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BU11JA2MNVX-CTL

BU11JA2MNVX-CTL

  • 厂商:

    ROHM(罗姆)

  • 封装:

    UDFN4

  • 描述:

    IC REG LIN 1.1V SSON004R1010

  • 数据手册
  • 价格&库存
BU11JA2MNVX-CTL 数据手册
Datasheet CMOS LDO Regulator Series for Automotive Ultra-Small Package FULL CMOS LDO Regulator BUxxJA2MNVX-C series General Description Key Specifications       BUxxJA2MNVX-C series are high-performance FULL CMOS regulators with 200mA output, which are mounted on versatile package SSON004R1010 (1.00mm x 1.00 mm x 0.60mm). These devices have excellent noise characteristics and load responsiveness characteristics despite its low circuit current consumption of 35μA. They are most appropriate for various applications such as power supplies for radar and camera of the automotive. Input Voltage Range: 1.7V to 6.0V Output Voltage: 1.0V to 3.4V Output Voltage Accuracy: ±2.0%(Ta=-40°C to 125°C) Output Current: 200mA(Max) Standby Current: 35μA (Typ) Operating Temperature Range: -40°C to +125°C Package Features          SSON004R1010 : W(Typ) x D(Typ) x H(Max) 1.00mm x 1.00mm x 0.60mm AEC-Q100 Qualified(Note 1) High Accuracy Output Low Current Consumption Compatible With Small Ceramic Capacitor(CIN=CO=0.47μF) With Built-in Output Discharge Circuit High Ripple Rejection ON/OFF Control of Output Voltage Built-in Over Current Protection Circuit Built-in Thermal Shutdown Circuit (Note 1) Grade1 SSON004R1010 Applications  Radar and camera for automotive, etc. Typical Application Circuit STBY VIN CIN 0.47μF STBY VOUT VIN VOUT CO 0.47μF GND GND GND Figure 1. Application Circuit 〇Product structure : Silicon monolithic integrated circuit .www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Ordering Information B U Part Number x x J A 2 M Output Voltage Output Current Category 10 : 1.0V 200mA M:Automotive 11 : 1.1V 12 : 1.2V 1C : 1.25V 15 : 1.5V 18 : 1.8V 25 : 2.5V 28 : 2.8V 2J : 2.85V 29 : 2.9V 30 : 3.0V 33 : 3.3V 34 : 3.4V N V X - Package C TL Product Rank C:for Automotive Packaging and forming specification TL: Embossed tape and reel NVX:SSON004R1010 Block Diagram Figure 2. Block Diagram Pin Descriptions Pin Configurations 4 VIN Pin No. Pin name 1 VOUT Output Voltage 2 GND Ground 3 STBY ON/OFF control of output voltage (High: ON, Low: OFF) 4 VIN Back side EXP-PAD 3 STBY Pin Function EXP-PAD Power Supply Voltage Connect to GND 1 VOUT 2 GND SSON004R1010 (TOP VIEW)(Note1) (Note1)The dashed line is the electrode position of the back side. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Absolute Maximum Ratings Parameter Symbol Rating Unit VIN -0.3 to +6.5 V STBY Voltage VSTBY -0.3 to +6.5 V Operating Temperature Range Topr -40 to +125 °C Storage Temperature Range Tstg -55 to +150 °C Tjmax +150 °C Power Supply Voltage Maximum junction temperature Recommended Operating Range Parameter Power Supply Voltage STBY Voltage Maximum Output Current Symbol Min Max Unit VIN 1.7 6.0 V VSTBY 0.0 6.0 V IOUT - 200 mA Recommended Operating Conditions Parameter Symbol Min Input Capacitor CIN (Note 1) Output Capacitor CO (Note 1) 0.22 0.22 Typ Max Unit Conditions 0.47 - µF Ceramic capacitor recommended 0.47 - µF Ceramic capacitor recommended (Note 1) Caution that the capacitance to be kept higher than this specified values under all conditions considering temperature, DC bias, etc. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) 1s(Note 3) 2s2p(Note 4) Unit SSON004R1010 Junction to Ambient θJA 450.2 97.1 °C/W Junction to Top Characterization Parameter (Note 2) ΨJT 99 22 °C/W (Note 1) Based on JESD51-2A(Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Thermal Via(Note 5) Pitch Diameter 1.20 mm Φ0.30 mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 5) This thermal via connects with the copper pattern of all layers. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Electrical Characteristics (Ta= -40°C to 125°C, VIN=VOUT+1.0V (Note 1), STBY=VIN, CIN=0.47μF, CO=0.47μF, unless otherwise specified.) Parameter Symbol Min Limit Typ Max Unit Conditions [Regulator Block] VOUT ×0.98 - VOUT ×1.02 VOUT -36mV - VOUT +36mV IOUT=0.01mA, VOUT
BU11JA2MNVX-CTL 价格&库存

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BU11JA2MNVX-CTL
    •  国内价格 香港价格
    • 1+1.395171+0.16856
    • 10+1.3627210+0.16464
    • 50+1.3383950+0.16170
    • 100+1.31405100+0.15876
    • 500+1.30594500+0.15778
    • 1000+1.297831000+0.15680
    • 2000+1.297832000+0.15680
    • 4000+1.297834000+0.15680

    库存:50