Datasheet
For Air-Conditioner Fan Motor
3-Phase Brushless Fan Motor
Driver
BM6249FS
General Description
Key Specifications
◼
◼
◼
◼
◼
◼
◼
This 3-phase Brushless Fan motor driver IC adopts
PrestoMOS™ as the output transistor, and put in a small
full molding package with the 180° sinusoidal
commutation controller chip and the high voltage gate
driver chip. The protection circuits for overcurrent,
overheating, under voltage lock out and the high voltage
bootstrap diode with current regulation are built-in. It
provides downsizing the built-in PCB of the motor.
Output MOSFET Voltage:
Driver Output Current (DC):
Driver Output Current (Pulse):
Output MOSFET DC On Resistance:
Duty Control Voltage Range:
Phase Control Range:
Maximum Junction Temperature:
Package
Features
600V
±2.5A (Max)
±4.0A (Max)
1.7Ω (Typ)
2.1V to 5.4V
0° to +40°
+150°C
W(Typ) x D(Typ) x H(Max)
SSOP-A54_36A
22.0mm x 14.1mm x 2.4mm
◼ 600V PrestoMOS™ Built-in
◼ Output Current 2.5A
◼ Bootstrap operation by floating high side driver
(including diode)
◼ 180° Sinusoidal Commutation Logic
◼ PWM Control (Upper and lower arm switching)
◼ Phase control supported from 0° to +40° at 1° intervals
◼ Rotational Direction Switch
◼ FG signal output with pulse number switch (4 or 12)
◼ VREG Output (5V/30mA)
◼ Protection circuits provided: CL, OCP, TSD, UVLO,
MLP and the external fault input
◼ Fault Output (open drain)
SSOP-A54_36
Applications
◼ Air Conditioners; Air Purifiers; Water Pumps;
Dishwashers; Washing Machines
SSOP-A54_36A
Typical Application Circuit
VDC
GND
D1
VCC
C5
C6
R1
VSP
C7
C13
C1
C8
R2
HW HV
M
VREG
C2~C4
C9
HU
C11
R10
R13
R8
C14
R11
R6
Q1
R5
FG
R12
C10
R9
R4
R3
C12
R7
DTR
Figure 1. Application Circuit Example
〇Product structure : Semiconductor IC
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
〇This product has no designed protection against radioactive rays
1/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package
.................................................................................................................................................................................. 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Block Diagram and Pin Configuration ............................................................................................................................................. 3
Pin Description................................................................................................................................................................................ 3
Description of Blocks ...................................................................................................................................................................... 4
Controller Outputs and Operation Mode Summary ......................................................................................................................... 9
Absolute Maximum Ratings .......................................................................................................................................................... 10
Thermal Resistance ..................................................................................................................................................................... 10
Recommended Operating Conditions ......................................................................................................................................... 11
Electrical Characteristics (Driver part) .......................................................................................................................................... 11
Electrical Characteristics (Controller part) .................................................................................................................................... 12
Typical Performance Curves (Reference Data) ............................................................................................................................ 13
Timing Chart ................................................................................................................................................................................. 21
Application Example ..................................................................................................................................................................... 23
Parts List ....................................................................................................................................................................................... 23
Dummy Pin Descriptions............................................................................................................................................................... 24
I/O Equivalent Circuits .................................................................................................................................................................. 25
Operational Notes ......................................................................................................................................................................... 26
Ordering Information ..................................................................................................................................................................... 28
Marking Diagrams......................................................................................................................................................................... 28
Physical Dimension and Packing Information ............................................................................................................................... 29
Revision History ............................................................................................................................................................................ 30
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
2/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Block Diagram and Pin Configuration
VCC
VCC
VSP
VREG
1
5
VREG
VSP
6
7
UH
UL
HW
9
HWP
10
HVN
11
HV
HU
HVP
12
HUN
13
HUP
14
PCT
15
PC
16
VH
VL
V/I
VREG
A/D
6
TEST
VREG
CCW
17
FGS
18
VREG
FG
19
FOB
20
SNS
21
VDC
35
BU
34
U
33
BV
32
V
31
VDC
30
BW
29
W
28
PGND
VCC
GND
TEST
VREG
HWN
36
LOGIC
WH
WL
LEVEL
SHIFT
&
GATE
DRIVER
LEVEL
SHIFT
&
GATE
DRIVER
LEVEL
SHIFT
&
GATE
DRIVER
GND
GND
VCC
VSP
24
FAULT
VREG
FAULT
SINE
WAVE
GENE.
