BM81004MUV-ZE2

BM81004MUV-ZE2

  • 厂商:

    ROHM(罗姆)

  • 封装:

    VFQFN48_EP

  • 描述:

    12V INPUT MULTI-CHANNEL SYSTEM P

  • 数据手册
  • 价格&库存
BM81004MUV-ZE2 数据手册
Datasheet Power supply IC series for TFT-LCD panels 12V Input Multi-Channel System Power Supply IC BM81004MUV General Description BM81004MUV is a system power supply for TFT-LCD panels used for liquid crystal TVs. This IC is incorporated with Negative and Positive charge pump controller and Gate Pulse Modulation (GPM) function. It also features built-in EEPROM to contain each setting voltage, soft start time etc. Key Specifications  Input voltage range:  AVDD Output voltage range:  VIO Output voltage range:  HAVDD Output voltage range:  VGH Output voltage range:  VGL Output voltage range:  Switching Frequency: Features ■ Step-up DC/DC converter (AVDD). (Synchronous rectification, Built-in load switch). ■ Step-down DC/DC converter 1(VIO). (Non-synchronous rectification). ■ Step-down DC/DC converter 2(VCORE). ■ Step-down DC/DC converter 3(HAVDD). (Synchronous rectification). ■ Positive charge pump controller (VGH). ■ Negative charge pump controller (VGL). ■ Gate Pulse Modulation (GPM) function. ■ High Voltage LDO (50mA) ■ 10 bit DAC-controlled Gamma Amplifier 4ch ■ 8 bit DAC-controlled VCOM Amplifier ■ Output voltage control by I2C. ■ Built-in EEPROM. ■ Switching Frequency 750kHz (AVDD, VIO). ■ Switching Frequency 1MHz (VCORE, HAVDD).  Operating temperature range: 8.6V to 14.0V 11.7V to 18.0V 2.2V to 3.7V 4.8V to 11.1V 25V to 40.5V -10.2V to -4.0V 750kHz(Typ) 1MHz(Typ) -40℃ to +105℃ Package W(Typ) x D(Typ) x H(Max) 7.00mm x 7.00mm x 1.0mm VQFN48V7070A Applications ■ TFT-LCD panel Typical Application Circuit 1 (TOP VIEW) SW SW VGH AVDD VIN HAVDD VCORE VGL DRVN VGH DRVP RE N.C. VINB3 SWB3 VGHM PGND2 PGND3 EN VDD3 SWB1 VGL PGATE SWB2 AVDDS VDD2 SWO VINB2 SWI SW VINB1 AVDD VIN SW VINB1 BM81004MUV VIO N.C. PGND SWB1 PGND VL SWB1 INN VCOM HVCC HVLDO AVIN A0 SCL SDA CTRL PG AGND AMP3 VDD1 AMP4 AMP1 COMP AMP2 AMPGND VIN AVDD Figure 1. Application Circuit 1 ○Product structure:Silicon monolithic chip ○This chip is not designed for protection against ratio active rays. www.rohm.com TSZ02201-0313AAF00420-1-2 © 2014 ROHM Co., Ltd. All rights reserved. 1/49 TSZ22111・14・001 4.Dec.2014 Rev.002 BM81004MUV Typical Application Circuit 2 (TOP VIEW) SW SW VGH AVDD VIN HAVDD VCORE VGL DRVN DRVP VGH RE VINB3 N.C. SWB3 VGHM PGND2 PGND3 VDD3 EN SWB1 VGL PGATE SWB2 AVDDS VDD2 SWO VINB2 SWI VINB1 SW VINB1 AVDD VIN SW BM81004MUV PGND SWB1 PGND SWB1 VL INN VCOM HVCC HVLDO AVIN A0 CTRL SCL AMP3 SDA AGND PG AMP4 VDD1 COMP AMP1 AMPGND AMP2 VIO N.C. VIN AVDD Figure 2. Application Circuit 2 www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Typical Application Circuit 1 ............................................................................................................................................................ 1 Key Specifications........................................................................................................................................................................... 1 Package .......................................................................................................................................................................................... 1 Typical Application Circuit 2 ............................................................................................................................................................ 2 Pin Configuration ............................................................................................................................................................................ 4 Pin Description................................................................................................................................................................................ 4 Block Diagram ................................................................................................................................................................................ 5 Description of each Block ............................................................................................................................................................... 6 Absolute Maximum Ratings ............................................................................................................................................................ 7 Recommended Operating Ranges ................................................................................................................................................. 7 Electrical Characteristics................................................................................................................................................................. 8 Typical Performance Curves ......................................................................................................................................................... 