Datasheet
Standard LCD Segment Drivers
BU9795ZKS2
MAX 140 segments (SEG35×COM4)
●Key Specifications
■ Supply Voltage Range:
+2.5V to +5.5V
■ Operating Temperature Range:
-40°C to +85°C
■ Max Segments:
140 Segments
■ Display Duty:
1/4
■ Bias:
1/2, 1/3 selectable
■ Interface:
3wire serial interface
●Features
Integrated RAM for display data (DDRAM) :
35 × 4bit (Max 140 Segment)
LCD drive output :
4 Common output, Max 35Segment output
Integrated Buffer AMP for LCD driving
Integrated Oscillator circuit
No external components
Low power consumption design
W (Typ.) x D (Typ.) x H (Max.)
●Packages
●Applications
Telephone
FAX
Portable equipment (POS, ECR, PDA etc.)
DSC
DVC
Car audio
Home electrical appliance
Meter equipment
etc.
SQFP-T52
12.00mm x 12.00mm x 1.50mm
●Typical Application Circuit
VDD
VDD
VLCD
COM0
COM1
COM2
COM3
INHb
CSB
SD
SCL
Controller
OSCIN
TEST
VSS
・・・
・・・・
SEG0
SEG1
Segment
LCD
SEG34
Internal oscillator circuit mode
Figure 1.
Typical application circuit
○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays.
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Datasheet
MAX 140 segments (SEG35×COM4)
●Block Diagrams / Pin Configurations / Pin Descriptions
SEG13
SEG14
NC
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
NC
SEG21
SEG0 … SEG34
SEG22
SEG23
COM0 …… COM3
39
VDD
LCD voltage generator
27
40
Common
driver
Segment
driver
26
SEG24
SEG12
SEG25
SEG11
SEG26
SEG10
SEG27
SEG9
SEG28
SEG8
SEG29
SEG7
SEG30
SEG6
SEG31
SEG5
SEG32
SEG4
SEG33
SEG3
SEG34
SEG2
＋
LCD BIAS
－
SELECTOR
Common
counter
＋
Blink timing
generator
DDRAM
－
VLCD
INHb
Command
register
OSCIN
Command
Data Decoder
COM0
SEG1
COM1
OSCILLATOR
Power On Reset
SEG0
14
Serial inter face
52
13
1
INHB
TEST
NC
SDA
SCL
CSB
OSCIN
VSS
VDD
VLCD
NC
COM3
COM2
IF FILTER
VSS
TEST
Figure 2.
CSB
SD
SCL
Block Diagram
Figure 3.
Pin Configuration (TOP VIEW)
Table 1 Pin Description
Pin name
Pin No.
I/O
Function
Input terminal for turn off display
H : turn on display
L : turn off display
Test input (ROHM use only)
Must be connect to VSS
INHb
13
I
TEST
12
I
OSCIN
7
I
External clock input
Ex clock and Int clock can be changed by command.
Must be connect to VSS when use internal oscillation circuit.
SD
10
I
serial data input
SCL
9
I
serial data transfer clock
CSB
8
I
Chip select
VSS
6
GND
VDD
5
Power supply
VLCD
4
Power supply for LCD driving
SEG0-34
COM0-3
14-28,
30-36
38-50
51-52,
1-2
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TSZ22111･15･001
:
”L” active
O
SEGMENT output for LCD driving
O
COMMON output for LCD driving
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Datasheet
MAX 140 segments (SEG35×COM4)
●Absolute Maximum Ratings (VSS=0V)
Parameter
Symbol
Ratings
Unit
Remark
Power supply voltage1
VDD
-0.5 to +7.0
V
Power supply
Power supply voltage2
VLCD
-0.5 to VDD
V
LCD drive voltage
Power dissipation
Pd
0.85
W
When use more than Ta=25°C, subtract 8.5mW
per degree (Package only)
Input voltage range
VIN
-0.5 to VDD+0.5
V
Operational temperature range
Topr
-40 to +85
℃
Storage temperature range
Tstg
-55 to +125
℃
●Recommended Operating Ratings(Ta=-40°C to +85°C,VSS=0V)
Ratings
Parameter
Symbol
Min.
Typ.
Max.
Unit
Remark
Power Supply voltage1
VDD
2.5
-
5.5
V
Power supply
Power Supply voltage2
VLCD
0
-
VDD
-2.4
V
LCD drive voltage
* Please use VDD-VLCD≥2.4V condition.