OSC
BU
VREG
NC
HWN
HWP
HVN
HVP
HUN
HUP
PCT
PC
CCW
FGS
FG
FOB
M
U
BV
V
VDC
SNS
NC
RT
GND
26 GND
FIB
VDC
GND
23 RT
BW
W
GND
GND
VCC
VSP
Figure 2. Block Diagram
PGND
Figure 3. Pin Configuration
(Top View)
Pin Description
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
Name
VCC
GND
GND
GND
VCC
VSP
VREG
NC
HWN
HWP
HVN
HVP
HUN
HUP
PCT
PC
CCW
FGS
FG
FOB
SNS
NC
RT
GND
GND
GND
VCC
Function
Low voltage power supply
Ground
Ground
Ground
Low voltage power supply
Duty control voltage input pin
Regulator output
No connection
Hall input pin phase WHall input pin phase W+
Hall input pin phase VHall input pin phase V+
Hall input pin phase UHall input pin phase U+
VSP offset voltage output pin
Phase control input pin
Direction switch (H:CCW)
FG pulse # switch (H:12, L:4)
FG signal output
Fault signal output (open drain)
Over current sense pin
No connection
Carrier frequency setting pin
Ground
Ground
Ground
Low voltage power supply
Pin
36
-
Name
VDC
VDC
Function
High voltage power supply
35
34
BU
U
U
Phase U floating power supply
33
32
BV
V
V
Phase V floating power supply
31
VDC
VDC
30
29
BW
W
W
28
PGND
PGND
Phase U output
Phase V output
High voltage power supply
Phase W floating power supply
Phase W output
Ground (current sense pin)
Note) All pin cut surfaces visible from the side of package are no connected, except the pin number is expressed as a “-”.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
3/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Description of Blocks
1. Commutation Logic
When the hall frequency is about 1.4Hz or less (e.g. when the motor starts up), the commutation mode is 120° square
wave drive with upper and lower switching (no lead angle). The controller monitors the hall frequency, and switches to
180° sinusoidal commutation drive when the hall frequency reaches or exceeds about 1.4Hz over four consecutive cycles.
Refer to the timing charts in Figures 46 and 47.
2. Duty Control
The switching duty can be controlled by forcing DC voltage with value from VSPMIN to VSPMAX to the VSP pin. When the
VSP voltage is VSPTST or more, the controller forces PC pin voltage to ground (Testing mode, maximum duty and no lead
angle). The VSP pin is pulled down internally by a 200 kΩ resistor. Therefore, note the impedance when setting the VSP
voltage with a resistance voltage divider.
3. Carrier Frequency Setting
The carrier frequency setting can be freely adjusted by connecting an external resistor
between the RT pin and ground. The RT pin is biased to a constant voltage, which
determines the charge current to the internal capacitor. Carrier frequencies can be set
within a range from about 16 kHz to 50 kHz. Refer to the formula to the right.
f OSC [kHz] =
400
RT [ k ]
4. FG Signal Output
The number of FG output pulses can be switched in accordance with the
number of poles and the rotational speed of the motor. The FG signal is output
from the FG pin. The 12-pulse signal is generated from the three hall signals
(exclusive NOR), and the 4-pulse signal is the same as hall U signal. It is
recommended to pull up FGS pin to VREG voltage when malfunctioning
because of the noise.
FGS
No. of pulse
H
12
L
4
CCW
Direction
H
CCW
L
CW
5. Direction of Motor Rotation Setting
The direction of rotation can be switched by the CCW pin. When CCW pin is “H”
or open, the motor rotates at CCW direction. When the real direction is different
from the setting, the commutation mode is 120° square wave drive (no lead
angle). It is recommended to pull up CCW pin to VREG voltage when
malfunctioning because of the noise.
6. Hall Signal Comparator
The hall comparator provides voltage hysteresis to prevent noise malfunctions. The bias current to the hall elements
should be set to the input voltage amplitude from the element, at a value is the minimum input voltage (VHALLMIN) or more.
We recommend connecting a ceramic capacitor with value from 100 pF to 0.01 µF, between the differential input pins of
the hall comparator. Note that the bias to hall elements must be set within the common mode input voltage range VHALLCM.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
4/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Description of Blocks - continued
7. Output Duty Pulse Width Limiter
Pulse width duty is controlled during PWM switching in order to ensure the operation of internal power transistor. The
controller doesn’t output pulse of less than tMIN (0.8µs minimum). Dead time is forcibly provided to prevent external power
transistors from turning on simultaneously in upper and lower side in driver output (for example, UH and UL) of each arm.
This will not overlap the minimum time tDT (1.6µs minimum). Because of this, the maximum duty of 120° square wave
drive at start up is 84% (typical).
8. Phase Control Setting
The driving signal phase can be advanced to the hall signal for phase control. The lead angle is set by forcing DC voltage
to the PC pin. The input voltage is converted digitally by a 6-bit A/D converter, in which internal VREG voltage is assumed
to be full-scale, and the converted data is processed by a logic circuit. The lead angle can be set from 0° to +40° at 1°
intervals, and updated fourth hall cycle of phase W falling edge. Phase control function only operates at sinusoidal
commutation mode. However, the controller forces PC pin voltage to ground (no lead angle) during testing mode. The
VSP offset voltage (Figure 32) is buffered to PCT pin, to connect an external resistor between PCT pin and ground. The
internal bias current is determined by PCT voltage and the resistor value (VPCT / RPCT), and mixed to PC pin. PC pin
voltage is VPC = VPCT / RPCT x RPCL. As a result, the lead angle setting is followed with the duty control voltage, and the
performance of the motor can be improved. Select the RPCT value from 50 kΩ to 200 kΩ in the range on the basis of 100
kΩ, because the PCT pin current capability is a 100 µA or less.
VPCT = VSP-VSPMIN
VSP
VSPMIN
PCT
L.A.
VPCT
RPCT
L.A.
