BU7485G-TR

Datasheet Operational Amplifiers Series Ground Sense High Speed Low Voltage CMOS Operational Amplifiers BU7485G BU7485SG BU7486xxx BU7486Sxxx General Description BU7485G/BU7486xxx/BU7487xx are CMOS operational amplifiers with input ground sense and full swing output. This series has extended operational amplifiers BU7485SG/BU7486Sxxx/BU7487Sxx which can operate over a wider temperature range (-40°C to +105°C). These ICs have wide band, high slew rate, low voltage operation and low input bias current, making the operational amplifiers suitable for portable equipment and sensor application. Features     High Slew Rate Wide Bandwidth Low Input Bias Current Output Full Swing BU7487xx Key Specifications  Operating Power Supply Voltage Range (Single Supply): +3.0V to +5.5V  Slew Rate: 10.0V/µs(Typ)  Temperature Range: BU7485G -40°C to +85°C BU7486xxx -40°C to +85°C BU7487xx -40°C to +85°C BU7485SG -40°C to +105°C BU7486Sxxx -40°C to +105°C BU7487Sxx -40°C to +105°C  Input Bias Current: 1pA (Typ)  Input Offset Current: 1pA (Typ) Package SSOP5 SOP8 SSOP-B8 MSOP8 SOP14 SSOP-B14 Application  Battery-powered Equipment  General Purpose Electronics BU7487Sxx W(Typ) x D(Typ) x H(Max) 2.90mm x 2.80mm x 1.25mm 5.00mm x 6.20mm x 1.71mm 3.00mm x 6.40mm x 1.35mm 2.90mm x 4.00mm x 0.90mm 8.70mm x 6.20mm x 1.71mm 5.00mm x 6.40mm x 1.35mm Simplified schematic VDD Vbias Class +IN AB control OUT -IN Vbias VSS Figure 1. Simplified schematic (1 channel only) ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 ○This product is not designed protection against radioactive rays. 1/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Pin Configuration BU7485G, BU7485SG : SSOP5 +IN 1 VSS 2 -IN VDD 5 3 Pin No. Pin Name 1 +IN 2 VSS 3 -IN 4 OUT 5 VDD Pin No. Pin Name 1 OUT1 2 -IN1 3 +IN1 OUT 4 : SOP8 BU7486F, BU7486SF : SSOP-B8 BU7486FV, BU7486SFV BU7486FVM, BU7486SFVM : MSOP8 OUT1 1 8 VDD 2 -IN1 7 OUT2 CH1 - + +IN1 3 6 -IN2 CH2 + - VSS 4 5 +IN2 BU7487F, BU7487SF BU7487FV, BU7487SFV +IN2 6 -IN2 7 OUT2 8 VDD Pin No. Pin Name 14 OUT4 1 OUT1 13 -IN4 2 -IN1 3 +IN1 4 VDD 5 +IN2 1 -IN1 2 +IN1 3 12 +IN4 VDD 4 11 VSS +IN2 5 10 +IN3 -IN2 6 OUT2 7 - ＋ + － CH2 VSS 5 : SOP14 : SSOP-B144 OUT1 CH1 － - ＋ + 4 CH4 ＋ + － ＋ + －CH3 9 -IN3 8 OUT3 6 -IN2 7 OUT2 8 OUT3 9 -IN3 10 +IN3 11 VSS 12 +IN4 13 -IN4 14 OUT4 Package SSOP5 SOP8 SSOP-B8 MSOP8 SOP14 SSOP-B14 BU7485G BU7485SG BU7486F BU7486SF BU7486FV BU7486SFV BU7486FVM BU7486SFVM BU7487F BU7487SF BU7487FV BU7487SFV www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Ordering Information B U 7 4 8 x x x x x - xx Packaging and forming specification E2: Embossed tape and reel (SOP8/SSOP-B8/SOP14/ SSOP-B14) TR: Embossed tape and reel (SSOP5/MSOP8) Package G:FVMIISSOP5 F:FVMESOP8 SOP14 FV:FMVSSOP-B8 SSOP-B14 FVM:FFMSOP8 Part Number BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Line-up Topr Package SSOP5 -40°C to +85°C -40°C to +105°C Absolute Maximum Ratings Operable Part Number Reel of 3000 BU7485G-TR SOP8 Reel of 2500 BU7486F-E2 SSOP-B8 Reel of 2500 BU7486FV-E2 MSOP8 Reel of 3000 BU7486FVM-TR SOP14 Reel of 2500 BU7487F-E2 SSOP-B14 Reel of 2500 BU7487FV-E2 SSOP5 Reel of 3000 BU7485SG-TR SOP8 Reel of 2500 BU7486SF-E2 SSOP-B8 Reel of 2500 BU7486SFV-E2 MSOP8 Reel of 3000 BU7486SFVM-TR SOP14 Reel of 2500 BU7487SF-E2 SSOP-B14 Reel of 2500 BU7487SFV-E2 (TA=25C) Symbol Parameter Supply Voltage Power dissipation Differential Input Voltage(Note 8) Input Common-mode Voltage Range Input Current(Note 9) Operating Supply Voltage Operating Temperature Storage Temperature Maximum Junction Temperature PD Ratings BU7485Sx/BU7486Sxxx /BU7487Sxx +7 0.54(Note 1,7) 0.55(Note 2,7) 0.50(Note 3,7) 0.47(Note 4,7) 0.45(Note 5,7) 0.70(Note 6,7) VDD – VSS BU7485G/BU7486xxx /BU7487xx VDD-VSS SSOP5 SOP8 SSOP-B8 MSOP8 SOP14 SSOP-B14 VID Unit V W V VICM (VSS - 0.3) to VDD + 0.3 V II Vopr Topr Tstg ±10 +3.0 to +5.5 -55 to +125 mA V C C +125 C -40 to +85 TJmax -40 to +105 (Note 1) (Note 2) (Note 3) (Note 4) (Note 5) (Note 6) (Note 7) (Note 8) To use at temperature above TA=25C reduce 5.4mW/°C. To use at temperature above TA=25C reduce 5.5mW/°C. To use at temperature above Ta＝25C reduce 5.0mW. To use at temperature above Ta＝25C reduce 4.7mW. To use at temperature above Ta＝25C reduce 4.5mW. To use at temperature above Ta＝25C reduce 7.0mW. Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm). The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input pin voltage is set to more than VSS. (Note 9) An excessive input current will flow when input voltages of more than VDD+0.6V or lesser than VSS-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Electrical Characteristics ○BU7485G, BU7485SG（Unless otherwise specified VDD=+3V, VSS=0V, TA=25C） Limits Temperature Parameter Symbol Range Min Typ Max Unit Condition Input Offset Voltage(Note 10) VIO 25C - 1 9.5 mV - Input Offset Current(Note 10) IIO 25C - 1 - pA - Input Bias Current(Note 10) IB 25C - 1 - pA - Supply Current(Note 11) IDD 25C - 1500 2000 Full range - - 2400 VOH 25C VDD-0.1 - VOL 25C - AV 25C VICM μA RL =∞ Av=0dB, IN=0.8V - V RL =10kΩ - VSS+0.1 V RL =10kΩ 70 105 - dB RL =10kΩ 25C 0 - 1.6 V VSS ~ VDD-1.4V CMRR 25C 45 60 - dB - Power Supply Rejection Ratio PSRR 25C 60 80 - dB - Output Source Current (Note 12) ISOURCE 25C 4 8 - mA VDD-0.4V Output Sink Current (Note 12) ISINK 25C 7 12 - mA VSS+0.4V Slew Rate SR 25C - 10 - V/μs CL =25pF Unity Gain Frequency fT 25C - 10 - MHz CL =25pF, Av=40dB Phase Margin θ 25C - 50 - deg CL =25pF, Av=40dB THD+N 25C - 0.03 - % Maximum Output Voltage (High) Maximum Output Voltage (Low) Large Signal Voltage Gain Input Common-mode Voltage Range Common-mode Rejection Ratio Total Harmonic Distortion +Noise OUT=0.7VP-P, f=1kHz (Note 10) Absolute value (Note 11) Full range BU7485G: TA =-40C to +85C BU7485SG: TA =-40C to +105C (Note 12) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Electrical Characteristics - continued ○BU7486xxx, BU7486Sxxx（Unless otherwise specified VDD=+3V, VSS=0V, TA =25C） Limits Temperature Parameter Symbol Unit Range Min Typ Max Condition Input Offset Voltage(Note 13) VIO 25C - 1 9.5 mV - Input Offset Current(Note 13) IIO 25C - 1 - pA - Input Bias Current(Note 13) IB 25C - 1 - pA - Supply Current(Note 14) IDD 25C - 3000 4000 Full range - - 4500 VOH 25C VDD-0.1 - VOL 25C - AV 25C VICM μA RL =∞ Av=0dB, IN=0.8V - V RL =10kΩ - VSS+0.1 V RL =10kΩ 70 105 - dB RL =10kΩ 25C 0 - 1.6 V VSS ~ VDD-1.4V CMRR 25C 45 60 - dB - Power Supply Rejection Ratio PSRR 25C 60 80 - dB - Output Source Current (Note 15) ISOURCE 25C 4 8 - mA VDD-0.4V Output Sink Current (Note 15) ISINK 25C 7 12 - mA VSS+0.4V Slew Rate SR 25C - 10 - V/μs CL =25pF Unity Gain Frequency fT 25C - 10 - MHz CL =25pF, Av=40dB Phase Margin θ 25C - 50 - deg CL =25pF, Av=40dB THD+N 25C - 0.03 - % OUT=0.7VP-P, f=1kHz CS 25C - 100 - dB Av=40dB Maximum Output Voltage (High) Maximum Output Voltage (Low) Large Signal Voltage Gain Input Common-mode Voltage Range Common-mode Rejection Ratio Total Harmonic Distortion +Noise Channel Separation (Note 13) Absolute value (Note 14) Full range BU7486xxx: TA =-40C to +85C BU7486Sxxx: TA =-40C to +105C (Note 15) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Electrical Characteristics - continued ○BU7487xx, BU7487Sxx（Unless otherwise specified VDD=+3V, VSS=0V, TA =25C） Limits Temperature Parameter Symbol Range Min Typ Max Unit Condition Input Offset Voltage(Note 16) VIO 25C - 1 9.5 mV - Input Offset Current(Note 16) IIO 25C - 1 - pA - Input Bias Current(Note 16) IB 25C - 1 - pA - Supply Current(Note 17) IDD 25C - 6000 8000 Full range - - 9000 VOH 25C VDD-0.1 - VOL 25C - AV 25C VICM μA RL =∞ Av=0dB, IN=0.8V - V RL =10kΩ - VSS+0.1 V RL =10kΩ 70 105 - dB RL =10kΩ 25C 0 - 1.6 V VSS ~ VDD-1.4V CMRR 25C 45 60 - dB - Power Supply Rejection Ratio PSRR 25C 60 80 - dB - Output Source Current (Note 18) ISOURCE 25C 4 8 - mA VDD-0.4V Output Sink Current (Note 18) ISINK 25C 7 12 - mA VSS+0.4V Slew Rate SR 25C - 10 - V/μs CL =25pF Unity Gain Frequency fT 25C - 10 - MHz CL =25pF, Av=40dB Phase Margin θ 25C - 50 - deg CL =25pF, Av=40dB THD+N 25C - 0.03 - % OUT=0.7VP-P, f=1kHz CS 25C - 100 - dB Av=40dB Maximum Output Voltage (High) Maximum Output Voltage (Low) Large Signal Voltage Gain Input Common-mode Voltage Range Common-mode Rejection Ratio Total Harmonic Distortion +Noise Channel Separation (Note 16) Absolute value (Note 17) Full range BU7487xx: TA =-40C to +85C BU7487Sxx: TA =-40C to +105C (Note 18) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or general document. 