●Electrical Characteristics
DC Characteristics (VDD=2.5V to 5.5V, VSS=0V, Ta=-40°C to +85°C, unless otherwise specified)
Limits
Parameter
Symbol
Unit
Conditions
MIN
TYP
MAX
“H” level input voltage
VIH
0.7VDD
-
VDD
V
“L” level input voltage
VIL
VSS
-
0.3VDD
V
“H” level input current
IIH
-
-
1
µA
“L” level input current
IIL
-1
-
-
µA
SEG
RON
-
3.5
-
kΩ
COM
RON
-
3.5
-
kΩ
VLCD
0
-
VDD -2.4
V
VDD-VLCD≥2.5V
Ist
-
-
5
µA
Display off, Oscillator off
Power consumption 1
IDD1
-
12.5
30
µA
Power consumption 2
IDD2
-
20
40
µA
LCD Driver
on resistance
VLCD supply voltage
Standby current
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Iload=±10µA
VDD=3.3V, Ta=25°C,
Power save mode1, FR=70Hz
1/3 bias, Frame inverse
VDD=3.3V, Ta=25°C,
Normal mode, FR=80Hz
1/3 bias, Line inverse
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BU9795ZKS2
Datasheet
MAX 140 segments (SEG35×COM4)
●Electrical Characteristics - continued
Oscillation Characteristics (VDD=2.5V to 5.5V,VSS=0V, Ta=-40°C to +85°C)
Limits
Unit
Parameter
Symbol
MIN
TYP
MAX
Conditions
Frame frequency
fCLK
56
80
104
Hz
FR = 80Hz setting
Frame frequency1
fCLK1
70
80
90
Hz
VDD=3.5V, 25°C
MPU interface Characteristics(VDD=2.5V to 5.5V,VSS=0V, Ta=-40°C to +85°C)
Limits
Unit
Parameter
Symbol
MIN
TYP
MAX
Input rise time
tr
-
-
80
ns
Input fall time
tf
-
-
80
ns
SCL cycle time
tSCYC
400
-
-
ns
“H” SCL pulse width
tSHW
100
-
-
ns
“L” SCL pulse width
tSLW
100
-
-
ns
SD setup time
tSDS
20
-
-
ns
SD hold time
tSDH
50
-
-
ns
CSB setup time
tCSS
50
-
-
ns
CSB hold time
tCSH
50
-
-
ns
“H” CSB pulse width
tCHW
50
-
-
ns
Conditions
tCHW
CSB
tCSS
tf
tr
tSCYC
tCSH
tSLW
tSHW
SCL
tSDS
tSDH
SD
Figure 4.
Interface Timing
●I/O equivalent circuit
VDD
VDD
VLCD
TEST
VSS
VSS
VDD
VDD
CSB, SD, SCL
OSCIN
VSS
VSS
VDD
VDD
INHb
VSS
VSS
Figure 5.
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I/O equivalent circuit
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Datasheet
MAX 140 segments (SEG35×COM4)
●Example of recommended circuit
VDD
VDD
VLCD
COM0
COM1
COM2
COM3
INHb
CSB
SD
SCL
Controller
OSCIN
TEST
VSS
・・・
・・・・
SEG0
SEG1
Segment
LCD
SEG34
Using internal oscillator circuit mode
VDD
VDD
VLCD
Controller
COM0
COM1
COM2
COM3
INHb
CSB
SD
SCL
Segment
OSCIN
TEST
VSS
LCD
・・・
・・・
SEG0
SEG1
SEG34
Using external oscillator mode
Figure 6.
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Recommended circuit
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Datasheet
MAX 140 segments (SEG35×COM4)
●Function Description
○Command and data transfer method
○3-SPI (3wire Serial interface)
This device is controlled by 3-wire signal (CSB, SCL, and SD).
First, Interface counter is initialized with CSB=“H", and CSB=“L” makes SD and SCL input enable.
The protocol of 3-SPI transfer is as follows.
Each command starts with Command or Data judgment bit (D/C) as MSB data, followed by D6 to D0 during
CSB =“L”.
(Internal data is latched at the rising edge of SCL, it is converted to 8bits parallel data at the falling edge of 8th CLK.)
Command/Data
Command
CSB
SCL
SD
D/C D6
D5
D4
D/C = “H” : Command
D3
D2
D1
D0
D/C
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D/C = “L” : Data
Figure 7.
3-SPI Command/Data transfer format
○Command transfer method
After CSB=“H”→”L”, 1st byte is always a command input.
MSB of the command input data will be judged that the next byte data, it is a command or display data (This bit is called
“command or data judgment bit”).
When set “command or data judge bit”=‘1’, next byte will be (continuously) command.
When set “command or data judge bit”=‘0’, next byte data is display data.
1 Command
1 Command
Display Data
0 Command
1 Command
…
Once it becomes display data transfer condition, it will not be back to command input condition even if D/C=1.