PC
ADC
RPCL
RPCT
VSP
Figure 4. Phase Control Setting Example 1
VREG
VPCT = VSP-VSPMIN
VSP
VSPMIN
PCT
L.A.
VPCT
RPCT
L.A.
RPCH
PC
ADC
RPCL
RPCT
VSP
Figure 5. Phase Control Setting Example 2
9. Current Limiter (CL) Circuit and Overcurrent Protection (OCP) Circuit
The current limiter circuit can be activated by connecting a low value resistor for current detection between the output
stage ground (PGND) and the controller ground (GND). When the SNS pin voltage reaches or surpasses the threshold
value (VSNS, 0.5V typical), the controller forces all the upper switching arm inputs low (UH, VH, WH = L, L, L), thus
initiating the current limiter operation. When the SNS pin voltage swings below the ground, it is recommended to insert a
resistor (1.5 kΩ or more) between SNS pin and PGND pin to prevent malfunction. Since this limiter circuit is not a latch
type, it returns to normal operation - synchronizing with the carrier frequency - once the SNS pin voltage falls below the
threshold voltage. A filter is built into the overcurrent detection circuit to prevent malfunctions, and does not activate when
a short pulse of less than tMASK is present at the input.
When the SNS pin voltage reaches or surpasses the threshold value (VOVER, 0.9V typical) because of the power fault or
the short circuit except the ground fault, the gate driver outputs low to the gate of all output MOSFETs, thus initiating the
overcurrent protection operation. Since this protection circuit is also not a latch type, it returns to normal operation
synchronizing with the carrier frequency.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
5/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Description of Blocks - continued
10. Under Voltage Lock Out (UVLO) Circuit
To secure the lowest power supply voltage necessary to operate the controller and the driver, and to prevent under
voltage malfunctions, the UVLO circuits are independently built into the upper side floating driver, the lower side driver and
the controller. When the supply voltage falls to VUVL and below, the controller forces driver outputs low. When the voltage
rises to VUVH and above, the UVLO circuit ends the lockout operation and returns the chip only after 32 carrier frequency
periods (1.6ms for the default 20kHz frequency) to normal operation. Even if the controller returns to normal operation, the
output begins from the following control input signal.
The voltage monitor circuit (4.0V nominal) is built-in for the VREG voltage. Therefore, the UVLO circuit does not release
operation when the VREG voltage rising is delayed behind the VCC voltage rising even if VCC voltage becomes VUVH or
more.
11. Thermal Shutdown (TSD) Circuit
The TSD circuit operates when the junction temperature of the controller exceeds the preset temperature (125°C nominal).
At this time, the controller forces all driver outputs low. Since thermal hysteresis is provided in the TSD circuit, the chip
returns to normal operation when the junction temperature falls below the preset temperature (100°C nominal). The TSD
circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its
operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not use
the IC in an environment where activation of the circuit is assumed.
Moreover, it is not possible to follow the output MOSFET junction temperature rising rapidly because it is a gate driver chip
that monitors the temperature and it is likely not to function effectively.
12. Motor Lock Protection (MLP) Circuit
When the controller detects the motor locking during fixed time of 4 seconds nominal when each edge of the hall signal
doesn't input either, the controller forces all driver outputs low under a fixed time 20 seconds nominal, and self-returns to
normal operation. This circuit is enabled if the voltage force to VSP is over the duty minimum voltage V SPMIN, and note that
the motor cannot start up when the controller doesn’t detect the motor rotation by the minimum duty control. Even if the
edge of the hall signal is inputted within range of the OFF state by this protection circuit, it is ignored. But if the VSP is
forced to ground level once, the protection can be canceled immediately.
13. Hall Signal Wrong Input Detection
Hall element abnormalities may cause incorrect inputs that vary from the normal logic. When all hall input signals go high
or low, the hall signal wrong input detection circuit forces all driver outputs low. And when the controller detects the
abnormal hall signals continuously for four times or more motor rotation, the controller forces all driver outputs low and
latches the state. It is released if the duty control voltage VSP is forced to ground level once.
14. VREG Output
The internal voltage regulator VREG is output for the bias of the hall
element and the phase control setting. However, when using the VREG
function, be aware of the IOMAX value. If a capacitor is connected to the
ground in order to stabilize output, a value of 1 µF or more should be
used. In this case, be sure to confirm that there is no oscillation in the
output.
VCC
VREG
R1
HUP
HU
HUN
HV
HVN
HW
HWN
HVP
HWP
Controller IC
Figure 6. VREG Output Pin Application Example
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
6/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Description of Blocks - continued
15. Fault Signal Output
When the controller detects either state that should be protected the overcurrent (OCP) and the over temperature (TSD),
the FOB pin outputs low (open drain) and it returns to normal operation synchronizing with the carrier frequency. Even
when this function is not used, be pull-up the FOB pin to the voltage of 3V or more and at least a resistor with a value 10k
Ω or more. A filter is built into the fault signal input circuit to prevent malfunctions by the switching noise, and does not
activate when a short pulse of less than tMASK is present at the input. The time to the fault operation is the sum total of the
propagation delay time of the detection circuit and the filter time, 1.6µs (typical).