1. Absolute maximum ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (VDD/VSS) Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without deterioration or destruction of characteristics of internal circuit. (2) Differential Input Voltage (VID) Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the IC. (3) Input Common-mode Voltage Range (VICM) Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. (4) Power Dissipation (PD) Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C (normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical characteristics (1) Input Offset Voltage (VIO) Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the input voltage difference required for setting the output voltage at 0 V. (2) Input Offset Current (IIO) Indicates the difference of input bias current between the non-inverting and inverting terminals. (3) Input Bias Current (IB) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) Supply Current (IDD) Indicates the current that flows within the IC under specified no-load conditions. (5) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL) Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output voltage low indicates the lower limit. (6) Large Signal Voltage Gain (AV) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. Av = (Output voltage) / (Differential Input voltage) (7) Input Common-mode Voltage Range (VICM) Indicates the input voltage range where IC normally operates. (8) Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset voltage fluctuation) (9) Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR= (Change of power supply voltage)/(Input offset voltage fluctuation) (10) Output Source Current/ Output Sink Current (ISOURCE / ISINK) The maximum current that can be output from the IC under specific output conditions. The output source current indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. (11) Slew Rate (SR) Indicates the ratio of the change in output voltage with time when a step input signal is applied. (12) Unity Gain Frequency (fT) Indicates a frequency where the voltage gain of operational amplifier is 1. (13) Phase Margin (θ) Indicates the margin of phase from 180 degree phase lag at unity gain frequency. (14) Total Harmonic Distortion+Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. (15) Channel Separation (CS) Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves ○BU7485G, BU7485SG 0.8 POWER DISSIPATION [W] . POWER DISSIPATION [W] . 0.8 0.6 BU7485G 0.4 0.2 0 BU7485SG 0.4 0.2 0 85 0 0.6 25 50 75 100 AMBIENT TEMPERATURE [°C] 105 25 50 75 100 AMBIENT TEMPERATURE [°C] 0 125 Figure 3. Derating curve 4 4 3 3 SUPPLY CURRENT [mA] SUPPLY CURRENT [mA] Figure 2. Derating curve 85C 105C 2 25C 1 125 -40C 0 5.5V 4.0V 2 3.0V 1 0 2.5 3 3.5 4 4.5 5 SUPPLY VOLTAGE [V] 5.5 6 -50 Figure 4. Supply Current vs Supply Voltage -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 5. Supply Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7485G: -40C to +85C BU7485SG: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx Datasheet BU7487Sxx Typical Performance Curves - Continued ○BU7485G, BU7485SG 6 6 85C 4 25C -40C 3 2 1 4.0V 4 3.0V 3 2 1 0 0 2 3 4 5 SUPPLY VOLTAGE [V] -50 6 Figure 6. Maximum Output Voltage High vs Supply Voltage (RL =10kΩ) -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 7. Maximum Output Voltage High vs Ambient Temperature (RL =10kΩ) 20 OUTPUT VOLTAGE LOW [mV] 20 OUTPUT VOLTAGE LOW [mV] 5.5V 5 105C OUTPUT VOLTAGE HIGH [V] OUTPUT VOLTAGE HIGH [V] 5 15 10 85C 105C 25C 5 15 10 5.5V 4.0V 5 3.0V -40C 0 0 2.5 3 3.5 4 4.5 5 SUPPLY VOLTAGE [V] 5.5 Figure 8. Maximum Output Voltage Low vs Supply Voltage (RL =10kΩ) -50 6 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 9. Maximum Output Voltage Low vs Ambient Temperature (RL =10kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7485G: -40C to +85C BU7485SG: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx Datasheet BU7487Sxx Typical Performance Curves - Continued ○BU7485G, BU7485SG 20 OUTPUT SOURCE CURRENT [mA] OUTPUT SOURCE CURRENT [mA] 50 40 -40C 30 25C 20 10 105C 85C 15 5.5V 4.0V 10 5 3.0V 0 0 0 0.5 1 1.5 2 2.5 -50 3 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] OUTPUT VOLTAGE [V] Figure 11. Output Source Current vs Ambient Temperature (OUT=VDD-0.4V) Figure 10. Output Source Current vs Output Voltage (VDD=3V) 40 80 OUTPUT SINK CURRENT [mA] OUTPUT SINK CURRENT [mA] 70 60 -40C 25C 50 40 30 20 85C 105C 10 30 4.0V 5.5V 20 10 3.0V 0 0 0.0 0.5 1.0 1.5 2.0 2.5 -50 3.0 -25 0 25 50 75 100 125 OUTPUT VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 12. Output Sink Current vs Output Voltage (VDD=3V) Figure 