BR9020RFV-WE2

BR9010-W / F-W / FV-W / RFV-W / RFVM-W / BR9020-W / F-W / FV-W / Memory IC RFV-W / RFVM-W / BR9040-W / F-W / FV-W / RFV-W / RFVM-W 1k, 2k, 4k, bit EEPROMs for direct connection to serial ports BR9010-W / BR9010F-W / BR9010FV-W / BR9010RFV-W / BR9010RFVM-W BR9020-W / BR9020F-W / BR9020FV-W / BR9020RFV-W / BR9020RFVM-W BR9040-W / BR9040F-W / BR9040FV-W / BR9040RFV-W / BR9040RFVM-W The BR90XX series are serial EEPROMs that can be connected directly to a serial port and can be erased and written electrically. Writing and reading is perfomed in word units, using four types of operation commands. Communication occurs through CS, SK, DI, and DO pins, WC pin control is used to initiate a write disabled state, enabling these EEPROMs to be used as one-time ROMs. During writing operation is checked via the internal status check. zApplication General-Purpose zFeatures 1) BR9010-W / F-W / FV-W / RFV-W / RFVM-W (1k bit) : 64 words×16bit BR9020-W / F-W / FV-W / RFV-W / RFVM-W (2k bit) : 128words×16bit BR9040-W / F-W / FV-W / RFV-W / RFVM-W (4k bit) : 256words×16bit 2) Single power supply. 3) Serial data I/O. 4) Self-timed programming cycle with auto-erase. 5) Low supply current. Active (5V) : 2mA (max.) Standby (5V) : 3µA (max.) (CMOS INPUT) 6) Noise filter on the SK pin. Write protection when the supply is low. 7) Write protection by WC pin. 8) Space Saving DIP8/SOP8/SSOP-B8/MSOP8pin Packages. 9) 100,000 erase/ write cycles endurance. 10) Provide 10 years of date retention. 11) Easy connection to serial port. 12) “FFFFh” stored in all address on shipped. Rev.A 1/14 BR9010-W / F-W / FV-W / RFV-W / RFVM-W / BR9020-W / F-W / FV-W / Memory IC RFV-W / RFVM-W / BR9040-W / F-W / FV-W / RFV-W / RFVM-W zBlock diagram R/B Command decode CS Power supply voltage detector Control Clock generation SK Write disable Command register DI Address buffer 6bitBR9010 7bitBR9020 8bitBR9040 Address decoder 16bit R/W amplifier High voltage generator 6bitBR9010 7bitBR9020 8bitBR9040 WC 1,024bit BR9010 2,048bit BR9020 4,096bit BR9040 EEPROM Data register DO array 16bit zTerminal Function Pin No. Function Pin name BR90xx-W/RFV-W/RFVM-W BR90xxF-W/FV-W 1 3 CS Chip Select Input 2 4 SK Serial Date Clock Input 3 5 DI Serial Date Input (Op code, address) 4 6 DO Serial Date Output 5 7 GND Ground (0V) 6 8 WC Write Control Input 7 1 R/B READY/ BUSY Status Output 8 2 VCC Power Supply Rev.A 2/14 BR9010-W / F-W / FV-W / RFV-W / RFVM-W / BR9020-W / F-W / FV-W / Memory IC RFV-W / RFVM-W / BR9040-W / F-W / FV-W / RFV-W / RFVM-W zAbsolute Maximum Ratings (Ta=25°C) Parameter Supply Voltage Symbol Limits Unit VCC −0.3 to +7.0 V BR9010-W, BR9020-W, BR9040-W DIP8 800∗1 BR9010F-W, BR9020F-W, BR9040F-W SOP8 450∗2 SSOP-B8 300∗3 MSOP8 310∗4 mW Pd Power dissipation BR9010FV-W, BR9010RFV-W, BR9020FV-W, BR9020RFV-W, BR9040FV-W, BR9040RFV-W BR9010RFVM-W, BR9020RFVM-W, BR9040RFVM-W Storage Temperature Tstg −65 to +125 °C Operating Temperature Topr −40 to +85 °C − −0.3 to VCC+0.3 V Terminal Voltage ∗1 Degradation is done at 8.0mW/˚C for operation above Ta=25˚C ∗2 Degradation is done at 4.5mW/˚C for operation above Ta=25˚C ∗3 Degradation is done at 3.0mW/˚C for operation above Ta=25˚C ∗4 Degradation is done at 3.1mW/˚C for operation above Ta=25˚C zRecommended Operating Condition (Ta=25°C) Parameter Supply voltage Symbol Write VCC