Datasheet
USB Type-C Power Delivery Controller
BM92A34MWV-Z
General Description
Key Specifications
BM92A34MWV-Z is a full function USB Type-C Power
Delivery (PD) controller that supports USB Power
Delivery using baseband communication.
BM92A34MWV-Z includes support for the PD policy
engine and communicates with an Embedded Controller
or the SoC via host interface. It supports SOP, SOP’ and
SOP’’ signaling, allowing it to communicate with cable
marker ICs, support alternate modes.
Applications
Consumer Applications:
Package
Laptop PCs, Tablet PCs
W (Typ) x D(Typ) x H(Max)
UQFN40V5050A
Features
VBUS Voltage Range:
4.75 V to 20 V
Power Consumption at Sleep Power: 0.4 mW (Typ)
Operating Temperature Range:
-30 °C to +105 °C
5.00 mm x 5.00 mm x 1.00 mm
USB Type-C Specification Compatible
USB PD Specification Compatible (BMC-PHY)
Supports Display Port Control
Automatic Mode without Ext-MCU
Two Power Path Control using N-ch MOSFET
Drivers with Back Flow Prevention
Type-C Cable Orientation Detection
Built-in VCONN Switch and VCONN Controller
Direct VBUS Powered Operation
Supports DFP/UFP/DRP Mode
Supports Dead Battery Operation
Connected the required initial voltage is 9 V
Typical Application Circuit
VBUS
Hi-side
Switch
Sink Path
Charger Power
Source Path
Power Supply
For Prov (5 V)
CC1
CC1
CC2
CC2
VSVR
VEX
S1_DRV_G2
S1_DRV_SRC
S1_DRV_G1
S2_DRV_G2
VCONN_IN
S2_DRV_SRC
D1
S2_DRV_G1
VCONN
(5 V)
VB
DSCHG
EN
VSVR
(3.3 V to 5 V)
VDDIO
(1.8 V to 5 V)
VDDIO
SMDATA
VDDIO
Optional
Ext-MCU
SMCLK
GPIO0(HPD_OUT)
GPIO1(ALERT#)
USB Type-C
GPO2/VDIV(BST_EN)
Receptacle
XCLPOFF1
XCLPOFF2
GPO3/FB(HSSWEN)
BM92A34MWV-Z
USB3.x-SS/
DP-MUX
Control
GPIO7(MSEL1)
UQFN40V5050A
N-ch
Open
Drain
GPIO6(MSEL0)
GPIO5(ORIENT)
GPIO4
VCCIN
DBGRSTCK
CSENSEN
CSENSEP
VCCIN
LDO15ACAP
LDO28CAP
GND
GND
GND
USB 3.x SS
MUX
EXP-PAD
RX1+, RX1RX2+, RX2TX1+, TX1TX2+, TX2-
DBGMODDT
VDDIO
D-
LDO15DCAP
D+
DP
HPD_OUT
USB-PHY
IDSEL/ATST1
VSTR/ATST2
XRST
Reset
VCCIN
GND
GND
〇Product structure : Silicon monolithic integrated circuit
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Key Specifications........................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Package
W (Typ) x D(Typ) x H(Max) ..................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Notation .......................................................................................................................................................................................... 3
Reference ....................................................................................................................................................................................... 3
Pin Configuration ............................................................................................................................................................................ 4
Pin Descriptions .............................................................................................................................................................................. 5
Block Diagram ................................................................................................................................................................................ 6
Absolute Maximum Ratings (Ta=25 °C) .......................................................................................................................................... 7
Thermal Resistance(Note 3) ............................................................................................................................................................... 7
Recommended Operating Conditions ............................................................................................................................................. 8
Electrical Characteristics................................................................................................................................................................. 8
1.
Internal Memory Cell Characteristics .............................................................................................................................. 8
2.
Circuit Power Characteristics .......................................................................................................................................... 8
3.
Digital Pin DC Characteristics ......................................................................................................................................... 9
4.
Power Supply Management .......................................................................................................................................... 10
5.
CC_PHY ....................................................................................................................................................................... 12
6.
Voltage Detection .......................................................................................................................................................... 14
7.
VBUS Discharge ........................................................................................................................................................... 14
8.
Power FET Gate Driver ................................................................................................................................................. 15
Timing Chart ................................................................................................................................................................................. 16
1.
Power On Sequence (Non Dead Battery Operation)..................................................................................................... 16
2.
Power On Sequence (Dead Battery Operation) ............................................................................................................ 16
3.
Reset Timing ................................................................................................................................................................. 17
4.
Power Off Sequence ..................................................................................................................................................... 17
Application Example ..................................................................................................................................................................... 18
Selection of Components Externally Connected ........................................................................................................................... 18
I/O Equivalence Circuit ................................................................................................................................................................. 19
Register Initial Values ................................................................................................................................................................... 22
Operational Notes ......................................................................................................................................................................... 23
1.