13. Output Sink Current vs Ambient Temperature (OUT=VSS+0.4V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7485G: -40C to +85C BU7485SG: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7485G, BU7485SG 7.5 7.5 INPUT OFFSET VOLTAGE [mV] 10.0 INPUT OFFSET VOLTAGE [mV] 10.0 5.0 2.5 105C 85C 0.0 25C -2.5 -40C -5.0 -7.5 5.0 2.5 5.5V 0.0 3.0V -2.5 -5.0 -7.5 -10.0 -10.0 2 3 4 5 6 -50 -25 SUPPLY VOLTAGE [V] Figure 14. Input Offset Voltage vs Supply Voltage (VICM =VDD-1.4V, OUT=1.5V) 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 15. Input Offset Voltage vs Ambient Temperature (VICM =VDD-1.4V, OUT=1.5V) 140 LARGE SIGNAL VOLTAGE GAIN [dB] L 15 INPUT OFFSET VOLTAGE [mV] 4.0V 10 5 85C 105C 0 25C -40C -5 -10 120 -40C 100 80 105C 85C 25C 60 40 20 -15 0 -1 0 1 2 COMMON MODE INPUT VOLTAGE [V] 3 2 Figure 16. Input Offset Voltage vs Common Mode Input Voltage (VDD=3V) 3 4 5 SUPPLY VOLTAGE [V] 6 Figure 17. Large Signal Voltage Gain vs Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7485G: -40C to +85C BU7485SG: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7485G, BU7485SG 120 COMMON MODE REJECTION RATIO [dB]L LARGE SIGNAL VOLTAGE GAIN [dB] L 160 140 120 5.5V 4.0V 3.0V 100 80 100 80 25C 85C 105C 60 40 20 60 0 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 2 Figure 18 Large Signal Voltage Gain vs Ambient Temperature 3 4 5 SUPPLY VOLTAGE [V] 6 Figure 19. Common Mode Rejection Ratio vs Supply Voltage 120 POWER SUPPLY REJECTION RATIO [dB] 120 COMMON MODE REJECTION RATIO [dB]L -40C 3.0V 100 80 4.0V 5.5V 60 40 20 100 80 60 40 20 0 0 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 -50 Figure 20. Common Mode Rejection Ratio vs Ambient Temperature -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 21. Power Supply Rejection Ratio vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7485G: -40C to +85C BU7485SG: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7485G, BU7485SG 12.0 30.0 5.5V 25.0 4.0V 3.0V 8.0 SLEW RATE H-L [V/μs] SLEW RATE L-H [V/μs] 10.0 6.0 4.0 2.0 5.5V 20.0 4.0V 15.0 3.0V 10.0 5.0 0.0 0.0 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 -50 Figure 22. Slew Rate L-H vs Ambient Temperature 100 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 23. Slew Rate H-L vs Ambient Temperature 200 Phase 150 60 100 40 Gain 50 20 0 1.E+00 1 PHASE [deg] GAIN[dB] 80 0 1.E+01 101 1.E+02 102 1.E+03 103 1.E+04 104 1.E+05 105 FREQUENCY [kHz] Figure 24. Voltage Gain・Phase vs Frequency （VDD=+3V, VSS=0V, TA=25C） (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7485G: -40C to +85C BU7485SG: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx Datasheet BU7487Sxx Typical Performance Curves - Continued ○BU7486xxx, BU7486Sxxx 0.8 0.6 POWER DISSIPATION [W] . POWER DISSIPATION [W] . 0.8 BU7486F BU7486FV 0.4 0.2 BU7486FVM 0 0 0.6 BU7486SF BU7486SFV 0.4 0.2 BU7486SFVM 85 25 50 75 100 AMBIENT TEMPERATURE [°C] 0 125 0 105 25 50 75 100 AMBIENT TEMPERATURE [°C] Figure 25. Derating curve Figure 26. Derating curve 5.0 5.0 4.5 4.5 105C 85C 3.5 3.0 2.5 2.0 25C -40C 1.5 1.0 4.0V 3.5 3.0 2.5 1.5 1.0 0.5 0.0 0.0 3 4 5 SUPPLY VOLTAGE [V] 3.0V 2.0 0.5 2 5.5V 4.0 SUPPLY CURRENT [mA] 4.0 SUPPLY CURRENT [mA] 125 -50 6 Figure 27. Supply Current vs Supply Voltage -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 28. Supply Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7486xxx, BU7486Sxxx 6 6 105C 5 OUTPUT VOLTAGE HIGH [V] OUTPUT VOLTAGE HIGH [V] 5 25C 85C 4 -40C 3 2 1 4.0V 4 3 3.0V 2 1 0 0 2 3 4 5 SUPPLY VOLTAGE [V] 6 -50 Figure 29. Maximum Output Voltage High vs Supply Voltage (RL =10kΩ) 10 10 9 9 8 105C 7 85C 6 5 4 25C 3 -40C 2 4.0V 5 4 3 3.0V 2 0 Figure 31. Maximum Output Voltage Low vs Supply Voltage (RL =10kΩ) 5.5V 6 0 4 5 SUPPLY VOLTAGE [V] 125 7 1 3 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 8 1 2 -25 Figure 30. Maximum Output Voltage High vs Ambient Temperature (RL =10kΩ) OUTPUT VOLTAGE LOW [mV] OUTPUT VOLTAGE LOW [mV] 5.5V -50 6 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 32. Maximum Output Voltage Low vs Ambient Temperature (RL =10kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx Datasheet BU7487Sxx Typical Performance Curves - Continued ○BU7486xxx, BU7486Sxxx 40 OUTPUT SOURCE CURRENT [mA] OUTPUT SOURCE CURRENT [mA] 40 30 -40C 25C 20 85C 105C 10 30 20 4.0V 5.5V 10 3.0V 0 0 0 0.5 1 1.5 2 OUTPUT VOLTAGE [V] 2.5 -50 3 