BU16501KS2-E2

Datasheet LED Driver with I2C Compatible and 3-wire Serial Interface for 8×16 LEDs in Dot Matrix BU16501KS2 General Description Key Specifications BU16501KS2 is “Matrix LED Driver” that is the most suitable for Home Appliance. It can control 8x16 (128 dot) LED Matrix by internal 8-channel PMOS SWs and 16-channel LED drivers. It can control the brightness in each dot by the setting of the internal register. It supports SPI and I2C interface.  Operating power supply voltage range: 2.7V to 5.5V  Oscillator frequency: 1.2MHz (Typ.)  Operating temperature range: -40℃ to +85℃ Package(s) SQFP-T52M SQFP-T52 W(Typ) x D(Typ) x H(Max) 12.00mm x 12.00mm x 1.60mm 12.00mm x 12.00mm x 1.50mm Features N.C. Applications Mobile phone, portable device, home electrical appliance, and general consumer equipment. Device provided with LED display application. LED display. Amusement, Traffic Signboards, hobby, etc. TEST1 LED16 LED13 LED12 LED11 VBAT1 LED10 GND4 GND5 Pin Configuration(s) LED15  LED14  LED Matrix driver (8x16)  It has 8-channel PMOS SWs and 16-channel current drivers with 1/8 TDM timing driven sequentially.  Put ON/OFF (for every dot)  The current drivers can drive from 0 to 20.00mA current with “16” steps(for every dot)  The current drivers can drive maximum 42.5mA/Line (ISET=47kΩ)  64 steps of the luminance control by PWM (common setting for all dots) Interface  SPI and I2C BUS FS mode (max 400 kHz) Compability. 2 2  For I C mode, I C Device address is selectable (74h or 75h). Thermal Shutdown LEDGND2  27 39 40 26 CLKIO N.C. ISET TESTO LED9 SDA LED8 CE LED7 GND3 LED6 SCL LED5 VIO LEDGND3 RESETB N.C. GND2 LED4 IFMODE LED3 VBAT3 LED2 VBAT2 LED1 SYNC 1 14 GND1 N.C. SW8 SW7 SW6 SW5 SW4 VINSW VINSW SW3 SW2 SW1 13 LEDGND1 52 ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Typical Application Circuit(s) VINSW VBAT VINSW1 VINSW2 VBAT1 10μF VBAT2 VBAT3 SW8 SW7 10µF SW6 SW5 SW4 ISET SW3 100kΩ SW2 SW1 LED16 VIO LED15 1µF LED14 BU16501KS2 RESETB LED13 LED12 CE I2C or SPI selectable SDA LED11 SCL LED10 IFMODE LED9 SYNC LED8 CLKIO LED7 LED6 LED5 LED4 LED3 LED2 LED1 8×16 Dot Matrix Unit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/30 LEDGND３ LEDGND２ LEDGND1 TESTO GND5 GND4 GND3 GND2 GND1 TEST1 X Matrix Direction Y TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Pin Description(s) No Pin Name I/O Pull down Unused processing setting For Power For Ground 1 LEDGND1 - - - VBAT - 2 SW1 O - VINSW VINSW 3 SW2 O - VINSW VINSW 4 SW3 O - VINSW 5 VINSW1 - - 6 VINSW2 - 7 SW4 O ESD Diode Equivalent Circuit Functions Ground B GND P-MOS SW1 output C GND P-MOS SW2 output C VINSW GND P-MOS SW3 output C - - GND Power supply for SW1-8 A - - - GND Power supply for SW1-8 A - VINSW VINSW GND P-MOS SW4 output C 8 SW5 O - VINSW VINSW GND P-MOS SW5 output C 9 SW6 O - VINSW VINSW GND P-MOS SW6 output C 10 SW7 O - VINSW VINSW GND P-MOS SW7 output C 11 SW8 O - VINSW VINSW GND P-MOS SW8 output C 12 NC - - - - - - - 13 GND1 - - - VBAT - Ground B 14 SYNC I - GND VBAT GND External synchronous input pin D 15 VBAT2 - - - - GND Battery is connected A 16 VBAT3 - - - GND Battery is connected 17 IFMODE I - GND VBAT GND I C/SPI select pin (L: I C, H: SPI) 18 GND2 - - - VBAT - 19 RESETB I - GND VBAT GND 20 VIO - - - VBAT GND I/O Power supply is connected 21 SCL I - - VBAT GND SPI, I C CLK input pin D 22 GND3 - - - VBAT - B 23 CE I - GND VBAT GND Ground SPI enable pin(H;Enable), or 2 I C slave address selection (L: 74ｈ, H: 75ｈ) 2 A 2 D Ground B Reset input pin (L: reset, H: reset cancel) D I 2 2 D 24 SDA I/O - - VBAT GND SPI DATA input / I C DATA input-output pin F 25 TESTO O - OPEN VBAT GND Test output pin1 26 CLKIO I/O 500Ω OPEN VBAT GND Reference CLK input / output pin G M 27 TEST1 I 94kΩ GND VBAT GND Test input pin 1 E 28 NC - - - - - 29 LED16 O - GND - 30 LED15 O - GND 31 LED14 O - GND 32 LEDGND2 - - 33 LED13 O - 34 LED12 O - GND - GND LED12 driver output K 35 LED11 O - GND - GND LED11 driver output K 36 LED10 O - GND - GND LED10 driver output K 37 VBAT1 - - - - GND Battery is connected A 38 GND4 - - - VBAT - Ground B 39 GND5 - - - VBAT - Ground B 40 NC - - - - - - - - - GND LED16 driver output K - GND LED15 driver output K - GND LED14 driver output K - VBAT - GND - GND Ground B LED13 driver output K 41 ISET I - - VBAT GND LED Constant Current Driver Current setting pin J 42 LED9 O - GND - GND LED9 driver output K 43 LED8 O - GND - GND LED8 driver output K 44 LED7 O - GND - GND LED7 driver output K 45 LED6 O - GND - GND LED6 driver output K 46 LED5 O - GND - GND LED5 driver output K 47 LEDGND3 - - - VBAT - Ground B 48 NC - - - - - - - 49 LED4 O - GND - GND LED4 driver output K 50 LED3 