Datasheet
CMOS LDO Regulator for Portable Equipments
High Ripple Rejection,
Low Current Consumption,
Versatile Package
FULL CMOS LDO Regulator (500mA)
BUXXTH5WNVX
General Description
Key Specifications
BUXXTH5WNVX is high-performance FULL CMOS
regulator with 500-mA output, which is mounted on
versatile package SSON004X1010 (1.00mm × 1.00 mm
× 0.60mm). It has excellent ripple rejection, noise
characteristics and load responsiveness characteristics
despite its low circuit current consumption of 10µA. It is
most appropriate for various applications such as power
supplies for logic IC, RF, and camera modules.
Load Current:
Accuracy output voltage:
Power Supply rejection Ratio:
Low current consumption:
Operating temperature range:
500mA
±1.0%
80dB@1KHz
10µA (TYP)
-20°C to +85°C
Applications
Smartphone, Battery-powered portable equipment, etc.
Features
Package
High accuracy detection
High ripple rejection
low current consumption
Compatible with small ceramic capacitor
(Cin=Co=1.0uF)
With built-in output discharge circuit
ON/OFF control of output voltage
With built-in over current protection circuit
SSON004X1010 :
1.00mm x 1.00mm x 0.60mm
Typical Application Circuit
CE
CE
VIN
VIN
1.0µF
VOUT
VOUT
1.0µF
GND
GND
GND
Figure 1. Application Circuit
○Product structure：Silicon monolithic integrated circuit
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Datasheet
BUXXTH5WNVX
Connection Diagram
SSON004X1010
TOP VIEW
4 VIN
BOTTOM VIEW
3 CE
1 VOUT
2 GND
LOT Number
reverse FIN
Part Number Marking
3 CE
4 VIN
2 GND
1 VOUT
1PIN MARK
Pin Descriptions
SSON004X1010
Symbol
Function
VOUT
Output Voltage
GND
Grounding
ON/OFF control of output voltage
CE
(High: ON, Low: OFF)
VIN
Power Supply Voltage
FIN
Substrate (Connect to GND)
PIN No.
1
2
3
4
reverse
Ordering Information
B
U
X
Part
Number
X
T
Output Voltage
1A : 1.05V
⇓
35 : 3.50V
H
5
High Ripple Rejection
Maximum Output Current
500mA
W
N
V
X
-
1
with
Package
output discharge NVX : SSON004X1010
None:
Chip Rev.1
1:
Chip Rev.2
(XX=1A,12)
T
L
Packageing and forming specification
Embossed tape and reel
TL : The pin number 1 is the lower left
SSON004X1010
1.0±0.1
Tape
1.0±0.1
1PIN MARK
0.6MAX
0.32±0.1
±
48
0.
Direction
of feed
05 0.65±0.05
0.
1
2
(0.12)
+0.03
0.02 −0.02
S
0.05
Embossed carrier tape
Quantity
5000pcs
TL
The direction is the 1pin of product is at the lower left when you hold
( reel on the left hand and you pull out the tape on the left hand
)
3-C0.18
R0.05
45º
0
0.
5
0.25±0.05
0.07±0.1
±
48
3
0.25±0.1
0.
4
Direction of feed
1pin
(Unit : mm)
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
Lineup
Marking
Output
Voltage
Part
Number
Di
Ci
6i
Ai
1.05V
1.20V
2.85V
3.50V
BU1ATH5WNVX-1
BU12TH5WNVX-1
BU2JTH5WNVX
BU35TH5WNVX
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Datasheet
BUXXTH5WNVX
Absolute Maximum Ratings (Ta=25°C)
PARAMETER
Symbol
Limit
VMAX
-0.3 to +6.5
Power Supply Voltage
Power Dissipation
Maximum junction temperature
Operating Temperature Range
Storage Temperature Range
Pd
560
TjMAX
Unit
V
(Note1)
mW
+125
°C
Topr
-20 to +85
°C
Tstg
-55 to +125
°C
(Note1) Pd deleted at 5.6mW/°C at temperatures above Ta=25°C, mounted on 70×70×1.6 mm glass-epoxy PCB.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the
absolute maximum ratings.