Reverse Connection of Power Supply........................................................................................................................... 23
2.
Power Supply Lines ...................................................................................................................................................... 23
3.
Ground Voltage ............................................................................................................................................................. 23
4.
Ground Wiring Pattern .................................................................................................................................................. 23
5.
Recommended Operating Conditions ........................................................................................................................... 23
6.
Inrush Current ............................................................................................................................................................... 23
7.
Operation Under Strong Electromagnetic Field ............................................................................................................. 23
8.
Testing on Application Boards ....................................................................................................................................... 23
9.
Inter-pin Short and Mounting Errors .............................................................................................................................. 24
10. Unused Input Pins ......................................................................................................................................................... 24
11. Regarding the Input Pin of the IC .................................................................................................................................. 24
12. Ceramic Capacitor ........................................................................................................................................................ 24
13. Area of Safe Operation (ASO) ...................................................................................................................................... 24
14. Over Current Protection Circuit (OCP) .......................................................................................................................... 24
Ordering Information ..................................................................................................................................................................... 25
Marking Diagrams ......................................................................................................................................................................... 25
Physical Dimension and Packing Information ............................................................................................................................... 26
Revision History ............................................................................................................................................................................ 27
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Notation
Category
Unit
Unit prefix
Notation
V
Volt (Unit of voltage)
A
Ampere (Unit of current)
Ω, Ohm
Ohm (Unit of resistance)
F
Farad (Unit of capacitance)
deg., degree
degree Celsius (Unit of temperature)
Hz
Hertz (Unit of frequency)
s (lower case)
second (Unit of time)
min
minute (Unit of time)
b, bit
bit (Unit of digital data)
B, byte
1 byte=8 bits
M, mega-, mebi-
220=1,048,576 (used with “bit” or “byte”)
M, mega-, million-
106=1,000,000 (used with “Ω” or “Hz”)
K, kilo-, kibi-
210=1,024 (used with “bit” or “byte”)
k, kilo-
103=1,000 (used with “Ω” or “Hz”)
m, milli-
10-3
µ, micro-
10-6
n, nano-
10-9
p, pico-
10-12
xx h, xx H
Numeric value
xx b
Address
Data
Signal level
Description
#xx h
Hexadecimal number.
“x”: any alphanumeric of 0 to 9 or A to F.
Binary number; “b” may be omitted.
“x”: a number, 0 or 1
“_” is used as a nibble (4 bit) delimiter.
(eg. “0011_0101b”=“35 h”)
Address in a hexadecimal number.
“x”: any alphanumeric of 0 to 9 or A to F.
bit[n]
n-th single bit in the multi-bit data.
bit[n:m]
Bit range from bit[n] to bit[m].
“H”, High
High level (over VIH or VOH) of logic signal.
“L”, Low
Low level (under VIL or VOL) of logic signal.
“Z”, “Hi-Z”
High impedance state of 3-state signal.
Reference
Name
Reference Document
Release Date
Publisher
USB Type-C
“USB Type-C Specification Release 1.1”
3.Apr.2015
USB.org
USB PD
“Power Delivery Specification Revision 2.0 Version 1.1”
7.May.2015
USB.org
SMBus
“System Management Bus (SMBus) Specification Version 2.0”
3.Aug.2000
System Management
Implementers Forum
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Pin Configuration
GPO3/FB(HSSWEN)
GPO2/VDIV(BST_EN)
VEX
GND
S1_DRV_G2
S1_DRV_SRC
S1_DRV_G1
S2_DRV_G2
S2_DRV_SRC
S2_DRV_G1
(TOP VIEW)
30
29
28
27
26
25
24
23
22
21
CSENSEN
31
20
SMCLK
CSENSEP
32
19
SMDATA
XCLPOFF1
33
18
VDDIO
XCLPOFF2
34
17
GPIO1(ALERT#)
CC1
35
16
GPIO0(HPD_OUT)
VCONN_IN
36
15
DBGMODDT
CC2
37
14
DBGRSTCK
LDO15DCAP
38
13
GPIO7(MSEL1)
LDO28CAP
39
12
GPIO6(MSEL0)
LDO15ACAP
40
11
GPIO5(ORIENT)
VSTR/ATST2
IDSEL/ATST1
XRST
VCCIN
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6
7
8
9
10
GPIO4
5
VB
4
GND
3
DSCHG
2
VSVR
1
GND
EXP-PAD
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Pin Descriptions
Pin No.
