BM61S40RFV-CE2

Datasheet Gate Driver Providing Galvanic Isolation Series Isolation voltage 3750Vrms 1ch Gate Driver Providing Galvanic Isolation BM61S40RFV-C Key Specifications General Description      The BM61S40RFV-C is a gate driver with an isolation voltage of 3750 Vrms, I/O delay time of 65ns, and minimum input pulse width of 60ns. It incorporates the Under-Voltage Lockout (UVLO) function, Miller clamp function and Over-Voltage Protect (OVP) function. Features       Isolation Voltage: Maximum Gate Drive Voltage: I/O Delay Time: Minimum Input Pulse Width: Output Current 3750 Vrms 20 V 65 ns(Max) 60 ns 4A (Note 1 ) AEC-Q100 Qualified Providing Galvanic Isolation Active Miller Clamping Under-Voltage Lockout Function Over-Voltage Protect Function UL1577 Recognized: File E356010 Package W(Typ) x D(Typ) x H(Max) 3.5 mm x10.2 mm x 1.9 mm SSOP-B10W (Note 1) Grade1 Applications  SiC MOSFET Gate Drive SSOP-B10W Typical Application Circuits Isolation GND2 GND1 VCC1 INA INB UVLO2 UVLO1 Pulse Generator OVP VCC2 OUT Logic MC CVCC1 CVCC2 - GND1 + GND2 2V Pin 1 Figure 1. For Driving SiC MOSFET without Negative Power Supply 〇Product structure : Silicon integrated circuit www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Key Specifications........................................................................................................................................................................... 1 Package .................................................................................................................................................................................. 1 Typical Application Circuits ............................................................................................................................................................. 1 Contents ......................................................................................................................................................................................... 2 Recommended Range of External Constants ................................................................................................................................. 3 Pin Configurations .......................................................................................................................................................................... 3 Pin Descriptions .............................................................................................................................................................................. 3 Description of Functions and Examples of Constant Setting .......................................................................................................... 5 Absolute Maximum Ratings ............................................................................................................................................................ 8 Thermal Resistance ........................................................................................................................................................................ 8 Recommended Operating Ratings .................................................................................................................................................. 9 Insulation Related Characteristics .................................................................................................................................................. 9 Electrical Characteristics............................................................................................................................................................... 11 Typical Performance Curves ......................................................................................................................................................... 12 Figure 8. Input-side Circuit Current 1 vs Input-side Supply Voltage .......................................................................................... 12 Figure 9. Input-side Circuit Current 1 vs Temperature ............................................................................................................... 