VCC1 = 4.5 V
VCC1 = 5.0 V
VCC1 = 5.5 V
53
[kΩ]
Logic Pull Up/Down Resistance: RINU, RIND
VCC1 = 5 V
16
47
RINU
VCC1 = 4.5 V
VCC1 = 5.0 V
VCC1 = 5.5 V
41
35
-40
-20
0
20
40
60
80
Temperature: Ta [˚C]
100
30
20
VCC1 = 4.5 V
VCC1 = 5.0 V
VCC1 = 5.5 V
10
0
120
-40
-20
0
20
40
60
80
100
120
Temperature: Ta [˚C]
Figure 13. Logic Pull Up/Down Resistance vs Temperature
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Figure 14. Minimum Input Pulse Width vs Temperature
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Typical Performance Curves – continued
3.0
2.5
OUT ON Resistance (Sink): RONL [Ω]
OUT ON Resistance (Source): RONH [Ω]
1.7
VCC2 = 9 V
VCC2 = 15 V
VCC2 = 24 V
2.0
1.5
1.0
VCC2 = 9 V
VCC2 = 15 V
VCC2 = 24 V
1.3
1.1
0.9
0.7
0.5
0.3
0.5
-40
-20
0
20
40
60
80
Temperature: Ta [˚C]
-40
100 120
Figure 15. OUT ON Resistance (Source) vs Temperature
-20
0
20
40
60
80
Temperature: Ta [˚C]
100
120
Figure 16. OUT ON Resistance (Sink) vs Temperature
60
55
Turn OFF Time: tPOFFA [ns]
60
Turn ON Time: tPONA [ns]
1.5
VCC2 = 9 V
VCC2 = 15 V
50
45
55
VCC2 = 15 V
VCC2 = 9 V
50
45
VCC2 = 24 V
VCC2 = 24 V
40
40
-40
-20
0
20
40
60
80
Temperature: Ta [˚C]
100
-40
120
Figure 17. Turn ON Time vs Temperature
(INA = PWM, INB = L)
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-20
0
20 40 60 80
Temperature: Ta [˚C]
100 120
Figure 18. Turn OFF Time vs Temperature
(INA = PWM, INB = L)
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Typical Performance Curves – continued
60
Turn OFF Time: tPOFFB [ns]
Turn ON Time: tPONB [ns]
60
55
VCC2 = 9 V
VCC2 = 15 V
50
45
55
50
VCC2 = 9 V
45
VCC2 = 24 V
VCC2 = 24 V
40
40
-40
-20
0
20 40 60 80
Temperature: Ta [˚C]
100 120
-40
Figure 19. Turn ON Time vs Temperature
(INA = H, INB = PWM)
-20
0
20 40 60 80
Temperature: Ta [˚C]
100 120
Figure 20. Turn OFF Time vs Temperature
(INA = H, INB = PWM)
3.65
5
3.60
3.55
VCC1 UVLO Mask Time: tUVLO1MSK [μs]
VCC1 UVLO ON/OFF Voltage: VUVLO1H, VUVLO1L [V]
VCC2 = 15 V
VUVLO1H
3.50
3.45
3.40
3.35
3.30
VUVLO1L
3.25
-40
-20
0
20 40 60 80
Temperature: Ta [˚C]
3
2
1
100 120
-40
Figure 21. VCC1 UVLO ON/OFF Voltage vs Temperature
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4
-20
0
20
40
60
80
Temperature: Ta [˚C]
100
120
Figure 22. VCC1 UVLO Mask Time vs Temperature
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Typical Performance Curves – continued
5
VCC2 UVLO Mask Time: tUVLO2MSK [μs]
VCC2 UVLO ON/OFF Voltage: VUVLO2H, VUVLO2L [V]
8.0
VUVLO2H
4
7.5
VUVLO2L
3
7.0
2
6.5
6.0
-40
1
-20
0
20 40 60 80
Temperature: Ta [˚C]
-40
100 120
0
20
40
60
80
Temperature: Ta [˚C]
100
120
Figure 24. VCC2 UVLO Mask Time vs Temperature
Figure 23. VCC2 UVLO ON/OFF Voltage vs Temperature
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Pin Descriptions
1. VCC1 (Input side power supply pin)
The VCC1 pin is a power supply pin on the input side. To suppress voltage fluctuations due to the current to drive internal
transformers, connect a bypass capacitor between the VCC1 and the GND1 pins.
2. GND1 (Input side ground pin)
The GND1 pin is a ground pin on the input side.
3. VCC2 (Output side power supply pin)
The VCC2 pin is a power supply pin on the output side. To reduce voltage fluctuations due to the OUTH and OUTL pins
output current, connect a bypass capacitor between the VCC2 pin and the GND2 pin.
4. GND2 (Output side ground pin)
The GND2 pin is a ground pin on the output side.
5. INA, INB (Control input pin)
The INA, INB are pins used to determine output logic.