RECOMMENDED OPERATING RANGE (not to exceed Pd)
PARAMETER
Power Supply Voltage
Maximum Output Current
Symbol
VIN
Limit
1.7 to 6.0
Unit
V
IMAX
500
mA
OPERATING CONDITIONS
PARAMETER
Input Capacitor
Symbol
Cin
MIN.
1.0 (Note2)
TYP.
-
MAX.
-
Unit
µF
Co
1.0 (Note2)
-
-
µF
Output Capacitor
(Note2) Make sure that
CONDITION
Ceramic capacitor recommended
the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias, changing as time
progresses characteristic.
Electrical Characteristics
(Ta=25°C, VIN= VOUT+1.0V, CIN=1.0µF, Co=1.0µF, unless otherwise noted.)
Limits
Parameter
Symbol
Unit
Min.
Typ.
Max.
Input Voltage
VIN
Output Voltage
VOUT
1.7
VOUT
-25mV
VOUT
6.0
VOUT
+25mV
Conditions
V
V
IOUT=10µA, VOUT＜2.5V
V
IOUT=10µA, VOUT≧2.5V
Line Regulation
⊿VOUT-line
VOUT
×0.99
-
-
VOUT
×1.01
20
mV
From (VOUT+0.3V) to 5.0V, IOUT=10mA
Load Regulation
⊿VOUT-load
-
21
40
mV
IOUT=5mA to 250mA
-
520
700
mV
VOUT=1.05V (IOUT=250mA)
-
440
550
mV
VOUT=1.20V (IOUT=250mA)
-
160
250
mV
VOUT=2.85V (IOUT=250mA)
-
150
230
mV
VOUT=3.50V (IOUT=250mA)
⊿Vdrop-out
Voltage Dropout
Load Current
Iload
500
-
-
mA
No Load Quiescent Current
Icq
-
10
20
µA
IOUT=0mA
Power Supply
Rejection Ratio
RR1
-
82
-
dB
fRR=100Hz
RR2
-
80
-
dB
fRR=1kHz
Output Noise Voltage
Noise
-
40
-
nV√Hz
@10KHz
Topr
-20
-
85
°C
RDSC
20
50
80
Ω
Operating Temperature range
Discharge Resistor
CE Pin Pull-down Current
CE Pin Control Voltage
ISTB
0.1
0.9
8.0
uA
ON
VCEH
1.2
-
6.0
V
OFF
VCEL
-0.3
-
0.3
V
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BUXXTH5WNVX
Block Diagrams
VIN
VIN
VREF
VOUT
CIN
OCP
GND
CE
VOUT
Co
CIN･･･1.0µF (Ceramic capacitor)
Co ･･･1.0µF (Ceramic capacitor)
CE
Figure 2. Block Diagrams
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BUXXTH5WNVX
Reference data BU1ATH5WNVX (Ta=25ºC unless otherwise specified.)
LINE REGULATION
1.08
25℃
85℃
1.07
Load Regulation
1.150
-20℃
25℃
85℃
CE=VIN
Iout=10mA
-20℃
1.06
VIN=2.5V
CE=VIN
1.100
VOUT [V]
VOUT[V]
1.05
1.04
1.03
1.050
1.02
1.000
1.01
1.00
0.950
0.99
1.7
2.0
2.3
2.6
2.9
3.2
0
3.5
50
100
Figure 3.
200
250
300
Figure 4.
OUTPUT VOLTAGE vs TEMPERATURE
GROUND PIN CURRENT vs INPUT VOLTAGE
20
1.15
VIN=2.5V
CE=VIN
IOUT=10uA
-20℃
25℃
CE=VIN
IOUT=0mA
85℃
15
IGND[uA]
1.10
VOUT[V]
150
IOUT[mA]
VIN[V]
1.05
10
1.00
5
0.95
-20
0
20
40
Temperature[℃]
60
0
80
1.7
2.3
2.6
VIN[V]
2.9
3.2
3.5
Figure 6.
