600V High voltage
High & Low-side, Gate Driver
BS2101F
General Description
The BS2101F is a monolithic high and low side gate drive
IC, which can drive high speed power MOSFET and IGBT
driver with bootstrap operation.
The floating channel can be used to drive an N-channel
power MOSFET or IGBT in the high side configuration
which operates up to 600V.
The logic inputs can be used 3.3V and 5.0V.
The Under Voltage Lockout (UVLO) circuit prevents
malfunction when VCC and VBS are lower than the
specified threshold voltage.
Key Specifications
High-side floating supply voltage:
600V
Output voltage range:
10V to 18V
Min Output Current Io+/Io-:
60mA/130mA
Turn-on/off time:
220ns(Typ)
Delay Matching:
50ns(Max)
Offset supply leakage current:
50µA (Max)
Operating temperature range:
-40°C to +125°C
Package
SOP-8
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.20mm x 1.71mm
Features
Floating Channels for Bootstrap Operation to +600V
Gate drive supply range from 10V to 18V
Built-in Under Voltage Lockout for Both Channels
3.3V and 5.0V Input Logic Compatible
Matched Propagation Delay for Both Channels
Output in phase with input
Applications
MOSFET and IGBT high side driver applications
Typical Application Circuits
Up to 600V
VCC
LIN
LIN
VB
HIN
HIN
HO
VCC
VS
COM
LO
TO
TO
LOAD
LORD
Figure 1. Typical Application Circuit
〇Product structure : Silicon monolithic integrated circuit
.www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
〇This product has no designed protection against radioactive rays
1/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
Pin Configuration
(TOP VIEW)
LIN
1
8
VB
HIN
2
7
HO
VCC
3
6
VS
COM
4
5
LO
Figure 2. Pin Configuration
Pin Description
Pin No.
Symbol
Function
1
LIN
Logic input for low side gate driver output
2
HIN
Logic input for high side gate driver output
3
VCC
Low side supply voltage
4
COM
Low side return
5
LO
Low side gate drive output
6
VS
High side floating supply return
7
HO
High side gate drive output
8
VB
High side floating supply
Block Diagram
VB
UV
DETECT
PULSE
FILTER
HV
LEVEL
SHIFTER
R
R
Q
DRV
HO
S
VS
HIN
PULSE
GENERATOR
VCC
UV
DETECT
DRV
LIN
DELAY
LO
COM
Figure 3. Functional Block Diagram
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
2/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Min
Max
Unit
High side offset voltage
VS
VB-20
VB+0.3
V
High side floating supply voltage
VB
-0.3
+620
V
High side floating output voltage HO
VHO
VS-0.3
VB+0.3
V
Low side and logic fixed supply voltage
VCC
-0.3
+20
V
Low side output voltage LO
VLO
-0.3
VCC+0.3
V
Logic input voltage (HIN, LIN)
VIN
-0.3
VCC+0.3
V
Com
VCC-20
VCC+0.3
V
Allowable offset voltage SLEW RATE
dVS/dt
-
50
V/ns
Junction temperature
Tjmax
-
150
°C
Storage temperature
Tstg
-55
+150
°C
Logic ground
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s
(Note 3)
2s2p
(Note 4)
Unit
SOP-8
Junction to Ambient
Junction to Top Characterization Parameter
(Note 2)
θJA
197.4
109.8
°C/W
ΨJT
21
19
°C/W
(Note 1)Based on JESD51-2A(Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4)Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
3/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
Recommended Operating Ratings
Parameter
Symbol
MIn
Max
Unit
High side floating supply voltage
VB
VS+10
VS+18
V
High side floating supply offset voltage
VS
-
600
V
High side (HO) output voltage