12 Timing Chart ................................................................................................................................................................................. 24 Example Application ..................................................................................................................................................................... 25 Protection function explanation of each block ............................................................................................................................... 26 Protection function list ................................................................................................................................................................... 29 Serial transmission ....................................................................................................................................................................... 30 Register Map ................................................................................................................................................................................ 33 Command Table 1 ......................................................................................................................................................................... 34 Command Table 2 ......................................................................................................................................................................... 35 Selecting Application Components ............................................................................................................................................... 36 Layout Guideline ............................................................................................................................................................................. 41 Power Dissipation ......................................................................................................................................................................... 41 I/O Equivalence Circuit ................................................................................................................................................................. 42 Operational Notes ......................................................................................................................................................................... 45 Ordering Information ..................................................................................................................................................................... 47 Marking Diagram .......................................................................................................................................................................... 47 Physical Dimension Tape and Reel Information ............................................................................................................................ 48 Revision history ............................................................................................................................................................................ 49 www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV 29 VGL 30 DRVN 31 VGH 32 DRVP 33 RE 34 VGHM SWB3 35 N.C. PGND3 36 VINB3 EN VDD3 Pin Configuration (TOP VIEW) 28 27 26 25 PGND2 37 24 PGATE SWB2 38 23 AVDDS VDD2 39 22 SWO VINB2 40 21 SWI VINB1 41 20 SW VINB1 42 19 SW N.C. 43 18 PGND SWB1 44 17 PGND SWB1 45 16 VL AMPGND 46 15 COMP AMP4 47 14 AGND AMP3 48 13 CTRL 6 7 AMP1 VDD1 PG SDA SCL A0 8 9 10 11 12 INN 5 VCOM 4 HVCC 3 HVLDO 2 AVIN 1 AMP2 Thermal Pad Figure 3. Pin Configuration Pin Description PIN No. SYMBOL FUNCTION PIN No. SYMBOL FUNCTION 1 AMP2 Gamma amplifier output pin 2 25 VGL Negative charge pump output pin 2 AMP1 Gamma amplifier output pin 1 26 DRVN Negative charge pump drive pin 3 VDD1 Step-down DC/DC output pin 1 27 DRVP Positive charge pump drive pin 4 PG Power GOOD signal output pin 28 VGH Positive charge pump output pin 5 SDA Serial data input pin 29 VGHM GPM output pin 6 SCL Serial clock input pin 30 RE GPM Slope adjustment pin 7 A0 I2C address selected pin 31 VINB3 Power supply pin for Step-down DC/DC 3 8 AVIN Power supply input pin 32 N.C. ― 9 HVLDO High Voltage LDO output pin 33 SWB3 Step-down DC/DC switching pin 3 10 HVCC VCOM and Gamma power supply pin 34 PGND3 Step-down DC/DC GND pin 3 11 VCOM VCOM amplifier output pin 35 VDD3 Step-down DC/DC output pin 3 12 INN VCOM amplifier feedback pin 36 EN Enable pin 13 CTRL GPM control pin 37 PGND2 Step-down DC/DC GND pin 2 14 AGND Analog GND pin 38 SWB2 Step-down DC/DC switching pin 2 15 COMP Error amplifier output pin 39 VDD2 Step-down DC/DC output pin 2 16 VL Internal REG output pin 40 VINB2 Power supply pin for Step-down DC/DC 2 17 PGND