BU9795ZKS2

Datasheet Standard LCD Segment Drivers BU9795ZKS2 MAX 140 segments (SEG35×COM4) ●Key Specifications ■ Supply Voltage Range: +2.5V to +5.5V ■ Operating Temperature Range: -40°C to +85°C ■ Max Segments: 140 Segments ■ Display Duty: 1/4 ■ Bias: 1/2, 1/3 selectable ■ Interface: 3wire serial interface ●Features Integrated RAM for display data (DDRAM) : 35 × 4bit (Max 140 Segment) LCD drive output : 4 Common output, Max 35Segment output Integrated Buffer AMP for LCD driving Integrated Oscillator circuit No external components Low power consumption design W (Typ.) x D (Typ.) x H (Max.) ●Packages ●Applications Telephone FAX Portable equipment (POS, ECR, PDA etc.) DSC DVC Car audio Home electrical appliance Meter equipment etc. SQFP-T52 12.00mm x 12.00mm x 1.50mm ●Typical Application Circuit VDD VDD VLCD COM0 COM1 COM2 COM3 INHb CSB SD SCL Controller OSCIN TEST VSS ・・・ ・・・・ SEG0 SEG1 Segment LCD SEG34 Internal oscillator circuit mode Figure 1. Typical application circuit ○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 1/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ●Block Diagrams / Pin Configurations / Pin Descriptions SEG13 SEG14 NC SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 NC SEG21 SEG0 … SEG34 SEG22 SEG23 COM0 …… COM3 39 VDD LCD voltage generator 27 40 Common driver Segment driver 26 SEG24 SEG12 SEG25 SEG11 SEG26 SEG10 SEG27 SEG9 SEG28 SEG8 SEG29 SEG7 SEG30 SEG6 SEG31 SEG5 SEG32 SEG4 SEG33 SEG3 SEG34 SEG2 ＋ LCD BIAS － SELECTOR Common counter ＋ Blink timing generator DDRAM － VLCD INHb Command register OSCIN Command Data Decoder COM0 SEG1 COM1 OSCILLATOR Power On Reset SEG0 14 Serial inter face 52 13 1 INHB TEST NC SDA SCL CSB OSCIN VSS VDD VLCD NC COM3 COM2 IF FILTER VSS TEST Figure 2. CSB SD SCL Block Diagram Figure 3. Pin Configuration (TOP VIEW) Table 1 Pin Description Pin name Pin No. I/O Function Input terminal for turn off display H : turn on display L : turn off display Test input (ROHM use only) Must be connect to VSS INHb 13 I TEST 12 I OSCIN 7 I External clock input Ex clock and Int clock can be changed by command. Must be connect to VSS when use internal oscillation circuit. SD 10 I serial data input SCL 9 I serial data transfer clock CSB 8 I Chip select VSS 6 GND VDD 5 Power supply VLCD 4 Power supply for LCD driving SEG0-34 COM0-3 14-28, 30-36 38-50 51-52, 1-2 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 : ”L” active O SEGMENT output for LCD driving O COMMON output for LCD driving 2/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ●Absolute Maximum Ratings (VSS=0V) Parameter Symbol Ratings Unit Remark Power supply voltage1 VDD -0.5 to +7.0 V Power supply Power supply voltage2 VLCD -0.5 to VDD V LCD drive voltage Power dissipation Pd 0.85 W When use more than Ta=25°C, subtract 8.5mW per degree (Package only) Input voltage range VIN -0.5 to VDD+0.5 V Operational temperature range Topr -40 to +85 ℃ Storage temperature range Tstg -55 to +125 ℃ ●Recommended Operating Ratings(Ta=-40°C to +85°C,VSS=0V) Ratings Parameter Symbol Min. Typ. Max. Unit Remark Power Supply voltage1 VDD 2.5 - 5.5 V Power supply Power Supply voltage2 VLCD 0 - VDD -2.4 V LCD drive voltage * Please use VDD-VLCD≥2.4V condition. ●Electrical Characteristics DC Characteristics (VDD=2.5V to 5.5V, VSS=0V, Ta=-40°C to +85°C, unless otherwise specified) Limits Parameter Symbol Unit Conditions MIN TYP MAX “H” level input voltage VIH 0.7VDD - VDD V “L” level input voltage VIL VSS - 0.3VDD V “H” level input current IIH - - 1 µA “L” level input current IIL -1 - - µA SEG RON - 3.5 - kΩ COM RON - 3.5 - kΩ VLCD 0 - VDD -2.4 V VDD-VLCD≥2.5V Ist - - 5 µA Display off, Oscillator off Power consumption 1 IDD1 - 12.5 30 µA Power consumption 2 