Datasheet
Low Duty LCD Segment Drivers
BU97950AFUV
MAX 280 segments (SEG35×COM8)
General Description
Key Specifications
■
■
■
■
■
BU97950AFUV is a 1/8 or 1/4 duty general-purpose LCD
driver that can be used for consumer / battery operated
products and can drive up to 280 LCD Segments.
It has integrated display RAM for reducing CPU load.
Also, it is designed with low power consumption and no
external component needed.
It can support LCD contrast adjustment by its EVR
function.
■
Supply Voltage Range:
+2.5V to +6.0V
LCD Drive Power Supply Range:
+2.5V to +6.0V
Operating Temperature Range:
-40°C to +85°C
Max Segments:
280 Segments
Display Duty and Bias:
1/4 Duty and 1/3 Bias,
1/8 Duty and 1/4 Bias selectable
Interface:
2wire serial interface
Features
◼
◼
◼
◼
◼
◼
◼
◼
Packages
Integrated RAM for Display Data (DDRAM):
35 x 8bit (Max 280 Segment)
1/8 or 1/4 Can be Selected with The Serial Control
Data.
1/8 duty drive: Up to 280 segments
1/4 duty drive: Up to 156 segments
Integrated Buffer AMP for LCD Driving
Integrated Oscillator Circuit
No External Components
Low Power Consumption Design
Independent Power Supply for LCD Driving
Integrated Electrical Volume Register (EVR) function
W (Typ) x D (Typ) x H (Max)
TSSOP-C48V
8.1mm x 12.5mm x 1.0mm
Applications
◼
◼
◼
◼
◼
etc.
Metering
Home Automation Goods
White Goods, Small Appliances
Healthcare Products
Battery Operated Products
Typical Application Circuit
VLCD
VDD
COM0
…...
…...
VDD
VLCD
COM7
SD
SCL
Controller
Segment
LCD
SEG0
SEG1
…...
…...
SEG34
VSS
Figure 1. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit
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○This product is not designed for protection against radioactive rays.
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
Block Diagram / Pin Configuration / Pin Description
BU97950AFUV (TSSOP-C48V)
COM0…COM3
COM4/SEG35…
COM7/SEG38 SEG0…SEG34
VLCD
LCD voltage generator
Common
Driver
Segment
Driver
＋
－
＋
LCD
BIAS
SELECTOR
－
＋
－
Common
Counter
DDRAM
＋
－
VSS
Command
Data Decoder
Command
Register
OSCILLATOR
Power On Reset
Serial Inter Face
IF FILTER
VDD
SCL
SDA
COM5 / SEG36
COM6 / SEG37
COM7 / SEG38
SEG1
SEG0
COM3
SEG4
SEG2
COM2
SEG5
COM4 / SEG35
COM1
SEG6
SEG3
COM0
SEG30
SEG12
SEG7
SEG29
SEG13
SEG34
SEG28
SEG14
SEG8
SEG27
SEG15
SEG33
SEG26
SEG16
SEG9
SEG25
SEG17
SEG32
SEG24
SEG18
SEG10
SEG23
SEG19
SEG31
SEG22
SEG20
SEG11
SEG21
SCL
VLCD
VSS
SDA
VDD
Figure 2. Block Diagram
Figure 3. Pin Configuration (TOP VIEW)
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
Table 1. Pin Description
Terminal
Terminal No
I/O
SDA
48
I/O
SCL
47
VSS
Function
Handling
when unused
Serial data input
-
I
Serial data transfer clock
-
3
I
Ground
-
VDD
1
I
Power supply
-
VLCD
2
I
Power supply for LCD drive
-
SEG0 to SEG34
4 to 24
33 to 46
O
SEGMENT output for LCD drive
OPEN
COM0 to COM3
29 to 32
O
COMMON output for LCD drive
OPEN
COM4/SEG35 to
COM7/SEG38
25 to 28
O
COMMON / SEGMENT output for LCD drive
OPEN
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
Absolute Maximum Ratings (VSS=0V)
Parameter
Symbol
Ratings
Unit
Remarks
Power Supply Voltage1
VDD
-0.5 to +7.0
V
Power Supply
Power Supply Voltage2
VLCD
-0.5 to +7.0
V
LCD Drive Voltage
Allowable Loss
Pd
0.64(Note)
W
Input voltage Range
Operational Temperature
Range
Storage Temperature Range
VIN
-0.5 to VDD+0.5
V
Topr
-40 to +85
ºC
Tstg
-55 to +125
ºC
(Note)Derate by 6.40mW/°C when operating above Ta=25°C (when mounted in ROHM’s standard board)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the
absolute maximum ratings.
