Audio Accessory ICs for Mobile Devices
Mixer & Selector IC with PCM CODEC and 16bit D/A Converter
BU7861KN
No.10087EAT04
●Description The “In/Output Selector with Built-in PCM Codec 16bit D/A Converter” LSI is ideal for improving the sound quality of and miniaturizing cellular phone handsets with music playback function, accumulating analog circuits for sound which application CPUs and bass band LSIs are not ideally able to handle. ●Features 1) Loaded with stereo 16bit audio D/A converter 2) Compatible with stereo and analog interfaces 3) Built-in stereo headphone amp (16Ω) 4) Lowpass correction circuit built into the headphone amp 5) Gain-adjustable volume built in 6) Flexible mixing function built in ●Applications Portable information communication devices such as cellular phone handsets and PDA (Personal Digital Assistants) Cellular phone handsets with music playback function ●Absolute maximum ratings Parameter Supply Voltage Power Dissipation Operational Temperature Range Storage Temperature Range Symbol DVDD AVDD, PVDD Pd TOPR TSTG Ratings -0.3 ~ 4.5 500 *1 -25 ~ +80 -55 ~ +125 Unit V mW ℃ ℃
*1 When used at over Ta=25℃, lessen by 5.0mW per 1℃ increase.
●Operating conditions Parameter Digital Supply Voltage Analog Supply Voltage Power Supply Voltage PLL Synchronous Signal Frequency Symbol DVDD AVDD PVDD FSYNC Ratings Min. 2.7 2.7 2.7 - Typ. 3.0 3.0 3.0 8 Max. 3.3 3.3 3.3 - Unit V V V kHz
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2010.09 - Rev.A
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●Electrical characteristics (Unless specified, Ta=25℃, DVDD=AVDD=3.0V, PVDD=3.0V, FSYNC=8kHz) ・Complete Block Parameter Consumed Current 1 Consumed Current 2 Consumed Current 3 Consumed Current 4 Consumed Current 5 Consumed Current 6 Consumed Current 7 Consumed Current 8 Consumed Current 9 Consumed Current 10 Consumed Current 11 Consumed Current 12 Digital High Level Input Voltage Digital Low Level Input Voltage Digital High Level Input Current Digital Low Level Input Current Digital High Level Output Voltage Digital Low Level Output Voltage Schmidt Input Hysteresis Width Symbol IDD1 IDD2 IDD3 IDD4 IDD5 IDD6 IDD7 IDD8 IDD9 IDD10 IDD11 IDD12 VIH VIL IIH IIL VOH VOL Vhys Limits Min. - - - - - - - - - - - - 0.8× DVDD - - -10 DVDD -0.5 - 0.3 Typ. 0.1 0.8 1.7 1.6 1.0 5.9 6.4 2.2 2.9 2.2 10.0 18.0 - - - - - - 0.5 Max. 10 1.2 2.6 2.4 1.5 9.0 9.6 3.3 4.5 3.3 15.0 27.0 - 0.2× DVDD 10 - - 0.5 0.7 Unit µA mA mA mA mA mA mA mA mA mA mA mA V V µA µA V V V VIH=DVDD VIL=0V IOH=-1mA IOL=1mA
Technical Note
Conditions When all power down, FSYNC L fixed REFON, FSYNC L fixed REFON+PLLON, FSYNC=8kHz REFON+MICBON, FSYNC L fixed