12 Figure 10. Input-side Circuit Current 2 vs Input-side Supply Voltage (At INA=100 kHz, Duty=50 %) ........................................ 12 Figure 11. Input-side Circuit Current 2 vs Temperature (At INA=100 kHz, Duty=50 %)............................................................. 12 Figure 12. Output-side Circuit Current 2 vs Output-side Supply Voltage (At OUT=L) ............................................................... 13 Figure 13. Output-side Circuit Current 2 vs Temperature (At OUT=L) ....................................................................................... 13 Figure 14.Output-side Circuit Current 2 vs Output-side Supply Voltage (At OUT=H) ................................................................ 13 Figure 15 Output-side Circuit Current 2 vs Temperature (At OUT=H) ....................................................................................... 13 Figure 16. Logic High/Low Level Input Voltage ......................................................................................................................... 14 Figure 17.Output Voltage vs Logic Level Input Voltage (INA) .................................................................................................... 14 Figure 18 Logic Pull-up/down Resistance vs Temperature ........................................................................................................ 14 Figure 19 Logic Input Minimum Pulse Width vs Temperature ................................................................................................... 14 Figure 20. OUT ON Resistance (Source) vs Temperature ........................................................................................................ 15 Figure 21. OUT ON Resistance (Sink) vs Temperature ............................................................................................................. 15 Figure 22 Turn ON Time vs Temperature .................................................................................................................................. 15 Figure 23 Turn OFF Time vs Temperature ................................................................................................................................ 15 Figure 24. Turn ON Time vs Temperature (INA=H, INB=PWM) ................................................................................................ 16 Figure 25. Turn OFF Time vs Temperature (INA=H, INB=PWM) ............................................................................................... 16 Figure 26. MC ON Resistance vs Temperature ......................................................................................................................... 16 Figure 27. MC ON Threshold Voltage vs Temperature .............................................................................................................. 16 Figure 28 VCC1 UVLO ON/OFF Voltage vs Temperature ........................................................................................................... 17 Figure 29 VCC1 UVLO Mask Time vs Temperature .................................................................................................................... 17 Figure 30 VCC2 UVLO ON/OFF Voltage vs Temperature ........................................................................................................... 17 Figure 31 VCC2 UVLO Mask Time vs Temperature .................................................................................................................... 17 Figure 32 VCC2 OVP ON/OFF Voltage vs Temperature ............................................................................................................. 18 Figure 33 VCC2 OVP Mask Time vs Temperature....................................................................................................................... 18 Selection of Components Externally Connected ........................................................................................................................... 19 I/O Equivalence Circuits................................................................................................................................................................ 