Capacitive Sensor Control IC Series
Capacitive Sensor Switch
Control IC
BU21008MUV
No.09048EBY01
●Note in capacitive sensor board design
Here, it explains a recommended value and recommended condition concerning the board, the overlay, and mounting when
BU21008MUV of capacitive sensor IC series and the composition by a solid board are assumed.
It is not the one to do the operation guarantee though a recommended value and recommended condition are made based
on the result of the real machine experiment by an experimental board. On the other hand, it is not the one to fix immovable
when not satisfying it either.
It treats as a reference of an initial examination, and finally, please experiment the principle by the use of a real machine, and
judge the quality of the system by the mounting experiment.
・Board
Item
Board material
Material
Numerical value
FR4(glass epoxy)
thickness =1.6mm or more
Electrode
material
Cu
Other condition
2 layer both sides structure
thickness =10um-50um
-
Electrode size
-
36mm over - finger contact
area twice or less
Electrode form
-
-
Shape doesn't influence sensitivity
Wiring width
Cu
0.2mm or less
The minimum value of the design rule
of the board is applied
Wiring length
Cu
100mm or less
-
Via size
Cu
0.4mm or less
The minimum value of the design rule
of the board is applied
1) About the size of the sensor electrode
①The area of the sensor must do Hi and become twice or more the gross area of wiring.
②Please give the twice the contact side product of the assumed finger to the upper bound of the area of the sensor as a
standard.
2
③Please give 36mm to the lower bound of the area of the sensor as a standard.
2) About the form of the sensor electrode
①The shape of the sensor doesn't have a big influence in the sensitivity of the sensor.
Given the shape of the finger-like circular and rectangular, and is appropriate.
②The design with the copyright like the registration of a design etc. exists, and note special shape, please.
3) Method of setting up sensor electrode and wiring
①The grand area arrangement around the sensor electrode and the sensor wiring is recommended.
Please arrange a grand area in the same to sensor electrode layer, and open the gap between a sensor electrode and
grand area by 1.0mm or more (To decrease a parasitic capacitance increase).
②The grand area arrangement in the back of the sensor electrode and wiring is recommended.
Please arrange a grand area to cover all opposed the sensor electrodes with another layer on the back side of the
sensor electrode. The device that suppresses a parasitic capacitance increase such as grand shape being made a
mesh is necessary following the thickness 1.6mm in the FR4 board. In that case, please consult separately.
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© 2009 ROHM Co., Ltd. All rights reserved.
1/14
2009.04 - Rev.B
Application Note
BU21008MUV
・Overlay
Item
Material
Numerical value
Other condition
Overlay material
Acrylic , glass
thickness =1.3mm or less
High dielectric constant
material
Decorative material coat
nonconductive
thickness =50um or less
The content of a metallic
material is noted
Decorative material
deposition plating
low tin and deposition of
conductive metal plating
thickness =50um or less
-
1) About the overlay material
In the resin system, the acrylic fiber is recommended. In the inorganic system, the glass is recommended. The material
with a high permittivity is recommended to be used.
2) The decorative metal-coating material on the carbon content and the volume of film and the low resistance, the sensor can
cause a loss of sensitivity. If you want to study painting, paint containing a conductive material and content of the
confirmation of whether the content of the variations (on mass) of the sample prepared please check acceptance.
3) By metal-plated decorative materials for the deposition
①It is possible to make the sensor react by depositing the material of low conductive as tin in discontinuity.
When a metallic deposition is examined, I hope a panel manufacturer and prior meeting.
②Will be decorating for the electrode surface, touch sensors at the bottom of a multi-electrode reaction at the same time a
situation occurs. Specifications for the film by evaporation the degree of impact varies, but as a fundamental measure,
the decorative film without a solid arrangement, the top surface of the sensor in the outer groove established electrical,
adjacent to the separation of electrical sensors to each other to make a film that is recommended.
・Mounting
Item
Fixed material
Material
Double-faced tape
Numerical value
Other condition
thickness =100um or less
-
1) About a fixed material
①Both sides must use the one of the composition that is the base material for the center for specification with the adhesive
especially like a no bur and the double-faced tape, etc. for the material, please use 100 um in total thickness following.
