LVDS Interface ICs
35bit LVDS Transmitter
35:5 Serializer
BU8254KVT
No.13057ECT06
●Description
LVDS Interface IC of ROHM "Serializer" "Deserializer" operate from 8MHz to 150MHz wide clock range, and number of bits
range is from 35 to 70. Data is transmitted seven times (7X) stream and reduce cable number by 3(1/3) or less. The
ROHM's LVDS has low swing mode to be able to expect further low EMI.
●Features
1) 35bits data of parallel LVCMOS level inputs are converted to five channels of LVDS data stream.
2) 30bits of RGB data and 5bits of timing and control data(HSYNC,VSYNC,DE,CNTL1,CNTL2) are transmitted up to
784Mbps effective rate per LVDS channel.
3) Support clock frequency from 8MHz up to 112MHz.
4) Support consumer video format including 480i, 480P, 720P and 1080i as well.
5) Clock edge selectable
6) Power down mode
7) Support spread spectrum clock generator.
8) Support reduced swing LVDS for low EMI.
9) 30bit LVDS receiver is recommended to use BU90R104.
●Applications
Flat Panel Display
●Precaution
■This chip is not designed to protect from radioactivity.
■The chip is made strictly for the specific application or equipment.
Then it is necessary that the unit is measured as need.
■This document may be used as strategic technical data which subjects to COCOM regulations.
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© 2013 ROHM Co., Ltd. All rights reserved.
1/17
2013.06 - Rev.C
Technical Note
BU8254KVT
●Block Diagram
LVCMOS Input
LVDS Output
CLKIIN
(8~112MHz)
PLL
+
-
Parallel to Serial
+
-
TA P/N
Parallel to Serial
+
-
TB P/N
Parallel to Serial
+
-
TC P/N
Parallel to Serial
+
-
TD P/N
Parallel to Serial
+
-
TE P/N
Data Clocks
7
TA6-TA0
7
TB6-TB0
7
TC6-TC0
7
TD6-TD0
7
TE6-TE0
TCLK P/N
(8~112MHz)
RS
RF
XRST
Fig.1
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© 2013 ROHM Co., Ltd. All rights reserved.
Block Diagram
2/17
2013.06 - Rev.C
Technical Note
BU8254KVT
●TQFP64V Package Outline and Specification
Product No.
BU8254KVT
Lot No.
1PIN MARK
Fig.2 TQFP64V Package Outline and Specification
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© 2013 ROHM Co., Ltd. All rights reserved.
3/17
2013.06 - Rev.C
Technical Note
BU8254KVT
TB4
TB3
TB2
RS
TB1
TB0
TA6
GND
TA5
TA4
TA3
TA2
TA1
46
45
44
43
42
41
40
39
38
37
36
35
34
TA0
GND
47
33
TB5
48
●Pin configuration
TB6
49
32
LVDS GND
TC0
50
31
TAN
VDD
51
30
TAP
TC1
52
29
TBN
TC2
53
28
TBP
TC3
54
27
LVDS VDD
TC4
55
26
LVDS GND
GND
56
25
TCN
TC5
57
24
TCP
TC6
58
23
TCLKN
TDO
59
22
TCLKP
RF
60
21
TDN
TD1
61
20
TDP
TD2
62
19
TEN
TD3
63
18
TEP
TD4
64
17
LVDS GND
11
12
13
14
15
16
TE5
CLK IN
XRST
PLL GND
PLL VDD
TE6
7
VDD
10
6
TE2
GND
5
TE1
9
4
TE0
TE4
3
TD6
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© 2013 ROHM Co., Ltd. All rights reserved.
8
2
GND
Fig.3
TE3
1
TD5
64-Pin TQFP
(Top View)
Pin Diagram (Top View)
4/17
2013.06 - Rev.C
Technical Note
BU8254KVT
●Pin Description
Table 1 : Pin Description
Pin Name
Pin No.