Figure 5.
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Datasheet
BUXXTH5WNVX
Reference data BU1ATH5WNVX (Ta=25ºC unless otherwise specified.)
GROUND PIN CURRENT vs TEMPERATURE
20
GROUND PIN CURRENT vs LOAD
300
VIN=2.5V
CE=VIN
IOUT=0mA
18
16
VIN=2.5V
CE=VIN
Ta=25℃
200
12
IGND [uA]
IGND[uA]
14
10
8
6
100
4
2
0
-20
0
20
40
Temperature[℃]
60
0
80
0
100
200
Figure 7.
VIN=2.5V
CE=VIN
Ta=25℃
90
80
70
0.8
PSRR[dB]
VOUT[V]
500
PSRR vs FREQUENCY
100
VIN=2.5V
CE=VIN
Ta=25℃
1.0
400
Figure 8.
OCP
1.2
300
IOUT [mA]
0.6
0.4
60
50
40
30
20
0.2
10
0.0
0
0
100 200 300 400 500 600 700 800 900 1000 1100
IOUT[mA]
100
1,000
100mV/div
1.05V
500mV/div
100mV/div
500mV/div
VOUT
CE=VIN
VOUT
Ta=25℃
Iout=10mA
2.5V
VOUT
1.05V
3.5V
VIN
CE=VIN
Ta=25℃
Iout=150mA
2.5V
200us/div
200us/div
Figure 11.
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1,000,000
LINE TRANSIENT RESPONSE
LINE TRANSIENT RESPONSE
VIN
100,000
Figure 10.
Figure 9.
3.5V
10,000
Frequency[Hz]
Figure 12.
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Datasheet
BUXXTH5WNVX
Reference data BU1ATH5WNVX (Ta=25ºC unless otherwise specified.)
DISCHARGE TIME
START UP TIME
1.5V
1V/div
1V/div
1.5V
CE
CE
1V/div
1V/div
0V
VIN=2.5V
Ta=25℃
Iout=0mA
Cout=1.0uF
VOUT
VIN=2.5V
Ta=25℃
Iout=0mA
Cout=1.0uF
VOUT
20µs/div
40µs/div
Figure 13.
Figure 14.
LOAD TRANSIENT RESPONSE
SHUTDOWN CURRENT vs INPUT VOLTAGE
10.00
Trise=12us
VIN=5.5V
CE=0V
250mA
IOUT
1mA
ISTBY[uA]
200mA/div
0V
1.00
200mV/div
0.10
VOUT
VIN=2.5V
CE=VIN
Ta=25℃
0.01
-20
0
20
40
60
80
Temperature[℃]
20µs/div
Figure 16.
Figure 15.
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BUXXTH5WNVX
Reference data BU12TH5WNVX-1 (Ta=25ºC unless otherwise specified.)
LINE REGULATION
1.23
-20℃
25℃
85℃
1.22
1.21
Load Regulation
1.300
CE=VIN
Iout=10mA
-20℃
25℃
85℃
VIN=2.5V
CE=VIN
1.250
VOUT[V]
VOUT [V]
1.20
1.19
1.18
1.200
1.17
1.150
1.16
1.15
1.100
1.14
1.7
2.0
2.3
2.6
2.9
3.2
0
3.5
150
Figure 17.
Figure 18.
VIN=2.5V
CE=VIN
IOUT=10uA
200
250
300
GROUND PIN CURRENT vs INPUT VOLTAGE
20
-20℃
25℃
CE=VIN
IOUT=0mA
85℃
15
IGND[uA]
1.25
VOUT[V]
100
IOUT[mA]
OUTPUT VOLTAGE vs TEMPERATURE
1.30
50
VIN[V]
1.20
10
1.15
5
1.10
-20
0
20
40
Temperature[℃]
60
0
80
1.7
2.3
2.6
VIN[V]
2.9
3.2
3.5
Figure 20.