Step-up DC/DC GND pin 41 VINB1 Power supply pin for Step-down DC/DC 1 18 PGND Step-up DC/DC GND pin 42 VINB1 Power supply pin for Step-down DC/DC 1 19 SW Step-up DC/DC switching pin 43 N.C. ― 20 SW Step-up DC/DC switching pin 44 SWB1 Step-down DC/DC switching pin 1 21 SWI Load switch input pin 45 SWB1 Step-down DC/DC switching pin 1 22 SWO Load switch output pin 46 AMPGND Gamma amplifier GND pin 23 AVDDS Step-up DC/DC feedback pin 47 AMP4 Gamma amplifier output pin 4 24 PGATE Load switch gate drive pin 48 AMP3 Gamma amplifier output pin 3 www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Block Diagram AVDD HVCC HVCC HVLDO HVLDO HVLDO HVLDO HVCC + OPAMP - VCOM COMP PGATE INN AVDDS AVDD HVCC SWO SWI + - DAC VIN BOOST CONVERTER AMP1 + - SW PGND AMP2 + - VIN AMP3 VINB1 + - BUCK CONVERTER 1 AMP4 SWB1 VIO AMPGND VIN VDD1 INTERNAL REGULATOR AVIN VIN VINB2 BUCK CONVERTER 2 VL VCORE SWB2 PGND2 EEPROM VDD2 VINB3 BUCK CONVERTER 3 SDA SCL I2C INTERFACE A0 SWB3 HAVDD PGND3 DAC VDD3 VGH REGULATOR SEQUENCE CONTROL EN DRVP SW AVDD PG SW VGH VGL GPM VGH VGHM RE AGND VGL DRVN CTRL VGL SWB1 Figure 4. Block Diagram www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Description of each Block ① BUCK CONVERTER BLOCK 2 This block generates VCORE (VDD2) voltage from Power supply voltage. After releasing UVLO of VIN, VL starts activating. After Auto Read is operated to EEPROM, VCORE will be activated. During operations, it is possible to prevent destruction of IC by OVP, UVP and OCP protection function. ② BUCK CONVERTER BLOCK 1 This block generates VIO (VDD1) voltage from Power supply voltage of VIO. After completing VCORE start-up, VIO starts activating. Power on Reset works at the time of VIN startup and the setting that is written to EEPROM will be reflected in Register. During operations, it is possible to prevent destruction of IC by OVP, UVP and OCP protection function. ③ VGL REGULATOR BLOCK This block generates VGL voltage. After completing VCORE start-up, VGL starts activating. Power on Reset works at the time of VIN startup and the setting that is written to EEPROM will be reflected in Register. During operations, it is possible to prevent destruction of IC by UVP and OCP protection function. ④ BOOST CONVERTER BLOCK This block generates AVDD (SWO) voltage from Power supply voltage. It activates when EN=H, and under condition where VIO and VGL are activating. Power on Reset works at the time of VIN startup and the setting that is written to EEPROM will be reflected in Register. During operations, it is possible to prevent destruction of IC by OVP, UVP and OCP protection function. ⑤ BUCK CONVERTER BLOCK 3 This block generates HAVDD (VDD3) voltage from Power supply voltage. HAVDD starts up following AVDD output voltage. The setting voltage range of the HAVDD voltage depends on the AVDD setting voltage, and the lower limit level of the HAVDD voltage is limited in AVDD×0.4. Power on Reset works at the time of VIN startup and the setting that is written to EEPROM will be reflected in Register. During operations, it is possible to prevent destruction of IC by OVP, UVP and OCP protection function. ⑥ HIGH VOLTAGE LDO BLOCK This block generates HVLDO voltage from Power supply voltage of AVDD (HVCC). HVLDO starts up following AVDD output voltage. Power on Reset works at the time of VIN startup and the setting that is written to EEPROM will be reflected in Register. During operations, it is possible to prevent destruction of IC by UVP and OCP protection function. ⑦ VCOM AMPLIFIER BLOCK This block generates VCOM voltage from Power supply voltage of AVDD (HVCC). VCOM calibrator function is built-in. VCOM starts up following AVDD output voltage. Power on Reset works at the time of VIN startup and the setting that is written to EEPROM will be reflected in Register. ⑧ GAMMA AMPLIFIER BLOCK This block generates AMP1 to 4 voltages from Power supply voltage of AVDD (HVCC). AMP1 to 4 startup following AVDD output voltage. Power on Reset works at the time of VIN startup and the setting that is written to EEPROM will be reflected in Register. ⑨ VGH REGULATOR BLOCK This block generates VGH voltage from AVDD voltage. After completing AVDD start-up, VGH starts activating. Power on Reset works at the time of VIN startup and the setting that is written to EEPROM will be reflected in Register. During operations, it is possible to prevent destruction of IC by OVP, UVP and OCP protection function. ⑩ GPM BLOCK This is a switching circuit to drive a gate voltage for TFT that consist of PMOS FET. VGHM output synchronizes with CTRL input and outputs High voltage = VGH at CTRL=H. GPM Falling Limit voltage can be controlled by EEPROM. ※ Caution ・EN Input tolerant function is built in this IC. No need to be always EN < VIN. ・When PG pin is not used, PG pin must be connected to GND, or it should be open. