Datasheet
Gate Driver Providing Galvanic Isolation Series
Isolation voltage 3750Vrms
1ch Gate Driver Providing Galvanic Isolation
BM61S40RFV-C
Key Specifications
General Description
The BM61S40RFV-C is a gate driver with an isolation
voltage of 3750 Vrms, I/O delay time of 65ns, and
minimum input pulse width of 60ns. It incorporates the
Under-Voltage Lockout (UVLO) function, Miller clamp
function and Over-Voltage Protect (OVP) function.
Features
Isolation Voltage:
Maximum Gate Drive Voltage:
I/O Delay Time:
Minimum Input Pulse Width:
Output Current
3750 Vrms
20 V
65 ns(Max)
60 ns
4A
(Note 1 )
AEC-Q100 Qualified
Providing Galvanic Isolation
Active Miller Clamping
Under-Voltage Lockout Function
Over-Voltage Protect Function
UL1577 Recognized: File E356010
Package
W(Typ) x D(Typ) x H(Max)
3.5 mm x10.2 mm x 1.9 mm
SSOP-B10W
(Note 1) Grade1
Applications
SiC MOSFET Gate Drive
SSOP-B10W
Typical Application Circuits
Isolation
GND2
GND1
VCC1
INA
INB
UVLO2
UVLO1
Pulse
Generator
OVP
VCC2
OUT
Logic
MC
CVCC1
CVCC2
-
GND1
+
GND2
2V
Pin 1
Figure 1. For Driving SiC MOSFET without Negative Power Supply
〇Product structure : Silicon integrated circuit
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications........................................................................................................................................................................... 1
Package
.................................................................................................................................................................................. 1
Typical Application Circuits ............................................................................................................................................................. 1
Contents ......................................................................................................................................................................................... 2
Recommended Range of External Constants ................................................................................................................................. 3
Pin Configurations .......................................................................................................................................................................... 3
Pin Descriptions .............................................................................................................................................................................. 3
Description of Functions and Examples of Constant Setting .......................................................................................................... 5
Absolute Maximum Ratings ............................................................................................................................................................ 8
Thermal Resistance ........................................................................................................................................................................ 8
Recommended Operating Ratings .................................................................................................................................................. 9
Insulation Related Characteristics .................................................................................................................................................. 9
Electrical Characteristics............................................................................................................................................................... 11
Typical Performance Curves ......................................................................................................................................................... 12
Figure 8. Input-side Circuit Current 1 vs Input-side Supply Voltage .......................................................................................... 12
Figure 9. Input-side Circuit Current 1 vs Temperature ............................................................................................................... 12
Figure 10. Input-side Circuit Current 2 vs Input-side Supply Voltage (At INA=100 kHz, Duty=50 %) ........................................ 12
Figure 11. Input-side Circuit Current 2 vs Temperature (At INA=100 kHz, Duty=50 %)............................................................. 12
Figure 12. Output-side Circuit Current 2 vs Output-side Supply Voltage (At OUT=L) ............................................................... 13
Figure 13. Output-side Circuit Current 2 vs Temperature (At OUT=L) ....................................................................................... 13
Figure 14.Output-side Circuit Current 2 vs Output-side Supply Voltage (At OUT=H) ................................................................ 13
Figure 15 Output-side Circuit Current 2 vs Temperature (At OUT=H) ....................................................................................... 13
Figure 16. Logic High/Low Level Input Voltage ......................................................................................................................... 14
Figure 17.Output Voltage vs Logic Level Input Voltage (INA) .................................................................................................... 14
Figure 18 Logic Pull-up/down Resistance vs Temperature ........................................................................................................ 14
Figure 19 Logic Input Minimum Pulse Width vs Temperature ................................................................................................... 14
Figure 20. OUT ON Resistance (Source) vs Temperature ........................................................................................................ 15
Figure 21. OUT ON Resistance (Sink) vs Temperature ............................................................................................................. 15
Figure 22 Turn ON Time vs Temperature .................................................................................................................................. 15
Figure 23 Turn OFF Time vs Temperature ................................................................................................................................ 15
Figure 24. Turn ON Time vs Temperature (INA=H, INB=PWM) ................................................................................................ 16
Figure 25. Turn OFF Time vs Temperature (INA=H, INB=PWM) ............................................................................................... 16
Figure 26. MC ON Resistance vs Temperature ......................................................................................................................... 16
Figure 27. MC ON Threshold Voltage vs Temperature .............................................................................................................. 16
Figure 28 VCC1 UVLO ON/OFF Voltage vs Temperature ........................................................................................................... 17
Figure 29 VCC1 UVLO Mask Time vs Temperature .................................................................................................................... 17
Figure 30 VCC2 UVLO ON/OFF Voltage vs Temperature ........................................................................................................... 17
Figure 31 VCC2 UVLO Mask Time vs Temperature .................................................................................................................... 17
Figure 32 VCC2 OVP ON/OFF Voltage vs Temperature ............................................................................................................. 18
Figure 33 VCC2 OVP Mask Time vs Temperature....................................................................................................................... 18
Selection of Components Externally Connected ........................................................................................................................... 19
I/O Equivalence Circuits................................................................................................................................................................ 20
Operational Notes ......................................................................................................................................................................... 21
1.
