BU33SD2MG-MTR

Datasheet CMOS LDO Regulators for Automotive Equipments 1ch 200mA CMOS LDO Regulators BUxxSD2-M series ●General Description BUxxSD2-M series are high-performance CMOS LDO regulators with output current ability of up to 200-mA. These devices have excellent noise and load response characteristics despite of its low circuit current consumption of 33µA. They are most appropriate for various applications such as power supplies for logic IC, RF, and camera modules. ●Key Specifications ◼ Input Power Supply Voltage Range: 1.7V to 6.0V ◼ Output Current Range: 0 to 200mA ◼ Operating Temperature Range: -40℃ to +105℃ ◼ Output Voltage Lineup: 1.2V,1.5V,1.8V,2.5V 2.8V,3.0V,3.3V ◼ Output Voltage Accuracy: ±2.0% ◼ Circuit Current: 33µA(Typ.) ◼ Standby Current: 0μA (Typ.) ●Package SSOP5 ●Features ◼ High Output Voltage Accuracy: 2.0% (In all recommended conditions) ◼ High Ripple Rejection: 68 dB (Typ, 1 kHz,) ◼ Compatible with small ceramic capacitor (Cin=Cout=0.47 µF) ◼ Low Current Consumption: 33 µA ◼ Output Voltage ON/OFF control ◼ Built-in Over Current Protection Circuit (OCP) ◼ Built-in Thermal Shutdown Circuit (TSD) ◼ Package SSOP5 is similar to SOT23-5(JEDEC) W(Typ.) x D(Typ.) x H(Max.) 2.90mm x 2.80mm x 1.25mm ●Applications ◼ Automotive equipments. ◼ Portable devices ◼ Camera modules ◼ Other electronic devices using microcontrollers or logic circuits ◼ AEC-Q100 qualified ●Typical Application Circuit Vin VOUT VIN Cin Vout Cout BUxxSD2MG-M BUxxSD2-M On Off STBY GND Figure 1. Typical Application Circuit ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Pin Configuration N.C. VOUT Lot. No Marking VIN GND STBY ●Pin Description Pin No. Symbol Function 1 VIN Input Pin 2 GND GND Pin 3 STBY Output Control Pin (High:ON, Low:OFF) 4 N.C. No Connect 5 VOUT Output Pin ●Block Diagram VIN VIN 1 VREF VOUT Cin VOUT 5 GND 2 OCP Cout TSD VSTBY STBY 3 STBY 4 N.C. Cin(min)=0.47µF (Ceramic) Cout(min)=0.47µF (Ceramic) Figure 2. Block diagram www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Absolute Maximum Ratings Parameter Symbol Rating Unit VMAX -0.3 to +6.5 V Power Dissipation Pd 540(*1) mW Maximum Junction Temperature Tjmax +125 ℃ Operating Temperature Range Topr -40 to +105 ℃ Storage Temperature Range Tstg -55 to +125 ℃ Maximum Power Supply Voltage Range (*1) Derate by 5.6mW/℃ when operating above Ta=25℃.(When mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer) ●Recommended Operating Ratings Parameter Symbol Limit Unit Input Power Supply Voltage Range VIN 1.7 to 6.0 V Maximum Output Current IMAX 200 mA ●Recommended Operating Conditions Parameter Symbol Input capacitor Output capacitor Rating Unit Conditions － µF A ceramic capacitor is recommended. － µF A ceramic capacitor is recommended. Min. Typ. Max. Cin 0.47(*2) 1.0 Cout 0.47(*2) 1.0 (*2) Set the value of the capacitor so that it does not fall below the minimum value. Take into consideration the temperature characteristics, characteristics, and degradation with time. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/35 DC device TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Electrical Characteristics (Unless otherwise noted, Ta=-40 to 105℃, VIN=VOUT+1.0V(*3), VSTBY=1.5V, Cin=1μF, Cout=1μF.) Limit PARAMETER Symbol Unit Conditions MIN. TYP. MAX. Output Voltage VOUT Line Regulation VDLI VOUT ×0.98 - VOUT VOUT ×1.02 V 4 10 mV 6 15 mV Load Regulation1 VDLO1 - 0.5 5 mV Load Regulation2 VDLO2 Dropout Voltage VDROP Maximum Output Current Limit Current Short Current Circuit Current Circuit Current (STBY) Ripple Rejection Ratio IOMAX ILMAX ISHORT IGND ICCST R.R. 200 250 - 1 400 280 180 150 110 100 85 400 100 33 68 10 700 550 370 290 220 180 150 200 80 2.0 - mV mV mV mV mV mV mV mV mA mA mA µA µA dB Load Transient Response VLOT - ±65 - mV Line Transient Response VLIT - ±5 - mV VNOIS - 30 - TST - 100 300 µsec VSTBH VSTBL 1.1 -0.2 - VIN 0.5 V V ISTBY - - 4.0 µA Output Noise Voltage Startup Time STBY Control Voltage ON OFF STBY Pin Current IOUT=0 to 200mA, VOUT≧2.5V, VIN=VOUT+0.5 to 6.0V VOUT＜2.5V, VIN=3.0 to 6.0V Ta=-40 to +105℃ (*4,5,6) IOUT=10mA VOUT≦2.5V, VIN=3.0 to 6.0V IOUT=10mA VOUT＞2.5V, VIN=VOUT+0.5 to 6.0V IOUT=1 to 100mA IOUT=1 to 200mA 1.0V≦VOUT＜1.2V, IOUT=100mA 