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Absolute Maximum Ratings Limits Parameter Symbol Unit MIN TYP MAX AVIN, VINB1, VINB2, VINB3 -0.3 - 24 V HVCC -0.3 - 20 V SDA, SCL, A0, EN, CTRL -0.3 - 7 V VL -0.3 - 6.5 V COMP, PG -0.3 - 7 V -0.3 - 24 V -0.3 - 20 V VGL, DRVN -15 - 7 V DRVP, VGH, VGHM, RE -0.3 - 48 V Ta -40 - 105 ℃ Tstg -55 - 150 ℃ - - 150 ℃ Supply Voltage Input Voltage SW, SWI, SWO, PGATE, AVDDS, VDD1, SWB1, VDD2, SWB2, VDD3, SWB3 HVLDO, VCOM, INN AMP1, AMP2, AMP3, AMP4 Output Voltage Operating Ambient Temperature Range Storage Temperature Range Maximum Continuous Junction Temperature Power Dissipation *1 *2 Tjmax (*1) Pd 5.08 W Θja 24.6 degC/W (*2) It shows junction temperature when stores. Derate by 40.6mW/℃ at Ta>25℃(on 4-layer 76.2mm×114.3mm×1.6mm glass epoxy board). Recommended Operating Ranges (Ta=-40℃~105℃) Limits Parameter Symbol Unit MIN TYP MAX AVIN 8.6 - 14 V EN, A0, CTRL -0.1 - 5.5 V 2 wire serial pin voltage SDA, SCL -0.1 - 5.5 V 2 wire serial frequency FCLK - - 400 kHz Supply Voltage Functional pin voltage www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Electrical Characteristics (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V) Limits Parameter Symbol MIN TYP MAX Unit Condition 【 GENERAL 】 8.0 8.3 8.6 V VIN rising 7.25 7.55 7.85 V VIN falling TSD 155 175 195 ℃ Design guarantee Internal Oscillator Frequency 1 FOSC1 600 750 900 kHz AVDD, VIO, 0 < Ta < 50℃ Internal Oscillator Frequency 2 FOSC2 800 1000 1200 kHz VCORE, HAVDD, 0 < Ta < 50℃ VL Voltage VL 4.9 5 5.1 V Consumption Current ICC - 5.4 - mA VIN Under Voltage Lockout Threshold VIN_ UVLO Thermal shutdown Not Switching 【 LOGIC SIGNALS SDA, SCL, EN, A0, CTRL 】 High Level Input Voltage VIH 2 - - V Low Level Input Voltage VIL - - 0.5 V Minimum Output Voltage VSDA - - 0.4 V RLOGIC 140 200 260 kΩ AVDD 11.7 - 18.0 V 0.1V step Regulation Voltage AVDD_R 15.444 15.6 15.756 V 27h, 1%, 0 < Ta < 50℃ Hi-Side Leakage Current ILK_SWH - 0 10 uA SWI=18V, SW=0V RON_SWH - 100 200 mΩ ISW=-500mA ILK_SWL - 0 10 uA SW=18V RON_SWL - 100 200 mΩ ISW=500mA Load SW ON-Resistance RON_LS - 100 200 mΩ ILS=500mA SW Current Limit ILIM_SW 4.25 5 5.75 A 5.0A – Offset(0.0A) setting L=6.8uH, 0 < Ta < 50℃ SW Current Limit Offset ILIM_SET 0 - 2.8 A 0.4A step 18 19.5 21 V - 18 - V - AVDD x 0.8 - V 10 - 20 msec Pull-Down Resistance SDA, ISDA=3mA EN, A0, CTRL 【 BOOST CONVERTER (AVDD) 】 Output Voltage Range Hi-Side SW ON-Resistance Lo-Side SW Leakage Current Lo-Side SW ON-Resistance Over-Voltage Protection Rise Over-Voltage Protection Fall AVDD UVP Detecting Voltage Soft Start Time VOVP_AVD D_RISE VOVP_AVD D_FALL VUVP_ AVDD TSS_ AVDD Load Switch Current Limit ILIM_LSW - 7 - A External Load Switch Current Limit ILIM_EXT 450 540 630 mV PGATE Drive Capability PGATE_ DRV - 10 - uA www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Electrical Characteristics (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V) Limits Parameter Symbol MIN TYP MAX Unit Condition 【 BUCK CONVERTER 1 (VIO) 】 Output Voltage Range Regulation Voltage Hi-Side SWB1 Leak Current Hi-Side SWB1 ON-Resistance SWB1 Current Limit VIO Over-Voltage Protection VIO UVP Detecting Voltage Soft Start Time VIO 2.2 - 3.7 V 0.1V step VIO_R 3.234 3.3 3.366 V 0Bh, 2%, 0 < Ta < 50℃ - 0 10 uA VINB1=18V, SWB1=0V - 200 300 mΩ SWB1=-500mA 2.8 3.5 4.2 A VIO x 1.03 VIO x 1.1 VIO x 0.8 VIO x 1.17 V - V - 3.3 - msec 0.396 0.400 0.404 V 1%, Ta=25℃ 0.394 0.400 0.406 V 1.5%, 0 < Ta < 50℃ - 0 10 uA VINB2=18V, SWB2=0V - 175 300 mΩ SWB2=-500mA - 0 10 uA SWB2=18V - 175 300 mΩ SWB2=500mA 2.4 3.0 3.6 A VCORE x 1.03 VCORE x 1.1 VCORE x 0.8 VCORE x 1.17 V - V - 3 - msec HAVDD 4.8 - 11.1 V 0.1V step HAVDD_R 7.68 7.8 7.92 V 1Eh, 1.5%, 0 < Ta < 50℃ - 0 10 uA VINB3=18V, SWB3=0V - 300 500 mΩ SWB3=-500mA - 0 10 uA SWB3=18V - 300 500 mΩ SWB3=500mA 1.2 1.8 2.4 A HAVDD x 1.03 HAVDD x 1.1 HAVDD x 0.8 HAVDD x 1.17 V - V ILK_ SWB1H RON_ SWB1H ILIM_ SWB1 VOVP_ VIO VUVP_ VIO TSS_VIO - L=6.8uH, 0 < Ta < 50℃ Frequency 1/4 VIO=3.3V 【 BUCK CONVERTER 2 (VCORE) 】 VCORE Reference Voltage Hi-Side SWB2 Leak Current Hi-Side SWB2 ON-Resistance Lo-Side SWB2 Leak Current Lo-Side SWB2 ON-Resistance SWB2 Current Limit VCORE Over-Voltage Protection VCORE UVP Detecting Voltage Soft Start Time VCORE_ REF ILK_ SWB2H RON_ SWB2H ILK_ SWB2L RON_ SWB2L ILIM_ SWB2 VOVP_ VCORE VUVP_ VCORE TSS_ VCORE - L=6.8uH, 0 < Ta < 50℃ Frequency 1/4 【 BUCK CONVERTER 3 (HAVDD) 】 Output Voltage Range Regulation Voltage Hi-Side SWB3 Leak Current Hi-Side SWB3 ON-Resistance Lo-Side SWB3 Leak Current Lo-Side SWB3 ON-Resistance SWB3 Current Limit HAVDD Over-Voltage Protection HAVDD UVP Detecting Voltage www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 ILK_ SWB3H RON_ SWB3H ILK_ SWB3L RON_ SWB3L ILIM_ SWB3 VOVP_ HAVDD VUVP_ HAVDD - 9/49 L=6.8uH, 0 < Ta < 50℃ Frequency 1/4 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Electrical Characteristics (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V) Limits Parameter Symbol MIN TYP MAX