Type
Descriptions
TAP, TAN
30,31
LVDS OUT
TBP, TBN
28,29
LVDS OUT
TCP, TCN
24,25
LVDS OUT
TDP, TDN
20,21
LVDS OUT
TEP, TEN
18,19
LVDS OUT
TCLKP, TCLKN
22,23
LVDS OUT
TA0~TA6
33,34,35,36,37,38,40
IN
TB0~TB6
41,42,44,45,46,48,49
IN
TC0~TC6
50,52,53,54,55,57,58
IN
TD0~TD6
59,61,62,63,64,1,3
IN
TE0~TE6
4,5,6,8,9,11,16
IN
XRST
13
IN
LVDS data out.
LVDS clock out.
Pixel data inputs.
H : Normal operation,
L : Power down (all outputs are Hi-Z)
*1
LVDS swing mode, VREF select.
RS
RS
43
IN
LVDS Swing
Small Swing
Input Support
VDD
350mV
N/A
0.6~1.4V
350mV
RS-VREF
GND
200mV
N/A
*1 VREF is Input Reference Voltage.
Input clock triggering edge select.
H : Rising edge, L : Falling edge.
RF
60
IN
VDD
51,7
Power
CLKIN
12
IN
GND
2,10,39,47,56
Ground
Ground pins for LVCMOS inputs and digital core.
LVDS VDD
27
Power
Power supply pins for LVDS outputs.
LVDS GND
17,26,32
Ground
Ground pins for LVDS outputs.
PLLVDD
15
Power
Power supply pin for PLL core.
PLLGND
14
Ground
Ground pins for PLL core.
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© 2013 ROHM Co., Ltd. All rights reserved.
Power supply pins for LVCMOS inputs and digital core.
Clock input.
5/17
2013.06 - Rev.C
Technical Note
BU8254KVT
●Electrical characteristics
■Rating
Table 2 : Absolute Maximum Ratings
Parameter
Ratings
Symbol
Min
Max
Units
Supply Voltage
VDD
-0.3
4.0
V
Input Voltage
VIN
-0.3
VDD+0.3
V
Output Voltage
VOUT
-0.3
VDD+0.3
V
Storage Temperature Range
Tstg
-55
125
℃
Table 3 : Package Power
PACKAGE
De-rating (mW/℃)
Power Dissipation (mW)
700
*1
7.0
TQFP64V
1000
*1:
*2:
*2
10.0
*2
At temperature Ta >25℃
Package power when mounting on the PCB board.
The size of PCB board
:70×70×1.6(mm3)
The material of PCB board :The FR4 glass epoxy board.(3% or less copper foil area)
(It is recommended to apply the above package power requirement to PCB board
when the small swing input mode is used)
Table 4 : Recommended Operating Conditions
Parameter
Supply Voltage
Operating
Temperature Range
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© 2013 ROHM Co., Ltd. All rights reserved.
Symbol
VDD
Ratings
Units
Conditions
Mi n
Typ
Max
3.0
3.3
3.6
V
VDD,LVDSVDD,PLLVDD
-40
-
85
℃
0
-
70
℃
Clock frequency
from 8MHz up to 90MHz
Cock frequency
from 90MHz up to 112MHz
Topr
6/17
2013.06 - Rev.C
Technical Note
BU8254KVT
■DC characteristics
Table 5 : LVCMOS DC Specifications (VDD=3.0V~3.6V, Ta=-40℃~85℃)
Rating
Parameter
Symbol
Units
Min
Typ
Max
Conditions
High Level Input Voltage
VIH
VDD×0.8
-
VDD
V
Low Level Input Voltage
VIL
GND
-
VDD×0.2
V
High Level Input Voltage
VIHRS
VDD×0.8
-
VDD
Low Level Input Voltage
VILRS
GND
-
0.2
1.2
-
2.8
V
-
VDDQ/2
-
-
Small Swing(RS=VDDQ/2)
*2
VDDQ/2
+200mV
-
-
V
VREF=VDDQ/2
*2
-
-
VDDQ/2
-200mV
V
VREF=VDDQ/2
-
-
±10
µA
0V ≤ VIN ≤ VDD
exclude RS pin
RS pin
Small Swing Voltage
Input Reference Voltage
Small Swing High Level
Input Voltage
Small Swing Low Level
Input Voltage
Input Current
VDDQ
*1
VREF
VSH
VSL
IINC
*1: VDDQ voltage defines max voltage of small swing input. It is not an actual input voltage.