REFON+EXTOUT, FSYNC L fixed REFON+PLLON+VICON, FSYNC=8kHz REFON+PLLON+VICON+TONEON, FSYNC=8kHz REFON+RECON, REFON+HPON, FSYNC L fixed FSYNC L fixed FSYNC
REFON+ HPVOLON, L fixed DACON,
SYSCLK=256fs SYSCLK=256fs
All power on FSYNC=8kHz
SYSCLK, BCLK, LRCLK, FSYNC, DSPCLK
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2010.09 - Rev.A
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Technical Note
・Sound Block Parameter Frequency Characteristics DAC Full Scale Gain Error between Channels Distortion (No Bass Boost) Distortion (With Bass Boost) S/N Crosstalk Output Level during Mute ・Driver Amp Block Parameter Gain Configurable Range (THD≦1%) Maximum Output Voltage (THD≦1%) S/N PSRR Load Maximum Output Power (THD≦1%) Receiver Amp S/N Offset Voltage PSRR Load Stereo Headphone Amp Maximum Output Power (THD≦1%) 100Hz PSRR 1kHz Maximum Output Voltage (THD≦1%) Maximum Output Voltage (THD≦1%) 100Hz 1kHz 100Hz 1kHz Limits Min. 40 - 60 12 25 26 31.25 80 - 65 60 12 15 15 40 0.707 0.707 Typ. - 1.0 66 20 35 32 45 90 5 77 70 16 25 26 48 - - Max. - - - - - - - - 100 - - - - - - - - Unit dB Conditions f=100Hz~3.4kHz Limits Min. -3 1.4 - - 75 70 70 Typ. - 1.8 - - 83 80 80 Max. +3 2.2 ±1.5 1 10 - - - Unit dB VP-P dB % % dB dB dB Conditions Reference level (-20dB due to full scale) f=20Hz~20kHz -3dB band width 0.6×VDD Difference between Lch and Rch levels during DAC full scale DAC input=-0.5dBFS, HP_VOL=-2dB, HP2_VOL=0dB DAC input=-0.5dBFS, HP_VOL=-2dB, HP2_VOL=0dB During full scale HP_VOL, HP2_VOL=0dB, f=1kHz, A-weighted Stereo headphone amp included Measures the leak from Lch to Rch during full-scale output. 1kHz BPF 1kHz BPF
Vrms MICO terminal, f=1kHz dB dB Ω mW dB mV dB Ω mW dB RL=16Ω, f=1kHz 0.2VP-P superimposed to supply COMIN 1.0µF, HP_Vol=0dB 0.2VP-P superimposed to supply COMIN 1.0µF RL=32Ω, f=1kHz RL=32Ω, C-Message C-Message 0.2VP-P superimposed to supply COMIN 1.0µF, MICIN no input
Microphone Amp
SPOUT Terminal EXTOUT Terminal
Vrms RL=10kΩ, f=1kHz Vrms RL=3kΩ, f=1kHz
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2010.09 - Rev.A
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Technical Note
・Codec Block Parameter Transmitting Side Reference Input Level MICIN→ DSPOUT EXTIN→ DSPOUT DSPIN→ RECP DSPIN→ SPOUT DSPIN→ EXTOUT EXTIN→ RECN EXTIN→ SPOUT -45dBm0 -40dBm0 0, -30dBm0 -45dBm0 -40dBm0 0, -30dBm0 -55dBm0 -50dBm0 0, -40dBm0 -55dBm0 -50dBm0 0, -40dBm0 0.06kHz Transmitter Transmission Loss F Special MICIN→DSPOUT 0.2kHz 0.3~3.0kHz 3.4kHz 3.6kHz 3.78kHz Receiver Transmission Loss F Special DSPIN→RECP Noise during idle transmission Noise during idle reception Crosstalk (Transmitter→ Receiver) Crosstalk (Receiver→ Transmitter) RX