O - GND - GND LED3 driver output K 51 LED2 O - GND - GND LED2 driver output K 52 LED1 O - GND - GND LED1 driver output K www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Pin ESD Type A E I B VBAT VIO F VBAT VBAT J VBAT VBAT C VIO G VINSW VBAT K VINSW VIO D VBAT H M VIO VBAT VBAT VIO VIO Figure 1. Pin ESD Type www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Limits Unit VMAX -0.3 to +7 V Pd 1.30 W Terminal voltage Power Dissipation (note1) Operating Temperature Range Topr -40 to +85 ℃ Storage Temperature Range Tstg -55 to +125 ℃ (Note1) Power dissipation deleting is 13mW/°C, when it’s used in over 25°C (ROHM’s standard one layer board has been mounted.) The power dissipation of the IC has to be less than the one of the package. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Ratings (Ta=-40 to 85℃) Parameter Symbol VBAT input voltage VINSW input voltage Limits Unit VBAT 2.7 to 5.5 V VINSW 2.7 to 5.5 V VIO 1.65 to 5.5 V VIO pin voltage Electrical Characteristics (Unless otherwise specified, Ta=25℃, VBAT=5.0V, VINSW=5.0V, VIO=5.0V) Parameter Symbol Limit Min Typ Max Unit Condition [ Circuit Current ] VBAT Circuit current 1 IBAT1 - 0 3.0 VBAT Circuit current 2 IBAT2 - 0.7 VBAT Circuit current 3 IBAT3 μA RESETB=0V, VIO=0V 5.0 μA RESETB=0V, VIO=5.0V mA When LED1-16 are active with 10.67mA settings. - 2.1 3.5 [ UVLO ] UVLO Threshold VUVLO - 2.1 2.5 V UVLO Hysteresis VHYUVLO 50 - - mV VBAT falling [ LED Driver ] (LED1-16) ILEDMax1 - 20.00 - mA LED1-16 ,ISET＝100kΩ ILEDMax2 - 42.50 - mA LED1-16 ,ISET＝47kΩ Output current ILED -7.0 - +7.0 % LED current Matching ILEDMT - - 5 % ILEDMT= (ILEDMax-ILEDMin)/(ILEDMax+ILEDMin) I=10.67mA setting, VLED=1V, ISET=100kΩ Driver pin voltage range VLED1 0.2 - V LED1-16 ,ISET＝100kΩ ILKLED - - 1.0 μA ILEAKP - - 1.0 μA RonP - 1.0 - Ω fosc 0.96 1.2 1.44 MHz L level input voltage VIL1 -0.3 - H level input voltage VIH1 Maximum output current LED OFF Leak current VBAT - 1.4 I=10.67mA setting, VLED=1V ISET=100kΩ [ PMOS switch ] Leak current at OFF Resistor at ON Isw=160mA, VINSW=5.0V [ OSC ] OSC frequency [ CE, SYNC, IFMODE ] input current www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Iin1 0.75 x VIO - 0 5/30 0.25 x VIO VIO +0.3 1 V V μA Input voltage = from (0.1 x VIO) to (0.9 x VIO) TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Electrical Characteristics - continued Parameter Limit Symbol Min Typ Max Unit Condition [ SDA, SCL ] L level input voltage VIL2 -0.3 - 0.25×VIO V H level input voltage VIH2 0.75×VIO - VIO+0.3 V Input hysteresis L level output voltage (for SDA pin) Vhys 0.05×VIO - - V VOL2 - - 0.3 V IOL=3mA Iin2 -3 - 3 μA Input voltage = from (0.1 x VIO) to (0.9 x VIO) L level input voltage VIL3 -0.3 - 0.25×VIO V H level input voltage VIH3 0.75×VIO - VIO+0.3 V Input current Iin3 - 0 1 μA Input current [ RESETB ] Input voltage = from (0.1 x VIO) to (0.9 x VIO) 【CLKIO(output)】 L level output voltage VOL1 - - 0.4 V IOL=2mA H level output voltage VOH1 VIO-0.4 - - V IOH=-2mA 【CLKIO(input)】 L level input voltage VIL4 -0.3 - 0.25×VIO V H level input voltage VIH4 0.75×VIO - VIO+0.3 V Iin4 - 10 20 μA Input current Input voltage =5.0V (Unless otherwise specified, Ta=25°C, VBAT=5.0V, VINSW=5.0V, VIO=5.0V) Limit Parameter Symbol Unit Min Typ Max SCL cycle time tscyc 76 - - ns H period of SCL cycle Twhc 35 - - ns L period of SCL cycle Twlc 35 - - ns SDA setup time Tss 38 - - ns SDA hold time Tsh 38 - - ns 38 - - ns Tcsw 2.1 - - μs ECLK x 2 - - s Write interval Write interval (after RAM accsess) CE setup time Tcss 55 - - ns CE hold time Tcgh 48 - - ns Condition (Note 1) (Note 2) (Note 1) When it used internal clock. (Note 2) When it used external clock. (ECLK means the cycle of external clock) o (Unless otherwise specified, Ta=25 C, VBAT=5.0V, VINSW=5.0V, VIO=5.0V) Standard-mode Parameter Symbol Min Typ Max 【I2C BUS format】 SCL clock frequency fSCL 0 100 LOW period of the SCL clock tLOW 4.7 HIGH period of the SCL clock tHIGH 4.0 - Hold time (repeated) START condition After this period, the first clock is generated Set-up time for a repeated START condition Data hold time Data set-up time Set-up time for STOP condition Bus free time between a STOP and START condition www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Min Fast-mode Typ Max 0 1.3 0.6 - 400 - kHz μs μs Unit tHD;STA 4.0 - - 0.6 - - μs tSU;STA 4.7 - - 0.6 - - μs tHD;DAT tSU;DAT tSU;STO 0 250 4.0 - 3.45 - 0 100 0.6 - 0.9 - μs ns μs tBUF 4.7 - - 1.3 - - μs 6/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Block Diagram VINSW1 VINSW2 VBAT1 VBAT2 VBAT3 SW8 T07 SW7 T06 VREF SW6 T05 OSC SW5 T04 ISET Logic TDM IREF SW4 T03 SW3 T02 SW2 T01 SW1 T00 