Datasheet
System Lens Drivers
µ-step System Lens Driver
for Digital Still Cameras
BU24035GW
General Description
Key Specifications
Digital Power Supply Voltage:
2.7 V to 3.6 V
Driver Power Supply Voltage:
2.7 V to 5.5 V
Input/Output Current (1ch to 4ch,6ch):
500 mA(Max)
Input/Output Current (5ch):
600 mA(Max)
Clock Operating Frequency:
1 MHz to 28 MHz
ON-Resistance (1ch to 4ch):
1.5 Ω(Typ)
ON-Resistance (5ch,6ch):
1.0 Ω(Typ)
Operating Temperature Range: -20 °C to +85 °C
BU24035GW is a system Lens Driver which is capable of
µ-step driving and possible to configure a high precision
and low noise lens driver system. This device performs
µ-step driving control internally and can reduce a load of
CPU. This device also has drivers for DC motor and
voice coil motor, and is utilizable for multifunctional lens.
Features
Built-in 6 Channel Drivers
1ch to 4ch: Voltage Control Type H-Bridge
(for 2 STM Systems)
5ch: Voltage /Current Control Type H-Bridge
6ch: Current Control Type H-Bridge
Built-in 2 Channel PI Driver Circuits
Built-in 1 Channel Waveform Shaping Circuits
Built-in FLL Digital Servo Circuit
Built-in PLL Circuit
Built-in STM Control Circuit: Autonomous Control
(cache, Acceleration/deceleration Mode), Clock IN
Control
Package
W(Typ) x D(Typ) x H(Max)
3.10 mm x 3.10 mm x 0.85 mm
UCSP75M3(40 pin)
Applications
Digital Still Camera
Typical Application Circuit
VDDAMP
Photo Interrupter
MVCC12
MVCC34
DVDD
SI
SO
PIOUT2
PIOUT1
DVDD
VDDAMP
MVCC12
MVCC34
DVSS
MGND56
VDDAMP
MGND12
MGND34
RNF5
OUT1A
OUT5A
OUT5B
5ch
Driver
1ch
Driver
Logic
VDDAMP
OUT1B
M
OUT2A
2ch
Driver
RNF6
OUT3A
OUT6A
STATE22
IN
SDATA
STATE11
STATE21
STATE12
3ch
Driver
TEST
6ch
Driver
FCLK
CSB
SCLK
OUT6B
OUT2B
OUT3B
M
OUT4A
4ch
Driver
OUT4B
Main Host
〇Product structure : Silicon monolithic integrated circuit
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© 2012 ROHM Co., Ltd. All rights reserved.
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〇This product has no designed protection against radioactive rays
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Contents
General Description ................................................................................................................................................................ 1
Features ................................................................................................................................................................................. 1
Applications ............................................................................................................................................................................ 1
Key Specifications................................................................................................................................................................... 1
Package ................................................................................................................................................................................. 1
Typical Application Circuit ........................................................................................................................................................ 1
Contents ................................................................................................................................................................................. 2
Pin Configuration .................................................................................................................................................................... 3
Pin Description........................................................................................................................................................................ 4
Block Diagram ........................................................................................................................................................................ 5
Description of Blocks............................................................................................................................................................... 6
Absolute Maximum Ratings ..................................................................................................................................................... 9
Recommended Operating Conditions ...................................................................................................................................... 9
Electrical Characteristics ....................................................................................................................................................... 10
Typical Performance Curves .................................................................................................................................................. 11
