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BU97960MUV-E2

BU97960MUV-E2

  • 厂商:

    ROHM(罗姆)

  • 封装:

    VFQFN28_EP

  • 描述:

    LCD 驱动器 VQFN28V5050A

  • 数据手册
  • 价格&库存
BU97960MUV-E2 数据手册
Datasheet Low Duty LCD Segment Drivers BU97960MUV MAX 120 segments (SEG15×COM8) General Description Key Specifications ■ ■ ■ ■ ■ BU97960MUV is a 1/4 or 1/8 duty general-purpose LCD driver that can be used for consumer/battery operated products and can drive up to 120 LCD Segments. It has integrated display RAM for reducing CPU load. Also, it is designed with low power consumption and no external component needed. It can support LCD contrast adjustment by its EVR function. ■ Features ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ Supply Voltage Range: +2.5V to +6.0V LCD Drive Power Supply Range: +2.5V to +6.0V Operating Temperature Range: -40°C to +85°C Max Segments: 120 Segments Display Duty and Bias: 1/4 Duty and 1/3 Bias, 1/8 Duty and 1/4 Bias selectable Interface: 2 wire serial interface W (Typ) x D (Typ) x H (Max) Packages Integrated RAM for Display Data (DDRAM): 15 x 8bit (Max 120 Segment) 1/8 or 1/4 can be Selected with The Serial Control Data. 1/8 duty drive: Up to 120 Segments 1/4 duty drive: Up to 76 Segments Integrated Buffer AMP for LCD Driving Integrated Oscillator Circuit No External Components Low Power Consumption Design Independent Power Supply for LCD Driving Integrated Electrical Volume Register (EVR) Function VQFN028V5050 5.00mm x 5.00mm x 1.00mm Applications ◼ ◼ ◼ ◼ ◼ etc. Metering Home Automation Goods White Goods, Small Appliances Healthcare Products Battery Operated Products Typical Application Circuit VLCD VDD VDD VLCD COM0 …… …… COM7 SD Controller Segment LCD SCL SEG0 SEG1 …… …… VSS SEG14 Figure 1. Typical Application Circuit ○Product structure:Silicon monolithic integrated circuit www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed for protection against radioactive rays. 1/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Block Diagram / Pin Configuration BU97960MUV (VQFN028V5050) COM4/SEG18 … COM0 … COM3 COM7/SEG15 SEG0 … SEG14 VLCD LCD Voltage Generator Common Driver Segment Driver V0 + - + - LCD BIAS SELECTOR + - Common Counter DDRAM + - VSS Command Data Decoder Command Register OSCILLATOR Power On Reset Serial Inter Face IF FILTER VDD SDA SCL COM2 COM3 COM4/SEG18 COM5/SEG17 COM6/SEG16 COM7/SEG15 SEG14 21 20 19 18 17 16 15 Figure 2. Block Diagram COM1 22 14 SEG13 COM0 23 13 SEG12 VLCD 24 12 SEG11 VDD 25 11 SEG10 VSS 26 10 SEG9 SCL 27 9 SEG8 SDA 28 8 SEG7 5 6 7 SEG4 SEG5 SEG6 3 SEG2 4 2 SEG1 SEG3 1 SEG0 EXP-PAD Figure 3. Pin Configuration (TOP VIEW) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Pin Description Table 1. Pin Description Pin Name Pin No. I/O SDA 28 I/O SCL 27 VSS Handling when Unused Function Serial data input - I Serial data transfer clock - 26 I Power supply pin Must be connected to ground - VDD 25 I Power supply - VLCD 24 I Power supply pin for LCD driving. - SEG0 to SEG14 1 to 15 O Segment output for LCD drive OPEN COM0 to COM3 23 to 20 O Common output for LCD drive OPEN COM4/SEG18 to COM7/SEG15 19 to 16 O Common/Segment output for LCD drive OPEN EXP-PAD - - The EXP-PAD of the center of product connect to VSS or OPEN www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/29 OPEN/VSS TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Absolute Maximum Ratings (VSS=0V,Ta=25°C) Parameter Symbol Ratings Unit Remarks Power Supply Voltage1 VDD -0.5 to +7.0 V Power Supply Power Supply Voltage2 VLCD -0.5 to +7.0 V Power supply pin for LCD driving Power Dissipation Pd 0.70(Note) W - Input Voltage Range VIN -0.5 to VDD+0.5 V - Storage Temperature Range Tstg -55 to +125 °C - (Note) Derate by 7.0mW/°C when operating above Ta=25°C (when mounted in ROHM’s standard board) Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Recommended Operating Conditions(VSS=0V) Parameter Ratings Symbol Min Typ Max Unit Remarks Operational Temperature Topr -40 - +85 °C - Power Supply Voltage1 VDD 2.5 - 6.0 V Power Supply Power Supply Voltage2 