So if you want to send command data again, please set CSB=“L”→”H”.
(CSB “L”→”H” will cancel data transfer condition.)
Command transfer is done by 8bits unit, so if CSB=“L”→”H” with less than 8bits data transfer, command will be
cancelled.
It will be able to transfer command with CSB=“L” again.
In Case Of Command Transfer
Command
Command
CSB
1
SCL
SD
STATUS
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
DISCTL Command Transfer
Command Cancelled (Less Than 8bits)
DISPON Command Transfer
Figure 8. Command transfer format
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Datasheet
MAX 140 segments (SEG35×COM4)
○Write display data and transfer method
This LSI has Display Data RAM (DDRAM) of 35×4=140bit.
The relationship between data input and display data, DDRAM data and address are as follows.
Command
0000000
a
b
c d
e
f
g
h
i
j k
l m
n
o p
…
Display Data
8 bit data will be stored in DDRAM. The address to be written is the address specified by ADSET command, and the
address is automatically incremented in every 4bit data.
Data can be continuously written in DDRAM by transmitting Data continuously.
(When RAM data is written successively after writing RAM data to 22h (SEG34), the address is returned to 00h
(SEG0) by the auto-increment function.
BIT
DDRAM address
06h 07h ・・・・・・・ 1Eh
00h
01h
02h
03h
04h
05h
0
a
e
i
m
q
u
1
b
f
j
n
r
v
COM1
2
c
g
k
o
s
x
COM2
3
1Fh
20h
21h
22h
COM0
d
h
l
p
t
y
SEG SEG SEG SEG SEG SEG SEG SEG
SEG SEG SEG SEG SEG
・・・・・・・
0
1
2
3
4
5
6
7
30
31
32
33
34
COM3
As data transfer to DDRAM happens every 4bit data, it will be cancelled if it changes CSB=“L”→”H” before
4bits data transfer.
Command
RAM write
CSB
SCL
SD
Address set
D7
D6
D5
D4
D3
D2
D1
D0
D7 D6
D5
D4
D3
D2
D1
D0
Internal signal
RAM write
Address00h
Address01h
Address02h
RAM write (Every 4bit data)
Command
Write data will be
canceled, when CSB='H'
Without
4bit data transfer.
RAM write
CSB
SCL
SD
Address set
D7
D6
D5
D4
D3
D2
D1
D0
D7 D6
D5
D4
D3
D2
D1
D0
Internal signal
RAM write
Address00h
Figure 9.
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TSZ22111･15･001
Address21h
Address22h
Address00h
Return to address "0"
by automatically
increment.
Data Transfer Format
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Datasheet
MAX 140 segments (SEG35×COM4)
○OSCILLATOR
There are two kinds of clock for logic and analog circuit; from internal oscillator circuit or external clock input. If internal
oscillator circuit will be used, OSCIN must be connected to VSS.
*When you use external clock, execute ICSET command and connect OSCIN to external clock.
OSCIN
BU9795ZKS2
OSCIN
BU9795ZKS2
VSS
VSS
Figure 10. Internal oscillator circuit mode
Clock input
Figure 11. External clock mode
○LCD Driver Bias Circuit
This LSI generates LCD driving voltage with on-chip Buffer AMP.
And it can drive LCD at low power consumption.
*1/3 and 1/2Bias can be set in MODESET command.
*Line and frame inversion can be set in DISCTL command.
Refer to “LCD driving waveform” about each LCD driving waveform.
○Blink timing generator
This device has Blinking function.
*This LSI is able to set blink mode with BLKCTL command.
Blink frequency varies widely by characteristic of fCLK, when internal oscillation circuit.
Refer to Oscillation Characteristics for more details on fCLK.
○Reset (initial) condition
Initial condition after execute SOFTWARE RESET is as follows.
・Display is OFF.
・DDRAM address is initialized (DDRAM Data is not initialized).
Refer to Command Description about initialize value of register.
●Command / Function List
Description List of Command / Function
No.
Command
Function
1
Mode Set (MODESET)
Set LCD drive mode
2
Address Set (ADSET)
Set LCD display mode 1
3
Display Control (DISCTL)
Set LCD display mode 2
4
Set IC Operation (ICSET)
Set IC operation
5
Blink Control (BLKCTL)
Set blink mode
6
All Pixel Control (APCTL)
Set pixel condition
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Datasheet
MAX 140 segments (SEG35×COM4)
●Detailed Command Description
D7 (MSB) is bit for command or data judgment.
Refer to Command and data transfer method.
C:
C:
0 : Next byte is RAM write data.
1 : Next byte is command.
