BU45K302G-TL

Datasheet Voltage Detector IC Series Counter Timer Built-in CMOS Voltage Detector IC BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series Key Specifications ◼ Detection voltage: ●General Description ROHM’s BU45xxxxx and BU46xxxxx series are highly accurate, low current consumption voltage detector IC series. Because the counter timer delay circuit is built-in, an external capacitor for the delay time setting is unnecessary. Two output types are available (Nch open drain and CMOS output) and detection voltages are 2.3V, 2.4V, 2.6V, 2.9V, 3.0V, 3.3V, 3.6V, 4.0V, 4.2V with fixed delay time of 200ms and 400ms, that may be selected according to application. ●Features ◼ Counter Timer Built-in ◼ No delay time setting capacitor required ◼ Low current consumption ◼ Two output types (Nch open drain and CMOS output) ◼ Package SSOP3 is similar to SOT-23-3 (JEDEC) ◼ ◼ ◼ ◼ 2.3V, 2.4V, 2.6V, 2.9V, 3.0V, 3.3V, 3.6V, 4.0V, 4.2V (Typ.) High accuracy detection voltage: ±1.0% Low current consumption: 2.3µA (Typ.) Operating temperature range: -40°C to +105°C Two internal, fixed delay time: 200ms 400ms ●Package SSOP3 2.92mm x 2.80mm x 1.25mm ●Applications Circuits using microcontrollers or logic circuits that require a reset ●Typical Application Circuit V DD1 V DD1 V DD2 RL BU45 x x x xx R ST Micro controller BD46 xx x xx R ST CL CL （Noise-filtering Capacitor） （Noise-filtering Capacitor） GND Micro controller GND （Open Drain Output Type） BU45xxxxx series （CMOS Output Type） BU46xxxxx series ●Connection Diagram ●Pin Descriptions BU45KxxxG / BU46KxxxG SSOP3 GND VDD GND Function 3 1 GND GND 2 1 2 1 2 VOUT Reset Output 3 VDD Power Supply Voltage Function 2 V1 OUT BU45KxxxG BU46KxxxG BU45LxxxG 1 2 PIN No. Symbol VOUT V1 DD 1 VOUT Reset Output 2 VDD Power Supply Voltage 3 GND GND BU45LxxxG ○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 Symbol 3 TOP VIEW 1 PIN No. 1/14 TSZ02201-0R7R0G300130-1-2 02.Sep.2021 Rev.006 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series ●Ordering Information B U Part Number x x x Output Type 45 : Open Drain 46 : CMOS x Package 1 x Reset Voltage Value 23 2.3V 23 :: 2.3V 0.1V step 42 :: 4.2V 48 4.8V x x - Counter Timer Package 2 Delay Time Settings 2 : 200ms 4 : 400ms T L Packaging and forming specification TL : Embossed tape and reel Package 1 Package 2 Package name K G SSOP3 (1pin GND) L G SSOP3 (3pin GND) ●Lineup Table 1. Open Drain Output Type Counter Timer Delay Time Settings 1-Pin GND 200ms Detection Marking Voltage 4.2V 3.6V 3.3V 3.0V 2.9V 2.6V 2.4V 2.3V bB aS aN aG aD aB - 3-Pin GND 400ms Part Number Marking BU45K422 BU45K362 BU45K332 BU45K292 BU45K262 BU45K242 - dF dE - 200ms Part Number BU45K304 BU45K294 - Marking fT 400ms Part Number BU45L232 Marking kR Part Number BU45L234 Table 2. CMOS Output Type Counter Timer Delay Time Settings 1-Pin GND 200ms Detection Marking Voltage 4.0V cH 2.9V bT Part Number BU46K402 BU46K292 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/14 TSZ02201-0R7R0G300130-1-2 02.Sep.2021 Rev.006 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series ⚫ Absolute maximum ratings (Ta=25°C) Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output Output Current Power Dissipation (Note1, Note2) Operating Temperature Ambient Storage Temperature Symbol VDD-GND VOUT Io Pd Topr Tstg Limit -0.3 to +6.0 GND-0.3 to +6.0 GND-0.3 to VDD+0.3 70 700 -40 to +105 -55 to +125 Unit V V mA mW °C °C (Note 1) Use above Ta=25°C results in a 7.0mW loss per degree. (Note 2) When mounted on ROHM standard circuit board (70mmx70mmx1.6mm, glass epoxy board). Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. ●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) Parameter Operating Voltage Range Symbol VOPL Condition VOL≤0.4V, RL=470kΩ, Ta=25~105°C VOL≤0.4V, RL=470kΩ, Ta=-40~25°C VDD=H→L, RL=470kΩ (Note 1) Ta=25°C VDET=3.0V Ta=-40°C to 85°C Ta=85°C to 105°C Detection Voltage VDET Ta=25°C VDET=3.3V Ta=-40°C to 85°C Ta=85°C to 105°C Ta=25°C VDET=4.2V Ta=-40°C to 85°C Ta=85°C to 105°C Detection Voltage Temperature coefficient Hysteresis Voltage VDET/∆T -40°C~105°C ∆VDET ‘High’ Output Delay time tPLH Circuit Current when ON Circuit Current when OFF IDD1 IDD2 ‘Low’Output Voltage (Nch) VOL Leak Current when OFF Ileak Limit Min. Typ. 0.6 0.9 VDET(T) VDET(T) ×0.99 2.970 3.0 2.901 2.885 3.267 3.3 3.191 3.173 4.158 4.2 4.061 4.039 - ±50 VDET(T) VDET(T) ×0.03 ×0.05 120 200 Ta=25°C CL=100pF, 95 Ta=-40°C to 85°C BU4XXXX2G RL=100kΩ 85 Ta=85°C to 105°C ( Note1, 240 400 Ta=25°C Note 2, 190 BU4XXXX4G Ta=-40°C to 85°C Note 3 ) 170 Ta=85°C to 105°C 0.60 2.30 VDD=VDET-0.2V, VDET=2.3V~4.2V 1.10 2.80 VDD=VDET+1.0V, VDET=2.3V~4.2V VDD=1.2V, ISINK = 2.0mA VDD=2.4V, ISINK = 8.5mA, VDET(2.9V to 4.2V) VDD=VDS=6.0V (Note 1) VDD＝L→H→L, RL=470kΩ Max. 6.0 6.0 VDET(T) ×1.01 3.030 3.100 3.117 3.333 3.410 3.428 4.242 4.341 4.364 ±360 VDET(T) ×0.08 280 460 235 560 920 470 7.00 8.00 0.3 0.3 1.0 Unit V V ppm/°C V ms µA µA V V µA VDET(T):Standard Detection Voltage (2.3V, 2.4V, 2.6V, 2.9V, 3.0V, 3.3V, 3.6V, 4.0V, 4.2V) RL :Pull-up resistor to be connected between VOUT and power supply. CL :Capacitor to be connected between VOUT and GND. (Note 1) Guarantee is Ta=25°C. (Note 2) tPLH:VDD=(VDET(T)-0.5V)→(VDET(T)+0.5V) (Note 3) tPLH:VDD=Please set up the rise up time between VDD=VOPL→VDET more than 10µs. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/14 TSZ02201-0R7R0G300130-1-2 02.Sep.2021 Rev.006 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series ●Block Diagrams VDD Oscillator VOUT Circuit Counter Timer Vref GND Fig.1 BU45xxxxx Series VDD Oscillator Circuit Counter Timer Vref VOUT GND Fig.2 BU46xxxxx Series www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/14 TSZ02201-0R7R0G300130-1-2 02.Sep.2021 Rev.006 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series ●Typical Performance Curves 16 6 "LOW" OUTPUT CURRENT:IOL[mA] [BU45L232G] CIRCUIT CURRENT:IDD[uA] 5 Ta=105°C 4 3 2 Ta=25°C Ta=-40°C 1 [BU45L232G] 14 12 10 Ta=25°C 8 Ta=105°C 6 4 2 0 0 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 DRAIN-SOURCE VOLTAGE: VDS[V] Fig.4 “LOW” Output Current VDD=1.2V VDD SUPPLY VOLTAGE: VDD[V] Fig.3 Circuit Current 50 8 [BU46K292G] Ta=-40°C 40 [BU45L232G] 7 OUTPUT VOLTAGE:VOUT[V] "HIGH" OUTPUT CURRENT:IOH[mA] Ta=-40°C 30 Ta=25°C 20 Ta=105°C 10 Ta=25°C 6 Ta=-40°C 5 Ta=105°C 4 3 2 1 0 0 0 1 2 3 4 5 0 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 1 2 3 4 5 6 7 VDD SUPPLY VOLTAGE: VDD[V] Fig.6 I/O Characteristics DRAIN-SOURCE VOLTAGE: VDS[V] Fig.5 “HIGH” Output Current VDD=3.9V 5/14 TSZ02201-0R7R0G300130-1-2 02.Sep.2021 Rev.006 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series ●Typical Performance Curves - Continued 2.6 3.0 [BU45L232G] 2.8 CIRCUIT CURRENT WHEN ON :IDD1[uA] DETECTION VOLTAGE:VOUT[V] [BU45L232G] 2.5 Low to high (V DET + ∆V DET) 2.4 2.3 High to low (V DET ) 2.2 2.1 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 -40 -20 0 20 40 60 80 100 -40 TEMPERATURE:Ta[°C] 0 20 40 60 80 100 80 100 TEMPERATURE: Ta[°C] Fig.8 Circuit Current when ON (VDD=VDET-0.2V) VDD=2.1V Fig.7 Detection Voltage Release Voltage 3.5 0.6 [BU45L232G] 3.3 MINIMUM OPERATING VOLTAGE:VOPL [V] CIRCUIT CURRENT WHEN OFF:IDD2 [uA] -20 3.1 2.9 2.7 2.5 2.3 2.1 1.9 1.7 1.5 [BU45L232G] 0.5 0.4 0.3 0.2 0.1 0.0 -40 -20 