20 Operational Notes ......................................................................................................................................................................... 21 1. Reverse Connection of Power Supply ............................................................................................................................ 21 2. Power Supply Lines ........................................................................................................................................................ 21 3. Ground Voltage............................................................................................................................................................... 21 4. Ground Wiring Pattern .................................................................................................................................................... 21 5. Recommended Operating Conditions............................................................................................................................. 21 6. Inrush Current................................................................................................................................................................. 21 7. Operation Under Strong Electromagnetic Field .............................................................................................................. 21 8. Testing on Application Boards ........................................................................................................................................ 21 9. Inter-pin Short and Mounting Errors ............................................................................................................................... 21 10. Unused Input Pins .......................................................................................................................................................... 22 11. Regarding the Input Pin of the IC ................................................................................................................................... 22 12. Ceramic Capacitor .......................................................................................................................................................... 22 Ordering Information ..................................................................................................................................................................... 23 Marking Diagram .......................................................................................................................................................................... 23 Physical Dimension and Packing Information ............................................................................................................................... 24 Revision History ............................................................................................................................................................................ 25 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Recommended Range of External Constants Recommended Value Pin Name Symbol Unit Min Typ Max 1.0 - µF - µF VCC1 CVCC1 0.1 VCC2 CVCC2 0.01 - (Note 2) (Note 2) Value according to the load Pin Configurations (TOP VIEW) GND1 6 5 GND2 VCC1 7 4 VCC2 INA 8 3 OUT INB 9 2 MC GND1 10 1 GND2 Pin Descriptions Pin No. Pin Name 1 GND2 2 MC Miller clamp pin 3 OUT Output pin 4 VCC2 Output-side power supply pin 5 GND2 Output-side ground pin 6 GND1 Input-side ground pin 7 VCC1 Input-side power supply pin 8 INA Control input A pin 9 INB Control input B pin 10 GND1 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Function Output-side ground pin Input-side ground pin 3/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Pin Descriptions - continued 1) VCC1 (Input-side Power Supply Pin) The VCC1 pin is a power supply pin on the input side. To suppress voltage fluctuations due to the current to drive internal transformers, connect a bypass capacitor between the VCC1 and the GND1 pins. 2) GND1 (Input-side Ground Pin) The GND1 pin is a ground pin on the input side. 3) VCC2 (Output-side Power Supply Pin) The VCC2 pin is a power supply pin on the output side. To reduce voltage fluctuations due to OUT pin output current, connect a bypass capacitor between the VCC2 and the GND2 pins. 4) GND2 (Output-side Ground Pin) The GND2 pin is a ground pin on the output side. 5) INA, INB (Control Input A/B Pin) The INA and INB pins are used to determine output logic. INB INA OUT H L L H H L L L L L H H 6) OUT (Output Pin) The OUT pin is used to drive the gate of a power device. 