Datasheet
Serial-in / Parallel-out Driver Series
4-input Serial-in / Parallel-out Drivers
BU2050F
Key Specifications
Description
Power supply voltage range:
Output voltage:
Operating temperature range:
BU2050F is a CMOS output driver. It incorporates a
built-in shift register and a latch circuit to turn on a
maximum of 8 outputs by a 4-line interface, linked to a
microcontroller.
A CMOS output provides maximum 25mA current.
Features
Package
LED can be driven directly
8 bit parallel output
SOP14
4.5V to 5.5V
0V to VDD
-40°C to +85°C
W(Typ) x D(Typ) x H(Max)
8.70mm x 6.20mm x 1.71mm
Applications
Drive of LED
Drive of Solenoid
Drive of Relay
SOP14
BU2050F
Pin Configurations
Block Diagrams
(Top View)
P3
1
14 VDD
P4
2
13 P2
CLK
P5
3
12 P1
DATA
VSS
4
11 CLR
P6
5
10 STB
P7
6
9 CLK
P8
7
8 DATA
Shift
STB
CLR
Register
Controller
8bit
Latch
Write Buffer
P1 to P8
○Product structure：Silicon monolithic integrated circuit
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Pin Descriptions
Pin No.
Pin Name
1
P3
2
P4
3
P5
4
VSS
5
P6
6
P7
7
P8
8
9
IO
O
Parallel Data Output
-
Ground
O
Parallel Data Output
DATA
I
Serial Data Input
CLK
I
Clock Signal Input
I
Strobe Signal Input
In case of “L”, the data of shift register is
outputted to P1 through P8.
In case of “H”, all parallel outputs and data of
latch circuit do not change.
I
Reset Signal Input
In case of “L”, the data of latch circuit reset,
and all parallel outputs(P1 to P8) change into
“L”.
Normally CLR=H
O
Parallel Data output
-
Power Supply
STB
10
Function
11
CLR
12
P1
13
P2
14
VDD
Absolute Maximum Ratings
Parameter
Symbol
Limits
Unit
Supply Voltage
VDD
-0.3 to +7.0
V
Input Voltage
VIN
VSS-0.3 to VDD+0.5
V
Output Voltage
VO
VSS-0.3 to VDD+0.5
V
Operating Temperature
Topr
-40 to +85
°C
Storage Temperature
Tstg
-55 to +125
°C
PD
(Note 1)
W
Power Dissipation
0.45
(Note 1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 4.5mW per 1°C above 25°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions (TA=25℃, VSS=0V)
Parameter
Symbol
Limits
Unit
Supply Voltage
VDD
+4.5 to +5.5
V
Output Voltage
VO
0 to VDD
V
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Electrical Characteristics
DC Characteristics
(unless otherwise specified, VDD=5V, VSS=0V, TA =25℃)
Parameter
Limits
Symbol
Min
Typ
Max
Unit
Condition
Input high-level voltage
VIH
0.7VDD
-
VDD
V
-
Input low-level voltage
VIL
VSS
-
0.3VDD
V
-
VHYS
-
0.5
-
V
-
VDD-1.5
-
VDD
VDD-1.0
-
VDD
VDD-0.5
-
VDD
IOH=-10mA
VSS
-
1.5
IOL=25mA
VSS
-
0.8
VSS
-
0.4
-
-
0.1
Input hysteresis
VOHD
Output high-level voltage
Output low-level voltage
VOLD
Quiescent current
IDD
IOH=-25mA
V
IOH=-15mA
V
IOL=15mA
IOL=10mA
mA
VIH=VDD, VIL=VSS
Switching Characteristics
(unless otherwise specified, VDD=5V, VSS=0V, TA =25℃)
Limits
Parameter
Symbol
Min
Typ
Max
Unit
Condition
Set up time (DATA-CLK)
tSD
20
-
-
ns
-
Hold time (DATA-CLK)
tHD
20
-
-
ns
-
Set up time (STB CLK)
tSSTB
30
-
-
ns
-
Hold time (STB CLK)
tHSTB
30
-
-
ns
Propagation delay (CLK P1 to P8)
tPDPCK
-
-
100
ns
Propagation delay (STB P1 to P8)
tPDPSTB
-
-
80
ns
Propagation delay (CLR P1 to P8)
tPDPCLR
-
-
80
ns
fMAX
5
-
-
MHz
Maximum clock frequency
P1 to P8 terminal
load 20pF or less
P1 to P8 terminal
load 20pF or less
P1 to P8 terminal
load 20pF or less
-
Waveform of Switching Characteristics
fMAX
CLK
DATA
1
8
2
9
10
11
12
tSD
tHD
STB
CLR
tHSTB
tSSTB
P8
P1
tPDPSTB
tPDPCLR
tPDPCK
Figure 1. Waveform of Switching Characteristics
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BU2050F
Test Circuits
VDD
14
13
12
11
10
9
8
PatternGenerator
VIH
1
4
3
2
6
5
VIL
VSS
7
VSS
Figure 2. Test Circuit of Input H/LVoltage
VDD
14
13
12
11
10
9
8
PatternGenerator
8
SW
1
2
4
3
5
6
1
7
IOH
VOHD
VSS
VSS
VSS
Figure 3. Test Circuit of Output H Voltage
VDD
14
13
12
11
10
9
8
PatternGenerator
8
SW
1
2
3
4
5
6
7
1
IOL
VOLD
VSS
VSS
VSS
Figure 4. Test Circuit of Output L Voltage
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BU2050F
Test Circuits - continued
VDD
+
IDD A
14
13
12
11
10
9
8
1
2
3
4
5
6
7
VSS
Figure 5. Test Circuit of Static Dissipation Current
VDD
14
13
12
11
10
9
8
PatternGenerator
VIH
1
2
3
4
5
6
7
VSS
VIL
VSS
Figure 6. Test Circuit of Switching Characteristics
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BU2050F
Timing chart
CLK
DATA
DATA8
DATA7
DATA6
DATA2
DATA1
CLR
STB
DATA
Previous DATA
P1 to P8
“L”
Figure 7. Timing chart
1.