Pin Name
1
GND
2
VSTR/ATST2
I/O
Type
I
GND
Digital
I/O Level
-
IO
Analog
VCCIN
SMBus ID (device address) selection
“H”: 1A h, “L”: 18 h/Debug pin
Digital block reset
Description
Ground
Analog test/Debug pin
3
IDSEL/ATST1
I
Analog/
Digital
4
XRST
I
Digital
VCCIN
5
VCCIN
O
Analog
-
Internal power supply (Need capacitor)
6
VSVR
I
Power
-
Power supply from SVR (5 V)
7
DSCHG
IO
Analog
-
Discharge N-ch MOSFET drain
8
GND
I
GND
-
Ground
9
VB
I
Power
-
Power supply from VBUS
10
GPIO4
I
Digital
-
Mode fixation (Fix: L)
11
GPIO5(ORIENT)
O(Note 1)
Digital
-
ORIENT signal
12
GPIO6(MSEL0)
O(Note 1)
Digital
-
MSEL0 signal
13
GPIO7(MSEL1)
O(Note 1)
Digital
-
MSEL1 signal
14
DBGRSTCK
IO
Digital
VDDIO
Test for logic
15
DBGMODDT
IO
Digital
VDDIO
Test for logic
16
GPIO0(HPD_OUT)
O
Digital
VDDIO
Hot Plug Detect signal
O(Note 1)
Digital
VDDIO
Alert signal
I
Power
-
17
GPIO1(ALERT#)
18
VDDIO
19
SMDATA
IO
Digital
VDDIO
SMBus data
20
SMCLK
I
Digital
VDDIO
SMBus clock
21
S2_DRV_G1
O
Analog
-
Power path N-ch MOSFET gate control
22
S2_DRV_SRC
I
Analog
-
Power path N-ch MOSFET BG/source
23
S2_DRV_G2
O
Analog
-
Power path N-ch MOSFET gate control
24
S1_DRV_G1
O
Analog
-
Power path N-ch MOSFET gate control
25
S1_DRV_SRC
I
Analog
-
Power path N-ch MOSFET BG/source
26
S1_DRV_G2
O
Analog
-
Power path N-ch MOSFET gate control
27
GND
I
GND
-
Ground
28
VEX
I
Power
-
Extension power input
29
GPO2/VDIV(BST_EN)
O
Digital
VCCIN
Boost enable signal
30
GPO3/FB(HSSWEN)
O
VCCIN
31
CSENSEN
I
32
CSENSEP
I
Digital
Analog/
Digital
Analog/
Digital
33
XCLPOFF1
I
Analog/
Digital
VCCIN
34
XCLPOFF2
I
Analog/
Digital
VCCIN
35
CC1
IO
Analog
-
Hi-side switch enable signal
Pin 29, 30 Configuration
(Pin 31, 32)=(H, H): GPO mode
Pin 29, 30 Configuration
(Pin 31, 32)=(H, H): GPO mode
Disable clamper of CC1
L: Dead-battery not support
Open: Dead-battery support
Disable clamper of CC2
L: Dead-battery not support
Open: Dead-battery support
Configuration channel 1 for Type-C
36
VCONN_IN
I
Analog
-
Input power for VCONN
37
CC2
IO
Analog
-
Configuration channel 2 for Type-C
38
LDO15DCAP
O
Analog
-
Internal LDO 1.5 V for Digital (Need capacitor)
39
LDO28CAP
O
Analog
-
Internal LDO 2.8 V for Analog (Need capacitor)
40
LDO15ACAP
O
Analog
-
Internal LDO 1.5 V for Analog (Need capacitor)
EXP-PAD
-
-
-
The EXP-PAD connect to GND.
-
VCCIN
VCCIN
Interface voltage
(Note 1) N-ch Open Drain
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Block Diagram
BM92A34MWV-Z is a full function USB Type-C PD controller that supports USB Power Delivery using baseband
communication. It is compatible with USB Type-C Specification and USB Power Delivery Specification.
S2_DRV_G1
S2_DRV_SRC
S2_DRV_G2
S1_DRV_G1
S1_DRV_SRC
S1_DRV_G2
GND
VEX
GPO2/VDIV(BST_EN)
GPO3/FB(HSSWEN)
BM92A34MWV-Z includes the following functional blocks: Type-C Physical Layer (baseband PHY), BMC encoder/decoder,
USB PD Protocol engine, two N-ch MOSFET switch drivers to control each, OVP, Discharge FET and SMBus interface for
communicating with the host controller. It requires an external embedded controller that includes Device Policy Manager
and GPIOs for USB Type-C PD operation. BM92A34MWV-Z is able to operate independently in a dead battery condition
where the embedded controller is not operational. BM92A34MWV-Z includes an EEPROM, enabling code updates via the
SMBus interface during prototyping phase.