Recommended Operating Ratings(Ta=-40°C to +85°C,VSS=0V)
Parameter
Symbol
Ratings
Min
Typ
Max
Unit
Remarks
Power Supply Voltage1
VDD
2.5
-
6.0
V
Power Supply
Power Supply Voltage2
VLCD
2.5
-
6.0
V
LCD Drive Voltage
Electrical Characteristics
DC Characteristics (VDD=2.5 to 6.0V, VLCD=2.5 to 6.0V, VSS=0V, Ta=-40°C to +85°C, unless otherwise specified)
Limits
Parameter
Symbol
Unit
Conditions
Min
Typ
Max
“H” Level Input Voltage
VIH
0.7VDD
-
VDD
“L” Level Input Voltage
VIL
VSS
-
“H” Level Input Current
IIH
-
-
“L” Level Input Current
IIL
-1
SEG
RON
COM
RON
Standby Current
V
SDA,SCL
0.3VDD
V
SDA,SCL
1
µA
SDA,SCL
-
-
µA
SDA,SCL
-
3.5
-
kΩ
-
3.5
-
kΩ
IST
-
-
5
µA
Power Consumption 1
IDD
-
2.5
15
µA
Power Consumption 2
ILCD
-
10
20
µA
LCD Driver on
Resistance
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Iload=±10µA
Display off, Oscillation off
VDD=3.3V, VLCD=5V, Ta=25°C
Power Save Mode1, FR=80Hz
1/4 Bias, Frame Inversion
VDD=3.3V, VLCD=5V, Ta=25°C
Power Save Mode1, FR=80Hz
1/4 Bias, Frame Inversion
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
Electrical Characteristics – continued
Oscillation Characteristics(VDD=2.5 to 6.0V, VLCD=2.5 to 6.0V, VSS=0V, Ta=-40°C to 85°C, unless otherwise specified)
Limits
Parameter
Symbol
Unit
Conditions
Min
Typ
Max
FR = 80Hz setting,
56
80
104
Frame Frequency 1
fCLK1
Hz
VDD=2.5V to 6.0V, Ta=-40°C to +85°C
FR = 80Hz setting,
72
80
88
Frame Frequency 2
fCLK2
Hz
VDD=3.5V, Ta=-40°C to +85°C
[Reference Data]
110
100
VDD = 6.0V
VDD = 5.0V
fosc[kHz]
90
VDD = 3.3V
80
VDD = 2.7V
70
60
50
-40
-20
0
20
40
60
80
Temperature[°C]
Figure 4. Frame Frequency Typical Temperature Characteristics
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MAX 280 segments (SEG35×COM8)
Electrical Characteristics – continued
MPU interface Characteristics (VDD=2.5 to 6.0V, VLCD=2.5 to 6.0V, VSS=0V, Ta=-40°C to +85°C, unless otherwise specified)
Limits
Parameter
Symbol
Unit
Conditions
Min
Typ
Max
Input Rise Time
tr
-
-
0.3
µs
Input Fall Time
tf
-
-
0.3
µs
SCL Cycle Time
tSCYC
2.5
-
-
µs
“H” SCL Pulse Width
tSHW
0.6
-
-
µs
“L” SCL Pulse Width
tSLW
1.3
-
-
µs
SDA Setup Time
tSDS
100
-
-
ns
SDA Hold Time
tSDH
100
-
-
ns
Bus Free Time
tBUF
1.3
-
-
µs
tHD;STA
0.6
-
-
µs
START Condition Setup Time
tSU;STA
0.6
-
-
µs
STOP Condition Setup Time
tSU;STO
0.6
-
-
µs
START Condition Hold Time
SDA
tf
tSLW
tBUF
tSCYC
SCL
tHD;STA
tr
tSDH
tSHW
tSDS
SDA
tSU;STO
tSU;STA
Figure 5. Serial Interface Timing
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
I/O Equivalent Circuit
VDD
VLCD
VSS
VSS
SDA
SCL
VSS
VSS
VLCD
VLCD
SEG0 to SEG34,
COM0 to COM3
COM4/SEG35 to
COM7/SEG38
VSS
VSS
Figure 6. I/O Equivalent Circuit
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
Function Description
Command / Data Transfer Method
BU97950AFUV is controlled by 2-wire signal (SDA, SCL).