Figure 19.
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Datasheet
BUXXTH5WNVX
Reference data BU12TH5WNVX-1 (Ta=25ºC unless otherwise specified.)
GROUND PIN CURRENT vs TEMPERATURE
20
GROUND PIN CURRENT vs LOAD
300
VIN=2.5V
CE=VIN
IOUT=0mA
18
16
VIN=2.5V
CE=VIN
Ta=25℃
200
12
IGND [uA]
IGND[uA]
14
10
8
6
100
4
2
0
-20
0
20
40
Temperature[℃]
60
0
80
0
100
200
Figure 21.
VIN=2.5V
CE=VIN
90
80
70
1.0
60
0.8
PSRR[dB]
VOUT[V]
500
PSRR vs FREQUENCY
100
VIN=2.5V
CE=VIN
Ta=25℃
1.2
400
Figure 22.
OCP
1.4
300
IOUT [mA]
0.6
0.4
50
40
30
20
0.2
10
0
0.0
0
100
100 200 300 400 500 600 700 800 900 1000 1100
1,000
100mV/div
VOUT
1.2V
CE=VIN
VOUT
Ta=25℃
Iout=10mA
2.5V
200us/div
VOUT
1.2V
3.5V
VIN
CE=VIN
Ta=25℃
Iout=150mA
2.5V
200us/div
Figure 25.
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1,000,000
LINE TRANSIENT RESPONSE
500mV/div
500mV/div
100mV/div
LINE TRANSIENT RESPONSE
VIN
100,000
Figure 24.
Figure 23.
3.5V
10,000
Frequency[Hz]
IOUT[mA]
Figure 26.
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Datasheet
BUXXTH5WNVX
Reference data BU12TH5WNVX-1 (Ta=25ºC unless otherwise specified.)
DISCHARGE TIME
START UP TIME
1.5V
1V/div
1V/div
1.5V
CE
CE
1V/div
1V/div
0V
VIN=2.5V
Ta=25℃
Iout=0mA
Cout=1.0uF
VOUT
0V
VIN=2.5V
Ta=25℃
Iout=0mA
Cout=1.0uF
VOUT
20µs/div
40µs/div
Figure 27.
Figure 28.
LOAD TRANSIENT RESPONSE
SHUTDOWN CURRENT vs INPUT VOLTAGE
Trise=12us
VIN=5.5V
CE=0V
250mA
IOUT
1mA
ISTBY[uA]
200mA/div
10.00
1.00
200mV/div
0.10
VOUT
VIN=2.5V
CE=VIN
0.01
-20
0
20
40
60
80
Temperature[℃]
20µs/div
Figure 30.
Figure 29.
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Datasheet
BUXXTH5WNVX
Reference data BU2JTH5WNVX (Ta=25ºC unless otherwise specified.)
LINE REGULATION
2.88
2.87
-20℃
25℃
85℃
CE=VIN
Iout=10mA
2.86
VIN=3.85V
CE=VIN
2.900
VOUT [V]
2.85
VOUT[V]
Load Regulation
2.950
-20℃
25℃
85℃
2.84
2.83
2.850
2.82
2.800
2.81
2.80
2.750
2.79
3.3
3.8
4.3
0
4.8
VIN[V]
50
100
Figure 31.
250
300
GROUND PIN CURRENT vs INPUT VOLTAGE
20
VIN=3.85V
CE=VIN
IOUT=10uA
2.90
-20℃
25℃
85℃
CE=VIN
IOUT=0mA
15
IGND[uA]
VOUT[V]
200
Figure 32.
OUTPUT VOLTAGE vs TEMPERATURE
2.95
150
IOUT[mA]
2.85
2.80
10
5
2.75
-20
0
20
40
Temperature[℃]
60
0
80
3.9
VIN[V]
4.9
5.4
Figure 34.
Figure 33.
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Datasheet
BUXXTH5WNVX
Reference data BU2JTH5WNVX (Ta=25ºC unless otherwise specified.)