CSENSEN
SMCLK
N-ch MOSFET Switch
Gate Driver
CSENSEP
SMDATA
XCLPOFF1
SMBus
XCLPOFF2
Type-C
Physical Layer
VDDIO
GPIO1(ALERT#)
Device Policy
Manager
CC1
GPIO0(HPD_OUT)
VCONN_IN
Baseband PD
Physical Layer
DBGMODDT
Protocol
CC2
SPI
I/F
LDO15DCAP
DBGRSTCK
GPIO7(MSEL1)
EEPROM
LDO28CAP
GPIO6(MSEL0)
USB Type-C Power Delivery
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GPIO4
VB
GND
DSCHG
VSVR
VCCIN
XRST
IDSEL/ATST1
VSTR/ATST2
GPIO5(ORIENT)
GND
LDO15ACAP
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BM92A34MWV-Z
Absolute Maximum Ratings (Ta=25 °C)
Parameter
Maximum Supply Voltage1
(VB, VEX, DSCHG, S2_DRV_G1,
S2_DRV_G2, S2_DRV_SRC,
S1_DRV_G1, S1_DRV_SRC, S1_DRV_G2 )
Maximum Supply Voltage2
(VDDIO, VSVR, DBGRSTCK, DBGMODDT,
GPIO0, GPIO1, SMDATA, SMCLK, XRST,
VCONN_IN, VSTR/ATST2, IDSEL/ATST1,
VCCIN, GPIO4, GPIO5, GPIO6, GPIO7,
GPO2/VDIV, GPO3/FB, CSENSEN,
CSENSEP, XCLPOFF1, XCLPOFF2, CC1,
CC2, LDO28CAP)
Maximum Supply Voltage3
(LDO15DCAP, LDO15ACAP)
Maximum Different Voltage
(S2_DRV_G1 - S2_DRV_SRC,
S2_DRV_G2 - S2_DRV_SRC,
S1_DRV_G1 - S1_DRV_SRC,
S1_DRV_G2 - S1_DRV_SRC)
Maximum Junction Temperature
Storage Temperature Range
Symbol
Rating
Unit
Conditions
VIN1
-0.3 to +28
V
VIN2
-0.3 to +6.5
V
-
VIN3
-0.3 to +2.1
V
-
VDIFF
-0.3 to +6.5
V
-
Tjmax
150
°C
-
Tstg
-55 to +125
°C
-
(Note 2)
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 2) The DSCHG pin connects more than 1 kΩ for current limiting.
Thermal Resistance(Note 3)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 5)
2s2p(Note 6)
θJA
125.0
43.0
°C/W
ΨJT
21
14
°C/W
UQFN40V5050A
Junction to Ambient
Junction to Top Characterization
Parameter(Note 4)
(Note 3) Based on JESD51-2A(Still-Air).
(Note 4) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 5) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 µm
(Note 6) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Thermal Via(Note 7)
Pitch
Diameter
1.20 mm
Φ0.30 mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 µm
74.2 mm x 74.2 mm
35 µm
74.2 mm x 74.2 mm
70 µm
(Note 7) This thermal via connects with the copper pattern of all layers.
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Recommended Operating Conditions
Item
Symbol
Limit
Unit
Conditions
Min
Typ
Max
VB, VEX
4.75
-
20
V
VSVR Voltage
VSVR
3.1
-
5.5
V
-
VDDIO Voltage
VDDIO
1.7
-
5.5
V
-
VCONN_IN Input Voltage
VCONN
4.75
5.0
5.5
V
-
Topr
-30
+25
+105
°C
-
Unit
Conditions
VB, VEX Voltage
Operating Temperature
USB VBUS voltage
Electrical Characteristics
1. Internal Memory Cell Characteristics
(VB=VEX=4.75 V to 20 V, VSVR=3.1 V to 5.5 V)
Item
Data Rewriting Number(Note 8)
Data Retention Life(Note 8)
Limit
Min
Typ
Max
1000
-
-
time
Ta≤25 °C
100
-
-
time
Ta≤105 °C
20
-
-
year
Ta≤25 °C
10
-
-
year
Ta≤105 °C
Caution : Customer is permitted to rewrite EEPROM on BM92A34MWV-Z only in case of being provided technical support from ROHM.
(Note 8) Not 100% tested.
2. Circuit Power Characteristics
(Ta=25 °C, VSVR=VDDIO=3.3 V, VB=VEX=Open)
Item
Limit
Unit
Conditions
Min
Typ
Max
Sleep Power
-
0.4
-
mW
(Note 9)
Standby Power
-
3.5
-
mW
(Note10)
(Note 9) Sleep power: Power consumption at unattached plug.
(Note 10) Standby power: Power consumption at attached plug.