Read Input voltage VIN Min. Typ. Max. Unit 2.7 − 5.5 V 2.7 − 5.5 V 0 − VCC V Rev.A 3/14 BR9010-W / F-W / FV-W / RFV-W / RFVM-W / BR9020-W / F-W / FV-W / Memory IC RFV-W / RFVM-W / BR9040-W / F-W / FV-W / RFV-W / RFVM-W zElectrical Characteristics Unless otherwise specified ( Ta=−40 to +85°C, VCC=2.7V to 5.5V) Symbol Min. Typ. Max. Unit Input LOW Voltage 1 VIL1 − − 0.3×VCC V DI pin Input HIGH Voltage 1 VIH1 0.7×VCC − − V DI pin Input LOW Voltage 2 VIL2 − − 0.2×VCC V CS, SK, WC pin Input HIGH Voltage 2 VIH2 0.8×VCC − − V CS, SK, WC pin Output LOW Voltage VOL 0 − 0.4 V IOL=2.1mA Output HIGH Voltage VOH VCC−0.4 − VCC V IOH=−0.4mA Input Leakage Current ILI −1 − 1 µA VIN=0V to VCC Output Leakage Current ILO −1 − 1 µA VOUT=0V to VCC, CS=VCC ICC1 − − 2 mA fSK=2MHz, tE / W=10ms (WRITE) ICC2 − − 1 mA fSK=2MHz (READ) Standby Current ISB − − 3 µA CS, SK, DI, WC=VCC, DO, R / B=OPEN Clock Frequency fSK − − 2 MHz − Conditions Parameter Operating Current Conditions Unless otherwise specified ( Ta=−40 to +85°C, VCC=2.7V to 3.3V) Parameter Symbol Min. Typ. Max. Unit Input LOW Voltage 1 VIL1 − − 0.3×VCC V DI pin Input HIGH Voltage 1 VIH1 0.7×VCC − − V DI pin Input LOW Voltage 2 VIL2 − − 0.2×VCC V CS, SK, WC pin Input HIGH Voltage 2 VIH2 0.8×VCC − − V CS, SK, WC pin Output LOW Voltage VOL 0 − 0.4 V IOL=100µA Output HIGH Voltage VOH VCC−0.4 − VCC V IOH=−100µA Input Leakage Current ILI −1 − 1 µA VIN=0V to VCC ILO −1 − 1 µA VOUT=0V to VCC, CS=VCC ICC1 − − 1.5 mA fSK=2MHz, tE / W=10ms (WRITE) ICC2 − − 0.5 mA fSK=2MHz (READ) Standby Current ISB − − 2 µA CS, SK, DI, WC=VCC, DO, R / B=OPEN Clock Frequency fSK − − 2 MHz Output Leakage Current Operating Current − Rev.A 4/14 BR9010-W / F-W / FV-W / RFV-W / RFVM-W / BR9020-W / F-W / FV-W / Memory IC RFV-W / RFVM-W / BR9040-W / F-W / FV-W / RFV-W / RFVM-W zAC Operation Characteristics ( Ta=−40 to +85°C, VCC=2.7 to 5.5V) Symbol Min. Typ. Max. Unit Chip Select Setup Time Parameter tCSS 100 − − ns Chip Select Hold Time tCSH 100 − − ns Data In Setup Time tDIS 100 − − ns Data In Hold Time tDIH 100 − − ns Delay to Output High tPD1 − − 150 ns Delay to Output Low tPD0 − − 150 ns Self-Timed Program Cycle tE / W − − 10 ms tCS 250 − − ns Minimum Chip Select High Time Data Output Disable Time( From CS) tOH 0 − 150 ns Clock High Time tWH 230 − − ns Clock Low Time tWL 230 − − ns Write Control Setup Time tWCS 0 − − ns Write Control Hold Time tWCH 0 − − ns tSV − − 150 ns Clock High to Output READY/BUSY Status Rev.A 5/14 BR9010-W / F-W / FV-W / RFV-W / RFVM-W / BR9020-W / F-W / FV-W / Memory IC RFV-W / RFVM-W / BR9040-W / F-W / FV-W / RFV-W / RFVM-W z I / O Circuit (1) Input Circuit CS int. RESET int. SK CS CS int. WC DI (2) Output Circuit DO OE int. R/B Rev.A 6/14 BR9010-W / F-W / FV-W / RFV-W / RFVM-W / BR9020-W / F-W / FV-W / Memory IC RFV-W / RFVM-W / BR9040-W / F-W / FV-W / RFV-W / RFVM-W zOperating (1) Instruction Code Instruction Start Bit Address Op Code Data (A6)∗2 (A7)∗1 READ 1010 1000 A0 A1 A2 A3 A4 A5 WRITE 1010 0100 A0 A1 A2 A3 A4 A5 (A6)∗2 (A7)∗1 D0 D1−D14 D15 (WRITE DATA) Write Enable (WEN) 1010 0011 Write Disable (WDS) 1010 0000 ∗ ∗ ∗ ∗ ∗ ∗ ∗ ∗ ∗ ∗ ∗ ∗ ∗ ∗ D0 D1−D14 D15 (READ DATA) ∗ ∗ Address and data must be transferred from LSB. ∗ Means either VIH or VIL BR9020-W/F-W/FV-W/RFV-W/RFVM-W ∗1= "0" BR9010-W/F-W/FV-W/RFV-W/RFVM-W ∗1, 2= "0" Synchronous Data