Higher Harmonic Component 0.3~3.0kHz 3.4kHz 3.6kHz 3.78kHz MICIN→ DSPOUT DSPIN→ REC[P-N] MICIN→ REC[P-N] Limits Min. 0.44 Typ. 0.50 Max. 0.56 Unit Vrms Conditions When 1020Hz, sine wave, 0dBm0 transmitting MIC amp gain 0dB, Tx_Vol 0dB When 1020Hz, sine wave, 0dBm0 transmitting Amp gain 11.37dB, Tx_Vol 0dB At 1020Hz, sine wave, 0dBm0 input Rx_Vol 0dB At 1020Hz, sine wave, 0dBm0 input Rx_Vol 0dB At 1020Hz, sine wave, 0dBm0 input Rx_Vol 0dB EXTIN input, Rx_testline path Rx_Vol 0dB EXTIN input, Rx_testline path SPRX_Vol 0dB 1020Hz, sine wave, MIC amp gain 0dB Tx_Vol 0dB, C-MESSAGE 1020Hz, sine wave Rx_Vol 0dB, C-MESSAGE 1020Hz, -10dBm0 typical MIC amp gain 0dB Tx_Vol 0dB, C-MESSAGE 1020Hz, -10dBm0 typical Rx_Vol 0dB, C-MESSAGE
0.119 0.135 0.151 Vrms 0.44 0.44 0.44 2.4 2.4 24 29 35 24 29 35 -0.9 -0.6 -0.3 -0.9 -0.6 -0.3 24 0 -0.3 -0.3 0 6.5 -0.3 -0.3 0.0 6.5 - - 0.50 0.50 0.50 3.2 3.2 - - - - - - - - - - - - - - - - - - - - - - - - 0.56 0.56 0.56 4.0 4.0 - - - - - - 0.9 0.6 0.3 0.9 0.6 0.3 - 2.5 0.3 0.9 - - 0.5 0.9 - - -65 -75 dBm0 dBV dB dB dB dB dB dB Vrms Vrms Vrms dB dB
Receiving Side Reference Input Level
Pass Gain Transmitter Signal vs. General Power Distortion MICIN→DSPOUT Receiver Signal vs. General Power Distortion DSPIN→RECP Transmitter Transmission Level MICIN→DSPOUT Receiver Transmission Level DSPIN→RECP
1020Hz, 0dBm0 at transmission MIC amp gain 0dB Tx_Vol 0dB
1020Hz, 0dBm0 at input Rx_Vol 0dB MIC amp gain 0dB Tx_Vol 0dB, C-MESSAGE DSPIN ALL0 Rx_Vol 0dB, C-MESSAGE 1020Hz, 0dBm0 at transmission MIC amp gain 0dB DSPIN ALL0 Tx_Vol 0dB Rx_Vol 0dB ST_MT OFF 1020Hz, 0dBm0 at input, 2040Hz component MIC amp gain 30dB Tx_Vol 0dB Rx_Vol 0dB ST_MT ON 1020Hz, sine wave, 0dBm0 at input Rx_Vol 0dB
60
70
-
dB
DSPIN→ DSPOUT Distortion 2nd to 5th time
63
68
-
dB
40
50
-
dB
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Technical Note
・Pass Switch Block Parameter Min. ※1 Mute Level ※2 70 80 - dB 70 Limits Typ. 80 Max. - Unit Conditions Configured at each mute SW Measured at 1kHz BPF Configured at each mute SW Leakage amount to each test line during normal usage Measured at 1kHz BPF
dB
Receiving side is muted digitally by VIC_MT and SPVIC_MT. ※1 MIC_SEL, MIC_MT, EXTIN_MT, MEL_MT, VIC_MT, REC_MT, ST_MT, HSJL_MT, HSJR_MT, SPVIC_MT, SPMEL_VOL, EXTOUT_SEL, TONE_MT, SOUND_MT, DIG_MT, AIN_MT, HP_SMT, SPOUT_SMT, EXTOUT_SMT, REC_SMT, HPR_MT, HPL_MT ※2 Tx_test1, Tx_test2, Rx_test1, Rx_test2, REC_TST, HPR_TST, HPL_TST