VHO
VS
VB
V
Low side (LO) output voltage
VLO
Com
VCC
V
Logic input voltage (HIN, LIN)
VIN
Com
VCC
V
Low side supply voltage
VCC
10
18
V
Ambient temperature
TA
-40
+125
°C
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
4/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
DC Operation Electrical Characteristics
(Unless otherwise specified: Ta=25°C, VCC=15V, VBS=15V, VS=COM, CL=1000pF)
Parameter
Symbol
Limits
Min
Typ
Max
VCC and VBS supply undervoltage
positive going threshold
VCCUV+
VBSUV+
8
8.9
9.8
VCC and VBS supply undervoltage
negative going threshold
VCCUVVBSUV-
7.4
8.2
9
VCC supply undervoltage lockout
hysteresis
VCCUVH
VBSUVH
0.3
0.7
-
Offset supply leakage current
ILK
-
-
50
Quiescent VBS supply current
IQBS
20
60
150
Quiescent VCC supply current
IQCC
50
120
240
Logic “1” input voltage
VIH
2.6
-
-
Logic “0” input voltage
VIL
-
-
1.0
High level output voltage, V CC (VBS ) - VO
VOH
-
-
2.8
Low level output voltage, VO
VOL
Logic “1” input bias current
IIN+
Unit
Conditions
V
VB = VS = 600V
µA
VIN = 0V or 5V
VIN = 0V or 5V
V
IO = 20mA
1.2
-
5
40
VIN = 5V
µA
Logic “0” input bias current
IIN-
-
1.0
2.0
Output high short circuit pulse current
IO+
60
-
-
Output low short circuit pulsed current
IO-
130
-
-
VIN = 0V
mA
VO = 0V
Pulse Width≦10µs
VO = 15V
Pulse Width≦10µs
AC Operation Electrical Characteristics
(Unless otherwise specified: Ta=25°C, VCC=15V, VBS=15V, VS=COM, CL=1000pF)
Parameter
Symbol
Limits
Min
Typ
Max
Turn-on propagation delay
ton
120
220
320
Turn-off propagation delay
toff
130
220
330
Unit
Conditions
VS = 0V
VS = 0V or 600V
ns
Turn-on rise time
tr
60
200
300
Turn-off fall time
tf
20
100
170
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
Typical Performance Curves
(Unless otherwise specified: Ta=25°C, VCC=15V, VBS=15V, VS=COM, CL=1000pF)
12
12
11
11
10
10
VCC [V]
VCC [V]
VCCUV+
9
VBSUV+
9
8
8
VCCUV-
VBSUV-
7
7
6
-40 -20
0
20 40
6
60 80 100 120 140
-40 -20
AMBIENT TEMPERATURE [°C]
0
20 40
60 80 100 120 140
AMBIENT TEMPERATURE [°C]
Figure 4. VCC UVLO - Ta
Figure 5. VBS UVLO - Ta
10.0
1.0
9.0
Ta=150°C
8.0
0.8
6.0
IVS [uA]
IVS [uA]
7.0
5.0
4.0
0.6
0.4
3.0
2.0
0.2
1.0
0.0
0.0
0
100 200 300 400 500 600 700
-40
VS [V]
40
80
120
160
Figure 7. Offset Supply Leakage Current – Ta
(VB=VS=600V)
Figure 6. Offset Supply Leakage Current - VS
(VB=VS)
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
0
AMBIENT TEMPERATURE [°C]
6/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
Typical Performance Curves
(Unless otherwise specified: Ta=25°C, VCC=15V, VBS=15V, VS=COM, CL=1000pF)
6
300
300
5
Output Voltage
I
[uA]V OUT [V]
240
250
180
200
3
QCC
IQCC [uA]
4
120
150
2
100
60
1
50
0
0
2
4
6
8
10
12
14
16
0
18
0
VCC [V]
0 20 40 60 80 100 120 140
2
3
4
5
6
AMBIENT TEMPERATURE [°C]
Input Voltage VIN [V]
Figure 9. Quiescent V CC Supply Current – Ta
(VCC=15V)
Figure 8. Quiescent VCC Supply Current - VCC
100
125
80
100
60
75
IQBS [uA]
IQBS[uA]
-40 -20
1
40
20
50
25
0
0
0
2
4
6
8
10
12
14 16
18
-40 -20
VBS [V]
20 40
60 80 100 120 140
Figure 11. Quiescent V BS Supply Current – Ta
(VBS=15V)
Figure 10. Quiescent V BS Supply Current - VBS
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
0
AMBIENT TEMPERATURE [°C]
7/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
Typical Performance Curves