Input Output Timing CS tCS tWH tCSS tCSH tDIH SK tWL tDIS DI tPD tPD tOH DO WC Fig.1 Input Data is clocked into the DI pin on the rising edge of the clock SK Output data is clocked out on the falling edge of the SK clock. The WC pin does not have any affect on the READ, WEN and WDS operations. Between instructions, CS must be brought High for greater than the minimum of tCS. If CS is maintained Low, the next instruction isn't detected. Rev.A 7/14 BR9010-W / F-W / FV-W / RFV-W / RFVM-W / BR9020-W / F-W / FV-W / Memory IC RFV-W / RFVM-W / BR9040-W / F-W / FV-W / RFV-W / RFVM-W (2) WRITE Enable / Disable H SK 1 4 12 8 16 L ENABLE = 11 DISABLE = 00 H CS L H 1 DI 0 1 0 0 0 L High-Z DO H R/B WC HIGH or LOW Fig.2 1) When power is first applied, the device has been held in a reset status, with respect to the write enable, in the same way the write disable (WDS) instruction is executed. Before the write instruction is executed, the device must be received the write enable (WEN) instruction. Once the device is done, the device remains programmable until the write disable (WDS) instruction is executed or the supply is removed from the device. 2) It is unnecessary to add the clock after 16 th clock. If the device is recieved the clock, the device ignores the clock. 3) As both of the enable and disable instructions don’t depend on the status of the WC pin, the state of WC isn’t cared during the instruction. 4) The instruction is recognized after the rising edge of 8 th clock for the address following 8 clocks for the opcode, but the specified address isn’t cared during the instructions. Rev.A 8/14 BR9010-W / F-W / FV-W / RFV-W / RFVM-W / BR9020-W / F-W / FV-W / Memory IC RFV-W / RFVM-W / BR9040-W / F-W / FV-W / RFV-W / RFVM-W (3) Read Cycle H SK 4 1 8 16 32 L tCS H CS L STANDBY H 0 1 DI 1 0 1 0 0 0 A0 A5 0 0 L HIGH-Z HIGH-Z D0 DO D15 D0 D15 tOH H Read Data (n) R/B WC Read Data (n+1) HIGH or LOW Fig.3 BR9010-W / F--W / FV-W / RFV-W / RFVM-W SK H 4 1 8 16 32 48 L tCS H CS L STANDBY H 0 1 DI 1 0 1 0 0 0 A0 A6 0 L HIGH-Z HIGH-Z D0 DO D15 D0 D15 tOH H Read Data (n) R/B Read Data (n+1) HIGH or LOW WC Fig.4 BR9020-W / F-W / FV-W / RFV-W / RFVM-W SK H 4 1 8 16 32 L tCS H CS L STANDBY H 1 DI 0 1 0 1 0 0 0 A0 A6 A7 L HIGH-Z HIGH-Z D0 DO D15 D0 D15 tOH H Read Data (n) R/B WC Read Data (n+1) HIGH or LOW Fig.5 BR9040-W / F-W / FV-W / RFV-W / RFVM-W 1) On the falling edge of 16 th clock, the data stored in the specified address (n) is clocked out of the DO pin. The Output DO is toggled after the internal propagation tPDO or tPD1 on the falling edge of SK. During tPD0 or tPD1, the data is the previous data or unstable, and to take in the data, tPD is needed. (Refer to Fig.1 Synchronous data input output timing.) 2) The data stored in the next address is clocked out of the device on the falling edge of 32nd clock. The data stored in the upper address every 16 clocks is output sequentially by the continual SK input. Also the read operation is reset by CS High. Rev.A 9/14 BR9010-W / F-W / FV-W / RFV-W / RFVM-W / BR9020-W / F-W / FV-W / Memory IC RFV-W / RFVM-W / BR9040-W / F-W / FV-W / RFV-W / RFVM-W (4) Write Cycle H SK 1 4 8 16 32 L H CS L tCS H 1 DI 0 1 0 0 1 0 0 A0 A5 0 0 D0 D15 L High-Z High-Z DO tSV H tE/W R/B H WC tWCS tWCH L Fig.6 BR9010-W / F-W / FV-W / RFV-W / RFVM-W SK H 1 4 8 16 32 L H CS L tCS