Datasheet
System Lens Drivers
µ-step System Lens Driver
for Digital Still Cameras
BU24038GW
General Description
Key Specifications
Digital Power Supply Voltage:
Driver Power Supply Voltage:
Input/Output Current (1ch to 9ch):
BU24038GW is a system Lens Driver which is capable of
µ-step driving and possible to configure a high precision
and low noise lens driver system. This device performs
µ-step driving control internally and can reduce a load of
CPU. This device also has drivers for DC motor and
voice coil motor, and is utilizable for multifunctional lens.
Features
Built-in 9 Channel Drivers
1ch to 8ch: Voltage Control Type H-Bridge
(for 3 STM Systems)
9ch: Current Control Type H-Bridge
Built-in 3 Channel PI Driver Circuits
Built-in 4 Channel Waveform Shaping Circuits
Built-in PLL Circuit
2.7 V to 3.6 V
2.7 V to 5.5 V
500 mA (Max)
Clock Operating Frequency:
1 MHz to 28 MHz
ON-Resistance (1ch to 8ch):
1.5 Ω (Typ)
ON-Resistance (9ch):
1.0 Ω (Typ)
Operating Temperature Range: -20 °C to +85 °C
Package
UCSP75M3 (56 pin)
W (Typ) x D (Typ) x H (Max)
3.80 mm x 3.80 mm x 0.85 mm
Applications
Digital Still Camera
Typical Application Circuit
Photo Interrupter
DVDD
PIOUT3
SO1
SI1
SO2
SI2
SO3
SI3
SO4
SI4
PIOUT1
PIOUT2
DVDD
VDDAMP
MVCC12
MVCC34
VDDAMP
MVCC567
MVCC12
MVCC8
MVCC34
MVCC567
MVCC8
DVSS
MGND9
OUT5A
M
OUT5B
MGND12
5ch
Driver
MGND34
MGND567
MGND8
OUT1A
OUT6A
OUT6B/7B 6ch/7ch
Driver
OUT7A
VDDAMP
Logic
8ch
Driver
2ch
Driver
OUT2B
M
OUT3A
RNF9
3ch
Driver
9ch
Driver
TEST
IN1
IN2
FCLK
RESETB
CSB
SCLK
SDATA
SOUT
STATE1
STATE2
STATE3
OUT9A
OUT9B
OUT1B
OUT2A
OUT8A
OUT8B
1ch
Driver
OUT3B
M
OUT4A
4ch
Driver
OUT4B
Main Host
〇Product structure : Silicon integrated circuit
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〇This product has no designed protection against radioactive rays
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Contents
General Description ................................................................................................................................................................ 1
Features ................................................................................................................................................................................. 1
Applications ............................................................................................................................................................................ 1
Key Specifications................................................................................................................................................................... 1
Package ................................................................................................................................................................................. 1
Typical Application Circuit ........................................................................................................................................................ 1
Contents ................................................................................................................................................................................. 2
Pin Configuration .................................................................................................................................................................... 3
Pin Description........................................................................................................................................................................ 4
Block Diagram ........................................................................................................................................................................ 5
Description of Blocks............................................................................................................................................................... 6
Absolute Maximum Ratings ..................................................................................................................................................... 9
Recommended Operating Conditions ...................................................................................................................................... 9
Electrical Characteristics ....................................................................................................................................................... 10
Typical Performance Curves .................................................................................................................................................. 11
Timing Chart ......................................................................................................................................................................... 14
Serial interface ...................................................................................................................................................................... 15
Register Map ........................................................................................................................................................................ 16
Application Example.............................................................................................................................................................. 17
I/O Equivalence Circuit .......................................................................................................................................................... 18
Operational Notes ................................................................................................................................................................. 20
Ordering Information ............................................................................................................................................................. 22
Marking Diagram................................................................................................................................................................... 22
Physical Dimension and Packing Information ......................................................................................................................... 23
Revision History .................................................................................................................................................................... 24
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Pin Configuration
(Top view)
A
RNF9
MVCC34
OUT3A
OUT3B
OUT4A
OUT4B
MGND34
SO3
OUT1A
B
VDDAMP
RNF9
SI1
SO1
SI2
SO2
SI3
OUT1A
OUT1B
C
OUT9B
PIOUT3
SO4
MVCC12
D
OUT9A
SDATA
SI4
OUT2A
E
MGND9
CSB
IN1
MGND12
F
OUT8B
PIOUT2
IN2
OUT2B
G
MGND8
RESETB
STATE2
STATE1
H
MVCC8
OUT8A
SCLK
FCLK
SOUT
STATE3
PIOUT1
DVDD
DVSS
J
OUT8A
OUT6B/7B
OUT6A
MGND567
OUT7A
OUT5B
OUT5A
MVCC567
TEST
1
2
3
4
5
6
7
8
9
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Pin Description
Pin No.
