Datasheet
DC Brushless Fan Motor Driver Series
3 Hall Sensor
3 Phase Brushless Motor Pre-driver
BM62300MUV
General Description
Key Specifications
BM62300MUV is pre-driver IC for three-phase brushless
motor driver that supports 24V power supply controlling
the motor driver constructed in external power transistor.
It detects the rotor position on three hall sensors. In
addition, silent operation and low vibration is
implemented by making the output current a sin
waveform.
◼Input Voltage Range
8 V to 28 V
◼External Power Transistor Upper Gate Drive Voltage：
VCC + 7.5 V(Typ)
◼External Power Transistor Lower Gate Drive Voltage：
9.0 V(Typ)
◼Switching Frequency：
40 kHz(Typ)
◼Standby Current：
0.6 mA (Typ)
◼Operating Temperature Range： -25 °C to +85 °C
Features
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
Supports External Power Transistor (Nch+Nch)
Built-in Boost Voltage Circuit
3 Hall Sine Wave 180 degrees Electric Drive
Automatic Lead Angle Settings
Speed Control on PWM Input
Soft Start Function
Number of Pole Selection
Current Limit Function
Built-in Power Save Function
Direction of Rotation Settings
Short Break Limitation
Built-in Several Protection Functions (High-speed
rotation protection, low-speed rotation protection,
over voltage protection (OVLO), under voltage
lock-out (UVLO), thermal shutdown(TSD))
Package
W(Typ) x D(Typ) x H(Max)
5.00 mm x 5.00 mm x 1.00 mm
VQFN032V5050
VQFN032V5050
Application
◼
◼
◼
◼
Fan Motor
Motor for Pump
Ceiling Fan
Other General Consumer Equipment
Typical Application Circuit
24V
0.1µF
1µF
VCC
0.1µF
VREG15
CP1 CP2
UVLO
VREG50
1µF
REG
Internal
Reg
TSD
VG
VREG50
OVLO
UH
PS
HU
VG
Charge
Pump
U
Pre
driver
HUP
U
UL
HUN
VG
HV
HVP
VH
CTL
Logic
HVN
HW
V
Pre
driver
HWP
V
M
VL
HWN
VG
VREG50
WH
VREG50
W
Pre
driver
PWMB
W
WL
VREG50
SS_SEL
Selector
VREG50
POLE_SEL
Selector
RCL
FR
BRK
FGO
External
Power
Supply
TEST
GND
〇Product structure : Silicon integrated circuit
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〇This product has no designed protection against radioactive rays
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Contents
General Description ...................................................................................................................................................................... 1
Features ......................................................................................................................................................................................... 1
Application .................................................................................................................................................................................... 1
Key Specifications ........................................................................................................................................................................ 1
Package ......................................................................................................................................................................................... 1
Typical Application Circuit ........................................................................................................................................................... 1
Pin Configurations ........................................................................................................................................................................ 3
Pin Descriptions ........................................................................................................................................................................... 3
Block Diagram............................................................................................................................................................................... 4
Absolute Maximum Ratings ......................................................................................................................................................... 5
Thermal Resistance ...................................................................................................................................................................... 6
Recommended Operating Conditions......................................................................................................................................... 6
Electrical Characteristics ............................................................................................................................................................. 7
Application Example .................................................................................................................................................................... 9
Typical Performance Curves ...................................................................................................................................................... 10
Description of Function Operations .......................................................................................................................................... 20
Thermal Resistance Model......................................................................................................................................................... 27
I/O Equivalence Circuits ............................................................................................................................................................. 28
Operational Notes ....................................................................................................................................................................... 29
Ordering Information .................................................................................................................................................................. 31
Marking Diagram......................................................................................................................................................................... 31
Physical Dimension and Packing Information ......................................................................................................................... 32
Revision History ......................................................................................................................................................................... 33
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Pin Configurations
CP2
VCC
VG
UH
U
UL
VH
V
(TOP VIEW)
24
23
22
21
20
19
18
17
CP 1
25
16
VL
HWN
26
15
WH
HWP
27
14
W
HVN
28
13
WL
HVP
29
12
FGO
HUN
30
11
RCL
HUP
31
10
GND
N. C .
32
9
1
2
3
4
5
6
7
8
VREG50
VREG15
BRK
FR
POLE_SEL
SS_SEL
PWM
TEST
EXP -PAD
PS
Figure 1. Pin Configurations
Pin Descriptions
Pin
number
Pin name
Pin
number
Pin name
1
VREG50
Standard voltage output
17
V
2
VREG15
Internal power supply output for
logic circuit
18
VH
3
BRK
Brakes control
19
UL
4
FR
Rotation direction setting
20
U
5
POLE_SEL
Setting the number of poles
21
UH
6
SS_SEL
Soft start setting
22
VG
7
PWM
PWM input (positive logic)
23
VCC
8
TEST
Test
24
CP2
9
PS
Power save input
25
CP1
10
GND
Ground
26
HWN
W phase hall input - side input
11
RCL
Output current detection voltage
input
27
HWP
W phase hall input + side input
12
FGO
Rotating speed pulse signal output
28
HVN
V phase hall input - side input
13
WL
29
HVP
V phase hall input + side input
14
W
30
HUN
U phase hall input - side input
15
WH
31
HUP
U phase hall input + side input
16
VL
W phase
Low side pre-driver output
W phase external power transistor
output feedback
W phase
High side pre-driver output
V phase
Low side pre-driver output
32
N.C.