Max 42.5mA/ch 64 steps DC TDM LED16 VIO TDM LED15 LED14 TDM RESETB TDM CE SDA TDM I/O SCL LED13 LED12 2 Level SPI / I C interface Shift Digital Control TDM LED11 LED10 TDM IFMODE LED9 TDM SYNC LED8 TDM CLKIO LED7 TDM LED6 TDM LED5 TDM LED4 TDM LED3 TDM LED2 TDM TDM LED1 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/30 LEDGND3 LEDGND2 LEDGND1 TESTO GND5 GND4 GND3 GND2 GND1 TEST1 PWM TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Serial Interface 1. SPI format ・ When IFMODE is set to “H”, it can interface with SPI format. ・The serial interface is four terminals (serial clock terminal (SCL), serial data input terminal (SDA), and chip selection input terminal (CE)). （1）Write operation ・ Data is taken into an internal shift register with rising edge of SCL. (Max of the frequency is 13MHz.) ・ The receive data becomes enable in the “H" section of CE. (Active “H".) ・ The transmit data is forwarded (with MSB-First) in the order of write command “0”(1bit), the control register address (7bit) and data (8bit). CE SCL SDA W A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 Figure 2. Writing format （2）Timing diagram tcgh CE tcss tscyc tcsw SCL twhc twlc SDA tss tsh Figure 3. Timing diagram (SPI format) 2 2. I C BUS format 2 When IFMODE is set to “L”, it can interface with I C BUS format. (1) Slave address CE L H A7 1 1 A6 1 1 A5 1 1 A4 0 0 A3 1 1 A2 0 0 A1 0 1 R/W 0 (2) Bit Transfer SCL transfers 1-bit data during H. During H of SCL, SDA cannot be changed at the time of bit transfer. If SDA changes while SCL is H, START conditions or STOP conditions will occur and it will be interpreted as a control signal. SDA SCL SDA a state of stability： SDA It can change Data are effective Figure 4. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Bit transfer (I2C format) 8/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Serial Interface - continued (3) START and STOP condition When SDA and SCL are H, data is not transferred on the I2C- bus. This condition indicates, if SDA changes from H to L while SCL has been H, it will become START (S) conditions, and an access start, if SDA changes from L to H while SCL has been H, it will become STOP (P) conditions and an access end. SDA SCL S P STOP condition START condition Figure 5. START/STOP condition (I2C format) (4) Acknowledge It transfers data 8 bits each after the occurrence of START condition. A transmitter opens SDA after transfer 8bits data, and a receiver returns the acknowledge signal by setting SDA to L. DATA OUTPUT BY TRANSMITTER not acknowledge DATA OUTPUT BY RECEIVER acknowledge SCL 1 S 2 8 clock pulse for acknowledgement START condition Figure 6. 9 Acknowledge (I2C format) (5) Writing protocol A register address is transferred by the next 1 byte that transferred the slave address and the write-in command. The 3rd byte writes data in the internal register written in by the 2nd byte, and after 4th byte or, the increment of register address is carried out automatically. However, when a register address turns into the last address (40h), it is set to 00h by the next transmission. After the transmission end, the increment of the address is carried out. *1 S X X X X X X X 0 A A7 A6 A5 A4 A3 A2 A1 A0 A D7 D6 D5 D4 D3 D2 D1 D0 A slave address register address *1 D7 D6 D5 D4 D3 D2 D1 D0 A P DATA DATA register address increment R/W=0(write) from master to slave from slave to master register address increment A=acknowledge(SDA LOW) A=not acknowledge(SDA HIGH) S=START condition P=STOP condition *1: Write Timing (6) Timing diagram SDA t BUF t SU;DAT t LOW t HD;STA SCL t HD;STA t SU;STA t HD;DAT S t HIGH Figure 7. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Sr t SU;STO P S Timing diagram ( I2C C format) 9/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Register List (Note) Please be sure to write “0” in the register which is not assigned. It is prohibition to write data to the address which is not assigned. Control register Address default D7 D6 D5 D4 D3 D2 D1 D0 Block Remark 00h 00h - - - - - - - SFTRST RESET Software Reset - - - - OSCEN - - - OSC OSC ON/OFF control LED driver LED1-8 Enable LED9-16 Enable PWM LED1-16 PWM setting CLK CLK selection, SYNC operation control 01h 00h 11h 00h LED8ON LED7ON LED6ON LED5ON LED4ON LED3ON LED2ON LED1ON 12h 00h LED16ON LED15ON LED14ON LED13ON LED12ON LED11ON LED10ON LED9ON 20h 00h 21h 00h - - CLKSEL[1：0] PWMSET[5:0] - - SYNCACT SYNCON CLKOUT CLKIN 2Dh 00h - - - - - PWMEN - - 30h 00h - - - - - - - START PWM ON/OFF setting 31h 00h - - - - - - - CLRA 7Fh 00h - - - - - - - RMCG MATRIX LED matrix control Matrix data clear RMAP Resistor map change Pattern register