Unit Condition 【 VGH REGULATOR 】 Output Voltage Range Regulation Voltage Over-Current Protection VGH Over-Voltage Protection VGH UVP Detecting Voltage Soft Start Time VGH 25 - 40.5 V 0.5V step VGH_R 34.47 35 35.53 V 14h, 1.5%, 0 < Ta < 50℃ Io=5mA ILIM_ DRVP VOVP_ VGH VUVP_ VGH 5 - - mA 42 45 48 V - VGH x 0.8 - V TSS_VGH - 7 - msec VGH=35V VGL -10.2 - -4.0 V 0.2V step VGL_R -6.09 -6 -5.91 V -6.12 -6 -5.88 V 5 - - mA - VGL×0.8 - V - 2.5 - msec 【 VGL REGULATOR 】 Output Voltage Range Regulation Voltage Over-Current Protection VGL UVP Detecting Voltage Delay Time ILIM_ DRVN VUVP_ VGL TDLY_VGL 0Ah, 1.5%, Ta=25℃ Io=5mA 0Ah, 2.0%, 0 < Ta < 50℃ Io=5mA 【 GATE PULSE MODULATION (GPM) 】 VGH-VGHM ON-Resistance RGHH - 3 5 Ω RE-VGHM ON-Resistance RGHL - 3 - Ω Propagation Delay TGPM 150 250 350 nsec www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Electrical Characteristics (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V) Limits Parameter Symbol MIN TYP MAX Unit Condition 【 HIGH VOLTAGE LDO 】 LDO 11.7 - 18.0 V 0.1V step LDO_R 15.12 15.2 15.28 V 23h, 0.5% LDO_R 15.09 15.2 15.31 V 23h, 0.7%, 0 < Ta < 50℃ ILIM_ LDO - 100 - mA LDO_UVP - LDOx0.8 - V VCOM_R HVLDO X0.36 - HVLDO X0.54 V SR - 30 - V/usec I_VCOM - ±200 - mA C2h Load Stability ΔVO1 - ±15 - mV Io=-50mA~50mA DAC Resolution RES1 Output Voltage Range Regulation Voltage Over-Current Protection HVLDO UVP Detecting Voltage 【 VCOM AMPLIFIER 】 Output Voltage Range Slew Rate Output Current Capability 8 No external components Bit DAC Integral Non-linearity Error (INL) LE1 -1 - +1 LSB DAC Differential Non-linearity Error (DNL) DLE1 -1 - +1 LSB Output Current Capability I_AMP 30 - - mA Load Stability ΔVO2 - ±15 - mV DAC Resolution RES2 02~FD is the allowable margin of error against the ideal linear. 02~FD is the allowable margin of error against the ideal increase of 1LSB. 【 GAMMA AMPLIFIER 】 10 Io=-5mA~5mA Bit DAC Integral Non-linearity Error (INL) LE2 -2 - +2 LSB DAC Differential Non-linearity Error (DNL) DLE2 -2 - +2 LSB 00F ~ 3F0 is the allowable margin of error against the ideal linear. 00F ~ 3F0 is the allowable margin of error against the ideal increase of 1LSB. ○This product has no designed for protection against radioactive rays. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Typical Performance Curves (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V, VIO=3.3V, VCORE=1.2V, AVDD=15.6V, HAVDD=7.8V, VGH=35V, VGL=-6.0V, HVLDO=15.2V, VCOM=6.1V, GAMMA=7.8V, RL=no load) 1500 8 Internal Oscillatior Freqency : FOSC [kHz] 7 Input Current : Icc[mA] 6 5 4 3 EN=L No Switching 2 1 1400 1300 1200 AVDD,VIO Frequency 1100 1000 900 800 700 VCORE,HAVDD Frequency 600 500 0 5 6 7 8 9 10 11 12 13 14 5 15 6 7 8 9 10 11 12 13 14 Input Voltage : VIN [V] Input Voltage : VIN [V] Figure 5. Input Current vs Input Voltage (EN=L, no switching) Figure 6. Internal Oscillator Frequency vs Input Voltage Figure 7. Power-on (till AVDD and VGH on) Figure 8. Power-on (after AVDD on) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15 12/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Typical Performance Curves (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V, VIO=3.3V, VCORE=1.2V, AVDD=15.6V, HAVDD=7.8V, VGH=35V, VGL=-6.0V, HVLDO=15.2V, VCOM=6.1V, GAMMA=7.8V, RL=no load) 3 100 90 2 70 Output Voltage [%] Efficiency [%] 80 60 50 40 VIN=12V VIO=3.3V 30 1 0 -1 VIN=12V VIO=3.3V 20 -2 10 -3 0 0 200 400 600 800 1000 1200 1400 0 200 400 600 800 1000 Output Current [mA] Output Current [mA] Figure 9. VIO Efficiency vs Output Current Figure 10. VIO Output Voltage vs Output Current VIO (10mV/Div AC) VIO (100mV/Div AC) ΔV:6.3mV SWB1 (10V/Div) ISWB1 (500mA/Div) IOUT=500mA IOUT=100mA IOUT (500mA/Div) IOUT (500mA/Div) 1usec/Div 50usec/Div Figure 11. VIO Load Transient www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 12. VIO Switching (Output Current=500mA) 13/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Typical Performance Curves (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V, VIO=3.3V, VCORE=1.2V, AVDD=15.6V, HAVDD=7.8V, VGH=35V, VGL=-6.0V, HVLDO=15.2V, VCOM=6.1V, GAMMA=7.8V, RL=no load) 3 100 90 2 70 Output Voltage [%] Efficiency [%] 80 60 50 40 VIN=12V VCORE=1.2V 30 1 0 -1 VIN=12V VCORE=1.2V 20 -2 10 -3 0 0 200 400 600 800 1000 Output Current [mA] 1200 0 1400 Figure 13. VCORE Efficiency vs Output Current 200 400 600 Output Current [mA] 800 1000 Figure 14. VCORE Output Voltage vs Output Current VCORE (10mV/Div AC) VCORE (100mV/Div AC) ΔV:6.4mV SWB2 (10V/Div ) I OUT =300mA I SWB2 (500mA/Div ) I OUT =10mA I OUT (500mA/Div ) I OUT (200mA/Div ) 50usec/Div 1usec/Div Figure 15. VCORE Load Transient www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 16. VCORE Switching (Output Current=500mA) 14/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Typical Performance Curves (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V, VIO=3.3V, VCORE=1.2V, AVDD=15.6V, HAVDD=7.8V, VGH=35V, VGL=-6.0V, HVLDO=15.2V, VCOM=6.1V, GAMMA=7.8V, RL=no