1.2V≦VOUT＜1.5V, IOUT=100mA 1.5V≦VOUT＜1.7V, IOUT=100mA 1.7V≦VOUT＜2.1V, IOUT=100mA 2.1V≦VOUT＜2.5V, IOUT=100mA 2.5V≦VOUT＜2.8V, IOUT=100mA 2.8V≦VOUT, IOUT=100mA VIN=VOUT+1.0V (*3) Vo=VOUT×0.98, Ta=25℃ Vo=0V, Ta=25℃ IOUT=0mA VSTBY=0V VRR=-20dBv,fRR=1kHz,IOUT=10mA IOUT=1 to 150mA,Trise=Tfall=1µs, VIN=VOUT+1.0V (*5) VIN=VOUT+0.5 to VOUT+1.0V, Trise=Tfall =10µs µVrms Bandwidth 10 to 100kHz Output Voltage settled within tolerances (*7) Ta=25℃ (*3) VIN=3.5V for VOUT＜2.5V. (*4) Operating Conditions are limited by Pd. (*5) Typical values apply for Ta=25℃. (*6) VIN=3.0V to 6.0V for VOUT＜2.5V. (*7) Startup time=time from EN assertion to VOUT×0.98 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.) 1.4 1.25 1.24 1.2 Output Voltage VOUT (V) Output Voltage VOUT (V) 1.23 1.0 IOUT=0mA IOUT=50mA IOUT=200mA 0.8 0.6 0.4 1.21 1.20 IOUT=0mA IOUT=50mA IOUT=200mA 1.19 1.18 1.17 Ta=25℃ VIN=VSTBY 0.2 1.22 Ta=25℃ VIN=VSTBY 1.16 0.0 1.15 0.0 1.0 2.0 3.0 4.0 Input Voltage VIN (V) 5.0 6.0 0.0 50 1.25 45 1.24 40 1.23 35 30 Ta=105℃ Ta=25℃ Ta=-40℃ 25 20 2.0 3.0 4.0 Input Voltage VIN (V) 15 6.0 Ta=25℃ Ta=105℃ Ta=-40℃ 1.22 1.21 1.20 1.19 1.18 VIN=3.5V VSTBY=1.5V 1.17 10 VIN=VSTBY IOUT=0mA 5 5.0 Figure 4. Line Regulation Output Voltage VOUT (V) Circuit Current IGND (μA) Figure 3. Output Voltage vs. Input Voltage 1.0 1.16 1.15 0 0.0 1.0 2.0 3.0 4.0 Input Voltage VIN (V) 5.0 6.0 50 100 150 200 Output Current IOUT (mA) Figure 5. Circuit Current vs. Input Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Figure 6. Load Regulation 5/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 1.40 90 1.20 70 Output Voltage VOUT (V) Circuit Current IGND (μA) 80 Ta=105℃ Ta=25℃ Ta=-40℃ 60 50 40 30 VIN=3.5V VSTBY=1.5V 20 1.00 VIN=6.0V VIN=3.5V VIN=3.0V 0.80 0.60 0.40 Ta=25℃ VSTBY=1.5V 0.20 10 0 0.00 0 50 100 150 Output Current IOUT (mA) 200 0 100 1.25 100 1.24 90 1.23 80 1.22 1.21 1.20 1.19 VIN=3.5V VSTBY=1.5V IOUT=0.1mA 1.18 1.17 70 60 50 40 30 10 1.15 0 -20 0 20 40 60 Temperature Ta (℃) 80 100 -40 Figure 9. Output Voltage vs. Temperature www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VIN=3.5V VSTBY=1.5V IOUT=0.1mA 20 1.16 -40 500 Figure 8. OCP Threshold Circuit Current IGND (μA) Output Voltage VOUT (V) Figure 7. Circuit Current vs. Output Current 200 300 400 Output Current IOUT (mA) -20 0 20 40 60 Temperature Ta (℃) 80 100 Figure 10. Circuit Current vs. Temperature 6/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.) 1.4 100 90 Circuit Current at STBY ICCST (nA) Output Voltage VOUT (V) 1.2 Ta=105℃ Ta=25℃ Ta=-40℃ 1.0 0.8 0.6 0.4 0.2 VIN=3.5V IOUT=0.1mA 0.0 0.00 80 70 60 50 40 30 VIN=6.0V VSTBY=0V 20 10 0 0.25 0.50 0.75 1.00 1.25 STBY Pin Voltage VSTBY (V) 1.50 Figure 11. STBY Threshold -40 -20 0 20 40 60 Temperature Ta (℃) 80 100 Figure 12. Circuit Current ( at STBY) vs. Temperature 2.0 STBY Pin Current ISTBY (μA) 1.8 1.6 1.4 1.2 Ta=105℃ Ta=25℃ Ta=-40℃ 1.0 0.8 0.6 0.4 0.2 0.0 0.0 1.0 2.0 3.0 4.0 5.0 STBY Pin Voltage VSTBY (V) 6.0 Figure 13. STBY Pin Current vs. STBY Pin Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.) 50 90 45 Output Noise Voltage VNOIS (μVrms) 100 Ripple Rejection Ratio R.R. (dB) 80 70 60 50 Ta=25℃ VIN=3.5V VRR=-20dBv VSTBY=1.5V IOUT=10mA Cin=Cout=1µF 40 30 20 10 40 35 30 25 20 Ta=25℃ VIN=3.5V VSTBY=1.5V Cin=Cout=1µF Bndwidth 10 to 100kHz 15 10 5 0 0 100 1000 10000 Frequency (Hz) 100000 Figure 14. Ripple Rejection Ratio vs. Frequency 0 50 100 150 Output Current IOUT (mA) 200 Figure 15. Output Noise Voltage vs. Output Current Output Spectral Noise Density (μV/√Hz) 10 1 0.1 Ta=25℃ VIN=3.5V VSTBY=1.5V IOUT=10mA Cin=Cout=1µF 0.01 10 100 1000 10000 Frequency (Hz) 100000 Figure 16.Output Spectral Noise Density vs. Frequency www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 100mA IOUT 200 1mA 100mA/div 0 VIN =3.5V,VSTBY=1.5V Trise＝Tfall=1μs, Cin=Cout=1μF 150mA 100 IOUT 1mA 100mA/div 1.20 1.30 VOUT VOUT 1.20 100mV/div 1.10 100mV/div 1.10 Figure 18. Load Response (1mA to 150mA) Figure 17. Load Response (1mA to 100mA) 2.0V/div 4.0 Slew Rate＝1V/μs 2.0 0.0 1ms/div 1.22 2.0V/div 6.0V 6.0 4.0 3.0V Output Volatage(V) Output Volatage(V) 3.0V 3.5V VIN =VSTBY Slew Rate＝1V/μs 2.0 Input Voltage(V) VIN =VSTBY Input Voltage(V) 6.0 1.20 0 20μs/div Output Volatage(V) Output Volatage(V) 20μs/div 1.30 200 Output Current(mA) Trise＝Tfall=1μs, Cin=Cout=1μF Output Current(mA) VIN =3.5V,VSTBY=1.5V 0.0 1ms/div 1.22 VOUT 20mV/div 1.18 1.20 VOUT 20mV/div 1.18 IOUT=10mA Cout=1.0μF Figure 19. Line Transient Response (3.0 to 3.5V) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 IOUT=10mA Cout=1.0μF Figure 20. Line Transient Response (3.0 to 6.0V) 9/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.) 