②The thickness of the air-gap when bonding is canceled by the calibration function in case of 100um or less.
It is possible to correct it even by the one by a change with the lapse of time because it is done at the time of not the
setting done to the first stage of manufacturing but each power supply turning on.
2) Sensors on board sensors fixed to the board at the top of double-sided tape at the Ministry of fixed overlay method is
recommended.
Department back on board, Board recommended conditions (FR4 material, thickness = 1.6mm or more) points if you do not
pay attention to the special. If you have a thin or thick board, FPC and stability of shape if not, back to the structural changes in
fixed to reduce the parasitic capacitance to charity is required.
●OK NG example of wiring pattern
Other signal line
Ground line
Sensor line
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© 2009 ROHM Co., Ltd. All rights reserved.
2/14
2009.04 - Rev.B
Application Note
BU21008MUV
●SREF electrode
1) In case SREF (reference electrode) has a same area as sensor electrode.
In case SREF electrode is placed on a surface of sensor electrode, it has to be placed with a certain distance from the
noise source and the finger contact influence. When it is placed on the back side of the sensor electrode surface, same
caution must be taken.
Most recommended configuration is to place it into middle layer which are covered by ground area (both front and back
side surface).
2) In case capacitor is used.
When a capacitor is used as a SREF (reference electrode), please place capacitor in the LSI component side as close as
possible.
The selection of the capacitance value has to be determined by experiment/tuning. In a commonly used PCB material (no
middle connection components such as connectors), under 1 to 10pF is recommended. In conversion theory, because the
capacity value near the DC is expected and there is a calibration of the offset cancellation circuit, the capacitor accuracy
as well as the temperature characteristics can be satisfied with standard capacitor products.
●Calibration
There are 16 sensor ports in BU21008MUV able to use. In the BU21008MUV, Only even ports can calibrate difference of the
capacitance between the two sensors to correct. The odd ports will use a result of the even ports that executed calibration.
An ideal value of the 8bitADC that the calibration was executed is near to 128.
After calibration, the ADC value that first sense is an offset correction data and is kept in register OFFSET (4*h). An offset
value will be the difference between the offset correction data and center value 128.
The offset value will keep the ADC value center value 128 when the sensor was not touched.
Offset value = Offset correction data (4*h) - 128
If the offset correction data is less than 128, it is meaning SREF > SIN. (Gain x1)
If the offset correction data is more than 128, it is meaning SREF < SIN. (Gain x1)
As for the channel not corrected, the error margin of the offset correction value grows compared with the corrected channel.
Because correction value obtained with other channels is misappropriated.
Without exceeding the threshold value of turning on not moving at all can happen when this error margin is large.
1) The channel that doesn't do the calibration must be nearer IC than the channel that does the calibration.
2) SREF setting
The offset value of SIN1, 3, 5, 7, 9, 11, 13, 15(register address 40h – 4Fh) < 128
Adjust the highest one in SIN1 and SIN3, 5, 7, … SIN15 approach 128
Before calibration C vs. Digitized
Saturated
Ideal
Smaller sensor (- offset)
Bigger sensor (+ offset)
Actual out of bigger sensor
Plus offset
Minus offset
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3/14
2009.04 - Rev.B
Application Note
BU21008MUV
Reference sensor (SREF) should be adjusted which is
balanced to the farthest sensor (SIN1, this example)
SREF
SIN0
BU21008MUV
SIN1
SIN2
SIN3
Red
Blue
Blue
Pair
Red
Pair
Blue: Calibrated channel
Red: Non-calibrated channel
Non-calibrated channel should be nearer to IC than calibrated channel
Example)
The switch application of 6ch
Use the channel that does the calibration by priority. (SIN0, SIN2, SIN4, SIN6)
SIN1, SIN3 wiring: SIN0 > SIN1, SIN2 > SIN3
SIN6
SIN4
SIN3
SREF
SIN2
SIN1
SIN0
Equal length
VDD
SIN5
LED
R
Not link mode
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© 2009 ROHM Co., Ltd. All rights reserved.
4/14
2009.04 - Rev.B
Application Note
BU21008MUV
●Appication circuit
The following figure illustrated the application circuit of BU21008MUV.
3.0V
1.8V
Cdcup
47uF Tantalum capacitor etc...