N.C.
Back
side
EXP-PAD
Function
Function
V phase external power
transistor output feedback
V phase
High side pre-driver output
U phase
Low side pre-driver output
U phase external power
transistor output feedback
U phase
High side pre-driver output
Charge pump output
Power supply
Charge pump boost voltage
Capacitor connection
Charge pump boost voltage
Capacitor connection
Connect the EXP-PAD to GND
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Block Diagram
VREG15
CP1 CP2
2pin
VCC
25pin
22pin
23pin
UVLO
VREG50
24pin
VG
Charge
Pump
1pin
REG
Internal
Reg
TSD
VG
OVLO
PS
HUP
HUN
21pin
U
Pre
driver
9pin
31pin
20pin
19pin
30pin
UH
U
UL
VG
HVP
HVN
18pin
29pin
V
Pre
driver
CTL
Logic
28pin
17pin
16pin
HWP
27pin
HWN
26pin
SS_SEL
V
VL
VG
VREG50
PWMB
VH
15pin
W
Pre
driver
7pin
6pin
14pin
13pin
WH
W
WL
Selector
VREG50
POLE_SEL
FR
5pin
Selector
4pin
RCL
11pin
BRK
3pin
12pin
TEST
FGO
8pin
10pin
GND
Figure 2. Block Diagram
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Absolute Maximum Ratings (Ta=25°C)
Parameters
Symbol
Rating
Unit
VCC
33
V
VG Voltage
VG
40
V
Pre-driver High side Output Voltage (UH,VH,WH)
VOH
40
V
Power Supply Voltage [VCC]
Pre-driver Low side Output Voltage (UL,VL,WL)
VOL
12
V
Pre-driver Output-current (consecutive) (UH,VH,WH,UL,VL,WL)
IOMAX1
±10
mA
Pre-driver Output-current (consecutive) (peak[
VG Voltage
< Pre-driver Output >
Dead Time
Output PWM Frequency
tDT
0.2
0.3
0.4
μs
fPWM
36
40
44
kHz
IHALL
-2.0
-0.1
+2.0
μA
VHALLCM1
0
-
VVREG50-1.7
V
VHALLCM2
0
-
VVREG50
V
Input Bias Current
Common mode Input Voltage
Range 1
Input Voltage Range 2
Minimum Input Voltage
HUP=0V, HUN=0V
HVP=0V, HVN=0V
HWP=0V, HWN=0V
When hall sensor is
used
When hall IC is used
VHALLMIN
50
-
-
mVP-P
Hall Input Hysteresis Level
+
VHYSP
8
20
32
mV
Hall Input Hysteresis Level
-
VHYSN
-32
-20
-8
mV
IPS
-82.5
-55.0
-27.5
μA
PS=0 V
PS Input H Voltage
VSTBY
3.8
-
VVREG50
V
Power save
PS Input L Voltage
VENA
0
-
0.4
V
Normal drive
IFR
25
50
75
μA
FR=VVREG50
FR Input H Voltage
VFRH
3.8
-
VVREG50
V
FR Input L Voltage
VFRL
0
-
0.8
V
IBRK
25
50
75
μA
BRK=VVREG50
BRK Input H Voltage
VBRKH
3.8
-
VVREG50
V
Short break
BRK Input L Voltage
VBRKL
0
-
0.8
V
Normal drive
Input Current
Input Current
Order of Electricity]
U→V→W
Order of Electricity
U→W→V
Input Current
For the electric current parameters, write positive number for the inflowing current and negative for the current outflow from the IC.
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Electrical Characteristics - Continued (Unless otherwise specified VCC=24V Ta=25°C)
Parameters
Symbol
Min
Typ
Max
Unit
Conditions
IIN
-1.0
-
+1.0
μA
IPWM
-75
-50
-25
μA
PWM Input H Level
VPWMINH
3.8
-
VVREG50
V
PWM Input L Level
VPWMINL
0
-
0.8
V
fPWMIN
1
-
50
kHz
Output L Voltage
VFGOL
0
0.1
0.3
V
IFGO=+3 mA
Output Leak Current
IFGLEAK
-
-
1
μA
FGO=30 V
RCL=0 V
< Control Input: POLE_SEL, SS_SEL>
Input Current
Input Current
PWM Input Frequency Range
PWM=0 V
RCL Outflow Current
IRCL
-35
-20
-10
μA
RCL Pin Input Voltage Range
VRCL
-0.3
-
+1.0
V
Current Limit Detection Voltage
VCL
0.23
0.25
0.27
V
VUVH
6.5
7.0
7.5
V
VCC UVLO Release Voltage
VUVL
5.5
6.0
6.5
V
VCC UVLO Hysteresis Voltage
VUVHYS
-
1.0
-
V
VREG50 UVLO Release Voltage
VUV50H
3.6
3.8
4.0
V
VREG50 UVLO Lockout Voltage
VREG50
UVLO
Hysteresis
Voltage
VG UVLO Voltage
VUV50L
3.4
3.6
3.8
V
VUV50HYS
-
0.2
-
V
VUVVG
VCC+2.0
VCC+3.0
VCC+4.0
V
OVLO Release Voltage
VOVL0
28.5
30.0
31.5
V
OVLO Lockout Voltage
VOVH0
29.5
31.0
32.5
V
OVLO Hysteresis Voltage
VOVHYS
-
1.0
-
V
Lock Protection Detection Time
tON
0.4
0.5
0.6
s
Lock Protection Time
tOFF
4.5
5
5.5
s
VCC UVLO Lockout Voltage
< Lock Protection >
For the electric current parameters, write positive number for the inflowing current and negative for the current outflow from the IC.