○Mode Set (MODE SET)
MSB
LSB
D7
D6
D5
D4
D3
D2
D1
D0
C
1
0
*
P3
P2
*
*
Set display ON and OFF
Setting
P3
Reset initialize condition
Display OFF(DISPOFF)
0
○
(* : Don’t care)
Display ON(DISPON)
1
Display OFF : Regardless of DDRAM data, all SEGMENT and COMMON output will be stopped after 1 frame of
data write. Display OFF mode will be finished by Display ON.
Display ON : SEGMENT and COMMON output will be active and start to read the display data from DDRAM.
(Note) It is not synchronize with display frame, when it will be controlled display ON/OFF with INHb terminal.
Set bias level
Setting
P2
Reset initialize condition
1/3 Bias
0
○
1/2 Bias
1
Refer to LCD driving waveform.
○Address set (ADSET)
MSB
D7
C
D6
0
D5
0
LSB
D4
P4
D3
P3
D2
P2
D1
P1
D0
P0
Address data is specified in P[4 : 0] and P2 (ICSET command) as follows.
MSB
LSB
Internal register
Address [5]
Address [4]
・・・
Address [0]
Bit of each command
ICSET [P2]
ADSET [P4]
・・・
ADSET [P0]
The address is 00h in reset condition. The valid address is 00h to 22h.
Another address is invalid, (otherwise address will be set to 00h.)
P2 of ICSET command is only to define either MSB of address is “1” or “0”.
Address counter will be set only when ADSET command is executed.
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Datasheet
MAX 140 segments (SEG35×COM4)
①
CSB
ADSET”00010”
COMMAND
RAM Write
RAM Write
RAM Write
RAM Write
・・・・・
DISCTL
RAM Write
RAM Write
・・・
RAM Write
Internal Signal
ICSET P2
Internal Signal
Address
000010
000011
000100
100010
・・・
000000
000001
000010
Set address by ADSET command.
P2(ICSET command) is referd to set address.
Address will be set "000010", because P2(ICSET)="0".
000011
000100
000101
Because of no setting ADSET command,
it will be kept the previous address.
It will be start to write RAM data from maintained address.
When RAM data is continuously trasmitted,
address will be increment automaticaly.
When write at 22h address, address will be
returen to 00h automaticaly.
The following address that write at the end is maintained.
②
CSB
COMMAND
ADSET”11111”
RAM Write
RAM Write
RAM Write
RAM Write
・・・・・
ADSET”00000” RAM Write
RAM Write
・・・
RAM Write
Internal Signal
ICSET P2
Internal Signal
Address
011111
100000
100001
100010
000000
000001
000010
000011
000000
Set address by ADSET command.
P2(ICSET command) is referd to set address.
Address will be set "011111", because P2(ICSET)="0".
000001
000010
000011
New address will be set by ADSET command.
When RAM data is continuously trasmitted,
address will be increment automaticaly.
When write at 22h address, address will be
returen to 00h automaticaly.
The following address that write at the end is maintained.
③
CSB
ICSET P2=1 ADSET”00000”
COMMAND
RAM Write
RAM Write
RAM Write
・・・・・
ADSET”00000” RAM Write
RAM Write
・・・
RAM Write
Internal Signal
ICSET P2
Internal Signal
Address
100000
100001
100010
000000
000001
000010
000011
Set address by ADSET command.
P2(ICSET command) is referd to set address.
Address will be set "100000", because P2(ICSET)="1".
It will be set P2="1" by ICSET command.
(ICSET command can not set addres)
100000
100001
100010
000000
New address will be set by ADSET command.
Address will be set "100000", because P2(ICSET)="1".
(P2(ICSET) will maintain the previous address
until ICSET command input.
When RAM data is continuously trasmitted,
address will be increment automaticaly.
When write at 22h address, address will be
returen to 00h automaticaly.
The following address that write at the end is maintained.
④
CSB
COMMAND
ICSET P2=1 ADSET”00000”
RAM Write
RAM Write
RAM Write
・・・・・
ICSET P2=0
RAM Write
RAM Write
・・・
RAM Write
Internal Signal
ICSET P2
Internal Signal
Address
100000
100001
100010
000000
・・・・・
100000
100001
Set address by ADSET command.
P2(ICSET command) is referd to set address.
100010
000000
000001
It is written to RAM continuously
from the previous address.
The address maintain the previous address
When RAM data is continuously trasmitted,
because it doesn't input the ADSET command
address will be increment automaticaly.
though ICSET P2="0" setting.
When write at 22h address, address will be
returen to 00h automaticaly.
The following address that write at the end is maintained.
Figure 12.