VLCD 2.5 - 6.0 V LCD Drive Voltage Electrical Characteristics DC Characteristics (VDD=2.5V to 6.0V, VLCD=2.5V to 6.0V, VSS=0V, Ta=-40°C to +85°C, unless otherwise specified) Limits Parameter Symbol Unit Conditions Min Typ Max “H” Level Input Voltage VIH 0.7VDD - VDD V SDA, SCL “L” Level Input Voltage VIL VSS - 0.3VDD V SDA, SCL “H” Level Input Current IIH - - 1 µA SDA, SCL SDA, SCL “L” Level Input Current IIL -1 - - µA SEG RON - 3.5 - kΩ COM RON - 3.5 - kΩ Standby Current IST - - 5 µA Power Consumption 1 IDD - 2.5 15 µA Power Consumption 2 ILCD - 25 40 µA LCD Driver on Resistance ILOAD=±10µA Display Off, Oscillation Off VDD=3.3V, VLCD=5V, Ta=25°C FR=80Hz, 1/4 Bias, Frame Inversion VDD=3.3V, VLCD=5V, Ta=25°C FR=80Hz, 1/4 Bias, Frame Inversion [Reference Data] Condition: Ta=25°C, FR=80Hz, 1/4 Bias, Frame Inversion 40 Operating Current [µA] 35 ILCD 30 25 20 15 10 IDD 5 0 2.5 3 3.5 4 4.5 5 5.5 6 Power Supply Voltage [V] Figure 4. Power Consumption Typical Temperature Characteristics www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Electrical Characteristics – continued Oscillation Characteristics (VDD=2.5V to 6.0V, VLCD=2.5V to 6.0V, VSS=0V, Ta=-40°C to +85°C, unless otherwise specified) Limits Parameter Symbol Unit Conditions Min Typ Max FR=80Hz setting, 56 80 104 Frame Frequency 1 fCLK1 Hz VDD=2.5V to 6.0V, Ta=-40°C to +85°C FR=80Hz setting, 72 80 88 Frame Frequency 2 fCLK2 Hz VDD=3.3V, Ta=-40°C to +85°C [Reference Data] 110 Frame Frequency : fCLK [Hz] 100 VDD = 6.0V 90 VDD = 3.3V 80 VDD = 2.5V 70 60 50 -40 -20 0 20 40 60 80 Temperature[°C] Figure 5. Frame Frequency Typical Temperature Characteristics www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Electrical Characteristics – continued MPU Interface Characteristics (VDD=2.5V to 6.0V, VLCD=2.5V to 6.0V, VSS=0V, Ta=-40°C to +85°C, unless otherwise specified) Limits Parameter Symbol Unit Conditions Min Typ Max Input Rise Time tR - - 0.3 µs - Input Fall Time tF - - 0.3 µs - SCL Cycle Time tSCYC 2.5 - - µs - “H” SCL Pulse Width tSHW 0.6 - - µs - “L” SCL Pulse Width tSLW 1.3 - - µs - SDA Setup Time tSDS 100 - - ns - SDA Hold Time tSDH 100 - - ns - Bus Free Time tBUF 1.3 - - µs - START Condition Hold Time tHD;STA 0.6 - - µs - START Condition Setup Time tSU;STA 0.6 - - µs - STOP Condition Setup Time tSU;STO 0.6 - - µs - SDA tF tSLW tBUF tSCYC SCL tHD;STA tR tSDH tSHW tSDS SDA tSU;STO tSU;STA Figure 6. Interface Timing www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) I/O Equivalent Circuit VLCD VDD VSS VSS SDA SCL VSS VSS VLCD VLCD SEG0 to SEG14 COM0 to COM3 VSS COM4/SEG18 to COM7/SEG15 VSS Figure 7. I/O Equivalent Circuit www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Function Description Command/Data Transfer Method BU97960MUV is transferred by 2 wire serial interface (SDA, SCL). SDA SCL START condition STOP condition Figure 8. 2 wire serial interface Command/Data Transfer Format It is necessary to generate START and STOP condition when sending Command or Display Data through this 2 wire serial interface. Slave Address A Command S 0 1 1 1 1 1 0 0 A C Display Data Command or Data judgement bit START condition A P STOP condition Acknowledge Figure 9. Interface Protocol The following procedure shows how to transfer Command and Display Data. (1) Generate “START condition”. (2) Issue Slave Address. (3) Transfer Command and Display Data. (4) Generate “STOP condition Acknowledge Data format is comprised of 8 bits, Acknowledge bit is returned after sending 8-bit data. After the transfer of 8-bit data (Slave Address, Command, Display Data), release the SDA line at the falling edge of the 8 th clock SCL. The SDA line is pulled “Low” until the falling edge of the 9 th clock SCL. (Output cannot be pulled “High” because of open drain NMOS). If acknowledge function is not required, keep SDA line at “Low” level from 8 th falling edge to 9th falling edge of SCL. SDA 1to7 8 9 1to7 8 9 1to7 8 9 SCL S P Slave Address ACK DATA ACK DATA ACK STOP condition START condition Figure 10. Acknowledge Timing www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Function