Datasheet
The 24bit Audio CODEC series
Monaural Audio CODEC
with Touch Panel Interface
BU26154MUV
General Description
Key Specifications
BU26154 is a low-power compact audio CODEC.
BU26154 also incorporates touch panel interface and
Cap-Less headphones amplifier, speaker amplifier which
is most suitable for digital still cameras, electronic
dictionaries. BU26154 has built-in voltage regulator for
the stability of CODEC characteristic that is sensitive to
the outside noise. Speaker amplifier that can change AB
/ D Class. Therefore, when the interference including the
FM radio influences it, BU26154 can prevent
interference by operating AB grade. As digital code
processing, it is equipped with the high-pass filter as the
noise cut use of the specific frequency band, Notch filter
2
and the Equalizer of 5 bands and P Bass+, Noise gate,
and flexible sound quality effect processing is possible.
HVDD Power Supply:
SPVDD Power Supply:
CPDD Power Supply:
TVDD Power Supply:
MIC-ADC SNR:
DAC-SP SNR:
DAC-HP SNR:
■
2.7V to 3.6V
2.7V to 5.5V
2.7V to 3.6V
2.7V to 3.6V
92dB(Typ)
95dB (Typ)
93dB (Typ)
W (Typ) x D (Typ) x H (Max)
6.00mm x 6.00mm x 1.00mm
Package(s)
VQFN040V6060
Features
■
■
■
■
Various sound processing functions
2
P Bass+
Noise gate
Fast release ALC
5-band Equalizer/Notch Filter
High PSRR is attained by built-in regulator
Speaker amplifier can be switched to AB class and
D class.
Touch panel interface.
VQFN040V6060
Applications
■
■
■
■
■
Electronic Dictionary
Digital Still Camera
Digital Single-lens Reflex Camera
Digital Mirror-less Camera
Digital Video Camera, others
Typical Application Circuit(s)
VMID
HVDD1 HGND2 REGOUT
HGND1
HVDD
REGOUT IOVDD
Bias
MBIASCAP
LDO
MICBIAS
REGOUT
CPU
I/F
CSB/SCL
IO
SDATA/SDA
REGOUT
REGOUT
SCLK
REGOUT IOVDD
MIN1
ADC
PGA
MIN2
RESET
SPVDD
Class AB or
Class D
SPGND
RESETB
IO
REGOUT IOVDD
SPVDD
SPOUT+
SP
VOL
SPOUTHPVDD
HPL
HP
HPR
CPVDD
HPVDD
CPP
CPN
SAI_LRCLK
IO
SAI_BCLK
SAI_SDOUT
SAI_SDIN
REGOUT
HP
DAC
REGOUT
IOVDD
HPVSS
LDO
MCLKI
TVDD
HPVDD
CHARGE
PUMP
Serial
Audio
InterFac
e
DAC
HPVSS
HPVDD
HPCOM
ALC
Filter
Sound Effect
REGOUT
VOL
CLOCK
PLL
TSTO
TOUCH
PANEL I/F
HPVSS
HPVSS
IO
CPGND
XP
XN
YP
YN
TVDD
TGND
IRQB
PLLC
Figure 1. Block Diagram
〇Product structure : Silicon monolithic integrated circuit
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Datasheet
BU26154MUV
Pin Configuration(s)
IRQB
SAI_SDOUT
SAI_SDIN
SAI_BCLK
SAI_LRCLK
SCLK/SAD
SDATA/SDA
CSB/SCL
MCLKI
TSTO
Top view
30
29
28
27
26
25
24
23
22
21
18
REGOUT
YN
34
17
HVDD
TGND
35
16
NC
TVDD
36
15
HGND1
HPCOM
37
14
HGND2
CPVDD
38
13
MIN2
CPP
39
12
MIN1
HPR
40
11
MBIASCAP
1
2
3
4
5
6
7
8
9
10
VMID
33
SPGND
XN
SPOUT-
PLLC
SPOUT+
19
SPVDD
32
CPN
XP
HPVSS
RESETB
CPGND
20
HPVDD
31
HPL
YP
Figure 2. Pin Configuration(s)
Pin Description(s)
No
Name
I/O
Power
17
HVDD
P
-
6
SPVDD
P
-
38
CPVDD
P
-
16
N.C
-
-
36
TVDD
P
-
15
HGND1
P
-
14
HGND2
P
-
9
SPGND
P
-
3
CPGND
P
-
35
TGND
P
-
18
REGOUT
O
HVDD
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Function
High voltage power supply pin
A capacitor is connected between HVDD and HGND1.