load) 100 3 90 2 70 Output Voltage [%] Efficiency [%] 80 60 50 40 VIN=12V AVDD=15.6V HAVDD=7.8V (source) 30 20 1 0 -1 VIN=12V AVDD=15.6V HAVDD=7.8V (source) -2 10 0 -3 0 200 400 600 800 1000 Output Current [mA] 1200 1400 Figure 17. HAVDD Efficiency vs Output Current (source) 0 200 400 600 800 Output Current [mA] 1000 Figure 18. HAVDD Output Voltage vs Output Current (source) HAVDD (10mV/Div AC) HAVDD (100mV/Div AC) ΔV:6.8mV SWB3 (10V/Div) IOUT=350mA ISWB3 (500mA/Div) IOUT=0mA IOUT (500mA/Div) IOUT (300mA/Div) 1usec/Div 200usec/Div Figure 19. HAVDD Load Transient (source) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 20. HAVDD Switching (source) (Output Current=500mA) 15/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Typical Performance Curves (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V, VIO=3.3V, VCORE=1.2V, AVDD=15.6V, HAVDD=7.8V, VGH=35V, VGL=-6.0V, HVLDO=15.2V, VCOM=6.1V, GAMMA=7.8V, RL=no load) 3 100 90 2 70 Output Voltage [%] Efficiency [%] 80 60 50 40 VIN=12V AVDD=15.6V HAVDD=7.8V (sink) 30 20 1 0 -1 VIN=12V AVDD=15.6V HAVDD=7.8V (sink) -2 10 0 -3 0 200 400 600 800 1000 Output Current [mA] 1200 1400 0 Figure 21. HAVDD Efficiency vs Output Current (sink) 200 400 600 800 Output Currnet [mA] 1000 Figure 22. HAVDD Output Voltage vs Output Current (sink) HAVDD (10mV/Div AC) ΔV:9.4mV HAVDD (100mV/Div AC) SWB3 (10V/Div) ISWB3 (500mA/Div) IOUT (300mA/Div) IOUT=0mA IOUT=350mA IOUT (500mA/Div) 1usec/Div 200usec/Div Figure 23. HAVDD Load Transient (sink) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 24. HAVDD Switching (sink) (Output Current=500mA) 16/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Typical Performance Curves (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V, VIO=3.3V, VCORE=1.2V, AVDD=15.6V, HAVDD=7.8V, VGH=35V, VGL=-6.0V, HVLDO=15.2V, VCOM=6.1V, GAMMA=7.8V, RL=no load) 100 3 90 2 70 Output Voltage [%] Efficiency [%] 80 60 50 40 VIN=12V AVDD=15.6V 30 1 0 -1 VIN=12V AVDD=15.6V 20 -2 10 0 -3 0 200 400 600 800 1000 Output Current [mA] 1200 1400 0 Figure 25. AVDD Efficiency vs Output Current 200 400 600 Output Current [mA] 800 1000 Figure 26. AVDD Output Voltage vs Output Current AVDD (10mV/Div AC) AVDD (200mV/Div AC) SW (10V/Div ) ΔV:18.0mV I OUT =500mA I SW (1A/Div ) I OUT =100mA I OUT (500mA/Div ) I OUT (500mA/Div ) 50usec/Div 1usec/Div Figure 27. AVDD Load Transient www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 28. AVDD Switching (Output Current=500mA) 17/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Typical Performance Curves (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V, VIO=3.3V, VCORE=1.2V, AVDD=15.6V, HAVDD=7.8V, VGH=35V, VGL=-6.0V, HVLDO=15.2V, VCOM=6.1V, GAMMA=7.8V, RL=no load) 3 VGH (200mV/Div AC) I OUT =50mA I OUT =10mA Output Voltage [%] 2 1 0 -1 VIN=12V AVDD=15.6V VGH=35V I OUT (50mA/Div ) -2 -3 200usec/Div 10 Figure 29. VGH Load Transient 30 50 70 90 110 Output Current [mA] 130 150 Figure 30. VGH Output Voltage vs Output Current VGH (20mV/Div AC) ΔV:38.7mV SW (10V/Div ) I OUT =50mA I OUT (50mA/Div ) 5usec/Div Figure 31. VGH Ripple Voltage www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Typical Performance Curves (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V, VIO=3.3V, VCORE=1.2V, AVDD=15.6V, HAVDD=7.8V, VGH=35V, VGL=-6.0V, HVLDO=15.2V, VCOM=6.1V, GAMMA=7.8V, RL=no load) 3 2 I OUT =50mA I OUT =10mA Output Voltage [%] VGL (100mV/Div AC) 1 0 -1 VIN=12V VGL=-6.0V I OUT (50mA/Div ) -2 -3 200usec/Div 10 Figure 32. VGL Load Transient 30 50 70 90 110 Output Current [mA] 130 150 Figure 33. VGL Output Voltage vs Output Current ΔV:28.2mV SWB1 (10V/Div ) I OUT =50mA I OUT (50mA/Div ) 5usec/Div Figure 34. VGL Ripple Voltage www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Typical Performance Curves (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V, VIO=3.3V, VCORE=1.2V, AVDD=15.6V, HAVDD=7.8V, VGH=35V, VGL=-6.0V, HVLDO=15.2V, VCOM=6.1V, GAMMA=7.8V, RL=no load) CTRL (5V/Div) CTRL (5V/Div) VGHM (5V/Div) VGHM (5V/Div) Delay=255nsec Delay=270nsec VGH=28V No Capacitive Load RE Resister=0Ω VGH=28V No Capacitive Load RE Resister=0Ω 500nsec/Div 500nsec/Div Figure 35. GPM Propagation Delay (rise) Figure 36. GPM Propagation Delay (fall) CTRL (5V/Div ) Clamp Voltage 20V VGHM (10V/Div ) 500usec/Div Figure 37. GPM Clamp Voltage (20V Clamp) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Typical Performance Curves (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V, VIO=3.3V, VCORE=1.2V, AVDD=15.6V, HAVDD=7.8V, VGH=35V, VGL=-6.0V, HVLDO=15.2V, VCOM=6.1V, GAMMA=7.8V, RL=no load) 3 CTRL (5V/Div) 2 Output Voltage [%] VGHM (5V/Div) 1 Delay=255nsec 0 -1 VIN=12V VGH=28V NoAVDD=15.6V Capacitive Load RE Resister=0Ω -2 HVLDO=15.2V -3 0 20 40 60 Output Current [mA] 500nsec/Div 80 100 3 3 2 2 Output Voltage [%] Output Voltage [%] Figure 38. HVLDO Output Voltage vs Output