GPIO ICs Series
GPIO Expander IC
No.09098EAT02
BU1850MUV
●Description
GPIO expander is useful especially for the application that is in short of IO ports.
It can
2
1. Control GPIO output states by I C write protocol.
2
2. Know GPIO input states by I C read protocol.
Furthermore,it has the interrupt function that can release CPU from polling the registers in the GPIO expander.
GPIO expander are also equipped with Built-in power on reset, 3V tolerant input,and NMOS open-drain output.
●Features
1) An 8-Port General purpose input/output interface 150kΩPull-down resistance.
2) NMOS Open-drain output interrupt controller with up to 1us pulse noise filter and bit mask function for
individual GPIO port.
3) 3volt tolerant Input
4) Built-in Power On Reset
5) 3mmx3mm small package
●Absolute maximum ratings
o
(Ta=25 C)
Parameter
Supply Voltage*1
Symbol
Rating
Unit
comment
VDD
-0.3 ~ +4.5
V
VDD≦VDDIO
VDDIO
-0.3 ~ +4.5
V
*1
VI
-0.3 ~ VDD +0.3
V
XRST, ADR
XINT, SCL, SDA, GPIO[7:0]
Input voltage
VIT
-0.3 ~ 4.5
V
Storage temperature range
Tstg
-55 ~ +125
℃
Package power
PD
272*2
mW
This IC is not designed to be X-ray proof.
*1
*2
It is prohibited to exceed the absolute maximum ratings even including +0.3 V.
o
o
Package dissipation will be reduced each 2.72mW/ C when the ambient temperature increases beyond 25 C.
●Operating conditions
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
VVDD
1.65
1.80
3.6
V
Core, XINT, XRST,
SCL, SDA, ADR,
Power On Reset
VVDDIO
1.65
1.80
3.6
V
GPIO[7:0]
VIN
-0.2
-
VVDD+0.2
V
XRST, ADR
VINT
-0.2
-
3.6
V
XINT, SCL, SDA,
GPIO[7:0]
Operating temperature range
Topr
-30
-
+85
℃
I2C operating frequency
FI2C
-
-
400
kHz
Supply voltage range (VDD)
Supply voltage range (VDDIO)
Input voltage range
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1/17
Slave
2009.09 - Rev.A
Technical Note
BU1850MUV
●Package Specification
B U 1
8 5 0
Lot No.
(UNIT: mm)
Fig.1 Package Specification (VQFN016V3030)
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2/17
2009.09 - Rev.A
Technical Note
BU1850MUV
9 GPIO0
10 GPIO1
11 GPIO2
12 GPIO3
●Pin Assignment
7 VDDIO
15 GPIO6
6 VDD
16 GPIO7
5 SDA
3 SCL
4 ADR
14 GPIO5
2 XRST
8 VSS
1 XINT
13 GPIO4
Fig.2 Pin Diagram (Top View)
●Block Diagram
Functional Block Diagram
XINT
Interrupt
Filter
Interrupt
Logic
INT_MASK
IN/OUT
Control
VDD
ADR
VDDIO
SCL
I2C Bus
Control
Input
Filter
SDA
Power
On
Reset
XRST
Reset
Gen
Shift
Register
8bit
GPIO
[7:0]
8bit
GPIO[7:0]
Write Pulse
Read Pulse
VSS
Fig.3 Functional Block Diagram
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3/17
2009.09 - Rev.A
Technical Note
BU1850MUV
●Pin-out Functional Descriptions
PIN
No.
PIN name
I/O
Power source
system
Function
Init
Cell
Type
1
XINT
O
VDD
Interrupt signal (1s pulse cut)*1
(NMOS Open-drain)
Hi-Z
B
2
XRST
I
VDD
Reset（Low Active）
I
E
I
A
I
E
Hi-Z
C
-
-
3
4
SCL
ADR
I
2
VDD
I
Clock for I C
2
VDD
Select device address of I C
2
*1
*2
*3
Serial data inout for I C
(NMOS Open-drain)
Power supply (Core, I/O, Power On
Reset)
5
SDA
I/O
VDD
6
VDD
-
-
7
VDDIO
-
-
Power supply (I/O)
-
-
8
VSS
-
-
GND
-
-
9
GPIO0
I/O
VDDIO
10
GPIO1
I/O
VDDIO
11
GPIO2
I/O
VDDIO
12
GPIO3
I/O
VDDIO
GPIO4
I/O
VDDIO
I
Pull-down
D
13
General purpose input/output.