Resisting Voltage 16V over
AVDD
CIN
0.1uF Ceramic capacitor
X5RorX7R over, 1608 over
Resisting Voltage16V over
DVDD
BU21008MUV
1)IC electrostatic times to pull the power to make the layout upstream AVDD please.
2)Control the branching paths after entering the terminal layout to please the most recent.
3)Recommended circuit, the real validation, please always done.
BU21008MUV Digital pins
There are several I/F settings of the BU21008. The following illustrated to define the digital pins.
1)TSTD(17) : Tide to “L”. Prefer to pull down.2)TSTA(13) : Open. Prefer to allocate a ground area around this pin.
3)MODE0(15)/MODE1(16): H or L. prefer to make the pins changeable.
4)RXD(22) : Tide to “L” .In I2C mode, it does not use.
5)CS(23) : Tide to “H/L”. In I2C mode, it is able to select the slave address. prefer to make the pins changeable.
6)CLK_EXT(18): External system clock input. When the controller uses internal clock, must tide it to “H/L”.
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5/14
2009.04 - Rev.B
Application Note
BU21008MUV
●Application circuit example
AVDD
3.0V
0.1uF
・・・
3.0V
47uF
0.1uF
LED Output
47uF
AVDD
DVDD
SREF
Sensor Input
SIN15
・・・
・・・
SIN3
Sensor I/F
Data
Calibration
ADC
CV Convertor
SIN1
SIN14
・・・
SIN2
SIN0
CS
SCL
Sequence control
I2C
Data register
SDA/TXD
3.0V
RXD
Shutdown Input
External Clock Input
host I/F
Reset
generation
SDN
Power
on
Reset
CLK_EXT
Power
managment
Clock
generation
CR
Oscil
lator
AVSS
INT
INT Output
MODE1
MODE0
TSTA
DVSS
DVSS
External clock mode
AVDD
3.0V
0.1uF
・・・
3.0V
47uF
0.1uF
LED Output
47uF
AVDD
DVDD
SREF
Sensor Input
SIN15
・・・
・・・
SIN3
Sensor I/F
Data
Calibration
ADC
CV Convertor
SIN1
SIN14
・・・
SIN2
SIN0
CS
SCL
Sequence control
I2C
Data register
SDA/TXD
RXD
SDN
Shutdown Input
CLK_EXT
host I/F
Reset
generation
Power
on
Reset
Power
managment
Clock
generation
CR
Oscil
lator
AVSS
INT
INT Output
MODE1
MODE0
DVSS
DVSS
TSTA
Internal clock mode
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© 2009 ROHM Co., Ltd. All rights reserved.
6/14
2009.04 - Rev.B
Application Note
BU21008MUV
●Power Supply
BU21008MUV have 2 kinds of power supply pins: DVDD and AVDD.
DVDD is the power supply pins used for digital block. AVDD is the power supply pins used for analog block.
It is recommended to design PCB with separate analog power supply and digital power supply without common impedance.
Moreover, it is recommended to have a countermeasure against noise and ripple at power supply. The bypass capacitor
between power supply and ground is essential. A careful study of decoupling capacitor and the line filter on actual PCB.
(Please refer to the application circuit diagram example for recommended values).
Regarding power supply start-up sequence, it is essential to apply power to DVDD first and then to AVDD or to apply
simultaneously power to DVDD and AVDD. If the power is applied to AVDD before DVDD, the initialization may not be guaranteed.
When the power has been supplied, the SND signal must be set like following timing.
DVDD
DVDD×0.9
DVDD×0.9
AVDD
AVDD×0.9
AVDD×0.9
DVDD
DVDD×0.1
DVDD
DVDD×0.1
DVDD×0.8
AVDD
0sec more than
DVDD×0.2
SDN
0sec more than
20usec more than
50usec more than
100usec more than
100usec more than
100us supply voltage in more than a start-up, please stand up. During the internal reset
circuit is the initialization of the IC.
For start-up power supply
DVDD, AVDD confirmed the timing of these signals at the launch, please SDN.
For standing down power
After standing down signal SDN, at the timing of the above DVDD, AVDD started to please lower.
●About IC placement
IC will be placed in the environment, humidity and temperature changes locally as a dynamic place for Please avoid easy.