VSP
TRIOSC
XH
YL
XHO
YLO
1.6µs (Typ)
SNS
1.6µs (Typ)
1.6µs (Typ)
1.6µs (Typ)
0.9V(Typ)
OCP threshold
0.5V(Typ)
CL threshold
FOB
Figure 7. Fault Operation ~ OCP ~ Timing Chart
10
The release time from the protection operation can be
changed by inserting an external capacitor. Refer to the
formula below. Release time of 5ms or more is
recommended.
2 .3
) R C [s]
VREG
8
Release time : t [ms]
t = − ln( 1 −
9
VREG
R
FOB
7
6
5
4
3
2
C
1
0
0.01
Figure 8. Release Time Setting Application Circuit
0.10
1.00
Capacitance : C[µF]
Figure 9. Release Time (Reference Data @R=100kΩ)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
7/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Description of Blocks - continued
16. Bootstrap Operation
VB
DX
VB
VDC
DX
CB
HO
L
OFF
VDC
CB
HO
H
VS
ON
VS
VCC
VCC
LO
H
ON
LO
L
Figure 10. Charging Period
OFF
Figure 11. Discharging Period
The bootstrap is operated by the charge period and the discharge period being alternately repeated for bootstrap
capacitor (CB) as shown in the figure above. In a word, this operation is repeated while the output of an external transistor
is switching with synchronous rectification. Because the supply voltage of the floating driver is charged from the VCC
power supply to CB through prevention of backflow diode DX, it is approximately (VCC-1V). The resistance series
connection with DX has the impedance of approximately 200 Ω. Because the total gate charge is needed only by the
carrier frequency in the upper switching section of 120° commutation driving, set it after confirming actual application
operation.
17. Switching Time
XH, XL
VDS
trr
ton
td(on)
tr
90%
90%
ID
10%
10%
td(off)
tf
toff
Figure 12. Switching Time Definition
Parameter
High Side Switching
Time
Low Side Switching
Time
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Symbol
tdH(on)
trH
trrH
tdH(off)
tfH
tdL(on)
trL
trrL
tdL(off)
tfL
Reference
950
150
220
490
20
870
145
160
555
30
8/30
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Conditions
VDC=300V, VCC=15V, ID=1.25A
Inductive load
The propagation delay time: Internal
gate driver input stage to the driver
IC output.
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Controller Outputs and Operation Mode Summary
Detected direction
Forward (CW:U~V~W, CCW:U~W~V)
Reverse (CW:U~W~V, CCW:U~V~W)
Conditions
Hall sensor frequency
1.4Hz ≤
< 1.4Hz
VSP < VSPMIN
(Duty off)
Normal
operation
VSPMIN < VSP < VSPMAX
(Control range)
VSPTST < VSP
(Testing mode)
< 1.4Hz
1.4Hz ≤
Upper and lower arm off
120°
Upper and lower
switching
180° sinusoidal
Upper and lower
switching
180° sinusoidal
Upper and lower
switching
(No lead angle)
Current limiter (Note 1)
120°
Upper and lower
switching
Upper arm off
120°
Upper switching
Upper and lower arm off
Overcurrent (Note 2)
TSD (Note 2)
Protect
operation
External input (Note 2)
Upper and lower arm off
UVLO (Note 3)
Motor lock
Hall sensor abnormally
(Note)
(Note)
(Note 1)
(Note 2)
(Note 3)
Upper and lower arm off and latch
The controller monitors both edges of three hall sensors for detecting period.
Phase control function only operates at sinusoidal commutation mode. However, the controller forces no lead angle during the testing mode.
It returns to normal operation by the carrier frequency synchronization.
It works together with the fault operation, and returns after the release time synchronizing with the carrier frequency.
It returns to normal operation after 32 cycles of the carrier oscillation period.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
9/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Absolute Maximum Ratings (Tj=25°C)
Parameter
Symbol
Ratings
Unit
VDSS
600
V
Supply Voltage
VDC
-0.3 to +600
V
Output Voltage
VU, VV, VW
-0.3 to +600
V
Output MOSFET
High Side Supply Pin Voltage
VBU, VBV, VBW
-0.3 to +600
V
VBU-VU, VBV-VV, VBW-VW
-0.3 to +20
V
Low Side Supply Voltage
VCC
-0.3 to +20
V
Duty Control Voltage
VSP
-0.3 to +20
V
High Side Floating Supply Voltage
All Others
VI/O
-0.3 to +5.5
V
IOMAX(DC)
±2.5
A
Driver Outputs (Pulse)
IOMAX(PLS)
±4.0 (Note 1)
A
Fault Signal Output
IOMAX(FOB)
15
mA
Tstg
-55 to +150
°C
Tjmax
150
°C
Driver Outputs (DC)
Storage Temperature
Maximum Junction Temperature
(Note)
(Note 1)
All voltages are with respect to ground unless otherwise specified.
Pw ≤ 10µs, Duty cycle ≤ 1%
Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC
is operated over the absolute maximum ratings.
Caution2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance (Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s (Note 3)
Unit
SSOP-A54_36A
Junction to Ambient
Junction to Top Characterization Parameter
(Note 2)
θJA
41.7
°C/W
ΨJT
10
°C/W
(Note 1) Based on JESD51-2A(Still-Air)
(Note 2) Refer to Figure 13. for temperature measurement point on the component package top surface.