GROUND PIN CURRENT vs TEMPERATURE
20
18
16
GROUND PIN CURRENT vs LOAD
300
VIN=3.85V
CE=VIN
IOUT=0mA
VIN=3.85V
CE=VIN
Ta=25℃
200
12
IGND [uA]
IGND[uA]
14
10
8
6
100
4
2
0
-20
0
20
40
60
Temperature[℃]
0
80
0
100
200
Figure 35.
500
PSRR vs FREQUENCY
100
VIN=3.85V
CE=VIN
Ta=25℃
3.0
VIN=4.3V
CE=VIN
Ta=25℃
90
80
70
PSRR[dB]
2.5
VOUT [V]
400
Figure 36.
OCP
3.5
300
IOUT [mA]
2.0
1.5
60
50
40
30
1.0
20
0.5
10
0
0.0
0
100
200
300
400
500
600
700
800
900
100
1000 1100
1,000
100mV/div
VOUT
2.85V
CE=VIN
Ta=25℃
Iout=10mA
3.2V
VOUT
2.85V
4.2V
VIN
CE=VIN
Ta=25℃
Iout=150mA
3.2V
200us/div
200us/div
Figure 39.
Figure 40.
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1,000,000
LINE TRANSIENT RESPONSE
500mV/div
500mV/div
100mV/div
LINE TRANSIENT RESPONSE
VIN
100,000
Figure 38.
Figure 37.
4.2V
10,000
Frequency[Hz]
IOUT [mA]
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Datasheet
BUXXTH5WNVX
Reference data BU2JTH5WNVX (Ta=25ºC unless otherwise specified.)
START UP TIME
DISCHARGE TIME
1.5V
1V/div
1V/div
1.5V
CE
CE
VOUT
VIN=3.85V
Ta=25℃
Iout=0mA
Cout=1.0uF
0V
VIN=3.85V
Ta=25℃
Iout=0mA
Cout=1.0uF
VOUT
1V/div
1V/div
0V
40µs/div
20µs/div
Figure 42.
Figure 41.
LOAD TRANSIENT RESPONSE
VIN=5.5V
CE=0V
250mA
IOUT
1mA
ISTBY[uA]
200mA/div
SHUTDOWN CURRENT vs INPUT VOLTAGE
10.00
Trise=12us
1.00
200mV/div
0.10
VOUT
VIN=3.85V
CE=VIN
Ta=25℃
0.01
-20
0
20
40
60
80
Temperature[℃]
20µs/div
Figure 44.
Figure 43.
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Datasheet
BUXXTH5WNVX
Reference data BU35TH5WNVX (Ta=25ºC unless otherwise specified.)
LINE REGULATION
3.55
3.54
25℃
85℃
3.53
Load Regulation
3.600
-20℃
-20℃
25℃
85℃
CE=VIN
Iout=10mA
VIN=4.5V
CE=VIN
3.550
VOUT [V]
3.52
VOUT[V]
3.51
3.50
3.49
3.48
3.500
3.450
3.47
3.46
3.400
3.45
4.0
4.5
5.0
0
5.5
50
100
Figure 45.
250
300
GROUND PIN CURRENT vs INPUT VOLTAGE
20
VIN=4.5V
CE=VIN
IOUT=10uA
-20℃
25℃
CE=VIN
IOUT=0mA
85℃
3.55
15
IGND[uA]
VOUT[V]
200
Figure 46.
OUTPUT VOLTAGE vs TEMPERATURE
3.60
150
IOUT[mA]
VIN[V]
3.50
10
3.45
5
3.40
-20
0
20
40
Temperature[℃]
60
0
80
4.0
VIN[V]
5.0
5.5
Figure 48.
Figure 47.
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4.5
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TSZ02201-0GBG0A600020-1-2
14.Dec.2015.Rev.004
Datasheet
BUXXTH5WNVX
Reference data BU35TH5WNVX (Ta=25ºC unless otherwise specified.)