Timing Chart ......................................................................................................................................................................... 14
Serial interface ...................................................................................................................................................................... 15
Register Map ........................................................................................................................................................................ 15
Application Example.............................................................................................................................................................. 16
I/O Equivalence Circuit .......................................................................................................................................................... 17
Operational Notes ................................................................................................................................................................. 19
Ordering Information ............................................................................................................................................................. 21
Marking Diagram................................................................................................................................................................... 21
Physical Dimension Packing Information................................................................................................................................ 22
Revision History .................................................................................................................................................................... 23
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Pin Configuration
(Top view)
A
TEST
MVCC12
OUT1B
OUT2A
MGND12
OUT2B
RNF5
B
OUT1A
PIOUT1
DVSS
DVDD
SI
RNF5
OUT5A
C
PIOUT2
PIOUT2
VDDAMP
OUT5B
D
SO
IN
SCLK
MGND56
E
STATE22
STATE12
STATE11
OUT6A
F
STATE21
MGND34
FCLK
SDATA
CSB
RNF6
OUT6B
G
MGND34
OUT4B
OUT4A
MVCC34
OUT3A
OUT3B
RNF6
1
2
3
4
5
6
7
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Pin Description
A1
Pin
Name
TEST
Power
Supply
DVDD
TEST logic input
1ch, 2ch driver
power supply
D6
Pin
Name
SCLK
D7
MGND56
-
MVCC12
1ch driver B output
E1
STATE22
DVDD
OUT2A
MVCC12
2ch driver A output
E2
STATE12
DVDD
A5
MGND12
-
E6
STATE11
DVDD
A6
OUT2B
MVCC12
E7
OUT6A
RNF6
RNF5
-
1ch, 2ch driver
ground
2ch driver B output
5ch driver
power supply
F1
STATE21
DVDD
B1
OUT1A
MVCC12
1ch driver A output
F2(Note 1)
MGND34
-
B2
PIOUT1
DVDD
PI driver output 1
F3
FCLK
DVDD
SCLK logic input
5ch,6ch driver
ground
STATE22
logic output
STATE12
logic output
STATE11
logic input/output
6ch driver A output
STATE21
logic input/output
3ch, 4ch driver
ground
FCLK logic input
A2
MVCC12
-
A3
OUT1B
A4
B3
DVSS
-
Ground
F4
SDATA
DVDD
SDATA logic input
B4
DVDD
-
Digital power supply
Waveform shaping
input
5ch driver
power supply
F5
CSB
DVDD
RNF6
-
CSB logic input
6ch driver
power supply
OUT6B
RNF6
Pin No.
(Note 1)
A7
B5
SI
DVDD
B6(Note 1)
RNF5
-
Function
Pin No.
(Note 1)
F6
F7
Power
Supply
DVDD
Function
6ch driver B output
B7
OUT5A
RNF5
5ch driver A output
C1
PIOUT2
VDDAMP
PI driving output 2
G2
OUT4B
3ch, 4ch driver
ground
MVCC34 4ch driver B output
C2
PIOUT2
VDDAMP
G3
OUT4A
MVCC34 4ch driver A output
C6
VDDAMP
-
G4
MVCC34
C7
OUT5B
RNF5
G5
OUT3A
MVCC34 3ch driver A output
D1
SO
DVDD
G6
OUT3B
D2
IN
DVDD
PI driving output 2
5ch, 6ch
driver control
power supply
5ch driver B output
Waveform shaping
output
IN logic input
G7(Note 1)
RNF6
MVCC34 3ch driver B output
6ch driver
power supply
(Note 1)
G1
MGND34
-
-
3ch, 4ch driver
power supply
(Note 1) It is not possible to use corner pin only. (Corner pins are A7, G1, and G7.)
Short each pin between A7-B6, F2-G1, F6-G7, and use it at the same time
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DVDD
DVDD
DVDD
DVDD
POR
TSD
SI
SO
PIOUT１
PIOUT２
Block Diagram
DVDD
VDDAMP
MVCC12
MVCC12
PREDRIVER
OUT1A
OUT1B
DVSS
MGND12
Speed control
Logic
Analog Feed-Back
VDDAMP
MVCC12
RNF5
MVCC12
DVDD
OUT2A
OUT2B
PREDRIVER
DAC5
+
-
RNF5
OUT5A
OUT5B
PREDRIVER
MGND12
Analog Feed-Back
MGND56
Logic
RNF6
MVCC34
MVCC34
PREDRIVER
OUT3A
OUT3B
VDDAMP
DVDD
+
-
OUT6A
OUT6B
MGND34
DAC6
Analog Feed-Back
MVCC34
MVCC34
MGND56
OUT4A
OUT4B
PREDRIVER
MGND34
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STATE12
STATE22
STATE11
STATE21
SDATA
CSB
SCLK
FCLK
IN
TEST
Analog Feed-Back
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Description of Blocks
Stepping Motor Driver (1ch to 4ch Driver)
Built-in PWM type stepping motor drivers.