Reverse Connection of Power Supply ............................................................................................................................ 21
2.
Power Supply Lines ........................................................................................................................................................ 21
3.
Ground Voltage............................................................................................................................................................... 21
4.
Ground Wiring Pattern .................................................................................................................................................... 21
5.
Recommended Operating Conditions............................................................................................................................. 21
6.
Inrush Current................................................................................................................................................................. 21
7.
Operation Under Strong Electromagnetic Field .............................................................................................................. 21
8.
Testing on Application Boards ........................................................................................................................................ 21
9.
Inter-pin Short and Mounting Errors ............................................................................................................................... 21
10.
Unused Input Pins .......................................................................................................................................................... 22
11.
Regarding the Input Pin of the IC ................................................................................................................................... 22
12.
Ceramic Capacitor .......................................................................................................................................................... 22
Ordering Information ..................................................................................................................................................................... 23
Marking Diagram .......................................................................................................................................................................... 23
Physical Dimension and Packing Information ............................................................................................................................... 24
Revision History ............................................................................................................................................................................ 25
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Recommended Range of External Constants
Recommended Value
Pin Name
Symbol
Unit
Min
Typ
Max
1.0
-
µF
-
µF
VCC1
CVCC1
0.1
VCC2
CVCC2
0.01
-
(Note 2)
(Note 2) Value according to the load
Pin Configurations
(TOP VIEW)
GND1
6
5
GND2
VCC1
7
4
VCC2
INA
8
3
OUT
INB
9
2
MC
GND1
10
1
GND2
Pin Descriptions
Pin No.
Pin Name
1
GND2
2
MC
Miller clamp pin
3
OUT
Output pin
4
VCC2
Output-side power supply pin
5
GND2
Output-side ground pin
6
GND1
Input-side ground pin
7
VCC1
Input-side power supply pin
8
INA
Control input A pin
9
INB
Control input B pin
10
GND1
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Function
Output-side ground pin
Input-side ground pin
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Pin Descriptions - continued
1) VCC1 (Input-side Power Supply Pin)
The VCC1 pin is a power supply pin on the input side. To suppress voltage fluctuations due to the current to drive internal
transformers, connect a bypass capacitor between the VCC1 and the GND1 pins.
2) GND1 (Input-side Ground Pin)
The GND1 pin is a ground pin on the input side.
3) VCC2 (Output-side Power Supply Pin)
The VCC2 pin is a power supply pin on the output side. To reduce voltage fluctuations due to OUT pin output current,
connect a bypass capacitor between the VCC2 and the GND2 pins.
4) GND2 (Output-side Ground Pin)
The GND2 pin is a ground pin on the output side.
5) INA, INB (Control Input A/B Pin)
The INA and INB pins are used to determine output logic.
INB
INA
OUT
H
L
L
H
H
L
L
L
L
L
H
H
6) OUT (Output Pin)
The OUT pin is used to drive the gate of a power device.
7) MC (Miller Clamp Pin)
The MC pin is for preventing the increase in gate voltage due to the Miller current of the power device connected to the
OUT pin. If the Miller Clamp function is not used, short-circuit the MC pin to the GND2 pin.
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Description of Functions and Examples of Constant Setting
1) Miller Clamp Function
When the INA=L or INB=H and OUT pin voltage < VMCON (typ 2V), the internal MOSFET of the MC pin is turned ON.