SDA
SCL
START condition
STOP condition
Figure 7. 2 wire Command/Data Transfer Format
It is necessary to generate START and STOP condition when sending Command or Display Data through this 2 wire serial
interface.
Slave Address
A
Command
S 0 1 1 1 1 1 0 0 A C
Display Data
Command or Data judgement bit
START condition
A P
STOP condition
Acknowledge
Figure 8. Interface Protocol
The following procedure shows how to transfer Command and Display Data.
(1) Generate “START condition”.
(2) Issue Slave Address.
(3) Transfer Command and Display Data.
(4) Generate “STOP condition
Acknowledge
Data format is comprised of 8 bits, Acknowledge bit is returned after sending 8-bit data.
After the transfer of 8-bit data (Slave Address, Command, Display Data), release the SDA line at the falling edge of the 8 th
clock. The SDA line is then pulled “Low” until the falling edge of the 9th clock SCL.
(Output cannot be pulled “High” because of open drain NMOS).
If acknowledge function is not required, keep SDA line at “Low” level from 8th falling edge to 9th falling edge of SCL.
SDA
1to7
8
9
1to7
8
9
1to7
8
9
SCL
S
P
Slave Address
ACK
DATA
ACK
DATA
ACK
STOP
condition
START
condition
Figure 9. Acknowledge timing
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MAX 280 segments (SEG35×COM8)
Function Description – continued
Command Transfer Method
Issue Slave Address (“01111100”) after generate “START condition”.
The 1st byte after Slave Address always becomes command input.
MSB (“Command or Data judgement bit”) of command decide to next data is Command or Display Data.
When set “Command or Data judgement bit”=‘1’, next byte will be command.
When set “Command or Data judgement bit”=‘0’, next byte data is Display Data.
S Slave Address A 1 Command
A
1 Command
A
A Display Data … P
1 Command AA 00 Command
It cannot accept input command once it enters into Display Data transfer state.
In order to input command again it is necessary to generate “START condition”.
If “START condition” or “STOP condition” is sent in the middle of command transmission, command will be cancelled.
If Slave Address is continuously sent following “START condition”, it remains in command input state.
“Slave Address” must be sent right after the “START condition”.
When Slave Address cannot be recognized in the first data transmission, no Acknowledge bit is generated and next
transmission will be invalid. When data is invalid status, if “START condition” is transmitted again, it will return to valid status.
Consider the MPU interface characteristic such as Input rise time and Setup/Hold time when transferring command and data
(Refer to MPU Interface Characteristics).
Write Display and Transfer Method
BU97950AFUV enters “Write mode” when R/W bit of Slave address is ‘0’
BU97950AFUV has Display Data RAM (DDRAM) of 35×8=280bits.
The relationship between data input and Display Data, DDRAM data and address are as follows.
Slave Address
S
0111110
Command
0 A
0
000000
A
R/W=0 (Write Mode)
a b c
d
e f
g h
A
i j k
l m
n o p A
… P
Display Data
In 1/8 Duty Mode
8-bit data is stored in DDRAM. ADSET command specifies the address to be written, and address is automatically
incremented in every 8-bit data.
Data can be continuously written in DDRAM by transmitting data continuously.
BIT
2h
0h
1h
0
a
i
COM0
1
b
j
COM1
2
c
k
COM2
3
d
l
COM3
4
e
m
COM4
5
f
n
COM5
6
g
o
COM6
7
h
p
COM7
SEG0
SEG1
SEG2
3h
DDRAM Address
4h
5h
6h
7h
SEG3
SEG4
SEG5
SEG6
SEG7
...
21h
SEG33
22h
SEG34
Display data is written to DDRAM every 8-bit data.
No need to wait for ACK bit to complete data transfer.
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MAX 280 segments (SEG35×COM8)
Function Description – continued
In 1/4 Duty Mode
4-bit data is stored in DDRAM. ADSET command specifies the address to be written, and address is automatically
incremented in every 8-bit data.
Data can be continuously written in DDRAM by transmitting data continuously.
0h
BIT
1h
2h
DDRAM Address
3h
...
12h
13h
0
a
e
i
m
COM0
1
b
f
j
n
COM1
2
c
g
k
o
COM2
3
d
H
l
p
SEG0
SEG1
SEG2
SEG3
COM3
SEG4
SEG5
SEG6
SEG7
SEG36
SEG37
SEG38
Display data is written to DDRAM every 4-bit data.