0.0 20μs/div 2.0 1.0 0.0 Cout=0.47μF 1.0V/div Cout=1.0μF Cout=2.2μF VOUT VIN =3.5V 0.0 0V 20μs/div 2.0 1.0 0.0 VIN =3.5V Figure 22. Startup Time (ROUT=6Ω) 1.0 Output Volatage(V) 0V 400ms/div Cout=0.47μF Cout=1.0μF Cout=2.2μF 0.0 VIN =3.5V 1.0V/div 0.0 VSTBY 0V 0.0 20μs/div 2.0 1.0 VOUT Cout=0.47μF Cout=1.0μF Cout=2.2μF 0.0 Figure 23. Discharge Time (ROUT=none) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1.0 1.0V/div Output Volatage(V) 1.0V/div 2.0 1.5V STBY Pin Voltage(V) VSTBY STBY Pin Voltage(V) 2.0 1.5V 1.0 VOUT Cout=0.47μF 1.0V/div Cout=1.0μF Cout=2.2μF VOUT Figure 21. Startup Time (ROUT=none) 2.0 1.0V/div 1.0 1.5V VSTBY Output Volatage(V) Output Volatage(V) 0V 2.0 STBY Pin Voltage(V) 1.0V/div 1.0 1.5V VSTBY STBY Pin Voltage(V) 2.0 1.0V/div VIN =3.5V Figure 24. Discharge Time (ROUT=6Ω) 10/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series 2.0 1.85 1.8 1.84 1.6 1.83 Output Voltage VOUT (V) Output Voltage VOUT (V) ●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.) 1.4 1.2 IOUT=0mA IOUT=50mA IOUT=200mA 1.0 0.8 0.6 0.4 1.81 1.80 IOUT=0mA IOUT=50mA IOUT=200mA 1.79 1.78 1.77 Ta=25℃ VIN=VSTBY 0.2 1.82 Ta=25℃ VIN=VSTBY 1.76 0.0 1.75 0.0 1.0 2.0 3.0 4.0 Input Voltage VIN (V) 5.0 6.0 0.0 Figure 25. Output Voltage vs. Input Voltage 2.0 3.0 4.0 Input Voltage VIN (V) 5.0 6.0 Figure 26. Line Regulation 60 1.85 Ta=105℃ Ta=25℃ Ta=-40℃ 1.83 40 30 20 VIN=VSTBY IOUT=0mA 10 Ta=25℃ Ta=-40℃ Ta=105℃ 1.84 Output Voltage VOUT (V) 50 Circuit Current IGND (μA) 1.0 1.82 1.81 1.80 1.79 VIN=3.5V VSTBY=1.5V 1.78 1.77 1.76 1.75 0 0.0 1.0 2.0 3.0 4.0 Input Voltage VIN (V) 5.0 6.0 50 100 150 200 Output Current IOUT (mA) Figure 27. Circuit Current vs. Input Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Figure 28. Load Regulation 11/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.) 2.00 100 90 1.60 Output Voltage VOUT (V) 80 Circuit Current IGND (μA) 1.80 Ta=105℃ Ta=25℃ Ta=-40℃ 70 60 50 40 30 VIN=3.5V VSTBY=1.5V 20 VIN=6.0V VIN=3.5V VIN=3.0V 1.40 1.20 1.00 0.80 0.60 Ta=25℃ VSTBY=1.5V 0.40 10 0.20 0 0.00 0 50 100 150 Outut Current IOUT (mA) 200 0 100 1.85 100 1.84 90 1.83 80 1.82 1.81 1.80 1.79 VIN=3.5V VSTBY=1.5V IOUT=0.1mA 1.78 1.77 500 Figure 30. OCP Threshold Circuit Current IGND (μA) Output Voltage VOUT (V) Figure 29. Circuit Current vs. Output Current 200 300 400 Output Current IOUT (mA) 70 60 50 40 30 VIN=3.5V VSTBY=1.5V IOUT=0.1mA 20 1.76 10 1.75 0 -40 -20 0 20 40 60 Temperature Ta (℃) 80 100 Figure 31. Output Voltage vs. Temperature www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -40 -20 0 20 40 60 Temperature Ta (℃) 80 100 Figure 32. Circuit Current vs. Temperature 12/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 1.8 90 Ta=105℃ Ta=25℃ Ta=-40℃ 1.6 Output Voltage VOUT (V) Circuit Current at STBY ICCST (nA) 2.0 1.4 1.2 1.0 0.8 0.6 0.4 VIN=3.5V IOUT=0.1mA 0.2 0.0 0.00 80 70 60 50 40 30 VIN=6.0V VSTBY=0V 20 10 0 0.25 0.50 0.75 1.00 1.25 STBY Pin Voltage VSTBY (V) 1.50 -40 -20 0 20 40 60 Temperature Ta (℃) 80 100 Figure 34. Circuit Current (at STBY) vs. Temperature Figure 33. STBY Threshold 2.0 STBY Pin Current ISTBY (μA) 1.8 1.6 1.4 1.2 Ta=105℃ Ta=25℃ Ta=-40℃ 1.0 0.8 0.6 0.4 0.2 0.0 0.0 1.0 2.0 3.0 4.0 5.0 STBY Pin Voltage VSTBY (V) 6.0 Figure 35. STBY Pin Current vs. STBY Pin Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.) 