Description – continued Command Transfer Method Issue Slave Address (“01111100”) after generate “START condition”. The 1st byte after Slave Address always becomes command input. MSB (“Command or Data judgement bit”) of command decides next data is Command or Display Data. When set “Command or Data judgement bit”=“1”, next byte will be command. When set “Command or Data judgement bit”=“0”, next byte data is Display Data. 1 Command A 1 Command A S Slave Address A 1 Command A 0 Command A Display Data … P A 0 It cannot accept input command once it enters into Display Data transfer state. In order to input command again, it is necessary to generate “START condition”. If “START condition” or “STOP condition” is sent in the middle of command transmission, the command will be cancelled. If Slave Address is continuously sent following “START condition”, it remains in command input state. “Slave Address” must be sent right after the “START condition”. When Slave Address cannot be recognized in the first data transmission, no Acknowledge bit is generated and next transmission will be invalid. When the data is in invalid status, if “START condition” is transmitted again, it will return to valid status. Consider the MPU interface characteristic such as Input rise time and Setup/Hold time when transferring command and data (Refer to MPU Interface Characteristics). Write Display Data and Transfer Method BU97960MUV enters “Write Mode” when Write Mode or Read Mode judgement bit of Slave Address is “0” BU97960MUV has Display Data RAM (DDRAM) of 15×8=120bits. The relationship between data input and Display Data, DDRAM data and the address are as follows. Command Slave Address S 0111110 0 A 0 000000 A a b c R/W=0 (Write Mode) d e f g h A i j k l m n o p A … P Display Data In 1/8 Duty Mode 8-bit data is stored in DDRAM. ADSET command specifies the address to be written, and address is automatically incremented in every 8-bit data. Data can be continuously written in DDRAM by transmitting data continuously. BIT 2h 1h 0 a i COM0 1 b j COM1 2 c k COM2 3 d l COM3 4 e m COM4 5 f n COM5 6 g o COM6 7 h p COM7 SEG0 SEG1 SEG2 3h SEG3 4h DDRAM Address 5h 6h 7h 0h SEG4 SEG5 SEG6 SEG7 ...... Dh SEG13 Eh SEG14 Display data is written to DDRAM every 8-bit data. No need to wait for ACK bit to complete data transfer. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Write Display and Transfer Method – continued In 1/4 Duty Mode 4-bit data is stored in DDRAM. ADSET command specifies the address to be written, and address is automatically incremented in every 8-bit data. Data can be continuously written in DDRAM by transmitting data continuously. 0h BIT 0 a 1 b 2 c 3 d SEG0 1h e 2h DDRAM Address 3h ... 8h 9h i m COM0 f j n COM1 g k o COM2 H l p COM3 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG16 SEG17 SEG18 Display data is written to DDRAM every 4-bit data. No need to wait for ACK bit to complete data transfer www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Function Description – continued Register Read Command and Transfer Method BU97960MUV enters “Read Mode” when R/W bit of Slave Address is “1” During Read mode the command registers can be read. The sequence for the command register read is shown below. Slave Address S 0111110 Command 0 A 1 ADSET Slave Address A P S 0111110 R/W=0(Write Mode) Data 1 A A P R/W=1(Read Mode) The following register settings can be read in this mode. Only one register setting can be read at once, after reading register setting, BU97960MUV will exit from read mode and wait for slave Address. If all register setting needs to be read, make sequence for “REG1” and “REG2”, respectively. Register D7 D6 D5 D4 D3 D2 D1 D0 Address REG1 P7 P6 P5 P4 P3 P2 P1 P0 0Fh REG2 P7 P6 1 0 P3 P2 P1 P0 10h REG1:P7 = Frame Frequency setting P6 = Duty and Bias setting P5 = Software Reset condition P4 to P0 = EVR setting REG2: P7 to P6 = Frame Frequency (FR) setting P3 = LCD drive waveform setting P2 = Display ON / OFF setting P1 = APON setting P0 = APOFF setting An example of the command register read sequence is shown below. P S SDA Slave Address (read) A P7 P6 P5 P4 P3 P2 P1 P0 A SCL LCD Driver Bias Circuit BU97960MUV generates LCD driving voltage with on-chip Buffer AMP. And it can drive LCD at low power consumption. 