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BU5255SHFV-TR

BU5255SHFV-TR

  • 厂商:

    ROHM(罗姆)

  • 封装:

    SOT665

  • 描述:

    IC COMPARATOR P-P HVSOF5

  • 数据手册
  • 价格&库存
BU5255SHFV-TR 数据手册
Datasheet Comparators Input Full Swing, Push-pull Output Low Supply Current CMOS Comparators BU5255HFV BU5255SHFV General Description Key Specifications  Operating Supply Voltage: Single Supply Split Supply  Supply Current:  Temperature Range: BU5255HFV BU5255SHFV  Input Offset Current:  Input Bias Current: BU5255HFV is input full swing, push-pull output CMOS comparator. BU5255SHFV have an expanded operating temperature range. These features low operating supply voltage of +1.8V to +5.5V(single supply), low supply current and extremely low input bias current. Features       Low Operating Supply Voltage Low Supply Current Input Full Swing Push-pull Output Wide Operating Temperature Range(BU5255SHFV) Low Input Bias Current Packages HVSOF5 +1.8V to +5.5V ±0.9V to ±2.75V 6.5µA(Typ) -40°C to +85°C -40°C to +105°C 1pA (Typ) 1pA (Typ) jW(Typ) x D(Typ) x H(Max) 1.60mm x 1.60mm x 0.60mm Applications     Limit Comparators Battery Monitor Multivibrators Consumer Electronics Pin Configuration BU5255HFV, BU5255SHFV: HVSOF5 INVSS 5 1 2 VDD Pin No. Pin Name 1 IN- 2 VSS + IN+ 3 4 OUT 3 IN+ 4 OUT 5 VDD Package HVSOF5 BU5255HFV BU5255SHFV ○Product structure:Silicon monolithic integrated circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays. 1/17 TSZ02201-0RFR1G200420-1-2 21.Oct.2013 Rev.001 Datasheet BU5255HFV BU5255SHFV Ordering Information B U 5 2 5 5 x x x x - Package HFV : HVSOF5 Part Number BU5255HFV BU5255SHFV x x Packaging and Forming Specification TR: Embossed Tape and Reel Line-up Package Topr Orderable Part Number -40°C to +85°C HVSOF5 Reel of 3000 BU5255HFV-TR -40°C to +105°C HVSOF5 Reel of 3000 BU5255SHFV-TR Absolute Maximum Ratings (TA=25°C) Parameter Supply Voltage BU5255HFV BU5255SHFV VDD - VSS Power Dissipation Differential Input Voltage Ratings Symbol (Note 3) Input Common-mode Voltage Range Input Current (Note 4) Unit +7 V PD 0.54 (Note 1,2) W VID VDD - VSS V VICM (VSS-0.3) to (VDD+0.3) V II ±10 mA Operating Supply Voltage Vopr +1.8 to +5.5 V Operating Temperature Topr Storage Temperature Tstg -55 to +125 °C Maximum Junction Temperature TJmax +125 °C -40 to +85 -40 to +105 °C (Note 1) To use at temperature above TA=25C reduce 5.4mW/°C. (Note 2) Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (copper foil area less than 3%). (Note 3) The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input terminal voltage is set to more than VSS. (Note 4) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/17 TSZ02201-0RFR1G200420-1-2 21.Oct.2013 Rev.001 Datasheet BU5255HFV BU5255SHFV Electrical Characteristics ○BU5255HFV, BU5255SHFV(Unless otherwise specified VDD=+3V, VSS=0V, TA=25°C) Limit Temperature Parameter Symbol Unit Range Min Typ Max Conditions Input Offset Voltage (Note 5) VIO 25°C - 1 6 mV - Input Offset Current (Note 5) IIO 25°C - 1 - pA - Input Bias Current (Note 5) IB 25°C - 1 - pA - Supply Current (Note 6) IDD Maximum Output Voltage(High) 25°C - 6.5 15 Full range - - 30 VOH 25°C VDD-0.1 - Maximum Output Voltage(Low) VOL 25°C - Large Signal Voltage Gain AV 25°C VICM Common-mode Rejection Ratio μA RL=∞ - V RL=10kΩ - VSS+0.1 V RL=10kΩ - 90 - dB RL=10kΩ 25°C 0 - 3 V VSS to VDD CMRR 25°C - 80 - dB - Power Supply Rejection Ratio PSRR 25°C - 80 - dB - Output Source Current (Note 7) ISOURCE 25°C 1.5 3.5 - mA OUT=VDD-0.4V ISINK 25°C 2.5 5 - mA OUT=VSS+0.4V Output Rise Time tR 25°C - 50 - ns Output Fall Time tF 25°C - 20 - ns Propagation Delay L to H tPLH 25°C - 1.6 - µs Propagation Delay H to L tPHL 25°C - 0.5 - µs Input Common-mode Voltage Range Output Sink Current (Note 7) CL=15pF, IN-=1.5V 100mV Overdrive CL=15pF, IN-=1.5V 100mV Overdrive CL=15pF, IN-=1.5V 100mV Overdrive CL=15pF, IN-=1.5V 100mV Overdrive (Note 5) Absolute value (Note 6) Full range: BU5255HFV: TA=-40°C to +85°C BU5255SHFV: TA=-40°C to +105°C (Note 7) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/17 TSZ02201-0RFR1G200420-1-2 21.Oct.2013 Rev.001 Datasheet BU5255HFV BU5255SHFV Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or general document. 