BU21018MWV

1/4 Structure Product Name Silicon Monolithic IC Capacitive Sensor Controller for Cellular Phone Product No BU21018MWV Features 1) High- resistive sensor material 2) High Speed Sensing 3) 3.0 V singe power supply 4) 36ch sensors 5) 2ch reference (1ch only use is possible) 6) Automatic program download function for internal CPU ●Absolute maximum ratings PARAMETER Digital applied voltage Analog applied voltage Digital input voltage Analog input voltage Storage temperature range Power dissipation SYMBOL DVDD AVDD Vdi Vai Tstg Pd RATING -0.5 ～ 2.5 -0.5 ～ 4.5 -0.5 ～ DVDD -0.5 ～ AVDD -55 ～ 125 928*1 UNIT V V V V ℃ mW (*1) This is the power dissipation per IC unit. Reduce to 9.28 mW /℃ when Ta = 25℃ or above. ●Operating conditions PARAMETER Digital power supply Analog power supply Operating temperature rage SYMBOL DVDD AVDD Topr RATING 1.60 ～ 2.00 2.70 ～ 3.60 -20 ～ 85 UNIT V V ℃ This chip is not designed to protect itself against radioactive rays. REV. C 2/4 ●Electrical characteristics PARAMETER Digital Low level input voltage Digital High level input voltage Digital Low level output voltage Analog Low level output voltage Analog High level output voltage OSC Frequency Digital standby current Analog standby current Digital operating current Analog operation current SYMBOL RATING MIN -0.4 0.7*DVDD LDO-0.4 21.0 0 0 24.0 3 1 TYP MAX 0.25*DVDD DVDD+0.5 VSS+0.4 VSS+0.45 LDO+0.5 27.0 10 10 5.5 1.5 UNIT CONDITION VIL1 VIH1 VOL1 VOL2 VOH2 Freq Ist1 Ist2 Idd1 Idd2 V V V V V MHz uA uA mA mA IOL=2.0[mA] IOL=1.0[mA] IOH=-0.5[mA] *Ta = 25℃ as long as it doesn't specify it. ●Block diagram Data Memory 2kB Program Memory 16kB SIN00 11 Noise Filter CPU CPU Core SIN01 SIN02 SIN03 12 13 CV Transfer Controller 20 Calibration Controller Register 7 EDA EEPROM I2C SIN33 50 8 ECL OSC SIN34 51 4 SDA I2C RESET (POR) Clock Controller 5 SCL SIN35 52 6 ADR_SEL 10 1 RESET EXT_CLK REV. C 3/4 ●External measure and View ●Pin description NAME PIN 1 2 3 4 5 6 EXTCLK INT NC SDA SCL ADR_SEL DISCRIPTION External clock input Interrupt I2C:SDA I2C:SCL I2C: Address select “L” (1011100)2 “H” (1011101)2 Automatic program download of EEPROM (SDA) Automatic program download of EEPROM (SCL) Interface select (Low fix) Digital power Connect to LDO pin. Sensor Sensor Sensor LDO output*1 Ground Analog power Reset “L” Reset “H” Release Reference sensor Reference sensor Sensor Sensor Sensor Sensor Sensor Test (Low fix) Test (Low fix) Test (Low fix) Test (Low fix) BU21018 Lot No. 7 EDA 8 ECL 9 10 11 12 13 14 15 16 17 IFSEL DVDD SIN00 SIN01 SIN02 LDO VSS AVDD RESET Package：UQFN056V7070 18 19 20 21 22~50 51 52 53 54 55 56 SREF0 SREF1 SIN03 SIN04 SIN05~SIN33 SIN34 SIN35 TEST0 TEST1 TEST2 TEST3 *1 Please do not connect devices other than BU21018MWV. REV. C 4/4 ●Cautions on use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC's power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Rush current The IC with some power supplies has a capable of rush current due to procedure and delay at power-on. Pay attention to the capacitance of the coupling condensers and the wiring pattern width and routing of the power supply and the GND lines. (13) Others In case of use this LSI, please peruse some other detail documents, we called, Technical note, Functional description, Application note. REV. C Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). 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