IDD2 - 20 40 µA LCD Driver on resistance VLCD supply voltage Standby current www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/26 Iload=±10µA VDD=3.3V, Ta=25°C, Power save mode1, FR=70Hz 1/3 bias, Frame inverse VDD=3.3V, Ta=25°C, Normal mode, FR=80Hz 1/3 bias, Line inverse TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ●Electrical Characteristics - continued Oscillation Characteristics (VDD=2.5V to 5.5V,VSS=0V, Ta=-40°C to +85°C) Limits Unit Parameter Symbol MIN TYP MAX Conditions Frame frequency fCLK 56 80 104 Hz FR = 80Hz setting Frame frequency1 fCLK1 70 80 90 Hz VDD=3.5V, 25°C MPU interface Characteristics(VDD=2.5V to 5.5V,VSS=0V, Ta=-40°C to +85°C) Limits Unit Parameter Symbol MIN TYP MAX Input rise time tr - - 80 ns Input fall time tf - - 80 ns SCL cycle time tSCYC 400 - - ns “H” SCL pulse width tSHW 100 - - ns “L” SCL pulse width tSLW 100 - - ns SD setup time tSDS 20 - - ns SD hold time tSDH 50 - - ns CSB setup time tCSS 50 - - ns CSB hold time tCSH 50 - - ns “H” CSB pulse width tCHW 50 - - ns Conditions tCHW CSB tCSS tf tr tSCYC tCSH tSLW tSHW SCL tSDS tSDH SD Figure 4. Interface Timing ●I/O equivalent circuit VDD VDD VLCD TEST VSS VSS VDD VDD CSB, SD, SCL OSCIN VSS VSS VDD VDD INHb VSS VSS Figure 5. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 I/O equivalent circuit 4/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ●Example of recommended circuit VDD VDD VLCD COM0 COM1 COM2 COM3 INHb CSB SD SCL Controller OSCIN TEST VSS ・・・ ・・・・ SEG0 SEG1 Segment LCD SEG34 Using internal oscillator circuit mode VDD VDD VLCD Controller COM0 COM1 COM2 COM3 INHb CSB SD SCL Segment OSCIN TEST VSS LCD ・・・ ・・・ SEG0 SEG1 SEG34 Using external oscillator mode Figure 6. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Recommended circuit 5/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ●Function Description ○Command and data transfer method ○3-SPI (3wire Serial interface) This device is controlled by 3-wire signal (CSB, SCL, and SD). First, Interface counter is initialized with CSB=“H", and CSB=“L” makes SD and SCL input enable. The protocol of 3-SPI transfer is as follows. Each command starts with Command or Data judgment bit (D/C) as MSB data, followed by D6 to D0 during CSB =“L”. (Internal data is latched at the rising edge of SCL, it is converted to 8bits parallel data at the falling edge of 8th CLK.) Command/Data Command CSB SCL SD D/C D6 D5 D4 D/C = “H” : Command D3 D2 D1 D0 D/C D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D/C = “L” : Data Figure 7. 3-SPI Command/Data transfer format ○Command transfer method After CSB=“H”→”L”, 1st byte is always a command input. MSB of the command input data will be judged that the next byte data, it is a command or display data (This bit is called “command or data judgment bit”). When set “command or data judge bit”=‘1’, next byte will be (continuously) command. When set “command or data judge bit”=‘0’, next byte data is display data. 1 Command 1 Command Display Data 0 Command 1 Command … Once it becomes display data transfer condition, it will not be back to command input condition even if D/C=1. So if you want to send command data again, please set CSB=“L”→”H”. (CSB “L”→”H” will cancel data transfer condition.) Command transfer is done by 8bits unit, so if CSB=“L”→”H” with less than 8bits data transfer, command will be cancelled. It will be able to transfer command with CSB=“L” again. In Case Of Command Transfer Command Command CSB 1 SCL SD STATUS 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 DISCTL Command Transfer Command Cancelled (Less Than 8bits) DISPON Command Transfer Figure 8. Command transfer format www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ○Write