BU52777GWZ-E2

Datasheet Omnipolar Detection Hall IC (Dual Outputs for both S and N Pole Polarity Detection) BU52777GWZ General Description Key Specifications The omnipolar detection Hall IC incorporating a polarity determination circuit enables separate operation (output) of both the South and North poles. Using a magnet and the device, detection of open and close of the cover are possible in smart phones and tablets, and detection of putting wireless earphones in a case, and detection of front/back side or rotational direction are possible in digital cameras and other applications involving display panels. ◼ ◼ ◼ ◼ ◼ ◼ ◼ Package Features ◼ ◼ ◼ VDD Voltage Range: Operate Point: Hysteresis: Period: Supply Current (AVG): Output Type: Operating Temperature Range: 2.5 V to 4.5 V ±15 mT (Typ) 2 mT (Typ) 50 ms (Typ) 1.7 µA (Typ) CMOS -40 °C to +85 °C W(Typ) x D(Typ) x H(Max) 0.80 mm x 0.80 mm x 0.40 mm UCSP35L1 Omnipolar Detection (OUT1 = S-pole Detection; OUT2 = N-pole Detection) Micro Power Operation (Small Current Using Intermittent Operation Method) Ultra-compact Package Applications ◼ Smart Phones, Tablets, Wireless Earphones, Notebook Computers, Digital Cameras, etc. Typical Application Circuit and Block Diagram VDD 0.1 µF Adjust the bypass capacitor value as necessary, according to power supply noise conditions, etc. LATCH TIMING LOGIC OUT1 GND VDD LATCH × SAMPLE & HOLD ELEMENT DYNAMIC OFFSET CANCELLATION HALL OUT2 GND Pin Configurations Pin Descriptions Pin No. TOP VIEW Pin Name Function GND OUT2 A1 A1 GND Ground A2 OUT2 Output (Detect to the north pole) B1 VDD Power supply(Note 1) B2 OUT1 Output (Detect to the south pole) B1 VDD A2 B2 OUT1 (Note 1) Dispose a bypass capacitor between VDD and GND. 〇Product structure :Silicon integrated circuit .www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/14 TSZ02201-0M2M0F420010-1-2 11.Mar.2021 Rev.001 BU52777GWZ Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Key Specifications .......................................................................................................................................................................... 1 Package .......................................................................................................................................................................................... 1 Typical Application Circuit and Block Diagram................................................................................................................................ 1 Pin Descriptions .............................................................................................................................................................................. 1 Pin Configurations .......................................................................................................................................................................... 1 Absolute Maximum Ratings ............................................................................................................................................................ 3 Recommended Operating Conditions ............................................................................................................................................. 3 Magnetic and Electrical Characteristics .......................................................................................................................................... 3 Measurement Circuit ....................................................................................................................................................................... 4 Typical Performance Curves........................................................................................................................................................... 5 Figure 5. Operate Point, Release Point vs Ambient Temperature ............................................................................................... 5 Figure 6. Operate Point, Release Point vs Supply Voltage .......................................................................................................... 5 Figure 7. Period vs Ambient Temperature ................................................................................................................................... 5 Figure 8. Period vs Supply Voltage .............................................................................................................................................. 5 Figure 9. Supply Current vs Ambient Temperature ...................................................................................................................... 6 Figure 10. Supply Current vs Supply Voltage .............................................................................................................................. 6 Description of Operations ............................................................................................................................................................... 7 Intermittent Operation at Power ON .............................................................................................................................................. 10 Magnet Selection .......................................................................................................................................................................... 