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Application Example
24V
0.1µF
1µF
VCC
0.1µF
VREG15
CP1 CP2
UVLO
Charge
Pump
VREG50
1µF
REG
Internal
Reg
TSD
VG
VREG50
OVLO
UH
PS
HU
VG
U
Pre
driver
HUP
U
UL
HUN
VG
HV
HVP
VH
CTL
Logic
HVN
HW
V
Pre
driver
HWP
V
M
VL
HWN
VG
VREG50
WH
VREG50
W
Pre
driver
PWMB
W
WL
VREG50
SS_SEL
Selector
VREG50
POLE_SEL
Selector
RCL
FR
BRK
FGO
External
Power
Supply
TEST
GND
Figure 3. Application example
Board Design Note
1. IC power, IC ground, motor outputs (U, V, W), and motor ground (RNF) lines are made as wide as possible.
2. The IC ground (signal GND) is arranged as close as the ground connector of PCB.
3. The bypass capacitor (VCC, FET side) are placed as close as possible to the VCC pin and FET.
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Typical Performance Curves
(Reference data)
1.5
30
Operating Voltage Range
Operating Voltage Range
Standby Current : ISTBY[mA]
Circuit Current : ICC[mA]
25
Ta=+85°C
Ta=+25°C
Ta=-25°C
20
15
10
1.2
0.9
0.6
Ta=+85°C
Ta=+25°C
Ta=-25°C
0.3
5
0.0
0
0
10
20
0
30
Supply Voltage : VCC[V]
Figure 4. Circuit Current vs Supply Voltage
30
Figure 5. Standby Current vs Supply Voltage
6
6
5
5
Ta=-25°C
Ta=+25°C
Ta=+85°C
4
VREG50 Voltage : VVREG50[V]
VREG50 Voltage : VVREG50[V]
10
20
Supply Voltage : VCC[V]
3
2
1
Operating Voltage Range
Ta=-25°C
Ta=+25°C
Ta=+85°C
4
3
2
1
0
0
0
10
20
Supply Voltage : VCC[V]
-30
30
Figure 6. VREG50 Voltage vs Supply Voltage
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-20
-10
VREG50 Output Current : IVREG50[mA]
0
Figure 7. VREG50 Voltage vs VREG50 Output Current
(VCC=24V)
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Typical Performance Curves - continued
(Reference data)
50
2.0
Operating Voltage Range
40
1.5
Ta=+85°C
Ta=+25°C
Ta=-25°C
VG Voltage : VG[V]
VREG15 Voltage : VVREG15[V]
Operating Voltage Range
30
1.0
Ta=-25°C
Ta=+25°C
Ta=+85°C
20
0.5
10
0
0.0
0
10
20
Supply Voltage : VCC[V]
0
30
20
30
Supply Voltage : VCC[V]
Figure 8. VREG15 Voltage vs Supply Voltage
Figure 9. VG Voltage vs Supply Voltage
50
50
High side Output High Voltage : VOHH[V]
High side Output High Voltage : VOHH[V]
10
40
30
Ta=-25°C
Ta=+25°C
Ta=+85°C
20
10
40
VCC=28V
30
VCC=24V
20
VCC= 8V
10
0
0
-10
-8
-6
-4
-2
high dise Output Current : IO[mA]
-10
0
Figure 10. High side Output High Voltage
vs High side Output Current (VCC=24V)
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-8
-6
-4
-2
High side Output Current : IO[mA]
0
Figure 11. High side Output High Voltage
vs High side Output Current (Ta=25°C)
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BM62300MUV
Typical Performance Curves - continued
(Reference data)
1.0
High side Output Low Voltage : VOHL[V]
High side Output Low Voltage : VOHL[V]
1.0
0.8
0.6
0.4
Ta=+85°C
Ta=+25°C
Ta=-25°C
0.2
0.8
0.6
0.4
0.2
0.0
0.0
0
2
4
6
8
High side Output Current : IO[mA]
0
10
Figure 12. High side Output Low Voltage
vs High side Output Current (VCC=24V)
2
4
6
8
High side Output Current : IO[mA]
10
Figure 13. High side Output Low Voltage
vs High side Output Current (Ta=25°C)
15
12
Low side Output High Voltage : VOLH[V]
15
Low side Output High Voltage : VOLH[V]
VCC=28V
VCC=24V
VCC= 8V
Ta=-25°C
Ta=+25°C
Ta=+85°C
9
6
3
12
VCC=28V
9
VCC=24V
VCC= 8V
6
3
0
0
0
2
4
6
8
Low side Output Current : IO[mA]
0
10
Figure 14. Low side Output High Voltage
vs Low side Output Current (VCC=24V)
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2
4
6
8
Low side Output Current : IO[mA]
10
Figure 15. Low side Output High Voltage
vs Low side Output Current (Ta=25°C)
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BM62300MUV
Typical Performance Curves - continued
(Reference data)
1.0
Low side Output Low Voltage : VOLL[V]
Low side Output Low Voltage : VOLL[V]
1.0
0.8
0.6
0.4
Ta=+85°C
Ta=+25°C
Ta=-25°C
0.2
0.8
0.6
0.4
0.2
0.0
0.0
0
2
4
6
8
Low side Output Current : IO[mA]
0
10
Figure 16. Low side Output Low Voltage
vs Low side Output Current (VCC=24V)
2
4
6
8
Low side Output Current : IO[mA]
10
Figure 17. Low side Output Low Voltage