Pin Name
Power
Supply
Pin No.
Pin Name
Power
Supply
Function
A1(Note 1)
RNF9
-
E8
IN1
DVDD
IN1 logic input
A2
MVCC34
-
E9
MGND12
-
1ch, 2ch driver
ground
A3
OUT3A
MVCC34
3ch driver A output
F1
OUT8B
MVCC8
A4
OUT3B
MVCC34
3ch driver B output
F2
PIOUT2
DVDD
PI driver output2
A5
OUT4A
MVCC34
4ch driver A output
F8
IN2
DVDD
IN2 logic input
A6
OUT4B
MVCC34
4ch driver B output
F9
OUT2B
MVCC12
2ch driver B output
A7
MGND34
-
G1
MGND8
-
8ch driver ground
A8
SO3
DVDD
G2
RESETB
DVDD
A9(Note 1)
OUT1A
MVCC12
G8
STATE2
DVDD
B1
VDDAMP
-
G9
STATE1
DVDD
B2(Note 1)
RNF9
-
H1
MVCC8
-
B3
SI1
DVDD
H2(Note 1)
OUT8A
MVCC8
B4
SO1
DVDD
H3
SCLK
DVDD
SCLK logic input
B5
SI2
DVDD
H4
FCLK
DVDD
FCLK logic input
B6
SO2
DVDD
H5
SOUT
DVDD
SOUT logic output
B7
SI3
DVDD
H6
STATE3
DVDD
STATE3 logic
input/output
B8(Note 1)
OUT1A
MVCC12
1ch driver A output
H7
PIOUT1
DVDD
PI driver output1
B9
OUT1B
MVCC12
1ch driver B output
H8
DVDD
-
Digital power supply
C1
OUT9B
RNF9
9ch driver B output
H9
DVSS
-
Ground
C2
PIOUT3
DVDD
PI driver output3
J1(Note 1)
OUT8A
MVCC8
C8
SO4
DVDD
C9
MVCC12
-
D1
OUT9A
RNF9
D2
SDATA
D8
Function
9ch driver
power supply
3ch, 4ch driver
power supply
3ch, 4ch driver
ground
Waveform shaping
output3
1ch driver A output
9ch power supply of
current driver control
9ch driver
power supply
Waveform shaping
input1
Waveform shaping
output1
Waveform shaping
input2
Waveform shaping
output2
Waveform shaping
input3
Waveform shaping
output4
1ch, 2ch driver
power supply
J2
OUT6B/7B MVCC567
8ch drive B output
RESETB logic input
STATE2 logic
input/output
STATE1 logic
input/output
8ch driver
power supply
8ch driver A output
8ch driver A output
6ch, 7ch driver
B output
J3
OUT6A
MVCC567 6ch driver A output
9ch driver A output
J4
MGND567
DVDD
SDATA logic input
J5
OUT7A
MVCC567 7ch driver A output
SI4
DVDD
Waveform shaping
input4
J6
OUT5B
MVCC567 5ch driver B output
D9
OUT2A
MVCC12
2ch driver A output
J7
OUT5A
MVCC567 5ch driver A output
E1
MGND9
-
9ch driver ground
J8
MVCC567
-
E2
CSB
DVDD
CSB logic input
J9
TEST
DVDD
-
5ch, 6ch, 7ch driver
ground
5ch, 6ch, 7ch driver
power supply
TEST logic input
(Note 1) It is not possible to use corner pin only. (Corner pins are A1, A9, and J1)
Short between the pins A1 to B2, A9 to B8 and J1 to H2, or use only the B2, B8 and H2 pins.