No need to wait for ACK bit to complete data transfer
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MAX 280 segments (SEG35×COM8)
Function Description – continued
Read Command Register and Transfer Method
BU97950AFUV enters “Read mode” when R/W bit of Slave Address is ‘1’
During Read mode the command registers can be read.
The sequence for the command register read is shown below.
Slave Address
S
0111110
Command
0 A
1
Slave Address
ADSET
A
0111110 1
P S
R/W=0(Write Mode)
Data
A
A
P
R/W=1(Read Mode)
The following register settings can be read in this mode.
Only one register setting can be read at once, after reading register setting, BU97950 will exit from read mode and wait for
slave Address. If all register setting needs to be read, please make sequence for “REG1” and “REG2”, respectively.
Register
D7
D6
D5
D4
D3
D2
D1
D0
Address
REG1
P7
P6
P5
P4
P3
P2
P1
P0
23h
REG2
P7
P6
P5
P4
P3
P2
P1
P0
24h
REG1:P7 = Frame Frequency setting
P6 = Duty and Bias setting
P5 = Software Reset condition
P4 to P0 = EVR setting
REG2: P7 to P6 = Frame Frequency (FR) setting
P5 to P4 = Power Save Mode (SR) setting
P3 = LCD drive waveform setting
P2 = Display ON/OFF setting
P1 = APON setting
P0 = APOFF setting
An example of the command register read sequence is shown below.
P
S
SDA
Slave Address (read)
A
P7
P6 P5 P4 P3 P2 P1 P0
A
SCL
LCD Driver Bias Circuit
BU97950AFUV generates LCD driving voltage with on-chip Buffer AMP.
And it can drive LCD at low power consumption.
1/4 or 1/3 Bias can be set by MODESET command.
Line or frame inversion can be set by DISCTL command.
Refer to the “LCD driving waveform” for each LCD Bias setting.
Reset Initialize Condition
Initial condition after executing Software Reset is as follows.
-Display is OFF.
-DDRAM address is initialized (DDRAM Data is not initialized).
Refer to Command Description for initialize value of registers.
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MAX 280 segments (SEG35×COM8)
Function Description – continued
Command / Function List
Description List of Command / Function
No.
Command
Function
1
Address Set (ADSET)
DDRAM Address setting (00h to 22h)
Command register address setting (23h, 24h)
2
EVR Set (EVRSET)
EVR setting (0 to 31)
3
Display Control (DISCTL)
Frame Frequency, Power Save Mode setting
4
IC Operation Set (ICSET)
LCD drive mode, Software Reset, display on/off
5
All Pixel Control (APCTL)
All pixel control during display ON
6
Mode Set (MODESET)
Frame Frequency, Duty and Bias setting
Detailed command Description
D7 (MSB) is a Command or Data judgment bit.
Refer to Command / Data transfer method.
C:
0: Next byte is RAM write data.
1: Next byte is command.
Address Set (ADSET)
MSB
D7
C
D6
0
D5
P5
D4
P4
D3
P3
D2
P2
D1
P1
LSB
D0
P0
Address data is specified in P[5:0].
The address range can be set as 00h(000000b) to 22h(100010b) for Write mode.
When the specified address is out of range, the address will be set to “0h(000000b)”.
The default value of the DDRAM Address is “0h(000000b)”
The address can be set 23h(100011b) and 24h(100100b) for Read mode.
It is prohibited to set other address.
P[5:0] = 23h (100011b) - REG1
Register address for Software Reset condition and EVR setting
P[5:0] = 24h (100100b) - REG2
Register address for the other settings
(For more detailed information, please refer to “Read Command Register and Transfer Method”)
EVR Set (EVRSET)
MSB
D7
C
D6
1
D5
0
D4
P4
D3
P3
D2
P2
D1
P1
LSB
D0
P0
BU97950AFUV has 32-step Electrical Volume Register (EVR) that can set the best V0 voltage level
(Maximum LCD driving voltage).
Electrical Volume Register (EVR) is set to “00000” in reset initialize condition.
In “0000” condition, V0 output voltage is equal to VLCD input voltage.
Keep Contrast Setting for V0 voltage more than 2.5V only.
Refer to the below table for V0 voltage.
And ensure “VLCD – V0 > 0.6” condition is satisfied.
Unstable IC output voltage may result if the above conditions are not satisfied.
