Datasheet
4-wire Resistive
Touch Screen Controller
BU21027MUV
General Description
Key Specifications
BU21027MUV supports 2 points coordinate at the 4-wire
resistive touch screen.
Introduction of 2 points touch detection becomes easy
by automatic adjustment function.
Features
Support 4-wire resistive touch screen.
Support 2 points touch detection.
Automatic adjustment of parameters for 2 points touch
detection.
2-wire serial bus interface.
Single power supply.
Auto power down.(power down = sleep)
Built-in clock oscillator circuit.
Power supply voltage:
Operating Temperature Range:
Standby current:
Sleep current:
Operating current:
Coordinate resolution:
Package
2.7V to 3.6V
-20°C to +85°C
1µA(Max)
70µA(Typ)
8mA(Typ)
12bit
W(Typ) x D(Typ) x H(Max)
4.00mm x 4.00mm x 1.00mm
VQFN020V4040
Applications
Equipment with built-in user interface for 4-wire
resistive touch screen.
Information equipment like education tablet and touch
monitor.
Office equipment like printer and copying machine.
Typical Application Circuit
2.2kΩ
AVDD
2.2kΩ
1.0μF
VDD30
DVDD
1.0μF
1.0μF
VDDA
VDDP
0.1μF
VDD30
SCL
4-wire
resistive
touch
screen
SDA
Option(*1)
XP
Host
(GPIO port）
RSTB
Y+
INT
YP
Option(*2)
AD0
X-
BU21027MUV
X+
XN
Option(*4)
TEST
VDD30
2.2kΩ
YN
2.2kΩ
Y-
ECL
Option(*3)
AUX
EEPROM
(16kbyte)
DVSS
AVSS
PVSS
EDA
VDD30 : external power supply.
Option(*1) For Noise protection. (Constants of RC-filter choose by evaluation)
Option(*2) 7bit I2C slave address select. (AD0=L : Slave address = 0x5C, AD0 = H : Slave address = 0x5D)
Option(*3) For ESD protection. (Zener diode / TVS diode)
Option(*4) If don’t use EEPROM for firmware download, please connect ECL and EDA to DVSS.
〇Product structure : Silicon monolithic integrated circuit
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications........................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 3
Pin Description................................................................................................................................................................................ 3
I/O Equivalent Circuit ...................................................................................................................................................................... 4
Block Diagram ................................................................................................................................................................................ 5
Description of Blocks ...................................................................................................................................................................... 5
Absolute Maximum Ratings ............................................................................................................................................................ 7
Thermal Resistance ........................................................................................................................................................................ 7
Recommended Operating Conditions ............................................................................................................................................. 7
Electrical Characteristics................................................................................................................................................................. 8
2-wire Serial Bus Interface AC Timing ............................................................................................................................................ 8
2-wire Serial Bus Interface AC Timing Characteristics .................................................................................................................... 8
2-wire Serial Bus Interface Communication Protocol ...................................................................................................................... 9
EEPROM Interface AC Timing ...................................................................................................................................................... 10
EEPROM Interface AC Timing Characteristics ............................................................................................................................. 10
EEPROM Communication Protocol .............................................................................................................................................. 11
Power Supply and Reset Timing Specification .............................................................................................................................. 12
Operational Notes ......................................................................................................................................................................... 13
Ordering Information ..................................................................................................................................................................... 15
Marking Diagram .......................................................................................................................................................................... 15
Physical Dimension and Packing Information ............................................................................................................................... 16
Revision History ............................................................................................................................................................................ 17
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Pin Configuration
PVSS
AUX
SDA
SCL
INT
15
14
13
12
11
(TOP VIEW)
YN
16
10
RSTB
XN
17
9
AD0
YP
18
8
TEST
XP
19
7
EDA
VDDP
20
6
ECL
3
4
AVSS
DVDD
5
2
AVDD
DVSS
1
VDDA
EPAD
Pin Description
Pin
No.
1
Pin
Name
VDDA
2
AVDD
I/O
I/O Equivalent
Circuit
-
Function
(Note 1)
-
Power supply.
O
Regulator output for analog circuit.
3
AVSS
-
Ground for analog circuit.
4
DVDD
O
Regulator output for digital circuit.
5
DVSS
-
Ground for digital circuit.
(Note 2)
Figure 4
-
(Note 3)
Figure 4
-
6
ECL
O
Serial clock for EEPROM.
7
EDA
I/O
Serial data for EEPROM.
8
TEST
I
(Note 4)
Figure 3
(Note 4)
Figure 3
Test control.