10 Position of the Hall Element .......................................................................................................................................................... 10 Output Equivalence Circuit ........................................................................................................................................................... 10 Operational Notes ......................................................................................................................................................................... 11 Ordering Information ..................................................................................................................................................................... 12 Marking Diagrams......................................................................................................................................................................... 12 Physical Dimension and Packing Information ............................................................................................................................... 13 Revision History ............................................................................................................................................................................ 14 www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/14 TSZ02201-0M2M0F420010-1-2 11.Mar.2021 Rev.001 BU52777GWZ Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit Power Supply Voltage VDD 7.0 V Output Current IOUT ±0.5 mA Power Dissipation Pd 0.10 W Tstg -40 to +125 °C Tjmax 125 °C Storage Temperature Range Maximum Junction Temperature Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Power Supply Voltage VDD 2.5 3.0 4.5 V Operating Temperature Topr -40 +25 +85 °C Magnetic and Electrical Characteristics (Unless otherwise specified VDD = 3.0 V Ta = 25 °C) Parameter Symbol Min Typ Max BOPS - 15 17 BOPN -17 -15 - BRPS 11 13 - BRPN - -13 -11 BHYSS - 2 - Operate Point Unit mT Release Point mT Hysteresis Conditions Output: OUT1 (Detect to the south pole) Output: OUT2 (Detect to the north pole) Output: OUT1 (Detect to the south pole) Output: OUT2 (Detect to the north pole) - mT BHYSN - 2 - tP - 50 100 ms Output High Voltage VOH VDD -0.2 - - V IOUT = -0.5 mA Output Low Voltage VOL - - 0.2 V IOUT = +0.5 mA Supply Current IDD - 1.7 3.5 µA Average Period - (Note) Polarity of Magnetic flux density is defined as positive when south pole side of magnet approaches top surface of the device. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/14 TSZ02201-0M2M0F420010-1-2 11.Mar.2021 Rev.001 BU52777GWZ Measurement Circuit BOP/BRP tP VDD 100 µF VDD OUT1 /OUT2 GND 200 Ω VDD VDD Oscilloscope V OUT1 /OUT2 GND The period is monitored by an oscilloscope BOP and BRP are measured by applying an external magnetic field Figure 1. BOP, BRP Measurement Circuit Figure 2. tP Measurement Circuit VOH, VOL VDD 100 µF VDD OUT1 /OUT2 GND IOUT V Figure 3. VOH, VOL Measurement Circuit IDD A VDD 2200 µF VDD OUT1 /OUT2 GND Figure 4. IDD Measurement Circuit www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/14 TSZ02201-0M2M0F420010-1-2 11.Mar.2021 Rev.001 BU52777GWZ Typical Performance Curves (Reference data) 20.0 20.0 10.0 Ta = 25 °C BOPS Operate Point, Release Point [mT] Operate Point, Release Point [mT] VDD = 3.0 V BRPS 0.0 BRPN -10.0 BOPS 10.0 BRPS 0.0 BRPN -10.0 BOPN BOPN -20.0 -20.0 -60 -40 -20 0 20 40 60 80 Ambient Temperature: Topr [°C] 2.0 100 3.0 3.5 4.0 4.5 5.0 Supply Voltage: VDD [V] Figure 5. Operate Point, Release Point vs Ambient Temperature Figure 6. Operate Point, Release Point vs Supply Voltage 100 100 VDD = 3.0 V 90 Ta = 25 °C 90 80 80 70 70 60 60 Period: tP [ms] Period: tP [ms] 2.5 50 40 50 40 30 30 20 20 10 10 0 0 -60 -40 -20 0 20 40 60 80 Ambient Temperature: Topr [°C] 100 2.0 3.0 3.5 4.0 4.5 5.0 Supply Voltage: VDD [V] Figure 7. Period vs Ambient Temperature www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2.5 Figure 8. Period vs Supply Voltage 5/14 TSZ02201-0M2M0F420010-1-2 11.Mar.2021 Rev.001 BU52777GWZ Typical Performance Curves - continued (Reference data) 10.0 10.0 VDD = 3.0 V Ta = 25 °C 9.0 8.0 8.0 7.0 7.0 Supply Current: IDD [µA] Supply Current: IDD [µA] 9.0 6.0 5.0 4.0 3.0 2.0 6.0 5.0 4.0 3.0 2.0 1.0 1.0 0.0 0.0 -60 -40 -20 0 20 40 60 80 2.0 100 Ambient Temperature: Topr [°C] 3.0 3.5 4.0 4.5 5.0 Supply Voltage: VDD [V] Figure 9. Supply Current vs Ambient Temperature www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2.5 Figure 10. Supply Current vs Supply Voltage 6/14 TSZ02201-0M2M0F420010-1-2 11.Mar.2021 Rev.001 BU52777GWZ Description of Operations Micropower Operation (Small Current Consumption Using Intermittent Sensing) The omnipolar detection Hall IC uses intermittent sensing save energy. At startup, the Hall elements, amplifier, comparator, and other detection circuits powered on and magnetic detection begins. During standby, the detection circuits powered off, thereby reducing current consumption. The detection results are held and output during standby time. IDD Period Startup Time Standby Time Peak Current 𝑃𝑒𝑟𝑖𝑜𝑑: 𝑡𝑃 [ms] t 0 𝑆𝑡𝑎𝑟𝑡𝑢𝑝 𝑇𝑖𝑚𝑒: Figure 11. Timing Chart of Micropower Operation 𝑡𝑃 8192 x2 [ms] 𝑃𝑒𝑎𝑘 𝐶𝑢𝑟𝑟𝑒𝑛𝑡: 12 [mA] (Peak Current is reference data. This is not 100 % tested.) (Offset Cancellation) VDD I B × + Hall Voltage GND The Hall elements are shown with an equivalent Wheatstone (resistor) bridge circuit. Offset voltage may be generated by a