BU3087FV-E2

Datasheet Built in VCXO, Spread-Spectrum Clock Generator BU3087FV ●Description BU3087FV has built in VCXO that is necessary for the Digital-TV signal reception. Connecting 27MHz crystal oscillator generates clock signals to 74.25MHz for Hi-Vision. BU3087FV has built in Spread-Spectrum function too. ●Key Specifications „ Crystal Pullability „ Modulation Frequency „ Cycle-to-Cycle Jitter „ Operating Current „ Operating Temperature ●Features „ 3225 size crystal is usable „ ON / OFF of Spread-Spectrum is selectable „ Four kinds of Modulation-Rate is selectable （±0.25% / ±0.50% / ±0.75% / ±1.00%） „ Triangular Modulation ●Package SSOP-B16 ±105ppm (Typ.) 34.5kHz (Typ.) 180psec (Typ.) 45mA (Typ.) -10℃ to +75℃ (Typ.) (Typ.) (Max.) 5.00mm x 6.40mm x 1.35mm ●Applications Digital-TV, STB, TV-Tuner SSOP-B16 ●Typical Application Circuit 3.3V (Typ.) CL 27MHz Crystal CL RD XOUT XIN AVDD1 PDB AVSS1 CLKOUT VCTRL VDD AVDD2 VSS AVSS2 SSON MODSEL1 TEST MODSEL2 CLK27M 0.1μF 0.1μF 0.1μF Figure 1. Typical Application Circuit (Caution) CL and RD in Typical Application Circuit should be optimized as to using crystal and board condition. ○Product structure：Silicon monolithic integrated circuit www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Block Diagram 7:MODSEL1 with Pull-up 8:MODSEL2 with Pull-down Control Logic 11:SSON with Pull-up Spread-Spectrum 10:TEST with Pull-down 14:CLKOUT PLL 15:PDB with Pull-up 4:VCTRL 1:XIN 9:CLK27M VCXO 16:XOUT Figure 2. Block Diagram ●Pin Configuration 1 XIN 2 XOUT 16 AVDD1 PDB 15 3 AVSS1 CLKOUT 14 4 VCTRL VDD 14 5 AVDD2 VSS 12 6 AVSS2 SSON 11 7 MODSEL1 TEST 10 8 MODSEL2 CLK27M 9 Figure 3.Pin Configuration (TOP VIEW) www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Pin Function PIN No. PIN Name Function 1 XIN 2 AVDD1 Power supply for VCXO 3 AVSS1 GND for VCXO 4 VCTRL VCXO control input terminal 5 AVDD2 Power supply for PLL-Analog 6 AVSS2 GND for PLL-Analog 7 MODSEL1 8 MODSEL2 9 CLK27M 10 TEST Test terminal, with pull-down 11 SSON Spread-Spectrum ON／OFF choice（H：ON、L：OFF）, with pull-up 12 VSS GND for PLL-Digital 13 VDD Power supply for PLL-Digital 14 CLKOUT 15 PDB 16 XOUT Crystal Input terminal Spread-Spectrum Modulation control terminal (Refer to Table of Spread-Spectrum Modulation) with pull-up Spread-Spectrum Modulation control terminal (Refer to Table of Spread-Spectrum Modulation) with pull-down 27.000000MHz Output 74.250000MHz Output Power-down control terminal, with pull-up Crystal Output terminal ●Table of Spread-Spectrum Modulation（1Pin_XIN input frequency =27.000000MHz） In the case of 11Pin_SSON=H, outputs it according to the following table. MODSEL2 MODSEL1 CLKOUT L L 74.250000MHz ±0.25% Modulation L H 74.250000MHz ±0.50% Modulation H L 74.250000MHz ±0.75% Modulation H H 74.250000MHz ±1.00% Modulation In the case of 11Pin・SSON=L, outputs unmodulated clock. www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Ratings