1/4 or 1/3 Bias can be set by MODESET command. Line or frame inversion can be set by DISCTL command. Refer to the “LCD Driving Waveform” for each LCD Bias setting. Reset Initialize Condition Initial condition after executing Software Reset is as follows. -Display is off. -DDRAM address is initialized (DDRAM Data is not initialized). Refer to Detailed Command Description for initialize value of registers. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Function Description – continued Command/Function List Description List of Command/Function No. Command Function 1 Address Set (ADSET) DDRAM Address setting (00h to 0Eh) Command register address setting (0Fh, 10h) 2 EVR Set (EVRSET) EVR setting (0 to 31) 3 Display Control (DISCTL) Frame Frequency, Power Save Mode setting 4 IC Operation Set (ICSET) LCD drive mode, Software Reset, Display On/Off setting 5 All Pixel Control (APCTL) All pixel On/Off setting 6 Mode Set (MODESET) Frame Frequency, Duty and Bias setting Detailed Command Description D7 (MSB) is a Command or Data judgment bit. Refer to Command/Data Transfer Method. C: 0: Next byte is RAM write data. 1: Next byte is command. Address Set (ADSET) MSB D7 C D6 0 D5 P5 D4 P4 D3 P3 D2 P2 D1 P1 LSB D0 P0 Address data is specified in P[5:0]. The address range can be set as 00h(000000b) to 0Eh(001110b) for Write mode. When the specified address is out of range, the address will be set to “00h(000000b)”. The default value of the DDRAM Address is “00h(000000b)” The address can be set 0Fh(001111b) and 10h(010000b) for Read mode. It is prohibited to set other address. P[5:0] = 0Fh(001111b) : REG1 Register address for Software Reset condition and EVR setting P[5:0] = 10h(010000b) : REG2 Register address for the other settings (For more detailed information, refer to “Register Read Command and Transfer Method”) EVR Set (EVRSET) MSB D7 C D6 1 D5 0 D4 P4 D3 P3 D2 P2 D1 P1 LSB D0 P0 BU97960MUV has 32-step Electrical Volume Register (EVR) that can set the best V0 voltage level (Maximum LCD driving voltage). Electrical Volume Register (EVR) is set to “00000” in reset initialize condition. In “00000” condition, VLCD voltage is equal to V0 voltage. Refer to the below table for V0 voltage in next page. Prohibited setting V0 voltage less than 2.5V. And ensure “VLCD – V0 > 0.6” condition is satisfied. Unstable IC output voltage may result if the above conditions are not satisfied. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) EVR Set (EVRSET) – continued The relationship between electrical volume register (EVR) setting and V0 voltage Calculation VLCD VLCD VLCD VLCD VLCD EVR Formula = 6.000 = 5.500 = 5.000 = 4.000 = 3.500 VLCD = 3.000 VLCD = 2.500 Unit 0 VLCD V0= 6.000 V0= 5.500 V0= 5.000 V0= 4.000 V0= 3.500 V0= 3.000 V0= 2.500 V 1 0.967*VLCD V0= 5.802 V0= 5.323 V0= 4.839 V0= 3.871 V0= 3.387 V0= 2.903 V0= 2.419 V 2 0.937*VLCD V0= 5.622 V0= 5.156 V0= 4.688 V0= 3.750 V0= 3.281 V0= 2.813 V0= 2.344 V 3 0.909*VLCD V0= 5.454 V0= 5.000 V0= 4.545 V0= 3.636 V0= 3.182 V0= 2.727 V0= 2.273 V 4 0.882*VLCD V0= 5.292 V0= 4.853 V0= 4.412 V0= 3.529 V0= 3.088 V0= 2.647 V0= 2.206 V 5 0.857*VLCD V0= 5.142 V0= 4.714 V0= 4.286 V0= 3.429 V0= 3.000 V0= 2.571 V0= 2.143 V 6 0.833*VLCD V0= 4.998 V0= 4.583 V0= 4.167 V0= 3.333 V0= 2.917 V0= 2.500 V0= 2.083 V 7 0.810*VLCD V0= 4.860 V0= 4.459 V0= 4.054 V0= 3.243 V0= 2.838 V0= 2.432 V0= 2.027 V 8 0.789*VLCD V0= 4.734 V0= 4.342 V0= 3.947 V0= 3.158 V0= 2.763 V0= 2.368 V0= 1.974 V 9 0.769*VLCD V0= 4.614 V0= 4.231 V0= 3.846 V0= 3.077 V0= 2.692 V0= 2.308 V0= 1.923 V 10 0.750*VLCD V0= 4.500 V0= 4.125 V0= 3.750 V0= 3.000 V0= 2.625 V0= 2.250 V0= 1.875 V 11 0.731*VLCD V0= 4.386 V0= 4.024 V0= 3.659 V0= 2.927 V0= 2.561 V0= 2.195 V0= 1.829 V 12 0.714*VLCD V0= 4.284 V0= 3.929 V0= 3.571 V0= 2.857 V0= 2.500 V0= 2.143 V0= 1.786 V 13 0.697*VLCD