・DTMF/TONE Generator Block Parameter Symbol VDTMF_L Output Level VDTMF_H VTONE_L VTONE_H Tone Distortion ・Microphone Bias Block Parameter Output Voltage Maximum Output Current Load Stability Output Noise Voltage Symbol VO IO ΔVO1 N Limits Min. 1.8 2 - - Typ. 2.0 - 14.0 -109 Max. 2.2 - 30 -90 Unit V mA mV dBV Io=100µA~2mA C-Message Io=500µA Io=500µA Conditions SDTN Min. -15.3 -12.8 -15.3 -12.8 - Limits Typ. -14.3 -11.8 -14.3 -11.8 - Max. -13.3 -10.8 -13.3 -10.8 -38 Unit dBV dBV dBV dBV dB Conditions f:DTMF_L TONE→RECP MEL_Vol 0dB Rx_Vol 0dB f:DTMF_H TONE→RECP MEL_Vol 0dB Rx_Vol 0dB f: designated TONE, low band TONE→RECP MEL_Vol 0dB Rx_Vol 0dB f: designated TONE, high band TONE→RECP MEL_Vol 0dB Rx_Vol 0dB f=1kHz ( designated TONE) TONE→REC[P-N] MEL_Vol 0dB Rx_Vol 0dB C-Message
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5/13
2010.09 - Rev.A
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●Reference data
19
Technical Note
2.0
1.0 0.8
18 Circuit Current[mA]
Vdd=3.4V
Stand-by Current [uA] 1.5
0.6
Vdd=3.4V
1.0
Gain [dB]
0.4 0.2 0.0 -0.2 -0.4 -0.6
Lch
17
Vdd=3.0V
16
Vdd=3.0V
Rch
Vdd=2.6V
15
0.5
Vdd=2.6V
14 -50 0 50 Temperature[℃] 100
-0.8 -1.0
0.0 -50 0 50 Temperature [℃] 100
0
5000
10000 15000 Frequency [Hz]
20000
Fig.1 Operational Current (All On)
-40
Fig.2 Static Consumed Current
Fig.3 16bit D/A Converter Frequency characteristics@ 0dBFS
0 -20 -40 LEVEL [dBV] -60 -80 -100 -120 -140
0
-50
Lch
-20 -40
THD+N [dB]
LEVEL [dBV]
-60
Rch
-70
-60 -80 -100
-80
-120 -140
-40 -20 0
-90 -60
0
5000
DAC Output Lev el [dBFS]
10000 15000 Frequency [Hz]
20000
0
5000
10000 15000 Frequency [Hz]
20000
Fig.4 16bit D/A Converter Distortion @ 1kHz
2 0 -2 Bass Boost Gain [dB] -4 -6 -8 -10 -12 -14 -16 10 100
2
Fig.5 16bit D/A Converter FFT @ 0dBFS, 1kHz
10 0 -10 TX Gain [dB] -20 -30 -40 -50 -60 0
Fig.6 16bit D/A Converter FFT @ 0FS
2dB
Bass Boost Gain [dB]
0 -2 -4 -6 -8
6dB 4dB 2dB 8dB 10dB 12dB 14dB
4dB 6dB 8dB 10dB 12dB 14dB
-10 -12 -14 - 16 10 100 1000 10000 Frequency [Hz] 100000
1000 10000 Frequency [Hz]
100000
1000
2000 3000 Frequency [Hz]
4000
Fig.7 Bus Boost Frequency Characteristics
2 0 -2 RX Gain [dB]
Fig.8 Bus Boost + High Pass Emphasis Frequency Characteristics
0 -10 -20 THD+N [dB]
THD+N [dB] 0 -10 -20 -30 -40 -50 -60 -70
Fig.9 Voice CODEC TX Frequency Characteristics
-30 -40 -50 -60 -70 -80
-4 -6 -8 -10 -12 0 1000 2000 3000 Frequency [Hz] 4000
0
10
20 30 40 Output Power [mW]
50
-80 0 20 40 60 80 Output Power [mW] 100
Fig.10 Voice CODEC RX Frequency Characteristics
Fig.11 Headphone Amp Output Characteristics @ vdd=3.0V, 1kHz
Fig.12 Receiver Amp Output Characteristics @ vdd=3.0V, 1kHz
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6/13
2010.09 - Rev.A
BU7861KN
●Block diagrams
AUDRXD AUDTXD AUDCLK RXCOM TXCOM AUDCS PVCOM COMIN SMUTE DVDD AVDD PVDD PVSS CPOP DVSS RSTB AVSS
Technical Note
MICB_1 MICB_2 MICO MICIN_C MICIN_1 MICIN_2 EXTIN