INA
INB
MC
Internal MOSFET of the MC Pin
L
X
Less Than VMCON
ON
X
H
Less Than VMCON
ON
H
L
X
OFF
VCC2
OUT
GATE
Logic
MC
+
VMCON
GND2
Figure 2. Block Diagram of Miller Clamp Function
-
Figure 3. Timing Chart of Miller Clamp Function
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Description of Functions and Examples of Constant Setting - continued
2) Under-Voltage Lockout (UVLO) Function
The BM61S40RFV-C incorporates the Under-Voltage Lockout (UVLO) function both on the Input-side and the output-side.
When the power supply voltage drops to the UVLO ON voltage (input-side typ 4.0 V, output-side 14.5 V), the OUT pin will
output the “L” signal. In addition, to prevent malfunctions due to noises, a mask time of tUVLO1MSK (typ 1.5 µs) and tUVLO2MSK
(typ 2.9 µs) are set on both the input-side and the output-side. After the UVLO on Input-side is released, the input signal
will take effect from the time after the input signal switches.
INA
H
INB
L
VUVLO1H
VUVLO1L
VCC1
OUT
tUVLO1MSK
Figure 4. Timing Chart of Input-side UVLO Function
H
INA
L
H
INB
L
VCC2
VUVLO2H
VUVLO2L
OUT
H
Hi-Z
L
tUVLO2MSK
Figure 5. Timing Chart of Output-side UVLO Function
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Description of Functions and Examples of Constant Setting - continued
3) Over-Voltage Protect (OVP) Function
The BM61S40RFV-C incorporates the Over-Voltage Protect (OVP) function on the output-side. When the power supply
voltage exceeds the OVP ON voltage (typ 21.5 V), the OUT pin will output the “L” signal. In addition, to prevent
malfunctions due to noises, a mask time of tOVPMSK (typ 10 µs) is set. After the OVP is released, OUT pin becomes the logic
according to the input logic
H
INA
L
H
INB
L
VOVPH
VOVPL
VCC2
H
tOVPMSK
OUT
L
Figure 6. Timing Chart of OVP Function
4) I/O Condition Table
Input
No.
Output
Status
VCC1
VCC2
INB
INA
OUT
MC
1
VCC1 UVLO
UVLO
X
X
X
L
L
2
VCC2 UVLO
X
UVLO
X
X
L
L
3
VCC2 OVP
X
OVP
X
X
L
L
4
INB Active
No UVLO
No UVLO
No OVP
H
X
L
L
5
Normal Operation L Input
No UVLO
No UVLO
No OVP
L
L
L
L
6
Normal Operation H input
No UVLO
No UVLO
No OVP
L
H
H
Hi-Z
X: Don't care
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Absolute Maximum Ratings
Parameter
Symbol
Input-side Supply Voltage
Limits
(Note 3)
VCC1
Output-side Supply Voltage
-0.3 to +7.0
VCC2
INA Pin Input Voltage
-0.3 to +30.0
VINA
INB Pin Input Voltage
VINB
OUT Pin Output Current (Peak 10µs)
Storage Temperature Range
Maximum Junction Temperature
Unit
V
(Note 4)
V
-0.3 to +VCC1+0.3 or +7.0
(Note 3)
V
-0.3 to +VCC1+0.3 or +7.0
(Note 3)
V
IOUTPEAK
self limited
A
Tstg
-55 to +150
°C
Tjmax
+150
°C
(Note 3) Relative to GND1.
(Note 4) Relative to GND2.
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance (Note 5)
Parameter
Symbol
Thermal Resistance (Typ)
1s
(Note 7)
(Note 8)
2s2p
Unit
SSOP-B10W
Input-side Junction to Ambient
Output-side Junction to Ambient
Input-side Junction to Top Characterization Parameter
(Note 6)
Output-side Junction to Top Characterization Parameter
(Note 6)
θJA1
172.1
101.8
°C/W
θJA2
180.2
108.9
°C/W
ΨJT1
32
27
°C/W
ΨJT2
82
60
°C/W
(Note 5) Based on JESD51-2A (Still-Air)
(Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 7) Using a PCB board based on JESD51-3.
(Note 8) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
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Recommended Operating Ratings
Parameter
Symbol
Min
Max
Units
(Note 9)
4.5
5.5
V
(Note 10)
16
20
V
-40
125
°C
Input-side Supply Voltage
VCC1
Output-side Supply Voltage
VCC2
Operating Temperature
Topr
(Note 9) Relative to GND1.
(Note 10) Relative to GND2.