Speaker power supply pin
A capacitor is connected between SPVDD and SPGND.
Voltage power supply pin for charge pump
A capacitor is connected between CPVDD and CPGND.
A no connect pin.
Voltage power supply for the touch panel
Please connect a capacitor between TVDD and TGND.
High voltage ground 1
It is used on the same voltage as HGND2, SPGND,
CPGND, and TGND.
High voltage ground 2
It is used on the same voltage as HGND1, SPGND,
CPGND, and TGND.
Ground pin for Speaker
It is used on the same voltage as HGND1, HGND2,
CPGND, and TGND.
Ground pin for charge pump
It is used on the same voltage as HGND1, HGND2,
SPGND, and TGND.
Ground pin for touch panel interface
It is used on the same voltage as HGND1, HGND2,
CPGND, and SPGND.
Regulator output
A capacitor is connected between REGOUT and HGND1.
Please connect as close as possible to the chip.
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Reset
(Note1)
No use
(Note3)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
HGND2
-
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Datasheet
BU26154MUV
2
HPVDD
O
CPVDD
4
HPVSS
O
CPVDD
22
21
MCLKI
TSTO
I
O
HVDD
HVDD
20
RESETB
I
HVDD
24
SDATA
/SDA
IO
HVDD
25
SCLK
/SAD
I
HVDD
23
CSB
/SCL
I
HVDD
26
27
28
29
SAI_LRCLK
SAI_BCLK
SAI_SDIN
SAI_SDOUT
IO
IO
I
O
HVDD
HVDD
HVDD
HVDD
30
IRQB
O
HVDD
10
VMID
O
REGOUT
11
MBIASCAP
O
HVDD
12
MIN1
I
REGOUT
13
MIN2
I
REGOUT
8
7
1
40
39
5
SPOUTSPOUT+
HPL
HPR
CPP
CPN
O
O
O
O
O
O
SPVDD
SPVDD
SPVDD
SPVDD
CPVDD
CPVDD
19
PLLC
O
HVDD
31
32
33
34
37
YP
XP
XN
YN
HPCOM
O
O
O
O
I
TVDD
TVDD
TVDD
TVDD
-
A positive side voltage output pin for the headphones
driver.
A capacitor is connected between HPVDD and CPGND.
Please connect as close as possible to the chip.
A negative side voltage output pin for the headphones
driver.
A capacitor is connected between HPVSS and CPGND.
Please connect as close as possible to the chip.
Master Clock pin
Output pin for test-mode. Make it open.
Reset pin
"L" level: Reset enables.
"H" level: Reset disable.
3 wire interface: data input output pin
It is indicated as SDATA.
2 wire interface: data input output pin(Note 1)
It is indicated as SDA.
3 wire interface: Serial clock input pin
It is indicated as SCLK.
2 wire interface: Slave address select input pin.
It is indicated as SAD.
SAD pin = "L" level slave address is "0011010"
SAD pin = "H" level slave address is "0011011"
3 wire interface: chip select input pin
It is indicated as CSB.
2 wire interface: Serial clock input pin *1
It is indicated as SCL.
SAI LR clock input/output pin
SAI bit clock input/output pin
SAI serial data input pin
SAI serial data output pin
An interrupt output terminal. When an interrupt occurs,
chip outputs "L".
Analog reference voltage pin
A capacitor is connected between VMID and HGND2.
Microphone bias voltage output pin
A capacitor is connected between HGND2.
Please connect as close as possible to the chip.
Analog microphone input 1
Single-end and differential can be chosen.
When differential is chosen, it connects with microphone
+ pin.
Analog microphone input 2
Single-end and differential can be chosen.
When differential is chosen, it connects with microphone
- pin.
speaker output - pin
speaker output + pin
Headphones output Lch terminal
Headphones output Rch terminal
Charge pump flying capacitor, positive side output pin
Charge pump flying capacitor, negative side output pin
PLL filter pin
When clock of the MCLKI pin input is used, make it open.
When clock of the SAI_BCLK pin input is used, it is
necessary to connect resistors and a capacitor.
YP pin for the touch panel interface
XP pin for the touch panel interface
XN pin for the touch panel interface
YN pin for the touch panel interface
Headphones amplifier common pin
(Note 1) In case of 2 wire serial, if this pin is used with external pull-up resistor, it possibly gets noise from power.
in the noisy environment.