vs Low side Output Current (Ta=25°C)
3
5
HALL Common Input Voltage Range :
VHALLCM1[V]
HALL Input Current : IHALL[µA]
VCC=28V
VCC=24V
VCC= 8V
2
1
0
Ta=+85°C
Ta=+25°C
Ta=-25°C
-1
-2
Operating Voltage Range
4
Ta=+85°C
Ta=+25°C
Ta=-25°C
3
2
1
Operating Voltage Range
0
-3
0
10
20
Supply Voltage : VCC[V]
0
30
Figure 18. HALL Input Current vs Supply Voltage
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10
20
Supply Voltage : VCC[V]
30
Figure 19. HALL Common Input Voltage Range
vs Supply Voltage
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Typical Performance Curves - continued
(Reference data)
0
Operating Voltage Range
HALL Input Hysteresis Voltage- : VHYSN[mV]
HALL Input Hysteresis Voltage+ : VHYSP[mV]
40
30
20
Ta=+85°C
Ta=+25°C
Ta=-25°C
10
-10
-20
Ta=-25°C
Ta=+25°C
Ta=+85°C
-30
-40
0
0
10
20
Supply Voltage : VCC[V]
0
30
Figure 20. HALL Input Hysteresis Voltage+ vs Supply Voltage
0
30
3.0
Operating Voltage Range
-25
-50
Ta=-25°C
Ta=+25°C
Ta=+85°C
-75
10
20
Supply Voltage : VCC[V]
Figure 21. HALL Input Hysteresis Voltage- vs Supply Voltage
PS Input High Voltage : VSTBY[V]
PS Input Current : IPS[µA]
Operating Voltage Range
-100
2.5
Ta=+85°C
Ta=+25°C
Ta=-25°C
2.0
1.5
1.0
0.5
Operating Voltage Range
0.0
0
10
20
Supply Voltage : VCC[V]
30
0
Figure 22. PS Input Current vs Supply Voltage
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10
20
Supply Voltage : VCC[V]
30
Figure 23. PS Input High Voltage vs Supply Voltage
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Typical Performance Curves - continued
(Reference data)
100
Operating Voltage Range
Operating Voltage Range
2.5
FR Input Current : IFR[µA]
PS Input Low Voltage : VENA[V]
3.0
Ta=+85°C
Ta=+25°C
Ta=-25°C
2.0
1.5
1.0
75
50
Ta=+85°C
Ta=+25°C
Ta=-25°C
25
0.5
0
0.0
0
10
20
Supply Voltage : VCC[V]
0
30
Figure 24. PS Input Low Voltage vs Supply Voltage
30
Figure 25. FR Input Current vs Supply Voltage
3.0
3.0
2.5
FR Input Low Voltage : VFRL[V]
FR Input High Voltage : VFRH[V]
10
20
Supply Voltage : VCC[V]
Ta=+85°C
Ta=+25°C
Ta=-25°C
2.0
1.5
1.0
0.5
2.5
Ta=+85°C
Ta=+25°C
Ta=-25°C
2.0
1.5
1.0
0.5
Operating Voltage Range
Operating Voltage Range
0.0
0.0
0
10
20
Supply Voltage : VCC[V]
0
30
Figure 26. FR Input High Voltage vs Supply Voltage
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10
20
Supply Voltage : VCC[V]
30
Figure 27. FR Input Low Voltage vs Supply Voltage
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Typical Performance Curves - continued
(Reference data)
3.0
100
BRK Input High Voltage : VBRKH[V]
BRK Input Current : IBRK[µA]
Operating Voltage Range
75
50
Ta=+85°C
Ta=+25°C
Ta=-25°C
25
Ta=+85°C
Ta=+25°C
Ta=-25°C
2.0
1.5
1.0
0.5
Operating Voltage Range
0.0
0
0
10
20
Supply Voltage : VCC[V]
0
30
Figure 28. BRK Input Current vs Supply Voltage
POLE_SEL Input Current : IIN[µA]
2
2.5
Ta=+85°C
Ta=+25°C
Ta=-25°C
2.0
1.5
1.0
0.5
10
20
Supply Voltage : VCC[V]
30
Figure 29. BRK Input High Voltage vs Supply Voltage
3.0
BRK Input Low Voltage : VBRKL[V]
2.5
Operating Voltage Range
1
0
Ta=+25°C
Ta=-25°C
Ta=+85°C
-1
Operating Voltage Range
-2
0.0
0
10
20
Supply Voltage : VCC[V]
0
30
Figure 30. BRK Input Low Voltage vs Supply Voltage
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20
Supply Voltage : VCC[V]
30
Figure 31. POLE_SEL Input Current vs Supply Voltage
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Typical Performance Curves - continued
(Reference data)
2
0
Operating Voltage Range
PWM Input Current : IPWM[µA]
SS_SEL Input Current : IIN[µA]
Operating Voltage Range
1
0
Ta=+25°C
Ta=-25°C
Ta=+85°C
-1
-2
-50
Ta=-25°C
Ta=+25°C
Ta=+85°C
-75
-100
0
10
20
Supply Voltage : VCC[V]
30
0
Figure 32. SS_SEL Input Current vs Supply Voltage
3.0
PWM Input Low Voltage : VPWMINL[V]
2.5
Ta=+85°C
Ta=+25°C
Ta=-25°C
2.0
1.5
1.0
0.5
10
20
30
Supply Voltage : VCC[V]
Figure 33. PWM Input Current vs Supply Voltage
3.0
PWM Input High Voltage : VPWMINH[V]
-25
Operating Voltage Range
0.0
Operating Voltage Range
2.5
2.0
1.5
Ta=+85°C
Ta=+25°C
Ta=-25°C
1.0
0.5
0.0
0
10
20
Supply Voltage : VCC[V]
