Datasheet
For Air-Conditioner Fan Motor
3-Phase Brushless Fan Motor
Driver
BM6242FS
General Description
Key Specifications
This 3-phase Brushless Fan motor driver IC adopts
PrestoMOSFETTM as the output transistor, and put in a
small full molding package with the high voltage gate
driver chip. The protection circuits for overcurrent,
overheating, under voltage lock out and the high voltage
bootstrap diode with current regulation are built-in. It
provides optimum motor drive system for a wide variety
of applications by the combination with controller
BD6201x series and enables motor unit standardization.
Output MOSFET Voltage:
Driver Output Current (DC):
Driver Output Current (Pulse):
Output MOSFET DC On Resistance:
Maximum Junction Temperature:
Package
600V
±1.5A (Max)
±2.5A (Max)
2.7Ω (Typ)
+150°C
W(Typ) x D(Typ) x H(Max)
SSOP-A54_23
22.0mm x 14.1mm x 2.4mm
Features
600V PrestoMOSFETTM Built-in
Output Current 1.5A
Bootstrap operation by floating high side driver
(including diode)
3.3V logic input compatible
Protection circuits provided: CL, OCP, TSD, UVLO,
MLP and the external fault input
Fault Output (open drain)
Applications
Air Conditioners; Air Purifiers; Water Pumps;
Dishwashers; Washing Machines
SSOP-A54_23
Typical Application Circuit
FG
Q1
VREG
R1
VSP
R9
DTR
R10
C14
C7
C13
C1
C2~C4
R2
HW HV
R3
VREG
C8
IC2
HU
R6
C11
R5
M
C5
R4
C9
C10
IC1
R8
VCC
GND
D1
C6
C12
R7
VDC
Figure 1. Application Circuit Example(BM6242FS & BD6201xFS)
〇Product structure : Semiconductor IC
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
〇This product has no designed protection against radioactive rays
1/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Contents
General Description ................................................................................................................................................................ 1
Features ................................................................................................................................................................................. 1
Applications ............................................................................................................................................................................ 1
Key Specifications................................................................................................................................................................... 1
Package
.......................................................................................................................................................................... 1
Typical Application Circuit ........................................................................................................................................................ 1
Contents ................................................................................................................................................................................. 2
Block Diagram and Pin Configuration....................................................................................................................................... 3
Pin Description........................................................................................................................................................................ 3
Description of Blocks............................................................................................................................................................... 4
Absolute Maximum Ratings ..................................................................................................................................................... 8
Thermal Resistance ................................................................................................................................................................ 8
Recommended Operating Conditions ...................................................................................................................................... 9
Electrical Characteristics (Driver part) ...................................................................................................................................... 9
Typical Performance Curves (Reference Data)....................................................................................................................... 10
Application Example.............................................................................................................................................................. 16
Parts List .............................................................................................................................................................................. 16
Dummy Pin Descriptions ....................................................................................................................................................... 17
I/O Equivalent Circuits ........................................................................................................................................................... 18
Operational Notes ................................................................................................................................................................. 19
Ordering Information ............................................................................................................................................................. 21
Marking Diagrams ................................................................................................................................................................. 21
Physical Dimension, Tape and Reel Information ..................................................................................................................... 22
Revision History .................................................................................................................................................................... 23
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
2/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Block Diagram and Pin Configuration
VCC
1
FOB
2
UH
3
UL
4
23
VDC
22
BU
21
U
VCC
LEVEL SHIFT
&
GATE DRIVER
VDC
FOB
UH
BU
UL
U
NC
VH
VL
19
V
BV
VH
V
6
LEVEL SHIFT
&
GATE DRIVER
7
WH
10
WL
11
M
VL
NC
LEVEL SHIFT
&
GATE DRIVER
VREG
FOB
20
BV
18
VDC
17
BW
16
W
NC
WH
WL
BW
FOB
12
W
VCC
FAULT
VCC
VDC
13
15
PGND
GND
Figure 2. Block Diagram
PGND
Figure 3. Pin Configuration
(Top View)
Pin Description
Pin
Name
Function
Pin
Name
1
VCC
Low voltage power supply
2
FOB
3
Function
23
VDC
Fault signal output (open drain)
-
VDC
UH
Phase U high side control input
22
BU
4
UL
Phase U low side control input
-
U
5
NC
No connection
21
U
6
VH
Phase V high side control input
20
BV
7
VL
Phase V low side control input
-
V
8
NC
No connection
19
V
9
NC
No connection
-
VDC
10
WH
Phase W high side control input
18
VDC
High voltage power supply
11
WL
Phase W low side control input
17
BW
Phase W floating power supply
12
FOB
Fault signal output (open drain)
-
W
13
VCC
Low voltage power supply
16
W
14
GND
Ground
15
PGND
High voltage power supply
Phase U floating power supply
Phase U output
Phase V floating power supply
Phase V output
Phase W output
Ground (current sense pin)
Note) All pin cut surfaces visible from the side of package are no connected, except the pin number is expressed as a “-”.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
3/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Description of Blocks
1. Control Input Pins (UH,UL,VH,VL,WH,WL)
The input threshold voltages of the control pins are 2.5V and 0.8V, with a hysteresis
voltage of approximately 0.4V. The IC will accept input voltages up to the VCC voltage.