0 20 40 60 80 -40 100 TEMPERATURE: Ta[°C] Fig.9 Circuit Current when OFF (VDD=VDET+1V) VDD=3.3 V 0 20 40 60 TEMPERATURE: Ta[°C] Fig.10 Operating Limit Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 -20 6/14 TSZ02201-0R7R0G300130-1-2 02.Sep.2021 Rev.006 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series ●Typical Performance Curves - Continued 3.0 280 [BU45L232G] [BU45L232G] "LOW" DELAY TIME TPHL [µs] "HIGH" DELAY TIME:TPLH [ms] 300 260 240 220 200 180 160 140 2.0 1.0 120 100 0.0 -40 -20 0 20 40 60 80 -40 100 0 20 40 60 TEMPERATURE: Ta[°C] Fig.11 Output Delay Time “Low” → “High” Fig.11 Output Delay Time “High” → “Low” www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 -20 TEMPERATURE: Ta[°C] 7/14 80 100 TSZ02201-0R7R0G300130-1-2 02.Sep.2021 Rev.006 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series ●Application Information Explanation of Operation For both the open drain type (Fig.13) and the CMOS output type (Fig.14), the detection and release voltages are used as threshold voltages. When the voltage applied to the V DD pins reaches the applicable threshold voltage, the V OUT terminal voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BU45xxxxx series uses an open drain output type, it is necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD VDD R1 R1 Vref Q2 Vref Reset VOUT Oscillator Oscillator Circuit Counter R2 R2 Timer Reset Circuit Counter Timer Q1 R3 Q1 R3 GND VOUT GND Fig.13 (BU45xxxxx Type Internal Block Diagram) Fig.14 (BU46xxxxx Type Internal Block Diagram) Reference Data Examples of Leading (tPLH) and Falling (tPHL) Output Part Number BU45L232G tPLH[ms] 208 tPHL[µs] 1.4 VDD=1.8V→2.8V VDD=2.8V→1.8V *This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. Timing Waveform Example: The following shows the relationship between the input voltages VDD and the output voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (the circuits are those in Fig. 13 and 14). 1 VDD VDD VDET+ΔVDET VDET 0V ⑤ VOPL VOH tPLH tPLH VOUT tPHL VOL tPHL ① ② ③ Fig.15 ④ Timing Waveform When the power supply is turned on, the output is unstable from after over the operating limit voltage (VOPL) until tPHL. Therefore it is possible that the reset signal is not outputted when the rise time of VDD is faster than tPHL. 2 When V DD is greater than VOPL but less than the reset release voltage (VDET + ∆VDET), the output voltages will switch to Low. 3 If V DD exceeds the reset release voltage (V DET + ∆VDET), the counter timer start and VOUT switches from L to H. 4 If V DD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply fluctuation, VOUT switches to L (with a delay of tPHL). 5 The potential difference between the detection voltage and the release voltage is known as the hysteresis width (∆VDET). The system is designed such that the output does not toggle with power supply fluctuations within this hysteresis width, thus, preventing malfunctions due to noise. Timing may change depending on application and use. Please verify and confirm using practical applications. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/14 TSZ02201-0R7R0G300130-1-2 02.Sep.2021 Rev.006 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series ●Circuit Applications 1. Examples of a common power supply detection reset circuit. VDD1 Application examples of BU45xxxxx series (Open Drain output type) and BU46xxxxx series (CMOS output type) are shown below. VDD2 RL BU45xxxxx RST Micro controller CASE1: Power supply of microcontroller (VDD2) differs from the power supply of the reset detection (VDD1). Use an open drain output Type (BU45xxxxx series) device with a load resistance