30
0
Figure 34. PWM Input High Voltage vs Supply Voltage
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10
20
Supply Voltage : VCC[V]
30
Figure 35. PWM Input Low Voltage vs Supply Voltage
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Typical Performance Curves - continued
(Reference data)
0.4
FGO Output Low Voltage : VFGOL[V]
FGO Output Low Voltage : VFGOL[V]
0.4
0.3
0.2
Ta=+85°C
Ta=+25°C
Ta=-25°C
0.1
0.3
0.2
VCC=28V
VCC=24V
VCC= 8V
0.1
0.0
0.0
0
2
4
6
8
FGO Output Current : IFGO[mA]
0
10
Figure 36. FGO Output Low Voltage
vs FGO Output Current (VCC=24V)
10
Figure 37. FGO Output Low Voltage
vs FGO Output Current (Ta=25°C)
0
Operating Voltage Range
RCL Input Current : IRCL[µA]
FG Leak Current : IFGLEAK[µA]
2.0
2
4
6
8
FGO Output Current : IFGO[mA]
1.5
1.0
0.5
Operating Voltage Range
-10
-20
Ta=-25°C
Ta=+25°C
Ta=+85°C
-30
Ta=+85°C
Ta=+25°C
Ta=-25°C
0.0
-40
0
10
20
Supply Voltage : VCC[V]
30
0
Figure 38. FG Leak Current vs Supply Voltage
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10
20
Supply Voltage : VCC[V]
30
Figure 39. RCL Input Current vs Supply Voltage
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Typical Performance Curves - continued
(Reference data)
Current Limit Voltage : VCL[V]
0.30
0.25
Ta=+85°C
Ta=+25°C
Ta=-25°C
0.20
0.15
0.10
0.05
Operating Voltage Range
0.00
0
10
20
Supply Voltage : VCC[V]
30
Figure 40. Current Limit Voltage vs Supply Voltage
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Description of Function Operations
1. Drive
It detects the rotor position on the three hall sensors. In addition, minimized sounds and low vibration are implemented by
making the output current a sin waveform.
(1) Timing chart of the sine wave drive on 3 hall sensors
The timing chart of the 3-hall sensor signal and external power transistor output signal are shown in Figure 41.
FR=High (Electricity order U → V → W, lead angle setting 0 degree)
①
STAGE
STAGE (1)
Position[deg.] 00
Position[deg]
②
(2)
30
30
③
(3)
60
60
④
(4)
90
90
⑤ (6)
⑥ (7)
⑦ (8)
⑧ (9)
⑨ (10)
⑩ (11)
⑪ (12)
⑫ (1)
① (2)
② (3)
③ (4)
④ (5)
⑤
(5)
120 150 180 210 240 270 300 330 360 390 420 450 480
120 150 180 210 240 270 300 330 360 390 420 450 480
HALL SIGNAL
HALL SIGNAL
3 HALL Sensor signal
HU=HUP-HUN
HU=HUP-HUN
HUP-HUN
HV=HVP-HVN
HV=HVP-HVN
HVP-HVN
HW=HWP-HWN
HW=HWP-HWN
HWP-HWN
Coil Current
Output
Current
Output Current
I_U
U phase
I_U
V phase
I_V
I_V
W phase
I_W
I_W
External Power Transistor
Output signal (Sin
drive)
Output
Voltage
Output
Voltage
U phase
UU
V phaseV
V
W phase
※
※
W
W
FGO signal
:PWM
：PWM
Operation
Operation
FG
FG
FGO
Position[deg.] 0
30
U
U
V
WV
WV
60
U
WV
90
U
120 150 180 210 240 270 300 330 360 390 420 450 480
WV
WV
WV
WV
WV
U
U
U
U
U
U
U
WV
WV
WV
WV
WV
WV
U
U
U
U
U
U
WV
WV
W
Figure 41. Timing Chart of Hall Detection Drive (FR=High)
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(1) Timing chart of the sine wave drive on 3 hall sensors - continued
FR=Low (Electricity order U → W → V, lead angle setting 0 degree)
①
STAGE (1)
Position[deg.] 00
Position[deg]
②
(2)
30
30
③
(3)
60
60
④ (5)
⑤ (6)
⑥ (7)
⑦ (8)
⑧ (9)
⑨ (10)
⑩ (11)
⑪ (12)
⑫ (1)
① (2)
② (3)
③ (4)
④ (5)
⑤
(4)
90 120 150 180 210 240 270 300 330 360 390 420 450 480
90 120 150 180 210 240 270 300 330 360 390 420 450 480
HALL SIGNAL
SIGNAL
3 HALL Sensor signalHALL
HU=HUP-HUN
HU=HUP-HUN
HUP-HUN
HV=HVP-HVN
HV=HVP-HVN
HVP-HVN
HW=HWP-HWN
HW=HWP-HWN
HWP-HWN
Coil Current
Output
Current
Output Current
I_U
U phase
I_U
I_V
V phase
I_V
W phase
I_W
I_W
External Power Transistor
Output signal (Sin drive)
Output
OutputVoltage
Voltage
U phase U
U
V phase VV
W phaseW
※
※
W
FGO signal
:PWM
：PWM
Operation
Operation
FG
FGOFG
Position[deg.] 0
30
U
U
V
WV
WV
60
U
WV
90
U
120 150 180 210 240 270 300 330 360 390 420 450 480
WV
WV
WV
WV
WV
U
U
U
U
U
U
U
WV
WV
WV
WV
WV
WV
U
U
U
U
U
U
WV
WV
W
Figure 42. Timing Chart of Hall Detection Drive (FR=Low)
[Adjustment of the Hall Sensor]
When the hall sensor is used, the amplitude adjustment of the hall signal is important for a stable drive.