H 0 1 DI 1 0 0 1 0 0 A0 A6 0 D0 D15 L High-Z High-Z DO tE/W tSV H R/B H WC tWCS tWCH L Fig.7 BR9020-W / F-W / FV-W / RFV-W / RFVM-W SK H 1 4 8 16 32 L H CS L tCS H 1 DI 0 1 0 0 1 0 0 A0 A6 A7 D0 D15 L High-Z High-Z DO tSV H tE/W R/B H WC tWCS tWCH L Fig.8 BR9040-W / F-W / FV-W / RFV-W / RFVM-W Rev.A 10/14 BR9010-W / F-W / FV-W / RFV-W / RFVM-W / BR9020-W / F-W / FV-W / Memory IC RFV-W / RFVM-W / BR9040-W / F-W / FV-W / RFV-W / RFVM-W 1) During the write instruction , CS must be brought Low. However once the write operation started, CS may be either High or Low. But in the case of connecting the WC pin to the CS pin. CS and WC must be brought Low during programming cycle.(If the WC pin is brought High during the write cycle, the write operation is halted. In that case, the data of the specified address is not guaranteed. It is necessary to rewrite it.) 2) After the R / B pin changed Busy to Ready, once CS is brought High, then CS keep Low ,which means the status of being able to accept an instruction. The device can take in the input from SK and DI, but in the case of keeping CS Low without being brought High once, the input is canceled until being CS High once. 3) At the rising edge of 32 nd clock, the R / B pin will be driven Low after the specified time delay (tSV). 4) During programming, R / B is tied to Low by the device (On the rising edge of SK taken in the last data (D15), internal timer starts and automatically finished after the data of memory cell is written spending tE / W. SK could be either High or Low at the time. 5) After input write instruction, also the DO pin will be able to show the status of R / B, in the case that CS is falling from High to Low while SK is tied to Low. (Refer to READY / BUSY STATUS in the next page.) (5) READY / BUSY STATUS (on the R / B pin, the DO pin) 1)The DO pin outputs the READY / BUSY status of the internal part, which shows whether the device is ready to receive the next instruction or not. (High or Low) After the write instruction is completed, if CS is brought from high to low while SK is Low, the DO pin outputs the internal status. (The R / B pin may be no connection. 2) When written to the memory cell, R / B status is output after tSV spent from the rising edge of 32 th clock on SK. R / B =Low : under writing After spending tE / W operating the internal timer, the device automatically finishes writing. During tE / W, the memory array is accessed and any instruction is not received. R / B=High : ready Auto programming has been completed. The device is ready to receive the next Instruction. SK CLOCK CS DI WRITE INSTRUCTION tPD tOH HIGH-Z READY DO HIGH-Z BUSY R/B READY BUSY READY Fig.9 R / B Status Output Timing Rev.A 11/14 BR9010-W / F-W / FV-W / RFV-W / RFVM-W / BR9020-W / F-W / FV-W / Memory IC RFV-W / RFVM-W / BR9040-W / F-W / FV-W / RFV-W / RFVM-W (6) About the direct connection between the DI and DO pins The device can be used with the DI pin connected to the DO pin directly. But when the READY / BUSY status is output, be careful about the bus conflict on the port of the controller. zAttention to Use (1) Power ON / OFF 1) The CS is brought High during power–up and power–down. 2) This device is in active state while CS is Low. 3) The extraordinary function or data collapse may occur in that condition because of noise