50 90 45 Output Noise Voltage VNOIS (μVrms) 100 Ripple Rejection Ratio R.R. (dB) 80 70 60 50 Ta=25℃ VIN=3.5V VRR=-20dBv VSTBY=1.5V IOUT=10mA Cin=Cout=1μF 40 30 20 10 40 35 30 25 20 Ta=25℃ VIN=3.5V VSTBY=1.5V Cin=Cout=1μF Bndwidth 10 to 100kHz 15 10 5 0 0 100 1000 10000 Frequency (Hz) 100000 Figure 36. Ripple Rejection Ratio vs. Frequency 0 50 100 150 Output Current IOUT (mA) 200 Figure 37. Output Noise Voltage vs. Output Current Output Spectral Noise Density (μV/√Hz) 10 1 0.1 Ta=25℃ VIN=3.5V VSTBY=1.5V IOUT=10mA Cin=Cout=1μF 0.01 10 100 1000 10000 Frequency (Hz) 100000 Figure 38.Output Spectral Noise Density vs. Frequency www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 100mA IOUT 200 1mA 100mA/div 0 VIN =3.5V,VSTBY=1.5V 150mA IOUT Output Volatage(V) Output Volatage(V) 1.80 1mA 100mA/div 0 20μs/div 1.90 VOUT VOUT 1.80 100mV/div 1.70 100mV/div 1.70 Figure 39. Load Response (1mA to 100mA) Figure 40. Load Response (1mA to 150mA) 2.0V/div 4.0 Slew Rate＝1V/μs 2.0 0.0 1ms/div 1.82 6.0V 2.0V/div 6.0 4.0 3.0V Output Volatage(V) 3.0V 3.5V VIN =VSTBY Slew Rate＝1V/μs 2.0 Input Voltage(V) VIN =VSTBY Input Voltage(V) 6.0 1.80 200 100 20μs/div 1.90 Output Volatage(V) Trise＝Tfall=1μs, Cin=Cout=1μF Output Current(mA) Trise＝Tfall=1μs, Cin=Cout=1μF Output Current(mA) VIN =3.5V,VSTBY=1.5V 0.0 1ms/div 1.82 20mV/div VOUT 1.78 20mV/div 1.80 VOUT 1.78 IOUT=10mA Cout=1.0μF Figure 41. Line Transient Response (3.0 to 3.5V) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 IOUT=10mA Cout=1.0μF Figure 42. Line Transient Response (3.0 to 6.0V) 15/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.) VSTBY 0.0 20μs/div 2.0 1.0V/div 1.0 0.0 Cout=0.47μF Cout=1.0μF Cout=2.2μF VOUT VIN =3.5V VSTBY 0.0 0V 20μs/div 2.0 1.0V/div 1.0 0.0 VIN =3.5V Figure 44. Startup Time (ROUT=9Ω) Output Volatage(V) 0V 400ms/div 0.0 Cout=0.47μF Cout=1.0μF Cout=2.2μF 1.0V/div VIN =3.5V 0.0 VSTBY 0V 0.0 20μs/div 2.0 1.0 VOUT 0.0 Figure 45. Discharge Time (ROUT=none) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1.0 1.0V/div Output Volatage(V) 1.0 1.0V/div 2.0 1.5V STBY Pin Voltage(V) VSTBY STBY Pin Voltage(V) 2.0 1.5V 1.0 Cout=0.47μF Cout=1.0μF Cout=2.2μF VOUT Figure 43. Startup Time (ROUT=none) 2.0 VOUT 1.0V/div 1.0 1.5V Output Volatage(V) Output Volatage(V) 0V 2.0 STBY Pin Voltage(V) 1.0V/div 1.0 1.5V STBY Pin Voltage(V) 2.0 Cout=0.47μF Cout=1.0μF Cout=2.2μF 1.0V/div VIN =3.5V Figure 46. Discharge Time (ROUT=9Ω) 16/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.) 3.0 2.55 2.54 2.53 Output Voltage VOUT (V) Output Voltage VOUT (V) 2.5 2.0 1.5 IOUT=0mA IOUT=50mA IOUT=200mA 1.0 2.52 2.51 2.50 IOUT=0mA IOUT=50mA IOUT=200mA 2.49 2.48 2.47 0.5 Ta=25℃ VIN=VSTBY Ta=25℃ VIN=VSTBY 2.46 0.0 2.45 0.0 1.0 2.0 3.0 4.0 Input Voltage VIN (V) 5.0 6.0 0.0 Figure 47. Output Voltage vs. Input Voltage 2.0 3.0 4.0 Input Voltage VIN (V) 5.0 6.0 Figure 48. Line Regulation 60 2.55 Ta=105℃ Ta=25℃ Ta=-40℃ 2.54 40 30 20 10 Ta=25℃ Ta=-40℃ Ta=105℃ 2.53 Output Voltage VOUT (V) 50 Circuit Current IGND (μA) 1.0 2.52 2.51 2.50 2.49 2.48 VIN=3.5V VSTBY=1.5V 2.47 VIN=VSTBY IOUT=0mA 2.46 0 2.45 0.0 1.0 2.0 3.0 4.0 Input Voltage VIN (V) 5.0 6.0 0 100 150 200 Output Current IOUT (mA) Figure 49. Circuit Current vs. Input Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 50 Figure 50. Load Regulation 17/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.) 3.00 100 90 70 Output Voltage VOUT (V) Circuit Current IGND (μA) 2.50 Ta=105℃ Ta=25℃ Ta=-40℃ 80 60 50 40 30 VIN=3.5V VSTBY=1.5V 20 VIN=3.0V VIN=6.0V VIN=3.5V 2.00 1.50 1.00 0.50 Ta=25℃ VSTBY=1.5V 10 0.00 0 0 50 100 150 Outut Current IOUT (mA) 0 200 100 2.55 100 2.54 90 2.53 80 2.52 2.51 2.50 2.49 VIN=3.5V VSTBY=1.5V IOUT=0.1mA 2.48 2.47 500 Figure 52. OCP Threshold Circuit Current IGND (μA) Output Voltage VOUT (V) Figure 51. Circuit Current vs. Output Current 200 300 400 Output Current IOUT (mA) 70 60 50 40 30 20 2.46 VIN=3.5V VSTBY=1.5V IOUT=0.1mA 10 2.45 0 -40 -20 0 20 40 60 Temperature Ta (℃) 80 100 Figure 53. Output Voltage vs. Temperature www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -40 -20 0 20 40 60 Temperature Ta (℃) 80 100 Figure 54. Circuit Current vs. Temperature 18/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 3.0 90 Circuit Current at STBY ICCST (nA) Output Voltage VOUT (V) 2.5 Ta=105℃ Ta=25℃ Ta=-40℃ 2.0 1.5 1.0 0.5 VIN=3.5V IOUT=0.1mA 0.0 0.00 80 70 60 50 40 30 10 0 0.25 0.50 0.75 1.00 1.25 STBY Pin Voltage VSTBY (V) 1.50 -40 500 1.8 450 1.6 400 Dropout Voltage VDROP (mV) 2.0 1.4 1.2 Ta=105℃ Ta=25℃ Ta=-40℃ 1.0 0.8 -20 0 20 40 60 Temperature Ta (℃) 80 100 Figure 56. Circuit Current ( at STBY) vs. Temperature Figure 55. STBY Threshold STBY Pin Current ISTBY (μA) VIN=6.0V VSTBY=0V 20 0.6 0.4 0.2 VIN=0.98*VOUT VSTBY=1.5V 350 300 250 200 150 100 Ta=105℃ Ta=25℃ Ta=-40℃ 50 0.0 0 0.0 1.0 2.0 3.0 4.0 5.0 STBY Pin Voltage VSTBY (V) 6.0 50 100 150 Output Current IOUT (mA) 200 Figure 58. Dropout Voltage vs. Output Current Figure 57. STBY Pin Current vs. STBY Pin Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 19/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.) 