V0= 4.182 V0= 3.837 V0= 3.488 V0= 2.791 V0= 2.442 V0= 2.093 V0= 1.744 V 14 0.681*VLCD V0= 4.086 V0= 3.750 V0= 3.409 V0= 2.727 V0= 2.386 V0= 2.045 V0= 1.705 V 15 0.666*VLCD V0= 3.996 V0= 3.667 V0= 3.333 V0= 2.667 V0= 2.333 V0= 2.000 V0= 1.667 V 16 0.652*VLCD V0= 3.912 V0= 3.587 V0= 3.261 V0= 2.609 V0= 2.283 V0= 1.957 V0= 1.630 V 17 0.638*VLCD V0= 3.828 V0= 3.511 V0= 3.191 V0= 2.553 V0= 2.234 V0= 1.915 V0= 1.596 V 18 0.625*VLCD V0= 3.750 V0= 3.438 V0= 3.125 V0= 2.500 V0= 2.188 V0= 1.875 V0= 1.563 V 19 0.612*VLCD V0= 3.672 V0= 3.367 V0= 3.061 V0= 2.449 V0= 2.143 V0= 1.837 V0= 1.531 V 20 0.600*VLCD V0= 3.600 V0= 3.300 V0= 3.000 V0= 2.400 V0= 2.100 V0= 1.800 V0= 1.500 V 21 0.588*VLCD V0= 3.528 V0= 3.235 V0= 2.941 V0= 2.353 V0= 2.059 V0= 1.765 V0= 1.471 V 22 0.576*VLCD V0= 3.456 V0= 3.173 V0= 2.885 V0= 2.308 V0= 2.019 V0= 1.731 V0= 1.442 V 23 0.566*VLCD V0= 3.396 V0= 3.113 V0= 2.830 V0= 2.264 V0= 1.981 V0= 1.698 V0= 1.415 V 24 0.555*VLCD V0= 3.330 V0= 3.056 V0= 2.778 V0= 2.222 V0= 1.944 V0= 1.667 V0= 1.389 V 25 0.545*VLCD V0= 3.270 V0= 3.000 V0= 2.727 V0= 2.182 V0= 1.909 V0= 1.636 V0= 1.364 V 26 0.535*VLCD V0= 3.210 V0= 2.946 V0= 2.679 V0= 2.143 V0= 1.875 V0= 1.607 V0= 1.339 V 27 0.526*VLCD V0= 3.156 V0= 2.895 V0= 2.632 V0= 2.105 V0= 1.842 V0= 1.579 V0= 1.316 V 28 0.517*VLCD V0= 3.102 V0= 2.845 V0= 2.586 V0= 2.069 V0= 1.810 V0= 1.552 V0= 1.293 V 29 0.508*VLCD V0= 3.048 V0= 2.797 V0= 2.542 V0= 2.034 V0= 1.780 V0= 1.525 V0= 1.271 V 30 0.500*VLCD V0= 3.000 V0= 2.750 V0= 2.500 V0= 2.000 V0= 1.750 V0= 1.500 V0= 1.250 V 31 0.491*VLCD V0= 2.946 V0= 2.705 V0= 2.459 V0= 1.967 V0= 1.721 V0= 1.475 V0= 1.230 V Prohibited setting www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Detailed Command Description – continued Display Control (DISCTL) MSB D7 C D6 1 D5 1 D4 0 Set Frame Frequency Setting D3 P3 D2 P2 D1 1 LSB D0 0 P3 P2 FRSEL Reset Initialize Condition 80Hz 0 0 0 ○ 71Hz 0 1 0 - 64Hz 1 0 0 - 50Hz 1 1 0 - 233Hz 0 0 1 - 197Hz 0 1 1 - 160Hz 1 0 1 - 122Hz 1 1 1 - The frame frequency varies according to the characteristics of f CLK when internal oscillation circuit is used. (Refer to Oscillation Characteristics for fCLK properties). Refer to MODESET for FRSEL www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Detailed Command Description – continued Set IC Operation (ICSET) MSB D7 C D6 1 D5 1 D4 1 D3 0 D2 P2 D1 P1 LSB D0 P0 Set LCD Drive Waveform Setup P2 Reset Initialize Condition Line Inversion Mode 0 Frame Inversion Mode 1 ○ Power consumption is reduced in the following order: Line Inversion > Frame Inversion Typically, when driving large capacitance LCD, Line inversion is more susceptible to crosstalk. Regarding driving waveform, refer to LCD Driving Waveform. Set Software Reset Execution Setup P1 Reset Initialize Condition Software Reset Not Execute 0 ○ Software Reset Execute 1 When “Software Reset” is executed, BU97960MUV is reset to initial condition. Don’t set Software Reset (P1) with P2, P0 at the same time. Set Display On and Off Setup P0 Reset Initialize Condition Display Off(DISPOFF) 0 ○ Display On(DISPON) 1 Display Off: Regardless of DDRAM data, all Segment and Common output will be stopped after 1frame of OFF data write. Display Off mode will be disabled after Display On command. Display On: Segment and Common output will be active and start to read the Display Data from DDRAM. After receiving the Display ON setting, BU97960MUV completes startup in one frame and starts displaying. If the Display OFF setting is received within one frame after receiving the Display ON setting, the state during startup is maintained and the abnormal current is generated. If you send the Display OFF setting after sending the Display ON setting, leave an interval of 1 frame or more. All Pixel Control (APCTL) MSB D7 C D6 1 D5 1 D4 1 All Display Set On and Off Setup D3 1 D2 0 D1 P1 LSB D0 P0 P1 Reset Initialize Condition Normal 0 ○ All Pixel On(APON) 1 - P0 Reset Initialize Condition 0 ○ Setup Normal All Pixel Off(APOFF) 1 All Pixels On: All pixels are on regardless of DDRAM data. All Pixels Off: All pixels are off regardless of DDRAM data. This command is valid in Display on status. The data of DDRAM is not changed by this command. If set both P1 and P0 =“1”, All pixels off will be selected. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Detailed Command Description – continued Mode Set (MODESET) MSB D7 D6 D5 D4 D3 D2 D1 LSB D0 C 1 1 1 1 P1 P0 1 Set Frame Frequency Setting Setup P1 Reset initialize condition Normal 0 ○ 200Hz Mode 1 - P0 Reset initialize condition 0 ○ 1 - Set Duty and Bias Level Setup 1/8 Duty and 1/4 Bias 1/4 Duty and 1/3 Bias Refer to LCD Driving Waveform. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) LCD Driving Waveform Line Inversion Mode (1/8 Duty, 1/4 Bias) SEGn SEGn+1 SEGn+2 SEGn+3 SEGn+4 SEGn+5 COM0 stateA COM1 stateB COM2 COM3 COM4 COM5 COM6 COM7 1frame V0 COM0 VSS V0 COM1 VSS V0 COM2 VSS V0 COM3 VSS V0 COM4 VSS V0 COM5 VSS V0 COM6 VSS V0 COM7 VSS V0 SEGn VSS V0 SEGn+1 VSS V0 SEGn+2 VSS V0 stateA (COM0-SEGn) -V0 V0 stateB (COM1-SEGn) -V0 Figure 11. Wave Form of Line Inversion www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) LCD Driving Waveform – continued Frame Inversion Mode (1/8 Duty, 1/4 Bias) SEGn SEGn+1 SEGn+2 SEGn+3 SEGn+4 SEGn+5 COM0 stateA COM1 stateB COM2 COM3 COM4 COM5 COM6 COM7 1 frame V0 COM0 VSS V0 COM1 VSS V0 COM2 VSS V0 COM3 VSS V0 COM4 VSS V0 COM5 VSS V0 COM6 VSS V0 COM7 VSS V0 SEGn VSS V0 SEGn+1 VSS V0 SEGn+2 VSS V0 stateA (COM0-SEGn) -V0 V0 stateB (COM1-SEGn) -V0 Figure 12. Wave Form of Frame Inversion www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) LCD Driving Waveform – continued Line Inversion Mode (1/4 Duty, 1/3 Bias) SEGn SEGn+1 SEGn+2 SEGn+3 COM0 stateA COM1 stateB COM2 COM3 1frame V0 COM0 VSS V0 COM1 VSS V0 COM2 VSS V0 COM3 VSS V0 SEGn VSS V0 SEGn+1 VSS V0 SEGn+2 VSS V0 SEGn+3 VSS V0 stateA (COM0-SEGn) -V0 V0 stateB (COM1-SEGn) -V0 Figure 13. Wave Form of Frame Inversion www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) LCD Driving Waveform – continued Frame Inversion Mode (1/4 Duty, 1/3 Bias) SEGn SEGn+1 SEGn+2 SEGn+3 COM0 stateA COM1 stateB COM2 COM3 1frame V0 COM0 VSS V0 COM1 VSS V0 COM2 VSS V0 COM3 VSS V0 SEGn VSS V0 SEGn+1 VSS V0 SEGn+2 VSS V0 SEGn+3 VSS V0 stateA (COM0-SEGn) -V0 V0 stateB (COM1-SEGn) -V0 Figure 14. Wave Form of Frame Inversion www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Initialize Sequence Follow the Power-on sequence below to initialize condition. Power on ↓ STOP condition ↓ START condition ↓ Issue Slave Address ↓ Execute Software Reset by ICSET command After Power-on and before sending initialize sequence, each register value, DDRAM Address and DDRAM Data are random. Start Sequence D7 D6 D5 D4 D3 D2 D1 D0 Descriptions VDD=0V to 5V (tR=0.1ms) Initialize IC STOP condition 0 1 1 1 1 1 0 0 START condition Issue Slave Address 1 1 1 1 0 * 1 * Execute Software Reset 1 1 1 0 0 0 1 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 DDRAM Address set * * * * * * * * Address 00h * * * * * * * * Address 0Eh 11 12 13 14 15 (*:Don’t care) Display Data ↓ STOP ↓ START Slave Address ↓ ICSET ↓ STOP ……… ……… Start Sequence Example No. Input 1 Power on ↓ 2 Wait 100µs (Min) ↓ 3 STOP ↓ 4 START 5 Slave Address ↓ 6 ICSET ↓ 7 DISCTL ↓ 8 EVRSET ↓ 9 ADSET ↓ 10 Display Data STOP condition 0 1 1 1 1 1 0 0 START condition Issue Slave Address 1 1 1 1 0 * 0 1 Display On www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 STOP condition 21/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Cautions in Power ON/OFF To prevent incorrect display, malfunction and abnormal current, follow Power On/Off sequence shown in waveform below. VDD must be turned on before VLCD during power up sequence. VDD must be turned off after VLCD during power down sequence. Set t1>0ns and t2>0ns. To refrain from data transmission is strongly recommended while power supply is rising up or falling down to prevent from the occurrence of disturbances on transmission and reception. t1 VLCD VDD t2 10% 10% VDD Min VDD Min Figure 15. Power ON/OFF Waveform www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Caution