Figure 5
2
9
AD0
I
7bit I C slave address select.(H=0x5D, L=0x5C)
Figure 1
10
RSTB
I
Reset.
Figure 1
11
INT
O
Interrupt output.
12
SCL
I
Serial clock for HOST interface.
13
Figure 2
(Note 4)
Figure 3
(Note 4)
SDA
I/O
Serial data for HOST interface.
Figure 3
14
AUX
I/O
Auxiliary channel input.
15
PVSS
-
16
YN
I/O
Touch screen interface.
Figure 4
17
XN
I/O
Touch screen interface.
Figure 4
18
YP
I/O
Touch screen interface.
Figure 4
19
XP
I/O
Touch screen interface.
20
VDDP
-
Power supply for touch screen interface.
-
EPAD
-
Please connect to AVSS.
Figure 4
Ground for touch screen interface.
-
Figure 4
(Note 1)
-
(Note 1) Please short VDDA and VDDP, and connect bypass capacitor to AVSS. (Please check Typical Application Circuit of page 1.)
(Note 2) Bypass AVDD to AVSS with 1.0µF capacitor and do not connect to external power supply.
(Note 3) Bypass DVDD to DVSS with 1.0µF capacitor and do not connect to external power supply.
(Note 4) ECL, EDA, SCL and SDA need a pull-up resistor 2.2kΩ or more. If don’t use EEPROM for firmware download, please connect ECL and EDA to DVSS.
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I/O Equivalent Circuit
PAD
PAD
Figure 1
Figure 2
PAD
PAD
Figure 4
Figure 3
PAD
Figure 5
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BU21027MUV
Block Diagram
VDDP
VDDA
LDO1
AVDD
DVDD
RSTB
OSC
LDO2
POR
LDO3
SCL
HOST
I/F
Touch Screen I/F
Register
Touch
Detector
XP
SDA
AD0
INT
XN
Touch
Screen
Driver
YP
SAR
ADC
ADC
I/F
CPU
RAM
SRAM
4096
x32bit
SRAM
512
x32bit
YN
AUX
2 point
Parameter
Generator
PVSS
TEST
EEPROM I/F
AVSS
DVSS
ECL
EDA
Description of Blocks
1.
Touch Screen I/F
(1) Touch Detector
Check touch condition and report a touch to CPU.
(2) Touch Screen Driver
Analog switch for touch screen control.
(3) 2 points Parameter Generator
Generate parameters for 2 points detection from touch condition.
2.
SAR ADC
12bit A/D converter.
3.
ADC I/F
SAR ADC controller.
4.
LDO1
Regulator for Touch Screen I/F.
5.
LDO2
Regulator for SAR ADC.
6.
LDO3
Regulator for digital circuit.
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Description of Blocks - continued
7.
CPU
Control of sensing sequence and calculate coordinate.
8.
HOST I/F
2
HOST interface. BU21027MUV works as I C slave device.
9.
Register
Coordinate and RAW data are stored.
10. RAM
(1) SRAM 4096x32bit
Program memory for CPU.
(2) SRAM 512x32bit
Work memory for CPU.
11. EEPROM I/F
16kBytes EEPROM interface for firmware download.
12. POR
Power on reset.
13. OSC
Clock oscillator.
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BU21027MUV
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
Power Supply Voltage1 (VDDA)
VDDA
-0.3 to +4.5
V
Power Supply Voltage2 (VDDP)
VDDP
-0.3 to +4.5
V
Digital Input Voltage
VIN1
-0.3 to VDDA +0.3
V
AUX Input Voltage
VIN2
-0.3 to 2.1
V
Touch Screen Interface Input Voltage
Maximum Junction Temperature
Storage Temperature Range
VIN3
-0.3 to 2.1
V
Tjmax
125
°C
Tstg
-50 to +125
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance
(Note 5)
Parameter
Symbol
Thermal Resistance (Typ)
1s
(Note 7)
(Note 8)
2s2p
Unit
VQFN020V4040
Junction to Ambient
Junction to Top Characterization Parameter
(Note 6)
θJA
153.9
37.4
°C/W
ΨJT
13
7
°C/W
(Note 5) Based on JESD51-2A(Still-Air).
(Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 7) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 8) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
4 Layers
(Note 9)
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
Thermal Via
Pitch
Diameter
1.20mm
Φ0.30mm
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
(Note 9) This thermal via connects with the copper pattern of all layers.