etc, if power–up and power–down is done with CS brought Low. In order to prevent above errors from happening, keep CS High during power-up and power-down. (Good example) CS is brought High during power–up and power-down. Please take more than 10ms between power–up and power-off, or the internal circuit is not always reset. (Bad example) CS is brought Low during power–up and power-down. The CS pin is always Low in this case, the noise may force the device to make malfunction or inadvertent write. It sometimes occurs in the case that the CS pin is Hi-Z. VCC VCC GND VCC CS GND Good Bad Fig.10 (2) Noise Rejection 1) SK NOISE If SK line has a lot of noise for rising time of SK, the device may recognize the noise as a clock and then clock will be shifted. 2) WC NOISE If WC line has noise during write cycle (tE / W), there may be a chance to deny the programming. 3) VCC NOISE It recommended that capacitor is put between VCC and GND to prevent these case, since it is possible to occur malfunction by the effect of noise or surge on power line. Rev.A 12/14 BR9010-W / F-W / FV-W / RFV-W / RFVM-W / BR9020-W / F-W / FV-W / Memory IC RFV-W / RFVM-W / BR9040-W / F-W / FV-W / RFV-W / RFVM-W (3) Instruction Mode Cancel 1) Read instruction 32 clocks SK CS DI START BIT OPCODE ADDRESS 4 bit 4 bit 8 bit 16 bit DO DO DATA D15 It is possible to be canceled for any timing. WC HIGH or LOW Fig.11 How to cancel : CS is brought High. 2) Write instruction 32 clocks SK CS DI START BIT OPECODE ADDRESS 4 bit 4 bit 8 bit DO DATA D15 16 bit tE / W R/B a b c d WC Fig.12 How to cancel a：CS is brought High to cancel the instruction, and WC may be either High or Low. b：In case that WC is brought High for a moment, or CS is brought High, the write instruction is canceled, the data of the specified address is not changed. c：When WC is brought High, or the device is powered down (But the latter way is not recommended), the instruction is canceled but the specified data is not guaranteed. Send the instruction again. d：When CS is brought High during R/B High, the device is reset and ready to receive a next instruction. NOTE : The document may be strategic technical data subject to COCOM regulations. Rev.A 13/14 BR9010-W / F-W / FV-W / RFV-W / RFVM-W / BR9020-W / F-W / FV-W / Memory IC RFV-W / RFVM-W / BR9040-W / F-W / FV-W / RFV-W / RFVM-W zExternal dimensions (Unit : mm) BR9010-W, BR9020-W, BR9040-W BR9010FV-W, BR9010RFV-W BR9020FV-W, BR9020RFV-W BR9040FV-W, BR9040RFV-W 9.3±0.3 5 3.0±0.2 1 4 0.3Min. 4 7.62 1.15±0.1 0.1 0.51Min. 5 0.3±0.1 2.54 0.5±0.1 0.15±0.1 0.1 0.22±0.1 0.65 (0.52) 0° ~ 15° DIP8 SSOP-B8 BR9010F-W, BR9020F-W, BR9040F-W BR9010RFVM-W, BR9020RFVM-W, BR9040RFVM-W 2.9±0.1 4 6.2±0.3 4.4±0.2 1.5±0.1 0.11 1.27 0.4±0.1 SOP8 0.15±0.1 0.1 8 5 1 4 2.8±0.1 1 +0.05 0.145−0.03 0.475 0.9Max. 0.75±0.05 0.08±0.05 5 0.3Min. 8 4.0±0.2 5.0±0.2 0.29±0.15 0.6±0.2 3.2±0.2 3.4±0.3 1 8 6.4±0.3 4.4±0.2 6.5±0.3 8 0.22+0.05 −0.04 0.65 0.08 M 0.08 S MSOP8 Rev.A 14/14 Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design. The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. About Export Control Order in Japan Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control Order in Japan. In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause) on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction. Appendix1-Rev1.1