1. Absolute Maximum Ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (VDD/VSS) Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without deterioration or destruction of characteristics of internal circuit. (2) Differential Input Voltage (VID) Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the IC. (3) Input Common-mode Voltage Range (VICM) Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. (4) Power Dissipation (PD) Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C (normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical Characteristics (1) Input Offset Voltage (VIO) Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the input voltage difference required for setting the output voltage at 0 V. (2) Input Offset Current (IIO) Indicates the difference of input bias current between the non-inverting and inverting terminals. (3) Input Bias Current (IB) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) Supply Current (IDD) Indicates the current that flows within the IC under specified no-load conditions. (5) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL) Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output voltage low indicates the lower limit. (6) Large Signal Voltage Gain (AV) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. Av = (Output voltage) / (Differential Input voltage) (7) Input Common-mode Voltage Range (VICM) Indicates the input voltage range where IC normally operates. (8) Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation) (9) Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation) (10) Output Source Current/ Output Sink Current (ISOURCE / ISINK) The maximum current that can be output from the IC under specific output conditions. The output source current indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. (11) Output Rise Time /Output Fall Time (tR/tF) Indicates the time required for an output voltage step to change from 90% to 10% of its final value. (12) Propagation Delay Time L to H /Propagation Delay Time H to L (tPLH/tPHL) Indicates the time to reach 50% of the output voltage after the step voltage is applied at the input pin. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/17 TSZ02201-0RFR1G200420-1-2 21.Oct.2013 Rev.001 Datasheet BU5255HFV BU5255SHFV Typical Performance Curves 0.8 0.8 0.6 0.6 Power Dissipation [W] Power Dissipation [W] ○BU5255HFV, BU5255SHFV BU5255HFV 0.4 BU5255SHFV 0.4 0.2 0.2 0.0 0 25 0.0 85 50 75 100 Ambient Temperature [°C] 105 0 125 Figure 1. Power Dissipation vs Ambient Temperature (Derating Curve) 12 10 10 85°C Supply Current [μA] Supply Current [μA] 50 75 100 Ambient Temperature [°C] 125 Figure 2. Power Dissipation vs Ambient Temperature (Derating Curve) 12 105°C 25 8 25°C 6 4 8 5.5V 6 3.0V 1.8V 4 -40°C 2 2 0 0 1 2 3 4 Supply Voltage [V] 5 6 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 4. Supply Current vs Ambient Temperature Figure 3. Supply Current vs Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU5255HFV: -40C to +85C BU5255SHFV: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/17 TSZ02201-0RFR1G200420-1-2 21.Oct.2013 Rev.001 Datasheet BU5255HFV BU5255SHFV Typical Performance Curves - continued ○BU5255HFV, BU5255SHFV 6 Maximum Output Voltage (High) [V] Maximum Output Voltage (High) [V] 6 5 4 105°C 85°C 25°C 3 -40°C 2 1 4 3.0V 3 1.8V 2 1 0 0 1 2 3 4 Supply Voltage [V] 5 -50 6 Figure 5. Maximum Output Voltage (High) vs Supply Voltage (RL=10kΩ) -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 6. Maximum Output Voltage (High) vs Ambient Temperature (RL=10kΩ) 50 50 Maximum Output Voltage (Low) [mV] Maximum Output Voltage (Low) [mV] 5.5V 5 40 30 20 105°C 25°C 85°C 10 40 30 20 5.5V 10 1.8V -40°C 0 -50 0 1 2 3 4 Supply Voltage [V] 5 6 -25 3.0V 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 8. Maximum Output Voltage (Low) vs Ambient Temperature (RL=10kΩ) Figure 7. Maximum Output Voltage (Low) vs Supply Voltage (RL=10kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU5255HFV: -40C to +85C BU5255SHFV: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/17 TSZ02201-0RFR1G200420-1-2 21.Oct.2013 Rev.001 Datasheet BU5255HFV BU5255SHFV Typical Performance Curves - continued ○BU5255HFV, BU5255SHFV 16 16 14 14 Output Source Current [mA] Output Source Current [mA] -40°C 12 12 25°C 10 10 8 85°C 105°C 6 4 8 5.5V 6 3.0V 4 1.8V 2 2 0 0.0 0.5 1.0 1.5 2.0 Output Voltage [V] 2.5 0 -50 3.0 Figure 9. Output Source Current vs Output Voltage (VDD=3 V) -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 10. Output Source Current vs Ambient Temperature (OUT=VDD-0.4V) 20 20 15 Output Sink Current [mA] Output Sink Current [mA] -40°C 25°C 10 85°C 105°C 5 15 10 5.5V 3.0V 5 1.8V 0 0.0 0.5 1.0 1.5 2.0 Output Voltage [V] 2.5 0 -50 3.0 Figure 11. Output Sink Current vs Output Voltage (VDD=3V) -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 12. Output Sink Current vs Ambient Temperature (OUT=VSS+0.4V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU5255HFV: -40C to +85C BU5255SHFV: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/17 TSZ02201-0RFR1G200420-1-2 21.Oct.2013 Rev.001 Datasheet BU5255HFV BU5255SHFV Typical Performance Curves - continued ○BU5255HFV, BU5255SHFV 7.5 7.5 5.0 5.0 85°C 2.5 Input Offset Voltage [mV] 10.0 Input Offset Voltage [mV] 10.0 105°C 0.0 25°C -40°C -2.5 -5.0 2.5 5.5V 0.0 1.8V 3.0V -2.5 -5.0 -7.5 -7.5 -10.0 -10.0 1 2 3 4 Supply Voltage [V] 5 -50 6 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 14. Input Offset Voltage vs Ambient Temperature (VICM=VDD, EK=-VDD/2) Figure 13. Input Offset Voltage vs Supply Voltage (VICM=VDD, EK=-VDD/2) 10.0 160 Large Signal Voltage Gain [dB] Input Offset Voltage [mV] 7.5 5.0 105°C 2.5 85°C 25°C 0.0 -40°C -2.5 -5.0 140 85°C 120 105°C -40°C 100 25°C 80 -7.5 -10.0 60 -1 0 1 2 Input Voltage [V] 3 1 4 Figure 15. Input Offset Voltage vs Input Voltage (VDD=3V) 2 3 4 Supply Voltage [V] 5 6 Figure 16. Large Signal Voltage Gain vs Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU5255HFV: -40C to +85C BU5255SHFV: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/17 TSZ02201-0RFR1G200420-1-2 21.Oct.2013 Rev.001 Datasheet BU5255HFV BU5255SHFV Typical Performance Curves - continued ○BU5255HFV, BU5255SHFV 120 Common-mode Rejection Ratio [dB] Large Signal Voltage Gain [dB] 160 140 1.8V 120 3.0V 100 5.5V 80 100 -40°C 105°C 60 85°C 40 20 0 60 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 1 Figure 17. Large Signal Voltage Gain vs Ambient Temperature 2 3 4 Supply Voltage [V] 5 6 Figure 18. Common-mode Rejection Ratio vs Supply Voltage 120 140 100 5.5V Power Supply Rejection Ratio [dB] Common-mode Rejection Ratio [dB] 25°C 80 3.0V 80 60 1.8V 40 20 120 100 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 80 60 40 20 0 -50 125 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 20. Power Supply Rejection Ratio vs Ambient Temperature Figure 19. Common-mode Rejection Ratio vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU5255HFV: -40C to +85C BU5255SHFV: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/17 TSZ02201-0RFR1G200420-1-2 21.Oct.2013 Rev.001 Datasheet BU5255HFV BU5255SHFV Typical Performance Curves - continued ○BU5255HFV, BU5255SHFV 2.0 Propagation Delay H to L [µs] Propagation Delay L to H [µs] 2.0 5.5V 1.5 3.0V 1.0 1.8V 0.5 0.0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 1.5 5.5V 1.0 3.0V 1.8V 0.5 0.0 -50 Figure 21. Propagation Delay L to H vs Ambient Temperature (CL=15pF, IN-=1.5V 100mV Overdrive) -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 22. Propagation Delay H to L vs Ambient Temperature (CL=15pF, IN-=1.5V 100mV Overdrive) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU5255HFV: -40C to +85C BU5255SHFV: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/17 TSZ02201-0RFR1G200420-1-2 21.Oct.2013 Rev.001 Datasheet BU5255HFV BU5255SHFV Application Information NULL Method Conditions for Test circuit 1 VDD, VSS, EK, VICM Unit:V Parameter Input Offset Voltage VF SW1 SW2 SW3 VDD VSS EK VICM Calculation VF1 ON ON OFF 3 0 -0.1 3 1 ON ON ON 3 0 0.3 2 ON ON OFF 3 0 VF6 ON ON OFF 1.8 0 VF7 ON ON OFF 5.5 0 VF2 Large Signal Voltage Gain VF3 VF4 Common-mode Rejection Ratio (Input Common-mode Voltage Range) VF5 Power Supply Rejection Ratio - Calculation 1. Input Offset Voltage (VIO) VIO = 2. Large Signal Voltage Gain (AV) Av = 20Log 3. Common-mode Rejection Ratio (CMRR) CMRR = 20Log 4. Power Supply Rejection Ratio (PSRR) PSRR = 20Log VDD × (1+ RF/RS) |VF7 - VF6| |VF1| 1 + RF/RS -0.3 -2.7 -0.1 -0.1 0 3 3 0.3 4 [V] EK × (1+RF/RS) |VF3 - VF2| [dB] VICM × (1+RF/RS) |VF5 - VF4| [dB] [dB] 0.1μF RF=50kΩ SW1 RS=50Ω 500kΩ VDD 15V EK RI=1MΩ 0.01μF Vo 500kΩ 0.015μF 0.015μF DUT SW3 RS=50Ω 1000pF RI=1MΩ RL VICM 50kΩ NULL SW2 VRL VSS V VF -15V Figure 23. Test Circuit 1 Application Information - continued www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/17 TSZ02201-0RFR1G200420-1-2 21.Oct.2013 Rev.001 Datasheet BU5255HFV BU5255SHFV Switch Conditions for Test Circuit 2 SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 Supply Current OFF ON ON OFF OFF OFF OFF OFF Maximum Output Voltage (RL=10kΩ) OFF ON ON ON OFF OFF ON OFF Output Current OFF OFF OFF OFF OFF ON OFF OFF Response Time ON OFF ON OFF ON OFF OFF ON SW No. VDD + SW1 SW2 - SW3 SW4 SW5 RL CL SW6 SW7 SW8 VIN VSS IN+ INOUT Figure 24. Test Circuit 2 Input Voltage Input Voltage 1.6V 1.6V 1.5V 1.5V 100mV Overdrive Vre 100mV Overdrive 1.4V 1.4V t t Input Wave Input Wave Output Voltage (L-H) Output Voltage (H-L) tPLH 3V tF 3V 90% 50% 1.5V 90% 50% 1.5V 10% 10% 0V 0V tR Output Wave tPHL t Output Wave t Figure 25. Response Time Input and Output Wave Power Dissipation www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/17 TSZ02201-0RFR1G200420-1-2 21.Oct.2013 Rev.001 Datasheet BU5255HFV BU5255SHFV Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 26(a) shows the model of the thermal resistance of the package. The equation below shows how to compute for the Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation (PD). θJA = (TJmax-TA) / PD °C/W The derating curve in Figure 26(b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 26(c) and (d) shows the derating curve for BU5255HFV and BU5255SHFV. Power Dissipation of LSI [W] PDmax Power Dissipation of IC θJA=(TJmax-TA)/PD C/W Ambient Temperature TA [ C ] P2 θJA2
BU5255SHFV-TR 价格&库存

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BU5255SHFV-TR
    •  国内价格
    • 100+3.75312
    • 300+3.57692
    • 500+3.41833
    • 1000+3.04831
    • 2500+2.81924

    库存:3150

    BU5255SHFV-TR
      •  国内价格
      • 5+6.35211
      • 50+3.10117
      • 100+2.83686

      库存:100