Maximum 2 stepping motors can be driven independently.
Built-in D-class type voltage feedback circuit.
3ch/4ch drivers can also drive DC motor or voice coil motor individually.
(1) Control
Both Clock IN and Autonomous control are possible.
(a)Clock IN Control
Set the registers for the stepping motor control.
Stepping motor rotates in synchronization with clock input to the STATE pin.
Mode of stepping motor control is selectable from μ-step, 1-2 phase excitation and 2 phase excitation. And
the number of edge for electrical angle cycle is selectable from 4, 8, 32, 64, 128, 256, 512 or 1024.
ON/OFF
Direction
CSB
SCLK
3 SDATA
Torque
SIF
Host
（Speed・amount）
STM
Control
Logic
SIN wave
Generation
Logic
PWM
Generation
Logic
H.B.
STM
H.B.
STATEx1
(b)Autonomous Control
Stepping motor rotates by setting the registers to drive the stepping motor.
Mode of stepping motor control is selectable from μ-step (1024 portion), 1-2 phase excitation and
2 phase excitation.
ON/OFF
Direction
Host
Speed
CSB
Torque
SCLK
amount 3
SDATA
MO
BUSY
SIF
STATEx1
STM
Control
Logic
SIN wave
Generation
Logic
PWM
Generation
Logic
H.B.
STM
H.B.
STATEx2
Cache Mode
Built-in Cache register enables to set next operation commands during motor operation, and continuous operation is
possible. It is possible to output from STATE pin the status information which is selectable from operation command
status(ACT), cache register status(BUSY), motor rotation position(MO) or excitation status(MO&EN) in synchronization
with motor operation.
Acceleration/deceleration Mode
Acceleration, constant and deceleration operation can be processed in a batch by setting rotation commands together
before motor operation.
It is possible to output from STATE pin the status information which is selectable from operation command status(ACT),
cache register status(BUSY), motor rotation position(MO) or excitation status(MO&EN) in synchronization with motor
operation.
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Description of Blocks – continued
Voltage / Current Driver (5ch Driver)
Built-in selectable PWM type voltage driver / constant current driver.
Built-in digital FLL speed control logic for voltage driver.
(1) Control
(a)Register Control
■Voltage Driver (speed control = OFF)
PWM driving by setting the registers for PWM duty ratio, direction and ON/OFF.
CSB
PWMduty
Host
SCLK
Direction
SDATA
3
ON/OFF
SIF
PWM
Generation
Logic
M
H.B.
■Voltage Driver (speed control = ON)
Speed control driving by setting the registers for target speed value, PI filter value, direction and ON/OFF. Motor speed
is detected from photo-interrupter signal and rotation speed is adjusted by comparing the target speed with the motor
speed.
Target speed
PI filter
Direction
ON/OFF 3
CSB
SCLK
SDATA
SIF
Host
DCM
Speed Control
Logic
PWM
Generation
Logic
DCM
H.B.
PI Dr
PI
Comp
■Current Driver
Constant current driving by setting the registers for output current value, direction and ON/OFF.
Current value
Direction
ON/OFF
CSB
SCLK
3 SDATA
Host
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SIF
Control
Logic
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Current control
DAC
C.C.
VCM
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Description of Blocks – continued
(b)External Pin Control
■Voltage Driver (speed control = OFF)
PWM driving by setting the registers for PWM duty ratio and direction, and the IN pin for ON/OFF. (This is not applicable
when speed control is ON.)
CSB
SCLK
PWMduty
SDATA
3
Direction
SIF
Host
IN
ON/OFF
PWM
Generation
Logic
M
H.B.
■Current Driver
Constant current driving by setting the registers for output current value and direction, and the IN pin for ON/OFF.
CSB
SCLK
Current value
Direction
3 SDATA
SIF
Host
IN
ON/OFF
Current control
Control
Logic
DAC
C.C.
VCM
Current Driver (6ch Driver)
Built-in constant current driver.
A voltage of the RNF pin and an external resistor (RRNF) value determine output current value. An internal high-precision
amplifier (CMOS gate input) controls constant current. If any resistance component exists in wirings for the RNF pin and
the external resistor (RRNF), that might reduce accuracy and pay attention about wiring.