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MAX 280 segments (SEG35×COM8)
Function Description – continued
The relationship of electrical volume register (EVR) setting and V0 voltage
EVR
Calculation
formula
VLCD
= 6.000
VLCD
= 5.500
VLCD
= 5.000
VLCD
= 4.000
VLCD
= 3.500
VLCD
= 3.000
VLCD
= 2.500
0
VLCD
V0= 6.000
V0= 5.500
V0= 5.000
V0= 4.000
V0= 3.500 V0= 3.000 V0= 2.500
V
1
0.967*VLCD
V0= 5.802
V0= 5.323
V0= 4.839
V0= 3.871
V0= 3.387 V0= 2.903 V0= 2.419
V
2
0.937*VLCD
V0= 5.622
V0= 5.156
V0= 4.688
V0= 3.750
V0= 3.281 V0= 2.813 V0= 2.344
V
3
0.909*VLCD
V0= 5.454
V0= 5.000
V0= 4.545
V0= 3.636
V0= 3.182 V0= 2.727 V0= 2.273
V
4
0.882*VLCD
V0= 5.292
V0= 4.853
V0= 4.412
V0= 3.529
V0= 3.088 V0= 2.647 V0= 2.206
V
5
0.857*VLCD
V0= 5.142
V0= 4.714
V0= 4.286
V0= 3.429
V0= 3.000 V0= 2.571 V0= 2.143
V
6
0.833*VLCD
V0= 4.998
V0= 4.583
V0= 4.167
V0= 3.333
V0= 2.917 V0= 2.500 V0= 2.083
V
7
0.810*VLCD
V0= 4.860
V0= 4.459
V0= 4.054
V0= 3.243
V0= 2.838 V0= 2.432 V0= 2.027
V
8
0.789*VLCD
V0= 4.734
V0= 4.342
V0= 3.947
V0= 3.158
V0= 2.763 V0= 2.368 V0= 1.974
V
9
0.769*VLCD
V0= 4.614
V0= 4.231
V0= 3.846
V0= 3.077
V0= 2.692 V0= 2.308 V0= 1.923
V
10
0.750*VLCD
V0= 4.500
V0= 4.125
V0= 3.750
V0= 3.000
V0= 2.625 V0= 2.250 V0= 1.875
V
Unit
11
0.731*VLCD
V0= 4.386
V0= 4.024
V0= 3.659
V0= 2.927
V0= 2.561 V0= 2.195 V0= 1.829
V
12
0.714*VLCD
V0= 4.284
V0= 3.929
V0= 3.571
V0= 2.857
V0= 2.500 V0= 2.143 V0= 1.786
V
13
0.697*VLCD
V0= 4.182
V0= 3.837
V0= 3.488
V0= 2.791
V0= 2.442 V0= 2.093 V0= 1.744
V
14
0.681*VLCD
V0= 4.086
V0= 3.750
V0= 3.409
V0= 2.727
V0= 2.386 V0= 2.045 V0= 1.705
V
15
0.666*VLCD
V0= 3.996
V0= 3.667
V0= 3.333
V0= 2.667
V0= 2.333 V0= 2.000 V0= 1.667
V
16
0.652*VLCD
V0= 3.912
V0= 3.587
V0= 3.261
V0= 2.609
V0= 2.283 V0= 1.957 V0= 1.630
V
17
0.638*VLCD
V0= 3.828
V0= 3.511
V0= 3.191
V0= 2.553
V0= 2.234 V0= 1.915 V0= 1.596
V
18
0.625*VLCD
V0= 3.750
V0= 3.438
V0= 3.125
V0= 2.500
V0= 2.188 V0= 1.875 V0= 1.563
V
19
0.612*VLCD
V0= 3.672
V0= 3.367
V0= 3.061
V0= 2.449
V0= 2.143 V0= 1.837 V0= 1.531
V
20
0.600*VLCD
V0= 3.600
V0= 3.300
V0= 3.000
V0= 2.400
V0= 2.100 V0= 1.800 V0= 1.500
V
21
0.588*VLCD
V0= 3.528
V0= 3.235
V0= 2.941
V0= 2.353
V0= 2.059 V0= 1.765 V0= 1.471
V
22
0.576*VLCD
V0= 3.456
V0= 3.173
V0= 2.885
V0= 2.308
V0= 2.019 V0= 1.731 V0= 1.442
V
23
0.566*VLCD
V0= 3.396
V0= 3.113
V0= 2.830
V0= 2.264
V0= 1.981 V0= 1.698 V0= 1.415
V
24
0.555*VLCD
V0= 3.330
V0= 3.056
V0= 2.778
V0= 2.222
V0= 1.944 V0= 1.667 V0= 1.389
V
25
0.545*VLCD
V0= 3.270
V0= 3.000
V0= 2.727
V0= 2.182
V0= 1.909 V0= 1.636 V0= 1.364
V
26
0.535*VLCD
V0= 3.210
V0= 2.946
V0= 2.679
V0= 2.143
V0= 1.875 V0= 1.607 V0= 1.339
V
27
0.526*VLCD
V0= 3.156
V0= 2.895
V0= 2.632
V0= 2.105
V0= 1.842 V0= 1.579 V0= 1.316
V
28
0.517*VLCD
V0= 3.102
V0= 2.845
V0= 2.586
V0= 2.069
V0= 1.810 V0= 1.552 V0= 1.293
V
29
0.508*VLCD
V0= 3.048
V0= 2.797
V0= 2.542
V0= 2.034
V0= 1.780 V0= 1.525 V0= 1.271