(Unless otherwise specified: Ta=25°C, VCC=15V, VBS=15V, VS=COM, CL=1000pF)
6
3.0
3.0
VIH
5
VIH
Output Voltage
LIN [V] V OUT [V]
2.4
2.4
HIN [V]
4
1.8
1.8
3
1.2
1.2
2
VIL
VIL
0.6
0.6
1
0.0
0.0
-40 -20
0
20
40
60
0
80 100 120 140
0
AMBIENT TEMPERATURE [°C]
Figure 12. HIN Input Threshold Voltage - Ta
0 20 40 60 80 100 120 140
2
3
4
5
6
AMBIENT TEMPERATURE [°C]
Input Voltage VIN [V]
Figure 13. LIN Input Threshold Voltage - Ta
2.0
1.0
0.8
1.5
VLO(VHO)-COM(VS) [V]
VCC(VB)-VLO(VHO) [V]
-40 -20
1
1.0
0.5
0.6
0.4
0.2
0.0
0.0
-40 -20
-40 -20 0 20 40 60 80 100 120 140
AMBIENT TEMPERATURE [°C]
0 20 40 60 80 100 120 140
AMBIENT TEMPERATURE [°C]
Figure 14. High Level Output Voltage –Ta
(IO=20mA)
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Figure 15. Low Level Output Voltage –Ta
(IO=20mA)
8/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
Typical Performance Curves
(Unless otherwise specified: Ta=25°C, VCC=15V, VBS=15V, VS=COM, CL=1000pF)
6
30
10
5
8
Output Voltage
I [uA] V OUT [V]
24
18
6
3
IN
IIN [uA]
4
12
4
2
6
2
1
0
0
2
4
6
8
10
12
14
16
0
18
VCC [V]
0
-40 -20
0
1
0 20 40 60 80 100 120 140
2
3
4
5
6
AMBIENT TEMPERATURE [°C]
Input Voltage VIN [V]
Figure 17. Input Bias Current – Ta
(VIN=5V)
Figure 16. Input Bias Current - VIN
6
2.0
400
5
OutputTime
Voltage
[ns]V OUT [V]
1.6
4
Rise
Time [us]
340
1.2
280
3
0.8
Turn off
220
2
Fall
0.4
160
Turn on
1
0.0
100
0
2500
5000
7500
0
10000 12500
0
CL [pF]
Figure 18. LO Rise/Fall time – Load Capacitance
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
-60
1
0
60
120
2
3
4
5
AMBIENT TEMPERATURE [°C]
Input Voltage VIN [V]
180
6
Figure 19.LO Turn on/off Propagation Delay -Ta
9/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
2.0
400
1.6
340
1.2
280
Time [ns]
Time [us]
Typical Performance Curves
(Unless otherwise specified: Ta=25°C, VCC=15V, VBS=15V, VS=COM, CL=1000pF)
Rise
0.8
0.4
Turn off
220
Turn on
160
Fall
0.0
100
0
2500
5000
7500
10000 12500
CL [pF]
0
60
120
180
AMBIENT TEMPERATURE [°C]
Figure 20. HO Rise/Fall time – Load Capacitance
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
-60
Figure 21. .HO Turn on/off Propagation Delay -Ta
10/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
Truth table
Input
Output
LIN
HIN
LO
HO
L
L
L
L
H
L
H
L
L
H
L
H
H
H
H
H
Timing Chart
50%
50%
HIN
LIN
ton
toff
tf
tr
90%
90%
HO
LO
10%
10%
Figure 22. Detail Timing Chart
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
Application Components Selection Method
(1) Gate Resistor
The gate resistor RG(on/off) is selected to control the
switching speed of the output transistor. The
switching time (tSW ) is defined as the time spent to
reach the end of the plateau voltage, so the turn on
gate resistor RG(on) can be calculated using the
following formulas.
Ig
Qgs Qgd
Ig
HO
Rnoff
Cgs
RG(off)
(1)
t SW
Qgs Qgd
Cgd
RG(on)
VS
RTOTAL ( on) R pon RG ( on)
t sw
VB
Rpon
VBS Vgs(th )
Ig
(Qgs Qgd )( R pon RG ( on) )
(VBS Vgs(th ) )
BS2101F
Figure 23. Gate Driver Equivalent Circuit
(2)
(3)
VDS
Turn on gate resistor value can be changed to
control output slope (dVs/dt). While the output
voltage is non-linear, the maximum output slope
should have a value near that of the following
formula:
Ig
dVs
dt
C rss
dVs/dt
ID
VGS
(4)
where:
Crss is the feedback capacitance.
tSW
Substituting the value of Ig from equation (2) into
equation (4) yields the following formulas.