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Power Supply Voltage1 (VDDA)
VDDA
2.7
3.0
3.6
V
VDDA=VDDP
Power Supply Voltage2 (VDDP)
VDDP
2.7
3.0
3.6
V
VDDA=VDDP
Operating Temperature
Topr
-20
+25
+85
°C
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BU21027MUV
Electrical Characteristics
(Unless otherwise specified VDDA=VDDP=3.0V, DVSS=AVSS=PVSS=0.00V, Tj=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
Low-level Input Voltage
VIL
- 0.3
-
VDDA * 0.2
V
High-level Input Voltage
VIH
Low-level Output Voltage
VOL
High-level Output Voltage
VOH
Conditions
V
AD0, SDA, SCL, RSTB, ECL,
EDA, TEST
AD0, SDA, SCL, RSTB, ECL,
EDA,TEST
SDA, ECL, EDA, INT (IL=3mA)
-
V
INT (IL=3mA)
Standby Current
IST
VDDA
* 0.8
VDDA
- 0.4
-
-
1
µA
RSTB=L
Sleep Current
ISLP
-
70
100
µA
Operating Current
IACT
3.5
8
12.5
mA
Sleep = Power down
No load (Not include 4-wire
resistive touch screen current)
Sensing sequence is running
+3
LSB
Resolution
AD
Differential Non-Linearity Error
DNL
-
VDDA +
0.3
0.4
-
-
12
-3
V
bit
-
Integrate Non-Linearity Error
I NL
-5
-
+5
LSB
Switch On-resistance
RON
0.5
5.0
10.0
Ω
XP, XN, YP, YN
2-wire Serial Bus Interface AC Timing
tHD_STA
tSU_DAT
tHD_DAT
tSU_STA
tHD_STA
tSU_STO
tBUF
SDA
tLOW
tHIGH
SCL
START
CONDITION
REPEATED
START
CONDITION
STOP
CONDITION
START
CONDITION
2-wire Serial Bus Interface AC Timing Characteristics
(Unless otherwise specified VDDA=VDDP=3.00V, DVSS=AVSS=PVSS=0.00V, Tj=25°C )
Parameter
Symbol
Min
Typ
Max
Unit
fSCL
-
-
400
kHz
tHD_STA
0.6
-
-
µs
SCL L Width
tLOW
1.3
-
-
µs
SCL H Width
REPEATED START CONDITION
Setup Time
Data Hold Time
tHIGH
0.6
-
-
µs
tSU_STA
0.6
-
-
µs
tHD_DAT
0
-
-
µs
Data Setup Time
tSU_DAT
0.1
-
-
µs
STOP CONDITION Setup Time
tSU_STO
0.6
-
-
µs
tBUF
1.3
-
-
µs
SCL Clock Frequency
START CONDITION Hold Time
Bus Free Time
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Conditions
Between STOP CONDITION
to START CONDITION
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04.Jul.2017 Rev.001
BU21027MUV
2-wire Serial Bus Interface Communication Protocol
2
2
2-wire serial bus interface of BU21027MUV supports I C bus. HOST controls BU21027MUV as I C slave device.
2
I C slave address of BU21027MUV is 0x5C or 0x5D and selected by AD0.
Register write protocol
START
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
1
0
1
1
1
0
AD0
0
0
REG
A7
REG
A6
REG
A5
REG
A4
REG
A3
REG
A2
REG
A1
REG
A0
18
SCL
SDA
R/WB ACK
from
BU21027
MUV
SLAVE ADDR
0
ACK
from
BU21027
MUV
REGISTER ADDRESS
END
19
20
21
22
23
24
25
26
27
WD7
WD6
WD5
WD4
WD3
WD2
WD1
WD0
0
ACK
from
BU21027
MUV
WRITE DATA
If HOST wants to change more registers, repeat this steps.(Note 10)
Register read protocol
START
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
1
0
1
1
1
0
AD0
0
0
REG
A7
REG
A6
REG
A5
REG
A4
REG
A3
REG
A2
REG
A1
REG
A0
18
SCL
SDA
R/WB ACK
from
BU21027
MUV
SLAVE ADDR
RESTART
0
ACK
from
BU21027
MUV
REGISTER ADDRESS
END
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
1
0
1
1
1
0
AD0
1
0
RD7
RD6
RD5
RD4
RD3
RD2
RD1
RD0
SLAVE ADDR
R/WB ACK
from
BU21027
MUV
18
1
NACK
from
HOST
READ DATA
If HOST wants to get more data, send ACK and repeat this steps.(Note 10)
(Note 10) If register address is less than 0x5F, register address is incremented automatically at the timing of ACK.