Insulation Related Characteristics
Basic Insulation Requirements according to VDE0884-11(pending)
Parameter
Symbol
Insulation Classification Per EN 60664-1, Table 1
For Rated Main Voltage< 150Vrms
For Rated Main Voltage< 300Vrms
For Rated Main Voltage< 450Vrms
For Rated Main Voltage< 600Vrms
Climatic Classification
Pollution Decree(EN 60664-1)
Characteristic
Units
Rated Impulse Voltage
I - IV
I - IV
I - III
I - III
-
40/125/21
-
2
-
Minimum External Clearance
CLR
8.1
mm
Minimum External Creepage
CPG
8.1
mm
0.012
mm
-
Minimum Internal Gap (Internal Clearance)
Minimum Comparative Tracking Index
CTI
>400
Minimum Repetitive Insulation Voltage
VIORM
891
VPR
1671
Input to Output Test Voltage, Method b
VIORM * 1.875= VPR, Productive Test, tm = 1s,
Partial Discharge < 5pC
Vpeak
Surge Isolation Voltage
VIOSM
6000
Highest Allowable Voltage, 1min
VIOTM
5300
RIO
>10
Symbol
Characteristic
Units
Insulation Withstand Voltage / 1min
VISO
3750
Vrms
Insulation Test Voltage / 1s
VISO
4500
Vrms
Insulation Resistance at TS, VIO = 500V
9
Ω
Recognized under UL 1577
Description
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UL1577 Ratings Table
Following values are described in UL Report.
Parameter
Values
Units
Side 1 (Input Side) Circuit Current
0.4
mA
VCC1=5.0V, OUT=L
Side 2 (Output Side) Circuit Current
0.7
mA
VCC2=15V, OUT=L
2
mW
VCC1=5.0V, OUT=L
Side 2 (Output Side) Consumption Power
12.6
mW
VCC2=15V, OUT=L
Isolation Voltage
3750
Vrms
Maximum Operating (Ambient) Temperature
125
°C
Maximum Junction Temperature
150
°C
Maximum Storage Temperature
150
°C
Maximum Data Transmission Rate
8.33
MHz
Side 1 (Input Side) Consumption Power
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Conditions
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BM61S40RFV-C
Electrical Characteristics
(Unless otherwise specified Ta=-40°C to +125°C, VCC1=4.5V to 5.5V, VCC2=16V to 20V)
Parameter
Symbol
Min
Typ
Max
Unit
General
Input-side Circuit Current 1
ICC11
0.2
0.4
1.0
mA
INA=L,INB=H
Input-side Circuit Current 2
Output-side Circuit Current 1
ICC12
ICC21
1.0
0.30
2.0
0.70
4.0
1.20
mA
mA
INA=100kHz, Duty=50%
OUT=L
Output-side Circuit Current 2
Logic Block
Logic High Level Input Voltage
Logic Low Level Input Voltage
ICC22
0.22
0.52
0.90
mA
OUT=H
VINH
VINL
2.0
0
-
VCC1
0.8
V
V
INA, INB
INA, INB
Logic Pull-down Resistance
Logic Pull-up Resistance
RIND
RINU
25
25
50
50
100
100
kΩ
kΩ
INA
INB
Logic Input Minimum Pulse Width
tINMIN
60
-
-
ns
INA, INB
RONH
RONL
0.3
0.15
0.67
0.45
1.5
0.98
Ω
Ω
OUT Maximum Current (Source)
IOUTMAXH
4.0
-
-
A
OUT Maximum Current (Sink)
IOUTMAXL
4.0
-
-
A
tPONA
45
55
65
ns
IOUT=-40mA
IOUT=40mA
VCC2=18 V,
Guaranteed by Design
VCC2=18 V,
Guaranteed by Design
INA=PWM, INB=L
tPONB
tPOFFA
45
45
55
55
65
65
ns
ns
INA=H, INB=PWM
INA=PWM, INB=L
tPOFFB
tPDISTA
45
-10
55
0
65
+10
ns
ns
INA=H, INB=PWM
tPOFFA – tPONA
tPDISTB
Tsk-pp
-10
-
0
-
+10
20
ns
ns
tPOFFB – tPONB
tRISE
tFALL
0.15
15
15
0.45
0.98
ns
ns
Ω
2 nF between OUT-GND2
1.8
2
2.2
V
CM
100
-
-
kV/µs
VCC1 UVLO OFF Voltage
VCC1 UVLO ON Voltage
VUVLO1H
VUVLO1L