When the same phase control pins are input high at the same time, the high side and low
side gate driver outputs become low. Dead time is installed in the control signals. The
control input pins are connected internally to pull-down resistors (100kΩ nominal).
However, the switching noise on the output stage may affect the input on these pins and
cause undesired operation. In such cases, attaching an external pull-down resistor (10kΩ
recommended) between each control pin and ground, or connecting each pin to an input
voltage of 0.8V or less (preferably GND), is recommended.
Truth Table
HIN
LIN
HO
LO
L
L
L
L
H
L
H
L
L
H
L
H
H
H
Inhibition
Note) HIN: UH,VH,WH, LIN: UL,VL,WL
2. Under Voltage Lock Out (UVLO) Circuit
To secure the lowest power supply voltage necessary to operate the driver, and to prevent under voltage malfunctions, the
UVLO circuits are independently built into the upper side floating driver and the lower side driver. When the supply voltage
falls to VUVL or below, the controller forces driver outputs low. When the voltage rises to VUVH or above, the UVLO circuit
ends the lockout operation and returns the chip to normal operation. Even if the controller returns to normal operation, the
output begins from the following control input signal.
VCCUVH
VCC
VCCUVL
HIN
LIN
HO
LO
VBUVH
VB
VBUVL
HIN
LIN
HO
LO
Figure 4. Low Voltage Monitor - UVLO - Timing Chart
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
4/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Description of Blocks - continued
3. Bootstrap Operation
VB
Dx
VB
VDC
Dx
CB
HO
L
OFF
H
VS
VDC
CB
HO
ON
VS
VCC
VCC
LO
H
ON
L
Figure 5. Charging Period
LO
OFF
Figure 6. Discharging Period
The bootstrap is operated by the charge period and the discharge period being alternately repeated for bootstrap
capacitor (CB) as shown in the figure above. In a word, this operation is repeated while the output of an external transistor
is switching with synchronous rectification. Because the supply voltage of the floating driver is charged from the VCC
power supply to CB through prevention of backflow diode DX, it is approximately (VCC-1V).
The resistance series connection with DX has the impedance of approximately 200 Ω.
The capacitance value for the bootstrap is the following formula:
( I BBQ I LBD )
C BOOT »
FPWM
2 Q g QLOSS
VDROP
20nF
where:
IBBQ is the floating driver power supply quiescence current, 150µA(Max)
ILBD is the bootstrap diode reverse bias current, 10µA(Max)
fPWM is the carrier frequency, 20kHz
Qg is the output MOSFET total gate charge, 25nC(Max)
QLOSS is the floating driver transmission loss, 1nC(Max)
∆VDROP is the drop voltage of the floating driver power supply, 3V
The allowed drop voltage actually becomes smaller by the range of the used power supply voltage, the output MOSFET
ON resistance, the forward voltages of the internal boot diode (the drop voltage to the capacitor by the charge current),
and the power supply voltage monitor circuits etc. Please set the calculation value to the criterion about the capacitance
value tenfold or more to secure the margin in consideration of temperature characteristics and the value change, etc.