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DVDD
SI1
SO1
SI2
SO2
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
SI3
SO3
SI4
SO4
PIOUT3
PIOUT１
PIOUT２
Block Diagram
DVDD
DVDD
TSD
DVSS
MVCC12
MVCC12
PREDRIVER
OUT1A
MVCC567
MVCC567
OUT1B
PREDRIVER
OUT5A
OUT5B
MGND12
Analog Feed-Back
MGND567
Analog Feed-Back
MVCC12
MVCC567
MVCC12
MVCC567
OUT2A
PREDRIVER
OUT6A
OUT6B/7B
OUT7A
OUT2B
PREDRIVER
MGND12
Analog Feed-Back
MGND567
Analog Feed-Back
Logic
MVCC8
MVCC8
MVCC34
MVCC34
OUT8A
OUT8B
PREDRIVER
PREDRIVER
OUT3A
OUT3B
MGND34
MGND8
Analog Feed-Back
VDDAMP
MVCC34
MVCC34
RNF9
DVDD
OUT4A
PREDRIVER
OUT4B
DAC9
+
OUT9A
OUT9B
MGND34
Analog Feed-Back
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STATE3
STATE2
STATE1
SOUT
SCLK
SDATA
CSB
FCLK
RESETB
IN2
IN1
TEST
MGND9
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Description of Blocks
Stepping Motor Driver (1ch to 6ch Driver)
Built-in PWM type stepping motor drivers.
Maximum 3 stepping motors can be driven independently.
Built-in D-class type voltage feedback circuit.
3ch/4ch drivers can also drive DC motor or voice coil motor individually.
(1) Control
Both Clock IN and Autonomous control are possible.
(a)Clock IN Control
Set the registers for the stepping motor control.
Stepping motor rotates in synchronization with clock input to the STATE1, STATE2 and/or STATE3 pin.
Mode of stepping motor control is selectable from μ-step, 1-2 phase excitation and 2 phase excitation. And the number
of edge for electrical angle cycle is selectable from 4, 8, 32, 64, 128, 256, 512 or 1024.
ON/OFF
Direction
Torque
CSB
SCLK
3 SDATA
SIF
Host
（Speed・amount）
STATE1
STATE2
STATE3
STM
Control
Logic
SIN wave
Generation
Logic
PWM
Generation
Logic
STM
H.B.
H.B.
(b)Autonomous Control
Stepping motor rotates by setting the registers to drive the stepping motor.
It is possible to output from serial output (the SOUT pin) the status information which are operation command status
(excecution:1, stop:0), cache register status and motor position, and to output signal (MO output) from the STATE1,
STATE2 and STATE3 pin in synchronization with motor operation.
Mode of stepping motor control is selectable from μ-step (1024 portion), 1-2 phase excitation and 2 phase excitation.
Built-in Cache register enables to set next operation commands during motor operation, and continuous operation is
possible.
ON/OFF
Direction
CSB
Speed
SCLK
Torque
SDATA
3
amount
Host
Motor State
SOUT
STATE1
Number of STATE2
STATE3
Rotation
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SIF
STM
Control
Logic
SIN wave
Generation
Logic
PWM
Generation
Logic
H.B.
STM
H.B.
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Description of Blocks – continued
Voltage Driver (7ch, 8ch Driver)
Built-in PWM type voltage driver.
(1) Control
(a)Register Control
■7ch, 8ch driver speed control = OFF
PWM driving by setting the registers for PWM duty ratio, direction and ON/OFF.
CSB
PWMduty
Host
SCLK
Direction
ON/OFF
3
SDATA
SIF
PWM
Generation
Logic
M
H.B.
■8ch driver speed control = ON
Speed control driving by setting the registers for target speed value, PI filter value, direction and ON/OFF. Motor speed
is detected from photo-interrupter signal and rotation speed is adjusted by comparing the target speed with the motor
speed.
Target speed
PI filter
Direction
ON/OFF 3
CSB
SCLK
SDATA
Host
SIF
DCM
Speed Control
Logic
PWM
Generation
Logic
H.B.
DCM
PI Dr
PI
Comp
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Description of Blocks – continued
Current Driver (9ch Driver)
Built-in constant current driver.
A voltage at the RNF9 pin and an external resistor (RRNF) value determine output current value. An internal
high-precision amplifier (CMOS gate input) controls constant current. If any resistance component exists in wirings for
the RNF9 pin and the external resistor (RRNF), that might reduce accuracy and pay attention about wiring.
(1) Control
(a)Register Control
Constant current driving by setting the registers for output current value, direction and ON/OFF.
Current value
SCLK
Direction
ON/OFF
CSB
3 SDATA
SIF
Host
Control
Logic
Current control
DAC
C.C.