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Electrical Characteristics - continued
3. Digital Pin DC Characteristics
(Ta=25 °C, VSVR=VDDIO=3.3 V, VCCIN=VSVR, VB=VEX=Open)
Item
Symbol
Limit
Min
Typ
Max
Unit
Comment
V
-
V
-
VDDIO Power Pin: GPIO0, GPIO1, SMDATA, SMCLK
Input "H" Level
VIH1
0.8×
VDDIO
-
Input "L" Level
VIL1
-0.3
-
Input Leak Current
IIC1
-5
0.7×
VDDIO
Output Voltage when “H”
VOH1
0
VDDIO+
0.3
0.2×
VDDIO
+5
µA
Power: VDDIO
-
-
V
Source=1 mA
0.4
V
Sink=350 µA Max.
0.3
V
Sink=1 mA
SMDATA Pin "L" Level Voltage
VOL_SMDATA
(SMDATA)
Output Voltage when “L”
VOL1
(GPIO0, GPIO1)
VCCIN Power Pin: XRST, GPO2, GPO3, GPIO4, GPIO5, GPIO6, GPIO7
0.8×
Input "H" Level
VIH2
VCCIN
Input "L" Level
VIL2
-0.3
-
Input Leak Current
Output Voltage when “H”
(GPIOs)
Output Voltage when “L”
(GPIOs)
IIC2
-5
0.7×
VCCIN
0
VCCIN+
0.3
0.2×
VCCIN
+5
-
-
V
Source=1 mA
-
-
0.3
V
Sink=1 mA
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VOH2
VOL2
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V
-
V
-
µA
Power: VCCIN
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BM92A34MWV-Z
Electrical Characteristics - continued
4. Power Supply Management
BM92A34MWV-Z has a power selector. It selects the lowest power supply voltage from the VSVR, VEX or VB pins for low
power consumption. Internal Power Supply (the VCCIN pin) gives priority in order of the VSVR, VEX and VB pins. The
VCCIN pin supplied from the power selector is used to BM92A34MWV-Z main power source. LDOs (for internal only) are
supplied from the VCCIN pin, and output each internal supply voltage.
Each power supply input has UVLO and OVLO. And POR (power on reset) signal is generated from detection of LDO28OK,
LDO15DOK and LDO15AOK signals, and the VCCIN pin.
UVLO
/OVLO
signal
UVLO/OVLO
Detection
Power Selector
with regulator
VSVR
VEX
VB
Internal
Power
Supply
VCCIN
VCCIN
POR
(2.6 V)
POR
signal
LDO28OK
LDO
(2.8 V)
LDO28CAP
LDO15DOK
LDO
(1.5 V)
LDO15DCAP
LDO15AOK
LDO
(1.5 V)
LDO15ACAP
Internal
Power
Supply
VDDIO
detection
signal
VDDIO
DET
5 V to 20 V
VBUS
0V
5 V to 20 V
VEX
0V
5V
VSVR
0V
VCCIN
0V
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VBUS
VEX
VSVR
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4. Power Supply Management - continued
Item
Limit
Min
Typ
Max
Unit
Comment
Unless otherwise specified
Ta=25 °C, VGND=0 V,
CVCCIN=4.7 µF (Ceramic), CLDO28=CLDO15D=CLDO15A=1 µF (Ceramic)
Input Analog Pins: VSVR, VEX, VB
UVLO Rising Threshold Voltage 1
2.8
-
V
VSVR
UVLO Rising Threshold Voltage 2
-
3.5
-
V
VEX, VB
UVLO Falling Threshold Voltage
-
2.7
-
V
VSVR, VEX, VB
OVLO Rising Threshold Voltage
-
6.4
-
V
VSVR
OVLO Rising Threshold Voltage
-
28
-
V
VEX, VB
OVLO Hysteresis Voltage 1
-
240
-
mV
VSVR
OVLO Hysteresis Voltage 2
-
920
-
mV
VEX, VB
Power ON Reset Threshold Voltage
-
2.6
-
V
VCCIN
1.7
-
-
V
For dead battery operation
LDO28CAP Output Voltage
-
2.8
-
V
No Load, VSVR=5 V
LDO15DCAP Output Voltage
-
1.5
-
V
No Load, VSVR=5 V
LDO15ACAP Output Voltage
-
1.5
-
V
No Load, VSVR=5 V
VDDIO Detection Voltage
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BM92A34MWV-Z
Electrical Characteristics - continued
5. CC_PHY
CC_PHY has below functions of USB Type-C (Refer to USB Type-C Specification):
Defining Port Mode: DFP/UFP/DRP
DFP-to-UFP Attach/Detach Detection
Plug Orientation/Cable Twist Detection
USB Type-C VBUS Voltage Detection and Usage
VCONN (Supply for SOP’) Control
Baseband Power Delivery Communication (BBPD Communication)
VBUS
MCU
VCONNSW
VCONN_IN
VBUS_MONI
MCU
CC1
BB_PHY
CC2
Receptacle
Control
Logic
XCLPOFF１
CC_DET
UFP_CLAMP
Rd
GND
Rd
XCLPOFF2
GND
PORT_CONT
PORT_CONT
This block chose the port mode according to the setting from MCU.
