BU90023NUX-TR

Datasheet Single-chip Type with Built-in FET Switching Regulator Series Step-down Switching regulators with Built-in Power MOSFET BU9002xNUX Series ●General Description The BU9002xNUX are a high efficiency 1MHz synchronous step-down switching regulator with low current PFM mode. It provides up to 1.5A load current and an input voltage range from 4.5V to 5.5V, optimized for various applications with input voltage range up to 5V. BU9002xNUX has a mode control pin that allows the user to select Forced PWM (Pulse Width Modulation) mode or PFM (Pulse Frequency Modulation) and PWM auto change mode utilized power save operation at light load current. ●Applications POL, 1Cell Li-ion battery for portable applications , USB accessories W(Typ.) x D(Typ.) x H(Max.) 2.00mm x 3.00mm x 0.60mm ●Package(s) VSON008X2030 ●Features ■ Fast transient response ■ Automatic PFM/PWM operation. ■ Forced PWM operation ■ Internal Soft Start ■ Under voltage lockout ■ Over current protection ■ Thermal shutdown VSON008X2030 ●Typical Application Circuit(s) ●Lineup Part No. Output voltage BU90023NUX 1.230V BU90028NUX 1.175V Figure 1. Typical Application Circuit(s) ●Pin Description(s) ●Pin Configuration(s) Pin No. (TOP VIEW) LX Symbol Function 1 LX Inductor connection pin 2 MODE Forced PWM mode pin 3 PVIN Power supply input pin 4 VIN Power supply input pin AGND 5 EN Enable pin EN 6 AGND GND pin 7 PGND GND pin 8 FB FB MODE PGND PVIN VIN Figure 2. Pin Configuration(s) Feedback voltage input pin ○Product structure : Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays www.rohm.com TSZ02201-0F2F0AG00020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 1/11 21.JUN.2012 Rev.001 TSZ22111・14・001 Datasheet BU9002xNUX Series ●Block Diagram(s) MODE AVIN TSD UVLO PWM/PFM control PVIN C Current sense FB + ERROR AMP Switching Control Logic and Gate Driver L LX OUTPUT C VREF EN SHUTDOWN Frequency control PGND ON/OFF AGND Figure 3. Block Diagram(s) ●Description of Block(s) The BU9002xNUX are a synchronous step-down DC/DC converter that achieves fast transient response from light load to heavy load by hysteretic PWM control system and current constant PFM control system. ○PWM control BU9002xNUX operates by hysteretic PWM control. This scheme ensures fast switching, high efficiency, and fast transient response. When the output voltage is below the VREF voltage, the error comparator output is low to high and turning on P-channel MOSFET until above the VREF voltage and minimum on time. ○PFM control At light load the regulator and MODE=low, the regulator operates with reduced switching frequency and improves the efficiency. During PFM operation, the output voltage slightly higher than typical output voltage. Figure 4. Operation of PFM mode and PWM mode www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/11 TSZ02201-0F2F0AG00020-1-2 21.JUN.2012 Rev.001 Datasheet BU9002xNUX Series ●Description of operations 1) Shutdown If the EN input pin set to low (2.05V(typ.) 5) FORCED PWM MODE Setting MODE pin high (>1.4V) places the regulator in forced PWM. This control provides noise reduction and output stability. Do not leave the MODE pin floating. 