VCM
(b)External Pin Control 1
Constant current driving by setting the registers for output current value, and the IN1 and IN2 pin for direction and
ON/OFF.
CSB
Current value
Host
SCLK
3 SDATA
SIF
Direction
ON/OFF
IN1
IN2
Control
Logic
Current control
DAC
C.C.
VCM
(b)External Pin Control 2
Constant current driving by setting the registers for output current value and direction, and the IN1 pin for ON/OFF.
CSB
Current value
Direction
SCLK
3 SDATA
SIF
Host
ON/OFF
IN1
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Control
Logic
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Current control
DAC
C.C.
VCM
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Absolute Maximum Ratings (Ta=25 °C)
Parameter
Symbol
Rating
Unit
DVDD
-0.3 to +4.5
V
MVCC
-0.3 to +7.0
V
Input Voltage
VIN
-0.3 to supply voltage+0.3
V
Input / Output Current (Note 2)
IIN
500
mA
Supply Voltage
Maximum Junction Temperature
Storage Temperature Range
Power Dissipation
(Note 3)
50
mA
Tjmax
125
°C
Tstg
-55 to +125
°C
Pd
1.30
W
Remark
MVCC12, MVCC34,
MVCC567, MVCC8, VDDAMP
MVCC12, MVCC34,
MVCC567, MVCC8, RNF9
PIOUT1, PIOUT2, PIOUT3
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 2): Must not exceed Pd.
(Note 3): When use at Ta=25 °C or more, derate 13 mW per 1 °C
(At mounting 50 mm x 58 mm x 1.75 mm glass epoxy board.)
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Remark
Digital Power Supply Voltage
DVDD
2.7
3.0
3.6
V
Driver Power Supply Voltage
MVCC
2.7
5.0
5.5
V
DVDD≤MVCC
MVCC12, MVCC34,
MVCC567, MVCC8, VDDAMP
Reference clock
Clock Operating Frequency
fFCLK
1
-
28
MHz
Operating Temperature
Topr
-20
+25
+85
°C
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Electrical Characteristics
(Unless otherwise specified Ta=25 °C, DVDD=3.0 V, MVCC12=MVCC34=MVCC567=MVCC8=VDDAMP=5.0 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
ISSD
-
0
10
µA
ISSM
-
0
10
µA
IDDD
-
14
19
mA
Low-Level Input Voltage
VIL
DVSS
-
0.3 x DVDD
V
High-Level Input Voltage
VIH
0.7 x DVDD
-
DVDD
V
Low-Level Input Current
IIL
0
-
10
µA
VIL=DVSS
High-Level Input Current
IIH
0
-
10
µA
VIH=DVDD
Quiescent Current
Operational Current
DVDD power supply
CMD_RS=0
MVCC power supply
CMD_RS=0
DVDD power supply
RESETB=H
CMD_RS=STB=CLK_EN=1
fFCLK = 24 MHz
CLK_DIV setting: 0h
No load
Low-Level Output Voltage
VOL
DVSS
-
0.2 x DVDD
V
IOL = 1.0 mA
High-Level Output Voltage
VOH
0.8 x DVDD
-
DVDD
V
IOH = 1.0 mA
VPIO
-
0.15
0.5
V
IIH = 30 mA
Output Voltage
High Detection Voltage
VTHH
-
-
1.9
V
DVDD = 3.25V
Low Detection Voltage
VTHL
0.9
-
-
V
DVDD = 3.25V
Hysteresis
VHYS
0.2
-
0.6
V
DVDD = 3.25V
RON
-
1.5
2.0
Ω
-10
0
+10
µA
IO = ±100 mA
(sum of high and low sides)
Output HiZ setting
-5
-
+5
%
ON-Resistance
OFF-Leak Current
IOZ
Accuracy of Average
Voltage between Output
VDIFF
Pins
ON-Resistance
RON
-
1.5
2.0
Ω
OFF-Leak Current
IOZ
-10
0
+10
µA
ON-Resistance
RON
-
1.0
1.5
Ω
OFF-Leak Current
IOZ
-10
0
+10
µA
Output Current
IO
190
200
210
mA
different output voltage
setting: 2Bh
IO = ±100 mA
(sum of high and low sides)
Output HiZ setting
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IO = ±100 mA
(sum of high and low sides)
Output HiZ setting
9_IOUT setting: 80h
RRNF=1 Ω