GROUND PIN CURRENT vs TEMPERATURE
20
GROUND PIN CURRENT vs LOAD
400
VIN=4.5V
CE=VIN
IOUT=0mA
18
16
300
12
IGND [uA]
IGND[uA]
14
10
8
6
200
VIN=4.5V
CE=VIN
Ta=25℃
100
4
2
0
-20
0
20
40
Temperature[℃]
60
0
80
0
100
200
Figure 49.
500
PSRR vs FREQUENCY
100
VIN=4.5V
CE=VIN
Ta=25℃
90
3.5
80
3.0
70
2.5
VIN=4.5V
CE=VIN
Ta=25℃
2.0
PSRR[dB]
VOUT[V]
400
Figure 50.
OCP
4.0
300
IOUT [mA]
1.5
60
50
40
30
1.0
20
0.5
10
0
0.0
0
100 200
300
400 500
600
700 800
100
900 1000 1100 1200
1,000
IOUT[mA]
100mV/div
VOUT
3.50V
CE=VIN
VOUT
Ta=25℃
Iout=10mA
4.0V
VOUT
3.50V
5.0V
VIN
CE=VIN
Ta=25℃
Iout=150mA
4.0V
200us/div
200us/div
Figure 53.
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
1,000,000
LINE TRANSIENT RESPONSE
500mV/div
500mV/div
100mV/div
LINE TRANSIENT RESPONSE
VIN
100,000
Figure 52.
Figure 51.
5.0V
10,000
Frequency[Hz]
Figure 54.
15/20
TSZ02201-0GBG0A600020-1-2
14.Dec.2015.Rev.004
Datasheet
BUXXTH5WNVX
Reference data BU35TH5WNVX (Ta=25ºC unless otherwise specified.)
START UP TIME
DISCHARGE TIME
1.5V
1V/div
1V/div
1.5V
CE
CE
1V/div
1V/div
0V
VIN=4.5V
Ta=25℃
Iout=0mA
Cout=1.0uF
VOUT
0V
VIN=4.5V
Ta=25℃
Iout=0mA
Cout=1.0uF
VOUT
40µs/div
20µs/div
Figure 56.
Figure 55.
LOAD TRANSIENT RESPONSE
VIN=5.5V
CE=0V
250mA
IOUT
1mA
ISTBY[uA]
200mA/div
SHUTDOWN CURRENT vs INPUT VOLTAGE
10.00
Trise=12us
1.00
200mV/div
0.10
VOUT
VIN=4.5V
CE=VIN
Ta=25℃
0.01
-20
0
20
40
60
80
Temperature[℃]
20µs/div
Figure 58.
Figure 57.
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/20
TSZ02201-0GBG0A600020-1-2
14.Dec.2015.Rev.004
Datasheet
BUXXTH5WNVX
About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as reduction in current capability. Therefore, be sure to prepare sufficient margin within power
dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
Measurement conditions
Standard ROHM Board
Evaluation Board 1
Top Layer (Top View)
Top Layer (Top View)
Bottom Layer (Top View)
Bottom Layer (Top View)
Measurement State
With board implemented (Wind speed 0 m/s)
With board implemented (Wind speed 0 m/s)
Board Material
Glass epoxy resin (Double-side board)
Glass epoxy resin (Double-side board)
Layout of Board for
Measurement
IC
Implementation
Position
Board Size
70 mm x 70 mm x 1.6 mm
40 mm x 40 mm x 1.6 mm
Top layer
Wiring
Bottom
Rate
layer
Through Hole
Metal (GND) wiring rate: Approx. 0%
Metal (GND) wiring rate: Approx. 50%
Metal (GND) wiring rate: Approx. 50%
Metal (GND) wiring rate: Approx. 50%
Diameter 0.5mm x 6 holes
Diameter 0.5mm x 25 holes
Power Dissipation
0.56W
0.39W
Thermal Resistance
θja=178.6°C/W
θja=256.4°C/W
0.6
0.56W
0.5
Pd [W]
0.4
0.39W
0.3
* Please design the margin so that
PMAX becomes is than Pd (PMAX