Condensation sensors to the terminal, the sensor accuracy may be malfunctioning.
●PCB layout
The electrostatic sensor IC, PCB parasitic on the capacity to be vulnerable to the effects of, IC package itself also due to
parasitic capacity and can not be ignored completely. In order to minimize the impact on small QFN package is adopted.
In addition, the package parasite-induced changes in capacity to hold it back a bit to rand adopted a package.
The effect is difficult to present quantitative, the back of the rand dropped to the PCB in order to GND is recommended.
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7/14
2009.04 - Rev.B
Application Note
BU21008MUV
●Operating Sequence
The following figure illustrated the operating sequence. There are two modes able to use.
When use the power management mode, the Host side can monitor INT signal to stop an operation of register read/write.
POWER ON
Initial Setting
Power
Management
using ?
Power Management
Mode
INT="L"
Repeat Block
Regiser Read
BTN: 0x32h, 33h
Gesture:
0x60h,0x61h,0x62h
etc..
Regiser Read
BTN: 0x32h, 33h
Gesture:
0x60h,0x61h,0x62h
etc..
Wait
Wait
Operating sequence flow chart
●Initial Setting
The following figure illustrated an initial setting. According as the following flow to set. At the end of setting, to write
configuration done “H” and then the detection will start to sense.
START
4
Software Reset
5
Senser port Setting
6
LED/PWM Setting
7
Power management
Setting
8
Gain/Noise Setting
9
Threshold Setting
10
Gesture Setting
11
Config Done
END
Initial setting flow chart
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8/14
2009.04 - Rev.B
Application Note
BU21008MUV
●Sensor Port Setting
To write register F0/F1 can enable/disable the Sensor Port. (H: enable, L: disable)
There is calibration (*) function on alternate ports of BU21008MUV. So the calibration port and no calibration port need pair
to use. For example, SIN0 of the BU21008MUV can execute calibration, SIN1 can not and need to use a result of the SIN0
executed calibration. So disable the SIN0 and enable the SIN1 that is can’t permit. But opposite way is can permit.
The ports are able to execute calibration and the other ports that pair of the calibration ports.
Port
Calibration
SIN0
○
SIN1
×
use a result of the SIN0 executed calibration
SIN2
○
SIN3
×
use a result of the SIN2 executed calibration
SIN4
○
SIN5
×
use a result of the SIN4 executed calibration
SIN6
○
SIN7
×
use a result of the SIN6 executed calibration
SIN8
○
SIN9
×
use a result of the SIN8 executed calibration
SIN10
○
SIN11
×
use a result of the SIN10 executed calibration
SIN12
○
SIN13
×
use a result of the SIN12 executed calibration
SIN14
○
SIN15
×
use a result of the SIN14 executed calibration
○:The port calibration
×:Not calibration port
Each pair of ports needs to make the same size of electrode and the same length of wiring
Example)SIN0-7, SIN8,SIN10,SIN12,SIN14 を ON, SIN9,SIN11,SIN13,SIN15 を OFF
//LED port Setting
Write ( F0h, FFh )
Write ( F1h, 55h )
●LED/PWM Setting
・Function description
Enables LED LINK function, LEDs will turn ON/OFF when the sensor is sensing inputs or not.
PWM function can control LEDs brightness with ratio of pulse width. And the function can add Fade in/Fade out impression
when LEDs turned ON/OFF.
BU21008MUV
LED PORT
8
LED LINK
○
PWM (Fade in/Fade out)
○
・LED Setting flow
Even the LED ports are enabled when the sensor ports were enabled, the LED function will be unavailable.
If using LED function, the sensor ports need to be disabled.
START
LED port Setting
LED link Setting
BU21008MUV
?
PWM Setting
END
LED/PWM setting flow chart
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9/14
2009.04 - Rev.B
Application Note
BU21008MUV
Example) In case of the BU21008MUV, odd ports for LED controlling and even ports for sensing.
SIN1,SIN3,SIN5,SIN7 add the Fade in/Fade out impression when LEDs turned ON/OFF.
//LED port Setting
Write ( F0h, 55h )
Write ( F2h, 55h )
//PWM
Write ( E0h, 1Fh )
Write ( E1h, 02h )
●Power Management Setting
・Power management state transition. There are five states “normal”, “idle”, “calibration”, “configuration” and “initial calibration”.