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Address Set sequence
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Datasheet
MAX 140 segments (SEG35×COM4)
○Display control (DISCTL)
MSB
D7
D6
D5
D4
C
0
1
P4
Set Frame frequency
Setting
D3
P3
D2
P2
LSB
D0
P0
D1
P1
P4
P3
Reset initialize condition
80Hz
0
0
○
71Hz
0
1
64Hz
1
0
53Hz
1
1
* About the characteristics of FR, refer to Oscillation characteristics.
Set LCD drive waveform
Setting
P2
Reset initialize condition
Line inversion
0
○
Frame inversion
1
Set Power save mode
Setting
P1
P0
Power save mode 1
0
0
Power save mode 2
0
1
Normal mode
1
0
High power mode
1
1
Reset initialize condition
○
*VDD-VLCD≥3.0V is required for High power mode.
(Reference current consumption data)
Setting
Reset initialize condition
Power save mode 1
×0.5
Power save mode 2
×0.67
Normal mode
×1.0
High power mode
×1.8
*Above current consumption data is reference value. It depends on panel load.
(Note) Frame rate FR / LCD drive waveform / Power save mode SR will effect display image.
Select the best value in point of current consumption and display image using LCD panel (under real application).
Screen flicker
Display image / contrast
Frame frequency
Mode
○
-
LCD drive waveform
○
○
-
○
Power save mode
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Datasheet
MAX 140 segments (SEG35×COM4)
○Set IC Operation (ICSET)
MSB
D7
D6
D5
D4
C
1
1
0
D3
1
D2
P2
LSB
D0
P0
D1
P1
P2 : MSB data of DDRAM address. Please refer to “ADSET” command.
Reset initialize condition
Setting
P2
Address MSB’0’
0
Address MSB’1’
1
○
Set Software Reset condition
Setting
P1
No operation
0
Software Reset
1
When “Software Reset” is executed, this LSI will be reset to initial condition.
If software reset is executed, the value of P2 and P1 will be ignored and they will be set initialized condition. (Refer
to “Reset initial condition”)
Switch between internal clock and external clock.
Setting
P0
Reset initialize condition
Internal clock
0
○
External clock input
1
For internal clock
: OSCIN is connected to VSS.
For external clock input : Input external clock into OSCIN.
DISCTL 80Hz select : Frame frequency [Hz] = external clock[Hz] / 512
DISCTL 71Hz select : Frame frequency [Hz] = external clock[Hz] / 576
DISCTL 64Hz select : Frame frequency [Hz] = external clock[Hz] / 648
DISCTL 53Hz select : Frame frequency [Hz] = external clock[Hz] / 768
Command
OSCIN_EN
(Internal signal)
ICSET
Internal clock mode
External clock mode
Internal oscillation
(Internal signal)
External clock
(OSCIN)
Figure 13.
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TSZ22111･15･001
OSCMODE switching timing
12/26
TSZ02201-0P4P0D300780-1-2
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BU9795ZKS2
MAX 140 segments (SEG35×COM4)
○Blink control (BLKCTL)
MSB
D7
C
D6
1
LSB
D5
1
D4
1
Set blink condition
Setting (Hz)
D3
0
D2
*
D1
P1
D0
P0
P1
P0
Reset initialize condition
OFF
0
0
○
0.5
0
1
1
1
0
2
1
1
○All pixel control (APCTL)
MSB
D7
D6
D5
D4
C
1
1
1
D3
1
All display set ON. OFF
Setting
P1
Normal
0
All pixel ON
1
Setting
D2
1
LSB
D0
P0
D1
P1
Reset initialize condition
○
P0
Reset initialize condition
Normal
0
○
All pixel OFF
1
All pixels ON
All pixels OFF
Datasheet
:
:
All pixels are ON regardless of DDRAM data.
All pixels are OFF regardless of DDRAM data.
(Note) All pixels ON/OFF is effective only at the time of “Display ON” status.
The data of DDRAM do not change with this command.
If both P1 and P0=‘1’, APOFF is selected. APOFF has higher priority than APON.
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BU9795ZKS2
Datasheet
MAX 140 segments (SEG35×COM4)
●LCD driving waveform
(1/3bias)
Line inversion
Frame inversion
SEGn SEGn+1 SEG n+2 SEGn+3
SEGn SEGn+1 SEGn+2 SEGn+3
COM0
stateA
COM0
stateA
COM1
stateB
COM1
stateB
COM2
COM2
COM3
COM3
1frame
VDD
1frame
VDD
COM0
COM0
VLCD
VLCD
VDD
VDD
COM1
COM1
VLCD
VDD
VLCD
VDD
COM2
COM2
VLCD
VDD
VLCD
VDD
COM3
COM3
VLCD
VLCD
VDD
VDD
SEGn
SEGn
VLCD
VLCD
VDD
VDD
SEGn+1
SEGn+1
VLCD
VDD
VLCD
VDD
SEGn+2
SEGn+2
VLCD
VDD
VLCD
VDD
SEGn+3
SEGn+3
VLCD
VLCD
stateA
stateA
(COM0-SEGn)
(COM0-SEGn)
stateB
stateB
(COM1-SEGn)
(COM1-SEGn)
Figure 14.