(1) Control
(a)Register Control
Constant current driving by setting the registers for output current value, direction and ON/OFF.
Current value
ON/OFF
CSB
SCLK
Direction
3 SDATA
SIF
Host
Control
Logic
Current control
DAC
C.C.
VCM
(b)External Pin Control
Constant current driving by setting the registers for output current value and direction, and the IN pin for ON/OFF.
CSB
Current value
Direction
SCLK
3 SDATA
SIF
Host
ON/OFF
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IN
Control
Logic
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Current control
DAC
C.C.
VCM
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03.Oct.2018 Rev.003
BU24035GW
Absolute Maximum Ratings (Ta=25 °C)
Parameter
Supply Voltage
Input Voltage
Input / Output Current (Note 2)
Maximum Junction Temperature
Storage Temperature Range
Power Dissipation
(Note 3)
Symbol
Rating
Unit
DVDD
-0.3 to +4.5
V
MVCC
-0.3 to +7.0
V
VIN
-0.3 to supply voltage+0.3
V
500
mA
600
mA
MVCC12, MVCC34,
RNF6
RNF5
50
mA
PIOUT1
150
mA
PIOUT2
Tjmax
125
°C
Tstg
-55 to +125
°C
Pd
1.05
W
IIN
Remark
MVCC12, MVCC34,
VDDAMP
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 2): Must not exceed Pd.
(Note 3): When use at Ta=25 °C or more, derate 10.5 mW per 1 °C
(At mounting 50 mm x 58 mm x 1.75 mm glass epoxy board.)
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Digital Power Supply Voltage
DVDD
2.7
3.0
3.6
V
Driver Power Supply Voltage
MVCC
2.7
5.0
5.5
V
Clock Operating Frequency
fFCLK
1
-
28
MHz
Operating Temperature
Topr
-20
+25
+85
°C
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Remark
DVDD ≤ MVCC
MVCC12, MVCC34,
RNF5, RNF6,
VDDAMP
Reference clock
TSZ02201-0M2M0BC12080-1-2
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BU24035GW
Electrical Characteristics
(Unless otherwise specified Ta=25 °C, DVDD=3.0 V, MVCC=5.0 V, DVSS=MGND=0.0 V)
Parameter
Symbol
Min
Typ
Max
Unit
ISSD
-
20
50
µA
ISSM
-
0
10
µA
IDDD
-
6
10
mA
Conditions
Quiescent Current
Operational Current
DVDD power supply
CMD_RS=0
MVCC power supply
CMD_RS=0
DVDD power supply
CMD_RS=STB=CLK_EN=1
fFCLK=24 MHz
CLK_DIV setting: 0h
No load
Low-Level Input Voltage
VIL
DVSS
-
0.3 x DVDD
V
High-Level Input Voltage
VIH
0.7 x DVDD
-
DVDD
V
Low-Level Input Current
IIL
0
-
10
µA
VIL=DVSS
High-Level Input Current
IIH
0
-
10
µA
VIH=DVDD
Low-Level Output Voltage
VOL
DVSS
-
0.2 x DVDD
V
IOL=1.0 mA
High-Level Output Voltage
VOH
0.8 x DVDD
-
DVDD
V
IOH=1.0 mA
VPIO
-
0.15
0.5
V
IIH=30 mA
VTH
1.4
1.5
1.6
V
VTH setting: 20h
RON
-
1.5
2.0
Ω
-10
0
+10
µA
IO=±100 mA
(sum of high and low sides)
Output Hiz setting
-5
-
+5
%
VDIFF setting: 2Bh
IO=±100 mA
(sum of high and low sides)
Output Hiz setting
In current driver mode
DAC setting: 82h
RRNF=1 Ω
Output Voltage
Detection Voltage
ON-Resistance
OFF-Leak Current
IOZ
Accuracy of Average
Voltage between Output
VDIFF
Pins
ON-Resistance
RON
-
1.0
1.5
Ω
OFF-Leak Current
IOZ
-10
0
+10
µA
Output Current
IO
190
200
210
mA
ON-Resistance
RON
-
1.0
1.5
Ω
OFF-Leak Current
IOZ
-10
0
+10
µA
Output Current
IO
190
200
210
mA
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IO=±100 mA
(sum of high and low sides)