*2
(NMOS Open-drain /CMOS Output,
*3
150kΩPull-down )
14
GPIO5
I/O
VDDIO
15
GPIO6
I/O
VDDIO
16
GPIO7
I/O
VDDIO
Specific bit mask control is decided by internal register value.
Pull-up more than VDDIO voltage.
It is possible to select Pull-down ON or OFF with register.
A
B
C
D
E
Fig.4 Equivalent IO circuit diagram
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4/17
2009.09 - Rev.A
Technical Note
BU1850MUV
●Functional Description
1. Power Modes
The device enters the state of Power Down when XRST=”Low” or enters the operation state when XRST=High after
powered.
Refer to “Electrical Specification” section 5 for a detailed startup sequence.
1-1 Power supply
A single supply to Core power supply (VDD) and IO power supply (VDDIO) is prohibited.
Supply the power supply to the Core power supply and the IO power supply at the same time.
1-2 Power On Reset
A Power On Reset logic is implemented in this device. Therefore, it will operate correctly even if the XRST port is
not used. In this case, the XRST port must be connected to high(VDD).
1-3 State of Power Down
2
The device enters the state of Power Down by XRST=”Low”. An internal circuit is initialized and I C interface is
invalid is input. Power On Reset becomes inactive during this state.
1-4 State of operation
The device enters the operation state by setting XRST to "High". The I2C interface starts communication is
the START condition. It becomes standby by the STOP condition. Power On Reset is active in this state.
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5/17
2009.09 - Rev.A
Technical Note
BU1850MUV
2.
2
I C Bus Interface
Each function of GPIO is controlled by an internal register. The I2C Slave interface is used to write or read this internal
register. The device supports up to 400kHz Fast-mode data transfer rate.
2-1 Slave address
Two device addresses (Slave address) can be selected by ADR port.
A7
A6
A5
A4
A3
A2
A1
ADR=0
0
0
0
1
0
0
1
ADR=1
0
0
0
1
1
1
0
R/W
1/0
2-2
Data transfer
One bit of data is transferred during SCL = “1”. During the bit transfer SCL = “1” cycle, the signal SDA should
keep the value. If SDA changes during SCL = “1”, a START condition or STOP condition occur and it is interpreted
as a control signal.
SDA
SCL
Data is valid
when SDA is
stable
SDA is
variable
Fig.5 Data transfer
2-3 START-STOP-Repeated START conditions
When SDA and SCL are “1”, the data isn’t transferred on the 2-wire bus. If SCL remains “1” and SDA transfers
from “1” to “0”, it means a “Start condition” is occurred and access is started.
If SCL remains “1” and SDA transfers from “0” to “1”, it means a “Stop condition” is occurred and access is
stopped.
It becomes repeated START condition (Sr) the START condition enters again although the STOP condition is not
done.
SDA
SCL
S
START Condition
Sr
P
Repeated START Condition
STOP Condition
Fig.6 START-STOP-Repeated START conditions
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Technical Note
BU1850MUV
2-4 Acknowledge
After start condition is occurred, 8 bits data will be transferred. SDA is latched by the rising edge of SCL.
Then the “Master” opens SDA to “1” and “Slave” de-asserts SDA to “0” as an “Acknowledge” returned.
Fig.7 Acknowledge
2-5 Writing protocol
Register address is transferred after one byte of slave address with R/W bit. The 3rd byte data is written to internal
register which defined by the 2nd byte. However, when the register address increased to the final address (13h), it
will be reset to (00h) after the byte transfer.