3.95
3.75
4.2
4.0
4.45
4.25
V
V
VCC1 UVLO Mask Time
VCC2 UVLO OFF Voltage
tUVLO1MSK
VUVLO2H
0.4
14.6
1.5
15.0
5.0
15.4
µs
V
VCC2 UVLO ON Voltage
VUVLO2L
14.1
14.5
14.9
V
VCC2 UVLO Mask Time
tUVLO2MSK
1.0
2.9
5.0
µs
VCC2 OVP OFF Voltage
VCC2 OVP ON Voltage
VOVPL
VOVPH
20.6
21.1
21.0
21.5
21.4
21.9
V
V
VCC2 OVP Mask Time
tOVPMSK
3.0
10.0
20.0
µs
Conditions
Output
OUT ON Resistance (Source)
OUT ON Resistance (Sink)
Turn ON Time
Turn OFF Time
Propagation Distortion
Part to Part Skew
Rise Time
Fall Time
MC ON Resistance
MC ON Threshold Voltage
RONMC
VMCON
Common Mode Transient Immunity
2 nF between OUT-GND2
IMC=40 mA
Guaranteed by Design
Protection Functions
INA
VINL
VINH
VINH
INB
tPONA
VINL
tPONB
tPOFFB
90%
90%
OUT
10%
tRISE
tFALL
tPOFFA
90%
90%
tRISE
tFALL
10% 10%
10%
Figure 7. Timing Chart of IN-OUT
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1.00
1.00
0.90
0.90
Input-side Current 1:ICC11 [mA]
Input-side Current 1:ICC11 [mA]
Typical Performance Curves
0.80
0.70
Ta=+125°C
0.60
0.50
0.40
0.80
0.70
0.60
0.50
0.40
0.30
0.30
Ta=-40°C
VCC1=4.5V
Ta=+25°C
0.20
0.20
4.50
4.75
5.00
5.25
Input-side Supply Voltage:VCC1[V]
-40
5.50
-20
0
20
40
60
80
100 120
Temperature: Ta [°C]
Figure 8. Input-side Circuit Current 1 vs
Input-side Supply Voltage
Figure 9. Input-side Circuit Current 1 vs
Temperature
4.00
4.00
Input-side Circuit Current 2:ICC12 [mA]
Input-side Circuit Current 2:ICC12 [mA]
VCC1=5.5V
VCC1=5.0V
3.50
3.50
Ta=+125°C
3.00
VCC1=5.5V
3.00
2.50
2.50
2.00
2.00
1.50
VCC1=5.0V
1.50
Ta=+25°C
VCC1=4.5V
Ta=-40°C
1.00
1.00
4.50
4.75
5.00
5.25
Input-side Supply Voltage:VCC1[V]
5.50
Figure 10. Input-side Circuit Current 2 vs
Input-side Supply Voltage (At INA=100 kHz,
Duty=50 %)
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-40
-20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Ta [°C]
Figure 11. Input-side Circuit Current 2 vs
Temperature (At INA=100 kHz, Duty=50 %)
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1.20
1.20
1.10
1.10
Output-side Circuit Current 1:ICC21 [mA]
Output-side Circuit Current 1:ICC21 [mA]
Typical Performance Curves - continued
1.00
1.00
Ta=+125°C
0.90
0.90
VCC2=20V
0.80
0.80
0.70
0.70
0.60
0.60
0.50
Ta=-40°C
VCC2=18V
0.50
Ta=+25°C
VCC2=16V
0.40
0.40
0.30
0.30
16
17
18
19
-40
20
-20
0
Figure 12. Output-side Circuit Current 1 vs
Output-side Supply Voltage (At OUT=L)
40
60
80
100 120
Figure 13. Output-side Circuit Current 1 vs
Temperature (At OUT=L)
0.90
0.80
Output-side Circuit Current 2:ICC22 [mA]
0.90
Output-side Circuit Current 2:ICC22 [mA]
20
Temperature: Ta [°C]
Output-side Supply Voltage:VCC2[V]
Ta=+125°C
0.70
0.60
0.50
0.40
Ta=-40°C
Ta=+25°C
0.30
0.20
0.80
VCC2=20V
0.70
0.60
0.50
VCC2=16V
0.40
VCC2=18V
0.30
0.20
16
17
18
19
20
Output-side Supply Voltage:VCC2[V]
-20
0
20
40
60
80
100
120
Temperature: Ta [°C]
Ta [°C]
Figure 15 Output-side Circuit Current 2 vs
Temperature (At OUT=H)
Figure 14.Output-side Circuit Current 2 vs
Output-side Supply Voltage (At OUT=H)
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Typical Performance Curves - continued
2.0
24