Output Hiz setting
DAC setting: 80h
RRNF=1 Ω
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BU24035GW
Typical Performance Curves
(Unless otherwise specified, Ta=25 °C, DVDD=3.0 V, MVCC=5.0 V, DVSS=MGND=0.0 V)
100
Quiescent Current (DVDD) : ISSD [µA]
Quiescent Current (DVDD) : ISSD [µA]
100
80
60
40
20
60
40
20
0
0
2.0
2.5
3.0
DVDD [V]
3.5
-50
4.0
Figure 1. Quiescent Current (DVDD) vs DVDD
-25
0
25
50
Temperature [°C]
75
100
Figure 2. Quiescent Current (DVDD) vs Temperature
10
10
Quiescent Current (MVCC) : ISSM [µA]
Quiescent Current (MVCC) : ISSM [µA]
80
8
6
4
2
8
6
4
2
0
0
2.0
3.0
4.0
MVCC [V]
5.0
-50
6.0
Figure 3. Quiescent Current (MVCC) vs MVCC
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TSZ22111 • 15 • 001
-25
0
25
50
Temperature [°C]
75
100
Figure 4. Quiescent Current (MVCC) vs Temperature
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Typical Performance Curves – continued
5
5
4
4
ON-Resistance : R ON [Ω]
ON-Resistance : R ON [Ω]
(Unless otherwise specified, Ta=25 °C, DVDD=3.0 V, MVCC=5.0 V, DVSS=MGND=0.0 V)
IO=±100 mA
3
2
1
IO=±100 mA
3
2
1
0
0
2.0
3.0
4.0
MVCC [V]
5.0
-50
6.0
Figure 5. ON-Resistance vs MVCC
(Voltage Driver Block)
0
25
50
Temperature [°C]
75
100
Figure 6. ON-Resistance vs Temperature
(Voltage Driver Block)
5
5
4
4
ON-Resistance : R ON [Ω]
ON-Rresistance : R ON [Ω]
-25
IO=±100 mA
3
2
1
IO=±100 mA
3
2
1
0
0
2.0
3.0
4.0
MVCC [V]
5.0
-50
6.0
Figure 7. ON-Resistance vs MVCC
(Current Driver Block)
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-25
0
25
50
Temperature [°C]
75
100
Figure 8. ON-Resistance vs Temperature
(Current Driver Block)
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Typical Performance Curves – continued
(Unless otherwise specified, Ta=25 °C, DVDD=3.0 V, MVCC=5.0 V, DVSS=MGND=0.0 V)
400
4
Output Current : IO [mA]
Average Voltage between Output Pins [V]
5
3
2
300
200
100
1
0
0
0
32
64
Code Setting
96
0
128
Figure 9. Average Voltage between Output Pins vs Code
Setting
(Voltage Driver Block)
32
64
96 128 160 192 224 256
Code Setting
Figure 10. Output Current vs Code Setting
(Current Driver Block, RRNF=1.0 Ω, RL=5.0 Ω)
Output Voltage : VPIO [V]
0.20
0.15
0.10
IIH=30 mA
0.05
0.00
2.0
2.5
3.0
DVDD [V]
3.5
4.0
Figure 11. Output Voltage vs DVDD
(PI Driver Circuit)
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Timing Chart
(Unless otherwise specified, Ta=25 °C, DVDD=3.0 V)
Parameter
Symbol
Design Value
SCLK Input Cycle
tSCLK
100 ns or more
SCLK L-level Input Time
tSCLKL
50 ns or more
SCLK H-level Input Time
tSCLKH
50 ns or more
SDATA Setup Time
tSSDATA
50 ns or more
SDATA Hold Time
tHSDATA
50 ns or more
CSB H-level Input Time
tCSBH
380 ns or more
CSB Setup Time
tSCSB
50 ns or more
CSB Hold Time
tHCSB
50 ns or more
FCLK Input Cycle
tFCLK
36 ns or more
FCLK L-level Input Time
tFCLKL
18 ns or more
FCLK H-level Input Time
tFCLKH
18 ns or more
0.7 x DVDD
0.3 x DVDD
CSB
tSCLK
tHCSB
tSCLKH
tSCSB
tSCLKL
tCSBH
tHCSB
tSCSB
0.7 x DVDD
0.3 x DVDD
SCLK(Note 4,5)
tSSDATA
tHSDATA
0.7 x DVDD
0.3 x DVDD
SDATA
tFCLKL
tFCLK
tFCLKH
0.7 x DVDD
0.3 x DVDD
FCLK(Note4,5)
(Note 4) FCLK is asynchronous with SCLK.