*2: Small swing signal is applied to TA[6:0], TB[6:0], TC[6:0], TD[6:0] TE[6:0], CLKIN.
Table 6 : LVDS Transmitter DC Specifications(VDD=3.0V~3.6V, Ta=-40℃~85℃)
Rating
Parameter
Symbol
Units
Min
Typ
Min
Conditions
Normal swing
RS=VDD
Reduced swing
RS=GND
250
350
450
mV
100
200
300
mV
ΔVOD
-
-
35
mV
VOC
1.125
1.25
1.375
V
Change in VOC between
complementary output states
ΔVOC
-
-
35
mV
Output Short Circuit Current
IOS
-
-
-24
mA
VOUT=0V, RL=100Ω
Output TRI-STATE Current
IOZ
-
-
±10
µA
XRST=0V,
VOUT=0V to VDD
Differential Output Voltage
Change in VOD between
complementary output states
Common Mode Voltage
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© 2013 ROHM Co., Ltd. All rights reserved.
VOD
RL=100Ω
7/17
RL=100Ω
2013.06 - Rev.C
Technical Note
BU8254KVT
■Supply Current
Table 7 : Supply Current
Rating
Parameter
Transmitter Supply
Current
Transmitter Supply
Current
Transmitter Power Down
Supply Current
Symbol
Units
Typ
Max
-
57
-
mA
-
42
-
mA
-
62
-
mA
RL=100Ω,CL=5pF
VDD=3.3V,RS=VDD
Worst Case pattern
f=85MHz
-
45
-
mA
RL=100Ω,CL=5pF
VDD=3.3V,RS=GND
Worst Case pattern
f=85MHz
-
-
10
µA
XRST=L
ITCCG
ITCCW
ITCCS
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© 2013 ROHM Co., Ltd. All rights reserved.
Conditions
Min
8/17
RL=100Ω,CL=5pF
VDD=3.3V,RS=VDD
Gray Scale Pattern
RL=100Ω,CL=5pF
VDD=3.3V,RS=GND
Gray Scale Pattern
f=85MHz
f=85MHz
2013.06 - Rev.C
Technical Note
BU8254KVT
Gray Scale Pattern
CLKOUT
Rx0
Rx1
Rx2
Rx3
Rx4
Rx5
Rx6
X=A,B,C,D,E
Fig.4
Gray scale pattern
Worst Case Pattern (Maximum Power condition)
CLKOUT
Rx0
Rx1
Rx2
Rx3
Rx4
Rx5
Rx6
X=A,B,C,D,E
Fig.5
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© 2013 ROHM Co., Ltd. All rights reserved.