Current 1 0 -1 VIN=12V AVDD=15.6V HVLDO=15.2V VCOM=6.1V -2 1 0 -1 VIN=12V AVDD=15.6V HVLDO=15.2V GAMMA=7.8V -2 -3 -3 -200 -150 -100 -50 0 50 100 Output Current [mA] 150 200 -20 Figure 39. VCOM Output Voltage vs Output Current www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -15 -10 -5 0 5 10 Output Current [mA] 15 20 Figure 40. GAMMA Output Voltage vs Output Current 21/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Typical Performance Curves (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V, VIO=3.3V, VCORE=1.2V, AVDD=15.6V, HAVDD=7.8V, VGH=35V, VGL=-6.0V, HVLDO=15.2V, VCOM=6.1V, GAMMA=7.8V, RL=no load) VCOM (5V/Div ) VCOM (5V/Div ) S/R = 43.6V/us S/R = 43.3V/us 100nsec/Div 100nsec/Div Figure 42. VCOM Slew Rate(Fall) 1 1 0.5 0.5 INL [LSB] DNL [LSB] Figure 41. VCOM Slew Rate(Rise) 0 000h 0FFh 0 000h -0.5 -0.5 -1 -1 BIT BIT Figure 43. VCOM DNL vs BIT www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0FFh Figure 44. VCOM INL vs BIT 22/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV 2 2 1 1 INL [LSB] DNL [LSB] Typical Performance Curves (Unless otherwise specified, Ta=25℃, AVIN,VINB1,VINB2,VINB3=12V, VIO=3.3V, VCORE=1.2V, AVDD=15.6V, HAVDD=7.8V, VGH=35V, VGL=-6.0V, HVLDO=15.2V, VCOM=6.1V, GAMMA=7.8V, RL=no load) 0 000h 3FFh 0 000h -1 -1 -2 -2 BIT BIT Figure 45. GAMMA DNL vs BIT www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3FFh Figure 46. GAMMA INL vs BIT 23/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Timing Chart ON and OFF Sequence of this IC are shown below. VIN_ UVLO VIN_ UVLO VIN VL VL_ UVLO TEAR VCORE TSS_VCORE / 3.0ms EEPROM Auto Read TSS_VIO / 3.3ms VIO VGL VGL DELAY (internal) TDLY_VGL / 2.5ms EN TSS_AVDD TSS_LSW / 10ms AVDD HAVDD Load Swith ON TSS_VGH / 7ms VGH CTRL VGHM VGHM = RE VGHM = VGH Figure 47. Timing Chart VL activates with UVLO release of VIN. It reads EEPROM data by Auto Read operation after VL finish its activation. (TEAR=2msec) After Auto Read completion, VCORE activates. The Soft Start time of VCORE is 3msec. After VCORE soft-start completion, VIO activates. The Soft Start time of VIO is 3.3msec if the setting is 3.3V. After VIO soft-start completion, PG becomes high and VGL activates. (If SWB1 is used) The Soft Start time of VGL depends on output voltage setting, external capacitor etc. 2.5msec after VIO soft-start completion, Load SW turns ON (10msec) because of EN=High and AVDD activates. The Soft Start time of AVDD can be changed by register setting. (10msec or 20msec) After AVDD started, VGH activates. The Soft Start time of VGH is 7msec if the setting is 35V. After VGH started, CTRL rising or falling will be a trigger to activate GPM operation. When VGHM voltage at CTRL =L reaches the GPM clamp voltage, VGHM output is high impedance. GPM, VGH, AVDD, HAVDD shuts down when EN=Low. GPM output (VGHM) will be the same potential with RE. All output shuts down when UVLO of VIN is detected. VGHM will be the same potential with VGH. AVDD HVLDO, HAVDD and VCOM starts up followed by AVDD output voltage. AMP 1 to 4 startup followed by HVLDO output voltage. HVLDO HAVDD When EN=low, AVDD and HAVDD output become high impedance. HVLDO, VCOM and AMP1 to 4 output shut down followed by AVDD till AVDD is below a certain level. VCOM AMP1-4 EN Figure 48. Timing Chart 2 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Example Application (TOP VIEW) SW SW CFP4 RFP2 CFP2 VGH CFP3 CFP1 RFP1 AVDD QP DFP2 C28 DFP1 RQP RQN VIN HAVDD QN L35 C35 CFN2 C31 CFN1 RFN1 VGL DRVP DRVN VGH RE SWB1 DFN1 VGHM N.C. VINB3 SWB3 VDD3 PGND2 C39 PGND3 EN R30 VGL PGATE C25 L39 VCORE R39_2 R39_1 SWB2 AVDDS VDD2 SWO AVDD C39_0 C22 VINB2 SWI VINB1 SW VINB1 SW C40 VIN BM81004MUV C41 C19 L19 N.C. PGND SWB1 PGND C16 D45 L3 VL AMPGND COMP AMP4 AGND AMP3 CTRL C15 SWB1 C3 R15 VIO INN VCOM HVCC HVLDO AVIN A0 SCL SDA PG VDD1 C52 C9 C11 VIN AMP1 C53 AMP2 C54 AVDD C10 C51 C8 Figure 49. Example Application Application circuit components list Parts name Value Company Parts Number Parts name Value Company Parts Number C3 4x 10 [uF] MURATA GRM21BB31A106KE18 C40 10 [uF] MURATA GRM31CB31E106KA75 C8 1 [uF] MURATA GRM188B31E105KA75 C41 2x 10 [uF] MURATA GRM31CB31E106KA75 C9 10 [uF] MURATA GRM31CB31E106KA75 C51-54 0.1 [uF] MURATA GRM188B31H104KA92 C10 10 [uF] MURATA GRM31CB31E106KA75 R15 2.7 [kΩ] ROHM MCR03 C11 10 [uF] MURATA GRM31CB31E106KA75 R30 300 [Ω] ROHM MCR25 C15 6.8 [nF] MURATA GRM188B11E682KA01 R39_1 330 [Ω] ROHM MCR03 C16 1 [uF] MURATA GRM188CB31E105KA75 R39_2 120 [Ω] ROHM MCR03 C19 2x 10 [uF] MURATA GRM31CB31E106KA75 RFN1 2.2 [Ω] ROHM MCR25 C22 4x 10 [uF] MURATA GRM31CB31E106KA75 RFP1-2 2.2 [Ω] ROHM MCR25 C25 4.7 [uF] MURATA GRM219B31C475KE15 RQN 100 [kΩ] ROHM MCR03 CFN1 0.1 [uF] MURATA GRM188B31H104KA92 RQP 100 [kΩ] ROHM MCR03 CFN2 470 [pF] MURATA GRM188B11H471KA01 L19 6.8 [uH] TAIYO YUDEN NS10165T6R8N CFP1 0.1 [uF] MURATA GRM188B31H104KA92 L3 6.8 [uH] TAIYO YUDEN NRS8040T6R8M CPF2 0.1 [uF] MURATA