Line inversion waveform(1/3bias)
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TSZ22111･15･001
Figure 15.
14/26
Frame inversion waveform(1/3bias)
TSZ02201-0P4P0D300780-1-2
28.May.2014 Rev.001
BU9795ZKS2
Datasheet
MAX 140 segments (SEG35×COM4)
(1/2bias)
Line inversion
Frame inversion
SEGn SEGn+1 SEGn+2 SEGn+3
SEGn SEGn+1 SEGn+2 SEGn+3
COM0
stateA
COM0
stateA
COM1
stateB
COM1
stateB
COM2
COM2
COM3
COM3
VDD
1frame
1frame
VDD
COM0
COM0
VLCD
VLCD
VDD
VDD
COM1
COM1
VLCD
VLCD
VDD
VDD
COM2
COM2
VLCD
VLCD
VDD
VDD
COM3
COM3
VLCD
VLCD
VDD
VDD
SEGn
SEGn
VLCD
VLCD
VDD
VDD
SEGn+1
SEGn+1
VLCD
VLCD
VDD
VDD
SEGn+2
SEGn+2
VLCD
VLCD
VDD
VDD
SEGn+3
SEGn+3
VLCD
VLCD
stateA
stateA
(COM0-SEGn)
(COM0-SEGn)
stateB
stateB
(COM1-SEGn)
(COM1-SEGn)
Figure 16. Line inversion waveform(1/2bias)
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Figure 17. Frame inversion waveform(1/2bias)
15/26
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28.May.2014 Rev.001
BU9795ZKS2
Datasheet
MAX 140 segments (SEG35×COM4)
●Example of display data
If LCD layout pattern is shown as in Figure28, Figure29 and DDRAM data is shown as in Table 5, display pattern will be
shown as in Figure 30.
COM0
COM1
COM2
COM3
Figure 18. Example COM line pattern
SEG1 SEG3
SEG2
SEG5 SEG7
SEG4 SEG6 SEG8
SEG9
SEG10
Figure 19. Example SEG line pattern
Figure 20. Example Display pattern
Table 5.
DDRAM Data map
S
S
S
E
E
E
G G G
0
1
2
S
E
G
3
S
E
G
4
S
E
G
5
S
E
G
6
S
E
G
7
S
E
G
8
S
E
G
9
S
E
G
10
S
E
G
11
S
E
G
12
S
E
G
13
S
E
G
14
S
E
G
15
S
E
G
16
S
E
G
17
S
E
G
18
S
E
G
19
COM0
D0
0
1
1
0
1
1
1
1
0
1
0
0
0
0
0
0
0
0
0
0
COM1
D1
0
0
1
1
1
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
COM2
D2
0
0
0
1
0
1
0
0
1
0
1
0
0
0
0
0
0
0
0
0
COM3
D3
0
0
1
1
0
0
0
1
0
1
0
0
0
0
0
0
0
0
0
0
Address
00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h
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BU9795ZKS2
Datasheet
MAX 140 segments (SEG35×COM4)
●Initialize sequence
Please follow sequence below after Power-On to set this device to initial condition.
Power on
↓
CSB ’H’
…I/F initialize condition
↓
CSB ’L’
…I/F Data transfer start
↓
Execute Software Reset by sending ICSET command
* Each register value and DDRAM address, DDRAM data are random condition after power on till initialize sequence is executed.
●Start sequence
○Start sequence example 1
No.