Worst Case Pattern
9/17
2013.06 - Rev.C
Technical Note
BU8254KVT
■AC characteristics
Table 8 : Switching Characteristics
Symbol
Min
Typ
Max
Units
CLK IN Transition time
tTCIT
-
-
5.0
ns
CLK IN Period
tTCP
8.93
-
125.0
ns
CLK IN High Time
tTCH
0.35tTCP
0.5tTCP
0.65tTCP
ns
CLK IN Low Time
tTCL
0.35tTCP
0.5tTCP
0.65tTCP
ns
CLK IN to TCLK+/-Delay
tTCD
-
tTCP
-
ns
LVSMOS Data Set up to CLK IN
tTS
2.5
-
-
ns
LVCMOS Data Hold from CLK IN
tTH
0
-
-
ns
LVDS Transition Time
tLVT
-
0.6
1.5
ns
Output Data Position 0
tTOP1
-0.2
0.0
+0.2
ns
Output Data Position 1
tTOP0
Output Data Position 2
tTOP6
Output Data Position 3
tTOP5
Output Data Position 4
tTOP4
Output Data Position 5
tTOP3
Output Data Position 6
tTOP2
tTCP
-0.2
7
tTCP
2
-0.2
7
tTCP
-0.2
3
7
tTCP
4
-0.2
7
tTCP
5
-0.2
7
tTCP
6
-0.2
7
tTCP
7
tTCP
2
7
tTCP
3
7
tTCP
4
7
tTCP
5
7
tTCP
6
7
tTCP
+0.2
7
tTCP
2
+0.2
7
tTCP
3
+0.2
7
tTCP
4
+0.2
7
tTCP
5
+0.2
7
tTCP
6
+0.2
7
Phase Locked Loop Set Time
tTPLL
-
-
10.0
Parameter
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© 2013 ROHM Co., Ltd. All rights reserved.
10/17
ns
ns
ns
ns
ns
ns
ms
2013.06 - Rev.C
Technical Note
BU8254KVT
●AC Timing
■AC Timing Diagrams
LVCMOS Input
90%
90%
CLKIN
10%
10%
tTCIT
tTCIT
LVCMOS Output
LVDS Output
Vdiff=(TAP)-(TAN)
TAP
80%
RL
Vdiff
80%
20%
20%
TAN
tLVT
LVDS Output Load
LVCMOS Input
tLVT
tTCP
tTCH
RF=L
CLKIN
VDD/2
VDD/2
VDD/2
RF=H
tTCL
tTS
Tx0-Tx6
VDD/2
tTH
VDD/2
tTCD
TCLKP
VOC
TCLKN
Fig.6
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© 2013 ROHM Co., Ltd. All rights reserved.
AC Timing Diagrams
11/17
2013.06 - Rev.C
Technical Note
BU8254KVT
■Small Swing Inputs
tTCP
tTCH
RF=L
CLKIN
VDDQ/2
VDDQ/2
VDDQ/2
RF=H
tTCL
tTS
Tx0-Tx6
VDDQ/2
VREF
tTH
VDDQ
VREF
GND
VDDQ/2
tTCD
TCLKP
VOC
TCLKN
Fig.7
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© 2013 ROHM Co., Ltd. All rights reserved.
Small Swing Inputs
12/17
2013.06 - Rev.C
Technical Note
BU8254KVT
■AC Timing Diagrams
TCLK OUT
(Differential)
TAP/N
TA6
TA5
TA4
TA3
TA2
TA1
TA0
TBP/N
TB6
TB5
TB4
TB3
TB2
TB1
TB0
TCP/N
TC6
TC5
TC4
TC3
TC2
TC1
TC0
TDP/N
TD6
TD5
TD4
TD3
TD2
TD1
TD0
TEP/N
TE6
TE5
TE4
TE3
TE2
TE1
TE0
Previous Cycle
Next Cycle
tTOP1
tTOP0
tTOP6
tTOP5
tTOP4
tTOP3
tTOP2
Fig.8
AC Timing Diagrams
■Phase Locked Loop Set Time
2.0V
XRST
3.6V
3.0V
tTPLL
VDD
CLKIN
Vdiff=0V
TCLKP/N
Fig.9
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© 2013 ROHM Co., Ltd. All rights reserved.
Phase Locked Loop Set Time
13/17
2013.06 - Rev.C
Technical Note
BU8254KVT
●System Timing Requirement
System Timing Requirement is mandatory by following two methods.