DFP mode: Variable current source is connected to the CC1 and CC2 pin. These currents of each mode
are Default Current, Medium Current and High Current.
UFP mode: Pull-down resistor is connected to the CC1 and CC2 pin.
DRP mode: Changing DFP and UFP is repeated frequently.
CC_DET
CC_DET has functions of “Attach/Detach Detection”, “Plug Orientation/Cable Twist Detection”, “Discovery and detect
extension mode” and “USB Type-C VBUS Current Detection”.
Attach/Detach is detected with monitoring voltage of the CC1 and CC2 pin. When the voltage of the CC1 and CC2
pin become under a threshold voltage at DFP, attach is detected. Oppositely, when the voltage of the CC1 and CC2
pin become over a threshold voltage, detach is detected. When the voltage of the CC1 and CC2 pin become over a
threshold voltage at UFP, attach is detected.
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5. CC_PHY - continued
Plug orientation and cable twist is detected from the relationship of the CC1 and CC2 pins.
UFP can detect the maximum current of the power source by monitoring the voltage of the CC1 and CC2 pin.
UFP_CLAMP
Clamp is used for UFP emulation at dead-battery condition.
VBUS_MONI
UFP detect Attach/Detach by existence of VBUS voltage. VBUSDET detects Attach when VBUS voltage over the
threshold voltage. And it detects Detach when VBUS under the threshold voltage.
VCONNSW
VCONNSW is the power switch for VCONN source. It has OCP function.
BB_PHY
If Type-C controller supports BBPD, the CC1 and CC2 pin can output BBPD communication signal.
Item
Limit
Min
Typ
Max
Unit
Comment
[PORT_CONT Characteristics]
Unless otherwise specified
Ta=25 °C, VSVR=VB=VCONN_IN=5 V, VDDIO=3.3 V, VGND=0 V,
CVCCIN=4.7 µF(Ceramic), CLDO28=CLDO15D=CLDO15A=1 µF(Ceramic)
Input Analog Pins: CC1, CC2
Default Current
64
80
96
µA
-
Medium Current
166
180
194
µA
-
High Current
304
330
356
µA
-
Pull Down Resistor
4.6
5.1
[UFP_CLAMP Characteristics]
Unless otherwise specified
Ta=25 °C, VB=VCONN_IN=5 V, VDDIO=3.3 V, VGND=0 V,
CVCCIN=4.7 µF(Ceramic), CLDO28=CLDO15D=CLDO15A=1 µF(Ceramic)
Input Analog Pins: CC1, CC2
CCx Pin Input Impedance
126
-
5.6
kΩ
-
-
kΩ
-
CCx Clamp Voltage
0.7
[VBUS_MONI]
Unless otherwise specified
Ta=25 °C, VB=VCONN_IN=5 V, VDDIO=3.3 V, VGND=0 V,
CVCCIN=4.7 µF(Ceramic), CLDO28=CLDO15D=CLDO15A=1 µF(Ceramic)
Input Analog Pin: VB
VBUS Presence Detection Level
3.42
[VCONNSW]
Unless otherwise specified
Ta=25 °C, VB=VCONN_IN=5 V, VDDIO=3.3 V, VGND=0 V,
CVCCIN=4.7 µF(Ceramic), CLDO28=CLDO15D=CLDO15A=1 µF(Ceramic)
Input Analog Pins: CC1, CC2, VCONN_IN
VCONN_IN to CCx Resistance
-
1.3
V
-
V
-
500
mΩ
-
-
A
-
Overcurrent Protection Level
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1.1
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-
Pull up=64 µA to 356 µA
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Electrical Characteristics - continued
6. Voltage Detection
VDET Block detects the voltage level of VB. It can detect follow conditions:
OVP (Over Voltage Protection) Detection
VBUS Voltage Drop Detection
VBUS (VB)
OVP
Detection
VBUS Voltage
Drop Detection
Variable Reference
Voltage
Limit
Item
Min
Unit
Comment
Typ
Max
Unless otherwise specified
Ta=25 °C, VSVR=VCONN_IN=5 V, VDDIO=3.3 V, VGND=0 V,
CVCCIN=4.7 µF(Ceramic), CLDO28=CLDO15D=CLDO15A=1 µF(Ceramic)
Input Analog Pin: VB
Over Voltage Protection Detection Rate
+15
+20
+25
%
(Note 11)
VBUS Voltage Drop Detection Rate
-20
%
(Note 11)
-30
-25
(Note 11) Reference value is USB PD negotiation voltage.
7. VBUS Discharge
FET switch is prepared for VBUS discharging.