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Typical Performance Curves
(Unless otherwise specified Ta=25 °C, DVDD=3.0 V, MVCC12=MVCC34=MVCC567=MVCC8=VDDAMP=5.0 V)
10
Quiescent Current (DVDD) : ISSD [µA]
Quiescent Current (DVDD) : ISSD [µA]
10
8
6
4
2
6
4
2
0
0
2.0
2.5
3.0
DVDD [V]
3.5
-50
4.0
Figure 1. Quiescent Current (DVDD) vs DVDD
-25
0
25
50
Temperature [°C]
75
100
Figure 2. Quiescent Current (DVDD) vs Temperature
10
10
Quiescent Current (MVCC) : ISSM [µA]
Quiescent Current (MVCC) : ISSM [µA]
8
8
6
4
2
8
6
4
2
0
0
2.0
3.0
4.0
MVCC [V]
5.0
-50
6.0
Figure 3. Quiescent Current (MVCC) vs MVCC
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-25
0
25
50
Temperature [°C]
75
100
Figure 4. Quiescent Current (MVCC) vs Temperature
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Typical Performance Curves – continued
(Unless otherwise specified Ta=25 °C, DVDD=3.0 V, MVCC12=MVCC34=MVCC567=MVCC8=VDDAMP=5.0 V)
5
4
4
ON-Resistance : R ON [Ω]
ON-Rresistance : R ON [Ω]
5
IO=±100 mA
3
2
1
IO=±100 mA
3
2
1
0
0
2.0
3.0
4.0
MVCC [V]
5.0
-50
6.0
0
25
50
Temperature [°C]
75
100
Figure 6. ON-Resistance vs Temperature
(1ch to 8ch Driver Block)
5
5
4
4
ON-Resistance : R ON [Ω]
ON-Resistance : R ON [Ω]
Figure 5. ON-Resistance vs MVCC
(1ch to 8ch Driver Block)
-25
IO=±100 mA
3
2
1
IO=±100 mA
3
2
1
0
0
2.0
3.0
4.0
MVCC [V]
5.0
-50
6.0
Figure 7. ON-Resistance vs MVCC
(9ch Driver Block)
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-25
0
25
50
Temperature [°C]
75
100
Figure 8. ON-Resistance vs Temperature
(9ch Driver Block)
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Typical Performance Curves – continued
(Unless otherwise specified Ta=25 °C, DVDD=3.0 V, MVCC12=MVCC34=MVCC567=MVCC8=VDDAMP=5.0 V)
400
4
Output Current : IO [mA]
Average Voltage between Output Pins [V]
5
3
2
300
200
100
1
0
0
0
32
64
Code Setting
96
32
128
Figure 9. Average Voltage between Output Pins vs Code
Setting
(Voltage Driver Block)
64
96
128 160 192
Code Setting
224
256
Figure 10. Output Current vs Code Setting
(Current Driver Block, RRNF=1.0 Ω, RL=5.0 Ω)
Output Voltage : VPIO [V]
0.20
0.15
0.10
IIH=30 mA
0.05
0.00
2.0
2.5
3.0
DVDD [V]
3.5
4.0
Figure 11. Output Voltage vs DVDD
(PI Driver Circuit)
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Timing Chart
(Unless otherwise specified, Ta=25 °C, DVDD=3.0 V)
Parameter
Symbol
Design Value
SCLK Input Cycle
tSCLK
100 ns or more
SCLK Low-Level Input Time
tSCLKL
50 ns or more
SCLK High-Level Input Time
tSCLKH
50 ns or more
SDATA Setup Time
tSSDATA
50 ns or more
SDATA Hold Time
tHSDATA
50 ns or more
CSB High-Level Input Time
tCSBH
380 ns or more
CSB Setup Time
tSCSB
50 ns or more
CSB Hold Time
tHCSB
50 ns or more
RESETB Low-Level Input Time
tRESETBL
350 ns or more
FCLK Input Cycle
tFCLK
36 ns or more
FCLK Low-Level Input Time
tFCLKL
18 ns or more
FCLK High-Level Input Time
tFCLKH
18 ns or more
0.7 x DVDD
0.3 x DVDD
CSB
tSCLK
tHCSB
tSCLKH
tSCSB
tSCLKL
tCSBH
tHCSB
tSCSB
0.7 x DVDD
0.3 x DVDD
SCLK(Note4,5)
tSSDATA
tHSDATA
0.7 x DVDD
0.3 x DVDD
SDATA
tFCLKL
tFCLK
tFCLKH
0.7 x DVDD
0.3 x DVDD
FCLK(Note 4,5)
tRESETBL
RESETB
0.3 x DVDD
(Note 4) RESETB and FCLK is asynchronous with SCLK.