display data and transfer method This LSI has Display Data RAM (DDRAM) of 35×4=140bit. The relationship between data input and display data, DDRAM data and address are as follows. Command 0000000 a b c d e f g h i j k l m n o p … Display Data 8 bit data will be stored in DDRAM. The address to be written is the address specified by ADSET command, and the address is automatically incremented in every 4bit data. Data can be continuously written in DDRAM by transmitting Data continuously. (When RAM data is written successively after writing RAM data to 22h (SEG34), the address is returned to 00h (SEG0) by the auto-increment function. BIT DDRAM address 06h 07h ・・・・・・・ 1Eh 00h 01h 02h 03h 04h 05h 0 a e i m q u 1 b f j n r v COM1 2 c g k o s x COM2 3 1Fh 20h 21h 22h COM0 d h l p t y SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG ・・・・・・・ 0 1 2 3 4 5 6 7 30 31 32 33 34 COM3 As data transfer to DDRAM happens every 4bit data, it will be cancelled if it changes CSB=“L”→”H” before 4bits data transfer. Command RAM write CSB SCL SD Address set D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 Internal signal RAM write Address00h Address01h Address02h RAM write (Every 4bit data) Command Write data will be canceled, when CSB='H' Without 4bit data transfer. RAM write CSB SCL SD Address set D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 Internal signal RAM write Address00h Figure 9. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Address21h Address22h Address00h Return to address "0" by automatically increment. Data Transfer Format 7/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ○OSCILLATOR There are two kinds of clock for logic and analog circuit; from internal oscillator circuit or external clock input. If internal oscillator circuit will be used, OSCIN must be connected to VSS. *When you use external clock, execute ICSET command and connect OSCIN to external clock. OSCIN BU9795ZKS2 OSCIN BU9795ZKS2 VSS VSS Figure 10. Internal oscillator circuit mode Clock input Figure 11. External clock mode ○LCD Driver Bias Circuit This LSI generates LCD driving voltage with on-chip Buffer AMP. And it can drive LCD at low power consumption. *1/3 and 1/2Bias can be set in MODESET command. *Line and frame inversion can be set in DISCTL command. Refer to “LCD driving waveform” about each LCD driving waveform. ○Blink timing generator This device has Blinking function. *This LSI is able to set blink mode with BLKCTL command. Blink frequency varies widely by characteristic of fCLK, when internal oscillation circuit. Refer to Oscillation Characteristics for more details on fCLK. ○Reset (initial) condition Initial condition after execute SOFTWARE RESET is as follows. ・Display is OFF. ・DDRAM address is initialized (DDRAM Data is not initialized). Refer to Command Description about initialize value of register. ●Command / Function List Description List of Command / Function No. Command Function 1 Mode Set (MODESET) Set LCD drive mode 2 Address Set (ADSET) Set LCD display mode 1 3 Display Control (DISCTL) Set LCD display mode 2 4 Set IC Operation (ICSET) Set IC operation 5 Blink Control (BLKCTL) Set blink mode 6 All Pixel Control (APCTL) Set pixel condition www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ●Detailed Command Description D7 (MSB) is bit for command or data judgment. Refer to Command and data transfer method. C: C: 0 : Next byte is RAM write data. 1 : Next byte is command. ○Mode Set (MODE SET) MSB LSB D7 D6 D5 D4 D3 D2 D1 D0 C 1 0 * P3 P2 * * Set display ON and OFF Setting P3 Reset initialize condition Display OFF(DISPOFF) 0 ○ (* : Don’t care) Display ON(DISPON) 1 Display OFF : Regardless of DDRAM data, all SEGMENT and COMMON output