(Note 5) The duty of FCLK and SCLK is arbitrary after observing the above table.
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Serial interface
Control command is 16-bit serial input (MSB first) and is sent via the CSB, the SCLK, and the SDATA pins.
Higher 4 bits specify addresses and lower 12 bits specify data. Data of each bit is sent via the SDATA pin and taken at a
rising edge of SCLK. The Data taken during CSB ‘L’ period is valid and is written in register at a rising edge of CSB.
CSB
SCLK
x
SDATA
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
x
3
2
Data
Address
Register Map(Note 6,7,8)
Address[3:0]
Data[11:0]
15
14
13
12
11
0
0
0
0
A_Mode[1:0]
0
0
0
1
10
9
8
7
6
5
A_SEL[2:0]
0
0
0
0
0
0
1
0
0
1
0
0
0
0
0
0
1
1
0
A_BEXC
0
0
1
1
1
4
1
0
0
0
A_different_output_voltage[6:0]
A_Cycle[5:0]
A_Cycle[13:6]
0
0
0
0
A_Start_POS[3:0]
A_BSL A_AEXC
A_POS[1:0]
0
0
A_UPDW
0
A_ASL
A_PS
A_Stop
0
0
_Stop
0
0
1
0
0
1
0
0
0
0
1
1
0
1
1
0
1
0
1
1
1
1
0
0
1
1
1
1
0
1
1
0
A_EN
A_RT
A_Pulse[9:0]/A_UPDW_Cycle[9:0]
B_Mode[1:0]
B_SEL[2:0]
B_different_output_voltage [6:0]
0
0
0
0
B_Cycle[5:0]
0
0
1
0
0
1
0
0
0
0
0
0
1
1
0
B_BEXC
0
0
1
0
0
0
0
0
1
0
1
3_State_CTL[1:0]
3_PWM_Duty[6:0]
1
1
0
4_State_CTL[1:0]
4_PWM_Duty[6:0]
1
1
1
0
B_EN
B_RT
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
1
0
0
1
1
0
0
1
1
1
0
1
0
0
0
0
0
0
0
0
0
0
1
0
0
0
1
0
0
0
0
0
1
1
0
0
0
1
0
0
0
1
0
1
0
0
0
1
0
1
1
0
0
1
1
0
0
0
0
B_Cycle[13:6]
0
0
0
B_Start_POS[3:0]
B_BSL B_AEXC
3_CHOP[1:0]
B_POS[1:0]
0
0
0
0
0
B_ASL
4_CHOP[1:0]
B_UPDW
_Stop
B_PS
B_Stop
B_CTL
A_CTL
B_Pulse[9:0]/B_UPDW_Cycle[9:0]
B_ANSEL A_ANSEL
Chopping[1:0]
Edge
0
0
0
0
0
0
0
0
0
CacheM
0
0
0
0
0
0
0
DET_SEL
0
SPEN[1:0]
0
0
5_Mode CLK_EN
EXT_CTL[1:0]
CLK_DIV[3:0]
PI_CTL2 PI_CTL1
0
0
TARSP[7:0]
PSP[2:0]
0
0
0
0
ISP[2:0]
SPC_Limit[3:0]
5_IOUT[7:0]
5_PWM_Duty[6:0]
5_CHOP[1:0]
0
0
0
0
0
5_State_CTL[1:0]
6_State_CTL[2:0]
6_IOUT[7:0]
Waveform_Vthh[5:0]
Waveform_Vthl[5:0]
0
STB
0
0
STM_RS CMD_RS
Other than the above
Setting Prohibited
(Note 6) The notations A and B in the register map correspond to Ach and Bch respectively. Ach is defined as 1ch and 2ch driver output, Bch as 3ch and 4ch
driver output.
(Note 7) After power on reset, the initial settings are stored in all registers.