Ta=-40°C
1.8
Ta=+25°C
Ta=+125°C
20
H level
Logic High/Low Level Input
Voltage:VINH/VINL[V]
VCC1=5V
Output Voltage [V]
1.6
1.4
1.2
L level
1.0
Ta=+25°C
Ta=-40°C
16
12
8
Ta=+125°C
4
0.8
4.50
4.75
5.00
5.25
0
5.50
0
1
Input-side Supply Voltage:VCC1[V]
3
4
5
Logic Level Input Voltage :VINH/L[V]
Figure 16. Logic High/Low Level Input Voltage
vs Input-side Supply Voltage
Figure 17.Output Voltage vs Logic Level Input
Voltage (INA)
(VCC1=5 V, VCC2=18 V, Ta=25 °C)
50
Logic Input Minimum Pulse Width:tINMIN [ns]
100
Logic Pull-up/down Resistance:R IND/INL[kΩ]
2
Logic Pull-up
VCC1=4.5V
VCC1=5V
VCC1=5.5V
75
50
Logic Pull-down
VCC1=4.5V
VCC1=5V
VCC1=5.5V
25
VCC1=4.5V
VCC1=5V
VCC1=5.5V
40
30
20
10
0
-40
-20
0
20
40
60
80
100
120
-20
0
20
40
60
80
100
120
Temperature: Ta [°C]
Temperature: Ta [°C]
Ta [°C]
Figure 18 Logic Pull-up/down Resistance vs
Temperature
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Figure 19 Logic Input Minimum Pulse Width
vs Temperature
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Typical Performance Curves - continued
1.0
OUT ON Resistance (Sink):RONL [Ω]
OUT ON Resistance (Source): RONH [Ω]
1.0
0.8
0.6
0.4
VCC2=16V
VCC2=18V
VCC2=20V
0.2
0.0
0.8
0.6
0.4
VCC2=16V
VCC2=18V
VCC2=20V
0.2
0.0
-40
-20
0
20
40
60
80
100 120
-40
Temperature: Ta [°C]
-20
0
20
40
60
80
100 120
Temperature: Ta [°C]
Ta [°C]
Figure 21. OUT ON Resistance (Sink) vs
Temperature
Figure 20. OUT ON Resistance (Source) vs
Temperature
65
65
VCC2=20V
Turn OFF Time:tPOFFA [ns]
Turn ON Time:tPONA [ns]
60
55
VCC2=18V
50
VCC2=16V
60
VCC2=20V
55
VCC2=18V
50
VCC2=16V
45
45
-40
-20
0
20
40
60
80
100 120
Temperature: Ta [°C]
-20
0
20
40
60
80
100 120
Temperature: Ta [°C]
Figure 22 Turn ON Time vs Temperature
(INA=PWM, INB=L)
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Figure 23 Turn OFF Time vs Temperature
(INA=PWM, INB=L)
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Typical Performance Curves - continued
65
VCC2=20V
60
Turn OFF Time:tPOFFB [ns]
Turn ON Time:tPONB [ns]
65
55
VCC2=18V
50
VCC2=16V
45
60
VCC2=20V
55
VCC2=18V
50
VCC2=16V
45
-40
-20
0
20
40
60
80
100 120
-40
-20
0
Temperature: Ta [°C]
40
60
80
100 120
Temperature: Ta [°C]
Figure 24. Turn ON Time vs Temperature
(INA=H, INB=PWM)
Figure 25. Turn OFF Time vs Temperature
(INA=H, INB=PWM)
2.2
MC ON Threshold Voltage:VMCON [V]
1.0
MC ON Resistance:R ONMC[Ω]
20
0.8
0.6
0.4
VCC2=16V
VCC2=18V
VCC2=20V
0.2
2.1
2.0
VCC2=16V
VCC2=18V
VCC2=20V
1.9
1.8
0.0
-40
-20
0
20
40
60
80
100 120
Temperature: Ta [°C]
-20
0
20
40
60
80
100 120
Temperature: Ta [°C]
Figure 26. MC ON Resistance vs
Temperature
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Figure 27. MC ON Threshold Voltage vs
Temperature
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Typical Performance Curves - continued
5
VCC1 UVLO Mask Time:tUVLO1MSK [µs]
VCC1 UVLO ON/OFF Voltage:VUVLO1H/L [V]
4.40
4.30
4.20
4.10
VUVLO1H
4.00
3.90
4
3
2
1
VUVLO1L
0
3.80
-40
-20
0
20
40
60
80
100
120
-40
-20
0
20
40
60
80
100
120
Temperature: Ta [°C]
Temperature: Ta [°C]
Figure 28 VCC1 UVLO ON/OFF Voltage vs