S X X X X X X X 0 A X X X A4 A3 A2 A1 A0 A D7 D6 D5 D4 D3 D2 D1 D0 A
Slave address
Register address
Transmit from slave
data
data
R/W=0(write)
Transmit from master
D7 D6 D5 D4 D3 D2 D1 D0 A P
Register address
increment
Register address
increment
A=acknowledge
A=not acknowledge
S=Start condition
P=Stop condition
Fig.8 Writing protocol
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2009.09 - Rev.A
Technical Note
BU1850MUV
2-6 Reading protocol
After Writing the slave address and Read/Write commend bits, the next byte is read. The reading register address
is next of previous accessed address. Therefore, the data is read with address increment. When the address in
increased to the last, the following read address will be reset to (00h).
Fig.9 Readout protocol
2-7 Complex reading protocol
After the specifying the internal register address, a repeated START condition occurs and the direction of data
transfer is changed then reading access is done. Therefore, the data is read followed by address increment. If the
address is increased to the last, it will be reset to (00h).
S X X X X X X X 0 A X X X A4 A3 A2 A1 A0 A Sr X X X X X X X 1 A
Slave address
Register address
Slave address
R/W=0(write)
R/W=1(read)
D7 D6 D5 D4 D3 D2 D1 D0 A
D7 D6 D5 D4 D3 D2 D1 D0 A P
data
Transmit from master
data
Register address
increment
Transmit from slave
Register address
increment
A=acknowledge
A=not aclnowledge
S=Start condition
P=Stop condition
Sr=Repeated Start condition
Fig.10 Complex reading protocol
2-8 Illegal access of I2C
The data accessed at that time is annulled, and access it again.
The illegal accesses are as follows.
The START condition and the STOP condition are continuously generated.
When the Slave address and the R/W bit is written, repeated START condition and the STOP
condition are generated.
Repeated START condition and the STOP condition are generated while writing data.
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2009.09 - Rev.A
Technical Note
BU1850MUV
3. Register configuration
The address is increased one by one when data is continuously written.
When the final address is set to 13h, then the next address 00h will be written.
By making XRST “Low”, the setting register value will be initialed shown in following register map.
3-1 Register map
Addr
Init
Type
D7
D6
D5
D4
D3
D2
D1
D0
00h
-
-
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
01h
-
-
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
02h
-
-
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
03h
-
-
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
04h
00h
R/W
RESET
reserved
reserved
reserved
reserved
reserved
reserved
reserved
05h
-
-
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
06h
-
-
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
07h
-
-
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
08h
00h
R/W
INTEN7
INTEN6
INTEN5
INTEN4
INTEN3
INTEN2
INTEN1
INTEN0
09h
-
-
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
0Ah
-
-
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
0Bh
-
-
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
0Ch
-
-
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
0Dh
-
-
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
0Eh
-
-
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
0Fh
-
-
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
10h
00h
R
GPI7
GPI6
GPI5
GPI4
GPI3
GPI2
GPI1
GPI0
11h
00h
R/W
GPO7
GPO6
GPO5
GPO4
GPO3
GPO2
GPO1
GPO0
12h
00h
R/W
WRSEL7
WRSEL6
WRSEL5
WRSEL4
WRSEL3
WRSEL2
WRSEL1
WRSEL0
13h
00h
R/W
XPD7
XPD6
XPD5
XPD4
XPD3
XPD2
XPD1
XPD0
※
Do not write reserved resisters excluding "0". 10h address register is disregarded even if it is written.
3-2 Resister function
※
n is the number of GPIO[7:0] ports.
Symbol
Addr
Description
RESET
04h
The register is returned to an initial value by writing "1". This register value is returned to "0".
GPIn register is not initialized.
INTENn
08h
Interrupt of GPIOn port is enabled by "1". It is masked by "0".
GPIn
10h
Read GPIOn port. Writing is disregarded.
GPOn
11h
Output value of GPIOn port.
WRSELn
12h
GPIOn port is input by "0" and output by "1".
XPDn
13h
Pull-down of GPIOn port is on by "0" and off by "1". GPIOn should be input.