(Note 2) At the time of power down, in HPVDD and HPVSS, is short-circuited.
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CPGND
(Note 2)
CPGND
(Note 2)
(input)
HGND1
HGND1
Open
(input)
-
(input)
-
(input)
HGND1
(input)
-
(input)
(input)
(input)
HGND1
HGND1
HGND1
HGND1
Open
HGND1
Open
HGND2
-
HGND2
Open
Hi-Z
Open
Hi-Z
Open
SPGND
SPGND
CPGND
CPGND
Hi-Z
Hi-Z
Open
Open
Open
Open
Open
Open
HGND2
Open
Hi-Z
Hi-Z
Hi-Z
Hi-Z
(input)
Open
Open
Open
Open
-
Therefore, tamper noise design is required
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Datasheet
BU26154MUV
Description of Block(s)
1μF
1μF
1μF
CPVDD HVDD
TVDD
option
2.2kohm
MBIASCAP
4.7μF
0.47μF
0.47μF
MIN1
MIN2
SPOUT+
SPOUT-
BU26154
option
HPR
VMID
XN
2.2μF
Touch
Screen
YP
CPP
CPN
HPVSS
1μF
CPU
and
DSP
XP
HPVDD
2.2μF
CSB/SCL
SDATA/SDA
SCLK
RESETB
IRQB
SAI_LRCLK
SAI_BCLK
SAI_SDOUT
SAI_SDIN
MCLKI
option
REGOUT
2.2μF
SPVDD
PLLC
HPL
1μF
1μF
YN
HPCOM
TSTO
CPGND HGND2HGND1 TGND SPGND
Open
option
Figure 3. BU26154 Application circuit
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Datasheet
BU26154MUV
Absolute Maximum Ratings (Ta = 25°C)
(HGND1=HGND2=SPGND=CPGND=TGND=0V)
Parameter
Symbol
Condition
Rating
Unit
HVDD
-
-0.3 to 4.5
V
SPVDD Supply Voltage
SPVDD
-
-0.3 to 7.0
V
CPVDD Supply Voltage
CPVDD
-
-0.3 to 4.5
V
VIN
MCLKI, SAI_LRCLK,
SAI_BCLK, SAI_SDIN,
SDATA/SDA, SCLK.
CSB/SCL pins
MIN1, MIN2 pins
-0.3 to HVDD+0.3
V
-0.3 to REGOUT+0.3
V
-
-55 to +150
℃
(Note 1)
0.80
W
Ta=25°C (Note 2)
3.01
W
HVDD Supply Voltage
Input Voltage
Storage Temperature
Tstg
Ta=25°C
(Note 1)
Power Dissipation
Pd
Output Current 1
IOSP
SPOUT+, SPOUT- pins
-560 to +560
mA
Output Current 2
IOHP
HPL, HPR pins
-100 to +100
mA
Output Current 3
IOCP
HPVSS,HPVDD,CP,CN
pin
-500 to +500
mA
Output Current 4
IOREGO
REGOUT pin
-30 to 0
mA
IOO
Except SPOUT+,SPOUT-,
HPL,HPR,
REGOUT,HPVDD,HPVSS
pins
-8 to +8
mA
Output Current 5
Do not short the output pin to another output pin, power supply pin or GND pin.(Output pin includes an IO pin which is in output mode)
(Note 1) 74.2mm×74.2mm×1.6tmm FR4 1Layer Glass epoxy base Surface Copper foil 0%）Mounting
Above Ta=25℃,reduced by 8.0mW/℃. Thermal beer is on a base.
(Note 2) 74.2mm×74.2mm×1.6tmm FR4. 4 Layer Glass epoxy base（2,3layer Copper foil 100%）Mounting
Above Ta=25℃, reduced by 30.12mW/℃. Thermal beer is on a base.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
(HGND1=HGND2=SPGND=CPGND=TGND=0V)
Parameter
Symbol
Condition
Rating
Unit
HVDD
HVDD=CPVDD=TVDD
2.7 to 3.6
V
SPVDD Supply Voltage
SPVDD
-
2.7 to 5.5
V
CPVDD Supply Voltage
CPVDD
HVDD=CPVDD=TVDD
2.7 to 3.6
V
TVDD
HVDD=CPVDD=TVDD
2.7 to 3.6
V
Top
-
-20 to +85
℃
HVDD Supply Voltage
TVDD Supply Voltage
Operating Temperature
(Note 1) The radiation-proof design is not carried out.