(Note 3) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
2.7mm
5.6mm
Measurement point
Figure 13. Temperature Measurement Point
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
10/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Recommended Operating Conditions (Tj=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
VDC
-
310
400
V
VBU-VU, VBV-VV, VBW-VW
13.5
15
16.5
V
VCC
13.5
15
16.5
V
Supply Voltage
High Side Floating Supply Voltage
Low Side Supply Voltage
Bootstrap Capacitor
CB
1.0
-
-
µF
VCC Bypass Capacitor
CVCC
1.0
-
-
µF
Shunt Resistor (PGND)
RS
0.5
-
-
Ω
Junction Temperature
Tj
-40
-
+125
°C
(Note) All voltages are with respect to ground unless otherwise specified.
Electrical Characteristics (Driver part, Unless otherwise specified VCC=15V and Tj=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
HS Quiescence Current
IBBQ
30
70
150
µA
VSP=0V, each phase
LS Quiescence Current
ICCQ
0.2
0.7
1.3
mA
VSP=0V
V(BR)DSS
600
-
-
V
ID=1mA, VSP=0V
IDSS
-
-
100
µA
VDS=600V, VSP=0V
RDS(ON)
-
1.7
2.5
Ω
ID=1.25A
VSD
-
1.1
1.5
V
ID=1.25A
Leak Current
ILBD
-
-
10
µA
VBX=600V
Forward Voltage
VFBD
1.5
1.8
2.1
V
IBD=-5mA with series-res.
Series Resistance
RBD
-
200
-
Ω
High Side Release Voltage
VBUVH
9.5
10.0
10.5
V
VBX - VX
High Side Lockout Voltage
VBUVL
8.5
9.0
9.5
V
VBX - VX
Power Supply
Output MOSFET
D-S Breakdown Voltage
Leak Current
DC On Resistance
Diode Forward Voltage
Bootstrap Diode
Under Voltage Lock Out
(Note) All voltages are with respect to ground unless otherwise specified.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
11/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Electrical Characteristics - continued (Controller part, Unless otherwise specified VCC=15V and Tj=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Supply Current
ICC
0.8
2.0
3.5
mA
VSP=0V
VREG Voltage
VREG
4.5
5.0
5.5
V
IO=-30mA
IHALL
-2.0
-0.1
+2.0
µA
VIN=0V
Common Mode Input
VHALLCM
0.3
-
VREG-1.5
V
Minimum Input Level
VHALLMIN
50
-
-
mVp-p
Hysteresis Voltage P
VHALLHY+
5
13
23
mV
Hysteresis Voltage N
VHALLHY-
-23
-13
-5
mV
ISP
15
25
35
µA
Duty Minimum Voltage
VSPMIN
1.8
2.1
2.4
V
Duty Maximum Voltage
VSPMAX
5.1
5.4
5.7
V
Testing Operation Range
VSPTST
8.2
-
18
V
Minimum Output Duty
DMIN
-
2
-
%
fOSC=20kHz
Maximum Output Duty
DMAX
-
100
-
%
fOSC=20kHz
Input Bias Current
IIN
-70
-50
-30
µA
VIN=0V
Input High Voltage
VINH
3
-
VREG
V
Input Low Voltage
VINL
0
-
1
V
Input High Voltage
VFOBIH
3
-
VREG
V
Input Low Voltage
VFOBIL
0
-
1
V
Output Low Voltage
VFOBOL
0
0.07
0.60
V
IO=5mA
Output High Voltage
VMONH
VREG-0.40
VREG-0.10
VREG
V
IO=-2mA
Output Low Voltage
VMONL
0
0.02
0.40
V
IO=2mA
Input Bias Current
ISNS
-30
-20
-10
µA
VIN=0V
Current Limiter Voltage
VSNS
0.48
0.50
0.52
V
Overcurrent Voltage
VOVER
0.84
0.90
0.96
V
Noise Masking Time
tMASK
0.8
1.0
1.2
µs
Minimum Lead Angle
PMIN
-
0
1
deg
VPC=0V
Maximum Lead Angle
PMAX
39
40
-
deg
VPC=2/3·VREG
fOSC
18
20
22
kHz
RT=20kΩ
Power Supply
Hall Comparators
Input Bias Current
Duty Control
Input Bias Current
VIN=5V
Mode Switch - FGS, CCW
Fault Input/Output - FOB
Monitor Output - FG
Current Detection - SNS
Phase Control
Carrier Frequency Oscillator
Carrier Frequency
Under Voltage Lock Out
LS Release Voltage
VCCUVH
11.5
12.0
12.5
V
LS Lockout Voltage
VCCUVL
10.5
11.0
11.5
V
(Note) All voltages are with respect to ground unless otherwise specified.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
12/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Typical Performance Curves (Reference Data)
10
5
+125°C
+25°C
-40°C
9
Supply Current : ICC [mA]
Supply Current : ICC [mA]
4.5
4
3.5
3
2.5
7
6
+125°C
+25°C
-40°C
5
2
4
1.5
12
14
16
18
Supply Voltage : VCC [V]
12
20
Figure 14. Quiescence Current
(Low Side Drivers)
120
400
100
350
80
60
40
14
16
18
Supply Voltage : VCC [V]
20
Figure 15. Low Side Drivers Operating Current
(FPWM: 20kHz)
Supply Current : IQVBX [µA]
Supply Current : IQVBX [µA]
8
+125°C
+25°C
-40°C
300
250
200
+125°C
+25°C
-40°C
20
150
12
14
