BR24H128F-5ACE2

Datasheet Serial EEPROM Series for Automotive EEPROM 125 °C Operation I2C BUS EEPROM for Automotive (2-Wire) BR24H256xxx-5AC Series General Description Key Specifications BR24H256xxx-5AC Series is a 256 Kbit serial EEPROM of I2C BUS Interface. ◼ ◼ ◼ ◼ ◼ Features ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ AEC-Q100 Qualified(Note 1) Functional Safety Supportive Automotive Products All Controls Available by 2 Ports of Serial Clock (SCL) and Serial Data (SDA) 1.7 V to 5.5 V Wide Limit of Operating Voltage, Possible 1 MHz Operation Page Write Mode 64 Byte Bit Format 32K x 8 bit Low Current Consumption Prevention of Miswriting ➢ WP (Write Protect) Function Added ➢ Prevention of Miswriting at Low Voltage Noise Filter Built-in SCL / SDA Pin Initial Delivery State FFh Write Cycles: 4 Million Times (Ta=25 °C) Data Retention: 100 Years (Ta=25 °C) Write Cycle Time: 3.5 ms (Max) Supply Voltage: 1.7 V to 5.5 V Ambient Operating Temperature: -40 °C to +125 °C Packages SOP8 SOP-J8 TSSOP-B8 MSOP8 VSON008X2030 W(Typ) x D(Typ) x H(Max) 5.00 mm x 6.20 mm x 1.71 mm 4.90 mm x 6.00 mm x 1.65 mm 3.00 mm x 6.40 mm x 1.20 mm 2.90 mm x 4.00 mm x 0.90 mm 2.00 mm x 3.00 mm x 0.60 mm (Note 1) Grade 1 Applications ◼ ◼ SOP8 MSOP8 SOP-J8 VSON008X2030 Automotive Camera Automotive Electronics Typical Application Circuit VCC * A0 VCC A1 WP A2 SCL GND SDA Microcontroller 0.1 µF TSSOP-B8 Figure 2 * Connect A0, A1, A2 to VCC or GND. These pins have pull-down elements inside the IC. If pins are open, they are the same as when they are connected to GND. Figure 1. Typical Application Circuit 〇Product structure : Silicon integrated circuit .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/36 TSZ02201-0G1G0G100440-1-2 28.Dec.2021 Rev.004 BR24H256xxx-5AC Series Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Typical Application Circuit .............................................................................................................................................................. 1 Key Specifications .......................................................................................................................................................................... 1 Packages ........................................................................................................................................................................................ 1 Contents ......................................................................................................................................................................................... 2 Pin Configuration ............................................................................................................................................................................ 3 Pin Description................................................................................................................................................................................ 3 Block Diagram ................................................................................................................................................................................ 3 Absolute Maximum Ratings ............................................................................................................................................................ 4 Thermal Resistance ........................................................................................................................................................................ 4 Operating Conditions ...................................................................................................................................................................... 5 Input / Output Capacitance ............................................................................................................................................................. 5 Input Impedance ............................................................................................................................................................................. 5 Memory Cell Characteristics ........................................................................................................................................................... 6 Electrical Characteristics................................................................................................................................................................. 6 AC Characteristics .......................................................................................................................................................................... 7 AC Characteristics Condition .......................................................................................................................................................... 