Unit Supply voltage VDD -0.3 to 4.0 V Input Voltage VIN -0.3 to VDD+0.3 V Storage Temperature range Tstg -55 to 125 °C Power dissipation PD 690※1 mW ※1 A measure value at mounting on 70mm x 70mm x 1.6mm glass epoxy substrate. In the case of exceeding Ta=25°C, 6.9mW should be reduced per 1°C. ●Recommended Operating Ratings Parameter Symbol Ratings Unit Supply voltage VDD 3.135 to 3.465 V Input ”H” Voltage VIH 0.8VDD to VDD V Input ”L” Voltage VIL 0.0 to 0.2VDD V Operating Temperature topr -10 to 75 °C Frequency Control Voltage Vc 0.0 to VDD V Output load CL 15 (MAX) pF ※1 In case of Output load exceeds previous value , consideration should be adapted Rise Time and Fall Time for condition of use. www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Electrical Characteristics DC Characteristics (VDD=3.3V, Ta=25°C, Crystal Frequency=27.000000MHz, at No Load, unless otherwise specified） Parameter Symbol Limit Min. Typ. Max. Unit Output H voltage VOH VDD-0.4 － － V Output L voltage VOL － － 0.4 V Conditions IOH=4.0mA IOL=4.0mA Operating Circuit current IDD － 45.0 58.0 mA Input H current 1 IupH -1.5 － 1.5 μA Input H current 2 IdnH 35.0 70.0 105.5 μA MODSEL2, TEST Terminal,VIH=VDD Input H current 3 IdirH -1.5 － 1.5 μA VCTRL Terminal,VIH=VDD Input L current 1 IupL -105.5 -70.0 -35.0 μA PDB, SSON, MODSEL1 Terminal VIL=0.0V Input L current 2 IdnL -1.5 － 1.5 μA MODSEL2, TEST Terminal,VIL=0.0V Input L current 3 IdirL -1.5 － 1.5 μA VCTRL Terminal,VIL=0.0V CLKOUT CLKOUT 74.248144 74.250000 74.251856 Crystal Pullability Spread-Spectrum Modulation Frequency ※1 Output no load, ±0.50% Modulation PDB, SSON, MODSEL1 Terminal VIH=VDD MHz VCTRL=1/2VDD fp ±80 ±105 ±130 ppm 0≦VCTRL≦VDD Fmod 32.5 34.5 36.5 kHz ※1 Triangular Modulation, Independently of Modulation Rate This is a guarantee with only IC. It is finished with confirmation to operate with Crystal (DSX321G・8pF load) made in DAISHINKU CORP. AC Characteristics (VDD=3.3V, Ta=25°C, Crystal Frequency=27.000000MHz, Output load=15pF, unless otherwise specified） Following the table cannot test directly on characteristic when shipment, so it is a design guarantee. Parameter Duty Symbol Duty Limit Min. Typ. Max. 45 50 55 Unit % Conditions Measured at 1/2VDD Period Jitter 1σ※2, in Spread-Spectrum OFF Period Jitter MIN-MAX value※2, in Spread-Spectrum OFF Cycle-to-Cycle Jitter, In ±0.50% Modulation Jitter 1σ JsSD － 35 － psec Jitter P-P JsABS － 180 － psec Jitter Cycle-to-Cycle JsCyCy － 180 － psec Rise Time Tr － 1.2 － nsec Time between 0.2VDD and 0.8VDD Fall Time Tf － 0.7 － nsec Time between 0.8VDD and 0.2VDD Tlock － － 1 msec ※3 Lock Up Time ※２ ※３ Jitter means center value when using Japan Tektronix : TDS7104 Digital Phosphor Oscilloscope. Time between voltage supply leads to 3.135V and output clock gets stable. ●Spread-Spectrum Modulation Waveform Modulation Waveform is triangular. Modulation Rate is selectable among ±0.25%／±0.50%／±0.75%／±1.00%. In addition, Modulation Frequency is 34.5kHz without depending on Modulation Rate. ( Figure 4 shows ±0.50% Modulation Waveform. ) 74.250000MHz x (100 + 0.5)% 74.250000MHz 74.250000MHz x (100 - 0.5)% Modulation Frequency； 34.5kHz Figure 4. Spread-Spectrum Modulation Waveform www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Typical Wave Forms (VDD=3.3v, Ta=25°C, Spread-Spectrum OFF setting) CLK27M (500mV/div.) CLK27M (500mV/div.) TIME (5nsec/div.) Figure 5. CLK27M Output Waveform TIME (1nsec/div.) Figure 6. CLK27M Period-Jitter CLKOUT (500mV/div.) CLKOUT (500mV/div.) TIME (5nsec/div.) Figure 7. CLKOUT Output Waveform www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 TIME (1nsec/div.) Figure 8. CLKOUT Period-Jitter 6/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF) 180 180 VDD=3.3V Ta=25°C 160 Period-Jitter MIN-MAX : JsABS[psec] Period-Jitter MIN-MAX : JsABS[psec] 160 140 120 100 80 60 40 20 140 120 100 0 80 60 40 20 0 3.1 3.2 3.3 3.4 SUPPLY VOLTAGE : VDD[V] 3.5 -20 80 Figure 10. CLK27M Period-Jitter MIN-MAX Figure 9. CLK27M Period-Jitter MIN-MAX 55 55 Ta=25°C VDD=3.3V 54 54 53 53 52 52 Duty : Duty[%] Duty : Duty[%] 0 20 40 60 AMBIENT TEMPERATURE : Ta[℃] 51 50 49 51 50 49 48 48 47 47 46 46 45 45 3.1 3.2 3.3 3.4 SUPPLY VOLTAGE : VDD[V] 3.5 Figure 11. CLK27M Duty www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -20 0 20 40 60 AMBIENT TEMPERATURE : Ta[℃] 80 Figure 12. CLK27M Duty 7/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF) 2.4 2.4 VDD=3.3V 2.0 2.0 1.6 1.6 Rise-Time : Tr[nsec] Rise-Time : Tr[nsec] Ta=25°C 1.2 0.8 0.4 1.2 0.8 0.4 0.0 0.0 3.10 3.20 3.30 3.40 SUPPLY VOLTAGE : VDD[V] 3.50 -20 80 Figure 14. CLK27M Rise-Time Figure 13. CLK27M Rise-Time 1.4 1.4 VDD=3.3V Ta=25°C 1.2 1.2 1.0 1.0 Fall-Time : Tf[nsec] Fall-Time : Tf[nsec] 0 20 40 60 AMBIENT TEMPERATURE : Ta[℃] 0.8 0.6 0.4 0.2 0.8 0.6 0.4 0.2 0.0 0.0 3.10 3.20 3.30 3.40 SUPPLY VOLTAGE : VDD[V] 3.50 0 20 40 60 AMBIENT TEMPERATURE : Ta[℃] 80 Figure 16. CLK27M Fall-Time Figure 15. CLK27M Fall-Time www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -20 8/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF) 280 280 VDD=3.3V 240 Period-Jitter MIN-MAX : JsABS[psec] Period-Jitter MIN-MAX : JsABS[psec] Ta=25°C 200 160 120 80 40 0 240 200 160 120 80 40 0 3.1 3.2 3.3 3.4 SUPPLY VOLTAGE : VDD[V] 3.5 -20 80 Figure 18. CLKOUT Period-Jitter MIN-MAX Figure 17. CLKOUT Period-Jitter MIN-MAX 55 55 VDD=3.3V Ta=25°C 54 54 53 53 52 52 Duty : Duty[%] Duty : Duty[%] 0 20 40 60 AMBIENT TEMPERATURE : Ta[℃] 51 50 49 51 50 49 48 48 47 47 46 46 45 45 3.1 3.2 3.3 3.4 SUPPLY VOLTAGE : VDD[V] 3.5 0 20 40 60 AMBIENT TEMPERATURE : Ta[℃] 80 Figure 20. CLKOUT Duty Figure 19. CLKOUT Duty www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -20 9/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF) 2.4 2.4 VDD=3.3V 2.0 2.0 1.6 1.6 Rise-Time : Tr[nsec] Rise-Time : Tr[nsec] Ta=25°C 