(Note 8) Regarding Mode, different_output_voltage, Cycle, EN, and RT registers, the data written right before the access to the Pulse register is valid and
determined at a rising edge of CSB after the access to the Pulse register.
(The Mode, different_output_voltage, Cycle, EN, RT, and Pulse registers have Cache registers. Any registers other than them do not have Cache
registers.)
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
15/23
TSZ02201-0M2M0BC12080-1-2
03.Oct.2018 Rev.003
BU24035GW
Application Example
1ch / 2ch
μ-STEP
3ch / 4ch
μ-STEP
STM
STM
Auto Focus
Zoom
1ch / 2ch
μ-STEP
STM
Auto Focus
1ch / 2ch
μ-STEP
5ch
PWM
6ch
C.C.
VCM
VCM
Iris
3ch / 4ch
μ-STEP
STM
Iris
Shutter
5ch
PWM
+FLL
6ch
C.C.
PI
Driver
(2ch)
DCM
VCM
LED
Zoom
3ch
PWM
+FLL
4ch
PWM
5ch
C.C.
Shutter
6ch
C.C.
STM
DCM
M
VCM
VCM
Auto Focus
Zoom
etc.
Iris
Shutter
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
16/23
A/F LED
TSZ02201-0M2M0BC12080-1-2
03.Oct.2018 Rev.003
BU24035GW
I/O Equivalence Circuit
Pin
FCLK
CSB
SCLK
SDATA
IN
STATE11
STATE21
Equivalent Circuit Diagram
DVDD
DVDD
Pin
SI
DVDD
STATE12
STATE22
SO
DVDD
Equivalent Circuit Diagram
DVDD
DVDD
DVDD
DVDD
PIOUT1
PIOUT2
DVDD
OUT1A
OUT1B
OUT2A
OUT2B
OUT5A
OUT5B
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
MVCC12
RNF5
VDDAMP
OUT3A
OUT3B
OUT4A
OUT4B
OUT6A
OUT6B
17/23
MVCC34
RNF6
TSZ02201-0M2M0BC12080-1-2
03.Oct.2018 Rev.003
BU24035GW
I/O Equivalence Circuit – continued
Pin
TEST(Note 9)
Equivalent Circuit Diagram
DVDD
DVDD
(Note 9) Short the TEST pin to DVSS.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
18/23
TSZ02201-0M2M0BC12080-1-2
03.Oct.2018 Rev.003
BU24035GW
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
19/23
TSZ02201-0M2M0BC12080-1-2
03.Oct.2018 Rev.003
BU24035GW
Operational Notes – continued
10. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin
lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Disturbance Light
In a device where a portion of silicon is exposed to light such as in a WL-CSP and chip products, IC characteristics
may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that
will prevent the chip from being exposed to light.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
20/23
TSZ02201-0M2M0BC12080-1-2
03.Oct.2018 Rev.003
BU24035GW
Ordering Information
B
U
2
4
0
3
5
G
W
-
Package
GW: UCSP75M3
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
TOP VIEW
UCSP75M3 (BU24035GW)
Pin 1 Mark
Part Number Marking
U2 4 03 5
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
LOT Number
21/23
TSZ02201-0M2M0BC12080-1-2
03.Oct.2018 Rev.003
BU24035GW
Physical Dimension Packing Information
Package Name
UCSP75M3(BU24035GW)
< Tape and Reel Information >
Tape
Embossed carrier tape
Quantity
Direction of
feed
2500 pcs
E2
The direction is the pin 1 of product is at the upper left when you
hold reel on the left hand and you pull out the tape on the right
hand
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
22/23
TSZ02201-0M2M0BC12080-1-2
03.Oct.2018 Rev.003
BU24035GW
Revision History
Date
Revision
26.Sep.2012
18.Apr.2013
001
002
03.Oct.2018
003
Changes
New Release
Update some English words, sentences, descriptions, grammar and format.
In the “Typical Application Circuit”, names of connected power supply are added.
In the “Pin Configuration”, the figure changes from bottom view to top view.
In the “Typical Performance Curves”, Figure 12 is removed.
Format is updated.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
23/23
TSZ02201-0M2M0BC12080-1-2
03.Oct.2018 Rev.003
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