RTOTAL ( on) R pon RG ( on)
RG ( on)
VBS Vgs(th )
R pon
dVs
Crss
dt
VBS Vgs(th )
dVs
Crss
dt
Figure 24. Gate Charge Transfer Characteristics
(5)
(6)
When the gate driver output is in off state, other dVs/dt may induce a drop in the gate voltage of the MOSFET, causing
self-turn-on. To prevent this, please set up the turn off resistor (RG(off)) that satisfies the following formulas.
Vgs( th ) (R noff R G ( off ) ) I g (R noff R G ( off ) ) Cgd
R G ( off )
Vgs( th )
R noff
dVs
C gd
dt
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
dVs
dt
(7)
(8)
12/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
(2) Bootstrap Capacitor CBS
To reduce ripple voltage, ceramic capacitors with low ESR value are recommended for use in the bootstrap circuit.
The maximum voltage drop (ΔVBS) that we have to guarantee when the high-side switch is in on state must be:
VBS VCC VF VGSMIN
(9)
where:
VCC is the gate driver supply voltage,
VF is the bootstrap diode forward voltage drop, and
VGSMIN is the minimum gate-source voltage.
The total charge supplied (QTotal) by the bootstrap capacitor should have a value near the following formulas.
QTotal QG ( I LKGS I LK I LKDIO I QBS ) THON
(10)
where:
QG is the total gate charge,
ILKGS is the switch gate-source leakage current,
ILKDIO is the bootstrap diode leakage current,
ILK is the level shifter circuit leakage current,
IQBS is the quiescent current, and
THON is the high-side switch on time.
The bootstrap capacitor value should satisfy the following formula.
C BS
QTotal
VBS
(11)
However, BS2101F has a BSTUVLO function to prevent malfunction at low voltage between VB and VS.
Please ensure sufficient capacitor margin to prevent BSTUVLO malfunction.
It is not able to keep turning-on the same way as the high side switch driver because of the specifications of the bootstrap
circuits.
In addition, it is recommended to insert a 1 μF ceramic capacitor between VB and VS. This capacitor should be placed as
close as possible to these pins for noise reduction.
VCC
VF
VB
CBS
VGS
VCC
VS
COM
Figure 25. Bootstrap Power Supply Circuit
(3) Input Capacitor
Mount a low-ESR ceramic input capacitor near the VCC pin to reduce input ripple.
For BS2101F, it is recommended to use a capacitor value two times larger than that of the bootstrap capacitor or more.
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
13/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
Power Dissipation
t
It is shown below reducing characteristics of power dissipation to mount 70mm×70mm×1.6mm , 4layer PCB.
Junction temperature must be designed not to exceed 150°C
Power Dissipation:Pd[W]
1.5
1
0.67W
5.4mW/℃
0.5
0
0
25
50
75
100
125
Ambient Tempreature:Ta[℃]
150
t
Figure 26. Power Dissipation(70mm×70mm×1.6mm 4layer PCB)
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
I/O Equivalence Circuits
Pin.No
Pin
Name
Pin Equivalent Circuit
Pin.No
Pin
Name
Pin Equivalent Circuit
VCC
VCC
1kΩ
1
LIN
1kΩ
LIN
2
HIN
HIN
1MΩ
1MΩ
COM
COM
VB
VCC
HO
LO
5
LO
7
LO
HO
VS
COM
COM
Figure 27. I/O Equivalent Circuit
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to prevent exceeding the maximum junction temperature rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low -impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all
within the Area of Safe Operation (ASO).
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
Ordering Information
B
S
2
1
0
1
Part Number
F
E2
Package
F:SOP-8
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
SOP-8(TOP VIEW)
Part Number Marking
S 2 1 0 1
LOT Number
1PIN MARK
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
17/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
Physical Dimension, Tape and Reel Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
18/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
BS2101F
Revision History
Date
Revision
Changes
6.JAN.2016
001
New Release
2.JUN.2016
002
Correction of errors
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
19/19
TSZ02201-0Q3Q0BZ00510-1-2
2.JUN.2016 Rev.002
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASS
CLASS b
CLASS
CLASS
CLASS
CLASS
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