V
30
0.500*VLCD
V0= 3.000
V0= 2.750
V0= 2.500
V0= 2.000
V0= 1.750 V0= 1.500 V0= 1.250
V
31
0.491*VLCD
V0= 2.946
V0= 2.705
V0= 2.459
V0= 1.967
V0= 1.721 V0= 1.475 V0= 1.230
V
Prohibited setting
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MAX 280 segments (SEG35×COM8)
Function Description – continued
Display Control (DISCTL)
MSB
D7
C
D6
1
D5
1
D4
0
Set Frame Frequency
Setting(Note 1)
D3
P3
D2
P2
D1
P1
LSB
D0
P0
P3
P2
FRSEL(Note 2)
Reset initialize condition
80Hz
0
0
0
○
71Hz
0
1
0
64Hz
1
0
0
50Hz
1
1
0
233Hz
0
0
1
197Hz
0
1
1
160Hz
1
0
1
122Hz
1
1
1
(Note 1) The frame frequency varies according to the characteristics of fCLK when internal oscillation circuit is used.
(Refer to oscillation characteristics for fCLK properties).
(Note 2) Please refer to MODESET for FRSEL
Set Power Save Mode SR.
Setup
Power Save Mode 1
Power Save Mode 2
Normal Mode
High Power Mode
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P1
0
0
1
1
P0
0
1
0
1
Reset initialize condition
○
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MAX 280 segments (SEG35×COM8)
Function Description – continued
Set IC Operation (ICSET)
MSB
D7
C
D6
1
D5
1
D4
1
D3
0
D2
P2
D1
P1
LSB
D0
P0
(* : Don’t care)
Set LCD drive Waveform.
Setup
P2
Reset initialize condition
Line Inversion Mode
0
Frame Inversion Mode
1
○
Power consumption is reduced in the following order:
Line Inversion > Frame Inversion
Typically, when driving large capacitance LCD, Line inversion is more susceptible to influence of crosstalk.
Regarding driving waveform, refer to LCD driving waveform.
Set Software Reset execution
Setup
P1
Reset initialize condition
Software Reset Not Execute
0
○
Software Reset Execute
1
When “Software Reset” is executed, BU97950AFUV is reset to initial condition.
Don’t set Software Reset (P1) with P2, P0 at the same time.
Set Display ON and OFF
Setup
P0
Reset initialize condition
Display off(DISPOFF)
0
○
Display on(DISPON)
1
Display off : Regardless of DDRAM data, all SEGMENT and COMMON output will be stopped after 1frame of
data write. Display OFF mode will be disabled after Display ON command.
Display on:
SEGMENT and COMMON output will be active and start to read the display data from DDRAM.
After receiving the Display ON setting, BU97950AFUV completes startup in one frame and starts displaying. If the
Display OFF setting is received within one frame after receiving the Display ON setting, the state during startup is
maintained and the abnormal current is generated. If you send the Display OFF setting after sending the Display
ON setting, leave an interval of 1 frame or more.
All Pixel control (APCTL)
MSB
D7
C
D6
1
D5
1
D4
1
All display set on, off
Setup
D3
1
D2
0
D1
P1
LSB
D0
P0
P1
Reset initialize condition
Normal
0
○
All pixel on
1
Setup
Normal
P0
Reset initialize condition
0
○
All pixel off
1
All pixels on: All pixels are on regardless of DDRAM data.