MIC_BIAS
MIC BIAS
CPU I/F
100kΩ
VREF/COMMON
VDD/VSS
SMUTE
POP
MIC_MT MIC_SEL +
100kΩ + 27kΩ
16step
TX_TEST1
TX_VOL
+6~ -8dB
A/D
BPF DSPCLK
RX_TEST1
EXTIN_MT
EXTGND
330kΩ EXTOUT
Tx_testline
DSPIN DSPOUT DSP I/F
8step
Rx_testline
EXTOUT
EXTOUT_SMT
TX_TEST2
ST_VOL
60kΩ 60kΩ ST_MT -18~-42dB
100kΩ 100kΩ REC_MT
32step
Gain=3.2dB +
RECN
+ 100kΩ REC_TST 100kΩ
RX_VOL
0~-30dB
41.7k VIC_MT Ω 32step +6~-54dB
MEL_VOL
D/A
RX_TEST2
LPF PLLLPF FSYNC
PLL
40kΩ + 40kΩ TONE_MT DTMF/ TONE
RECP
+ REC_SMT
60kΩ MEL_MT 100kΩ Gain=3.2dB 60kΩ 32step + 41.7k Ω SPVIC_MT 16step +6~-8dB
SPMEL_VOL
SPOUT
SPRX_VOL
60kΩ
SPMEL_MT SOUND_MT
SPOUT_SMT 0~-30dB
16step 0~-28dB
HPR_TST HPL_TST 200kΩ 100kΩ 100kΩ + 80kΩ Gain=+3dB 70.8k Ω HSJL _MT 32step 0~-45dB HP2_VOL HPL_MT 8step +14~0dB Gain=+3dB 70.8k Ω + 100kΩ HSJR _MT 80kΩ 50kΩ +
50kΩ 50kΩ
AIN_R
AIN_MT
AIN_VOL AIN_L SYSCLK Digital Bass Boost SDI Digital I/F
HP_LI
200kΩ + HP_S MT + 200kΩ 200kΩ 100kΩ
25kΩ
25kΩ
HP_L HP_R
100kΩ
HP_VOL
DIG_MT
16bit DAC
LRCLK
50kΩ +
HP_RI
100kΩ
HP2_VOL HPR_MT 8step +14~0dB
BCLK
25kΩ
25kΩ
TEST
Fig.13 BU7861KN Block Diagram
AUDRXD
AUDTXD
AUDCS
AUDCLK
PLLLPF 26
DACLO DACRO
CSTEP
PVSS
36 RECN 37 RECP 38
35
34
33
32
31
30
29
28
27
25 24 DSPIN 23 DSPOUT 22 DSPCLK 21 DVSS 20 DVDD
CSTEP 39 CPOP 40 SMUTE 41 RXCOM 42 TXCOM 43 PVCOM 44 COMIN 45 EXTOUT 46 MICB_1 47 MICB_2 48 1 MICO 2 MICIN_C 3 MICIN_1 4 MICIN_2 5 EXTGND 6 EXTIN 7 AVDD 8 AVSS 9 SPOUT 10 AIN_L 11 AIN_R 12 DACLO
FSYNC 19 SYSCLK 18 BCLK 17 SDI 16 LRCLK 15 RSTB 14 TEST 13 DACRO
HP_RI
PVDD
HP_R
BU7861KN
Fig.14 BU7861KN Pin Placement Diagram
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HP_LI
HP_L
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Technical Note
●Lowpass correction circuit The headphone output terminal (either HP_X or HPX_OUT) has a built-in “lowpass correction circuit” to correct lowpass decay, comprised of output coupling capacity and headphone impedance.
200kΩ 200kΩ 100kΩ + CL + HP_X or HPX_OUT RL CCHPx HP_XI or HPX_FB
OUTPUT
Fig.15 Headphone Output Section Equivalent Circuit Lowpass Cut-off Frequency Lowpass Boost Frequency Boost Gain fC= 1/(2・π・CL・RL) fBOOST = 1/(2・π・CCHPx・200kΩ) ABOOST = 20・log((200 kΩ+1/(2・π・f・CCHPx))/100 kΩ) (Maximum lowpass boost is 6dB.)
The constant configuration calculates the lowpass cut-off frequency fC after confirming the output coupling capacity CL and headphone impedance RL used. CCHPx is determined in order for the lowpass cut-off frequency fC and lowpass boost frequency fBOOST to roughly correspond. The recommended constants are CL = 100µF, when RL = 16Ω and CCHPx = 6800pF. The chart below shows the frequency characteristics (calculated values) during recommended constant use.