Address 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah 1Bh 1Ch 1Dh 1Eh 1Fh 20h 21h 22h 23h 24h 25h 26h 27h 28h 29h 2Ah 2Bh 2Ch 2Dh 2Eh 2Fh default 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h D7 D6 D5 D4 ILED01SET[3:0] ILED03SET[3:0] ILED05SET[3:0] ILED07SET[3:0] ILED11SET[3:0] ILED13SET[3:0] ILED15SET[3:0] ILED17SET[3:0] ILED21SET[3:0] ILED23SET[3:0] ILED25SET[3:0] ILED27SET[3:0] ILED31SET[3:0] ILED33SET[3:0] ILED35SET[3:0] ILED37SET[3:0] ILED41SET[3:0] ILED43SET[3:0] ILED45SET[3:0] ILED47SET[3:0] ILED51SET[3:0] ILED53SET[3:0] ILED55SET[3:0] ILED57SET[3:0] ILED61SET[3:0] ILED63SET[3:0] ILED65SET[3:0] ILED67SET[3:0] ILED71SET[3:0] ILED73SET[3:0] ILED75SET[3:0] ILED77SET[3:0] ILED81SET[3:0] ILED83SET[3:0] ILED85SET[3:0] ILED87SET[3:0] ILED91SET[3:0] ILED93SET[3:0] ILED95SET[3:0] ILED97SET[3:0] ILEDA1SET[3:0] ILEDA3SET[3:0] ILEDA5SET[3:0] ILEDA7SET[3:0] ILEDB1SET[3:0] ILEDB3SET[3:0] ILEDB5SET[3:0] www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 D3 D2 D1 D0 ILED00SET[3:0] ILED02SET[3:0] ILED04SET[3:0] ILED06SET[3:0] ILED10SET[3:0] ILED12SET[3:0] ILED14SET[3:0] ILED16SET[3:0] ILED20SET[3:0] ILED22SET[3:0] ILED24SET[3:0] ILED26SET[3:0] ILED30SET[3:0] ILED32SET[3:0] ILED34SET[3:0] ILED36SET[3:0] ILED40SET[3:0] ILED42SET[3:0] ILED44SET[3:0] ILED46SET[3:0] ILED50SET[3:0] ILED52SET[3:0] ILED54SET[3:0] ILED56SET[3:0] ILED60SET[3:0] ILED62SET[3:0] ILED64SET[3:0] ILED66SET[3:0] ILED70SET[3:0] ILED72SET[3:0] ILED74SET[3:0] ILED76SET[3:0] ILED80SET[3:0] ILED82SET[3:0] ILED84SET[3:0] ILED86SET[3:0] ILED90SET[3:0] ILED92SET[3:0] ILED94SET[3:0] ILED96SET[3:0] ILEDA0SET[3:0] ILEDA2SET[3:0] ILEDA4SET[3:0] ILEDA6SET[3:0] ILEDB0SET[3:0] ILEDB2SET[3:0] ILEDB4SET[3:0] 10/30 Block MATRIX DATA R/W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W Remark Data for Matrix 01/00 Data for Matrix 03/02 Data for Matrix 05/04 Data for Matrix 07/06 Data for Matrix 11/10 Data for Matrix 13/12 Data for Matrix 15/14 Data for Matrix 17/16 Data for Matrix 21/20 Data for Matrix 23/22 Data for Matrix 25/24 Data for Matrix 27/26 Data for Matrix 31/30 Data for Matrix 33/32 Data for Matrix 35/34 Data for Matrix 37/36 Data for Matrix 41/40 Data for Matrix 43/42 Data for Matrix 45/44 Data for Matrix 47/46 Data for Matrix 51/50 Data for Matrix 53/52 Data for Matrix 55/54 Data for Matrix 57/56 Data for Matrix 61/60 Data for Matrix 63/62 Data for Matrix 65/64 Data for Matrix 67/66 Data for Matrix 71/70 Data for Matrix 73/72 Data for Matrix 75/74 Data for Matrix 77/76 Data for Matrix 81/80 Data for Matrix 83/82 Data for Matrix 85/84 Data for Matrix 87/86 Data for Matrix 91/90 Data for Matrix 93/92 Data for Matrix 95/94 Data for Matrix 97/96 Data for Matrix A1/A0 Data for Matrix A3/A2 Data for Matrix A5/A4 Data for Matrix A7/A6 Data for Matrix B1/B0 Data for Matrix B3/B2 Data for Matrix B5/B4 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Pattern register - continued Address 30h 31h 32h 33h 34h 35h 36h 37h 38h 39h 3Ah 3Bh 3Ch 3Dh 3Eh 3Fh 40h default 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h D7 D6 D5 D4 ILEDB7SET[3:0] ILEDC1SET[3:0] ILEDC3SET[3:0] ILEDC5SET[3:0] ILEDC7SET[3:0] ILEDD1SET[3:0] ILEDD3SET[3:0] ILEDD5SET[3:0] ILEDD7SET[3:0] ILEDE1SET[3:0] ILEDE3SET[3:0] ILEDE5SET[3:0] ILEDE7SET[3:0] ILEDF1SET[3:0] ILEDF3SET[3:0] ILEDF5SET[3:0] ILEDF7SET[3:0] D3 D2 D1 D0 ILEDB6SET[3:0] ILEDC0SET[3:0] ILEDC2SET[3:0] ILEDC4SET[3:0] ILEDC6SET[3:0] ILEDD0SET[3:0] ILEDD2SET[3:0] ILEDD4SET[3:0] ILEDD6SET[3:0] ILEDE0SET[3:0] ILEDE2SET[3:0] ILEDE4SET[3:0] ILEDE6SET[3:0] ILEDF0SET[3:0] ILEDF2SET[3:0] ILEDF4SET[3:0] ILEDF6SET[3:0] Block MATRIX DATA R/W W W W W W W W W W W W W W W W W W Remark Data for Matrix B7/B6 Data for Matrix C1/C0 Data for Matrix C3/C2 Data for Matrix C5/C4 Data for Matrix C7/C6 Data for Matrix D1/D0 Data for Matrix D3/D2 Data for Matrix D5/D4 Data for Matrix D7/D6 Data for Matrix E1/E0 Data for Matrix E3/E2 Data for Matrix E5/E4 Data for Matrix E7/E6 Data for Matrix F1/F0 Data for Matrix F3/F2 Data for Matrix F5/F4 Data for Matrix F7/F6 Register Map Address 00h < Software Reset > Address R/W Bit7 (Index) 00h W Initial 00h value Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 - - - - - - SFTRST - - - - - - 0 Bit 0：SFTRST Software Reset “0” : Reset cancel “1” : Reset（All register initializing） SFTRST register return to 0 automatically. Address 01h Address R/W Bit7 (Index) 01h W Initial 00h value Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 - - - OSCEN - - - - - - 0 - - - Bit 3：OSCEN OSC block ON/OFF control “0”：OFF（Initial） “1”：ON This register should not change into "1 "→" 0" at the time of START (30h, D0) register ="1" setup (under lighting operation). This register must be set to "0" after LED putting out lights ("START register = 0"), and please surely stop an internal oscillation circuit. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Register Map - continued Address 11h < LED1-8 Enable > Address R/W Bit7 Bit6 (Index) 11h W LED8ON LED7ON Initial 00h 0 0 value Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 LED6ON LED5ON LED4ON LED3ON LED2ON LED1ON 0 0 0 0 0 0 Bit 0：LED1ON LED1 ON/OFF setting “0”：LED1 OFF（initial） “1”：LED1 ON Bit 1：LED2ON LED2 ON/OFF setting “0”：LED2 OFF（initial） “1”：LED2 ON Bit 2：LED3ON LED3 ON/OFF setting “0”：LED3 OFF（initial） “1”：LED3 ON Bit 3：LED4ON LED4 ON/OFF setting “0”：LED4 OFF（initial） “1”：LED4 ON Bit 4：LED5ON LED5 ON/OFF setting “0”：LED5 OFF（initial） “1”：LED5 ON Bit 5：LED6ON LED6 ON/OFF setting “0”：LED6 OFF（initial） “1”：LED6 ON Bit 6：LED7ON LED7 ON/OFF setting “0”：LED7 OFF（initial） “1”：LED7 ON Bit 7：LED8ON LED8 ON/OFF setting “0”：LED8 OFF（initial） “1”：LED8 ON (Note) Current setting follows ILEDXXSET[3:0] register. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Register Map - continued Address 12h < LED9-16 Enable > Address R/W Bit7 Bit6 (Index) LED16 LED15 12h W ON ON Initial 00h 0 0 value Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 LED14 ON LED13 ON LED12 ON LED11 ON LED10 ON LED9 ON 0 0 0 0 0 0 Bit 0：LED9ON LED9 ON/OFF setting “0”：LED9 OFF（initial） “1”：LED9 ON Bit 1：LED10ON LED10 ON/OFF setting “0”：LED10 OFF（initial） “1”：LED10 ON Bit 2：LED11ON LED11 ON/OFF setting “0”：LED11 OFF（initial） “1”：LED11 ON Bit 3：LED12ON LED12 ON/OFF setting “0”：LED12 OFF（initial） “1”：LED12 ON Bit 4：LED13ON LED13 ON/OFF setting “0”：LED13 OFF（initial） “1”：LED13 ON Bit 5：LED14ON LED14 ON/OFF setting “0”：LED14 OFF（initial） “1”：LED14 ON Bit 6：LED15ON LED15 ON/OFF setting “0”：LED15 OFF（initial） “1”：LED15 ON Bit 7：LED16ON LED16 ON/OFF setting “0”：LED16 OFF（initial） “1”：LED16 ON (Note) Current setting follows ILEDXXSET[3:0] register. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Register Map - continued Address 20h < LED1-16 PWM setting > Address R/W Bit7 Bit6 (Index) 20h W Initial 00h value Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 0 0 PWMSET [5:0] 0 0 0 0 Bit 5-0：PWMSET[5:0] LED1-16 PWM DUTY setting “000000”： 0/63＝0%(initial) “000001”： 1/63＝1.59% ： ： “100000”：32/63＝50.8% ： ： “111110”：62/63＝98.4% “111111”：63/63＝100% (Note)Please refer to Description of operation, chapter 2 Address 21h Address R/W Bit7 Bit6 Bit5 Bit4 (Index) 21h W CLKSEL[1:0] Initial value 00h 0 0 - Bit3 Bit2 Bit1 Bit0 SYNCACT 0 SYNCON 0 CLKOUT 0 CLKIN 0 Bit 0：CLKIN Selection CLK for PWM control “0”：Internal OSC (initial) “1”：External CLK input (to CLKIO pin) Bit 1：CLKOUT Output CLK enable “0”：CLK is not output (initial) “1”：Output selected CLK from CLKIO pin As for CLKIN & CLKOUT, setting change is forbidden under OSCEN (01h, D3) register =”1” and also under clock input to CLKIO terminal. Bit 2：SYNCON SYNC operation enable “0”：Disable SYNC operation (initial) “1”：SYNC pin control LED driver ON/OFF Bit 3：SYNCACT SYNC operation setting “0”：When SYNC pin is “L”, LED drivers are ON (initial) “1”：When SYNC pin is “H”, LED drivers are ON Bit 7-6：CLKSEL[1:0] Select Clock Frequency “00”：1.2MHz (initial) “01”：300kHz “10”：150kHz “11”：37.5kHz www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Register Map - continued Address 2Dh < PWM ON/OFF setting > Address R/W Bit7 Bit6 (Index) 2Dh W Initial 00h value Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 - - - PWMEN - - - - - 0 - - Bit 2：PWMEN PWM control at LED1-16 ON/OFF setting “0”：PWM operation is invalid（initial value） “1”：PWM operation is valid (Note)Please refer to Description of operation, chapter 2 Address 30h < LED Matrix control > Address R/W Bit7 (Index) 30h W Initial value 00h - Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 - - - - - - START 0 Bit 0：START Lighting/turning off bit of MATRIX LED(LED1-16) “0”：MATRIX LED（LED1-16） Lights out (initial) “1”：MATRIX LED（LED1-16） Lighting start Address 31h < Matrix data clear > Address R/W Bit7 Bit6 (Index) 31h W Initial 00h value Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 - - - - - CLRA - - - - - 0 Bit 0：CLRA Reset Pattern register “0”：Pattern register is not reset and writable（initial value） “1”：Pattern register is reset (Note)CLRA register return to 0 automatically. Address 7Fh < Register map change > Address R/W Bit7 Bit6 (Index) 7Fh W Initial 00h value Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 - - - - - RMCG - - - - - 0 Bit 0：RMCG Change register map “0”：Control register is selected（initial value） “1”：Pattern register is selected