7) MC (Miller Clamp Pin) The MC pin is for preventing the increase in gate voltage due to the Miller current of the power device connected to the OUT pin. If the Miller Clamp function is not used, short-circuit the MC pin to the GND2 pin. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Description of Functions and Examples of Constant Setting 1) Miller Clamp Function When the INA=L or INB=H and OUT pin voltage < VMCON (typ 2V), the internal MOSFET of the MC pin is turned ON. INA INB MC Internal MOSFET of the MC Pin L X Less Than VMCON ON X H Less Than VMCON ON H L X OFF VCC2 OUT GATE Logic MC + VMCON GND2 Figure 2. Block Diagram of Miller Clamp Function - Figure 3. Timing Chart of Miller Clamp Function www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Description of Functions and Examples of Constant Setting - continued 2) Under-Voltage Lockout (UVLO) Function The BM61S40RFV-C incorporates the Under-Voltage Lockout (UVLO) function both on the Input-side and the output-side. When the power supply voltage drops to the UVLO ON voltage (input-side typ 4.0 V, output-side 14.5 V), the OUT pin will output the “L” signal. In addition, to prevent malfunctions due to noises, a mask time of tUVLO1MSK (typ 1.5 µs) and tUVLO2MSK (typ 2.9 µs) are set on both the input-side and the output-side. After the UVLO on Input-side is released, the input signal will take effect from the time after the input signal switches. INA H INB L VUVLO1H VUVLO1L VCC1 OUT tUVLO1MSK Figure 4. Timing Chart of Input-side UVLO Function H INA L H INB L VCC2 VUVLO2H VUVLO2L OUT H Hi-Z L tUVLO2MSK Figure 5. Timing Chart of Output-side UVLO Function www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Description of Functions and Examples of Constant Setting - continued 3) Over-Voltage Protect (OVP) Function The BM61S40RFV-C incorporates the Over-Voltage Protect (OVP) function on the output-side. When the power supply voltage exceeds the OVP ON voltage (typ 21.5 V), the OUT pin will output the “L” signal. In addition, to prevent malfunctions due to noises, a mask time of tOVPMSK (typ 10 µs) is set. After the OVP is released, OUT pin becomes the logic according to the input logic H INA L H INB L VOVPH VOVPL VCC2 H tOVPMSK OUT L Figure 6. Timing Chart of OVP Function 4) I/O Condition Table Input No. Output Status VCC1 VCC2 INB INA OUT MC 1 VCC1 UVLO UVLO X X X L L 2 VCC2 UVLO X UVLO X X L L 3 VCC2 OVP X OVP X X L L 4 INB Active No UVLO No UVLO No OVP H X L L 5 Normal Operation L Input No UVLO No UVLO No OVP L L L L 6 Normal Operation H input No UVLO No UVLO No OVP L H H Hi-Z X: Don't care www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Absolute Maximum Ratings Parameter Symbol Input-side Supply Voltage Limits (Note 3) VCC1 Output-side Supply Voltage -0.3 to +7.0 VCC2 INA Pin Input Voltage -0.3 to +30.0 VINA INB Pin Input Voltage VINB OUT Pin Output Current (Peak 10µs) Storage Temperature Range Maximum Junction Temperature Unit V (Note 4) V -0.3 to +VCC1+0.3 or +7.0 (Note 3) V -0.3 to +VCC1+0.3 or +7.0 (Note 3) V IOUTPEAK self limited A Tstg -55 to +150 °C Tjmax +150 °C (Note 3) Relative to GND1. (Note 4) Relative to GND2. Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance (Note 5) Parameter Symbol Thermal Resistance (Typ) 1s (Note 7) (Note 8) 2s2p Unit SSOP-B10W Input-side Junction to Ambient Output-side Junction to Ambient Input-side Junction to Top Characterization Parameter (Note 6) Output-side Junction to Top Characterization Parameter (Note 6) θJA1 172.1 101.8 °C/W θJA2 180.2 108.9 °C/W ΨJT1 32 27 °C/W ΨJT2 82 60 °C/W (Note 5) Based on JESD51-2A (Still-Air) (Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 7) Using a PCB board based on JESD51-3. (Note 8) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Recommended Operating Ratings Parameter Symbol Min Max Units (Note 9) 4.5 5.5 