10 5 0 -5 -10
Gain [dB]
Amp Output
After correction Before correction
-15 -20 -25 -30 -35 -40 1 10 100 Frequency [Hz] 1000 10000 100000
Fig.16 Low pass Correction Circuit Frequency Characteristics
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●Recommended circuits
Technical Note
CPU DVDD AVDD AVSS DVSS PVDD PVSS
RXCOM
TXCOM
PVCOM
COMIN
AUDCLK
AUDTXD
AUDCS
AUDRXD
+
RSTB
SMUTE
MICB_1 MICB_2 MICO MICIN_C MICIN_1 MIC_BIAS
MIC BIAS
CPU I/F
VREF/COMMON
VDD/VSS
SMUTE
POP
MIC_MT
MICIN_2 EXTIN
+
MIC_SEL
16step +
TX_VOL
TX_TEST1 A/D BPF DSPCLK DSPIN CPU
+6~-8dB
RX_TEST1
EXTIN_MT
Tx_testline Rx_testline EXTOUT
EXTOUT TX_TEST2 DSP I/F
CPOP
0.1µ
1µ
1µ
1µ
1µ
1µ
+
+
+
DSPOUT
8step
ST_VOL
ST_MT 32step
RX_VOL
-18~-42dB
REC_MT
RECN
Gain=3.2dB
+
D/A LPF PLLLPF 0.01µ
+ REC_TST
VIC_MT 32step +6~-54dB
MEL_VOL
0~-30dB
RX_TEST2
32Ω
PLL
FSYNC DTMF/ TONE
RECP
+
MEL_MT
Gain=3.2dB
SPVIC_MT 32step
SPRX_VOL
16step +6~-8dB
SPMEL_VOL
+
TONE_MT
SPOUT 8Ω SP amp
+
SPMEL_MT SOUND_MT AIN_MT
0~-30dB HPR_TST
16step 0~-28dB AIN_VOL
AIN_R AIN_L SYSCLK
Sound Source IC
HPL_TST
HP_LI 6800pF
HSJL_MT 32step 0~-45dB +
HP2_VOL
SDI Digital Bass Boost + 16bit DAC
DIG_MT
100µ HP_L HP_R 16Ω
+
6800pF
100µ
+ + -
HSJR_MT
HP_VOL
Digital I/F
16Ω
+
+
8step HPL_MT +14~0dB
LRCLK
DSP
BCLK
HP2_VOL
HP_RI
8step HPR_MT +14~0dB
+
TEST
CSTEP
Fig.17 Recommended Circuit
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DACLO DACRO
0.1µ
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BU7861KN
●Input/output equivalent circuit figure Terminal Analog/ No I/O name Digital 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 MICO MICIN_C MICIN_1 MICIN_2 EXTGND EXTIN AVDD AVSS SPOUT AIN_L AIN_R DACLO DACRO TEST RSTB LRCLK SDI BCLK SYSCLK DVDD DVSS DSPCLK DSPOUT DSPIN FSYNC PLLLPF AUDCLK AUDCS AUDTXD AUDRXD PVSS HP_LI HP_L HP_R HP_RI PVDD RECN RECP CSTEP CPOP SMUTE RXCOM TXCOM PVCOM COMIN EXTOUT MICB_1 MICB_2 O O I I O I O I I I I I I I I I I I O I I O I I I O I O O I O O O O O O O O I O O O Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Analog Digital Digital Digital Digital Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog MIC output MIC Selection output MIC1 input MIC2 input External ground External input Power source for analog GND for analog Speaker output Melody input terminal Lch Melody input terminal Rch DAC Lch LPF Condenser connected terminal DAC Rch LPF Condenser connected terminal Please connect to DVSS L:Reset input LRCLK terminal 44.1kHz(fs) for DAC SDI terminal for DAC BCLK terminal 2.8224MHz(64fs) for DAC SYSCLK terminal 11.2896MHz(256fs) for DAC The power source for digital GND for digital PCMClock input for PCM signal PCMsignal input PCM signal input 8kHz The reference clock for PLL Condenser connected terminal for PLL CPU I/F clock input terminal The chip selection terminal for CPU I/F (H active) CPU I/FData input terminal CPU I/FData output terminal GND for Headphone and receiver Lch head phone amplifier revision terminal in low limits Lch Head phone amplifier output terminal Rch Head phone amplifier output terminal Rch head phone amplifier revision terminal in low limits Power source for Headphone and receiver Receiver output Receiver output Step noise decrease terminal when volume is variable Pop sound decrease terminal Constant terminal when soft mute Receiving standard voltage output Transmit standard voltage output PATH standard voltage output Standard voltage input terminal External output MIC BIAS output1 MIC BIAS output2
Technical Note
Terminal function
Power source AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD PVDD PVDD PVDD PVDD PVDD PVDD PVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD
Circuit figure E E E E E H I I E D D F F A A B A B B I I B C A B F A A A C I F E E F I E E F F F E E E G H E E
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2010.09 - Rev.A
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Technical Note
PAD
PAD
PAD
A
B
C
PAD
PAD
PAD
D
E
F
PAD
PAD
PAD
G
H
I
Fig.18 Terminal equivalent circuit figure
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2010.09 - Rev.A
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●Notes for use
Technical Note
1) Absolute maximum ratings When applied voltage (VDD and VIN), and the operating temperature range (Topr) and the like it exceeds absolute maximum rating, there is a possibility of destroying, Because it cannot specify destructive mode such as short circuit or opening, when special mode which exceeds absolute maximum rating is supposed, that physical safety measure such as a fuse should be implemented. 2) Recommendation operating range If it is this range, it is the range which almost can obtain the quality of according to expectation. Concerning electric quality ,being something which is guaranteed under condition of each item. Even inside the recommendation operating range, voltage, temperature characteristic is shown. 