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Datasheet
BU26154MUV
Electrical Characteristics
DC Characteristics
(HGND1= HGND2=SPGND=CPGND=TGND=0V, HVDD=3.3V, SPVDD=3.3V, CPVDD=3.3V, TVDD=3.3V, Ta=25℃)
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Related Pin
All Digital
"H" Input Voltage1
VIH1
HGND1=0V
HVDD *0.8
HVDD+0.3
V
Input
All
Digital
"L" Input Voltage 1
VIL1
HGND1=0V
-0.3
HVDD *0.2
V
Input
All Digital
"H" Input Voltage 2
VIH2
HGND1=0V
HVDD-0.4
HVDD+0.3
V
Input
All
Digital
"L" Input Voltage 2
VIL2
HGND1=0V
-0.3
0.4
V
Input
"H" output Voltage
VOH
IOH=-1mA
HVDD *0.85
V
Except SDA
"L" output Voltage 1
VOL1
IOL=1mA
HVDD *0.15
V
Except SDA
"L" output Voltage 2
VOL2
IOL=3mA
0.4
V
SDA
"H" Input Leakage
All Digital
IIH
VIH= HVDD
10
µA
Current
Input
"L" Input Leakage
All Digital
IIL
VIL=HGND1
-10
µA
Current
Input
"Z" output Leakage
IOZH
VOH=HVDD
10
µA
SDA
Current
"Z" output Leakage
IOZL
VOL=HGND1
-10
µA
SDA
Current
Playback(fs48kHz)
no Load, Hp-amp
Operating Current1
IDDO1
use
10
13
mA
Sin1kHz-Full Scale
output
Playback(fs48kHz)
no Load, D-class,
Operating Current2
IDDO2
Sp-amp use
10.5
13.7
mA
Sin1kHz-Full Scale
output
Playback(fs48kHz)
no Load, AB-class,
Operating Current3
IDDO3
Sp-amp use
12
15.6
mA
Sin1kHz-Full Scale
output
Record(fs48kHz)
Operating Current4
IDDO4
Sin1kHz-Full Scale
9.5
12.4
mA
input
Touch Panel
Operating Current5
IDDO5
0.6
1
mA
Interface Operate
Touch Panel
Interface Interrupt
Operating Current6
IDDO6
220
320
uA
(Note 3)
Wait
Ta = -40 to 55 ℃
Standby Current
IDDS
25 ℃
0.5
5
µA
(Note 1) Touch Panel Interface Interrupt electric current at the time of the wait. Please refer to a touch panel interface clause for the movement setting
condition.
(Note 2) Standby current is total value for all power supply currents.
(Note 3) Standby current's condition is power off state by RESETB=L
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Datasheet
BU26154MUV
AC Characteristics
Clock
PLL not used
(HGND1= HGND2=SPGND=CPGND=TGND=0V, HVDD=3.3V, SPVDD=3.3V, CPVDD=3.3V, TVDD=3.3V, Ta=25℃)
Min
Max
Unit
Parameter
Symbol
MCLKI Frequency
fC
4.096
49.152
MHz
MCLKI Period
tC
1/fC
1/fC
ns
MCLKI “H” Length
tCH
tC*0.4
-
ns
MCLKI “L” Length
tCL
tC*0.4
-
ns
PLL used
(HGND1= HGND2=SPGND=CPGND=TGND=0V, HVDD=3.3V, SPVDD=3.3V, CPVDD=3.3V, TVDD=3.3V,Ta=25℃)
Min
Max
Unit
Parameter
Symbol
MCLKI Frequency
fC
6.75
54
MHz
MCLKI Period
tC
1/fC
1/fC
ns
MCLKI “H” Length
tCH
tC*0.4
-
ns
MCLKI “L” Length
tCL
tC*0.4
-
ns
When PLL is use, clock from SAI_BCLK pin other than MCLKI pin could be inputted. Please refer to SAI slave clause about
the BCLK pin input frequency.
tC, fC
MCLKI
tCH
tCL
Figure 4
Reset
(HGND1= HGND2=SPGND=CPGND=TGND=0V, HVDD=3.3V, SPVDD=3.3V, CPVDD=3.3V, TVDD=3.3V, Ta=25℃)
Min
Max.
Unit
Parameter
Symbol
RESETB pulse width
tW_RST
5
-
µs
tW_RST
RESETB
Figure 5
When Reset pin is made low-level, internal LDO goes to power mode.