The amplitude of hall signal larger than the hall input hysteresis level + (VHYSP) and hall input hysteresis level - (VHYSN) is
necessary to detect the position of the normal motor.
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1. Drive - continued
(2) Electricity Logic
FR=High (Electricity order U→V→W)
Table 1. Electricity Logic Table
Input Condition
STAGE
HU
=(HUP)-(HUN)
HV
=(HVP)-(HVN)
Output State
HW
=(HWP)-(HWN)
U
V
W
1
Middle
Low
High
PWM
Low
PWM
2
High
Low
High
PWM
Low
PWM
3
High
Low
Middle
PWM
Low to PWM
PWM to Low
4
High
Low
Low
PWM
PWM
Low
5
High
Middle
Low
PWM
PWM
Low
6
High
High
Low
PWM
PWM
Low
7
Middle
High
Low
PWM to Low
PWM
Low to PWM
8
Low
High
Low
Low
PWM
PWM
9
Low
High
Middle
Low
PWM
PWM
10
Low
High
High
Low
PWM
PWM
11
Low
Middle
High
Low to PWM
PWM to Low
PWM
12
Low
Low
High
PWM
Low
PWM
2. Lock Protection Function
When the motor locks due to disturbance factors, there are protection functions (lock protection function) that turns off all
aspects of external power transistor output (lock protection time tOFF: typ 5.0s) for a certain period of time so that the current
will not continue to flow in the coil current. In addition, it has a function that automatically restarts afterwards.
Lock Detection Judgment
When the motor normally rotates, the change of hall signal will be detected but when the motor is locked, it will not be
detected. When the change of hall signal is not detected for a certain period (lock protection detect time tON: typ 500ms),
it will be judged as motor lock. (It becomes 75rpm when it is converted into the rotation speed of 4pole motors, when it is
less than the rotation speed mentioned, it will be judged as motor locked.) The waveform/ timing chart of the hall signal
and each output aspect during motor lock is shown in Figure 43.
Motor Lock
Re-Start
Hall Detecting
V Hall
Comparator
Signal
Output U
Output V
Output Hi-Z section
Output W
Hall Driving Section
(normal driving)
Lock Detect OFF Section tOFF (5.0 s)
Start-up Section
Lock
Detect Section
tON (500 ms)
Figure 43. Timing Chart during Lock Protection
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Description of Function Operations - continued
3. Current Limit Setting (RCL pin)
It detects the coil current, when it detects a current more than the current setting value, all aspects of the external power
transistor output will be turned off and it will cut off the current. When the current is less than the current value setting in the
timing of next PWM (ON) after turning off all aspects of the external power transistor output for drive, the output returns to
normal drive.
Setting current value IO that operates the current limit is determined on the resistance R1 to use for the current limit setting
voltage (VCL) 250mV (Typ) and the coil current detection in the IC. Please refer to the formula shown below.
𝐼𝑂 [A] = 𝑉 𝐶𝐿 [V] / 𝑅1 [Ω]
= 250[mV] / 0.2[Ω]
= 1.25[A]
𝑃𝐶 [𝑊] = 𝑉𝐶𝐿 [V] × 𝐼𝑜[A]
= 250[mV] × 1.25[A]
= 0.3125[W]
When the current limit function is not used, short the RCL pin
with GND.
A large current flows in the resistor R1 to use for the coil
current detection.
Because the power consumption PC becomes the
calculation in the formula shown above, please pay attention
to the power dissipation.
VREG50
VCL
CL COMP
RCL
Current Detection Resistor
Connection
(Current Limit enable)
OK
GND Short Setting
(Current limit disables)
OK
Open Setting
(Restricted mode)
NG
IO
GND
R1
IC small signal GND line
Motor Large Current GND line
R1
RCL
RCL
RCL
Figure 45. Small Signal and Large Current
GND line separation
Figure 44. RCL pin process
During PCB layout design, separate the small signal ground line of the IC with a large current ground line motor connected
to R1 as shown in Figure 45.
4. Soft Start Time Setting (SS_SEL pin)
When it starts from the motor stop state, a function (soft start function) gradually increases the coil current to control the
inrush current.
The start-up command which starts from the motor stop state restarts when the motor stopped on the start of the motor at
power supply injection, start on the torque input (PWM pin), start on the power save cancellation(PS pin), restart from lock
protection, restart from the reverse brake mode at change of rotation direction (FR pin). It also includes each protection
circuit (high-speed rotation protection, low speed rotation protection, overvoltage protection, under voltage lock-out and
overheat protection).
About the current limit during soft start, it maintains the sine wave drive by gradually increasing the output duty of the
external power transistor.