3) About the opposite connection of the power source connector There is a possibility of destroying LSI with the opposite connection to the power source connector. Please administer the measure such as the diode is inserted between power source and the power source terminal of LSI outside as the protection for opposite connection destruction. 4) About the power source line At the time of designing the baseplate pattern, as for wiring of the power source/GND line, please make sure to become low impedance. At that time, even digital type power source and analog type power source being the same electric potential, please separate digital type power source pattern and analog type power source pattern, control the turning of digital noise to the analog power source due to the common impedance of wiring pattern. Concerning the GND line, please consider the similar pattern design. In addition, concerning all power source terminals of LSI, the condenser is inserted between power source and the GND terminal, in the case of electrolysis condenser use, please decide constant with sufficient verification in regard to the fact of without being problem in qualities of the condenser which is used, such as the capacity pulling out happens in low temperature. 5) About GND voltage As for electric potential of the GND terminal regarding what ever working condition, please make sure to become lowest electric potential. In addition, please really verify that does not have the terminal which becomes electric potential below GND include transient phenomenon 6) About the short circuit between the terminal and error installing The occasion where you install in the set baseplate, please pay attention to the direction and the position gap of LSI sufficiently. when you install with mistake, there is a possibility of LSI destroying. In addition, there is a possibility of destruction concerning when it short-circuits e.g. due to the foreign material enters between the terminal and between terminal and power source and GND. 7) About the operation in the strong electromagnetic field As for the use in the strong electromagnetic field, being to be a possibility of doing the malfunction, please note. 8) About the testing with the set baseplate When inspecting with the set baseplate, the condenser is connected to the LSI terminal whose impedance is low, because there is a possibility of stress depending on LSI, please be sure to do discharge in every process. In addition, when installing and removing the tool in inspection process, by all means with power source as off to connect, to inspect, to remove. Furthermore, As a static electricity measure, please note to administer the earth and the conveyance and preservation in the case of assemble process sufficiently. 9) About each input terminal With respect to the structure of LSI, the parasitic element is formed inevitably by the relationship of electric potential. It causes the interference of circuit operation due to the fact that the parasitic element operates, the malfunction, even can become cause of destruction. Therefore, e.g., the voltage which is lower than GND in the input terminal is impressed, please note sufficiently not to do the method where the parasitic element operates. In addition, When not impress power supply voltage in LSI, please do not impress voltage in the input terminal. Furthermore, when power supply voltage is impressed even, as for each input terminal, please make voltage below power supply voltage or within guaranteed performance of electric quality. 10) About GND wiring pattern When there are both small signal GND and a heavy-current GND, it separates small signal GND pattern from heavy-current GND pattern, in order that the pattern wiring and the voltage change caused by large current do not change the voltage of small-signal GND, it is recommended to carry out the one-point grounding at the reference point of set.. Please be careful of not to fluctuate the GND wiring pattern of external parts 11) When in the external condenser, the ceramic condenser is used, please decide the constant on the consideration of the nominal capacity decrease caused by direct current bias and the change of the capacity due to temperature etc.
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12/13
2010.09 - Rev.A
BU7861KN
●Ordering part number
Technical Note
B
D
7
Part No.
8
6
1
K
N
-
E
2
Part No.
Package KN: UQFN48
Packaging and forming specification E2: Embossed tape and reel
UQFN48
(1.4) 7.2 ± 0.1 7.0 ± 0.1
36 25 24
Tape Quantity Direction of feed Embossed carrier tape (with dry pack) 2500pcs E2
The direction is the 1pin of product is at the upper left when you hold
7.2 ± 0.1
7.0 ± 0.1
37
48 1 12
13
0.2 ± 0.05
0.05
M
0.22 ± 0.05
( reel on the left hand and you pull out the tape on the right hand
)
+0.03 0.02 -0.02
0.05
+0.1 0.6 -0.3
0.95MAX
Notice : Do not use the dotted line area for soldering
.2
)
0.4
(0
5 .5 (0 ) 5 .4 (0 3)
1pin Reel
Direction of feed
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
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13/13
2010.09 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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R1010A