V (Note 10) 16 20 V -40 125 °C Input-side Supply Voltage VCC1 Output-side Supply Voltage VCC2 Operating Temperature Topr (Note 9) Relative to GND1. (Note 10) Relative to GND2. Insulation Related Characteristics Basic Insulation Requirements according to VDE0884-11(pending) Parameter Symbol Insulation Classification Per EN 60664-1, Table 1 For Rated Main Voltage< 150Vrms For Rated Main Voltage< 300Vrms For Rated Main Voltage< 450Vrms For Rated Main Voltage< 600Vrms Climatic Classification Pollution Decree(EN 60664-1) Characteristic Units Rated Impulse Voltage I - IV I - IV I - III I - III - 40/125/21 - 2 - Minimum External Clearance CLR 8.1 mm Minimum External Creepage CPG 8.1 mm 0.012 mm - Minimum Internal Gap (Internal Clearance) Minimum Comparative Tracking Index CTI >400 Minimum Repetitive Insulation Voltage VIORM 891 VPR 1671 Input to Output Test Voltage, Method b VIORM * 1.875= VPR, Productive Test, tm = 1s, Partial Discharge < 5pC Vpeak Surge Isolation Voltage VIOSM 6000 Highest Allowable Voltage, 1min VIOTM 5300 RIO >10 Symbol Characteristic Units Insulation Withstand Voltage / 1min VISO 3750 Vrms Insulation Test Voltage / 1s VISO 4500 Vrms Insulation Resistance at TS, VIO = 500V 9 Ω Recognized under UL 1577 Description www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C UL1577 Ratings Table Following values are described in UL Report. Parameter Values Units Side 1 (Input Side) Circuit Current 0.4 mA VCC1=5.0V, OUT=L Side 2 (Output Side) Circuit Current 0.7 mA VCC2=15V, OUT=L 2 mW VCC1=5.0V, OUT=L Side 2 (Output Side) Consumption Power 12.6 mW VCC2=15V, OUT=L Isolation Voltage 3750 Vrms Maximum Operating (Ambient) Temperature 125 °C Maximum Junction Temperature 150 °C Maximum Storage Temperature 150 °C Maximum Data Transmission Rate 8.33 MHz Side 1 (Input Side) Consumption Power www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/25 Conditions TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Electrical Characteristics (Unless otherwise specified Ta=-40°C to +125°C, VCC1=4.5V to 5.5V, VCC2=16V to 20V) Parameter Symbol Min Typ Max Unit General Input-side Circuit Current 1 ICC11 0.2 0.4 1.0 mA INA=L,INB=H Input-side Circuit Current 2 Output-side Circuit Current 1 ICC12 ICC21 1.0 0.30 2.0 0.70 4.0 1.20 mA mA INA=100kHz, Duty=50% OUT=L Output-side Circuit Current 2 Logic Block Logic High Level Input Voltage Logic Low Level Input Voltage ICC22 0.22 0.52 0.90 mA OUT=H VINH VINL 2.0 0 - VCC1 0.8 V V INA, INB INA, INB Logic Pull-down Resistance Logic Pull-up Resistance RIND RINU 25 25 50 50 100 100 kΩ kΩ INA INB Logic Input Minimum Pulse Width tINMIN 60 - - ns INA, INB RONH RONL 0.3 0.15 0.67 0.45 1.5 0.98 Ω Ω OUT Maximum Current (Source) IOUTMAXH 4.0 - - A OUT Maximum Current (Sink) IOUTMAXL 4.0 - - A tPONA 45 55 65 ns IOUT=-40mA IOUT=40mA VCC2=18 V, Guaranteed by Design VCC2=18 V, Guaranteed by Design INA=PWM, INB=L tPONB tPOFFA 45 45 55 55 65 65 ns ns INA=H, INB=PWM INA=PWM, INB=L tPOFFB tPDISTA 45 -10 55 0 65 +10 ns ns INA=H, INB=PWM tPOFFA – tPONA tPDISTB Tsk-pp -10 - 0 - +10 20 ns ns tPOFFB – tPONB tRISE tFALL 0.15 15 15 0.45 0.98 ns ns Ω 2 nF between OUT-GND2 1.8 2 2.2 V CM 100 - - kV/µs VCC1 UVLO OFF Voltage VCC1 UVLO ON Voltage VUVLO1H VUVLO1L 3.95 3.75 4.2 4.0 4.45 4.25 V V VCC1 UVLO Mask Time VCC2 UVLO OFF Voltage tUVLO1MSK VUVLO2H 0.4 14.6 1.5 15.0 5.0 15.4 µs V VCC2 UVLO ON Voltage VUVLO2L 14.1 14.5 14.9 V VCC2 UVLO Mask Time tUVLO2MSK 1.0 2.9 5.0 µs VCC2 OVP OFF Voltage VCC2 OVP ON Voltage VOVPL VOVPH 20.6 21.1 21.0 21.5 21.4 21.9 V V VCC2 OVP Mask Time tOVPMSK 3.0 10.0 20.0 µs Conditions Output OUT ON Resistance (Source) OUT ON Resistance (Sink) Turn ON Time Turn OFF Time Propagation Distortion Part to Part Skew Rise Time Fall Time MC ON Resistance MC ON Threshold Voltage RONMC VMCON Common Mode Transient Immunity 2 nF between OUT-GND2 IMC=40 mA Guaranteed by Design Protection Functions INA VINL VINH VINH INB tPONA VINL tPONB tPOFFB 90% 90% OUT 10% tRISE tFALL tPOFFA 90% 90% tRISE tFALL 10% 10% 10% Figure 7. Timing Chart of IN-OUT www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C 1.00 1.00 0.90 0.90 Input-side Current 1:ICC11 [mA] Input-side Current 1:ICC11 [mA] Typical Performance Curves 0.80 0.70 