①The method of using CR circuit.( In the case that CLK does not stop after power supply)
②The method of using external specific IC. (In the case that CLK turns on/off after power supply)
It is recommend to do enough examination for target application.
①The method of using CR circuit.( In the case that CLK does not stop after power supply)
V DD
V DD
PVDD
schottky barrier diode
10KΩ
LVDD
220Ω
Be careful of temperature of
the capacitor especially over
and again.
B characteristic ceramics and
polymer aluminum
are recommended.
2.2µF
XRS
T
VDD
td
Recommend
after VDD up
,
XRST
Recommend
after VDD up and before XRST release
CLK
,
If unused connect to GND
td is approximately equal to 20ms when the left RC coleus are applied.
Fig.10
②
The method of using external specific IC.
The method of using CR circuit.
(In the case that CLK turns on/off after power supply)
PVDD
VDD
VDD
LVDD
external specific
IC
XRST
VOUT
VDD
CLK
VIN
Recommend
after VDD up
Recommend
after CLK input
Recommend
after VDD up and before XRST release
Recommend
before XRST release
XRST
GND
CLK
(CLK monitor and RST signal generation)
Fig.11
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© 2013 ROHM Co., Ltd. All rights reserved.
The method of using external specific IC.
14/17
2013.06 - Rev.C
Technical Note
BU8254KVT
●10bit LVCMOS Level Input
Example:
BU8254KVT: LVCMOS level input/Falling edge/Normal swing
BU90R104: Falling edge
VDD
F.Bead *1
VDD
GND
0.1uF
0.01uF
CLKIN
R4
R5
R6
R7
R8
R9
G4
G5
G6
G7
G8
G9
B4
B5
B6
B7
B8
B9
HSYNC
VSYNC
DE
R2
R3
G2
G3
B2
B3
CLKIN
TA0
TA1
TA2
TA3
TA4
TA5
TA6
TB0
TB1
TB2
TB3
TB4
TB5
TB6
TC0
TC1
TC2
TC3
TC4
TC5
TC6
TD0
TD1
TD2
TD3
TD4
TD5
TD6
TE0
TE1
TE2
TE3
TE4
TE5
TE6
R0
R1
G0
G1
B0
B1
XRST
0.1uF
0.01uF
LGND
PLL VDD
PVDD
0.1uF
0.01uF
0.1uF
0.01uF
TAN
100Ω
TAP
TBN
100Ω
TBP
TCN
100Ω
TCP
TCLKN
100Ω
TCLKP
TDN
100Ω
TDP
TEN
XRST
PGND
RARA+
RBRB+
RCRC+
RCLKRCLK+
RDRD+
RE-
100Ω
TEP
RE+
CLKOUT
RA0
RA1
RA2
RA3
RA4
RA5
RA6
RB0
RB1
RB2
RB3
RB4
RB5
RB6
RC0
RC1
RC2
RC3
RC4
RC5
RC6
RD0
BU90
BU90R
90R104 RD1
RD2
RD3
RD4
RD5
RD6
RE0
RE1
RE2
RE3
RE4
RE5
RE6
PD
OE
100Ωtwist
pair Cable
or
PCB trace
VDD
0.1uF
0.1uF
0.01uF
LVDS GND
PLL GND
VDD
GND
LVDD
LVDS VDD
BU8254
BU8254KVT
8254KVT
RS *2
PCB(Transmitter)
Recommended Parts:
F.Bead : BLM18A-Series (Murata Manufacturing)
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© 2013 ROHM Co., Ltd. All rights reserved.
0.1uF
0.01uF
CLKOUT
R4
R5
R6
R7
R8
R9
G4
G5
G6
G7
G8
G9
B4
B5
B6
B7
B8
B9
HSYNC
VSYNC
DE
R2
R3
G2
G3
B2
B3
OPEN
R0
R1
G0
G1
B0
B1
OPEN
PD
OE
DK
R/F
R/F
*1 :
VDD
F.Bead *1
PCB(Receiver)
*2
15/17
If RS pin is tied to VDD, LVDS swing is 350m V.