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] Figure 33. Output Source Current vs Output Voltage (VDD=3V) Figure 34. Output Source Current vs Ambient Temperature (OUT=VDD-0.4V) 40 60 50 -40C 25C OUTPUT SINK CURRENT [mA] OUTPUT SINK CURRENT [mA] -25 40 30 105C 85C 20 10 30 4.0V 5.5V 20 10 0 3.0V 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 OUTPUT VOLTAGE [V] -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] Figure 36. Output Sink Current vs Ambient Temperature (OUT=VSS+0.4V) Figure 35. Output Sink Current vs Output Voltage (VDD=3V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued 10 10.0 8 7.5 INPUT OFFSET VOLTAGE [mV] INPUT OFFSET VOLTAGE [mV] ○BU7486xxx, BU7486Sxxx 5 25℃ -40℃ 3 0 85℃ 105℃ -3 -5 5.0 3.0V -2.5 -5.0 -7.5 -10 -10.0 3 4 5 SUPPLY VOLTAGE [V] 6 -50 Figure 37. Input Offset Voltage vs Supply Voltage -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 38. Input Offset Voltage vs Ambient Temperature 15 140 LARGE SIGNAL VOLTAGE GAIN [dB] L INPUT OFFSET VOLTAGE [mV] 5.5V 0.0 -8 2 4.0V 2.5 10 -40℃ 5 25℃ 0 105℃ 85℃ -5 -10 -40℃ 120 25℃ 100 80 105℃ 85℃ 60 40 20 -15 0 -1 0 1 2 INPUT VOLTAGE [V] 3 2 Figure 39. Input Offset Voltage vs Common Mode Input Voltage (VDD=3V) 3 4 5 SUPPLY VOLTAGE [V] 6 Figure 40. Large Signal Voltage Gain vs Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7486xxx, BU7486Sxxx 120 COMMON MODE REJECTION RATIO [dB]. LARGE SIGNAL VOLTAGE GAIN [dB] . 120 110 3.0V 100 5.5V 90 4.0V 80 70 110 -40℃ 90 85℃ 105℃ 80 70 60 60 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 2 125 3 4 5 SUPPLY VOLTAGE [V] 6 Figure 42. Common Mode Rejection Ratio vs Supply Voltage Figure 41. Large Signal Voltage Gain vs Ambient Temperature 120 120 POWER SUPPLY REJECTION RATIO [dB] COMMON MODE REJECTION RATIO [dB]. 25℃ 100 110 3.0V 100 90 4.0V 5.5V 80 70 100 80 60 40 20 0 60 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] -50 125 Figure 43. -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 44. Power Supply Rejection Ratio vs Ambient Temperature Common Mode Rejection Ratio vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued 15 25 12 20 SLEW RATE H-L [V/μs] SLEW RATE L-H [V/μs] ○BU7486xxx, BU7486Sxxx 5.5V 9 3.0V 4.0V 6 5.5V 4.0V 15 3.0V 10 3 5 0 0 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 -50 Figure 45. Slew Rate L-H vs Ambient Temperature 100 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 46. Slew Rate H-L vs Ambient Temperature 200 Phase 150 60 100 40 Gain 50 20 0 1.E+00 1 PHASE [deg] GAIN[dB] 80 0 1.E+01 101 1.E+02 102 1.E+03 103 1.E+04 104 1.E+05 105 FREQUENCY [kHz] Figure 47. Voltage Gain・Phase vs Frequency （VDD=+3V, VSS=0V, TA=25C） (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx Datasheet BU7487Sxx Typical Performance Curves ○BU7487xx, BU7487Sxx 800 600 POWER DISSIPATION [mW] . POWER DISSIPATION [mW] . 800 BU7487FV 400 BU7487F 200 0 0 25 50 75 85 600 BU7487SFV 400 200 BU7487SF 0 100 0 125 25 50 105 100 125 AMBIENT TEMPERATURE [°C ] Figure 49. Derating curve AMBIENT TEMPERATURE [°C ] Figure 48. Derating curve 10 10 105C 9 9 4.0V 85C 8 8 SUPPLY CURRENT [mA] . SUPPLY CURRENT [mA] 75 7 6 25C 5 -40C 4 3 2 7 6 4 3 2 1 0 0 3 4 5 SUPPLY VOLTAGE [V] 6 3.0V 5 1 2 5.5V -50 Figure 50. Supply Current vs Supply Voltage -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 51. Supply Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7487xx, BU7487Sxx 6 6 105C 5 25C 4 85C 3 5.5V OUTPUT VOLTAGE HIGH [V] OUTPUT VOLTAGE HIGH [V] 5 -40C 2 1 4.0V 4 3 3.0V 2 1 0 0 2 3 4 5 SUPPLY VOLTAGE [V] 6 -50 10 10 9 9 8 105C 7 85C 6 5 4 3 -40C 2 25C 7 4 3 3.0V 2 0 6 4.0V 5 0 4 5 SUPPLY VOLTAGE [V] 5.5V 6 1 3 125 8 1 2 0 25 50 75 100 AMBIENT TEMPERATURE [°C] Figure 53. Maximum Output Voltage High vs Ambient Temperature (RL =10kΩ) OUTPUT VOLTAGE LOW [mV] OUTPUT VOLTAGE LOW [mV] Figure 52. Maximum Output Voltage High vs Supply Voltage (RL =10kΩ) -25 -50 Figure 54. Maximum Output Voltage Low vs Supply Voltage (RL =10kΩ) -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 55. Maximum Output Voltage Low vs Ambient Temperature (RL =10kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx Datasheet BU7487Sxx Typical Performance Curves - Continued ○BU7487xx, BU7487Sxx 40 OUTPUT SOURCE CURRENT [mA] . OUTPUT SOURCE CURRENT [mA] 40 30 -40C 25C 20 85C 10 105C 30 20 4.0V 5.5V 10 3.0V 0 0 0 0.5 1 1.5 2 2.5 3 -50 -25 OUTPUT VOLTAGE [V] 25 50 75 100 125 AMBIENT TEMPERATURE [°C] Figure 