in POR Circuit Use BU97960MUV has “POR” (Power-On Reset) circuit and Software Reset function. Keep the following recommended Power-On conditions in order to power up properly. Set power up conditions to meet the recommended t R, tF, tOFF, and VBOT specification below in order to ensure P.O.R operation. VDD tF tR Recommended condition of tR, tF, tOFF, VBOT (Ta=25 °C) tR tF tOFF VBOT tOFF VBOT Less than 5ms Less than 5ms More than 20ms Less than 0.3V Figure 16. Power ON/OFF Waveform When it is difficult to keep above conditions, it is possibility to cause meaning less display due to no IC initialization. Execute the IC initialization as quickly as possible after Power-on to reduce such influence. See the IC initialization flow as below. However, note that it cannot accept command while supply is unstable or below the minimum supply range. Note also that Software Reset is not a complete alternative to POR function. 1. Generate STOP condition VDD SDA SCL STOP condition Figure 17. STOP Condition 2 Generate START condition. VDD SDA SCL START condition Figure 18. START Condition 3. Issue Slave Address. 4. Execute Software Reset (ICSET) command. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Note on the Multiple Devices be Connected to 2 Wire Interface Do not access the other device without power supply (VDD) to the BU97960MUV. Controller BU97960MUV Device1 Figure 19. Example of BUS Connection To control the slope of the falling edge, a capacitor is connected between gate and drain of a NMOS transistor (Refer to Figure. 20). The gate is in a high-impedance state if the power supply (VDD) is not supplied. In this condition, the gate voltage is pulled up by the current flow through the capacitance as a result of the SDA signal's transition from LOW to HIGH. The NMOS transistor turns on and draws some current (Ids) from the SDA port if the gate voltage (Vg) is higher than the threshold voltage (Vth). An external resistor (R) is connected between the power line and SDA line to keep the SDA line as logic HIGH. But the line cannot be kept as logic HGH if the voltage drop (R*Ids) is large. Access the other LSIs with power supply to BU97960MUV to control the gate voltage as logic level of 1 or 0 if the number of LSIs are connected to the same bus. Z=1/jωC VDD SDA internal circuit Vg Figure 20. SDA output cell structure www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Operational Notes – continued 10. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 11. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 12. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Ordering Information B U 9 7 9 6 0 M U V - Package MUV : VQFN028V5050 Part Number E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram VQFN028V5050 (TOPVIEW) Part Number Marking 9 7 9 6 0 LOT Number Pin 1 Mark www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 27/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Physical Dimension and Packing Information Package Name www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VQFN028V5050 28/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Revision History Date Revision 26.Jan.2018 001 05.Jan.2021 002 Changes New Release P.15 Add the description P.29-2, P.29-3 Updated packages and part numbers www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 29/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Ordering Information B U 9 7 9 6 0 M U V Package MUV: VQFN28V5050A Part Number - Z E 2 Production site Packaging and forming specification Z: Added E2: Embossed tape and reel Marking Diagram VQFN28V5050A (TOPVIEW) Part Number Marking 9 7 9 6 0 LOT Number Pin 1 Mark www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 29-2/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 BU97960MUV MAX 120 Segments (SEG15×COM8) Physical Dimension and Packing Information Package Name www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VQFN28V5050A 29-3/29 TSZ02201-0P3P0D302030-1-2 05.Jan.2021 Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001
BU97960MUV-E2 价格&库存