will be stopped after 1 frame of data write. Display OFF mode will be finished by Display ON. Display ON : SEGMENT and COMMON output will be active and start to read the display data from DDRAM. (Note) It is not synchronize with display frame, when it will be controlled display ON/OFF with INHb terminal. Set bias level Setting P2 Reset initialize condition 1/3 Bias 0 ○ 1/2 Bias 1 Refer to LCD driving waveform. ○Address set (ADSET) MSB D7 C D6 0 D5 0 LSB D4 P4 D3 P3 D2 P2 D1 P1 D0 P0 Address data is specified in P[4 : 0] and P2 (ICSET command) as follows. MSB LSB Internal register Address [5] Address [4] ・・・ Address [0] Bit of each command ICSET [P2] ADSET [P4] ・・・ ADSET [P0] The address is 00h in reset condition. The valid address is 00h to 22h. Another address is invalid, (otherwise address will be set to 00h.) P2 of ICSET command is only to define either MSB of address is “1” or “0”. Address counter will be set only when ADSET command is executed. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ① CSB ADSET”00010” COMMAND RAM Write RAM Write RAM Write RAM Write ・・・・・ DISCTL RAM Write RAM Write ・・・ RAM Write Internal Signal ICSET P2 Internal Signal Address 000010 000011 000100 100010 ・・・ 000000 000001 000010 Set address by ADSET command. P2(ICSET command) is referd to set address. Address will be set "000010", because P2(ICSET)="0". 000011 000100 000101 Because of no setting ADSET command, it will be kept the previous address. It will be start to write RAM data from maintained address. When RAM data is continuously trasmitted, address will be increment automaticaly. When write at 22h address, address will be returen to 00h automaticaly. The following address that write at the end is maintained. ② CSB COMMAND ADSET”11111” RAM Write RAM Write RAM Write RAM Write ・・・・・ ADSET”00000” RAM Write RAM Write ・・・ RAM Write Internal Signal ICSET P2 Internal Signal Address 011111 100000 100001 100010 000000 000001 000010 000011 000000 Set address by ADSET command. P2(ICSET command) is referd to set address. Address will be set "011111", because P2(ICSET)="0". 000001 000010 000011 New address will be set by ADSET command. When RAM data is continuously trasmitted, address will be increment automaticaly. When write at 22h address, address will be returen to 00h automaticaly. The following address that write at the end is maintained. ③ CSB ICSET P2=1 ADSET”00000” COMMAND RAM Write RAM Write RAM Write ・・・・・ ADSET”00000” RAM Write RAM Write ・・・ RAM Write Internal Signal ICSET P2 Internal Signal Address 100000 100001 100010 000000 000001 000010 000011 Set address by ADSET command. P2(ICSET command) is referd to set address. Address will be set "100000", because P2(ICSET)="1". It will be set P2="1" by ICSET command. (ICSET command can not set addres) 100000 100001 100010 000000 New address will be set by ADSET command. Address will be set "100000", because P2(ICSET)="1". (P2(ICSET) will maintain the previous address until ICSET command input. When RAM data is continuously trasmitted, address will be increment automaticaly. When write at 22h address, address will be returen to 00h automaticaly. The following address that write at the end is maintained. ④ CSB COMMAND ICSET P2=1 ADSET”00000” RAM Write RAM Write RAM Write ・・・・・ ICSET P2=0 RAM Write RAM Write ・・・ RAM Write Internal Signal ICSET P2 Internal Signal Address 100000 100001 100010 000000 ・・・・・ 100000 100001 Set address by ADSET command. P2(ICSET command) is referd to set address. 100010 000000 000001 It is written to RAM continuously from the previous address. The address maintain the previous address When RAM data is continuously trasmitted, because it doesn't input the ADSET command address will be increment automaticaly. though ICSET P2="0" setting. When write at 22h address, address will be returen to 00h automaticaly. The following address that write at the end is maintained. Figure 12. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Address Set sequence 10/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ○Display control (DISCTL) MSB D7 D6 D5 D4 C 0 1 P4 Set Frame frequency Setting D3 P3 D2 P2 LSB D0 P0 D1 P1 P4 P3 Reset initialize condition 80Hz 0 0 ○ 71Hz 0 1 64Hz 1 0 53Hz 1 1 * About the characteristics of FR, refer to Oscillation characteristics. Set LCD drive waveform Setting P2 Reset initialize condition Line inversion 0 ○ Frame inversion 1 Set Power save mode Setting P1 P0 Power save mode 1 0 0 Power save mode 2 0 1 Normal mode 1 0 High power mode 1 1 Reset initialize condition ○ *VDD-VLCD≥3.0V is required for High power mode. (Reference current consumption data) Setting Reset initialize condition Power save mode 1 ×0.5 Power save mode 2 ×0.67 Normal mode ×1.0 High power mode ×1.8 *Above current consumption data is reference value. It depends on panel load. (Note) Frame rate FR / LCD drive waveform / Power save mode SR will effect display image. Select the best value in point of current consumption and display image using LCD panel (under real application). Screen flicker Display image / contrast Frame frequency Mode ○ - LCD drive waveform ○ ○ - ○ Power save mode www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ○Set IC Operation (ICSET) MSB D7 D6 D5 D4 C 1 1 0 D3 1 D2 P2 LSB D0 P0 D1 P1 P2 : MSB data of DDRAM address. Please refer to “ADSET” command. Reset initialize condition Setting P2 Address MSB’0’ 0 Address MSB’1’ 1 ○ Set Software Reset condition Setting P1 No operation 0 Software Reset 1 When “Software Reset” is executed, this LSI will be reset to initial condition. If software reset is executed, the value of P2 and P1 will be ignored and they will be set initialized condition. (Refer to “Reset initial condition”) Switch between internal clock and external clock. Setting P0 Reset initialize condition Internal clock 0 ○ External clock input 1 For internal clock : OSCIN is connected to VSS. For external clock input : Input external clock into OSCIN. DISCTL 80Hz select : Frame frequency [Hz] = external clock[Hz] / 512 DISCTL 71Hz select : Frame frequency [Hz] = external clock[Hz] / 576 DISCTL 64Hz select : Frame frequency [Hz] = external clock[Hz] / 648 DISCTL 53Hz select : Frame frequency [Hz] = external clock[Hz] / 768 Command OSCIN_EN (Internal signal) ICSET Internal clock mode External clock mode Internal oscillation (Internal signal) External clock (OSCIN) Figure 13. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 OSCMODE switching timing 12/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 MAX 140 segments (SEG35×COM4) ○Blink control (BLKCTL) MSB D7 C D6 1 LSB D5 1 D4 1 Set blink condition Setting (Hz) D3 0 D2 * D1 P1 D0 P0 P1 P0 Reset initialize condition OFF 0 0 ○ 0.5 0 1 1 1 0 2 1 1 ○All pixel control (APCTL) MSB D7 D6 D5 D4 C 1 1 1 D3 1 All display set ON. OFF Setting P1 Normal 0 All pixel ON 1 Setting D2 1 LSB D0 P0 D1 P1 Reset initialize condition ○ P0 Reset initialize condition Normal 0 ○ All pixel OFF 1 All pixels ON All pixels OFF Datasheet : : All pixels are ON regardless of DDRAM data. All pixels are OFF regardless of DDRAM data. (Note) All pixels ON/OFF is effective only at the time of “Display ON” status. The data of DDRAM do not change with this command. If both P1 and P0=‘1’, APOFF is selected. APOFF has higher priority than APON. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ●LCD driving waveform (1/3bias) Line inversion Frame inversion SEGn SEGn+1 SEG n+2 SEGn+3 SEGn SEGn+1 SEGn+2 SEGn+3 COM0 stateA COM0 stateA COM1 stateB COM1 stateB COM2 COM2 COM3 COM3 1frame VDD 1frame VDD COM0 COM0 VLCD VLCD VDD VDD COM1 COM1 VLCD VDD VLCD VDD COM2 COM2 VLCD VDD VLCD VDD COM3 COM3 VLCD VLCD VDD VDD SEGn SEGn VLCD VLCD VDD VDD SEGn+1 SEGn+1 VLCD VDD VLCD VDD SEGn+2 SEGn+2 VLCD VDD VLCD VDD SEGn+3 SEGn+3 VLCD VLCD stateA stateA (COM0-SEGn) (COM0-SEGn) stateB stateB (COM1-SEGn) (COM1-SEGn) Figure 14. Line inversion waveform(1/3bias) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Figure 15. 14/26 Frame inversion waveform(1/3bias) TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) (1/2bias) Line inversion Frame inversion SEGn SEGn+1 SEGn+2 SEGn+3 SEGn SEGn+1 SEGn+2 SEGn+3 COM0 stateA COM0 stateA COM1 stateB COM1 stateB COM2 COM2 COM3 COM3 VDD 1frame 1frame VDD COM0 COM0 VLCD VLCD VDD VDD COM1 COM1 VLCD VLCD VDD VDD COM2 COM2 VLCD VLCD VDD VDD COM3 COM3 VLCD VLCD VDD VDD SEGn SEGn VLCD VLCD VDD VDD SEGn+1 SEGn+1 VLCD VLCD VDD VDD SEGn+2 SEGn+2 VLCD VLCD VDD VDD SEGn+3 SEGn+3 VLCD VLCD stateA stateA (COM0-SEGn) (COM0-SEGn) stateB stateB (COM1-SEGn) (COM1-SEGn) Figure 16. Line inversion waveform(1/2bias) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Figure 17. Frame inversion waveform(1/2bias) 15/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ●Example of display data If LCD layout pattern is shown as in Figure28, Figure29 and DDRAM data is shown as in Table 5, display pattern will be shown as in Figure 30. COM0 COM1 COM2 COM3 Figure 18. Example COM line pattern SEG1 SEG3 SEG2 SEG5 SEG7 SEG4 SEG6 SEG8 SEG9 SEG10 Figure 19. Example SEG line pattern Figure 20. Example Display pattern Table 5. DDRAM Data map S S S E E E G G G 0 1 2 S E G 3 S E G 4 S E G 5 S E G 6 S E G 7 S E G 8 S E G 9 S E G 10 S E G 11 S E G 12 S E G 13 S E G 14 S E G 15 S E G 16 S E G 17 S E G 18 S E G 19 COM0 D0 0 1 1 0 1 1 1 1 0 1 0 0 0 0 0 0 0 0 0 0 COM1 D1 0 0 1 1 1 0 0 1 1 1 1 0 0 0 0 0 0 0 0 0 COM2 D2 0 0 0 1 0 1 0 0 1 0 1 0 0 0 0 0 0 0 0 0 COM3 D3 0 0 1 1 0 0 0 1 0 1 0 0 0 0 0 0 0 0 0 0 Address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ●Initialize sequence Please follow sequence below after Power-On to set this device to initial condition. Power on ↓ CSB ’H’ …I/F initialize condition ↓ CSB ’L’ …I/F Data transfer start ↓ Execute Software Reset by sending ICSET command * Each register value and DDRAM address, DDRAM data are random condition after power on till initialize sequence is executed. ●Start sequence ○Start sequence example 1 No. Input 1 D7 D6 D5 D4 D3 D2 D1 D0 Power on Descriptions VDD=0 to 5V (Tr=0.1ms) ↓ 2 wait 100us Initialize IC ↓ 3 CSB ’H’ Initialize I/F data ’L’ I/F Data transfer start ↓ 4 CSB ↓ 5 ICSET 6 BLKCTL 1 1 1 0 1 * 1 0 Software Reset 1 1 1 1 0 * 0 1 1 0 1 0 0 1 1 0 1 1 1 0 1 0 0 0 RAM address MSB set 0 0 0 0 0 0 0 0 RAM address set ↓ ↓ 7 DISCTL ↓ 8 ICSET 9 ADSET 10 Display Data * * * * * * * * address 00h to 01h Display Data * * * * * * * * address 02h to 03h * * * * * * * * address ↓ ↓ … … Display Data 22h to 00h ↓ 11 CSB ‘H’ 12 CSB ‘L’ I/F Data transfer stop ↓ I/F Data transfer start ↓ 13 MODESET 1 1 0 * 1 0 * * Display ON ↓ 14 CSB ‘H’ www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 I/F Data transfer stop 17/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ○Start sequence example 2 Initialize Initialize Sequence DISPON DISPON Sequence RAM write RAM write Sequence DISPOFF DISPOFF Sequence This LSI is initialized with Initialize Sequence. And start to display with DISPON Sequence. This LSI will update display data with RAM write Sequence. And stop the display with DISPOFF sequence. If you want to restart to display, This LSI will restart to display with DISPON Sequence. Initialize sequence Input Power