56. Output Source Current vs Output Voltage (VDD=3V) Figure 57. Output Source Current vs Ambient Temperature (OUT=VDD-0.4V) 60 40 -40C 50 OUTPUT SINK CURRENT [mA] OUTPUT SINK CURRENT [mA] 0 25C 40 30 85C 105C 20 10 30 4.0V 5.5V 20 3.0V 10 0 0 0.0 0.5 1.0 1.5 2.0 2.5 -50 3.0 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] OUTPUT VOLTAGE [V] Figure 58. Output Sink Current vs Output Voltage (VDD=3V) Figure 59. Output Sink Current vs Ambient Temperature (OUT=VSS+0.4V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 22/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued 3 3 2 2 25C INPUT OFFSET VOLTAGE [mV] . INPUT OFFSET VOLTAGE [mV] ○BU7487xx, BU7487Sxx -40C 1 85C 0 105C -1 -2 1 4.0V 0 5.5V -1 -2 -3 -3 2 3 4 5 SUPPLY VOLTAGE [V] -50 6 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 61. Input Offset Voltage vs Ambient Temperature Figure 60. Input Offset Voltage vs Supply Voltage 140 LARGE SIGNAL VOLTAGE GAIN [dB] . 15 INPUT OFFSET VOLTAGE [mV] 3.0V 10 5 25℃ -40℃ 0 85℃ 105℃ -5 -10 -40℃ 120 25℃ 100 80 105℃ 85℃ 60 40 20 0 -15 -1 0 1 2 INPUT VOLTAGE [V] 2 3 Figure 62. Input Offset Voltage vs Common Mode Input Voltage (VDD=3V) 3 4 5 SUPPLY VOLTAGE [V] 6 Figure 63. Large Signal Voltage Gain vs Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 23/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7487xx, BU7487Sxx 120 COMMON MODE REJECTION RATIO [dB]L LARGE SIGNAL VOLTAGE GAIN [dB] . 120 110 100 3.0V 5.5V 90 4.0V 80 70 110 25℃ 90 85℃ 105℃ 80 70 60 60 -50 2 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] Figure 64. Large Signal Voltage Gain vs Ambient Temperature -25 3 4 5 SUPPLY VOLTAGE [V] 6 Figure 65. Common Mode Rejection Ratio vs Supply Voltage 120 120 POWER SUPPLY REJECTION RATIO [dB] COMMON MODE REJECTION RATIO [dB]L -40℃ 100 110 100 3.0V 4.0V 90 5.5V 80 70 100 80 60 40 20 0 60 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] -50 125 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 67. Power Supply Rejection Ratio vs Ambient Temperature Figure 66. Common Mode Rejection Ratio vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 24/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Typical Performance Curves - Continued ○BU7487xx, BU7487Sxx 25 16 20 12 SLEW RATE H-L [V/μs] SLEW RATE L-H [V/μs] 14 5.5V 10 8 4.0V 3.0V 6 4 5.5V 15 4.0V 10 3.0V 5 2 0 0 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] -50 125 Figure 68. Slew Rate L-H vs Ambient Temperature -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 69. Slew Rate H-L vs Ambient Temperature 200 100 Phase 150 60 100 40 Gain 50 20 0 1.E+00 1 PHASE [deg] GAIN[dB] 80 0 1.E+01 101 1.E+02 102 1.E+03 103 1.E+04 104 1.E+05 105 FREQUENCY [kHz] Figure 70. Voltage Gain・Phase vs Frequency （VDD=+3V, VSS=0V, TA=25C） (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 25/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Application Information NULL method condition for Test circuit1 VDD, VSS, EK, VICM, VRL Unit:V, RL Unit:ohms Parameter Input Offset Voltage VF SW1 SW2 SW3 VDD VSS EK VICM VRL RL Calculation VF1 ON ON OFF 3 0 -1.5 1.6 - - 1 ON ON ON 3 0 0.8 0 10k 2 ON ON OFF 3 0 -1.5 - - 3 ON ON OFF 0 -1.5 - - 4 VF2 Large Signal Voltage Gain VF3 VF4 Common-mode Rejection Ratio (Input Common-mode Voltage Range) VF5 VF6 Power Supply Rejection Ratio VF7 3 5.5 -0.5 -2.5 0 1.6 0 －Calculation－ VIO = 1. Input Offset Voltage (VIO) |VF1| 1 + RF/RS Av = 20Log 2. Large Signal Voltage Gain (Av) [V] EK × (1+RF/RS) |VF3 - VF2| [dB] VICM × (1+RF/RS) |VF5 - VF4| 3. Common-mode Rejection Ratio (CMRR) CMRR = 20Log 4. Power Supply Rejection Ratio (PSRR) PSRR = 20Log VDD × (1+ RF/RS) |VF7 - VF6| [dB] [dB] 0.1μF RF=50kΩ SW1 RS=50Ω 500kΩ VDD RI=1MΩ Vo 0.01μF 15V EK 500kΩ 0.015μF 0.015μF DUT SW3 RS=50Ω 1000pF RI=1MΩ RL VICM 50kΩ NULL SW2 V VF VRL -15V VSS Figure 71. Test circuit 1 (one channel only) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 26/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Switch Condition for Test circuit2 SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 Parameter Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage RL=10kΩ OFF ON OFF OFF ON OFF OFF Output Current OFF ON OFF OFF ON OFF OFF OFF OFF Slew Rate OFF OFF Unity Gain Frequency ON ON OFF OFF OFF OFF OFF ON ON ON ON OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF OFF ON SW3 R2 100kΩ SW4 ● VDD=3V － SW1 SW2 ＋ SW5 SW6 SW7 SW8 