50 90 45 Output Noise Voltage VNOIS (μVrms) 100 Ripple Rejection Ratio R.R. (dB) 80 70 60 50 Ta=25℃ VIN=3.5V VRR=-20dBv VSTBY=1.5V IOUT=10mA Cin=Cout=1μF 40 30 20 10 40 35 30 25 20 Ta=25℃ VIN=3.5V VSTBY=1.5V Cin=Cout=1μF Bndwidth 10 to 100kHz 15 10 5 0 0 100 1000 10000 Frequency (Hz) 100000 Figure 59. Ripple Rejection Ratio vs. Frequency 0 50 100 150 Output Current IOUT (mA) 200 Figure 60. Output Noise Voltage vs. Output Current Output Spectral Noise Density (μV/√Hz) 10 1 0.1 Ta=25℃ VIN=3.5V VSTBY=1.5V IOUT=10mA Cin=Cout=1μF 0.01 10 100 1000 10000 Frequency (Hz) 100000 Figure 61.Output Spectral Noise Density vs. Frequency www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 100mA 1mA 100mA/div 0 2.60 2.50 VIN =3.5V,VSTBY=1.5V 150mA IOUT 200 100 1mA 0 100mA/div 20μs/div 2.60 VOUT 2.50 100mV/div 2.40 VOUT 100mV/div 2.40 Figure 62. Load Response (1mA to 100mA) Figure 63. Load Response (1mA to 150mA) Slew Rate＝1V/μs 1ms/div 2.52 2.0 0.0 2.0V/div 6.0V 6.0 4.0 3.0V Output Volatage(V) 3.0V 2.0V/div 4.0 3.5V VIN =VSTBY Slew Rate＝1V/μs 2.0 Input Voltage(V) VIN =VSTBY Input Voltage(V) 6.0 Output Volatage(V) Trise＝Tfall=1μs, Cin=Cout=1μF 20μs/div Output Volatage(V) Output Volatage(V) IOUT 200 Output Current(mA) Trise＝Tfall=1μs, Cin=Cout=1μF Output Current(mA) VIN =3.5V,VSTBY=1.5V 0.0 1ms/div 2.52 2.50 VOUT 20mV/div 2.48 2.50 VOUT 20mV/div 2.48 IOUT=10mA Cout=1.0μF Figure 64. Line Transient Response (3.0 to 3.5V) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 IOUT=10mA Cout=1.0μF Figure 65. Line Transient Response (3.0 to 6.0V) 21/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.) 1.0V/div VSTBY 1.0 0.0 0V 2.0 1.0V/div 1.5V VSTBY 0.0 0V 1.0V/div Cout=0.47μF Cout=1.0μF Cout=2.2μF 1.0 0.0 20μs/div Output Volatage(V) Output Volatage(V) 20μs/div 2.0 VOUT VIN =3.5V 1.0V/div 2.0 Cout=0.47μF Cout=1.0μF Cout=2.2μF 1.0 0.0 VOUT VIN =3.5V Figure 66. Startup Time (ROUT=none) Figure 67. Startup Time (ROUT=12.5Ω) 1.0 Output Volatage(V) 0V 400ms/div 1.0 Cout=0.47μF Cout=1.0μF Cout=2.2μF 0.0 VIN =3.5V 1.0V/div 0.0 VSTBY 0V 0.0 20μs/div 2.0 VOUT 1.0 0.0 Figure 68. Discharge Time (ROUT=none) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1.0 1.0V/div Output Volatage(V) 1.0V/div 2.0 1.5V STBY Pin Voltage(V) VSTBY STBY Pin Voltage(V) 2.0 1.5V 2.0 VOUT 1.0 STBY Pin Voltage(V) 1.5V STBY Pin Voltage(V) 2.0 Cout=0.47μF Cout=1.0μF Cout=2.2μF 1.0V/div VIN =3.5V Figure 69. Discharge Time (ROUT=12.5Ω) 22/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.) 3.5 3.35 IOUT=0mA IOUT=50mA IOUT=200mA 3.34 3.0 Output Voltage VOUT (V) Output Voltage VOUT (V) 3.33 2.5 2.0 1.5 IOUT=0mA IOUT=50mA IOUT=200mA 1.0 0.5 3.32 3.31 3.30 3.29 3.28 3.27 Ta=25℃ VIN=VSTBY Ta=25℃ VIN=VSTBY 3.26 0.0 3.25 0.0 1.0 2.0 3.0 4.0 Input Voltage VIN (V) 5.0 6.0 0.0 Figure 70. Output Voltage vs. Input Voltage 1.0 2.0 3.0 4.0 Input Voltage VIN (V) 6.0 Figure 71. Line Regulation 3.35 70 Ta=25℃ Ta=-40℃ Ta=105℃ 3.34 60 Ta=105℃ Ta=25℃ Ta=-40℃ 50 3.33 Output Voltage VOUT (V) Circuit Current IGND (μA) 5.0 40 30 20 3.32 3.31 3.30 3.29 3.28 VIN=4.3V VSTBY=1.5V 3.27 10 VIN=VSTBY IOUT=0mA 3.26 3.25 0 0.0 1.0 2.0 3.0 4.0 Input Voltage VIN (V) 5.0 6.0 50 100 150 200 Output Current IOUT (mA) Figure 72. Circuit Current vs. Input Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Figure 73. Load Regulation 23/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 3.50 90 Ta=105℃ Ta=25℃ Ta=-40℃ Circuit Current IGND (μA) 80 3.00 2.50 70 (V) 60 OUT VIN=3.8V VIN=4.3V VIN=6.0V 2.00 50 1.50 40 30 1.00 VIN=4.3V VSTBY=1.5V 20 Output Voltag e V Ta=25℃ VSTBY=1.5V 0.50 10 0 0.00 0 50 100 150 Outut Current IOUT (mA) 0 200 100 3.34 90 3.33 80 Circuit Current IGND (μA) Output Voltage VOUT (V) 100 3.32 3.31 3.30 3.29 VIN=4.3V VSTBY=1.5V IOUT=0.1mA 50 40 30 0 20 40 60 Temperature Ta (℃) 80 -40 100 Figure 76. Output Voltage vs. Temperature www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VIN=4.3V VSTBY=1.5V IOUT=0.1mA 20 3.25 0 (mA) 60 10 -20 OUT 500 70 3.26 -40 400 Figure 75. OCP Threshold 3.35 3.27 300 Output Current I Figure 74. Circuit Current vs. Output Current 3.28 200 -20 0 20 40 60 Temperature Ta (℃) 80 100 Figure 77. Circuit Current vs. Temperature 24/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.) 