Input
1
D7
D6
D5
D4
D3
D2
D1
D0
Power on
Descriptions
VDD=0 to 5V (Tr=0.1ms)
↓
2
wait 100us
Initialize IC
↓
3
CSB
’H’
Initialize I/F data
’L’
I/F Data transfer start
↓
4
CSB
↓
5
ICSET
6
BLKCTL
1
1
1
0
1
*
1
0
Software Reset
1
1
1
1
0
*
0
1
1
0
1
0
0
1
1
0
1
1
1
0
1
0
0
0
RAM address MSB set
0
0
0
0
0
0
0
0
RAM address set
↓
↓
7
DISCTL
↓
8
ICSET
9
ADSET
10
Display Data
*
*
*
*
*
*
*
*
address
00h to 01h
Display Data
*
*
*
*
*
*
*
*
address
02h to 03h
*
*
*
*
*
*
*
*
address
↓
↓
…
…
Display Data
22h to 00h
↓
11
CSB ‘H’
12
CSB ‘L’
I/F Data transfer stop
↓
I/F Data transfer start
↓
13
MODESET
1
1
0
*
1
0
*
*
Display ON
↓
14
CSB ‘H’
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I/F Data transfer stop
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BU9795ZKS2
Datasheet
MAX 140 segments (SEG35×COM4)
○Start sequence example 2
Initialize
Initialize Sequence
DISPON
DISPON Sequence
RAM write
RAM write Sequence
DISPOFF
DISPOFF Sequence
This LSI is initialized with Initialize Sequence. And start to display with DISPON Sequence.
This LSI will update display data with RAM write Sequence.
And stop the display with DISPOFF sequence.
If you want to restart to display, This LSI will restart to display with DISPON Sequence.
Initialize sequence
Input
Power on
wait 100us
CSB 'H'
CSB 'L'
ICSET
MODESET
ADSET
Display Data
…
CSB 'H'
DATA
Description
D7 D6 D5 D4 D3 D2 D1 D0
IC initialized
I/F initialized
1
1
1
0
1
0
1
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
*
*
*
*
*
*
*
*
Software Reset
Display OFF
RAM address set
Display data
DISPON sequence
Input
CSB 'L'
DISCTL
BLKCTL
APCTL
MODESET
CSB 'H'
DATA
Description
D7 D6 D5 D4 D3 D2 D1 D0
1
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
1
1
0
0
1
1
0
0
1
0
0
0
Display Control
BLKCTL
APCTL
Display ON
RAM write sequence
Input
CSB 'L'
DISCTL
BLKCTL
APCTL
MODESET
ADSET
Display Data
…
DATA
Description
D7 D6 D5 D4 D3 D2 D1 D0
1
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
1
1
0
0
1
1
0
0
1
0
0
0
0
0
0
0
0
0
0
0
*
*
*
*
*
*
*
*
Display Control
BLKCTL
APCTL
Display ON
RAM address set
Display data
CSB 'H'
DISPOFF sequence
Input
CSB 'L'
MODESET
CSB 'H'
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TSZ22111･15･001
DATA
D7 D6 D5 D4 D3 D2 D1 D0
1
1
0
0
0
0
0
0
18/26
Description
Display OFF
TSZ02201-0P4P0D300780-1-2
28.May.2014 Rev.001
BU9795ZKS2
Datasheet
MAX 140 segments (SEG35×COM4)
●Example of start sequence
START
Reduce operating
current or enhance
display quality
Display quality
Please select Frame rate from 80Hz,71Hz,64Hz,53Hz
according to LCD panel characteristic.
Line inversion.
Power save mode= High Power mode
DISCTL setup value
"101**011"
Operating current
Operating current decreases in order of
80Hz>71Hz>64Hz>53Hz.
Frame inversion.
Power save mode= Power save mode1
Screen Flicker?
DISCTL setup value
"101**100"
OK
Please select Frame rate from 80Hz,71Hz,64Hz,53Hz
according to LCD panel characteristic.
Frame inversion.
Power save mode= Power save mode1
DISCTL setup value
"101**100"
NG
Operating current decreases in order of
80Hz>71Hz>64Hz>53Hz.
Frame inversion.
Power save mode= Power save mode2
Screen Flicker?
DISCTL setup value
"101**101"
OK
Please select Frame rate from 80Hz,71Hz,64Hz,53Hz
according to LCD panel characteristic.
Frame inversion.
Power save mode= Power save mode2
DISCTL setup value
"101**101"
NG
Operating current decreases in order of
80Hz>71Hz>64Hz>53Hz.
Frame inversion.
Power save mode= Normal mode
Screen Flicker?
DISCTL setup value
"101**110"
OK
Please select Frame rate from 80Hz,71Hz,64Hz,53Hz
according to LCD panel characteristic.
Frame inversion.
Power save mode= Normal mode
DISCTL setup value
"101**110"
NG
Operating current decreases in order of
80Hz>71Hz>64Hz>53Hz.
Frame inversion.
Power save mode= High Power mode
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DISCTL setup value
"101**111"
19/26
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BU9795ZKS2
Datasheet
MAX 140 segments (SEG35×COM4)
●Cautions on Power ON condition
This LSI has “P.O.R” (Power-On Reset) circuit and Software Reset function.
Please keep the following recommended Power-On conditions in order to power up properly.
Please set power up conditions to meet the recommended tR, tF, tOFF, and Vbot spec below in order to ensure P.O.R
operation.