If RS pin is tied to GND, LVDS swing is 200m V.
2013.06 - Rev.C
Technical Note
BU8254KVT
●10bit Small Swing Input
Example:
BU8254KVT : LVCMOS level input/Falling edge/Normal swing
BU90R104: Falling edge
VDD
F.Bead *3
VDD
GND
0.1uF
0.01uF
CLKIN
R4
R5
R6
R7
R8
R9
G4
G5
G6
G7
G8
G9
B4
B5
B6
B7
B8
B9
HSYNC
VSYNC
DE
R2
R3
G2
G3
B2
B3
CLKIN
TA0
TA1
TA2
TA3
TA4
TA5
TA6
TB0
TB1
TB2
TB3
TB4
TB5
TB6
TC0
TC1
TC2
TC3
TC4
TC5
TC6
TD0
TD1
TD2
TD3
TD4
TD5
TD6
TE0
TE1
TE2
TE3
TE4
TE5
TE6
R0
R1
G0
G1
B0
B1
XRST
VDD
GND
LVDD
LVDS VDD
0.1uF
0.01uF
0.1uF
0.01uF
LVDS GND
LGND
PLL VDD
PVDD
PLL GND
0.1uF
0.01uF
0.1uF
0.01uF
TAN
100Ω
TAP
TBN
100Ω
TBP
TCN
100Ω
TCP
BU8254
BU8254KVT
8254KVT
VDD
F.Bead *3
TCLKN
100Ω
TCLKP
TDN
100Ω
TDP
TEN
100Ω
TEP
XRST
PGND
RARA+
RBRB+
RCRC+
RCLKRCLK+
RDRD+
RERE+
CLKOUT
RA0
RA1
RA2
RA3
RA4
RA5
RA6
RB0
RB1
RB2
RB3
RB4
RB5
RB6
RC0
RC1
RC2
RC3
RC4
RC5
RC6
RD0
BU90
BU90R
90R104 RD1
RD2
RD3
RD4
RD5
RD6
RE0
RE1
RE2
RE3
RE4
RE5
RE6
PD
OE
100Ωtwist
pair Cable
or
PCB trace
*4
RS *4
0.1uF
0.01uF
CLKOUT
R4
R5
R6
R7
R8
R9
G4
G5
G6
G7
G8
G9
B4
B5
B6
B7
B8
B9
HSYNC
VSYNC
DE
R2
R3
G2
G3
B2
B3
OPEN
R0
R1
G0
G1
B0
B1
OPEN
PD
OE
DK
R/F
R/F
PCB(Receiver)
PCB(Transmitter)
*3 : Recommended Parts:
F.Bead : BLM18A-Series (Murata Manufacturing)
*4 : RS pin acts as VREF input pin when input voltage is set to half of high level signal input.
We recommend to locate by-pass condenser near the RS pin.
VDD
R1
15k
R2
5.6k
RS pin
C1=0.1uF
Example for LVCMOS(1.8V input)(R1,R2)=(1.5kΩ,5.6kΩ)
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© 2013 ROHM Co., Ltd. All rights reserved.
16/17
2013.06 - Rev.C
Technical Note
BU8254KVT
●Ordering Part Number
U
B
8
Part No.
2
5
4
K
Part No.
V
T
Package
KVT: TQFP64V
Packaging and forming specification
None:Tray
TQFP64V
12.0±0.3
10.0±0.2
33
49
32
64
17
Container
Tray (with dry pack)
Quantity
1000pcs
Direction of feed Direction of product is fixed in a tray
10.0±0.2
12.0±0.3
48
1
0.5
1pin
16
0.1±0.1
1.0±0.1
0.125±0.1
0.5
0.2 ± 0.1
0.1
∗ Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
17/17
2013.06 - Rev.C
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001