www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Register Map - continued Address 01h-40h < Pattern register data > Address R/W Bit7 Bit6 Bit5 (Index) 01-40h W ILEDXXSET [3:0] Initial 00h 0 0 0 value Bit7-4/Bit 3-0：ILEDXXSET[3:0] 0 0 0 ・ ・ ・ Bit4 Bit3 Bit2 Bit1 Bit0 ILEDXXSET [3:0] 0 0 0 0 0 LED output current setting for Pattern matrix data ILEDxxSET[3:0] 0 0 0 0 0 1 ・ ・ ・ ・ ・ ・ 0 1 0 ・ ・ ・ 電流値 0 [mA] 1/15 x ILEDmax [mA] 2/15 x ILEDmax [mA] 1/15 x ILEDmax [mA] Step ・ ・ ・ ・ 1 1 0 1 13/15 x ILEDmax [mA] 1 1 1 0 14/15 x ILEDmax [mA] 1 1 1 1 15/15 x ILEDmax [mA] example : ILEDmax=20mA (ISET=100 kΩ) , LED current setting as below. “0000”： 0.00mA “0001”： 1.33mA “0010”： 2.67mA “0011”： 4.00mA “0100”： 5.33mA “0101”： 6.67mA “0110”： 8.00mA “0111”： 9.33mA “1000”：10.67mA（initial value） “1001”：12.00mA “1010”：13.33mA “1011”：14.67mA “1100”：16.00mA “1101”：17.33mA “1110”：18.67mA “1111”：20.00mA (Note) In a SPI interface, the interval to the following access has regulation after this address access. For details, please refer to the clause of the chapter of serial interface, and the electrical property of a SPI format. (Note) The change of this register needs OSC frequency or CLKIO external input frequency. Please set "Address 01H" or "Address 21H" before the change of this register. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Description of operation 1. LED Matrix 1-1. Lighting method of dot Matrix It can control 8 x 16 Matrix. VINSW D0 E0 F0 01 11 21 31 41 51 61 71 81 91 A1 B1 C1 D1 E1 F1 02 12 22 32 42 52 62 72 82 92 A2 B2 C2 D2 E2 F2 03 13 23 33 43 53 63 73 83 93 A3 B3 C3 D3 E3 F3 04 14 24 34 44 54 64 74 84 94 A4 B4 C4 D4 E4 F4 05 15 25 35 45 55 65 75 85 95 A5 B5 C5 D5 E5 F5 06 16 26 36 46 56 66 76 86 96 A6 B6 C6 D6 E6 F6 07 17 27 37 47 57 67 77 87 97 A7 B7 C7 D7 E7 F7 LED1 T07 C0 LED16 SW 8 B0 LED15 T06 A0 LED14 SW 7 90 LED13 T05 80 LED12 SW 6 70 LED11 T04 60 LED10 SW 5 50 LED9 T03 40 LED8 SW 4 30 LED7 T02 20 LED6 SW 3 10 LED5 T01 00 LED4 SW 2 LED3 T00 LED2 SW 1 Figure 8. TDM TDM TDM TDM TDM TDM TDM TDM TDM TDM TDM TDM TDM TDM TDM X Matrix Direction TDM Y 8 x 16 LED Matrix coordinate The SW1 – SW8 is turned on by serial. LED is driven one by one within the ON period. SW 1 SW 2 SW 3 SW 4 SW 5 SW 6 SW 7 SW 8 LED1 ・ ・ ・ ・・ D00 D01 D02 D03 D04 DF0 DF1 DF2 DF3 DF4 D05 D06 D07 D00 D01 DF6 DF7 DF0 DF1 LED16 DF5 PW M period＝ 524clk（@ 1.2MHz、436.7us） 1/8TDMA period＝ 559clk（@ 1.2MHz、465.8us） Duty is variable 0/63 and between 1/63 and 63/63 of PW M period. TDMA period＝ 4472clk（@ 1.2MHz、3.73ms） Figure 9. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 SW timing 17/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Description of operation - continued 1-2. LED lighting example The following command set is the example of LED matrix lighting. 1) 7Fh 2) 21h 3) 01h 4) 11h 5) 12h 6) 20h 7) 7Fh 8) 01-40h 9) 7Fh 10) 30h 11) 30h 2. 00000000 00000000 00001000 11111111 11111111 00111111 00000001 xxxxxxxx 00000000 00000001 00000000 Select control register Select internal OSC for CLK Start OSC Set LED1-8 enable Set LED9-16 enable Set Max Duty at Slop Set Max Duty Select Pattern register to write matrix data Write pattern data Select control register, Pattern register to output for matrix Start lighting Light off LED Driver Current Control It can be controlled PWM Duty and DC current for LED driver current. Item (A)(Note2) (B)(Note3) PWM Duty DC current Control object Setting Registers Name (Note1) Bits PWMSET 6 ILEDXXSET 4 Control detail Whole matrix Each matrix dot 0/63 to 63/63 (64 step) 0 to 20.00mA (16 step) (Note1) The “XX” shows the matrix number from “00” to “F7”. Please refer 8x16 LED Matrix coordinate. (Note2) For setting(A), please refer to P14 :register map of address 20H. (Note3) For setting(B), please refer to P16 :register map of address 01H-40H. Minimum width=5clk (A) PWM Duty Duty is variable by PWMSET[5：0] between 0/63 and 63/63.（Duty 1/63=8clk） OFF LED Driver Internal enable signal Clk (ex.1.2MHz at internal OSC) ~ ~ ~ ~ 559clk = 1/8TDMA Figure 10. LED output current timing and PWM cycle 524clk of PWM period is set in the 1/8 TDM period (559clk). PWM is operated 63 steps of 8clk. TDM period is 3.73ms (@1.2MHz). Moreover, it has the starting waiting time of a constant current driver by 20clk. PWM"H" time turns into ON time after waiting 20clk. (However, LED driver is set “OFF” compulsorily at PWM=0% setting.) 