1.2 0.8 0.4 1.2 0.8 0.4 0.0 0.0 3.10 3.20 3.30 3.40 SUPPLY VOLTAGE : VDD[V] 3.50 -20 80 Figure 22. CLKOUT Rise-Time Figure 21. CLKOUT Rise-Time 1.4 1.4 VDD=3.3V Ta=25°C 1.2 1.2 1.0 1.0 Fall-Time : Tf[nsec] Fall-Time : Tf[nsec] 0 20 40 60 AMBIENT TEMPERATURE : Ta[℃] 0.8 0.6 0.4 0.2 0.8 0.6 0.4 0.2 0.0 0.0 3.10 3.20 3.30 3.40 SUPPLY VOLTAGE : VDD[V] 3.50 0 20 40 60 AMBIENT TEMPERATURE : Ta[℃] 80 Figure 24. CLKOUT Fall-Time Figure 23. CLKOUT Fall-Time www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -20 10/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Typical Wave Forms (VDD=3.3v, Ta=25°C, Spread-Spectrum ON setting) CLKOUT (10dB/div.) CLKOUT (10dB/div.) FREQUENCY (500kHz/div.) Figure 25. CLKOUT±0.25% Modulation Spectrum FREQUENCY (500kHz/div.) Figure 26. CLKOUT±0.50% Modulation Spectrum CLKOUT (10dB/div.) CLKOUT (10dB/div.) FREQUENCY (500kHz/div.) Figure 27. CLKOUT±0.75% Modulation Spectrum www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 FREQUENCY (500kHz/div.) Figure 28. CLKOUT±1.00% Modulation Spectrum 11/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Typical Wave Forms (VDD=3.3v, Ta=25°C, Spread-Spectrum ON setting) CLKOUT (60psec/div.) TIME (20μsec/div.) Figure 29. CLKOUT±0.25% Modulation Waveform CLKOUT (78psec/div.) TIME (20μsec/div.) Figure 30. CLKOUT±0.50% Modulation Waveform CLKOUT (93psec/div.) TIME (20μsec/div.) Figure 31. CLKOUT±0.75% Modulation Waveform CLKOUT (113psec/div.) TIME (20μsec/div.) Figure 32. CLKOUT±1.00% Modulation Waveform www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF) 36.5 36.5 Ta=25°C VDD=3.3V 36.0 Modulation-Frequency : Fmod[kHz] Modulation-Frequency : Fmod[kHz] 36.0 35.5 35.0 34.5 34.0 33.5 33.0 35.5 35.0 34.5 34.0 33.5 33.0 32.5 32.5 3.10 3.20 3.30 3.40 SUPPLY VOLTAGE : VDD[V] 3.50 -20 80 Figure 34. CLKOUT ±0.50% Modulation Frequency Figure 33. CLKOUT ±0.50% Modulation Frequency 0.60 0.60 VDD=3.3V Ta=25°C 0.58 0.58 0.56 0.56 0.54 0.54 Modulation-Rate [%] Modulation-Rate [%] 0 20 40 60 AMBIENT TEMPERATURE : Ta[℃] 0.52 0.50 0.48 0.46 0.52 0.50 0.48 0.46 0.44 0.44 0.42 0.42 0.40 0.40 3.10 3.20 3.30 3.40 SUPPLY VOLTAGE : VDD[V] 3.50 -20 0 20 40 60 AMBIENT TEMPERATURE : Ta[℃] 80 Figure 36. CLKOUT ±0.50% Modulation Rate Figure 35. CLKOUT ±0.50% Modulation Rate Modulation Frequency has a same characteristic despite a Modulation control. Modulation Rate has a same trend despite a control. www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF) 360 360 VDD=3.3V 300 Cycle-to-Cycle Jitter : JsCyCy[psec] Cycle-to-Cycle Jitter : JsCyCy[psec] Ta=25°C 240 180 120 60 0 300 240 180 120 60 0 3.1 3.2 3.3 3.4 SUPPLY VOLTAGE : VDD[V] 3.5 -20 80 Figure 38. CLKOUT ±0.25% Modulation Figure 37. CLKOUT ±0.25% Modulation Cycle-to-Cycle Jitter Cycle-to-Cycle Jitter 360 360 Ta=25°C VDD=3.3V 300 Cycle-to-Cycle Jitter : JsCyCy[psec] Cycle-to-Cycle Jitter : JsCyCy[psec] 0 20 40 60 AMBIENT TEMPERATURE : Ta[℃] 240 