(Note 5) The duty of FCLK and SCLK is arbitrary after observing the above table.
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Serial interface
Control command is 16-bit serial input (MSB first) and is sent via the CSB, the SCLK, and the SDATA pins.
Higher 4 bits specify addresses and lower 12 bits specify data. Data of each bit is sent via the SDATA pin and taken at a
rising edge of SCLK. The Data taken during CSB ‘L’ period is valid and is written in register at a rising edge of CSB.
SOUT output is 12bit data and synchronous with a falling edge of SCLK.
CSB
SCLK
SDATA
x
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D11
D10
D9
D8
D7
D6
x
HiZ
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TSZ22111 • 15 • 001
D4
D3
D2
D1
D0
D4
D3
D2
D1
D0
x
Data
Address
SOUT
D5
D5
HiZ
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Register Map(Note 6,7,8,9)
Address[3:0]
Data[11:0]
15
14
13
12
11
0
0
0
0
A_Mode[1:0]
0
0
0
1
0
0
1
0
0
0
0
1
1
0
1
0
0
1
0
1
0
1
1
0
0
1
1
1
1
0
0
0
1
0
0
1
1
0
1
0
1
0
1
1
1
1
1
1
1
1
0
0
1
0
1
0
10
9
8
7
6
4
3
2
1
0
0
0
A_different_output_voltage[6:0]
0
0
0
0
0
0
1
0
0
1
1
0
A_BEXC
0
1
1
1
0
0
0
A_EN
A_RT
A_ACT A_BUSY
B_Mode[1:0]
5
A_SEL[2:0]
A_Cycle[5:0]
A_Cycle[13:6]
0
A_BSL
A_POS[1:0]
A_AEXC
0
0
A_ASL
0
0
A_PS
A_Stop
L
L
0
0
0
B_ASL
A_Pulse[9:0]
B_ACT
B_BUSY C_ACT
B_SEL[2:0]
C_BUSY
0
0
0
0
0
0
1
0
0
1
1
0
B_BEXC
0
1
0
0
0
0
0
1
0
1
3_State_CTL[1:0]
1
1
0
4_State_CTL[1:0]
1
1
1
B_EN
B_RT
0
L
L
L
L
B_different_output_voltage [6:0]
B_Cycle[5:0]
B_Cycle[13:6]
0
0
B_BSL
3_CHOP[1:0]
B_AEXC
0
0
0
4_CHOP[1:0]
3_PWM_Duty[6:0]
4_PWM_Duty[6:0]
0
B_POS[1:0]
0
0
B_PS
B_Stop
B_Pulse[9:0]
A_Position[9:6]
C_Mode[1:0]
B_Position[9:6]
C_SEL[2:0]
C_Position[9:6]
C_different_output_voltage[6:0]
0
0
0
0
0
0
1
0
C_Cycle[5:0]
0
0
0
1
1
0
C_BEXC
0
0
1
1
1
0
0
0
C_POS[1:0]
C_EN
C_RT
0
0
0
0
0
0
Edge
0
0
1
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
0
1
1
0
0
1
1
1
0
1
0
0
0
0
0
0
0
0
0
SPC_Limit[1:0]
1
0
1
0
0
0
0
8_SPEN
0
0
8_CHOP[1:0]
1
1
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
9_State_CTL[1:0]
1
0
1
0
0
0
0
0
HYS4
HYS3
1
1
0
0
0
0
0
STB
0
0
C_Cycle[13:6]
C_BSL
C_AEXC
0
0
C_ASL
0
0
C_PS
C_Stop
0
0
C_CTL
B_CTL
A_CTL
67_SEL
0
EXT_CTL[2:0]
0
PI_CTL3 PI_CTL2 PI_CTL1
C_Pulse[9:0]
Chopping[1:0]
CacheM
0
0
CLK_EN
0
0
0
0
0
0
0
0
0
0
7_State_CTL[1:0]
CLK_DIV[3:0]
0
0
7_CHOP[1:0]
7_PWM_Duty[6:0]
8_TARSP[7:0]
8_PSP[2:0]
0
8_State_CTL[1:0]
8_ISP[2:0]
8_PWM_Duty[6:0]
9_IOUT[7:0]
Other than the above
HYS2
HYS1
STM_RS CMD_RS
Setting Prohibited
(Note 6) The notations A, B and C in the register map correspond to Ach, Bch and Cch respectively. Ach is defined as 1ch and 2ch driver output, Bch as 3ch
and 4ch, Cch as 5ch and 6ch driver output.