on wait 100us CSB 'H' CSB 'L' ICSET MODESET ADSET Display Data … CSB 'H' DATA Description D7 D6 D5 D4 D3 D2 D1 D0 IC initialized I/F initialized 1 1 1 0 1 0 1 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 * * * * * * * * Software Reset Display OFF RAM address set Display data DISPON sequence Input CSB 'L' DISCTL BLKCTL APCTL MODESET CSB 'H' DATA Description D7 D6 D5 D4 D3 D2 D1 D0 1 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 1 1 0 0 1 1 0 0 1 0 0 0 Display Control BLKCTL APCTL Display ON RAM write sequence Input CSB 'L' DISCTL BLKCTL APCTL MODESET ADSET Display Data … DATA Description D7 D6 D5 D4 D3 D2 D1 D0 1 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 1 1 0 0 1 1 0 0 1 0 0 0 0 0 0 0 0 0 0 0 * * * * * * * * Display Control BLKCTL APCTL Display ON RAM address set Display data CSB 'H' DISPOFF sequence Input CSB 'L' MODESET CSB 'H' www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 DATA D7 D6 D5 D4 D3 D2 D1 D0 1 1 0 0 0 0 0 0 18/26 Description Display OFF TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ●Example of start sequence START Reduce operating current or enhance display quality Display quality Please select Frame rate from 80Hz,71Hz,64Hz,53Hz according to LCD panel characteristic. Line inversion. Power save mode= High Power mode DISCTL setup value "101**011" Operating current Operating current decreases in order of 80Hz>71Hz>64Hz>53Hz. Frame inversion. Power save mode= Power save mode1 Screen Flicker? DISCTL setup value "101**100" OK Please select Frame rate from 80Hz,71Hz,64Hz,53Hz according to LCD panel characteristic. Frame inversion. Power save mode= Power save mode1 DISCTL setup value "101**100" NG Operating current decreases in order of 80Hz>71Hz>64Hz>53Hz. Frame inversion. Power save mode= Power save mode2 Screen Flicker? DISCTL setup value "101**101" OK Please select Frame rate from 80Hz,71Hz,64Hz,53Hz according to LCD panel characteristic. Frame inversion. Power save mode= Power save mode2 DISCTL setup value "101**101" NG Operating current decreases in order of 80Hz>71Hz>64Hz>53Hz. Frame inversion. Power save mode= Normal mode Screen Flicker? DISCTL setup value "101**110" OK Please select Frame rate from 80Hz,71Hz,64Hz,53Hz according to LCD panel characteristic. Frame inversion. Power save mode= Normal mode DISCTL setup value "101**110" NG Operating current decreases in order of 80Hz>71Hz>64Hz>53Hz. Frame inversion. Power save mode= High Power mode www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 DISCTL setup value "101**111" 19/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ●Cautions on Power ON condition This LSI has “P.O.R” (Power-On Reset) circuit and Software Reset function. Please keep the following recommended Power-On conditions in order to power up properly. Please set power up conditions to meet the recommended tR, tF, tOFF, and Vbot spec below in order to ensure P.O.R operation. VDD tF tR tOFF Figure 21. Recommended condition of tR,tF,tOFF,Vbot tR Less than 1ms Vbot tF Less than 1ms tOFF More than 150ms Vbot Less than 0.1V Power ON/OFF waveform If it is difficult to meet above conditions, execute the following sequence after Power-On. Command input is not accepted during power off. It has to take care that software reset is not a perfect substitute to POR function. (1) CSB=“L”→”H” condition VDD CSB Figure 22. CSB Timing (2) After CSB”H”→”L”, execute Software Reset (ICSET command). www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ●Cautions on application In case, BU9795ZKS used at VLCD≠VSS, voltage gap occur between SEG line to COM1–3 line at Display off state. Because of this voltage gap, there is possibility to display LCD for a moment. To avoid this phenomenon, please decide VDD and VLCD level to satisfy Voff voltage lower than OFF level (OFF level = 1V at the example explained below). condition ： VDD=5.0V VLCD=2.0V 1/3bias DDRAM data ALL "H" Frame inversion In case, VLCD voltage different from VSS level（VLCD≠VSS) In this case, volatage gap occur, between SEG line to COM 1-3 line. Because of this gap, there is possibility to display LCD for a moment. 