After the power is turned on and the voltage is stabilized, STB should be activated, after clocking 8 data bits into
the DATA pin.
Parallel outputs (P1 to P8) are set to the shift register data after the eighth clock by the STB.
Since the STB is level latch, data is retained in the “L” section and renewed in the “H” section of the STB.
2.
3.
［Function Explanation］
・ A latch circuit has the reset function, which is common in all bits. In case of CLR terminal is “L”, the latch
circuit is reset non-synchronously without the other input condition, and all parallel outputs change into “L”.
・ A serial data inputted from DATA terminal is read in shift register with synchronized rising transition of clock.
In case of STB is “L” (CLR is ”H”), transmit the data which read in the shift register to latch circuit, and
outputs from the parallel data output terminal (P1 to P8). In case of STB is “H”, all parallel outputs and the
data of latch do not change.
［Truth Table］
CLK
Input
STB
CLR
×
×
L
All the data of the latch circuit are set to “L” (data of shift register does not
change), all the parallel outputs are “L”.
H
H
Serial data of DATA pin are latched to the shift register.
At this time, the data of the latch circuit does not change.
L
H
L
H
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Function
The data of the shift register are transferred to the latch circuit, and the data of
the latch circuit are outputted from the parallel output pin.
The data of the shift register shifts 1bit, and the data of the latch circuit and
parallel output also change.
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BU2050F
I/O Equivalence Circuits
P1 to P8
DATA,CLK,STB,CLR
VDD
VDD
VDD
DATA
CLK
P1 to P8
STB
CLR
VSS
VSS
VSS
VSS
Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at T A=25°C(normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal
resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θ JA (°C/W).The temperature of IC inside the package can be estimated by
this thermal resistance. Figure 8 shows the model of thermal resistance of the package. Thermal resistance θJA, ambient
temperature TA, maximum junction temperature TJmax, and power dissipation PD can be calculated by the equation below:
θJA = (TJmax - TA) / PD
(°C/W)
Derating curve in Figure 9 indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θJA. Thermal resistance θJA depends on chip size, power consumption, package, ambient temperature, package
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition.
0.8
θJA =( TJmax - TA)/ PD
(°C/W)
周囲温度
Ta [℃] TA (℃)
Ambient
temperature
Power Dissipation [W]
0.7
0.6
0.5
0.4
BU2050F(SOP14)
0.3
0.2
0.1
0.0
25
50
75
100
125
Ambient Temperature [℃]
消費電力 P [W]
Figure 9. Derating Curve
Figure 8. Thermal resistance
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0
Chip surface temperature TJmax(℃)
チップ 表面温度 Tj [℃]
Power dissipation PD (W)
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BU2050F
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input pins have voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
Ordering Information
B
U
2
0
5
Part Number
0
F
-
E2
Packaging and forming specification
E2: Embossed tape and reel
Package
F: SOP14
Marking Diagrams
SOP14(TOP VIEW)
Part Number Marking
BU2050F
LOT Number
1PIN MARK
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BU2050F
Physical Dimension, Tape and Reel Information – continued
Package Name
SOP14
(Max 9.05 (include.BURR))
(UNIT : mm)
PKG : SOP14
Drawing No. : EX113-5001
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BU2050F
Revision History
Date
Revision
Changes
08.Nov.2013
001
New Release
18.Sep.2015
002
Page.6
Truth Table : When CLR=L, modified the output=H-> L.
Page.1
Page.1
Features Deleted “This product can be operated on low voltage”.
Key Specifications Modified power supply voltage range
from”2.7V to 5.5V” to ”4.5V to 5.5V”.
Pin Descriptions Modified “Function” sentences of pin name STB and CLR.
Recommended Operating Conditions
Modified supply voltage
from”+2.7V to +5.5V” to ”+4.5V to +5.5V”.
Electrical Characteristics
Modified name from “Timing Characteristics” to
“Switching Characteristics”
Electrical Characteristics
Modified pin name of propagation delay TPDPCK
from “CLR” to “CLK”.
Timing chart
Modified pin name from ”STB” to ”STB”.
Modified description sentences.
I/O Equivalence Circuits
Modified pin name from ”CLOCK” to ”CLK”.
Power Dissipation Modified description sentences.
Page.2
Page.2
18.Apr.2016
003
Page.3
Page.3
Page.6
Page.7
Page.7
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
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extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
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[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
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Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
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A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
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2.
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3.
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Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
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© 2015 ROHM Co., Ltd. All rights reserved.
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