Moreover, the example of the mentioned above assumes the synchronous rectification switching. Because the total gate
charge is needed only by the carrier frequency in the upper switching section, for example 150° commutation driving, it
becomes a great capacity shortage in the above settings. Set it after confirming actual application operation.
4. Thermal Shutdown (TSD) Circuit
The TSD circuit operates when the junction temperature of the gate driver exceeds the preset temperature (150°C
nominal). At this time, the controller forces all driver outputs low. Since thermal hysteresis is provided in the TSD circuit,
the chip returns to normal operation when the junction temperature falls below the preset temperature (125°C nominal).
The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or
guarantee its operation in the presence of extreme heat. Do not continue using the IC after the TSD circuit is activated,
and do not use the IC in an environment where activation of the circuit is assumed. Moreover, it is not possible to follow
the output MOSFET junction temperature rising rapidly because it is a gate driver chip that monitors the temperature and it
is likely not to function effectively.
5. Overcurrent Protection (OCP) Circuit
The overcurrent protection circuit can be activated by connecting a low value resistor for current detection between the
PGND pin and the GND pin. When the PGND pin voltage reaches or surpasses the threshold value (0.9V typical), the
gate driver outputs low to the gate of all output MOSFETs, thus initiating the overcurrent protection operation.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
5/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Description of Blocks - continued
6. Fault Signal Output
When the gate driver detects either state that should be protected (UVLO / TSD / OCP), the FOB pin outputs low (open
drain) for at least 25µs nominal. The FOB pin has wired-OR connection with each phase gate driver chip internally, and
into another phase also entering the protection operation. Even when this function is not used, the FOB pin is pull-up to
the voltage of 3V or more and at least a resistor with a value 10k Ω or more. Moreover, the signal from the outside of the
chip is not passed because of the built-in analog filter, but the internal control signals (UVLO / TSD / OCP) pass the filter
(2.0µs Min) for the malfunction prevention by the switching noise, etc.
TSD
OCP
FILTER
UVLO
SHUTDOWN
FOB
FAULT
Figure 7. Fault Signal Bi-Directional Input Pin Interface
HIN
LIN
HO
LO
2.0µs (Min)
2.0µs (Min)
PGND
0.9V(Typ)
OCP threshold
25µs (Typ)
FOB
25µs (Typ)
Figure 8. Fault Operation ~ OCP ~ Timing Chart
10
The release time from the protection operation can be
changed by inserting an external capacitor. Refer to the
formula below. Release time of 2ms or more is
recommended.
2.0
) R C [s]
VPU
VREG
R
FOB
VPU=5V
VPU=15V
8
Release time : t [ms]
t ln( 1
9
7
6
5
4
3
2
C
1
0
0.01
Figure 9. Release Time Setting Application Circuit
0.10
1.00
Capacitance : C[µF]
Figure 10. Release Time (Reference Data @R=100kΩ)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
6/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
6. Fault Signal Output - continued
When using controller BD6201x series as a control IC, the FOB pin can be linked to the external fault signal input pin of
the side of the control IC since it has the internal pull-up resistor. Refer to figure 11.
BD6201xFS
BM6242FS
VREG
100k
FIB
FOB
C
Figure 11. Interface Equivalent Circuit
7. Switching Time
XH, XL
VDS
trr
ton
td(on)
tr
90%
90%
ID
10%
10%
td(off)
tf
toff
Figure 12. Switching Time Definition
Parameter
High Side Switching
Time
Low Side Switching
Time
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Symbol
tdH(on)
trH
trrH
tdH(off)
tfH
tdL(on)
trL
trrL
tdL(off)
tfL
Reference
820
110
230
430
30
830
110
160
500
65
7/23
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Conditions
VDC=300V, VCC=15V, ID=0.75A
Inductive load
The propagation delay time: Internal
gate driver input stage to the driver
IC output.