SW9 RL CL SW10 SW11 SW12 R1 1kΩ VSS VIN- VIN+ Vo Figure 72. Test circuit 2 OUT[V] IN [V] SR = ∆ V / ∆ t 1.6 V 1.6 V ∆V 1.6 V P-P 0V 0V t t ∆t Input wave Output wave Figure 73. Slew rate input output wave R2=100kΩ R2=100kΩ VDD R1=1kΩ VDD R1=1kΩ OUT1 VIN R1//R2 OUT2 R1//R2 VSS VSS CS=20Log 100×OUT1 OUT2 Figure 74. Test circuit 3 (Channel Separation) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 27/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Application example ○Voltage follower VDD Voltage gain is 0dB. Using this circuit, the output voltage (OUT) is configured to be equal to the input voltage (IN). This circuit also stabilizes the output voltage (OUT) due to high input impedance and low output impedance. Computation for output voltage (OUT) is shown below. OUT=IN OUT IN VSS Figure 75. Voltage follower ○Inverting amplifier R2 For inverting amplifier, input voltage (IN) is amplified by a voltage gain and depends on the ratio of R1 and R2. The out-of-phase output voltage is shown in the next expression OUT=-(R2/R1)・IN This circuit has input impedance equal to R1. VDD R1 IN OUT VSS Figure 76. Inverting amplifier circuit ○Non-inverting amplifier R1 R2 VDD OUT IN For non-inverting amplifier, input voltage (IN) is amplified by a voltage gain, which depends on the ratio of R1 and R2. The output voltage (OUT) is in-phase with the input voltage (IN) and is shown in the next expression. OUT=(1 + R2/R1)・IN Effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. VSS Figure 77. Non-inverting amplifier circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 28/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 78 (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation (PD). θJA = (TJmax-TA) / PD °C/W The Derating curve in Figure 78 (b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 79. (a) to (f) shows an example of the derating curve for BU7485G, BU7485SG, BU7486xxx, BU7486Sxxx, BU7487xx, BU7487Sxx. Power dissipation of LSI [W] PDmax Power dissipation of IC θJA=(TJmax-TA)/ PD °C/W Ambient temperature TA [ °C ] P2 θJA2 < θJA1 P1 θJA2 TJmax θJA1 0 Chip surface temperature TJ [ °C ] 25 50 75 100 125 Ambient temperature TA[C] (b) Derating Curve (a) Thermal Resistance Figure 78. Thermal resistance and Derating Curve 0.8 POWER DISSIPATION [W]. POWER DISSIPATION [W]. 0.8 0.6 BU7485G (Note 19) 0.4 0.2 0 0 25 50 75 85 0.6 BU7485SG (Note 19) 0.4 0.2 0 100 125 0 25 50 75 105 100 125 AMBIENT TEMPERATURE [℃ ] AMBIENT TEMPERATURE [℃ ] (b) BU7485SG (a) BU7485G Figure 79. Derating Curve www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 29/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Power Dissipation - continued 0.8 0.6 POWER DISSIPATION [W] POWER DISSIPATION [W]. 0.8 BU7486F (Note 20) BU7486FV (Note 21) 0.4 BU7486FVM (Note 22) 0.2 0 0 25 50 75 0.6 BU7486SF (Note 20) BU7486SFV (Note 21) 0.4 BU7486SFVM (Note 22) 0.2 0 85 100 0 125 25 75 105 100 125 AMBIENT TEMPERATURE [℃ ] AMBIENT TEMPERATURE [℃ ] (c) BU7486F/FV/FVM (d) BU7486SF/SFV/SFVM 0.8 0.8 BU7487FV (Note 23) POWER DISSIPATION [W]. POWER DISSIPATION [W]. 50 0.6 0.4 BU7487F (Note 24) 0.2 0 0 25 50 75 85 BU7487SFV (Note 23) 0.6 0.4 BU7487SF (Note 24) 0.2 0 100 125 0 25 50 75 105 100 125 AMBIENT TEMPERATURE [℃ ] AMBIENT TEMPERATURE [℃ ] (e) BU7487F/FV (f) BU7487SF/SFV (Note19) (Note20) (Not21) (Note22) (Note23) (Note24) Unit 5.4 5.5 5.0 4.7 7.0 4.5 mW/C When using the unit above TA=25C, subtract the value above per degree C. Power dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted. Figure 79. Derating Curve www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 30/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the PD rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 31/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Operational Notes – continued 13. Unused Circuits When there are unused op-amps, it is recommended that they are connected as in Figure 80, setting the non-inverting input terminal to a potential within the input common mode voltage range (VICM). VDD Keep this potential in VICM VICM VSS Figure 80. Example of Application Circuit for Unused Op-amp 14. Input Voltage Applying (VSS－0.3) to (VDD+0.3) to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, regardless of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 15. Power Supply(single/dual) The op-amp operates when the voltage supplied is between VDD and VSS. Therefore, the single supply op-amp can be used as dual supply op-amp as well. 16. Output Capacitor If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into the output pin and may destroy the IC when the VDD pin is shorted to ground or pulled down to 0V. Use a capacitor smaller than 0.1uF between output pin and VSS pin. 17. Oscillation by Output Capacitor Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop circuit with these ICs. 18. Latch up Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and protect the IC from abnormaly noise. 