ON
Start-up
Command
OFF
Current limit
(VCL)
Vcc Current
0A
Figure 46. Timing Chart of the Coil Current Waveform at Soft Start
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4. Soft Start Time Setting (SS_SEL pin) - continued
The soft start function can gradually increase the current limit setting voltage in the IC.
The soft start time for 1 step is set on the voltage of the soft start control pin (SS_SEL) as shown in Table 2. Set it on the
partial pressure resistance from VREG50 pin.
The current limit setting voltage in the IC increases for 1step 5.16mV (Typ). Therefore, the soft start time can be calculated
as follows.
Soft start time = Time for 1 step × (𝑉𝐶𝐿 / 5.16𝑚𝑉)
For example, when set it in 𝑆𝑆_𝑆𝐸𝐿 = 0 𝑉,
It becomes, Time of 1step = 49ms / (250mV / 5.16mV) = 2.37s
Start-up command
VCL(250mV:typ)
Current limit voltage setting of the
internal IC
Step Voltage Width
5.16mV
Soft Start Time
Figure 47. Timing Chart of the Current Limit Voltage Setting during Soft Start
Table 2. SS_SEL pin setting table
SS_SEL pin setting
0.000
0.069
0.131
0.194
0.256
0.319
0.381
0.444
0.506
0.569
0.631
0.694
0.756
0.819
0.881
0.944
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
0.056
0.119
0.181
0.244
0.306
0.369
0.431
0.494
0.556
0.619
0.681
0.744
0.806
0.869
0.931
1.000
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
Time for 1 step
49 ms
98 ms
147 ms
197 ms
246 ms
295 ms
344 ms
393 ms
442 ms
491 ms
541 ms
590 ms
639 ms
688 ms
737 ms
786 ms
5. Power Save (PS pin)
The power save control is possible with PS pin. Normal drive (motor drive) state becomes PS=Low and it enters power save
(motor stop) during PS=High or Open. The power save is prioritized over other control input signals and the internal power
supply VREG50 output turns off. Furthermore, PS pin is pulled up on the internal REG (5V) by the 100kΩ (Typ) resistor.
PS pin Setting
Table 3. PS pin Setting Table
Function
Low
High / Open
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Description of Function Operations – continued
6. Short break control (BRK pin)
The rotation stops immediately on BRK pin. All upper part pre-driver outputs (UH, VH, WH) of each aspect becomes Low in
BRK=High, all lower pre-driver outputs (UL, VL, WL) of each aspect becomes High and enters short brake operation. (the
external upper part power transistor of each aspect is off and the external lower power transistor is on) It cancels the short
brake operation when BRK=Low or Open. In addition, the BRK pin is pulled-down by 100kΩ (Typ) resistor of the internal IC.
During short brake operation, the pre-driver output enters short brake operation but continues the operation based on the
hall sensor signal of the internal IC. When the short brake operation is canceled, it resumes the operating conditions in the
IC at that time.
The priority of Short brake is higher than other protection functions. Therefore, when short brake works during other
protection function operation, protection function is canceled and short brake operation is enable.
Table 4. BRK pin Setting Table
BRK pin Setting
Function
Low / Open
High
Normal Drive
Short Break
7. Change of Rotation Direction (FR pin)
FR pin can change the electricity order. It becomes U → V → W in FR=High and becomes U → W → V in FR=Low or Open.
The change of the electricity order is not recommended during motor rotation, but shift to brake mode (reverse brake mode)
once when it changed. (When number of revolutions decreases to 500 rpm@4 pole or less as for the restart) As for the FR
pin, it is pulled-down by the resistor of 100 kΩ(typ) in the IC.
Table 5. FR pin Setting Table
FR pin Setting
Function
Low / Open
High
Electricity Order U→W→V
Electricity Order U→V→W
8. Motor Polarity Setting (POLE_SEL pin)
It can perform motor pole number setting with POLE_SEL pin. The FGO output frequency, high-speed rotation protection
and low-speed rotation protection can be set on the voltage of the POLE_SEL pin as shown in Table 6. Please set it on the
resistance partial pressure from VREG50 pin.
Table 6. POLE_SEL pin Setting Table
POLE_SEL pin setting
0.00
0.16
0.30
0.59
0.73
0.87
x
x
x
x
x
x
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
to
to
to
to
to
to
0.13
0.27
0.41
0.70
0.84
1.00
x
x
x
x
x
x
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
VVREG50
Number of Motor
Polarity (Poles)
4
6
8
12
16
10
9. Under Voltage Lock Out (UVLO: Under Voltage Lock Out)
In extremely low supply voltage area deviating from normal operation, it is a protection function that prevents the
unexpected operations such as high current flow in drive FET by turning off all aspects of external power transistor of the IC
intentionally. (Upper/lower FET drive of each U, V, W aspect). The under voltage lock out (UVLO ON) works when VCC is
6V (Typ) or less in an area less than 8V of the recommended operating supply voltage and the external power transistor
turns off. There is a hysteresis and it returns to normal operation (UVLO cancellation) when the VCC is 7V (Typ) or more.