RL as shown Fig.16. CL （Noise-filtering Capacitor） GND Fig.16 Open Drain Output Type CASE2: Power supply of the microcontroller (VDD1) is same as the power supply of the reset detection (VDD1). Use a CMOS output type (BU46xxxxx) device or an open drain output type (BU45xxxxx) with pull up resistor between the output and VDD1. (As shown Fig.17) VDD1 BU46xxxxx RST Micro controller When a capacitance CL for noise filtering is connected to the VOUT pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (VOUT). CL （Noise-filtering Capacitor） GND Fig.17 CMOS Output Type 2. The following is an example of a circuit application in which an OR connection between two types of detection voltage resets the microcontroller. VDD1 VDD2 VDD3 RL BU45xxxxx BU45xxxxx RST Micro controller GND Fig. 18 To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain output type (BU45xxxxx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller (VDD3) as shown in Fig. 18. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/14 TSZ02201-0R7R0G300130-1-2 02.Sep.2021 Rev.006 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series Examples of the power supply with resistor dividers. In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause malfunction in the systems operation such as output oscillations, etc. V1 R2 I1 VDD BU45xxxxx BU46xxxxx R1 CIN VOUT CL GND Fig. 19 When an in-rush current (I1) flows into the circuit (Refer to Fig. 19) at the time when output switches from “Low” to “High”, a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low” condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to oscillation. IDD In-rush Current 0 VDD VDET Fig. 20 Current Consumption vs. Power Supply Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/14 TSZ02201-0R7R0G300130-1-2 02.Sep.2021 Rev.006 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series ●Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/14 TSZ02201-0R7R0G300130-1-2 02.Sep.2021 Rev.006 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series 12. Regarding Input Pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 21. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Bypass Capacitor for Noise Rejection To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND. Be careful when using extremely big capacitor as transient response will be affected. 15. The VDD line impedance might cause oscillation because of the detection current. 16. A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 17. External Parameters The recommended parameter range for RL is 50kΩ to 470kΩ. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 18. Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be V DD in pull up (VDD) condition. 19. Power-on Reset Operation Please note that the power on reset output varies with the V DD rise time. Please verify the behavior in the actual operation. 20. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/14 TSZ02201-0R7R0G300130-1-2 02.Sep.2021 Rev.006 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series Physical Dimension, Tape and Reel Information Package Name SSOP3 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/14 TSZ02201-0R7R0G300130-1-2 02.Sep.2021 Rev.006 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series ●Revision History Date Revision Changes 03.Feb.2014 004 New Release 03.July.2014 005 Updated Fig.5 VDD condition Updated Operational Notes and Notice 02.Sep.2021 006 Deleted Not Recommended New Designs product www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/14 TSZ02201-0R7R0G300130-1-2 02.Sep.2021 Rev.006 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001