18. Crossover Distortion Inverting amplifier generates crossover distortion when feedback resistance value is small. To suppress the crossover distortion, connect a resistor between the output terminal and VSS. Feedback Resistor VDD Pull-down Resistor VSS Figure 81. To Suppress the Crosover Distortion www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 32/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Physical Dimensions Tape and Reel Information Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SSOP5 33/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Physical Dimensions Tape and Reel Information - continued Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 34/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Physical Dimensions Tape and Reel Information - continued Package Name SSOP-B8 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 35/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Physical Dimensions Tape and Reel Information - continued Package Name MSOP8 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin Direction of feed Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ∗ Order quantity needs to be multiple of the minimum quantity. 36/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Physical Dimensions Tape and Reel Information - continued Package Name SOP14 (Max 9.05 (include.BURR)) (UNIT : mm) PKG : SOP14 Drawing No. : EX113-5001 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 37/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Physical Dimensions Tape and Reel Information - continued Package Name SSOP-B14 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 38/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Marking Diagram SSOP5(TOP VIEW) SOP8(TOP VIEW) Part Number Marking Part Number Marking LOT Number 1PIN MARK LOT Number SSOP-B8(TOP VIEW) MSOP8(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK SOP14(TOP VIEW) Part Number Marking SSOP-B14(TOP VIEW) Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK Product Name BU7485 BU7485S Package Type G F BU7486 FV FVM F BU7486S BU7487 BU7487S FV SSOP5 Marking D5 FC SOP8 SSOP-B8 7486 MSOP8 SOP8 7486S SSOP-B8 486S FVM MSOP8 7486S F SOP14 BU7487F FV F FV www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SSOP-B14 SOP14 SSOP-B14 7487 BU7487SF 7487S 39/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx Datasheet Revision History Date Revision Changes 12.Jul.2013 001 New Release 06.Mar.2015 002 21.Oct.2016 003 Correction of Figure number (page.29 Power Dissipation) P.1…Add (Typ) for Slew Rate, Corrected BU7485S→BU7485SG P.3…Corrected Power dissipation of SOP14, SSOP-B14 P.5…Corrected (Note14) BU7485G→BU7486xxx, BU7485SG→BU7486Sxxx P.6…Corrected (Note17) BU7485G→BU7487xx, BU7485SG→BU7487Sxx P.7…Corrected Input offset fluctuation→Input offset voltage fluctuation P.12…Corrected explanatory notes at Figure 18 P.16…Corrected the scale at Figure 33, 35 P.18…Corrected explanatory notes at Figure 41 P.20…Corrected explanatory notes at Figure 48, 49 P.22…Corrected the scale at Figure 56, 58 P.26…Corrected S1～S3→SW1～SW3, and EK, VICM value, Add VRL, RL P.27…Corrected SW No.→Parameter, Figure 73 1.8V→1.6V P.29, 30…Corrected Figure 79 (c)～(h)→(a)～(f), explanatory notes at (e), (f) P.31…Corrected Operational Notes 2, Add “Unused Input Pins” P.32…Add “Unused Circuits”, Corrected each Numbering P.39…Corrected SSOP5 Marking Diagram P.40…Delete Land pattern data www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 40/40 TSZ02201-0GMG0G200380-1-2 21.Oct.2016 Rev.003 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. 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Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. 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ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001