16
18
Supply Voltage : VCC [V]
20
12
Figure 16. Quiescence Current
(High Side Driver, Each Phase)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
14
16
18
Supply Voltage : VCC [V]
20
Figure 17. High Side Driver Operating Current
(fPWM: 20kHz, Each Phase)
13/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Typical Performance Curves (Reference Data) - continued
2
+125°C
+25°C
-40°C
-40°C
+25°C
+125°C
6
Forward Voltage : VSD [V]
Output On Resistance : RDS(ON) [Ω]
8
4
2
1.5
1
0.5
0
0
0
0.5
1
1.5
2
Drain Current : IDS [A]
2.5
0
3
Figure 18. Output MOSFET ON Resistance
1
1.5
2
Drain Current : ISD [A]
2.5
3
Figure 19. Output MOSFET Body Diode
1.2
4
+125°C
+25°C
-40°C
Drop Voltage : VBSR [V]
1
Forward Voltage : VFBD [V]
0.5
0.8
0.6
-40°C
+25°C
+125°C
0.4
3
2
1
0.2
0
0
0
2
4
6
8
Bootstrap Diode Current : IBD [mA]
10
0
Figure 20. Bootstrap Diode Forward Voltage
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
2
4
6
8
Series Resistor Current : IBR [mA]
10
Figure 21. Bootstrap Series Resistor
14/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Typical Performance Curves (Reference Data) - continued
15
400
+125°C
+25°C
-40°C
EON
300
Recovery Loss : E [µJ]
Switching Loss : E [µJ]
+125°C
+25°C
-40°C
200
10
5
100
EOFF
0
0
0
0.5
1
1.5
Drain Current : ID [A]
2
0
2.5
Figure 22. High Side Switching Loss
(VDC=300V)
1
1.5
Drain Current : ID [A]
2
2.5
Figure 23. High Side Recovery Loss
(VDC=300V)
400
15
+125°C
+25°C
-40°C
+125°C
+25°C
-40°C
EON
300
Recovery Loss : E [µJ]
Switching Loss : E [µJ]
0.5
200
10
5
100
EOFF
0
0
0
0.5
1
1.5
Drain Current : ID [A]
2
2.5
0
Figure 24. Low Side Switching Loss
(VDC=300V)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
0.5
1
1.5
Drain Current : ID [A]
2
2.5
Figure 25. Low Side Recovery Loss
(VDC=300V)
15/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Typical Performance Curves (Reference Data) - continued
5.4
-40°C
+25°C
+110°C
5.2
VREG voltage : VREG [V]
VREG voltage : VREG [V]
5.4
5
4.8
5.2
-40°C
+25°C
+110°C
5
4.8
4.6
4.6
12
14
16
18
Supply Voltage : VCC [V]
0
20
Figure 26. VREG vs VCC
200
+110°C
+25°C
-40°C
Input Bias Current : ISP [µA]
Internal Output Voltage : [V]
40
Figure 27. VREG Drive Capability
6
5
10
20
30
Output Current : IOUT [mA]
4
3
2
1
0
+110°C
+25°C
-40°C
-1
-30
-15
0
15
Differential Voltage : VHUP-VHUN [mV]
100
50
+110°C
+25°C
-40°C
0
30
0
Figure 28. Hall Comparator Hysteresis Voltage
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
150
5
10
15
VSP Voltage : VSP [V]
20
Figure 29. VSP Input Bias Current
16/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Typical Performance Curves (Reference Data) - continued
100
1.5
60
Internal Logic Value : H/L [-]
Output Duty : DSP [%]
80
+110°C
+25°C
-40°C
40
20
1
0.5
0
+110°C
+25°C
-40°C
0
-0.5
0
2
4
6
VSP Voltage : VSP [V]
8
0
Figure 30. Output Duty vs VSP Voltage
5
5
10
15
VSP Voltage : VSP [V]
20
Figure 31. Testing Mode Threshold Voltage
4
+110°C
+25°C
-40°C
3
PC Voltage : VPC [V]
PCT Voltage : VPCT [V]
4
3
2
2
1
1
-40°C
+25°C
+110°C
0
0
0
1
2
3
4
5
VSP Voltage : VSP [V]
6
7
0
Figure 32. VSP vs PCT Offset Voltage
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
1
2
3
PCT Voltage : VPCT [V]
4
Figure 33. PCT vs PC Linearity
(RPCT=RPC=100kΩ)
17/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Typical Performance Curves (Reference Data) - continued
30
60
+25°C
+110°C
-40°C
+110°C
+25°C
-40°C
50
Frequency : fOSC [kHz]
Phase : LA [deg]
25
40
30
20
20
15
10
10
0
0
0.2
0.4
0.6
0.8
VPC/VREG (Normalized) : [V/V]
14
1
Figure 34. PC Voltage Normalized vs Lead Angle
30
Figure 35. Carrier Frequency vs RT
0
0.8
+110°C
+25°C
-40°C
-0.2
Output Voltage : VOL [V]
Output Drop Voltage : ΔVOH [V]
18
22
26
External Resistor : RT [kΩ]
-0.4
-0.6
0.6
0.4
0.2
-40°C
+25°C
+110°C
-0.8
0
0
2
4
Output Current : IOUT [mA]
6
0
Figure 36. High Side Output Voltage
(FG)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
2
4
Output Current : IOUT [mA]
6
Figure 37. Low Side Output Voltage
(FG)