6) TSD The BU9002xNUX has a thermal shutdown feature to protect the device if the junction temperature exceeds 150℃.In thermal shutdown, the DRIVER is disabled. This circuit is only to cut off the IC from thermal runaway, and has not been design to protect or guarantee the IC. Therefore, the user should not plan to activate this circuit with continued operation in mind. ●Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit VIN 7 V VEN, VFB, VLX, VMODE 7 V Pd 0.515 W Operating temperature range Topr -40 to +85 ℃ Storage temperature range Tstg -55 to +125 ℃ Tjmax +125 ℃ Maximum input power supply voltage Maximum voltage at EN, FB, LX, MODE Power dissipation Junction temperature (*1) When mounted on the specified PCB (55mm x 63mm), Deducted by 3.9m W/c when used over Ta=25c ●Recommended Operating Rating(s) Parameter Symbol Input voltage VIN www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Rating Min. Typ. Max. 2.3 - 5.5 3/11 Unit Series V TSZ02201-0F2F0AG00020-1-2 21.JUN.2012 Rev.001 Datasheet BU9002xNUX Series ●Electrical Characteristic(s) (unless otherwise specified VIN=5.0V, Ta=25℃) Item Min. Rating Typ. Max. 1.206 1.230 1.254 1.152 1.175 1.199 Tss 120 240 480 usec fosc 0.8 1.0 2.0 MHz RonP RonN - 250 220 400 350 mOhm mOhm Symbol Unit Condition 【Switching regulator】 Output voltage accuracy VOUTA V BU90023NUX MODE:H（PWM） BU90028NUX MODE:H（PWM） 【Soft start】 Soft start time 【Frequency control】 Switching frequency 【Driver】 PchFET on resistance NchFET on resistance 【Control】 VIN=5.0V VIN=5.0V EN pin control voltage Operation VENH 1.4 - VIN V Non Operation VENL 0 - 0.4 V MODE pin control voltage Operation VMODEH 1.4 - VIN V Forced PWM Non Operation VMODEL 0 - 0.4 V Automatic PFM/PWM Uvth Uvhy 1.95 50 2.05 100 2.15 150 V mV Current limit threshold ILIMIT 2.2 2.5 2.8 A 【Output discharge】 Output discharge resistance 【Circuit current】 DRES 55 110 220 Ohm Operating quiescent current IINS 53 75 uA Shutdown current SHD 0 1 uA 【UVLO】 Protect threshold voltage Hysteresis 【Current limit】 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 - 4/11 PMOS current detect, Open loop EN=0V EN:H, MODE:L, VOUT=3.6V forced Not switching EN=0V TSZ02201-0F2F0AG00020-1-2 21.JUN.2012 Rev.001 Datasheet BU9002xNUX Series ●Electrical characteristic curves (Reference data) BU90023NUX (1.23V OUTPUT） ） EN 2V/div EN 2V/div VOUT 1V/div VOUT 1V/div IL 500mA/div Figure 5. Start up Figure 6. Shut down Vout 50mV/div ac coupled Vout 50mV/div ac coupled IOUT 500mA/div IOUT 500mA/div Figure 7. Load transient response 400mA to 800mA tr=tf=100ns, MODE : Low www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/11 Figure 8. Load transient response 600mA to 1200mA tr=tf=100ns, MODE : Low TSZ02201-0F2F0AG00020-1-2 21.JUN.2012 Rev.001 Datasheet BU9002xNUX Series ●Electrical characteristic curves (Reference data) BU90023NUX (1.23V OUTPUT) continued Vout 20mV/div ac coupled LX 2V/div IL 500mA/div Figure 9. PWM mode Operation Iout=50mA Figure 10. Efficiency vs Load current VIN=5V PWM/PFM Auto mode VIN=5.5 VIN=5.0 VIN=4.0 Figure 11. Load regulation PWM mode www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/11 TSZ02201-0F2F0AG00020-1-2 21.JUN.2012 Rev.001 Datasheet BU9002xNUX Series ●Electrical characteristic curves (Reference data) BU90028NUX (1.175V OUTPUT) EN 2V/div EN 2V/div VOUT 1V/div VOUT 1V/div IL 500mA/div Figure 12. Start up Figure 13. Shut down Vout 50mV/div ac coupled Vout 50mV/div ac coupled IOUT 500mA/div IOUT 500mA/div Figure 14. Load transient response 400mA to 800mA tr=tf=100ns, MODE : Low www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/11 Figure 15. Load transient response 600mA to 1200mA tr=tf=100ns, MODE : Low TSZ02201-0F2F0AG00020-1-2 21.JUN.2012 Rev.001 Datasheet BU9002xNUX Series ●特性データ(参考データ) BU90028NUX（ （1.175V 出力） 出力）continued Vout 20mV/div ac coupled LX 2V/div IL 500mA/div Figure 16. PWM mode Operation Iout=50mA Figure 17. Efficiency vs Load current VIN=5V PWM/PFM Auto mode VIN=5.5 VIN=5.0 VIN=4.0 Figure 18. Load regulation PWM mode www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/11 TSZ02201-0F2F0AG00020-1-2 21.JUN.2012 Rev.001 Datasheet BU9002xNUX Series ●PC Board layout The suggested PCB layout for the BU9002xNUX are shown in Figure. The following guidelines should be used to ensure a proper layout. 