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BU21027MUV
EEPROM Interface AC Timing
tHD_STA
tSU_DAT
tHD_DAT / tODLY
tSU_STA
tHD_STA
tSU_STO
tBUF
EDA
tLOW
tHIGH
ECL
START
CONDITION
REPEATED
START
CONDITION
STOP
CONDITION
START
CONDITION
EEPROM Interface AC Timing Characteristics
(Unless otherwise specified VDDA=VDDP=3.00V, DVSS=AVSS=PVSS=0.00V, Tj=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
fECL
270
310
350
kHz
tHD_STA
0.7
-
0.9
µs
ECL L Width
tLOW
1.4
-
1.8
µs
ECL H Width
REPEATED START CONDITION
Setup Time
Output Data Delay Time
tHIGH
1.4
-
1.8
µs
tSU_STA
0.6
-
1.0
µs
tODLY
-
-
1.0
µs
Data Hold Time
tHD_DAT
0.0
-
-
µs
Input from EEPROM
Data Setup Time
tSU_DAT
0.1
-
-
µs
Input from EEPROM
STOP CONDITION Setup Time
tSU_STO
0.6
-
1.0
µs
tBUF
3.0
-
3.4
µs
ECL Clock Frequency
START CONDITION Hold Time
Bus Free Time
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Conditions
Between STOP CONDITION
to START CONDITION
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04.Jul.2017 Rev.001
BU21027MUV
EEPROM Communication Protocol
BU21027MUV supports only read for firmware download.
DUMMY
START
1
2
3
16
START
1
2
9
1
2
3
4
5
6
7
8
9
1
0
1
0
0
0
0
0
0
R/WB
ACK
from
EEPROM
EDA
～
～
～
～
～
～
～
～
ECL
1
1
SLAVE ADDRESS of EEPROM(Note 12)
DUMMY ACCESS(Note 11)
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
ACK
from
EEPROM
WORD ADDRESS = 0x00
ACK
from
EEPROM
WORD ADDRESS = 0x00
RESTART
END
2
3
4
5
6
7
8
9
1
0
1
0
0
0
0
1
0
R/WB
ACK
from
EEPROM
10
11
12
13
14
N
～
～
～
～
1
～
～
1
SLAVE ADDRESS of EEPROM(Note 12)
RECEIVE DATA from EEPROM
16kBytes
NACK
from
BU21027
MUV
(Note 11) Dummy access for free serial bus.
(Note 12) This is selectable by using BU21027MUV register and initial value = 0x50.
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BU21027MUV
Power Supply and Reset Timing Specification
A power supply sequence and timing AC characters of BU21027MUV are below.
～
～
BU21027MUV start wake-up of digital power supply after RSTB input goes to “H”.
Because wake-up sequence needs 1ms, HOST access is enabled after 1ms at RSTB goes to H.
tWAIT2
tRISE
RSTB
0V
VDDA*0.8
tWAIT1
VDDA*0.2
tPON
HOST
access
0V
～
～
0V
enable
0V
～
～
VDD30
(VDDA and VDDP)
disable
disable
Power Supply AC Timing Characteristics
Parameter
Symbol
Min
Typ
Max
Unit
VDD30 Rise Time
tRISE
1
-
10
ms
RSTB Wait Time1
tWAIT1
1
-
-
ms
RSTB Wait Time2
tWAIT2
0
-
-
ms
Wake-up Time
tPON
1
-
-
ms
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Conditions
VDDA and VDDP
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04.Jul.2017 Rev.001
BU21027MUV
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
11. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input pins have voltages within the values specified in the electrical characteristics of this IC.
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
13/17
TSZ02201-0L5L0FF00910-1-2
04.Jul.2017 Rev.001
BU21027MUV
Operational Notes – continued
13.
Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all
within the Area of Safe Operation (ASO).
14.
Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
14/17
TSZ02201-0L5L0FF00910-1-2
04.Jul.2017 Rev.001
BU21027MUV
Ordering Information
B
U
2
1
0
2
Part Number
7
M
U
V
Package
MUV: VQFN020V4040
-
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
VQFN020V4040 (TOP VIEW)
Part Number Marking
BU210
LOT Number
27MUV
Pin 1 Mark
Part Number Marking
BU21027MUV
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© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Package
Orderable Part Number
VQFN020V4040
BU21027MUV-E2
15/17
TSZ02201-0L5L0FF00910-1-2
04.Jul.2017 Rev.001
BU21027MUV
Physical Dimension and Packing Information
Package Name
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© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
VQFN020V4040
16/17
TSZ02201-0L5L0FF00910-1-2
04.Jul.2017 Rev.001
BU21027MUV
Revision History
Date
Revision
04.Jul.2017
001
Changes
New Release
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© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
17/17
TSZ02201-0L5L0FF00910-1-2
04.Jul.2017 Rev.001
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