20clk wait LED Drive Internal enable signal PWM = 0/63 setting OFF 0mA PWM = 1/63 setting 20clk 1/63 = 8clk PWM = 2/63 setting 20clk 2/63 = 16clk Figure 11. LED output current timing and a PWM cycle www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Description of operation - continued 3. About LEDMax current setting LED Current is variable by RISET resister connecting ISET terminal. Maximum LED current can be leads by next formula. ILEDmax [A] = 2.0 / RISET [kΩ] (Typ) Caution that Maximum LED current value is up to 42.5mA. 60 Prohibit setting area (under 47.5kΩ) ILED [mA] 50 40 30 20 10 0 0 50 100 150 200 250 300 350 400 450 500 RISET [kΩ] Figure 12. ILED vs RISET In case of RISET = 100[kΩ], Maximum LED current is 20.0mA. There are Maximum LED current and Delta LED current value in next table. If you change the RISET value, you can calculate LED current on each step by next table. Recommended RISET value is 100[kΩ]. In case of RISET under 47.5 [kΩ], ISET short function may be effective. An example for setting DC current=16mA , PWMDuty=50.8% 1. ILEDMax current setting (set by external resistor): RISET=100kΩ -> ILEDmax[A]= 2.0 / RISET [kΩ]=20mA. 2. DC current setting (set by register/Each matrix dot can be set): ILEDxxSET[3:0]=”1100” -> ILEDxx[A]=12/15 * ILEDmax=16mA. Please refer to P16 to set register of address01H-40H. 3. PWM duty setting (set by register /whole matrix): PWMSET[5:0]=”100000” (50.8%) -> ILEDxx[A]=16mA * 50.8%=8.128mA. Please refer to P14 to set register of address20H. 4. 1/8TDM active -> ILEDxx[A]=8.128mA * 1/8=1.016mA. For this case, average 1.016mA LED current is loaded to one LED. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Description of operation - continued 4. Power up sequence VBAT 2.5V 2.5V TVBATON=min 0ms TVBATOFF2=min 0ms VINSW TVINSWON=min 0ms TVINSWOFF=min 0.1ms TVIOON=min 0.5ms TVIOOFF=min 1ms 1.55V VIO 0.4V RESETB TRST=min 0ms TRSTB=min 0.1ms COMMAND Inhibit Inhibit Possible Figure 13. Power up sequence Please take sufficient wait time for each Power/Control signal. However, if VBATTTSD(Typ:175℃), the command input is not effective because of the protection operation 5. Reset There are two kinds of reset, software reset and hardware reset (1) Software reset ・All the registers are initialized by SFTRST="1". ・SFTRST is an automatically returned to "0". (Auto Return 0). (2) Hardware reset ・It shifts to hardware reset by changing RESETB pin “H” → “L”. ・The condition of all the registers under hardware reset pin is returned to the Initial Value, and it stops accepting all address. All LED driver turn off. ・It’s possible to release from a state of hardware reset by changing RESETB pin “L” → “H”. RESETB pin has delay circuit. lt doesn’t recognize as hardware reset in "L" period under 5μs. 6. Thermal shutdown A thermal shutdown function is effective at all blocks of those other than VREF. Return to the state before detection automatically at the time of release. 7. UVLO Function (VBAT Voltage Low-Voltage Detection) UVLO function is effective at all blocks of those other than VREF, and when detected, those blocks function is stopped. Return to the state before detection automatically at the time of release. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Description of operation - continued 8. I/O When the RESETB pin is Low, the input buffers (SDA and SCL) are disabling for the Low consumption power. VBAT VIO RESETB=L, Output “H” SCL (SDA) Level Shift EN LOGIC RESETB Figure 14. 9. Input disabling by RESETB Standard Clock Input and Output It is possible to carry out synchronous operation of two or more ICs using the input-and-output function of a standard clock. CLKIO PMOS Register : CLKOUT TDMA Switch LEDMatrix Controller SEL OSC LED Driver Register : CLKIN SYNC Register: SYNCON Figure 15. I/O part equivalent circuit diagram ・When a clock is supplied from the exterior Inputting an external standard clock from CLKIN and setting register CLKIN=1, IC operates with the clock inputted from CLKIN as a standard clock. ・When the built-in oscillation circuit of one IC is used When a clock cannot be supplied from the exterior, it is possible to synchronize between ICs by the connection as the following figure. When a clock supplied from IC1 IC1 IC2 IC3 OSC OSC CLKIO Figure 16. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 CLKIO OSC CLKIO It is an example of application for the usage of two or more. 21/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Description of operation - continued 10. External ON/OFF Synchronization (SYNC Terminal) Lighting of LED that synchronized with the external signal is possible. By setting H/L of SYNC terminal, LED drivers output is set ON/OFF. It’s asynchronous operation with the internal TDMA control. CLKIO PMOS Register : CLKOUT TDMA Switch LEDMatrix OSC SEL Controller LED Driver Register : CLKIN SYNC Register : SYNCON Figure 17. I/O part equivalent circuit diagram 11. About terminal processing of the function which is not used Please set up a test terminal and the unused terminal as the following table. Especially, if an input terminal is not fixed, it may occur the unstable state of a device and the unexpected internal current. Terminal name Processing Reason SYNC CLKIO GND Short Open TEST1 TESTO GND Short Open In order to avoid an unfixed state. Pin is fixed to L because pin is connected with a Pull down register of 500Kohm The input terminal for a test (94k Ω Pull down) The output terminal for a test LED Terminal GND Short In order to avoid an unfixed state. (Register setup in connection with LED terminal that is not used is forbidden.) SW Terminal VINSW Short In order to avoid an unfixed state. (Register setup in connection with SW terminal that is not used is forbidden.) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Description of operation - continued 12. Setting about VINSW VINSW is Power Supply about LED Current. It needs proper Voltage range of LED terminal to get proper LED Current (refer to Page5). If it needs the voltage range, it needs to set up proper Voltage range of VINSW which is Power Supply about LED. VINSW Internal IC External IC (unit) VINSW = V1 + V2 + V3 V1: IR Drop Voltage SW IOUT V2: LED Vf SW1 on/off SW2 on/off SW3 on/off SW4 on/off SW5 on/off IOUT mA LED1 LED16 Iout_max V3: Terminal Voltage to operate Iout_min time IOUT = ILED1 + ILED2 + ************** + ILED16 Figure 18. Set up VINSW Figure 19. SW timing and IOUT VINSW’s Voltage range is made by V1, V2, V3. (refer to Figure 18) VINSW_max = V1_min + V2_min + V3_max VINSW_min = V1_max + V2_max + V3_min V1:IR Drop Voltage V1 is IR Voltage drop by SW’s Resistor at ON and IOUT which is the sum of every LED Current. It is V1’s maximum and minimum that it multiplies by SW’s Resistor at ON and IOUT maximum and minimum in each SW timing. Please estimate IOUT by setting application. (refer to figure 19). Please refer to page 5 about SW’s Resistor at ON. (And it needs to estimate parasitic resistor on PCB’s current route). V1_max = Ron * Iout_max V1_min = Ron * Iout_min V2: LED Vf V2 is the Voltage drop by LED’s Vf. Please confirm about all LED’s Vf. V2_max = Vf_max V2_min = Vf_min V3: Terminal Voltage to operate V3 is the terminal Voltage to operate LED Current. (refer to page 5). The minimum is made by IC’s ability. The maximum is made by VBAT’s minimum in Voltage range. V3_max = VBAT_min – 1.4V V3_min = 0.2V --Example of Setting VINSW— Condition: VBAT=3.2 – 4.0 V, Iout_max = 100mA, Iout_min = 20mA, Vf_max = 3.0V, Vf_min = 2.5V V1_max = 1 ohm * 100mA = 0.1V V2_max = 3.0V V3_max = 3.2V – 1.4V = 1.8V V1_min = 1 ohm * 20mA = 0.02V V2_min = 2.5V V3_min = 0.2V VINSW_max = 0.02V + 2.5V + 1.8V = 4.32V VINSW_min = 0.1V + 3.0V + 0.2V =3.3V This is proper Voltage range about VINSW. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Power dissipation (On the ROHM’s standard one layer board) 1.8 Power Dissipation Pd （W) 1.6 1.4 1300mW 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 25 50 75 100 125 150 Figure 20. Power dissipation Ta(℃) Pd=(VINSW-Vf) x ILED x N(Channel) ex ) VINSW=5V, Vf=3.2V, ILED =20mA,N=16channel, Pd =(5-3.2) x 20 x 16=576mW Please adjust VINSW and ILED in order to prevent Pd from exceeding 1300mV of power dissipation. *VINSW: VINSW input voltage *Vf: Diode Vf *ILED: LED Current *N(Channel): LED Channel www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 20. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 17. Disturbance light In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Ordering Information B U 1 6 5 0 1 K Part Number S 2 - Package KS2: SQFP-T52M SQFP-T52 E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram (TOP VIEW) (TOP VIEW) Part Number Marking BU16501GD Part Number Marking BU16501KS2 LOT Number 1PIN MARK Marking BU16501GD BU16501KS2 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 LOT Number 1PIN MARK Package SQFP-T52M SQFP-T52 SQFP-T52 27/30 Wire Au Cu TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Physical Dimensions Tape and Reel Information Package Name www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 SQFP-T52M 28/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 SQFP-T52 29/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Datasheet BU16501KS2 Revision History Date Revision 01.Oct.2013 001 Changes New Release 04.Sep.2014 002 Additional SQFP-T52 package and marking image 14.Mar.2016 003 Modified the marking www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 30/30 TSZ02201-0G3G0CZ00250-1-2 14.Mar.2016 Rev.003 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001