3.5 100 90 Ta=105℃ Ta=25℃ Ta=-40℃ 2.5 Circuit Current at STBY ICCST (nA) Output Voltage VOUT (V) 3.0 2.0 1.5 1.0 0.5 VIN=4.3V IOUT=0.1mA 0.0 0.00 80 70 60 50 40 30 10 0 0.25 0.50 0.75 1.00 1.25 STBY Pin Voltage VSTBY (V) 1.50 -40 Figure 78. STBY Threshold 2.0 500 1.8 450 1.6 400 1.4 Ta=105℃ Ta=25℃ Ta=-40℃ 1.2 1.0 -20 0 20 40 60 Temperature Ta (℃) 80 100 Figure 79. Circuit Current ( at STBY) vs. Temperature Dropout Voltage VDROP (mV) STBY Pin Current ISTBY (μA) VIN=6.0V VSTBY=0V 20 0.8 0.6 0.4 VIN=0.98*VOUT VSTBY=1.5V 350 300 250 200 150 100 Ta=105℃ Ta=25℃ Ta=-40℃ 50 0.2 0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 STBY Pin Voltage VSTBY (V) 6.0 50 100 150 200 Output Current IOUT (mA) Figure 80. STBY Pin Current vs. STBY Pin Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Figure 81. Dropout Voltage vs. Output Current 25/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.) 90 45 Output Noise Voltage VNOIS (μVrms) 50 Ripple Rejection Ratio R.R. (dB) 100 80 70 60 50 Ta=25℃ VIN=4.3V VRR=-20dBv VSTBY=1.5V IOUT=10mA Cin=Cout=1μF 40 30 20 10 40 35 30 25 20 Ta=25℃ VIN=4.3V VSTBY=1.5V Cin=Cout=1μF Bndwidth 10 to 100kHz 15 10 5 0 0 100 1000 10000 Frequency (Hz) 100000 0 50 100 150 200 Output Current IOUT (mA) Figure 83. Output Noise Voltage vs. Output Current Figure 82. Ripple Rejection Ratio vs. Frequency Output Spectral Noise Density (μV/√Hz) 10 1 0.1 Ta=25℃ VIN=4.3V VSTBY=1.5V IOUT=10mA Cin=Cout=1μF 0.01 10 100 1000 10000 100000 Frequency (Hz) Figure 84.Output Spectral Noise Density vs. Frequency www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.) 100 100mA 1mA 100mA/div 0 150mA IOUT 100 1mA 0 100mA/div 20μs/div VOUT 3.30 100mV/div VOUT 100mV/div 3.20 Figure 85. Load Response (1mA to 100mA) Figure 86. Load Response (1mA to 150mA) 2.0V/div Slew Rate＝1V/μs 4.0 2.0 1ms/div 3.32 20mV/div VOUT 3.28 IOUT=10mA Cout=1.0μF 0.0 Output Volatage(V) 3.8V 4.3V VIN =VSTBY 3.8V Slew Rate＝1V/μs 6.0 4.0 2.0 0.0 1ms/div 20mV/div 3.32 3.30 VOUT 3.28 Figure 87. Line Transient Response (3.8 to 4.3V) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2.0V/div 6.0V Input Voltage(V) VIN =VSTBY Input Voltage(V) 6.0 Output Volatage(V) 200 3.40 3.20 3.30 Trise＝Tfall=1μs, Cin=Cout=1μF 20μs/div 3.40 3.30 VIN =4.3V,VSTBY=1.5V Output Volatage(V) Output Volatage(V) IOUT 200 Output Current(mA) Trise＝Tfall=1μs, Cin=Cout=1μF Output Current(mA) VIN =4.3V,VSTBY=1.5V IOUT=10mA Cout=1.0μF Figure 88. Line Transient Response (3.8 to 6.0V) 27/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.) 1.0V/div 1.0 VSTBY 0.0 0V 3.0 2.0 Cout=0.47μF Cout=1.0μF Cout=2.2μF 0.0 VOUT VSTBY VIN =4.3V 0.0 0V 3.0 1.0V/div 2.0 Cout=0.47μF Cout=1.0μF Cout=2.2μF 1.0 0.0 VOUT VIN =4.3V Figure 89. Startup Time (ROUT=none) Figure 90. Startup Time (ROUT=16.5Ω) 0V Output Volatage(V) 1.0s/div 2.0 VOUT 1.0 Cout=0.47μF Cout=1.0μF Cout=2.2μF 0.0 VIN =3.5V 1.0V/div 0.0 VSTBY 0V 3.0 2.0 VOUT 1.0 0.0 Figure 91. Discharge Time (ROUT=none) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1.0 1.0V/div Output Volatage(V) 1.0 1.0V/div 2.0 1.5V 0.0 STBY Pin Voltage(V) VSTBY STBY Pin Voltage(V) 2.0 1.5V 3.0 1.0 20μs/div 1.0V/div 1.0 1.0V/div 1.5V Output Volatage(V) Output Volatage(V) 20μs/div 2.0 STBY Pin Voltage(V) 1.5V STBY Pin Voltage(V) 2.0 40μs/div Cout=0.47μF Cout=1.0μF Cout=2.2μF 1.0V/div VIN =3.5V Figure 92. Discharge Time (ROUT=16.5Ω) 28/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Input/Output Capacitor Capacity value of ceramic capacitor - DC bias characteristics (Example) 10-V withstand voltage B1characteristics GRM188B11A105KA61D 10 0 -10 Capacitance Change [%] It is recommended that an input capacitor is placed near pins between the VCC pin and GND as well