Idle
: In this state, the sampling cycle will be 1/8 and power consumption can be decreased.
Normal
: Normal operating state.
Calibration
: In this state, controller detects the capacitance difference between reference capacitor
(SREF) and sensor (SIN*) to execute the offset correction automatically
Configuration
:In this state, the initial setting does not be executed.
Initial calibration
:The function of the state is the same with the Calibration but different form state transition.
START
Power ON
Configuration
config done
initial
calibration
calibration finish
normal
(INT="L")
capacitive don't
detect
calibration
capacitive detect
calibration finish
idle
(INT="H")
Power management state transition
・Power management flow chart as shown. With monitoring the INT pin can know the sensor that is detecting capacitance or
not. When the sensor did not detect any capacitance, the HOST side is not necessary to read register. So the HOST side
can stop accessing.In the “idle” state, the INT pin was “L” . So it also can detect the state when it return to “normal”.
POWER ON
Initial Setting
INT="L"
Regiser Read
BTN: 0x32, 33
Gesture: 0x60,0x61,0x62
etc..
Wait
Power management flow chart
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10/14
2009.04 - Rev.B
Application Note
BU21008MUV
・It can know the state of the controller with the INT pin.
“L” : Normal operating state. The controller is normal to sense.
“H” : ”idle” state.
A condition of INT pin when the “normal” state translate to the “idle” state, as shown in Fig. When the Sensor does not
sense any capacitance, it will be the “idle” state with passing of BxN[sec] and the INT pin will be ”H”.
content
BU21008MUV
A
Sampling cycle
system clock x 213
B
Time for idle
system clock x 219
N
Setting Value of FAh Register
SIN*
CLOCK
INT
BxN
A x 16
normal
A x 16
idle (1/16)
INT pin condition 1 (normal → idle)
A condition of INT pin when the “idle” state translate to the “normal” state, as shown in Fig. When the Sensor sense the
capacitance, it will be the “normal” state with passing of Ax16x2[sec] . (1MHz :about 262msec)
SIN*
CLOCK
INT
~ A x 16
A x 16
idle (1/16)
normal
INT pin condition 2(idle → normal)
Example) The power save mode will not translate to the normal mode even the SIN8-15 are being touched.
For the final touch with passing of 8 sec, It will translate to the power save mode.
//Power management Setting
Write ( F3h, FFh )
Write ( F4h, 00h )
Write ( FAh, 1Fh )
●Gain/Noise Setting
・Gain
The Gain can adjust to x1~ x92.
GAIN[2:0]
000
001
010
011
100
101
110
111
Adjustment value
x1
x 4.22
x 8.4
x 16.5
x 23
x 46
x 69
x92
Example) GAIN x8.4, disable Filter
//Gain Setting
Write ( FBh, 40h )
・Noise
For a countermeasure against noise, there are two kinds of the functions that are Noise Filter and Chattering Canceller.
The Noise Filter can limit the fluctuation (Δ) of the ADC output. It can cause noise to decrease.
The Chattering Canceller is a digital filter that can detect a sequence of sensing ON states to decrease noise.
Analog value and XY processing of the BU21009MUV are only applied to the Noise Filter.
ADC
output
Noise
Chattering
Register
Filter
Cancel
32h, 33h
8bit
the circuit of noise
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11/14
2009.04 - Rev.B
Application Note
BU21008MUV
The Noise Filter limits the fluctuation (Δ) of the ADC output to decrease noise. For example, the ADC output is like
① of the Fig to set the fluctuation of every sampling cycle Δ. Then the following will be worsened like
② of the Fig. So it can decrease noise.
ADC
OUT
?
?
?
Time
1 sampling cycle
Noise Filter
The Chattering Canceller sampling setting.