10. Over Voltage Lock Out (OVLO: Over Voltage Lock Out)
When the VCC voltage becomes 31V (Typ) or more, all upper part pre-driver outputs (UH, VH, WH) of each aspect
becomes Low and all lower pre-driver outputs (UL, VL, WL) of each aspect becomes High. So, the external power transistor
becomes short brake status. Therefore, this IC enters overvoltage protection (OVLO ON). (the external upper part power
transistor of each aspect is off and the external lower power transistor is on) In addition, the Charge Pump function for VG
voltage will turn off. There is a hysteresis, and the overvoltage protection is cancelled (OVLO cancellation) after 5s(Typ)
when VCC is 30V (Typ) or less. Furthermore, mask time of 4µs(Typ) is set for the prevention of malfunction.
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Description of Function Operations – continued
11. High-speed rotation protection, low-speed rotation protection
When a rotating speed boost up is caused by uncontrollable motor, it has the protection function which turn OFF output for a
certain period and automatically return afterward not to continue applying current in helix and not to fall uncontrollable motor
into super slow rotation.
Table 7. No. of each rotation of speed protection function (Typ)
Protection Function Judgment
Speed protection function
Condition (At 4-pole calculation)
High-speed rotation protection
40300 rpm or more
Low-speed rotation protection
100 rpm or less
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Thermal Resistance Model
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which
indicates this heat dissipation capability (hardness of heat release) is called thermal resistance. Thermal resistance from the
chip junction to the ambient is represented in θJA [°C/W], and thermal characterization parameter from junction to the top center
of the outside surface of the component package is represented in ΨJT [°C/W]. Thermal resistance is divide into the package
part and the substrate part. Thermal resistance in the package part depends on the composition materials such as the mold
resins and the lead frames. On the other hand, thermal resistance in the substrate part depends on the substrate heat
dissipation capability of the material, the size, and the copper foil area etc. Therefore, thermal resistance can be decreased by
the heat radiation measures like installing a heat sink etc. in the mounting substrate.
The thermal resistance model is shown in Figure 48, and equation is shown below.
Equation
𝜃𝐽𝐴 =
𝜓𝐽𝑇 =
𝑇𝑗−𝑇𝑎
𝑃
𝑇𝑗−𝑇𝑡
𝑃
[°C/W]
[°C/W]
Where:
𝜃𝐽𝐴 is the thermal resistance from junction to ambient [°C/W]
𝜓𝐽𝑇 is the thermal characterization parameter from junction to the top center of the outside surface of the component package
[°C/W]
𝑇𝑗 is the junction temperature [°C]
𝑇𝑎 is the ambient temperature [°C]
𝑇𝑡 is the package outside surface (top center) temperature [°C]
𝑃 Is the power consumption [W]
Ambient temperature: Ta[°C]
θJA[°C/W]
Junction temperature: Tj[°C]
Package outside surface (top center)
temperature: Tt[°C]
ΨJT[°C/W]
Mounting Substrate
Figure 48. Thermal Resistance Model of Surface Mount
Even if it uses the same package, θJA and ΨJT are changed depending on the chip size, power consumption and the
measurement environments of the ambient temperature, the mounting condition and the wind velocity, etc.
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30.Jun.2021 Rev.002
BM62300MUV
I/O Equivalence Circuits (Resistors are standard values)
1) VREG50 pin
2) VREG15 pin
3) PS pin
Internal
Reg
VREG
50
VCC
VREG
50
100 kΩ
PS
VREG
15
VREG
50
49 kΩ
60 kΩ
80 kΩ
24.4 kΩ
10 kΩ
10 kΩ
10 kΩ
156 kΩ
50 kΩ
HALL
BIAS
4) PWM, SS_SEL pin
5) UH,U,VH,V,WH,W pin
6) POLE_SEL pin
VREG
50
VG
UH
VH
WH
5 kΩ
PWM
SS_SEL
90 kΩ 10 kΩ
90 kΩ
VREG
50
POLE_SEL
90 kΩ
100 kΩ
500 kΩ
U
V
W
30 kΩ
90 kΩ 90 kΩ 90 kΩ
50 kΩ
50 kΩ
20 Ω
20 Ω
7) RCL pin
8) UL, VL, WL pin
VREG
50
9) CP2, VG pin
Internal
Reg
VG
250 kΩ
RCL
UL
VL
WL
2 kΩ
1000
kΩ
25 Ω
CP2
VCC
x2
10) FGO pin
11) CP1 pin
12) HUP, HUN, HVP,
HVN,HWP,HWN
HUP
HUN
HVP
HVN
HWP
HWN
Internal Reg
FGO
5Ω
25 Ω
13) BRK pin
5 kΩ
100 kΩ
15) TEST pin
VREG
50
VREG
50
FR
2 kΩ
CP1
14) FR pin
VREG
50
BRK
10 kΩ
90 kΩ
5 kΩ
5 kΩ
TEST
100 kΩ
100 kΩ
10 kΩ
x2
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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BM62300MUV
Operational Notes – continued
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Figure 49. Example of IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BM62300MUV
Ordering Information
B
M
6
2
3
Part Number
0
0
M
U
V
-
E2
Package
Packaging and forming specification
MUV: VQFN032V5050 E2: Embossed tape and reel
Marking Diagram
VQFN032V5050 (TOP VIEW)
Part Number Marking
M 6 2 3 0 0
LOT Number
Pin 1 Mark
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BM62300MUV
Physical Dimension and Packing Information
Package Name
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VQFN032V5050
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30.Jun.2021 Rev.002
BM62300MUV
Revision History
Date
Revision
21.Sep.2018
001
30.Jun.2021
002
Changes
New Release
P3 : 5pin, 6pin are changed
P1, P4, P8 : Figure is changed
P25 : Table6 is changed
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30.Jun.2021 Rev.002
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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