7 Input / Output Timing ...................................................................................................................................................................... 8 Typical Performance Curves ........................................................................................................................................................... 9 I2C BUS Communication............................................................................................................................................................... 18 Write Command ............................................................................................................................................................................ 19 Read Command............................................................................................................................................................................ 20 Method of Reset ........................................................................................................................................................................... 21 Acknowledge Polling ..................................................................................................................................................................... 21 WP Valid Timing (Write Cancel) .................................................................................................................................................... 22 Command Cancel by Start Condition and Stop Condition ............................................................................................................ 22 Application Examples ................................................................................................................................................................... 23 Caution on Power-Up Conditions.................................................................................................................................................. 25 Low Voltage Malfunction Prevention Function .............................................................................................................................. 25 I/O Equivalence Circuits................................................................................................................................................................ 26 Operational Notes ......................................................................................................................................................................... 27 Ordering Information ..................................................................................................................................................................... 29 Lineup ........................................................................................................................................................................................... 29 Marking Diagrams ......................................................................................................................................................................... 30 Physical Dimension and Packing Information ............................................................................................................................... 31 Revision History ............................................................................................................................................................................ 36 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/36 TSZ02201-0G1G0G100440-1-2 28.Dec.2021 Rev.004 BR24H256xxx-5AC Series Pin Configuration (TOP VIEW) (TOP VIEW) A0 1 8 VCC A0 1 A1 2 7 WP A1 A2 3 6 SCL A2 3 GND 4 5 SDA GND 4 Figure 3-(a). Pin Configuration (SOP8, SOP-J8, TSSOP-B8, MSOP8) Pin Description Pin No. Pin Name 8 VCC 7 WP 2 6 SCL EXP-PAD 5 SDA Figure 3-(b). Pin Configuration (VSON008X2030) Input / Output Descriptions setting(Note 2) 1 A0 Input Slave address 2 A1 Input Slave address setting(Note 2) 3 A2 Input Slave address setting(Note 2) 4 GND - Reference voltage of all input / output, 0 V 5 SDA Input / Output Serial data input / serial data output(Note 3) 6 SCL Input Serial clock input 7 WP Input Write protect pin(Note 4) 8 VCC - Connect the power source - EXP-PAD - Leave as OPEN or connect to GND (Note 2) Connect to VCC or GND. There are pull-down elements inside the IC. If pins are open, they are the same as when they are connected to GND. (Note 3) SDA is NMOS open drain, so it requires a pull-up resistor. (Note 4) Connect to VCC or GND, or control to ‘HIGH’ level or ‘LOW’ level. There are pull-down elements inside the IC. If this pin is open, this input is recognized as ‘LOW’. Block Diagram A0 1 256 Kbit EEPROM Array 8 VCC 7 WP 6 SCL 5 SDA 8 bit A1 2 Address Decoder 15 bit Word Address Register START A2 3 Data Register STOP Control Circuit ACK GND 4 High Voltage Generating Circuit Supply Voltage Detection Figure 4. Block Diagram www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/36 TSZ02201-0G1G0G100440-1-2 28.Dec.2021 Rev.004 BR24H256xxx-5AC Series Absolute Maximum Ratings Parameter Symbol Rating Unit Remark VCC -0.3 to +6.5 V - -0.3 to VCC+1.0 V Ta=25 °C Ta=25 °C. The maximum value of input voltage/ output voltage is not over than 6.5 V. When the pulse width is 50ns or less, the minimum value of input voltage/output voltage is -1.0 V. VESD -3000 to +3000 V Ta=25 °C IOLMAX 10 mA Ta=25 °C Tjmax 150 °C Tstg -65 to +150 °C Supply Voltage Input Voltage / Output Voltage Electro Static Discharge (Human Body Model) Maximum Output Low Current (SDA) Maximum Junction Temperature Storage Temperature Range Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance(Note 5) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 7) 2s2p(Note 8) θJA 197.4 109.8 °C/W ΨJT 21 19 °C/W SOP8 Junction to Ambient Junction to Top Characterization Parameter(Note 6) SOP-J8 θJA 149.3 76.9 °C/W Parameter(Note 6) ΨJT 18 11 °C/W Junction to Ambient θJA 251.9 152.1 °C/W Junction to Top Characterization Parameter(Note 6) ΨJT 31 20 °C/W Junction to Ambient θJA 284.1 135.4 °C/W Junction to Top Characterization Parameter(Note 6) ΨJT 21 11 °C/W Junction to Ambient Junction to Top Characterization TSSOP-B8 MSOP8 (Note 5) Based on JESD51-2A(Still-Air) (Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 7) Using a PCB board based on JESD51-3. (Note 8) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 µm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 µm 74.2 mm x 74.2 mm 35 µm 74.2 mm x 74.2 mm 70 µm www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/36 TSZ02201-0G1G0G100440-1-2 28.Dec.2021 Rev.004 BR24H256xxx-5AC Series Thermal Resistance(Note 9) - continued Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 11) 2s2p(Note 12) θJA 308.3 69.6 °C/W ΨJT 43 10 °C/W VSON008X2030 Junction to Ambient Junction to Top Characterization Parameter(Note 10) (Note 9) Based on JESD51-2A(Still-Air) (Note 10) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 11) Using a PCB board based on JESD51-3. (Note 12) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 µm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top Thermal Via(Note 13) Pitch Diameter 1.20 mm Φ0.30 mm 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 µm 74.2 mm x 74.2 mm 35 µm 74.2 mm x 74.2 mm 70 µm (Note 13) This thermal via connects with the copper pattern of all layers. Operating Conditions Parameter Symbol Min Typ Max Unit Supply Voltage VCC 1.7 - 5.5 V Ambient Operating Temperature Ta -40 - +125 °C Bypass Capacitor(Note 14) C 0.1 - - µF (Note 14) Connect a bypass capacitor between the IC’s VCC and GND pin. Input / Output Capacitance (Ta=25 °C, f=1 MHz) Parameter Input / Output Capacitance (SDA)(Note 15) Input Capacitance (SCL, A0, A1, A2, WP)(Note 15) Symbol Min Typ Max Unit Conditions CI/O - - 8 pF VI/O=GND CIN - - 8 pF VIN=GND (Note 15) Not 100% TESTED. Input Impedance (Unless otherwise specified, Ta=-40 °C to +125 °C, VCC=1.7 V to 5.5 V) Parameter Symbol Min Typ Max Unit Input Impedance 1 ZIH 500 - - kΩ 0.7VCC≤VIN (A0, A1, A2, WP) Input Impedance 2 ZIL 30 - - kΩ VIN≤0.3VCC (A0, A1, A2, WP) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/36 Conditions TSZ02201-0G1G0G100440-1-2 28.Dec.2021 Rev.004 BR24H256xxx-5AC Series Memory Cell Characteristics (VCC=1.7 V to 5.5 V) Parameter Write Cycles(Note 16,17) Data Retention(Note 16) Symbol Min Typ Max Unit Conditions - 4,000,000 - - Times Ta=25 °C - 1,200,000 - - Times Ta=85 °C - 500,000 - - Times Ta=105 °C - 300,000 - - Times Ta=125 °C - 100 - - Years Ta=25 °C - 60 - - Years Ta=105 °C - 50 - - Years Ta=125 °C (Note 16) Not 100% TESTED. (Note 17) The Write Cycles is defined for unit of 4 data bytes with the same address bits of WA14 to WA2. Electrical Characteristics (Unless otherwise specified, Ta=-40 °C to +125 °C, VCC=1.7 V to 5.5 V) Parameter Symbol Min Typ Max Unit Input High Voltage VIH 0.7VCC - VCC+1.0 V Input Low Voltage VIL -0.3(Note 18) - +0.3VCC V Output Low Voltage 1 VOL1 - - 0.4 V Output Low Voltage 2 VOL2 - - 0.2 V Input Leakage Current 1 ILI1 -2 - +2 µA Input Leakage Current 2 ILI2 -2 - +2 µA Output Leakage Current ILO -2 - +2 µA Supply Current (Write) (Note 19) ICC1 - - 1.7 mA Supply Current (Read) (Note 19) ICC2 - - 2.0 mA Standby Current ISB - - 10 µA (Note 18) When the pulse width is 50 ns or less, it is -1.0 V. (Note 19) The average value during operation. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/36 Conditions IOL=3.2 mA, 2.5 V≤VCC≤5.5 V (SDA) IOL=1.0 mA, 1.7 V≤VCC