Setting Value
0h
1h
2h
3h
Cancel Freq*1 [Hz]
-
4h
5h
6h
61.0 30.5 20.3 15.3 12.2 10.2
7h
8h
9h
Ah
Bh
Ch
Dh
Eh
Fh
8.7
7.6
6.8
6.1
5.5
5.1
4.7
4.4
4.1
*1) If the internal frequency of 1MHz
SIN*
A
A*2
01h
A*3
02h
03h
Chattering Canceller
Example) Set the Noise Filter Δ 2 and the Chattering Cancel sampling 3//Noise Filter
Write ( FBh, 12h )
// Chattering Cancel
Write ( F6h, 03h )
●Gesture
The Gesture Function is used with combination of 4 sensor ports. That can detect direction, duration and speed when a
finger is pressing. This function only can be used by BU21008MUV.
Only the 4 sensor ports that are SIN0, SIN2, SIN4 and SIN6 have the Gesture Function to use. And they can not change to
the other sensor ports.
Dir: Right
Vel: ****
SIN0
SIN2
SIN4
SIN6
Gesture Image
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© 2009 ROHM Co., Ltd. All rights reserved.
12/14
2009.04 - Rev.B
Application Note
BU21008MUV
For example detects the direction of the Gesture Function, as shown in Fig. At first read register of GES_DIR(62h). Next if
a value of register GES_DIR is 01h or 02h, that is meaning the direction has been detected out. The value of the register
GES_DIR will be kept until register GES_CLR(E2h) is written 80h to clear.
START
Setting
Read ( 62h, 01h )
or
Read ( 62h, 02h )
Read ( 60h, ** )
Read ( 61h, ** )
Write ( E2h, 80h )
Gesture Flow
There are two modes that are the All detection mode and the Verbose mode to detect the gesture.
All detection mode: Requires all sensors to be present in the sequence before the gesture is recognized.
Verbose mode: Allows one or more of the keys to be missed in the sequence.
Mode
Value
Direction (GES_DIR)
Detected
DIR_A
1)SIN0→SIN2→SIN4→SIN6
All detection
0
DIR_B
1)SIN6→SIN4→SIN2→SIN0
1)SIN0→SIN2→SIN4
2)SIN0→SIN2→
SIN6
DIR_A
3)
SIN2→SIN4→SIN6
4)SIN0→
SIN4
5)
SIN2→
SIN6
Verbose
1
1)SIN6→SIN4→SIN2
2)SIN6→SIN4→
SIN0
DIR_B
3)
SIN4→SIN2→SIN0
4)SIN6→
SIN2
5)
SIN4→
SIN0
Example) Set the value of the Gesture Mode 1 and Gesture maximum judgment time 1.9 sec.
//Gesture
Write ( E3h, 1Fh )
Write ( E4h, 00h )
Write ( E5h, FFh )
●Config Done
The register DONE (EFh) should be written 01h when all register have set up. And the controller will start to work. If any
setting have to be changed when the controller is working, the register DONE (EFh) should be written 00h. After setting up
write it 01h again.
//Config done
Write ( EFh, 01h )
●Setting examples
Write ( EDh, 01h )
Write ( F0h, FFh )
Write ( F1h, FFh )
Write ( F6h, 20h )
Write ( FBh, 71h )
Write ( FCh, 30h )
Write ( FDh, 03h )
Write ( EFh, 01h )
//Software Reset
//Sensor Port Setting
//Sensor Port Setting
// Chattering Cancel 2
//GAIN*16 Noise FilterΔ1
//OFF -> ON Threshold
//ON -> OFF Threshold
//Done
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© 2009 ROHM Co., Ltd. All rights reserved.
13/14
2009.04 - Rev.B
Application Note
BU21008MUV
●Ordering part number
B
U
2
Part No
1
0
0
8
M
Part No
U
V
-
Package
MUV : VQFN032V5050
E
2
Packaging and forming specification
E2:Embossed tape and reel
VQFN032V5050
5.0 ± 0.1
5.0±0.1
1.0MAX
3.4±0.1
0.4 ± 0.1
1
8
9
32
16
25
24
0.75
0.5
2500pcs
E2
The direction is the 1pin of product is at the upper left when you hold
)
(0.22)
( reel on the left hand and you pull out the tape on the right hand
3.4 ± 0.1
+0.03
0.02 -0.02
S
C0.2
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.08 S
Tape
17
+0.05
0.25 -0.04
1pin
Reel
(Unit : mm)
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© 2009 ROHM Co., Ltd. All rights reserved.
14/14
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.04 - Rev.B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2009 ROHM Co., Ltd. All rights reserved.
R0039A