1) The input capacitor CIN should be connect as closely possible to VIN pin and GND pin. 2) From the output voltage to the FB pin line should be as separate as possible. 3) COUT and L should be connected as closely as possible. The connection of L to the LX pin should be as short as possible. Figure 19. PCB layout ●External parts selection Inductor selection The inductance significantly depends on output ripple current. As shown by following equation, the ripple current decreases as the inductor and/or switching frequency increase. (VIN-VOUT)×VOUT ⊿IL= L×VIN×f f: switching frequency L: inductance ⊿IL: inductor current ripple As a minimum requirement, the DC current rating of the inductor should be equal to the maximum load current plus half of the inductor current ripple as shown by the following equation. ILPEAK= IOUTMAX + ⊿IL 2 1) Recommended inductor selection ・Iout≦1.5A DFE252012C Type 2.2uH (TOKO) NR4018T2R2M (TAIYO YUDEN) ・Iout≦0.6A NR3010T2R2M (TAIYO YUDEN) 2) Recommended input capacitor(CIN) selection C1608 Type 22uF (X5R 6.3V TDK) 3)Recommended output capacitor(COUT) selection C1608 Type 22uF (X5R 6.3V TDK) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/11 TSZ02201-0F2F0AG00020-1-2 21.JUN.2012 Rev.001 Datasheet BU9002xNUX Series ●Caution of use 1) Absolute maximum ratings An excess in the absolute maximum rating, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) GND voltage The potential of GND pin must be minimum potential in all condition. As an exception, the circuit design allows voltages up to -0.3 V to be applied to the IC pin. 3) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 5) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 6) Mutual impedance Power supply and ground wiring should reflect consideration of the need to lower mutual impedance and minimize ripple as much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and capacitance). 7) Thermal shutdown Circuit (TSD Circuit) This model IC has a built-in TSD circuit. This circuit is only to cut off the IC from thermal runaway, and has not been design to protect or guarantee the IC. Therefore, the user should not plan to activate this circuit with continued operation in mind. 8) Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, as shown in the figures below, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/11 TSZ02201-0F2F0AG00020-1-2 21.JUN.2012 Rev.001 Datasheet BU9002xNUX Series ●Ordering Information B U 9 0 0 2 x N U X TR Package NUX: VSON008X2030 Part Number Packaging and forming specification TR: Embossed tape and reel (VSON008X2030) ●Physical Dimension Tape and Reel Information VSON008X2030 2.0±0.1 3.0±0.1 Tape Quantity 0.6MAX 1PIN MARK Direction of feed 0.3±0.1 C0.25 0.25 1.5±0.1 4000pcs TR The direction is the 1pin of product is at the upper right when you hold ) (0.12) ( reel on the left hand and you pull out the tape on the right hand 0.5 1 4 8 5 1.4±0.1 0.08 S +0.03 0.02 −0.02 S Embossed carrier tape Direction of feed 1pin +0.05 0.25 −0.04 (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagram(s)(TOP VIEW) VSON008X2030 (TOP VIEW) Part Number Marking LOT Number Part No. BU90023NUX BU90028NUX Part Number Marking U90 023 U90 028 1PIN MARK www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/11 TSZ02201-0F2F0AG00020-1-2 21.JUN.2012 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. 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The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. 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The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001