INB
INA
OUTH
OUTL
L
L
Hi-Z
L
L
H
H
Hi-Z
H
L
Hi-Z
L
H
H
Hi-Z
L
6. OUTH, OUTL (Output pin for gate driving)
The OUT pin is used to drive the gate of a power device. OUTH is the source output. OUTL is the sink output.
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Description of Functions and Examples of Constant Setting
1. Under-voltage Lockout (UVLO) Function
The BM61M22BFJ-C incorporates the Under-voltage Lockout (UVLO) Function both on the input and the output sides. When
the power supply voltage drops to the UVLO ON voltage (low voltage side typ 3.4 V, high voltage side typ 7.4 V), the OUT
(OUTL and OUTH are shorted) pin will output the “L” signal. When the power supply voltage rises to the UVLO OFF voltage,
these pins are reset. In addition, to prevent malfunctions due to noises, a mask time of t UVLO1MSK (typ 1.7 μs) and tUVLO2MSK
(typ 2.9 μs) are set on both the low and the high voltage sides. After the input side UVLO is released, the OUT pin will output
the “H” signal from the time after the input signal switches.
H
INA
L
H
INB
L
VUVLO1H
VUVLO1L
VCC1
tUVLO1MSK
OUT
H
L
Figure 25. Input Side UVLO Function Operation Timing Chart
H
INA
L
H
INB
L
VUVLO2H
VUVLO2L
VCC2
OUT
tUVLO2MSK
H
Hi-Z
L
Figure 26. Output Side UVLO Function Operation Timing Chart
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Description of Functions and Examples of Constant Setting – continued
2. I/O Condition Table
Input
No.
Output
Status
VCC1
VCC2
INB
INA
OUTH
OUTL
1
VCC1UVLO
UVLO
X
X
X
Hi-Z
L
2
VCC2UVLO
X
UVLO
X
X
Hi-Z
L
3
INB Active
○
○
H
X
Hi-Z
L
4
Normal operation L input
○
○
L
L
Hi-Z
L
5
Normal operation H input
○
○
L
H
H
Hi-Z
○: VCC1 or VCC2 > UVLO, X: Don't care
VUVLO1H
VUVLO1L
VCC1
INA
INB
VUVLO2H
VUVLO2L
VCC2
tUVLO2MSK
OUTH
tUVLO1MSK
H
Hi-Z
Hi-Z
L
H
Hi-Z
L
OUTL
GATE
OUTPUT
Figure 27. IN-OUT Timing Chart
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© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
15/22
TSZ02201-0818ACH00220-1-2
24.Apr.2020 Rev.001
BM61M22BFJ-C
Selection of Components Externally Connected
Figure 28. For Driving IGBT or MOSFET
Figure 29. For Driving IGBT or MOSFET with Buffer Circuits
Figure 30. For Driving IGBT or MOSFET with Negative Power Supply
Figure 31. For Driving IGBT or MOSFET with Buffer Circuits & Negative Power Supply
Symbol
R1
Manufacturer
ROHM
Element
Resistor
R2
ROHM
Resistor
Q1
Q2
ROHM
ROHM
NPN Transistor
PNP Transistor
D1
ROHM
Diode
ZD1
ROHM
Zener Diode
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© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
16/22
Recommended Components
LTR Series
LTR Series
MCR Series
2SCR542PFRA
2SAR542PFRA
RBR3MM30A
RBR5LAM30A
YFZV Series
TSZ02201-0818ACH00220-1-2
24.Apr.2020 Rev.001
BM61M22BFJ-C
I/O Equivalence Circuits
Pin No
Name (Function)
2
INA (Control input pin A)
3
INB (Control input pin B)
6
OUTH (Source side output pin)
7
OUTL (Sink side output pin)
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© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
I/O equivalence circuits
17/22
TSZ02201-0818ACH00220-1-2
24.Apr.2020 Rev.001
BM61M22BFJ-C
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
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© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
18/22
TSZ02201-0818ACH00220-1-2
24.Apr.2020 Rev.001
BM61M22BFJ-C
Operational Notes – continued
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
Parasitic
Elements
Pin B
B
GND
Parasitic
Elements
GND
GND
N Region
close-by
Figure 32. Example of IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
19/22
TSZ02201-0818ACH00220-1-2
24.Apr.2020 Rev.001
BM61M22BFJ-C
Ordering Information
B
M
6
1
M
2
2
B
F
J
Package
FJ: SOP-JW8
Part Number
-
CE2
Rank
C:Automotive
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SOP-JW8 (TOP VIEW)
Part Number Marking
6 1 M 2 2
LOT Number
Pin 1 Mark
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© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
20/22
TSZ02201-0818ACH00220-1-2
24.Apr.2020 Rev.001
BM61M22BFJ-C
Physical Dimension and Packing Information
Package Name
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© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
SOP-JW8
21/22
TSZ02201-0818ACH00220-1-2
24.Apr.2020 Rev.001
BM61M22BFJ-C
Revision History
Date
Revision
24.Apr.2020
001
Changes
New Release
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© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
22/22
TSZ02201-0818ACH00220-1-2
24.Apr.2020 Rev.001
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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