VDD
tF
tR
tOFF
Figure 21.
Recommended condition of tR,tF,tOFF,Vbot
tR
Less than
1ms
Vbot
tF
Less than
1ms
tOFF
More than
150ms
Vbot
Less than
0.1V
Power ON/OFF waveform
If it is difficult to meet above conditions, execute the following sequence after Power-On.
Command input is not accepted during power off. It has to take care that software reset is not a perfect substitute to POR
function.
(1) CSB=“L”→”H” condition
VDD
CSB
Figure 22.
CSB Timing
(2) After CSB”H”→”L”, execute Software Reset (ICSET command).
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BU9795ZKS2
Datasheet
MAX 140 segments (SEG35×COM4)
●Cautions on application
In case, BU9795ZKS used at VLCD≠VSS, voltage gap occur between SEG line to COM1–3 line at Display off state.
Because of this voltage gap, there is possibility to display LCD for a moment.
To avoid this phenomenon, please decide VDD and VLCD level to satisfy Voff voltage lower than OFF level (OFF level = 1V
at the example explained below).
condition ： VDD=5.0V
VLCD=2.0V
1/3bias
DDRAM data ALL "H"
Frame inversion
In case, VLCD voltage different from VSS level（VLCD≠VSS)
In this case, volatage gap occur, between SEG line to COM 1-3 line.
Because of this gap, there is possibility to display LCD for a moment.
1Frame
Send "Display off" command
VDD (5V)
SEG0 Output
Output VLCD level at display off
（All SEG terminal）
VLCD (2V)
VLCD-VSS=2V
VSS
COM0 Output
VDD (5V)
Output VLCD level at display off
（Only COM0 terminal）
VLCD (2V)
VLCD-VSS=2V
VSS
COM1 Output
VDD (5V)
VLCD (2V)
Output VSS level at display off
(at COM 1-3 terminal)
VLCD-VSS=2V
VSS
Display on
Voltage gap of
COM0-SEG0
Display off
3V
2V
the volatage between COM0 to SEG0
is 0V at display off.
1V
0V
-1V
-2V
-3V
Display off
Display on
Voltage gap of
COM1-SEG0
3V
2V
ON level
the volatage between COM1 to SEG0
is -2V at display off.
1V
OFF level
0V
-1V
Voff
-2V
-3V
Voltage gap occur between COM1 to SEG0 at display off.
So, there is possibility to display LCD.
（Only at COM 1-3 line）
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BU9795ZKS2
Datasheet
MAX 140 segments (SEG35×COM4)
●Operational Notes
(1) Absolute Maximum Ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as
adding a fuse, in case the IC is operated over the absolute maximum ratings.
(2) Recommended Operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
(4) Power Supply Lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines
of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the
analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature
and aging on the capacitance value when using electrolytic capacitors.
(5) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
(6) Short between Pins and Mounting Errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
(7) Operation under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
(8) Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
(9) Regarding Input Pins of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower
than the GND voltage should be avoided. Furthermore, do not apply a voltage to the input terminals when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input terminals have
voltages within the values specified in the electrical characteristics of this IC.
(10) GND Wiring Pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on
the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
(11) External Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
(12) Unused Input Terminals
Input terminals of an IC are often connected to the gate of a CMOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of IC. So unless otherwise specified, input terminals not being used should be connected to the
power supply or ground line.
(13) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to the
parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special consideration
to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
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TSZ02201-0P4P0D300780-1-2
28.May.2014 Rev.001
BU9795ZKS2
MAX 140 segments (SEG35×COM4)
Datasheet
●Ordering Information
B
U
9
7
9
Part Number
5
Z
K
S
2
Package
KS2
: SQFP-T52
●Lineup
Package
SQFP-T52
Tray of 1000
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Orderable Part Number
BU9795ZKS2
23/26
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28.May.2014 Rev.001
BU9795ZKS2
Datasheet
MAX 140 segments (SEG35×COM4)
Physical Dimension, Tape and Reel Information
Package Name
SQFP-T52
Container
Tray (with dry pack)
Quantity
1000pcs
Direction of feed Direction of product is fixed in a tray
1pin
∗ Order quantity needs to be multiple of the minimum quantity.
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28.May.2014 Rev.001
BU9795ZKS2
MAX 140 segments (SEG35×COM4)
Datasheet
●Marking Diagrams
SQFP-T52 (TOP VIEW)
Part Number Marking
BU9795AKS2
LOT Number
1PIN MARK
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28.May.2014 Rev.001
BU9795ZKS2
MAX 140 segments (SEG35×COM4)
Datasheet
●Revision History
Date
Revision
28.May.2014
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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