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BU97960MUV-E2
  •  国内价格 香港价格
  • 2500+6.554602500+0.78342
  • 5000+6.488715000+0.77554

库存:2045

BU97960MUV-E2
    •  国内价格 香港价格
    • 1+19.645711+2.34808
    • 10+10.8067810+1.29164
    • 50+9.7244650+1.16228
    • 100+7.71562100+0.92218
    • 500+6.94488500+0.83006
    • 1000+6.600501000+0.78890
    • 2000+6.403722000+0.76538
    • 4000+4.862234000+0.58114

    库存:2500

    BU97960MUV-E2
      •  国内价格 香港价格
      • 1+19.645711+2.34808
      • 10+10.8067810+1.29164
      • 50+9.7244650+1.16228
      • 100+7.71562100+0.92218
      • 500+6.94488500+0.83006
      • 1000+6.600501000+0.78890
      • 2000+6.403722000+0.76538
      • 4000+4.862234000+0.58114

      库存:2000

      BU97960MUV-E2
      •  国内价格 香港价格
      • 1+23.236921+2.77731
      • 10+14.6569810+1.75182
      • 25+12.4245725+1.48500
      • 100+9.89247100+1.18236
      • 250+8.64956250+1.03381
      • 500+7.88501500+0.94243
      • 1000+7.244451000+0.86587

      库存:2045