Temperature
Figure 29 VCC1 UVLO Mask Time vs
Temperature
5
VCC2 UVLO Mask Time:tUVLO2MSK [µs]
VCC2 UVLO ON/OFF Voltage:VUVLO2H/L [V]
15.5
15.3
15.1
14.9
VUVLO2H
14.7
VUVLO2L
14.5
14.3
4
3
2
1
0
-40
-20
0
20
40
60
80
100 120
Temperature: Ta [°C]
-20
0
20
40
60
80
100 120
Temperature: Ta [°C]
Figure 30 VCC2 UVLO ON/OFF Voltage vs
Temperature
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Figure 31 VCC2 UVLO Mask Time vs
Temperature
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VCC2 OVP Mask Time:tOVPMSK [µs]
VCC2 OVP ON/OFF Voltage:VOVPH/L [V]
Typical Performance Curves - continued
21.9
21.7
21.5
VOVPH
21.3
VOVPL
21.1
20.9
19
17
15
13
11
9
7
20.7
5
20.5
3
-40
-20
0
20
40
60
80
100
120
-20
0
20
40
60
80
100 120
Temperature: Ta [°C]
Temperature: Ta [°C]
Figure 32 VCC2 OVP ON/OFF Voltage vs
Temperature
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Figure 33 VCC2 OVP Mask Time vs
Temperature
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Selection of Components Externally Connected
GND1
GND2
VCC1
VCC2
R1
INA
OUT
INB
MC
GND1
GND2
Figure 34. Driving SiC MOSFET
GND1
GND2
VCC1
VCC2
Q1
R1
OUT
INA
R1
D1
Q2
MC
INB
GND1
GND2
Figure 35. Driving SiC MOSFET with Buffer Circuit
Recommended Parts
Manufacturer
Element
Part Number
R1
ROHM
Resistor
LTR18EZP,LTR50UZP
Q1
ROHM
NPN Transistor
2SCR542PFRA
Q2
ROHM
PNP Transistor
2SAR542PFRA
D1
ROHM
Diode
RBR3MM30ATF,RBR5LAM30ATF
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I/O Equivalence Circuits
Name
Pin No.
I/O Equivalence Circuits
Function
VCC2
OUT
OUT
1
Output Pin
GND2
VCC2
MC
MC
2
Miller Clamp pin
GND2
VCC1
INA
INA
3
Control Input pin A
GND1
VCC1
INB
INB
4
Control Input pin B
GND1
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
11. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Figure 36. Example of IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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BM61S40RFV-C
Ordering Information
B
M
6
1
S
Part Number
4
0
R
F
V
Package
FV: SSOP-B10W
-
CE2
Product class
C: for Automotive applications
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SSOP-B10W (TOP VIEW)
Pin 1 Mark
BM61S40R
Part Number Marking
LOT Number
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BM61S40RFV-C
Physical Dimension and Packing Information
Package Name
SSOP-B10W
包装仕様だけ最新のものに更新した外形寸法図を添付しておりますので
そちらに差し替えをお願いします
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Revision History
Date
Revision
14.May.2018
001
30.Mar.2020
002
Changes
New Release
Page 1: Changed Features
Before: UL1577(pending) → After: UL1577 Recognized
Page 9: Corrected Insulation Related Characteristic
Before: Reinforced Insulation
→ After: Basic Insulation
Before: VDE0884-10(pending) → After: VDE0884-11(pending)
Before: Recognized under UL 1577(pending)
→ After: Recognized under UL 1577
Before: Vpk → After: Vpeak
Corrected Highest Allowable Voltage, 1min
Before: 3750Vrms → After: 5300Vpeak
Page 10: Added UL1577 Rating Table
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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