GRM188B31H104KA92 L35 6.8 [uH] TAIYO YUDEN NRS8040T6R8M CPF3 1 [uF] MURATA GRM21BB31H105KA12 L39 6.8 [uH] TAIYO YUDEN NRS8040T6R8M CFP4 2.2 [nF] MURATA GRM188B11H222KA01 D45 - ROHM RSX301L-30 C28 10 [uF] MURATA GRM31CB31H106KA12 DFN1 - ROHM RB558W C31 10 [uF] MURATA GRM31CB31E106KA75 DFP1 - ROHM RB558W C35 2x 10 [uF] MURATA GRM31CB31E106KA75 DFP2 - ROHM RB558W C39 4x 10 [uF] MURATA GRM21BB31A106KE18 QN PNP ROHM 2SCR513P C39_0 22 [nF] MURATA GRM188B31H104KA92 QP NPN ROHM 2SAR513P www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV Protection function explanation of each block 1. BUCK CONVERTER BLOCK 1 (VIO) 1-1. Over Voltage Protection (OVP) OVP function is incorporated to prevent IC or other components from malfunctioning due to rising VIO voltage. Voltage inputted to VDD1 pin is monitored and if VIO voltage reaches VIO>110% (Typ), it is considered as unusual condition thus, OVP function is operated. If OVP is detected, switching is stopped until OVP release voltage (100%, Typ) falls to VIO voltage. After OVP is released, switching is re-started. 1-2. Over Current Protection (OCP) If excessive load current (SWB1 peak current>3.5A, Typ) is present, it limits current to flow to built–in Power MOS by controlling Switching. 1-3. Under Voltage Protection (UVP) Timer-latch type output UVP function is built-in. When unusual condition (VIO110%(Typ), it is considered as unusual condition thus, OVP function is operated. If OVP is detected, switching is stopped until OVP release voltage (100%,Typ) falls to VCORE voltage. After OVP is released, switching is re-started. 2-2. Over Current Protection (OCP) If excessive load current (SWB2 peak current>3.0A, Typ) is present, it limits current to flow to built–in Power MOS by controlling Switching. 2-3. Under Voltage Protection (UVP) Timer-latch type output UVP function is built-in. When unusual condition (VCORE5mA, Min) is present, It controls source current (Base current of NPN Tr) of DRVN. 3-2. Under Voltage Protection (UVP) Timer-latch type output UVP function is built in. When unusual condition is detected (VGL>80%), UVP time counter get started, and if the unusual condition continues up to 10msec (Typ), all output is latched in shutdown condition. Power reset is needed to cancel the latch state and to re-start. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/49 TSZ02201-0313AAF00420-1-2 4.Dec.2014 Rev.002 BM81004MUV 4. BOOST CONVERTER BLOCK (AVDD) 4-1. Over Voltage Protection (OVP) OVP function is built in to prevent IC or other components from malfunctioning due to excessive rise in AVDD voltage. The voltage inputted to SWO pin is being monitored. If the SWO pin voltage becomes 19.5V (Typ), OVP is detected. Once OVP is detected, switching is stopped. After AVDD voltage falls below OVP detection release voltage 18V (Typ), switching is restarted. 4-2. Over Current Protection (OCP) If excessive load current over 5A (Typ) of SW peak current is present, OCP limits current to rush to built-in Power MOS by controlling its output switching. 4-3. Under Voltage Protection (UVP) Timer-latch type output UVP function is built in. When an unusual condition is detected (AVDD110% (Typ), it is considered as unusual condition thus, OVP function is operated. If OVP is detected, switching is stopped until OVP release voltage (100%, Typ) falls to HAVDD voltage. After OVP release, switching is re-started. 5-2. Over Current Protection (OCP) If excessive load current is demanded (SWB3 peak current>1.5A, Typ), it limits current to flow to built–in Power MOS by controlling Switching. 5-3. Under Voltage Protection (UVP) Timer-latch type output UVP function is built-in. When the unusual condition (HAVDD100mA, typ.) is present, It controls source current of HVLDO. 6-2. Under Voltage Protection (UVP) Timer-latch type output UVP function is built in. When an unusual condition is detected (HVLDO38V (Typ), it is considered as unusual condition so that OVP function is operated. If OVP is detected, limit DRVP current until OVP release voltage (35V, Typ) falls to VGH voltage. After OVP release, switching is re-started. 7-2. Over Current Protection (OCP) If excessive load current (I_DRVP>5mA, Min) is present, It controls sink current (Base current of PNP Tr ) of DRVP. 7-3. Under Voltage Protection (UVP) Timer-latch type output UVP function is built-in. When an unusual condition is detected (VGH110% Stops switching. VIO3.5A Control switching pulse duty to not over current limit. I_SWB180% UVP VIO110% Stops switching. VCORE3.0A Control switching pulse duty to not over current limit. I_SWB280% UVP VCORE5mA Limit DRVN current. I_DRVN
BM81004MUV-ZE2 价格&库存

很抱歉,暂时无法提供与“BM81004MUV-ZE2”相匹配的价格&库存,您可以联系我们找货

免费人工找货
BM81004MUV-ZE2
    •  国内价格 香港价格
    • 1+11.239791+1.45567
    • 10+10.9331010+1.41595
    • 50+10.7258750+1.38911
    • 100+10.52694100+1.36335
    • 500+10.47721500+1.35691
    • 1000+10.452341000+1.35369

    库存:700