as an output capacitor between the output pin and GND. The input is valid when the power supply impedance is high or when the PCB trace has significant length. For the output capacitor, the greater the capacitance, the more stable the output will be depending on the load and line voltage variations. However, please check the actual functionality of this capacitor by mounting it on a board for the actual application. Ceramic capacitors usually have different, thermal and equivalent series resistance characteristics, and may degrade gradually over continued use. For additional details, please check with the manufacturer, and select the best ceramic capacitor for your application 10-V withstand voltage B characteristics -20 6.3-V withstand voltage B characteristics -30 10-V withstand voltage F characteristics -40 -50 -60 4-V withstand voltage X6S characteristics 10-V withstand voltage F characteristics -70 -80 -90 -100 0 0.5 1 1.5 2 2.5 3 3.5 4 DC Bias Voltage [V] Figure 93. Capacity-bias characteristics Capacitors generally have ESR (equivalent series resistance) and it operates stably in the ESR-IOUT area shown on the right. Since ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different ESR, please check the ESR of the capacitor to be used and use it within the stability area range shown in the right graph for evaluation of the actual application. 100 Unstable region 10 ESR[Ω] ●Equivalent Series Resistance (ESR) of a Ceramic Capacitor Stable region Cin=Cout=0.47μF　Ta=-40 to 105℃ 1 Stable region 0.1 0.01 0 50 100 IOUT[mA] 150 200 Figure 94. Stability area characteristics (Example) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 29/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Power Dissipation (Pd) As for power dissipation, an estimate of heat reduction characteristics and internal power consumption of IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as causing the operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare sufficient margin within power dissipation for usage. Calculation of the maximum internal power consumption of IC (PMAX) PMAX=(VIN-VOUT)×IOMAX Where : VIN=Input voltage VOUT= Output voltage IOMAX: Maximum output current) ○Measurement conditions Standard ROHM Board Layout of Board for Measurement Top Layer (Top View) IC Implementation Position Bottom Layer (Top View) Measurement State With board implemented (Wind speed 0 m/s) Board Material Glass epoxy resin (Double-side board) Board Size Wiring Rate 70 mm x 70 mm x 1.6 mm Top layer Metal (GND) wiring rate: Approx. 0% Bottom layer Metal (GND) wiring rate: Approx. 50% Through Hole Diameter 0.5mm x 6 holes Power Dissipation 0.54W θja=185.2℃/W Thermal Resistance 0.6 0.54W 0.5 Standard ROHM board Pd (W) 0.4 0.3 * Please design the margin so that PMAX is less than Pd (PMAXPd) within the usage temperature range 0.2 0.1 0 0 25 50 75 100 105 125 Ta (℃) Figure 95. SSOP5 Power dissipation heat reduction characteristics (Reference) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 30/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●I/O Equivalence Circuits 5pin (VOUT) 2pin (GND) 3pin (STBY) 1pin (VIN) VIN VIN VOUT STBY Figure 96. Input / Output equivalent circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 31/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Operational Notes 1) Absolute maximum ratings This product is produced with strict quality control, however it may be destroyed if operated beyond its absolute maximum ratings. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. T h e r e f o r e , i t i s i m p o r t a n t t o c o n s i d e r c i r c u i t p r o t e c t i o n m e a s u r e s , l i k e a d d i n g a fuse, in case the IC is operated in a special mode exceeding the absolute maximum ratings. 2) GND Potential GND potential must be the lowest potential of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 3) Setting of Heat Carry out the heat design that have adequate margin considering Pd of actual working states. 4) Pin Short and Mistake Fitting When mounting the IC on the PCB, pay attention to the orientation of the IC. If there is mistake in the placement, the IC may be burned up. 5) Actions in Strong Magnetic Field Using the IC within a strong magnetic field may cause the IC to malfunction. 