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Technical Note
BU1850MUV
4. GPIO-Interrupt
4-1 GPIO configuration
As the default value, GPIO[7:0] ports are input and Pull-down.
At this time, WRSELn is "0" and XPDn is "0". (n is the number of GPIO[7:0] ports.)
Refer to the following for the configuration of GPIO.
Register
State of GPIO
GPOn
WRSELn
XPDn
Input, Pull-down ON
*
0
0
Input, Pull-down OFF
*
0
1
Output, H drive
1
1
*
Output, L drive
0
1
*
0
0
1
※1
Output, Hi-Z -1
※1
Make external Pull-up the terminal potential which is the potential of VVDDIO or more.
About GPIO port not used
When making it to the output, open it.
When making it to the input, do not open it. It is forced by "0" or Pull-down on.
When interrupt is enabled, mask INTEN register in which the port is not used to "0".
4-2 Interrupt configuration
When interrupt is generated, L is output from XINT port. The default value is Hi-Z. Make it Pull-up.
For the default value, interrupt is masked with INTEN register "0".
The bit to be used is made "1", and the mask is released. WRSEL register should be "0"(input).
4-3 Write to GPIO port
After setting the internal register address, the data from master is written from MSB.
After Acknowledge is returned, the value of each GPIO port will be changed.
When the register is written, Write Configuration Pulse is generated according to the timing of Acknowledge.
SCL
1
SDA
S
X
2
X
3
4
X
5
X
X
6
X
Start Condition
7
X
8
0
Write
9
Ack
MSB
Reg Address
LSB
Ack
MSB
Data1 (GPO[7:0])
LSB
Ack
P
Acknowledge From Slave
Stop Condition
Acknowledge From Slave
Write Configuration
Pulse
Data1
Valid
GPIO[7:0]
tDV
SCL
SDA
1
S
X
2
X
Start Condition
3
X
4
X
5
X
6
X
7
X
8
0
Write
9
Ack
MSB
Reg Address
Acknowledge From Slave
LSB
Ack
MSB
Data1 (GPO[7:0])
Acknowledge From Slave
LSB
Ack
MSB
WRSEL = Write Mode
LSB
Ack
P
Acknowledge From Slave
Stop Condition
Write Configuration
Pulse
Data1
Valid
GPIO[7:0]
tDV
Fig.11 Write to GPIO port
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BU1850MUV
4-4 Read from GPIO port
After writing of the Slave address and R/W bits, reading GPIO port is begun from the following byte.
The data that had been being fixed between the following Acknowledge after Acknowledge is taken into the GPI
register, and it is transmitted to Master.
All ports that are the input by WRSEL register are read to the GPI register according to the timing of Read
Configuration Pulse. Therefore, the data of each bit that SDA transmits is the GPI register value taken immediately
before that.
SCL
S
SDA
1
2
3
4
5
6
7
8
9
X
X
X
X
X
X
X
1
Ack
D1
[6]
D1
[5]
D1
[4]
D2
[3]
D2
[2]
D2
[1]
D2
[0]
NA
P
Stop Condition
No Acknowledge From Master
Acknowledge From Slave
Read
Start Condition
D1
[7]
Read Configuration
Pulse
GPI[7:0] Reg
D2
D1
D1
GPIO[7:0]
tDS
D2
tDS
tDH
tDH
Fig.12 Read from GPIO port
4-5 Interrupt Valid/Reset
If GPIO port becomes different from the GPIn register (default is "0"), XINT port is changed from "1" into "0".
It becomes "1" to release "0" of XINT port after acknowledge by reading GPI register. Because the value of GPIO
port is reflected in the output as it is and is not latched, XINT becomes "1" again if the port returns to the same
value.
If the ports with INTEN register "1" are different even by one, XINT becomes "0".
If it is distinguished which GPIO port changes, it is necessary to keep the GPI register value on the master side
and compare with the value that is read after XINT is asserted.