differential in this bridge resistance, or can arise from changes of resistance due to package or bonding stress. A dynamic offset cancellation circuit is employed to cancel this offset voltage. When the Hall elements are connected as shown in Figure 12 and a magnetic field is applied perpendicular to the Hall elements, a voltage is generated at the mid-points of the bridge. This is known as Hall voltage. Dynamic offset cancellation switches the wiring (shown in the figure 12) to redirect the current flow to a 90 ° angle from its original path, and thereby cancels the offset voltage of Hall. Only the magnetic signal is maintained in the sample/hold circuit process and then released. Figure 12. Equivalent Circuit of Hall Elements www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/14 TSZ02201-0M2M0F420010-1-2 11.Mar.2021 Rev.001 BU52777GWZ Description of Operations - continued (Magnetic Field Detection Mechanism) S N S S N S N Flux Direction Flux Direction Figure 13. Direction of the Detectable Magnetic Field The Hall IC cannot detect magnetic fields that run horizontal to the package top layer. Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer. OUT1 N S N S S N Flux Direction Flux Direction OUT1 [V] High High High Low B BRPS N-pole 0 Magnetic Flux Density [mT] BOPS S-pole Figure 14. S-pole Detection OUT1 detects only S pole magnetic field. (OUT1 doesn’t detect N pole.) www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/14 TSZ02201-0M2M0F420010-1-2 11.Mar.2021 Rev.001 BU52777GWZ Description of Operations - continued OUT2 N S N S S N Flux Direction Flux Direction OUT2 [V] High High High Low B BOPN BRPN N-pole 0 Magnetic Flux Density [mT] S-pole Figure 15. N-pole Detection OUT2 detects only N pole magnetic field. (OUT2 doesn’t detect S pole.) The dual output omnipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. When the distance between magnet and Hall IC is far and magnetic flux density is smaller than the operate point (BOP), output goes HIGH. When the magnet gets closer to the IC and magnetic density rises to the operate point, the output switches LOW. In LOW output mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just below BOP, and output returns HIGH. The point where magnetic flux density restores a HIGH output is known as the release point, BRP. This detection and adjustment mechanism is designed to prevent noise and other erratic system operation. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/14 TSZ02201-0M2M0F420010-1-2 11.Mar.2021 Rev.001 BU52777GWZ Intermittent Operation at Power ON Power ON 2.5 V VDD Startup Time Standby Time Supply Current (Intermittent Action) Standby Time Indefinite Interval (Max: tP) High (Not detected Magnetic Field) OUT1 /OUT2 Low (Detected Magnetic Field) Figure 16. Timing Chart of Intermittent Operation at Power ON The omnipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as shown in Figure 16. The IC outputs the detection result and maintains the output condition during the standby period. The output is an indefinite interval from power ON to the first end of startup (Max: tP). Magnet Selection Neodymium and ferrite are major permanent magnets. Neodymium generally offers greater magnetic power per volume than ferrite, thereby enabling miniaturization of magnet. The larger neodymium magnet is, the stronger magnetic flux density is. And the farther detection distance is, the weaker it is. Therefore, the proper size and detection distance of the magnet should be determined according to the operate point of Hall IC. To increase the magnet’s detection distance, the magnet which is thicker or larger sectional area is used. Position of the Hall Element Output Equivalence Circuit (Reference) UCSP35L1 (BU52777GWZ) OUT1, OUT2 0.40 VDD 0.40 0.25 OUT1 /OUT2 GND (UNIT: mm) Figure 17. Position of the Hall Element www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 18. Output Equivalence Circuit 10/14 TSZ02201-0M2M0F420010-1-2 11.Mar.2021 Rev.001 BU52777GWZ Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 10. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Disturbance light In a device where a portion of silicon is exposed to light such as in a WL-CSP and chip products, IC characteristics may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/14 TSZ02201-0M2M0F420010-1-2 11.Mar.2021 Rev.001 BU52777GWZ Ordering Information B U 5 2 7 7 Part Number 7 G W Z Package GWZ: UCSP35L1 - E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagrams UCSP35L1 (BU52777GWZ) TOP VIEW 1PIN MARK KM www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Part Number Marking LOT Number 12/14 TSZ02201-0M2M0F420010-1-2 11.Mar.2021 Rev.001 BU52777GWZ Physical Dimension and Packing Information Package Name UCSP35L1 (BU52777GWZ) < Tape and Reel Information > Tape Embossed carrier tape Quantity 6000 pcs Direction of feed E2 The direction is the pin 1 of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/14 TSZ02201-0M2M0F420010-1-2 11.Mar.2021 Rev.001 BU52777GWZ Revision History Date Revision 11.Mar.2021 001 Changes New Release www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/14 TSZ02201-0M2M0F420010-1-2 11.Mar.2021 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 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Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. 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Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001