DSCHG
Discharge
Resistor
Discharge
Control
GND
Item
Limit
Min
Typ
Unless otherwise specified
Ta=25 °C, VSVR=VB=VCONN_IN=5 V, VDDIO=3.3 V, VGND=0 V,
CVCCIN=4.7 µF(Ceramic), CLDO28=CLDO15D=CLDO15A=1 µF(Ceramic)
Input Analog Pin: DSCHG
FET Switch ON Resistance
25
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Max
-
Unit
Comment
Ω
-
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Electrical Characteristics - continued
8. Power FET Gate Driver
FET Gate Driver is the external N-ch MOSFET switch driver for power line switch.
Sink Path
(Default)
VBUS
Typ
Max
Charge
Pump
OUT
IN IN
Limit
Min
S1_DRV_G2
S1_DRV_SRC
S1_DRV_G1
S2_DRV_G2
IN IN
Item
OUT
OUT
Charge
Pump
Charge
Pump
OUT
Charge
Pump
S2_DRV_G1
S2_DRV_SRC
Source Path
(Register setting is needed.)
Unit
Comment
Unless otherwise specified
Ta=25 °C, VSVR=VB=VCONN_IN=5 V, VDDIO=3.3 V, VGND=0 V,
CVCCIN=4.7 µF(Ceramic), CLDO28=CLDO15D=CLDO15A=1 µF(Ceramic)
Input Analog Pins: S1_DRV_SRC=S2_DRV_SRC=0 V
Output Analog Pins: S1_DRV_G1, S1_DRV_G2, S2_DRV_G1, S2_DRV_G2
N-ch MOSFET Control Voltage Between Gate and
Source
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-
15/27
6.0
-
V
S1_DRV_G1 - S1_DRV_SRC
S1_DRV_G2 - S1_DRV_SRC
S2_DRV_G1 - S2_DRV_SRC
S2_DRV_G2 - S2_DRV_SRC
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Timing Chart
1. Power On Sequence (Non Dead Battery Operation)
3.1 V to 5.5 V
VSVR
0V
1.7 V to 5.5 V
VDDIO
0V
5V
VB
(Status)
0V
Firmware
Download
Shutdown
Normal Operation
(Non Dead Battery )
Firmware Download
(Max 230 ms)
SMBus can’t
operate
(SMBus access)
SMBus can operate
2. Power On Sequence (Dead Battery Operation)
3.1 V to 5.5 V
VSVR
0V
1.7 V to 5.5 V
VDDIO
0V
5V
VB
0V
Firmware Download
(Max 230 ms)
(Status)
Shutdown
(SMBus access)
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TSZ22111 • 15 • 001
Dead Battery
Operation
Firmware
Download
SMBus can’t
operate
16/27
Normal Operation
(Non Dead Battery )
SMBus can operate
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Timing Chart - continued
3. Reset Timing
Input “L” level more than 100 μs
when need reset.
t1
t2
XRST
(SMBus access)
SMBus can operate
Item
Symbol
XRST Minimum “L” Level Pulse
SMBus Access Start After XRST
Release
SMBus can operate
SMBus can’t operate
Limit
Unit
Comment
-
µs
-
-
ms
-
Min
Typ
Max
t1
100
-
t2
230
-
4. Power Off Sequence
3.1 V to 5.5 V
VSVR
0V
(Status)
Normal Operation
(Non Dead Battery)
Shutdown
(SMBus Access)
SMBus can operate
SMBus can’t operate
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Application Example
Q1
Q2
10µF
VBUS
Q3
Hi-side
Switch
Q4
Sink Path
Charger Power
Source Path
Power Supply
For Prov (5 V)
CC1
CC1
CC2
CC2
VDDIO
100kΩ
100kΩ
100kΩ
100kΩ
10kΩ
SMDATA
10kΩ
VDDIO
100kΩ
1µF
1µF
VSVR
VEX
S1_DRV_G2
S1_DRV_SRC
S1_DRV_G1
S2_DRV_G2
VCONN_IN
D1
S2_DRV_SRC
S2_DRV_G1
1µF
0.01µF
VB
1kΩ
DSCHG
VCONN
(5 V)
VSVR
(3.3 V to 5 V)
VDDIO
(1.8 V to 5 V)
1µF
1µF
EN
Optional
Ext-MCU
SMCLK
GPIO0(HPD_OUT)
GPIO1(ALERT#)
USB Type-C
GPO2/VDIV(BST_EN)
Receptacle
XCLPOFF1
XCLPOFF2
GPO3/FB(HSSWEN)
BM92A34MWV-Z
USB3.x-SS/
DP-MUX
Control
GPIO7(MSEL1)
UQFN40V5050A
N-ch
Open
Drain
GPIO6(MSEL0)
GPIO5(ORIENT)
GPIO4
VCCIN
100kΩ
Reset
100kΩ
100kΩ
VCCIN
100kΩ
XRST
100kΩ
VSTR/ATST2
100kΩ
100kΩ
IDSEL/ATST1
0.01µF
CSENSEP
CSENSEN
DBGRSTCK
100kΩ
VCCIN
CVCCIN
LDO15ACAP
CLDO15A
LDO28CAP
CLDO28
CLDO15D
GND
GND
USB 3.x SS
MUX
GND
EXP-PAD
RX1+, RX1RX2+, RX2TX1+, TX1TX2+, TX2-
DP
HPD_OUT
DBGMODDT
VDDIO
D-
LDO15DCAP
D+
USB-PHY
GND
GND
Selection of Components Externally Connected
Item
Symbol
Limit
Min
Typ
Max
Unit
Comment
VCCIN Capacitance
CVCCIN
0.60
4.7
10
µF
(Note 12)
LDO15ACAP Capacitance
CLDO15A
0.47
1.0
2.2
µF
(Note 12)
LDO15DCAP Capacitance
CLDO15D
0.47
1.0
2.2
µF
(Note 12)
LDO28CAP Capacitance
CLDO28
0.47
1.0
2.2
µF
(Note 12)
Q1, Q2, Q3, Q4 Gate-Source Capacitance
CQx_gs
470 p
-
0.5 µ
F
-
(Note 12) Use the ceramic capacitor which capacitance value to decrease by temperature characteristics and DC bias is larger than the minimum limit.