6) Mutual Impedance Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as possible. Use a capacitor to keep ripple to a minimum. 7) STBY Pin Voltage To enable standby mode for all channels, set the STBY pin to 0.5 V or less, and for normal operation, to 1.1 V or more. Setting STBY to a voltage between 0.5 and 1.1 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a minimum. Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always be completely discharged before turning the IC on. 8) Over Current Protection Circuit Over current and short circuit protection is built-in at the output, and IC destruction is prevented at the time of load short circuit. These protection circuits are effective in the destructive prevention by sudden accidents, please avoid applications to where the over current protection circuit operates continuously. 9) Thermal Shutdown This IC has Thermal Shutdown Circuit (TSD Circuit). When the temperature of IC Chip is higher than 175℃, the output is turned off by TSD Circuit. TSD Circuit is only designed for protecting IC from thermal over load. Therefore it is not recommended that you design application where TSD will work in normal condition. 10) Actions under Strong light A strong light like a halogen lamp may be caused malfunction. In our testing, fluorescence light and white LED causes little effects for the IC, but infrared light causes strong effects on the IC. The IC should be shielded from light like sunrays or halogen lamps. 11) Output capacitor To prevent oscillation at output, it is recommended that the IC be operated at the stable region shown in Figure 94. It operates at the capacitance of more than 0.47μF. As capacitance is larger, stability becomes more stable and characteristic of output load fluctuation is also improved. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 32/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Ordering Information B ROHM Part No. U x x Output voltage xx=12:1.2V xx=15:1.5V xx=18:1.8V xx=25:2.5V xx=28:2.8V xx=30:3.0V xx=33:3.3V S D 2 M G Series name Package SD2M:High-speed G: SSOP5 load response 　 Low noise 　 - M T Grade M;Automotive Accessories R Packaging and forming specifications TR:Embossed tape and reel (SSOP5) Shutdown SW ●Marking Diagram SSOP5(TOP VIEW) Part Number Marking Output Voltage 1.2V typ. 1.5V typ. 1.8V typ. 2.5V typ. 2.8V typ. 3.0V typ. 3.3V typ. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Marking M3 NV M4 M5 NW NX NY ｘ ｘ xx 12 15 18 25 28 30 33 LOT Number 33/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Physical Dimension Tape and Reel Information Package Name www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 SSOP5 34/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Revision History Date Revision Changes 21.Dec.2012 001 New Release 19.Mar.2013 002 1) 2) 17.Feb.2014 003 Graphs about BU33SD2 are added to the Reference data. 01.Dec.2020 004 p.35-2, p.35-3 Updated Packages and Part Numbers www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4 devices (1.5V,2.8V,3.0V,3.3V) are added to the Output Voltage Lineup. Some graphs are added to the Reference data. 35/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Ordering Information B ROHM Part No. U x x Output voltage xx=12:1.2V 15:1.5V 18:1.8V 25:2.5V 28:2.8V 30:3.0V 33:3.3V S D 2 M G - Series name Package SD2M:High-speed G: SSOP5 load response Low noise 　 Shutdown SW M Z T Grade M;Automotive Accessories R Packaging and forming specifications TR:Embossed tape and reel (SSOP5) Production site Z:added ●Marking Diagram SSOP5(TOP VIEW) Part Number Marking Output Voltage 1.2V typ. 1.5V typ. 1.8V typ. 2.5V typ. 2.8V typ. 3.0V typ. 3.3V typ. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Marking M3 NV M4 M5 NW NX NY ｘ ｘ xx 12 15 18 25 28 30 33 LOT Number 35-2/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 BUxxSD2-M series ●Physical Dimension and Packing Information Package Name www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 SSOP5A 35-3/35 TSZ02201-0RBR0A300020-1-2 08.Apr.2022 Rev.004 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001