Ta=+125°C 0.60 0.50 0.40 0.80 0.70 0.60 0.50 0.40 0.30 0.30 Ta=-40°C VCC1=4.5V Ta=+25°C 0.20 0.20 4.50 4.75 5.00 5.25 Input-side Supply Voltage:VCC1[V] -40 5.50 -20 0 20 40 60 80 100 120 Temperature: Ta [°C] Figure 8. Input-side Circuit Current 1 vs Input-side Supply Voltage Figure 9. Input-side Circuit Current 1 vs Temperature 4.00 4.00 Input-side Circuit Current 2:ICC12 [mA] Input-side Circuit Current 2:ICC12 [mA] VCC1=5.5V VCC1=5.0V 3.50 3.50 Ta=+125°C 3.00 VCC1=5.5V 3.00 2.50 2.50 2.00 2.00 1.50 VCC1=5.0V 1.50 Ta=+25°C VCC1=4.5V Ta=-40°C 1.00 1.00 4.50 4.75 5.00 5.25 Input-side Supply Voltage:VCC1[V] 5.50 Figure 10. Input-side Circuit Current 2 vs Input-side Supply Voltage (At INA=100 kHz, Duty=50 %) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/25 -40 -20 0 20 40 60 80 100 120 Temperature: Ta [°C] Ta [°C] Figure 11. Input-side Circuit Current 2 vs Temperature (At INA=100 kHz, Duty=50 %) TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C 1.20 1.20 1.10 1.10 Output-side Circuit Current 1:ICC21 [mA] Output-side Circuit Current 1:ICC21 [mA] Typical Performance Curves - continued 1.00 1.00 Ta=+125°C 0.90 0.90 VCC2=20V 0.80 0.80 0.70 0.70 0.60 0.60 0.50 Ta=-40°C VCC2=18V 0.50 Ta=+25°C VCC2=16V 0.40 0.40 0.30 0.30 16 17 18 19 -40 20 -20 0 Figure 12. Output-side Circuit Current 1 vs Output-side Supply Voltage (At OUT=L) 40 60 80 100 120 Figure 13. Output-side Circuit Current 1 vs Temperature (At OUT=L) 0.90 0.80 Output-side Circuit Current 2:ICC22 [mA] 0.90 Output-side Circuit Current 2:ICC22 [mA] 20 Temperature: Ta [°C] Output-side Supply Voltage:VCC2[V] Ta=+125°C 0.70 0.60 0.50 0.40 Ta=-40°C Ta=+25°C 0.30 0.20 0.80 VCC2=20V 0.70 0.60 0.50 VCC2=16V 0.40 VCC2=18V 0.30 0.20 16 17 18 19 20 Output-side Supply Voltage:VCC2[V] -20 0 20 40 60 80 100 120 Temperature: Ta [°C] Ta [°C] Figure 15 Output-side Circuit Current 2 vs Temperature (At OUT=H) Figure 14.Output-side Circuit Current 2 vs Output-side Supply Voltage (At OUT=H) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -40 13/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Typical Performance Curves - continued 2.0 24 Ta=-40°C 1.8 Ta=+25°C Ta=+125°C 20 H level Logic High/Low Level Input Voltage:VINH/VINL[V] VCC1=5V Output Voltage [V] 1.6 1.4 1.2 L level 1.0 Ta=+25°C Ta=-40°C 16 12 8 Ta=+125°C 4 0.8 4.50 4.75 5.00 5.25 0 5.50 0 1 Input-side Supply Voltage:VCC1[V] 3 4 5 Logic Level Input Voltage :VINH/L[V] Figure 16. Logic High/Low Level Input Voltage vs Input-side Supply Voltage Figure 17.Output Voltage vs Logic Level Input Voltage (INA) (VCC1=5 V, VCC2=18 V, Ta=25 °C) 50 Logic Input Minimum Pulse Width:tINMIN [ns] 100 Logic Pull-up/down Resistance:R IND/INL[kΩ] 2 Logic Pull-up VCC1=4.5V VCC1=5V VCC1=5.5V 75 50 Logic Pull-down VCC1=4.5V VCC1=5V VCC1=5.5V 25 VCC1=4.5V VCC1=5V VCC1=5.5V 40 30 20 10 0 -40 -20 0 20 40 60 80 100 120 -20 0 20 40 60 80 100 120 Temperature: Ta [°C] Temperature: Ta [°C] Ta [°C] Figure 18 Logic Pull-up/down Resistance vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -40 Figure 19 Logic Input Minimum Pulse Width vs Temperature 14/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Typical Performance Curves - continued 1.0 OUT ON Resistance (Sink):RONL [Ω] OUT ON Resistance (Source): RONH [Ω] 1.0 0.8 0.6 0.4 VCC2=16V VCC2=18V VCC2=20V 0.2 0.0 0.8 0.6 0.4 VCC2=16V VCC2=18V VCC2=20V 0.2 0.0 -40 -20 0 20 40 60 80 100 120 -40 Temperature: Ta [°C] -20 0 20 40 60 80 100 120 Temperature: Ta [°C] Ta [°C] Figure 21. OUT ON Resistance (Sink) vs Temperature Figure 20. OUT ON Resistance (Source) vs Temperature 65 65 VCC2=20V Turn OFF Time:tPOFFA [ns] Turn ON Time:tPONA [ns] 60 55 VCC2=18V 50 VCC2=16V 60 VCC2=20V 55 VCC2=18V 50 VCC2=16V 45 45 -40 -20 0 20 40 60 80 100 120 Temperature: Ta [°C] -20 0 20 40 60 80 100 120 Temperature: Ta [°C] Figure 22 Turn ON Time vs Temperature (INA=PWM, INB=L) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -40 Figure 23 Turn OFF Time vs Temperature (INA=PWM, INB=L) 15/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Typical Performance Curves - continued 65 VCC2=20V 60 Turn OFF Time:tPOFFB [ns] Turn ON Time:tPONB [ns] 65 55 VCC2=18V 50 VCC2=16V 45 60 VCC2=20V 55 VCC2=18V 50 VCC2=16V 45 -40 -20 0 20 40 60 80 100 120 -40 -20 0 Temperature: Ta [°C] 40 60 80 100 120 Temperature: Ta [°C] Figure 24. Turn ON Time vs Temperature (INA=H, INB=PWM) Figure 25. Turn OFF Time vs Temperature (INA=H, INB=PWM) 2.2 MC ON Threshold Voltage:VMCON [V] 1.0 MC ON Resistance:R ONMC[Ω] 20 0.8 0.6 0.4 VCC2=16V VCC2=18V VCC2=20V 0.2 2.1 2.0 VCC2=16V VCC2=18V VCC2=20V 1.9 1.8 0.0 -40 -20 0 20 40 60 80 100 120 Temperature: Ta [°C] -20 0 20 40 60 80 100 120 Temperature: Ta [°C] Figure 26. MC ON Resistance vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -40 Figure 27. MC ON Threshold Voltage vs Temperature 16/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Typical Performance Curves - continued 5 VCC1 UVLO Mask Time:tUVLO1MSK [µs] VCC1 UVLO ON/OFF Voltage:VUVLO1H/L [V] 4.40 4.30 4.20 4.10 VUVLO1H 4.00 3.90 4 3 2 1 VUVLO1L 0 3.80 -40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120 Temperature: Ta [°C] Temperature: Ta [°C] Figure 28 VCC1 UVLO ON/OFF Voltage vs Temperature Figure 29 VCC1 UVLO Mask Time vs Temperature 5 VCC2 UVLO Mask Time:tUVLO2MSK [µs] VCC2 UVLO ON/OFF Voltage:VUVLO2H/L [V] 15.5 15.3 15.1 14.9 VUVLO2H 14.7 VUVLO2L 14.5 14.3 4 3 2 1 0 -40 -20 0 20 40 60 80 100 120 Temperature: Ta [°C] -20 0 20 40 60 80 100 120 Temperature: Ta [°C] Figure 30 VCC2 UVLO ON/OFF Voltage vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -40 Figure 31 VCC2 UVLO Mask Time vs Temperature 17/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C VCC2 OVP Mask Time:tOVPMSK [µs] VCC2 OVP ON/OFF Voltage:VOVPH/L [V] Typical Performance Curves - continued 21.9 21.7 21.5 VOVPH 21.3 VOVPL 21.1 20.9 19 17 15 13 11 9 7 20.7 5 20.5 3 -40 -20 0 20 40 60 80 100 120 -20 0 20 40 60 80 100 120 Temperature: Ta [°C] Temperature: Ta [°C] Figure 32 VCC2 OVP ON/OFF Voltage vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -40 Figure 33 VCC2 OVP Mask Time vs Temperature 18/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Selection of Components Externally Connected GND1 GND2 VCC1 VCC2 R1 INA OUT INB MC GND1 GND2 Figure 34. Driving SiC MOSFET GND1 GND2 VCC1 VCC2 Q1 R1 OUT INA R1 D1 Q2 MC INB GND1 GND2 Figure 35. Driving SiC MOSFET with Buffer Circuit Recommended Parts Manufacturer Element Part Number R1 ROHM Resistor LTR18EZP,LTR50UZP Q1 ROHM NPN Transistor 2SCR542PFRA Q2 ROHM PNP Transistor 2SAR542PFRA D1 ROHM Diode RBR3MM30ATF,RBR5LAM30ATF www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C I/O Equivalence Circuits Name Pin No. I/O Equivalence Circuits Function VCC2 OUT OUT 1 Output Pin GND2 VCC2 MC MC 2 Miller Clamp pin GND2 VCC1 INA INA 3 Control Input pin A GND1 VCC1 INB INB 4 Control Input pin B GND1 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Operational Notes – continued 10. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 11. Regarding the Input Pin of the IC This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Figure 36. Example of IC structure 12. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Ordering Information B M 6 1 S Part Number 4 0 R F V Package FV: SSOP-B10W - CE2 Product class C: for Automotive applications Packaging and forming specification E2: Embossed tape and reel Marking Diagram SSOP-B10W (TOP VIEW) Pin 1 Mark BM61S40R Part Number Marking LOT Number www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Physical Dimension and Packing Information Package Name SSOP-B10W 包装仕様だけ最新のものに更新した外形寸法図を添付しておりますので そちらに差し替えをお願いします www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 24/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 BM61S40RFV-C Revision History Date Revision 14.May.2018 001 30.Mar.2020 002 Changes New Release Page 1: Changed Features Before: UL1577(pending) → After: UL1577 Recognized Page 9: Corrected Insulation Related Characteristic Before: Reinforced Insulation → After: Basic Insulation Before: VDE0884-10(pending) → After: VDE0884-11(pending) Before: Recognized under UL 1577(pending) → After: Recognized under UL 1577 Before: Vpk → After: Vpeak Corrected Highest Allowable Voltage, 1min Before: 3750Vrms → After: 5300Vpeak Page 10: Added UL1577 Rating Table www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 25/25 TSZ02201-0818ACH00400-1-2 30.Mar.2020 Rev.002 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001