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Absolute Maximum Ratings (Tj=25°C)
Parameter
Symbol
Ratings
Unit
Output MOSFET
VDSS
600
V
Supply Voltage
VDC
-0.3 to +600
V
Output Voltage
VU, VV, VW
-0.3 to +600
V
VBU, VBV, VBW
-0.3 to +600
V
VBU-VU, VBV-VV, VBW -VW
-0.3 to +20
V
High Side Supply Pin Voltage
High Side Floating Supply Voltage
Low Side Supply Voltage
VCC
-0.3 to +20
V
All Others
VI/O
-0.3 to +VCC
V
Driver Outputs (DC)
IOMAX(DC)
±1.5
A
Driver Outputs (Pulse)
IOMAX(PLS)
±2.5 (Note 1)
A
Fault Signal Output
IOMAX(FOB)
15
mA
Tstg
-55 to +150
°C
Tjmax
150
°C
Storage Temperature
Maximum Junction Temperature
(Note)
(Note 1)
All voltages are with respect to ground unless otherwise specified.
Pw ≤ 10µs, Duty cycle ≤ 1%
Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC
is operated over the absolute maximum ratings.
Caution2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance (Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s (Note 3)
Unit
SSOP-A54_23
Junction to Ambient
Junction to Top Characterization Parameter
(Note 2)
θJA
41.7
°C/W
ΨJT
10
°C/W
(Note 1) Based on JESD51-2A(Still-Air)
(Note 2) Refer to Figure 13. for temperature measurement point on the component package top surface.
(Note 3) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
2.8mm
5.6mm
Measurement point
Figure 13. Temperature Measurement Point
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
8/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Recommended Operating Conditions (Tj=25°C)
Parameter
Symbol
Supply Voltage
High Side Floating Supply Voltage
Min
Typ
Max
Unit
VDC
-
310
400
V
VBU-VU, VBV-VV, VBW -VW
13.5
15
16.5
V
VCC
13.5
15
16.5
V
Low Side Supply Voltage
Bootstrap Capacitor
CB
1.0
-
-
µF
CVCC
1.0
-
-
µF
Minimum Input Pulse Width
tMIN
0.8
-
-
µs
Dead Time
tDT
1.5
-
-
µs
Shunt Resistor (PGND)
RS
0.6
-
-
Ω
Junction Temperature
Tj
-40
-
+125
°C
VCC Bypass Capacitor
(Note) All voltages are with respect to ground unless otherwise specified.
Electrical Characteristics (Driver part, Unless otherwise specified VCC=15V and Tj=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
HS Quiescence Current
IBBQ
30
70
150
µA
XH=XL=L, each phase
LS Quiescence Current
ICCQ
0.2
0.7
1.3
mA
XH=XL=L
V(BR)DSS
600
-
-
V
ID=1mA, XH=XL=L
Power Supply
Output MOSFET
D-S Breakdown Voltage
Leak Current
IDSS
-
-
100
µA
VDS=600V, XH=XL=L
RDS(ON)
-
2.7
3.5
Ω
ID=0.75A
VSD
-
1.1
1.5
V
ID=0.75A
Leak Current
ILBD
-
-
10
µA
VBX=600V
Forward Voltage
VFBD
1.5
1.8
2.1
V
IBD=-5mA with series-res.