180 120 60 0 300 240 180 120 60 0 3.1 3.2 3.3 3.4 SUPPLY VOLTAGE : VDD[V] 3.5 -20 80 Figure 40. CLKOUT ±0.50% Modulation Figure 39. CLKOUT ±0.50% Modulation Cycle-to-Cycle Jitter www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 20 40 60 AMBIENT TEMPERATURE : Ta[℃] Cycle-to-Cycle Jitter 14/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF) 360 360 VDD=3.3V 300 Cycle-to-Cycle Jitter : JsCyCy[psec] Cycle-to-Cycle Jitter : JsCyCy[psec] Ta=25°C 240 180 120 60 0 300 240 180 120 60 0 3.1 3.2 3.3 3.4 SUPPLY VOLTAGE : VDD[V] 3.5 -20 80 Figure 42. CLKOUT ±0.75% Modulation Figure 41. CLKOUT ±0.75% Modulation Cycle-to-Cycle Jitter Cycle-to-Cycle Jitter 360 360 Ta=25°C VDD=3.3V 300 Cycle-to-Cycle Jitter : JsCyCy[psec] Cycle-to-Cycle Jitter : JsCyCy[psec] 0 20 40 60 AMBIENT TEMPERATURE : Ta[℃] 240 180 120 60 0 300 240 180 120 60 0 3.1 3.2 3.3 3.4 SUPPLY VOLTAGE : VDD[V] 3.5 -20 80 Figure 44. CLKOUT ±1.00% Modulation Figure 43. CLKOUT ±1.00% Modulation Cycle-to-Cycle Jitter www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 20 40 60 AMBIENT TEMPERATURE : Ta[℃] Cycle-to-Cycle Jitter 15/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF) 60 60 Ta=25°C VDD=3.3V 56 Operating Current : Icc[mA] Operating Current : Icc[mA] 56 52 48 44 52 48 44 40 40 3.1 3.2 3.3 3.4 SUPPLY VOLTAGE : VDD[V] 3.5 -20 0 20 40 60 AMBIENT TEMPERATURE : Ta[℃] 80 Figure 46. Operating Current Figure 45. Operating Current 120 VDD=3.3v, Ta=25°C Crystal Pullability : fp[ppm] 80 40 0 -40 -80 -120 -160 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 VCXO-Control-Voltage : Vctrl[V] 2.4 2.7 3.0 3.3 Figure 47. VCXO Crystal Pullability VCXO Crystal Pullability has been gathered from following the evaluation environment. Evaluation board: 70mm x 70mm x 1.6mm, 4 layers、FR-4 Using parts : 27MHz Crystal (DSX321G・8pF load) made in DAISHINKU CORP. RD=200Ω, CL=4pF VCXO Crystal Pullability modulates by a using crystal and a board condition. In order to use, should be checked matting with a final board condition. www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Typical Application Circuit In the case of Spread-Spectrum Modulation Rate =±0.75% setting, 7Pin_MODSEL1 connects GND, and 8Pin_MODSEL2 connect Power supply directly following the diagram. In the case of other Modulation Rate setting, should be changed connections as a Table of Spread-Spectrum Modulation (P3). (In the case of ±0.50% setting, it is no problem that 7Pin_MODSEL1 and 8Pin_MODSEL2 are OPEN Manages.) 3.3V (Typ.) CL 27MHz Crystal CL RD XOUT XIN AVDD1 PDB AVSS1 CLKOUT VCTRL VDD AVDD2 VSS AVSS2 SSON MODSEL1 TEST MODSEL2 CLK27M 0.1μF 0.1μF 0.1μF Figure 48. Modulation Rate =±0.75% setting Typical Application Circuit In the case of Spread-Spectrum OFF setting, 11Pin_SSON connect GND directly as the following diagram. (In the case of using Spread-Spectrum, it is no problem that 11Pin_SSON are OPEN Manages.) 