1ms is necessary until REGOUT pin becomes low-level. The recommended tW_RST is over 1ms.
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Datasheet
BU26154MUV
2-Wire Serial Interface
(HGND1= HGND2=SPGND=CPGND=TGND=0V, HVDD=3.3V, SPVDD=3.3V, CPVDD=3.3V, TVDD=3.3V, Ta=25℃,
CL=30pF)
Standard Mode
Fast Mode
Unit
Parameter
Symbol
Min
Max
Min
Max
SCL Frequency
fSCL
-
100
-
400
kHz
SCL "L" Length
tLOW
4.7
-
1.3
-
µs
SCL "H" Length
tHIGH
4.0
-
0.6
-
µs
Hold Time under Repeat [Start] Condition
tHD:STA
4.0
-
0.6
-
µs
Setup Time under Repeat [Start] Condition
tSU:STA
4.0
-
0.6
-
µs
Data Hold Time
tHD:DAT
0
3.45
0
0.9
µs
Data Setup Time
tSU:DAT
250
-
100
-
ns
Setup Time under [Stop] Condition
tSU:STO
4.0
-
0.6
-
µs
tHD:STA
SDA
tLOW
tSU:DAT
SCL
tHD:STA
tHD:DAT
tSU:STA
tHIGH
tSU:STO
Figure 6
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Datasheet
BU26154MUV
3-Wire Serial Interface
(HGND1= HGND2=SPGND=CPGND=TGND=0V, HVDD=3.3V, SPVDD=3.3V, CPVDD=3.3V, TVDD=3.3V,
CL=30pF)
Parameter
Symbol
Min
Max
Unit
SCLK Low to Chip Select enable
tSLCL
100
-
ns
Chip Select Enable to SCLK Low
tCLSL
100
-
ns
Chip Select Enable to SCLK High
tCLSH
100
-
ns
CLK High to Chip Select enable
tSHCL
100
-
ns
SCLK High Pulse Width
tSH
50
-
ns
SCLK Low Pulse Width
tSL
50
-
ns
Input Data Setup time
tIDS
30
-
ns
Input Data Hold time
tIDH
30
-
ns
tCHS2
100
-
ns
tCH
100
-
ns
tODV
-
40
ns
tCHDTS
-
40
ns
SCLK last edge to Chip Select disable
Chip Select High Pulse Width
Output Data Valid
Chip Select High to Data Transition
Ta=25℃,
Two kinds of timing are supported depending on the SCLK pin level at data transfer start. Read or Write is selected by LSB
logic INDEX.
Figure 7
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Datasheet
BU26154MUV
Serial Audio Interface (Slave)
(HGND1= HGND2=SPGND=CPGND=TGND=0V, HVDD=3.3V, SPVDD=3.3V, CPVDD=3.3V, VDD=3.3V,
CL=30pF)
Parameter
Symbol
Min
Max
SAI_BCLK Period
Ta=25℃,
Unit
tC_BCLK
32fs
128fs
Hz
SAI_BCLK "H" Length
tHW_BCLK
73
-
ns
SAI_BCLK "L" Length
tLW_BCLK
73
-
ns
SAI_LRCLK Hold Time
tH_LRCLK
20
-
ns
SAI_LRCLK Setup Time
tSU_LRCLK
20
-
ns
-
80
ns
SAI_SDOUT Delay Time
tD_SDO
(Note 1)
SAI_SDIN Setup Time
tSU_SDI
20
-
ns
SAI_SDIN Hold Time
tH_SDI
20
-
ns
(Note 1) tD_SDO is the delay time from previous SAI_BCLK transition and SAI_LRCLK transition.