SCL
SDA
S
1
2
3
4
5
6
7
8
9
X
X
X
X
X
X
X
1
Ack
Read
Start Condition
MSB
Data2 (GPI[7:0])
LSB
NA
P
Stop Condition
Acknowledge From Slave
No Acknowledge From Master
GPIOn
Data1
GPIn Reg
Data1
Data3
Data2
Data2
Data2
XINT
tIV
tIR
tIV
tIR
Fig.13 Interrupt Valid/Reset
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11/17
2009.09 - Rev.A
Technical Note
BU1850MUV
●Electrical Specification
1. DC characteristics
VVDD=1.8V，VVDDIO=1.8V，Topr=25℃
Specification
Parameter
Symbol
Unit
Min
Typ
Max
Conditions
Input H Voltage1
VIH1
0.7xVVDDIO
-
3.6
V
Input L Voltage1
VIL1
-0.2
-
0.3xVVDDIO
V
Input H Voltage2
VIH2
0.7xVVDD
-
3.6
V
SCL, SDA,
Input L Voltage2
VIL2
-0.2
-
0.3xVVDD
V
SCL, SDA, XRST, ADR
Input H Voltage3
VIH3
0.7xVVDD
-
VVDD+0.2
V
XRST, ADR
Input H Current1
(3V Tolerant)
IIH1
-1
-
1
A
VIN=3.6V*1
Input H Current2
IIH2
-1
-
1
A
VIN=1.8V, XRST,ADR
IIL
-1
-
1
A
VIN=0V*1, XRST,ADR
Output H Voltage1
VOH1
0.75xVVDDIO
-
-
V
IOH=-2mA, GPIO[7:0]
Output L Voltage1
VOL1
-
-
0.25xVVDDIO
V
IOL=2mA, GPIO[7:0]
Output H Voltage2
VOH2
VVDDIO-0.25
-
-
V
IOH=-0.2mA, GPIO[7:0]
Output L Voltage2
VOL2
-
-
0.25
V
IOL=0.2mA, GPIO[7:0]
Output L Voltage3
VOL3
-
-
0.3
V
IOL=3mA, SDA, XINT
GPIO[7:0]
Input L Current
*1 XINT(Hi-Z), XRST, SCL, SDA(IN), ADR, GPIO[7:0](IN, Pull-down OFF)
2. Circuit Current
VVDD=1.8V，VVDDIO=1.8V，Topr=25℃
Specification
Parameter
Symbol
Unit
Min
Typ
Max
Condition
Power Down Current
(VDD)
IPD1
-
-
1.0
A
Power Down Current
(VDDIO)
IPD2
-
-
1.0
A
ISTBY1
-
-
3.0
A
Standby Current
(VDDIO)
ISTBY2
-
-
1.0
A
Operating Current1
(VDD)
IOP1
-
14
25
A
I2C 400kHz
100% traffic density*1
Operating Current1
(VDD)
IOP2
-
2
8
A
I2C 400kHz
1% traffic density*2
Standby Current
(VDD)
*1
*2
XRST=VSS
XRST=VDD,
SCL=VDD, SDA=VDD
All GPIO ports are output, and they repeat 01010101 and 10101010.
The period when I2C did not operate was inserted in *1 pattern by 99%.