All pixels off: All pixels are off regardless of DDRAM data.
This command is valid in Display on status. The data of DDRAM is not changed by this command.
If set both P1 and P0 =”1”, All Pixels OFF will be selected.
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
Function Description – continued
Mode Set (MODE SET)
MSB
D7
D6
D5
C
1
1
D4
D3
D2
D1
LSB
D0
1
1
1
P1
P0
( * : Don’t care)
Set Frame Frequency Setting
Setup
P1
Reset initialize condition
Normal
0
○
200Hz Mode
1
Set Duty and Bias Level
Setup
1/8 Duty and 1/4 Bias
P0
Reset initialize condition
0
○
1/4 Duty and 1/3 Bias
1
Please refer to LCD drive waveform, for example of SEG and COM output waveform
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
LCD Driving Waveform
(1/4 Bias, 1/8 Duty) Line Inversion Mode
SEGn
COM0
stateA
COM1
stateB
SEGn+1 SEGn+2 SEGn+3 SEGn+4 SEGn+5
COM2
COM3
COM4
COM5
COM6
COM7
1frame
V0
COM0
Vss
V0
COM1
Vss
V0
COM2
Vss
V0
COM3
Vss
V0
COM4
Vss
V0
COM5
Vss
V0
COM6
Vss
V0
COM7
Vss
V0
SEGn
Vss
V0
SEGn+1
Vss
V0
SEGn+2
Vss
Vreg
stateA
(COM0-SEGn)
-Vreg
Vreg
stateB
(COM1-SEGn)
-Vreg
Figure 10. Wave form of line inversion
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
LCD Driving Waveform– continued
(1/4 Bias, 1/8 Duty)Frame Inversion Mode
SEGn
COM0
stateA
COM1
stateB
SEGn+1 SEGn+2 SEGn+3 SEGn+4 SEGn+5
COM2
COM3
COM4
COM5
COM6
COM7
1 frame
V0
COM0
VSS
V0
COM1
VSS
V0
COM2
VSS
V0
COM3
VSS
V0
COM4
VSS
V0
COM5
VSS
V0
COM6
VSS
V0
COM7
VSS
V0
SEGn
VSS
V0
SEGn+1
VSS
V0
SEGn+2
VSS
Vreg
stateA
(COM0-SEGn)
-Vreg
Vreg
stateB
(COM1-SEGn)
-Vreg
Figure 11. Wave form of frame inversion
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
LCD Driving Waveform– continued
(1/3 Bias, 1/4 Duty) Line Inversion Mode
SEGn SEGn+1 SEGn+2 SEGn+3
COM0
stateA
COM1
stateB
COM2
COM3
1frame
V0
COM0
VSS
V0
COM1
VSS
V0
COM2
VSS
V0
COM3
VSS
V0
SEGn
VSS
V0
SEGn+1
VSS
V0
SEGn+2
VSS
V0
SEGn+3
VSS
V0
stateA
(COM0-SEGn)
-V0
V0
stateB
(COM1-SEGn)
-V0
Figure 12. Wave form of frame inversion
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
LCD Driving Waveform– continued
(1/3 Bias, 1/4 Duty) Frame Inversion Mode
SEGn SEGn+1 SEGn+2 SEGn+3
COM0
stateA
COM1
stateB
COM2
COM3
1frame
V0
COM0
VSS
V0
COM1
VSS
V0
COM2
VSS
V0
COM3
VSS
V0
SEGn
VSS
V0
SEGn+1
VSS
V0
SEGn+2
VSS
V0
SEGn+3
VSS
V0
stateA
(COM0-SEGn)
-V0
V0
stateB
(COM1-SEGn)
-V0
Figure 13. Wave form of Frame Inversion
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
Initialize sequence
Follow the Power-on sequence below to initialize condition.
Power on
↓
STOP condition
↓
START condition
↓
Issue Slave Address
↓
Execute Software Reset by ICSET command
After Power-on and before sending initialize sequence, each register value, DDRAM Address and DDRAM Data are random.
Start sequence
Start sequence example
No.