Series Resistance
RBD
-
200
-
Ω
Input Bias Current
IXIN
30
50
70
µA
Input High Voltage
VXINH
2.5
-
VCC
V
Input Low Voltage
VXINL
0
-
0.8
V
High Side Release Voltage
VBUVH
9.5
10.0
10.5
V
VBX - VX
High Side Lockout Voltage
VBUVL
8.5
9.0
9.5
V
VBX - VX
Low Side Release Voltage
VCCUVH
11.0
11.5
12.0
V
Low Side Lockout Voltage
VCCUVL
10.0
10.5
11.0
V
VSNS
0.8
0.9
1.0
V
Output Low Voltage
VFOL
-
-
0.8
V
Input High Voltage
VFINH
2.5
-
VCC
V
Input Low Voltage
VFINL
0
-
0.8
V
Noise Masking Time
tMASK
2.0
-
-
µs
DC On Resistance
Diode Forward Voltage
Bootstrap Diode
Control Inputs
VIN=5V
Under Voltage Lock Out
Over Current Protection
Threshold Voltage
Fault Output
IO=+10mA
(Note) All voltages are with respect to ground unless otherwise specified.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
9/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Typical Performance Curves (Reference Data)
2.5
2.5
+125°C
+25°C
-25°C
2.0
Supply Current : ICC [mA]
2.0
Supply Current : ICC [mA]
+125°C
+25°C
-25°C
1.5
1.0
1.5
1.0
0.5
0.5
0
0
12
14
16
18
Supply Voltage : VCC [V]
12
20
Figure 14. Quiescence Current
(Low Side Drivers)
14
16
18
Supply Voltage : VCC [V]
20
Figure 15. Low Side Drivers Operating Current
(fPWM: 20kHz, One-Phase Switching)
3.0
120
Supply Current : IQVBX [µA]
Supply Current : ICC [mA]
100
2.5
2.0
1.5
80
60
40
+125°C
+25°C
-25°C
1.0
+125°C
+25°C
-25°C
20
12
14
16
18
Supply Voltage : VCC [V]
20
12
Figure 16. Low Side Drivers Operating Current
(fPWM: 20kHz, Two-Phase Switching)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
14
16
18
Supply Voltage : VBX - VX [V]
20
Figure 17. Quiescence Current
(High Side Driver, Each Phase)
10/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Typical Performance Curves (Reference Data) - continued
250
Input Bias Current : IHIN/ILIN [µA]
Supply Current : IQVBX [µA]
300
250
200
150
+125°C
+25°C
-25°C
200
150
100
50
+125°C
+25°C
-25°C
0
100
12
14
16
18
Supply Voltage : VBX - VX [V]
0
20
Figure 18. High Side Driver Operating Current
(fPWM: 20kHz, Each Phase)
20
Figure 19. Input Bias Current
(UH,UL,VH,VL,WH,WL)
20
20
+125°C
+25°C
-25°C
15
Internal Logical Voltage: VOUT [V]
Internal Logical Voltage: VOUT [V]
5
10
15
Input Voltage : VHIN/VLIN [V]
10
5
0
+125°C
+25°C
-25°C
15
10
5
0
1
1.5
2
Input Voltage : VIN [V]
2.5
0.6
Figure 20. Input Threshold Voltage
(UH, UL, VH, VL, WH, WL, FOB)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
0.7
0.8
0.9
1.0
1.1
Input Voltage : VPGND [V]
1.2
Figure 21. Over Current Detection Voltage
11/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Typical Performance Curves (Reference Data) - continued
8
Noise Masking Time : tMASK [µs]
Internal Logical Voltage: VOUT [V]
20
15
10
5
4
2
TSD
UVLO
OCP
0
0
-25
100 110 120 130 140 150 160 170 180
0
25
50
75
100
Junction Temperature : Tj [°C]
Junction Temperature : Tj [°C]
Figure 22. Thermal Shut Down
Figure 23. Noise Masking Time
50
1.0
40
0.8
Output Voltage : VFOB [V]
Release Time : tRELEASE [µs]
6
30
20
10
0.6
0.4
0.2
TSD
UVLO
OCP
0
+125°C
+25°C
-25°C
0
-25
0
25
50
75
100
125
0
Junction Temperature : Tj [°C]
Figure 24. Release Time
(No External Capacitor)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
125
2
4
6
8
Output Current : IFOB [mA]
10
Figure 25. Fault Output ON Resistance
12/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Typical Performance Curves (Reference Data) - continued
20
Internal Logical Voltage : VOUT [V]
Internal Logical Voltage : VOUT [V]
20
15
+125°C
+25°C
-25°C
+125°C
+25°C
-25°C