1Frame Send "Display off" command VDD (5V) SEG0 Output Output VLCD level at display off （All SEG terminal） VLCD (2V) VLCD-VSS=2V VSS COM0 Output VDD (5V) Output VLCD level at display off （Only COM0 terminal） VLCD (2V) VLCD-VSS=2V VSS COM1 Output VDD (5V) VLCD (2V) Output VSS level at display off (at COM 1-3 terminal) VLCD-VSS=2V VSS Display on Voltage gap of COM0-SEG0 Display off 3V 2V the volatage between COM0 to SEG0 is 0V at display off. 1V 0V -1V -2V -3V Display off Display on Voltage gap of COM1-SEG0 3V 2V ON level the volatage between COM1 to SEG0 is -2V at display off. 1V OFF level 0V -1V Voff -2V -3V Voltage gap occur between COM1 to SEG0 at display off. So, there is possibility to display LCD. （Only at COM 1-3 line） www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) ●Operational Notes (1) Absolute Maximum Ratings Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. (2) Recommended Operating conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. (4) Power Supply Lines Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. (5) Ground Voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. (6) Short between Pins and Mounting Errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. (7) Operation under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. (8) Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. (9) Regarding Input Pins of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the GND voltage should be avoided. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input terminals have voltages within the values specified in the electrical characteristics of this IC. (10) GND Wiring Pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. (11) External Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. (12) Unused Input Terminals Input terminals of an IC are often connected to the gate of a CMOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of IC. So unless otherwise specified, input terminals not being used should be connected to the power supply or ground line. (13) Rush current When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 22/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 MAX 140 segments (SEG35×COM4) Datasheet ●Ordering Information B U 9 7 9 Part Number 5 Z K S 2 Package KS2 : SQFP-T52 ●Lineup Package SQFP-T52 Tray of 1000 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Orderable Part Number BU9795ZKS2 23/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 Datasheet MAX 140 segments (SEG35×COM4) Physical Dimension, Tape and Reel Information Package Name SQFP-T52 Container Tray (with dry pack) Quantity 1000pcs Direction of feed Direction of product is fixed in a tray 1pin ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 24/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 MAX 140 segments (SEG35×COM4) Datasheet ●Marking Diagrams SQFP-T52 (TOP VIEW) Part Number Marking BU9795AKS2 LOT Number 1PIN MARK www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 25/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 BU9795ZKS2 MAX 140 segments (SEG35×COM4) Datasheet ●Revision History Date Revision 28.May.2014 001 Changes New Release www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 26/26 TSZ02201-0P4P0D300780-1-2 28.May.2014 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001