(Note 7) After reset, the initial settings are stored in all registers.
(Note 8) The data at register address 4’b0011 and 4’b0111 (ACT, BUSY, POSITION[9:6]) is internal register value and is output from the SOUT pin. ‘L’ in the
above table indicates Low output.
(Note 9) Regarding Mode, different_output_voltage, Cycle, EN, and RT registers, the data written right before the access to the Pulse register is valid and
determined at a rising edge of CSB after the access to the Pulse register. (The Mode, different_output_voltage, Cycle, EN, RT, and Pulse registers
have Cache registers. Any registers other than them do not have Cache registers.)
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Application Example
1ch / 2ch
μ-STEP
5ch / 6ch
μ-STEP
3ch / 4ch
μ-STEP
STM
STM
STM
Auto Focus
Zoom
Zoom
1ch / 2ch
μ-STEP
STM
Auto Focus
3ch
PWM
4ch
PWM
DCM
DCM
Iris
Iris
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5ch / 6ch
μ-STEP
STM
Zoom
17/24
7ch
PWM
8ch
PWM
9ch
C.C.
DCM
DCM
VCM
Lens cap
Iris
Shutter
7ch
PWM
8ch
PWM
9ch
C.C.
DCM
DCM
VCM
Lens cap
etc
Shutter
TSZ02201-BU24038GW-1-2
12.Mar.2019 Rev.003
BU24038GW
I/O Equivalence Circuit
Pin
RESETB
FCLK
CSB
SCLK
SDATA
IN1
IN2
Equivalent Circuit Diagram
DVDD
DVDD
SOUT
DVDD
DVDD
Pin
TEST(Note 10)
STATE1
STATE2
STATE3
Equivalent Circuit Diagram
DVDD
DVDD
DVDD
DVDD
DVDD
SI1
SI2
SI3
SI4
PIOUT1
PIOUT2
PIOUT3
DVDD
DVDD
DVDD
OUT3A
OUT3B
OUT4A
OUT4B
MVCC34
SO1
SO2
SO3
SO4
OUT1A
OUT1B
OUT2A
OUT2B
OUT5A
OUT5B
OUT6A
OUT6B/7B
OUT7A
DVDD
DVDD
MVCC12
MVCC567
(Note 10) Short the TEST pin to DVSS.
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I/O Equivalence Circuit – continued
Pin
OUT8A
OUT8B
Equivalent Circuit Diagram
MVCC8
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Pin
OUT9A
OUT9B
19/24
Equivalent Circuit Diagram
RNF9
TSZ02201-BU24038GW-1-2
12.Mar.2019 Rev.003
BU24038GW
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin
lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Disturbance Light
In a device where a portion of silicon is exposed to light such as in a WL-CSP and chip products, IC characteristics
may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that
will prevent the chip from being exposed to light.
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BU24038GW
Ordering Information
B
U
2
4
0
3
8
G
W
-
Package
GW: UCSP75M3
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
TOP VIEW
UCSP75M3 (BU24038GW)
Pin 1 Mark
Part Number Marking
U2 4 0 3 8
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LOT Number
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BU24038GW
Physical Dimension and Packing Information
Package Name
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BU24038GW
Revision History
Date
Revision
14.May.2010
18.Apr.2013
001
002
12.Mar.2019
003
Changes
New Release
Update some English words, sentences, descriptions, grammar and format.
In the “Typical Application Circuit” names of connected power supply are added.
In the “Absolute Maximum Ratings” the “Maximum Junction Temperature” is added.
In the “Absolute Maximum Ratings” notes are added. e.g. About when operating the IC
over the “Absolute Maximum Ratings”,
“Operating Temperature” is moved to “Recommended Operating Conditions” from
“Absolute Maximum Ratings”.
In the “Typical Performance Curves” package power dissipation graph is removed,
because it’s same information as Note 2 in “Absolute Maximum Ratings”.
“Operational Notes” are updated.
Other formats are updated.
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