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12/17
2009.09 - Rev.A
Technical Note
BU1850MUV
3. I2C AC characteristics
State
（Repeated）
START
BIT 7
BIT 6
tSU;STA
tLOW tHIGH
Ack
STOP
1/fSCLK
SCL
SDA
tSU;STO
tSU;DAT tHD;DAT
tBUF tHD;STA
Fig.14 I2C AC Timing
VVDD=1.8V，VVDDIO=1.8V，Topr=25℃
Specification
Parameter
Symbol
Unit
Min
Typ
Max
SCL Clock Frequency
fSCLK
-
-
400
kHz
Bus free time
tBUF
1.3
-
-
s
(Repeated)START Condition
Setup Time
tSU;STA
0.6
-
-
s
(Repeated)START Condition
Hold Time
tHD;STA
0.6
-
-
s
SCL Low Time
tLOW
1.3
-
-
s
SCL High Time
tHIGH
0.6
-
-
s
Data Setup Time
tSU;DAT
100
-
-
s
Data Hold Time
tHD;DAT
0
-
-
ns
STOP Condition Setup Time
tSU;STO
0.6
-
-
s
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Conditions
2009.09 - Rev.A
Technical Note
BU1850MUV
4. GPIO AC Characteristics
State
BIT 1
BIT 0
Ack
BIT 1
BIT 0
Ack
SCL
tDV
GPIO[7:0](Output)
tDS
tDH
GPIO[7:0](Input)
tIV
tIR
XINT
Fig.15 GPIO AC timing
VVDD=1.8V，VVDDIO=1.8V，Topr=25℃
Specification
Parameter
Symbol
Unit
Min
Typ
Max
Output Data Valid Time
tDV
-
-
0.8
s
Input Data Setup Time
tDS
100
-
-
ns
Input Data Hold Time
tDH
0.8
-
-
s
Interrupt Valid Time
tIV
-
-
5
s
Interrupt Reset Time
tIR
-
-
5
s
Conditions
See Fig.11
See Fig.12
See Fig.13
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Technical Note
BU1850MUV
5. Startup sequence
tVDD
tVDD
tVDD
VDD,
VDDIO
tRV
tRWAIT
XRST
tRWAIT
tVDD
tI2CWAIT
tI2CWAIT
SCL
SDA
Fig.16 Start Sequence timing
VVDD=1.8V，VVDDIO=1.8V，Topr=25℃
Specification
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
VDD Stable Time
tVDD
-
-
5
ms
VDD and VDDIO are ON at the
same time.
Reset Wait Time
tRWAIT
0
-
-
s
XRST controlling *1
Reset Valid Time
tRV
10
-
-
s
tI2CWAIT
10
-
-
s
I2C Wait Time
*1
Even if XRST port is not used, it operates because Power On Reset is built in.
In this case, connect XRST port with VDD on the set PCB.
Note) At VDD=0V, when SCL port is changed from 0V to 0.5V or more, SCL port pulls the current. It is same in SDA, XINT,
and GPIO[7:0] ports of 3V tolerant I/O. (VDDIO=0V in case of GPIO[7:0] ports)
VDD
0V
Port
(2kΩ Pull-Up)
Port
Pull Current
3V
0V
0.1～1mA
2～3ms
Fig.17 Port operating at VDD=0V
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© 2009 ROHM Co., Ltd. All rights reserved.
15/17
2009.09 - Rev.A
Technical Note
BU1850MUV
●Application circuit example
1.8V
3.0V
0.1uF
IN
XINT
SCL
SCL
SDA
SDA
GPIO7
GPIO6
ADR
XINT
GPIO5
GPIO4
GPIO3
GPIO2
SCL
SDA
VSS
VDD
XRST
VDDIO
VSS
0.1uF
0.1uF
BU1850MUV
ADR
BU1850MUV
XRST
MPU
VDD
0.1uF
VDDIO
1.8V
GPIO7
GPIO6
GPIO5
GPIO4
GPIO3
GPIO2
GPIO1
GPIO1
GPIO0
GPIO0
Other I2C Devices
Fig.18 Application circuit example
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© 2009 ROHM Co., Ltd. All rights reserved.
16/17
2009.09 - Rev.A
Technical Note
BU1850MUV
●Ordering part number
B
U
1
Part No.
8
5
0
M
Part No.
U
V
Package
MUV:
VQFN016V3030
-
E
2
Packaging and forming specification
E2: Embossed tape and reel
VQFN016V3030
3.0±0.1
3.0±0.1
0.5
5
13
0.75
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
16
8
12
E2
9
1.4±0.1
0.4±0.1
1
3000pcs
(0.22)
1.4±0.1
+0.03
0.02 –0.02
1.0MAX
S
C0.2
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.08 S
Tape
+0.05
0.25 –0.04
1pin
(Unit : mm)
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© 2009 ROHM Co., Ltd. All rights reserved.
Reel
17/17
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.09 - Rev.A
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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Authorized Distributor
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