18/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Typical Performance Curves (Reference Data) - continued
1.5
60
+110°C
+25°C
-40°C
Internal Logic Value : H/L [-]
Input Bias Current : IIN [µA]
50
+110°C
+25°C
-40°C
40
30
20
+110°C
+25°C
-40°C
1
0.5
0
10
-0.5
0
0
1
2
3
Input Voltage : VIN [V]
4
1.5
5
Figure 38. Input Bias Current
(CCW, FGS)
1.9
2.1
2.3
Input Voltage : VIN [V]
2.5
2.7
Figure 39. Input Threshold Voltage
(CCW, FGS, FOB)
30
1.5
+110°C
+25°C
-40°C
Internal Logic Value : H/L [-]
SNS Input Bias Current : ISNS [µA]
1.7
20
10
0
0
1
2
3
4
SNS Input Voltage : VSNS [V]
0.5
0
+110°C
+25°C
-40°C
-0.5
0.48
5
Figure 40. Input Bias Current
(SNS)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
1
0.49
0.5
0.51
Input Voltage : VSNS [V]
0.52
Figure 41. Current Limiter Input Threshold Voltage
(SNS)
19/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Typical Performance Curves (Reference Data) - continued
1.5
1.5
Internal Logic Value : H/L [-]
Internal Logic Value : H/L [-]
-40°C
+25°C
+110°C
1
0.5
0
-0.5
1
0.5
0
-0.5
0.6
0.7
0.8
0.9
1
Input Voltage : VSNS [V]
1.1
1.2
75
Figure 42. OCP Input Threshold Voltage
(SNS)
100
125
Junction Temperature : Tj [˚C]
Figure 43 Thermal Shutdown
1.5
1.5
Internal Logic Value : H/L [-]
+110°C
+25°C
-40°C
Internal Logic Value : H/L [-]
150
1
0.5
-40°C
+25°C
+125°C
0
-0.5
+110°C
+25°C
-40°C
1
0.5
0
-0.5
8
9
10
11
12
Supply Voltage : VBX-VX [V]
13
8
Figure 44. Under Voltage Lock Out
(High Side Driver, Each Phase)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
9
10
11
12
Supply Voltage : VCC [V]
13
Figure 45. Under Voltage Lock Out
(Low Side Drivers)
20/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Timing Chart (CW)
Hall Signals
HALL U
HALL V
HALL W
Spin Up (Hall Period < 1.4Hz)
UH
VHPWM
WH
PWM
PWM
UL
PWM
PWM
PWM
PWM
VLPWM
WL
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
CW Direction (Lead=0deg)
UH
VH
WH
UL
VL
WL
CW Direction (Lead=30deg)
UH
VH
WH
UL
VL
WL
FG Output (FGS=H)
FG
Figure 46. Timing Chart (Clockwise)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
21/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Timing Chart (CCW)
Hall Signals
HALL U
HALL V
HALL W
Spin Up (Hall Period < 1.4Hz)
UH
PWM
PWM
VHPWM
PWM
WH
UL
PWM
PWM
WL
PWM
PWM
PWM
PWM
PWM
PWM
PWM
VLPWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
CCW Direction (Lead=0deg)
UH
VH
WH
UL
VL
WL
CCW Direction (Lead=30deg)
UH
VH
WH
UL
VL
WL
FG Output (FGS=H)
FG
Figure 47. Timing Chart (Counter Clockwise)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
22/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Application Example
VDC
GND
D1
VCC
C5
C6
R1
VSP
C7
C13
C1
C8
R2
HW HV
M
VREG
C2~C4
C9
HU
C11
R10
R8
C14
R9
R11
R12
C10
R6
Q1
R5
FG
R13
R4
R3
C12
R7
DTR
Figure 48. Application Example (180° Sinusoidal Commutation Driver, CCW="H", FGS="H")
Parts List
Parts
Value
Manufacturer
Type
Parts
Value
Ratings
Type
IC1
-
R1
1kΩ
ROHM
BM6249FS
ROHM
MCR18EZPF1001
C1
0.1µF
50V
Ceramic
C2
2200pF
50V
Ceramic
R2
150Ω
ROHM
MCR18EZPJ151
C3
2200pF
50V
Ceramic
R3
150Ω
R4
20kΩ
ROHM
MCR18EZPJ151
C4
2200pF
50V
Ceramic
ROHM
MCR18EZPF2002
C5
10 µF
50V
Ceramic
R5
R6
100kΩ
ROHM
MCR18EZPF1003
C6
10 µF
50V
Ceramic
100kΩ
ROHM
MCR18EZPF1003
C7
2.2µF
50V
Ceramic
R7
0.5Ω
ROHM
MCR50JZHFL1R50 // 3
C8
2.2µF
50V
Ceramic
R8
10kΩ
ROHM
MCR18EZPF1002
C9
2.2µF
50V
Ceramic
R9
0Ω
ROHM
MCR18EZPJ000
C10
0.1µF
50V
Ceramic
R10
-
-
-
C11
2.2uF
50V
Ceramic
R11
0Ω
ROHM
MCR18EZPJ000
C12
100pF
50V
Ceramic
R12
-
-
-
C13
0.1µF
630V
Ceramic
R13
100kΩ
ROHM
MCR18EZPF1003
C14
0.1µF
50V
Ceramic
Q1
-
ROHM
DTC124EUA
HX
-
-
Hall elements
D1
-
ROHM
KDZ20B
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
23/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Dummy Pin Descriptions
VCC
PGND
VCC
GND
VDC
(VDC)
GND
GND
VCC
VSP
(U)
BU
VREG
NC
HWN
HWP
HVN
HVP
HUN
HUP
PCT
PC
CCW
U
BV
(V)
V
(VDC)
VDC
FGS
FG
FOB
SNS
NC
RT
GND
BW
Dummy pins handling inside the package
· All VCC pins are electrically connected in the inner lead
frame except 5pin.