10
5
0
+125°C
+25°C
-25°C
15
10
5
0
8
9
10
11
12
Supply Voltage : VBX - VX [V]
13
8
Figure 26. Under Voltage Lock Out
(High side Driver)
9
10
11
12
Supply Voltage : VCC[V]
13
Figure 27. Under Voltage Lock Out
(Low Side Drivers)
1500
1500
-25°C
+25°C
+125°C
Input/Output Propagation Delay : tdon [ns]
Minimum Pulse Width : tPWMIN [ns]
+125°C
+25°C
-25°C
+125°C
+25°C
-25°C
Low side
1000
1000
Low side
500
High side
+125°C
+25°C
-25°C
High side
500
+125°C
+25°C
-25°C
0
0
12
14
16
Supply Voltage : VCC [V]
12
18
Figure 28. Minimum Input Pulse Width
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
14
16
Supply Voltage : VCC [V]
18
Figure 29. Input/Output Propagation Delay
(On delay)
13/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Typical Performance Curves (Reference Data) - continued
2
+125°C
+25°C
-40°C
-40°C
+25°C
+125°C
8
Forward Voltage : VSD [V]
Output On Resistance : RDS(ON) [Ω]
10
6
4
1.5
1
0.5
2
0
0
0
0.5
1
1.5
Drain Current : IDS [A]
0
2
Figure 30. Output MOSFET ON Resistance
2
Figure 31. Output MOSFET Body Diode
1.2
4
+125°C
+25°C
-40°C
Drop Voltage : VBSR [V]
1.0
Forward Voltage : VFBD [V]
0.5
1
1.5
Drain Current : ISD [A]
0.8
0.6
-40°C
+25°C
+125°C
0.4
3
2
1
0.2
0
0
0
2
4
6
8
Bootstrap Diode Current : IBD [mA]
10
0
Figure 32. Bootstrap Diode Forward Voltage
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
2
4
6
8
Series Resistor Current : IBR [mA]
10
Figure 33. Bootstrap Series Resistor
14/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Typical Performance Curves (Reference Data) - continued
15
200
+125°C
+25°C
-40°C
EON
150
Recovery Loss : E [µJ]
Switching Loss : E [µJ]
+125°C
+25°C
-40°C
100
10
5
50
EOFF
0
0
0
0.5
1
Drain Current : ID [A]
0
1.5
Figure 34. High Side Switching Loss
(VDC=300V)
1.5
Figure 35. High Side Recovery Loss
(VDC=300V)
15
200
+125°C
+25°C
-40°C
+125°C
+25°C
-40°C
EON
150
Recovery Loss : E [µJ]
Switching Loss : E [µJ]
0.5
1
Drain Current : ID [A]
100
10
5
50
EOFF
0
0
0
0.5
1
Drain Current : ID [A]
0
1.5
Figure 36. Low Side Switching Loss
(VDC=300V)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
0.5
1
Drain Current : ID [A]
1.5
Figure 37. Low Side Recovery Loss
(VDC=300V)
15/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Application Example
FG
Q1
VREG
R1
VSP
R9
DTR
R10
C14
C7
C13
C1
C2~C4
R2
HW HV
VREG
C8
HU
R6
C11
R3
M
C5
IC2
R4
R5
C9
C10
IC1
R8
VCC
GND
D1
C6
C12
R7
VDC
Figure 38. Application Example (180° Sinusoidal Commutation Controller + BM6242FS)
Parts List
Parts
Value
Manufacturer
Type
Parts
Value
Ratings
Type
IC1
-
IC2
-
ROHM
BM6242FS
ROHM
BD62018AFS
C1
0.1µF
50V
Ceramic
C2
2200pF
50V
Ceramic
R1
R2
1kΩ
ROHM
150Ω
ROHM
MCR18EZPF1001
C3
2200pF
50V
Ceramic
MCR18EZPJ151
C4
2200pF
50V
Ceramic
R3
150Ω
R4
20kΩ
ROHM
MCR18EZPJ151
C5
10µF
50V
Ceramic
ROHM
MCR18EZPF2002
C6
10µF
50V
Ceramic
R5
100kΩ
ROHM
MCR18EZPF1003
C7
2.2µF
50V
Ceramic
R6
100kΩ
ROHM
MCR18EZPF1003
C8
2.2µF
50V
Ceramic
R7
0.6Ω
ROHM
MCR50JZHFL1R80 // 3
C9
2.2µF
50V
Ceramic
R8
10kΩ
ROHM
MCR18EZPF1002
C10
0.1µF
50V
Ceramic
R9
0Ω
ROHM
MCR18EZPJ000
C11
2.2µF
50V
Ceramic
R10
0Ω
ROHM
MCR18EZPJ000
C12
100pF
50V
Ceramic
Q1
-
ROHM
DTC124EUA
C13
0.1µF
630V
Ceramic
D1
-
ROHM
KDZ20B
C14
0.1µF
50V
Ceramic
HX
-
-
Hall elements
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
16/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Dummy Pin Descriptions
VCC
PGND
VCC
VDC
(VDC)
FOB
UH
BU
(U)
UL
U
Dummy pins handling inside the package
· VCC pins, 1pin and 12pin are electrically connected in the
inner lead frame.