3.3V (Typ.) CL 27MHz Crystal CL RD XOUT XIN AVDD1 PDB AVSS1 CLKOUT VCTRL VDD AVDD2 VSS AVSS2 SSON MODSEL1 TEST MODSEL2 CLK27M 0.1μF 0.1μF 0.1μF Figure 49. Spread-Spectrum OFF setting Typical Application Circuit www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Application Information Basically, mount ICs to the printed circuit board for use. (If the ICs are not mounted to the printed circuit board, the characteristics of ICs may not be fully demonstrated.) Mount 0.1µF capacitors in the vicinity of the IC Pins between 2Pin_AVDD1, 3Pin_AVSS1, and 5Pin_AVDD2, 6Pin_AVSS2, and 12Pin_VSS, 13Pin_VDD respectively. To obtain accurate frequency, confirm the Crystal-matching with the last board to get rid of a problem by a mass-production. Depending on the conditions of the printed circuit board, mount an additional electrolytic capacitor between the power supply and GND terminal. For EMI protection, it is effective to put ferrite beads in the origin of power supply to be fed to BU3087FV from the printed circuit board or to insert a capacitor (of 1Ω or less), which bypasses high frequency desired, between the power supply and the GND terminal. For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of wiring. Typical Application Circuit is recommendation, but in order to use, thoroughly check to be sure characteristic. ●Power Dissipation (SSOP-B16 package) POWER DISSIPATION : Pd [mW] 700 600 500 400 300 200 100 0 0 25 50 75 AMBIENT TEMPERATURE : Ta [℃] 100 125 * 70mm x 70mm x 1.6mm Glass Epoxy Board Figure 50. Power Dissipation Curve (Pd-Ta Curve) www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●I/O Equivalence Circuit Pin No. Equivalent Circuit Schmitt-trigger Pin 7, 11, 15 ( with Pull-Up ) 8, 10 ( with Pull-Down ) To IC inside VCXO Control Input Pin 4 To IC inside From IC inside Clock Output Pin 9, 14 From IC inside www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●I/O Equivalence Circuit Pin No. Equivalent Circuit Crystal Input Pin 1 To IC inside From IC inside Crystal Output Pin 16 From IC inside www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Operational Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Ordering Information B U 3 0 8 7 Part Number F V - Package FV : SSOP-B16 E2 Packaging and forming specification E2: Embossed tape and reel ●Physical Dimension Tape and Reel Information SSOP-B16 5.0±0.2 9 0.3Min. 4.4±0.2 6.4±0.3 16 1 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 8 0.10 1.15±0.1 0.15±0.1 0.1 0.65 1pin 0.22±0.1 Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagram SSOP-B16(TOP VIEW) Part Number Marking 3087F LOT Number 1PIN MARK www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet BU3087FV ●Revision History Date Revision 17.AUG.2012 001 Changes New Release www.rohm.com ©j 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/23 TSZ02201-0E3E0J500040-1-2 17.AUG.2012 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001