· GND pins, 2pin, 3pin, 4pin, 24pin, 25pin and 26pin are
electrically connected in the inner lead frame.
· VDC pins, 31pin and 36pin are electrically connected in the
inner lead frame.
Plural same name pins
· 5pin is an independent VCC pin. 5pin and the other VCC
pins are electrically not connected in the inner lead frame.
Therefore, 5pin and 1pin needs to connect the pins each
other.
· 24pin, 25pin and 26pin are electrically connected in the
inner lead frame, but 24pin is better to use the carrier
frequency setting ground pin, and 26pin is also better to
use the small signal ground, separately. Refer to the
functional block diagram or an application circuit example.
(W)
W
GND
(PGND)
GND
VCC
PGND
VCC
PGND
Figure 49. Dummy Pins
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
24/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
I/O Equivalent Circuits
VCC
VREG
VREG
100k
VSP
RT
VREG
100k
250k
SNS
2k
Figure 50. RT
Figure 51. SNS
Figure 52. VSP
VREG
VREG
HUP
HUN
HVP
HVN
HWP
HWN
FG
Figure 54. FG
VREG
Figure 53. VREG, VCC
2k
Figure 55. HXP, HXN
VREG
VREG
100k
2k
FGS
2k
PC
CCW
2k
PCT
Figure 56. FGS, CCW
Figure 57. PC, PCT
BX
VREG
VDC
FOB
X
VCC
Figure 58. FOB
PGND
Figure 59. VCC, PGND, VDC, BX(BU/BV/BW), X(U/V/W)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
25/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital
and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.
Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the
capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins
that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back
EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause
the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics,
supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground
caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground
voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions.
The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
7. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the
IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be
turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage
from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
9. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin
shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional
solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply
or ground line.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
26/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
11. Regarding the Input Pin of the IC
Do not force voltage to the input pins when the power does not supply to the IC. Also, do not force voltage to the input pins
that exceed the supply voltage or in the guaranteed the absolute maximum rating value even if the power is supplied to the
IC.
When using this IC, the high voltage pins VDC, BU/U, BV/V and BW/W need a resin coating between these pins. It is judged
that the inter-pins distance is not enough. If any special mode in excess of absolute maximum ratings is to be implemented
with this product or its application circuits, it is important to take physical safety measures, such as providing
voltage-clamping diodes or fuses. And, set the output transistor so that it does not exceed absolute maximum ratings or
ASO. In the event a large capacitor is connected between the output and ground, and if VCC and VDC are short-circuited
with 0V or ground for any reason, the current charged in the capacitor flows into the output and may destroy the IC.
This IC contains the controller chip, P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic
diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference
among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as
applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided.
Resistor
Transistor(NPN)
Pin A
Pin B
E
Pin A
C
P
N
P+ N
Pin B
B
C
N
P+ N
Parasitic
Elements
N
P+
N
P
N
B
P+ N
E
P Substrate
Parasitic
Elements
N
P Substrate
GND
Parasitic
Elements
GND
GND
N Region
close-by
Parasitic
Elements
Figure 60. Example of IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature
and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation
(ASO).
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
27/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Ordering Information
B M 6
2
4
9
ROHM Part Number
BM6249 : 600V/2.5A, 180° sinusoidal
F
S
Package
FS : SSOP-A54_36A
-
E
2
Packaging specification
E2 : Embossed carrier tape
Marking Diagrams
SSOP-A54_36A
(TOP VIEW)
Part Number Marking
BM6249FS
1PIN MARK
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
LOT Number
28/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Physical Dimension and Packing Information
Package Name
SSOP-A54_36A
(UNIT : mm)
PKG : SSOP-A54_36A
Tape
Quantity
Direction
of feed
Embossed carrier tape
1000pcs
E2
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
Reel
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Direction of feed
1pin
*Order
quantity needs to be multiple of the minimum quantity.
29/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
BM6249FS
Revision History
Date
Revision
Changes
06.Apr.2018
001
New Release
22.Feb.2019
002
Correct some misdescriptions
04.Jul.2023
003
Correct some misdescriptions
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
30/30
TSZ02201-0P1P0C402210-1-2
04.Jul.2023 Rev.003
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
工商网监
湘ICP备2023018690号