SAI_LRCLK
tH_LRCLK
tSU_LRCLK
tC_BCLK
SAI_BCLK
tHW_BCLK tLW_BCLK
SAI_SDOUT
tD_SDO
SAI Transmit
Figure 8
SAI_LRCLK
tH_LRCLK
tSU_LRCLK
tC_BCLK
SAI_BCLK
tSU_SDI
tH_SDI
tHW_BCLK tLW_BCLK
SAI_SDIN
SAI Receive
Figure 9
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BU26154MUV
SAI (Master) - Serial Audio Interface (Master)
(HGND1= HGND2=SPGND=CPGND=TGND=0V, HVDD=3.3V, SPVDD=3.3V, CPVDD=3.3V, TVDD=3.3V,
CL=30pF)
Parameter
Symbol
Min
Max
SAI_BCLK Period
Ta=25℃,
Unit
tC_BCLK
32fs
64fs
Hz
SAI_BCLK "H" Length
tHW_BCLK
146
-
ns
SAI_BCLK "L" Length
tLW_BCLK
146
-
ns
SAI_LRCLK Delay time
tD_LRCLK
-
20
ns
SAI_SDOUT Delay Time
tD_SDO
-
20
ns
SAI_SDIN Setup Time
tSU_SDI
50
-
ns
SAI_SDIN Hold Time
tH_SDI
0
-
ns
SAI_LRCLK
tC_BCLK
tD_LRCLK
SAI_BCLK
tHW_BCLK tLW_BCLK
SAI_SDOUT
tD_SDO
SAI Transmit
Figure 10
SAI_LRCLK
tC_BCLK
tD_LRCLK
SAI_BCLK
tSU_SDI
tH_SDI
tHW_BCLK tLW_BCLK
SAI_SDIN
SAI Receive
Figure 11
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BU26154MUV
Power Supply Sequence
Please power on/off the LSI with all kind of power at the same time.
Each power supply should power up/down in 50ms. Also, keep all power supply in the ON state or the OFF state.
Please avoid partial ON or partial OFF states.
Please keep RESETB pin “L” level until all power supply become ON state. The CPU I/F become available when all power
supply is powered on after tW_PURST and tW_REGU time exceeds.
HVDD must be powered on first, but HVDD must be powered off last. About SPVDD, there is no limitation above.
Parameter
Symbol
Min
Typ
Max
Unit
Power On Delay Time
tVDD_ON
0
-
50
ms
Power Off Delay Time
tVDD_OFF
0
-
50
ms
Reset Time after Power ON
tw_PURST
1
-
-
μs
Wait Time for Regulator Starting after Reset
Release
tw_REGU
1
-
-
ms
PowerSupply*0.9
HVDD
Power
supply
tVDD_ON
PowerSupply*0.1
Other
tVDD_OFF
PowerSupply*0.9
Power
tW_PURST tW_REGU
supply
PowerSupply*0.1
REGOUT
RESETB
CPU I/F
STATUS
not available
VDD OFF
PowerDown Wait
Regulator
available
not available
Operation
VDD OFF
Figure 12
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BU26154MUV
Analog Characteristics
(HGND1= HGND2=SPGND=CPGND=TGND=0V, HVDD=3.3V, SPVDD=3.3V, CPVDD=3.3V, TVDD=3.3V, Ta=25°C)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Regulator Output
REGOUT Output Level
VREGOUT
-
1.7
1.8
1.9
V
-
-
0.124
Vp-p
20
30
40
kΩ
Mic Input (MIC Gain=18dB / Digital Volume=0.0dB / ALC=OFF)
Full Scale Input Signal Level
Input Resistance
VMINFS1
MIN1,MIN2
RMIN1
MIN1,MIN2
Mic Input (MIC Gain=9.0dB / Digital Volume=0.0dB / ALC=OFF)
Full Scale Input Signal Level
Input Resistance
VMINFS2
MIN1,MIN2
-
-
0.454
Vp-p
RMIN2
MIN1,MIN2
20
30
40
kΩ
VREF
-
0.9x
REGOUT/2
1.0x
REGOUT/2
1.1x
REGOUT/2
V
IMIC = -1mA,
MICBCON=0
1.50x
REGOUT/2
1.67x
REGOUT/2
1.84x
REGOUT/2
V
IMIC = -1mA,
MICBCON=1
2.00x
REGOUT/2
2.22x
REGOUT/2
2.45x
REGOUT/2
V
2.50x
REGOUT/2
2.78x
REGOUT/2
3.06x
REGOUT/2
V
3.00x
REGOUT/2
-
3.33x
REGOUT/2
-
3.67x
REGOUT/2
2
V
Analog Reference Level(VMID-pin)
Analog Reference Voltage
Microphone Bias(MBIASCAP -pin)
Output Voltage
where, VMIC HVDD)
P38, P48,P49,P50,P51,P73 Register function explanation and register details explanation
Removed MCLKOE bit and ADCREN bit、
Added Analog Input Power Management, Speaker Amplifier Power Management registers
MAPCON setting
Changed ZCEN explanation(PDATT => EFFECT VOLUME)
Added the explanation of Playback Digital Attenuator Control Register /B “FFh setting”
Changed HPLSEN bit of Audio analog contol2 register
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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