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BM92A34MWV-Z
I/O Equivalence Circuit
Pin
No.
Pin Name
Equivalent Circuit Diagram
VB
GND
VEX
1
5
6
8
9
27
28
GND
VCCIN
VSVR
GND
VB
GND
VEX
Power
Selector
GND
VSVR
Internal
Circuit
VCCIN
GND
7
DSCHG
VCCIN
VCCIN
10
11
12
13
VCCIN
GPIO4
GPIO5(ORIENT)
GPIO6(MSEL0)
GPIO7(MSEL1)
VDDIO
VDDIO
14
15
16
17
VDDIO
DBGRSTCK
DBGMODDT
GPIO0(HPD_OUT)
GPIO1(ALERT#)
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I/O Equivalence Circuit - continued
Pin
No.
Pin Name
Equivalent Circuit Diagram
VCCIN
29
GPO2/VDIV(BST_EN)
VCCIN
VCCIN
30
VCCIN
VCCIN
VCCIN
GPO3/FB(HSSWEN)
VCCIN
31
32
CSENSEN
CSENSEP
VDDIO
18
19
20
VDDIO
SMDATA
SMCLK
SMDATA
SMCLK
Sx_DRV_G1
Sx_DRV_G2
21
22
23
24
25
26
S2_DRV_G1
S2_DRV_SRC
S2_DRV_G2
S1_DRV_G1
S1_DRV_SRC
S1_DRV_G2
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Sx_DRV_SRC
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I/O Equivalence Circuit - continued
Pin
No.
Pin Name
Equivalent Circuit Diagram
VCONN_IN
33
34
35
36
37
XCLPOFF1
XCLPOFF2
CC1
VCONN_IN
CC2
CC1
CC2
XCLPOFF1
XCLPOFF2
VCCIN
VCCIN
4
XRST
VCCIN
VCCIN
38
40
LDO15DCAP
LDO15ACAP
Internal
Circuit
VCCIN
39
LDO28CAP
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Internal
Circuit
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I/O Equivalence Circuit - continued
Pin
No.
Pin Name
Equivalent Circuit Diagram
VCCIN
2
VSTR/ATST2
VCCIN
3
IDSEL/ATST1
Register Initial Values
Firmware Information
Code
Command
Protocols
Data Size
Initial Values
4B h
Firmware Type (Vendor Specific)
Read Word
2
0403 h
4C h
Firmware Revision (Vendor Specific)
Read Word
2
1501 h
Sink Power Data Object 1:
Fixed, Voltage=5 V, Current=0.1 A
Sink Power Data Object 2 (After a contract, sink path switch is turned on automatically.):
Fixed, Voltage=9 V, Current=Automatic maximum (Request current depends on the far-end device.)
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BM92A34MWV-Z
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
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BM92A34MWV-Z
Operational Notes - continued
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
11. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all
within the Area of Safe Operation (ASO).
14. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BM92A34MWV-Z
Ordering Information
B
M
9
2
A
Part Number
3
4
M W
V
-
Package
MWV:UQFN40V5050A
Z
E2
Manufacturing
Code
Packaging and forming
specification
E2: Embossed tape and reel
Marking Diagrams
UQFN40V5050A (TOP VIEW)
Part Number Marking
M92A34
LOT Number
Pin 1 Mark
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BM92A34MWV-Z
Physical Dimension and Packing Information
Package Name
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UQFN40V5050A
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Revision History
Date
Revision
25.Jan.2018
001
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TSZ22111 • 15 • 001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