Input
1
2
3
4
5
6
7
8
9
Descriptions
VDD=0V to 5V (Tr=0.1ms)
Initialize IC
STOP condition
0
1
1
1
1
1
0
0
START condition
Issue Slave Address
1
1
1
1
0
*
1
*
Execute Software Reset
1
1
1
0
0
0
1
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
DDRAM Address set
*
*
*
*
*
*
*
*
Address 00h
*
*
*
*
*
*
*
*
Address 22h
Display Data
↓
11
STOP
↓
12
START
13
Slave Address
↓
14
ICSET
(*:Don’t’ care)
………
………
10
Power on
↓
wait min 100µs
↓
STOP
↓
START
Slave Address
↓
ICSET
↓
DISCTL
↓
EVRSET
↓
ADSET
↓
Display Data
D7 D6 D5 D4 D3 D2 D1 D0
STOP condition
0
1
1
1
1
1
0
0
START condition
Issue Slave Address
1
1
1
1
0
*
0
1
Display on
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
Cautions in Power ON/OFF
To prevent incorrect display, malfunction and abnormal current, follow Power On/Off sequence shown in waveform below.
VDD must be turned on before VLCD during power up sequence.
VDD must be turned off after VLCD during power down sequence.
Set VDD-2.4≥ VLCD, t1>0ns and t2>0ns.
To refrain from data transmission is strongly recommended while power supply is rising up or falling down to prevent from the
occurrence of disturbances on transmission and reception.
t1
VLCD
VDD
t2
10%
10%
VDD(Min)
VDD(Min)
Figure 14. Recommended Power ON/OFF Sequence
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
Caution in P.O.R Circuit Use
BU97950AFUV has “P.O.R” (Power-On Reset) circuit and Software Reset function.
Keep the following recommended Power-On conditions in order to power up properly.
Set power up conditions to meet the recommended t R, tF, tOFF, and VBOT specification below in order to ensure P.O.R operation.
VDD
tF
tR
Recommended condition of tR, tF, tOFF, VBOT (Ta=25 ºC)
tR
tF
tOFF
VBOT
tOFF
VBOT
Less than
5ms
Less than
5ms
More than
20ms
Less than
0.3V
Figure 15. Power ON/OFF waveform
When it is difficult to keep above conditions, it is possibility to cause meaningless display due to no IC initialization.
Please execute the IC initialization as quickly as possible after Power-on to reduce such an affect.
See the IC initialization flow as below.
Setting TEST2="H" disables the POR circuit, in such case, execute the following sequence.
Note however that it cannot accept command while supply is unstable or below the minimum supply range.
Note also that Software Reset is not a complete alternative to POR function.
(1)
Generate STOP condition
VDD
SDA
SCL
STOP condition
Figure 16. STOP condition
(2)
Generate START condition.
VDD
SDA
SCL
START condition
Figure 17. START condition
(3)
Issue Slave Address.
(4)
Execute Software Reset (ICSET) command.
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
Note on the Multiple Devices be Connected to 2 Wire Interface
Do not access the other device without power supply (VDD) to the BU97950AFUV.
Controller
BU97950AFUV
Device1
Figure 18. Example of BUS connection
To control the slope of the falling edge, a capacitor is connected between gate and drain of a NMOS transistor
(Refer toFigure19).
The gate is in a high-impedance state if the power supply (VDD) is not supplied.
In this condition, the gate voltage is pulled up by the current flow through the capacitance as a result of the SDA signal's
transition from LOW to HIGH.
The NMOS transistor turns on and draws some current (Ids) from the SDA port if the gate voltage (Vg) is higher than the
threshold voltage (Vth).
An external resistor (R) is connected between the power line and SDA line to keep the SDA line as logic HIGH.
But the line cannot be kept as logic HGH if the voltage drop (R*Ids) is large.
Access the other LSIs with power supply to BU97950AFUV to control the gate voltage as logic level of 1 or 0 if the number of
LSIs are connected to the same bus.
Z=1/jωC
VDD
SDA
internal circuit
Vg
Figure 19. SDA output cell structure
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin
lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
Ordering Information
B
U
9
7
9
5
0
A
Part Number
x
x
x
Package
FUV
: TSSOP-C48V
-
xx
Packaging and forming specification
E2: Embossed tape and reel
Lineup
Package
TSSOP-C48V
Orderable Part Number
Reel of 2000
BU97950AFUV-E2
Marking Diagram
TSSOP-C48V(TOP VIEW)
Part Number Marking
BU97950
LOT Number
A
Pin 1 Mark
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
Physical Dimension, Tape and Reel Information
Package Name
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TSSOP-C48V
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BU97950AFUV
MAX 280 segments (SEG35×COM8)
Revision History
Date
Revision
31.July.2017
5.Jan.2021
001
002
Changes
New Release
P.15 Add the description
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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