· FOB pins, 2pin and 13pin are electrically connected in the
inner lead frame.
· VDC pins, 18pin and 23pin are electrically connected in the
inner lead frame.
NC
BV
(V)
VH
V
VL
NC
(VDC)
NC
VDC
WH
WL
BW
(W)
FOB
W
VCC
(PGND)
GND
PGND
VCC
PGND
Figure 39. Dummy Pins
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
17/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
I/O Equivalent Circuits
VREG
UH
UL
BX
VH
PGND
VL
WH
VDC
100k
WL
Figure 40.UH,UL,VH,VL,WH,WL
Figure 41. PGND
X
VCC
VREG
FOB
PGND
GND
Figure 42. FOB
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Figure 43. VCC, GND, VDC, BX(BU/BV/BW), X(U/V/W)
18/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital
and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.
Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the
capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins
that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back
EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause
the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics,
supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground
caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground
voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions.
The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the
IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be
turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage
from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin
shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional
solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply
or ground line.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
19/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
10. Regarding the Input Pin of the IC
Do not force voltage to the input pins when the power does not supply to the IC. Also, do not force voltage to the input pins
that exceed the supply voltage or in the guaranteed the absolute maximum rating value even if the power is supplied to the
IC.
When using this IC, the high voltage pins VDC, BU/U, BV/V and BW/W need a resin coating between these pins. It is judged
that the inter-pins distance is not enough. If any special mode in excess of absolute maximum ratings is to be implemented
with this product or its application circuits, it is important to take physical safety measures, such as providing
voltage-clamping diodes or fuses. And, set the output transistor so that it does not exceed absolute maximum ratings or
ASO. In the event a large capacitor is connected between the output and ground, and if VCC and VDC are short-circuited
with 0V or ground for any reason, the current charged in the capacitor flows into the output and may destroy the IC.
This IC contains the controller chip, P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic
diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference
among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as
applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided.
Resistor
Transistor(NPN)
Pin B
Pin A
E
Pin A
C
P
N
P+ N
Pin B
B
C
N
P+ N
Parasitic
Elements
N
P+
N
P
N
B
P+ N
E
P Substrate
P Substrate
Parasitic
Elements
N
GND
Parasitic
Elements
GND
GND
N Region
close-by
Parasitic
Elements
Figure 44. Example of IC structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature
and the decrease in nominal capacitance due to DC bias and others.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
20/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Ordering Information
B M
6
2
4
ROHM Part Number
BM6242 : 600V/1.5A
2
F
S
Package
FS : SSOP-A54_23
-
E
2
Packaging specification
E2 : Embossed carrier tape
Marking Diagrams
SSOP-A54_23
(TOP VIEW)
Part Number Marking
BM6242FS
1PIN MARK
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
LOT Number
21/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Physical Dimension and Packing Information
Package Name
SSOP-A54_23
22.0±0.2
(MAX 22.35 include BURR)
23
15
1
14
0.4 Min.
11.4±0.2
14.1±0.3
4°+6°
-4°
1.05±0.1
0.27±0.1
0.1±0.1
2.1±0.1
(UNIT : mm)
PKG : SSOP-A54_23
0.8
0.1
0.38±0.1
Tape
Embossed carrier tape
Quantity
1000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
Reel
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Direction of feed
1pin
*Order
quantity needs to be multiple of the minimum quantity.
22/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
BM6242FS
Revision History
Date
Revision
06.Jul.2018
001
Changes
New Release
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
23/23
TSZ02201-0P1P0C402140-1-2
06.Jul.2018 Rev.001
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
工商网监
湘ICP备2023018690号
